JP2011177854A - Suction device and droplet discharge device - Google Patents

Abstract

A suction device that does not cause warpage or local deformation in a workpiece is provided.
An adsorption device 20 for adsorbing a workpiece 5 includes an adsorption plate 21, a porous porous adsorption portion 22 provided on the adsorption plate 21 and formed in a frame shape along the outer shape of the workpiece 5. And a negative pressure generating unit 25 communicated with the porous adsorption unit 22. For this reason, the part which adsorb | sucks the workpiece | work 5 is the external shape vicinity of the workpiece | work 5, and since the area to adsorb | suck is large, it can adsorb | suck, without giving a warp or a local deformation | transformation to the workpiece | work 5. Then, unnecessary stress is not applied to the work 5 and the work 5 can be prevented from cracking.
[Selection] Figure 1

Description

  The present invention relates to an adsorption device and a droplet discharge device.

2. Related Art There is known a droplet discharge device that performs various drawing operations by discharging a liquid into droplets onto a work such as a semiconductor substrate or a glass substrate. In recent years, various device manufacturing, marking, printing, and the like are performed using a droplet discharge device, and the field of use of the droplet discharge device is expanding.
By the way, a workpiece is transported in a production apparatus such as a droplet discharge device. Generally, a suction device is used in which a suction pad is brought into contact with the surface (upper surface) of the workpiece and vacuum-sucked to hold the workpiece. Things have been done. (See Patent Document 1).

JP 2009-160713 A

However, in recent years, workpieces have become thinner, and there is a problem that warpage occurs on workpieces due to workpiece adsorption. Further, the suction hole portion may be locally deformed depending on the strength of the suction.
When such a workpiece is warped or locally deformed, there is a problem that stress is applied to the workpiece and the workpiece is easily broken. When an image of a workpiece being conveyed is recognized, an alignment mark formed on the workpiece may be deformed and image recognition may become unstable.
For this reason, the adsorption | suction apparatus which does not generate | occur | produce a curvature | sledge and local deformation | transformation with respect to the thin workpiece | work is desired.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  [Application Example 1] An adsorption device according to this application example is an adsorption device that adsorbs a workpiece, and includes an adsorption plate and a porous frame provided on the adsorption plate and formed in a frame shape along the outer shape of the workpiece. A porous adsorbing portion and a negative pressure generating portion communicating with the porous adsorbing portion are provided.

According to this structure, the porous porous adsorption | suction part formed in frame shape along the external shape of a workpiece | work attracts | sucks a workpiece | work. The portion that adsorbs the workpiece is near the outer periphery of the workpiece, and the area to be adsorbed is large, so that the workpiece can be adsorbed without giving warpage or local deformation. Further, unnecessary stress is not applied to the work, and the work can be prevented from cracking.
Further, in the suction device of this application example, since the central portion of the work and the porous suction portion do not come into contact with each other, there is no risk of adhesion of dust or the like to the central portion of the work.

  Application Example 2 In the adsorption device according to the application example described above, the frame-shaped porous adsorption part is formed separately.

  According to this structure, the frame-shaped porous adsorption | suction part is formed separately. By doing so, it is possible to divide the suction intake system, and it is possible to further reduce the warpage of the work by adjusting the strength of each intake.

  Application Example 3 An adsorption device according to this application example is an adsorption device that adsorbs a workpiece, and is provided with a plurality of adsorption plates and the same height provided on the adsorption plate along the outer shape of the workpiece. It has a needle-like suction part from which a hollow needle protrudes, and a negative pressure generating part communicated with the needle-like suction part.

According to this configuration, the needle-like suction part in which the hollow needle is arranged along the outer shape of the work sucks the work. The part that adsorbs the workpiece is in the vicinity of the outer periphery, and furthermore, the adsorption is performed with a large number of needle tips, and the adsorption area is small, so that the workpiece can be adsorbed without warping or local deformation. Further, unnecessary stress is not applied to the work, and the work can be prevented from cracking.
Further, in the suction device of this application example, since the center portion of the workpiece and the needle-like suction portion do not come into contact with each other, there is no fear of adhesion of dust or the like to the center portion of the workpiece.

  Application Example 4 A liquid droplet ejection apparatus according to this application example is a liquid droplet ejection apparatus that applies a liquid droplet to a workpiece, and the adsorption device according to any one of application examples 1 to 3 and the adsorption device. And a droplet discharge head that discharges droplets to the workpiece.

According to this configuration, the suction device that does not give warpage or local deformation to the workpiece is provided in the droplet discharge device. For this reason, it is possible to provide a droplet discharge device that does not give warpage or local deformation to the workpiece during conveyance of the workpiece. In addition, unnecessary stress is not applied to the workpiece during workpiece suction, and the workpiece can be prevented from cracking.
Further, this droplet discharge device does not warp the workpiece during conveyance of the workpiece and can accurately recognize the image of the workpiece while the workpiece is attracted.

The structure of the adsorption | suction apparatus in 1st Embodiment is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. The schematic plan view which shows the modification of the adsorption | suction apparatus in 1st Embodiment. The structure of the adsorption | suction apparatus in 2nd Embodiment is shown, (a) is a schematic plan view, (b) is a schematic sectional drawing. FIG. 9 is a schematic plan view illustrating a configuration of a droplet discharge device according to a third embodiment. The schematic side view which shows a part of structure in the droplet discharge apparatus of 3rd Embodiment. FIG. 10 is a schematic cross-sectional perspective view showing a configuration of a droplet discharge head in a third embodiment. The schematic perspective view which shows the structure of the robot in 3rd Embodiment. FIG. 10 is an electric control block diagram of a droplet discharge device according to a third embodiment. The top view which shows the alignment mark of the workpiece | work in 3rd Embodiment. FIG. 10 is a schematic diagram illustrating the operation of a droplet discharge device according to a third embodiment.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. In the drawings used for the following description, the ratio of dimensions of each member is appropriately changed so that each member has a recognizable size.
(First embodiment)

FIG. 1 shows a configuration of an adsorption device according to the present embodiment, FIG. 1 (a) is a schematic plan view, and FIG. 1 (b) is a schematic cross-sectional view taken along the line AA in FIG.
The adsorption device 20 includes a rectangular flat plate-like adsorption plate 21, a porous adsorption unit 22 formed of a porous material having a number of fine holes, a negative pressure generation unit 25 communicating with the porous adsorption unit 22, have.
The suction plate 21 has a flat surface made of a metal material such as aluminum or stainless steel. And the porous adsorption | suction part 22 formed in frame shape along the external shape of the workpiece | work 5 is arrange | positioned on the surface of the adsorption | suction board 21. As shown in FIG. In addition, the workpiece | work 5 is a semiconductor substrate, a glass substrate, etc., and is a rectangular external shape.

A stepped groove portion 23 is formed on one surface of the adsorption plate 21 in accordance with the shape of the porous adsorption portion 22, and the porous adsorption portion 22 is fixed to the wide groove portion on the surface side with an adhesive or the like. The porous adsorbing portion 22 is disposed so as to protrude from one surface of the adsorbing plate 21, and the protruding surface is formed in parallel and flat with one surface of the adsorbing plate 21.
On the other hand, a space is formed between the narrow groove portion and one surface of the porous adsorption portion 22. A plurality of suction holes 24 penetrating from the stepped groove 23 to the