JP2011180039A - Specimen damage analyzer - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To measure laser's resistance to an optical component as a specimen, in a noncontact and quantitative manner, and accurately analyze damaged mechanism. <P>SOLUTION: A specimen damage analyzer includes a beam splitter 13 for separating a light pulse generated by a light source 11 into a pump light and a probe light; a delay-time adjusting section 15 for adjusting the delay times of the separated pump light and probe light; a first polarizing element 36 for controlling the polarization direction of the probe light to the pump light so that they are orthogonal to each other; an irradiation optical system for irradiating the specimen 2 with the pumped light and the probe light; a light-receiving element 31 for detecting a probe signal as the probe light reflected from the specimen 2; and a PC 33 for analyzing the reflectivity of the specimen 2, based on the probe signal detected by the light-receiving element 31. The height and/or the width of a reflectivity peak due to electron excitation for identifying its relaxation from the reflectivity. Correlation information between the previously-input degree of the damage and the height and/or the width of the reflectivity peak is verified, and the degree of the damage of the specimen is determined. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a specimen damage analysis apparatus that analyzes the degree of damage of a specimen nondestructively based on a pump probe method.

  Conventionally, when measuring the laser tolerance of an optical component, the optical component as a subject is irradiated with laser light. Next, the actual laser resistance is measured by confirming the damage trace on the optical component formed by the irradiated laser light by visual observation or through microscopic observation.

  However, such a laser proof stress measuring method is premised on so-called destructive measurement in which an optical component as a subject is destroyed by irradiating a laser beam. Therefore, in such a laser proof stress measuring method, since the optical component as a product is wrinkled, a technique for measuring the laser proof strength non-destructively has been desired.

  Further, in the method of measuring the laser resistance by visual observation as described above, since the quantitative and objective measurement standard cannot be determined, the reliability of the measurement result is inferior.

  Further, in the above-described conventional method, it is determined whether the laser destruction has occurred inside the substrate or on the surface of the substrate, and whether the laser beam has actually been damaged by any destruction mechanism. There was a problem that it could not be distinguished.

  In addition, although the technique shown in patent document 1 is proposed conventionally, not all the problems mentioned above can be cleared.

JP 2004-37439 A

  Therefore, the present invention has been devised in view of the above-described problems, and the object of the present invention is to be able to quantitatively measure non-destructively the laser proof strength of an optical component as a subject, An object of the present invention is to provide a specimen damage analyzing apparatus capable of analyzing a mechanism with high accuracy.

  In order to solve the above-described problems, an object damage analysis apparatus to which the present invention is applied includes an irradiation optical system that irradiates the object with pump light and probe light whose delay times are adjusted, and the probe light that is applied to the object. The reflectance analysis means comprises signal detection means for detecting the probe signal reflected from the specimen, and reflectance analysis means for analyzing the reflectance from the subject based on the probe signal detected by the signal detection means. The means identifies the height and / or width of the reflectance peak due to electron excitation and its relaxation from the above reflectance, and collates the correlation information between the damage degree and the height and / or width of the reflectance peak that are input in advance. Then, the degree of damage of the subject is determined.

  The reflectance analysis means includes a damage area Sd with respect to an irradiation area S irradiated with the probe light on the subject, a change amount ΔR (t) of the reflectance with respect to the delay time, and a subject non-input previously input. You may make it obtain | require based on the refractive index n at the time of damage, the refractive index n 'at the time of test object damage, and the variation | change_quantity (DELTA) n and (DELTA) n' with respect to the delay time of each refractive index.

  Further, the reflectance analysis means may identify the tendency of photochemical reaction, electronic excitation, and thermal reaction from the reflectance, and analyze the cause of damage or the damage mechanism based on the identified result. .

  The probe light further includes transmitted light receiving means for receiving the transmitted light that has passed through the subject, and the reflectance analyzing means is further configured based on information about the transmitted light received by the transmitted light receiving means. The tendency of the subject in the depth direction may be analyzed.

  Also, an optical pulse generating means for generating an optical pulse, an optical separating means for separating the optical pulse generated by the optical pulse generating means into pump light and probe light, and the pump light and probe separated by the optical separating means You may make it further provide the delay time adjustment means which adjusts the delay time with light, and the polarization control means which controls the polarization direction of the said probe light with respect to the said pump light in the direction orthogonal to each other.

  The object damage analyzer to which the present invention is applied identifies the height and / or width of the reflectance peak due to electron excitation and its relaxation from the measured reflectance, and the damage level and the reflectance peak height that are input in advance. The correlation information of the height and / or width is collated to determine the degree of damage of the subject. For this reason, according to the present invention, the presence or absence of damage to the subject can be analyzed non-destructively, and in order to determine the presence or absence of damage to the subject, the subject is purposely irradiated with laser light for destruction. This eliminates the need for so-called destructive measurement. For this reason, it is possible to determine the presence or absence of optical damage without glaring the optical component as a product.

It is a figure which shows the structure of the subject damage analyzer to which this invention is applied. It is a figure which shows the result of having measured the time change of the reflectance based on the probe signal from a subject. (A) is a figure which shows the reflectance peak B in the test piece which received light damage, (b) is a figure which shows the reflectance peak B in the test piece which has not received light damage. It is a figure which shows the relationship between delay time t (fs) from the time of incidence | injection of pump light, and the variation | change_quantity (DELTA) R of a reflectance. It is another figure which shows the structure of the test object damage analyzer to which this invention is applied.

  Hereinafter, an object damage analyzer according to an embodiment of the present invention will be described in detail with reference to the drawings.

  FIG. 1 shows the configuration of an object damage analyzer 1 to which the present invention is applied. This object damage analysis apparatus 1 is an apparatus that analyzes the degree of damage of the object 2 by a pump probe method, and includes a light source 11 and an ND (dimming) filter 12 to which a light pulse emitted from the light source 11 is supplied. A beam splitter 13 that divides the light that has passed through the ND filter 12, a reflector 14 that is disposed on the optical path of the pump light that has passed through the beam splitter 13, and pump light that is bent by the reflector 14 is supplied. The delay time adjusting unit 15, the reflecting plate 20 that guides the pump light supplied from the delay time adjusting unit 15 to the subject 2, and the pump light from the reflecting plate 20 is collected on the subject 2. And a condensing lens 23 that emits light.

  In addition, the object damage analyzer 1 further reflects the probe light from the reflector 18 disposed on the optical path of the probe light bent and separated by the beam splitter 13 and the probe light from the reflector 18. A reflecting plate 19 that leads to the specimen 2 side, a half-wave plate 35 to which probe light from the reflecting plate 19 is supplied, and a first polarizing element 36 provided on the exit side of the half-wave plate 35 A condensing lens 22 that condenses the probe light that has passed through the first polarizing element 36 on the subject 2, a pump light that is condensed by the condensing lens 23, and a probe that is condensed by the condensing lens 22. An optical chopper 24 for chopping light, a holder 26 for mounting the subject 2, a lens 28 for condensing the probe signal reflected by the probe light from the subject 2, and a probe condensed by the lens 28 A second polarizing element 30 for controlling the polarization direction of the probe signal; a light receiving element 31 disposed on the output side of the second polarizing element 30; and a lock-in amplifier 32 connected to the light receiving element 31. A personal computer (PC) 33 connected to the delay time adjustment unit 15 and the lock-in amplifier 32, and an imaging unit 34 and an XY stage 27 connected to the PC 33.

  The subject 2 is an optical element used as, for example, a lens, mirror, prism, substrate, beam splitter, or polarizing element. The material of the optical element as the subject 2 is, for example, optical glass such as crown glass such as BK7, flint glass such as F2, or synthetic quartz, calcium fluoride, lithium fluoride, barium fluoride, rock salt ( It is embodied by an optical crystal such as NaCl), germanium (Ge), sapphire, zinc selenium (ZnSe) or the like.

  The light source 11 is, for example, a femtosecond pulse laser light source. Specifically, the light source 11 may be a titanium sapphire laser oscillator that generates an optical pulse having a wavelength of about 750 nm and a time width of about 100 fs at a repetition frequency of 80 MHz.

  The ND filter 12 is used to reduce the light amount of the light pulse emitted from the light source 11. The ND filter 12 is composed of gray or black, and the light reduction amount of the light pulse emitted from the light source 11 is determined according to the degree of the darkness.

  The beam splitter 13 includes a half mirror (not shown) disposed obliquely in the optical path from the ND filter 12. The beam splitter 13 divides the optical pulse from the ND filter 12 and transmits part of the light pulse as it is, and reflects the remaining part in a direction substantially orthogonal thereto. Here, it is assumed that the light transmitted by the beam splitter 13 is used as pump light, and the reflected light is used as probe light, but the opposite may be possible.

  The reflectors 14, 18, and 19 are configured as mirrors that change an optical path by reflecting an incident light beam. Among these, the reflecting plate 14 bends the optical path of the pump light transmitted through the beam splitter 13 in a substantially right angle direction and guides it to the delay time adjusting unit 15. The reflector 18 reflects the probe light reflected by the beam splitter 13 in a substantially right angle direction. The reflecting plate 19 reflects the probe light reflected by the reflecting plate 18 in a substantially right angle direction.

  The delay time adjustment unit 15 is configured by an optical system that uses adjustment of the optical path length by the movable mirror 16. The movable mirror 16 is composed of a pair of reflection mirrors arranged obliquely at an angle of 45 degrees with respect to the incident optical axis, and light incident along the incident optical axis is incident on the incident optical axis by one reflection mirror. On the other hand, it is reflected perpendicularly and enters the other reflecting mirror, and is reflected by the other reflecting mirror in parallel to the incident direction.

  As a result, the movable mirror 16 is moved and adjusted in the optical axis direction of the pulse of the pump light, so that the optical path length is long when the movable mirror 16 moves upward in the figure, and the optical path length when it moves downward in the figure. Will be adjusted short. Therefore, the delay time adjustment unit 15 can adjust the delay time between the pump light and the probe light by moving the movable mirror 16. Here, the variable range of the optical path length of the pump light is generally about 30 cm, and a delay time setting range of, for example, −1 to 1 ns is given between the probe pulse light and the pump pulse light. .

  Note that the delay time adjustment unit 15 has been described by taking an example in which time delay is performed by adjusting the optical path of the pump light, but is not limited thereto, and may be provided on the optical path of the probe light. . Accordingly, it is possible to delay the time by adjusting the optical path of the probe light.

  The light emitted from the delay time adjustment unit 15 is reflected by the reflecting plate 20 and collected by the condenser lens 23, and is irradiated almost perpendicularly to the surface of the subject 2, and further to the surface of the subject 2. Will be reflected almost vertically.

  Further, the half-wave plate 35 generates a half-wave phase difference with respect to the incident probe light. The half-wave plate 35 converts the linearly polarized component of the probe light into a component orthogonal to this, and sets the phase difference to 180 °. By passing the probe light through the half-wave plate 35, the ratio of the P-polarized component and the S-polarized component can be adjusted.

  The first polarizing element 36 transmits one of the S-polarized component and the P-polarized component in the probe light that has passed through the half-wave plate 35 and emits it. In the following example, the case where the P-polarized light component is transmitted from the first polarizing element 36 will be described as an example.

  The condensing lens 22 irradiates the probe light that has passed through the first polarizing element 36 obliquely upward with respect to the surface of the subject 2. As a result, the probe light incident from the obliquely upward direction is reflected by the surface of the subject 2 to be collected as light as a probe signal by the lens 28.

  The light chopper 24 periodically chops the pump light and the probe light by intermittently switching the pump light condensed by the condensing lens 23 and the probe light condensed by the condensing lens 22. . The light chopper 24 may be configured as a rotating disk in which light reflecting portions and light transmitting portions are alternately arranged in the circumferential direction, and the light beam may be periodically reflected or passed by rotating the motor. The purpose of disposing the optical chopper 24 is to improve the signal-to-noise ratio of the signal to be acquired. Incidentally, the optical chopper 24 is controlled by the PC 33 via the lock-in amplifier 32. Pump light and probe light modulated by the light chopper 24 are applied to the surface of the subject 2.

  The second polarizing element 30 transmits one of the S-polarized component and the P-polarized component in the probe signal light collected by the lens 28 and emits it. The polarization component to be transmitted by the second polarization element 30 is assumed to be the same as the polarization component to be transmitted by the first polarization element 36, and the polarization component transmitted through the first polarization element 36 is If it is a P-polarized component, the polarized component to be transmitted by the second polarizing element 30 is also a P-polarized component.

  The light receiving element 31 receives the P-polarized light component that has passed through the second polarizing element 30 and photoelectrically converts the light to generate an electric signal, and transmits the electric signal to the lock-in amplifier 32.

  The lock-in amplifier 32 amplifies this electric signal and transmits it to the PC 33. The lock-in amplifier 32 is also supplied with a reference signal from the optical chopper 24, amplifies it, and transmits it to the PC 33.

  The imaging unit 34 includes a camera that performs imaging from the back side of the subject 2. The imaging unit 34 includes a lens for forming image light and a CCD (Charge Coupled Device) image sensor that generates an electrical imaging signal based on a subject image incident through the lens. . Thereby, the imaging unit 34 can receive the transmitted light that has passed through the subject 2. And this imaging part 34 can acquire the information of the depth direction of the subject 2 from the information regarding this transmitted light. The imaging unit 34 transmits an imaging signal related to the transmitted light generated from the CCD to the PC 33.

  The XY stage 27 moves the subject 2 fixed by the holder 26 in the X direction and the Y direction. In addition to this XY stage 27, a rotation stage (not shown) for rotating the subject 2 may be further provided, and a Z-axis stage for moving the subject 2 in the height direction is further provided. It may be done.

  The PC 33 plays a role as a central control unit for controlling the subject damage analysis apparatus 1. The PC 33 is supplied with a signal from the lock-in amplifier 62 and analyzes the reflectance based on the supplied signal. Further, the PC 33 is supplied with an imaging signal from the imaging unit 34, and can analyze the imaging signal to obtain a transmission image of the subject 2. Further, the PC 33 adjusts the delay time of the pump light and the probe light by controlling the delay time adjustment unit 15 based on the command input from the user.

  When the object damage analyzing apparatus 1 having the above-described configuration is used to actually analyze the object 2 for damage, the movable mirror 16 of the delay time adjusting unit 15 placed in the optical path of the pump light is physically moved. By changing the optical path length, the delay time with the probe light is adjusted. The pump light is applied to the subject 2 after being chopped by the light chopper 24. The subject 2 itself is excited by this pump light irradiation. Further, since the probe light is incident on the subject 2 obliquely from above and is reflected obliquely upward, only the probe signal component can be received by the light receiving element 31. However, the pump light scattered on the surface of the subject 2 causes noise when detecting the probe light. Therefore, the probe light is adjusted by the first polarizing element 36 so that the polarization direction is different from that of the pump light, and the second polarizing element 30 detects only the probe light of the polarization component.

  FIG. 2 shows the result of measuring the temporal change in reflectance based on the probe signal from the subject 2. In FIG. 2, the horizontal axis indicates the time delay (fs) from the time when the pump light is incident on the subject 2, and the vertical axis indicates the reflectance ΔR / R. The time origin (0 seconds) corresponds to the incident time of the pump light.

  The temporal change in reflectance can be roughly classified into three patterns. The reflectance peak A is based on the nonlinear optical response. This reflectance peak A is an optical response caused by actually irradiating the surface of the subject 2 with pump light, and is a refraction caused by a change in an electronic excited state that may be accompanied by a photochemical reaction due to multiphoton absorption. Respond to rate changes. Incidentally, the reflectance ΔR / R of the reflectance peak A is as high as more than 0.002, and its width is narrow. These are physical quantities that depend on the material.

  Further, the reflectance peak B is obtained from the stage where the reflectance is lowered by the electron excitation by the pump light irradiated on the subject 2 and the stage where the reflectance is improved by the relaxation of the excited electrons. A valley-shaped peak appears.

  Moreover, the tendency C is due to a thermal reaction based on a change in refractive index caused by irradiation with pump light.

  In the subject damage analysis apparatus 1 to which the present invention is applied, the degree of optical damage of the subject 2 is analyzed based on such a change in reflectance over time.

  First, in the first analysis method, the degree of damage of the subject 2 is determined based on the reflectance peak B due to the above-described electronic excitation and its relaxation. In this first analysis method, two types of test pieces are prepared: a test piece intentionally damaged by light and a test piece not damaged at all. Incidentally, it is desirable that the test piece is an optical component having the same components and surface state as the subject 2.

  Next, with respect to each of the test piece that has been damaged by light and the test piece that has not been damaged by light, the specimen damage analyzer 1 measures the change in reflectance over time in advance, and the reflectance peak B is identified. FIG. 3A shows the reflectance peak B in the test piece damaged by light, and FIG. 3B shows the reflectance peak B in the test piece not damaged by light. The reflectance peak B of the test piece that has been damaged by light is narrower and the depth of the peak becomes deeper than the reflectance peak B of the test piece that has not been damaged by light. ing. That is, it is shown that the width and depth (height) of the reflectance peak B are greatly different between the test piece that is damaged by light and the test piece that is not damaged by light. In other words, it can be said that there is a correlation between the point of whether or not the optical damage has occurred and the width and depth (height) of the reflectance peak B.

  In the first analysis method, the correlation is analyzed in advance and stored in the PC 33 as correlation information. And then. With respect to the subject 2 to actually measure the degree of optical damage from now on, the change in reflectance over time is measured. And the measurement result of the reflectance in the subject 2 is compared with the previously measured correlation information. As a result, if the measurement result of the reflectance in the subject 2 is similar to the profile of FIG. 3A, it can be determined that there is no optical damage, and FIG. If it is similar to the profile, it can be determined that it has been damaged by light. Incidentally, when comparing the correlation information, it is only necessary to refer to either or both of the width and depth (height) of the reflectance peak B.

  As described above, according to the first analysis method, the height and / or width of the reflectance peak due to electron excitation and its relaxation is identified from the reflectance measured for the subject 2. Then, the presence / absence of damage of the subject is determined by comparing the presence / absence of damage input in advance with the correlation information of the height and / or width of the reflectance peak.

  Thereby, the presence or absence of damage to the subject 2 can be analyzed non-destructively, and in order to determine whether or not the subject 2 is damaged, the subject 2 is bothered by irradiating the subject 2 with laser light and destroying it. The need for destructive measurement is also eliminated. Therefore, according to the first analysis method, it is possible to determine the presence or absence of the optical damage without glaring the optical component as a product.

  According to the first analysis method, not only the presence or absence of damage to the subject 2 but also the degree of damage to the subject 2 can be determined. For example, the height and / or width of the reflectance peak B is measured for each of a plurality of types of test pieces ranked by the degree of optical damage. Then, correlation information between the degree of optical damage and the height and / or width of the reflectance peak B is acquired and stored in the PC 33. Thereafter, the height and / or width of the reflectance peak B is measured in the same manner for the subject 2 for which the degree of damage is actually obtained, and the height and / or width of the reflectance peak B in the correlation information most similar to this is measured. The degree of damage may be discriminated. It can be considered that the presence or absence of damage to the subject 2 described above evaluates the degree of damage in two stages, but the degree of damage may be evaluated not only in this two-stage evaluation but also in three or more stages.

  Further, according to the first analysis method, in addition to the case where the subject 2 is subjected to damage analysis only at one location, the XY stage 27 is used to perform damage analysis at a plurality of locations by moving the probe light spot formation position. It is also possible.

  Next, a second analysis method by the subject damage analyzer 1 will be described.

  In the second analysis method, the damage area Sd with respect to the irradiation area S irradiated with the probe light on the subject 2 is analyzed.

  FIG. 4 shows the delay time t (fs) from when the pump light is incident on the subject 2 on the horizontal axis, and the reflectance change amount ΔR on the vertical axis. ΔR initially increases corresponding to reflectance peak A, and then gradually decreases as reflectance peak B and trend C are reached.

  Such ΔR can be expressed as a function ΔR (t) of the delay time t. Expression (1) shows the reflectance ΔR (t) of the subject 2 when there is no optical damage.

ΔR (t) = 2Δn (t) (n−1) / | n + 1 | ² (1)

  In Expression (1), the refractive index when the subject is not damaged is n, and Δn (t) is a change amount Δn of the refractive index n with respect to the delay time t.

  Equation (2) represents the reflectance ΔR (t) of the subject 2 when there is optical damage.

ΔR (t) = 2Δn (t) (n−1) / | n + 1 | ² × (S−Sd) / S + 2Δn ′ (t) (n′−1) / | n ′ + 1 | ² × Sd / S (2)

  In Expression (2), the refractive index when the subject is damaged is n ′, and Δn ′ (t) is a change amount Δn ′ of the refractive index n ′ with respect to the delay time t.

  When actually measuring the damage area Sd with respect to the irradiation area S when there is optical damage, first, the subject damage analyzer 1 measures the profile of ΔR with respect to the delay time t to obtain ΔR (t). In addition, it is assumed that the refractive index n when the subject is not damaged, the refractive indexes n ′, Δn (t), and Δn ′ (t) when the subject is damaged are input as information in the PC 33 in advance. The irradiation area S of the probe light with respect to the subject 2 can be obtained with a commercially available beam profiler or the like.

  By substituting these parameters into the equation (2), the damage area Sd can be obtained from the calculation, and as a result, the ratio of the damage area Sd to the irradiation area S can be obtained. In addition, according to the present invention, this damage area Sd can be quantitatively measured nondestructively.

  Next, the third analysis method will be described. According to the third analysis method, the reflectance peak A due to photochemical reaction, the reflectance peak B due to electron excitation and relaxation thereof, and the thermal reaction tendency C are identified from the reflectance measured for the subject 2. Next, the reflectance peaks A, B, and tendency C classified in advance for each damage cause or each damage mechanism are compared and referred to, and the cause of damage or damage is determined based on the identified reflectance peaks A, B, and tendency C. Analyze the mechanism.

  Thus, according to the present invention, it is possible to analyze the cause of damage and the damage mechanism with high accuracy.

  Furthermore, according to the present invention, it is possible to acquire information on the depth direction of the subject 2 from the information on the imaging unit 34, and based on this, the tendency of the subject 2 in the depth direction is analyzed. Of course, it is also good.

  In the above-described object damage analysis apparatus 1, the case where the light pulse emitted from the light source 11 is separated by the beam splitter 13 to generate the pump light and the probe light, respectively, has been described as an example, but the present invention is not limited thereto. It is not something. For example, as shown in FIG. 5, pump light and probe light may be generated by separate light sources, and the configuration corresponding to the beam splitter 13 may be omitted. In this configuration, the light source 11a that generates pump light and the light source 11b that generates probe light are configured independently of each other. Instead of providing the light sources 11a and 11b separately, the configuration relating to the beam splitter 13 is omitted.

  The light emitted from the light source 11a passes through the ND filter 12a and becomes pump light as it is. Further, the light emitted from the light source 11b passes through the ND filter 12b, reaches the reflection plate 18, and becomes probe light as it is. The subsequent pump light and probe light paths are the same as described above. The light source 11a and the light source 11b are premised on various adjustments such as synchronization.

  In the present invention, the configuration relating to the first polarizing element 36 and the second polarizing element 30 may be omitted. That is, by making the polarization directions different between the pump light and the probe light, not only when the probe light is accurately detected, but also when the probe light is detected by the light receiving element 31, it is not mixed with the pump light. The irradiation direction or the like may be spatially different.

DESCRIPTION OF SYMBOLS 1 Subject damage analyzer 2 Subject 11 Light source 12 ND filter 13 Beam splitter 14, 18, 19 Reflector plate 15 Delay time adjustment part 20 Reflector plates 22, 23 Condensing lens 24 Optical chopper 26 Holder 27 XY stage 28 Lens 30 First Two polarizing elements 31 Light receiving element 32 Lock-in amplifier 33 PC
34 Imaging part 35 1/2 wavelength plate 36 1st polarizing element

Claims (5)

An irradiation optical system that irradiates the subject with pump light and probe light whose delay times are adjusted to each other;
Signal detection means for detecting the probe signal reflected from the subject by the probe light; and
A reflectance analyzing means for analyzing the reflectance from the subject based on the probe signal detected by the signal detecting means,
The reflectance analysis means identifies the height and / or width of the reflectance peak due to electron excitation and relaxation from the reflectance, and determines the degree of damage and the height and / or width of the reflectance peak that are input in advance. An object damage analyzer characterized by collating correlation information and determining the degree of damage of the object. The reflectance analysis means includes a damage area Sd with respect to an irradiation area S irradiated with the probe light on the subject, a change amount ΔR (t) of the reflectance with respect to the delay time, and a subject non-input previously input. 2. The object damage according to claim 1, wherein the object damage is obtained based on a refractive index n at the time of damage, a refractive index n ′ at the time of damage to the object, and variations Δn and Δn ′ with respect to a delay time of each refractive index. Analysis equipment. The reflectance analysis means identifies a tendency of a photochemical reaction, electronic excitation, and thermal reaction from the reflectance, and analyzes a cause of damage or a damage mechanism based on the identified result. 3. The object damage analyzer according to 1 or 2. The probe light further comprises transmitted light receiving means for receiving the transmitted light transmitted through the subject,
The said reflectance analysis means further analyzes the tendency of the depth direction of the said subject based on the information regarding the transmitted light received by the said transmitted light light-receiving means, The any one of Claims 1-3 characterized by the above-mentioned. 2. The object damage analyzer according to claim 1. An optical pulse generating means for generating an optical pulse;
Light separating means for separating the light pulse generated by the light pulse generating means into pump light and probe light;
A delay time adjusting means for adjusting a delay time between the pump light and the probe light separated by the light separating means;
The object damage analyzer according to any one of claims 1 to 4, further comprising polarization control means for controlling the polarization directions of the probe light with respect to the pump light in directions orthogonal to each other.

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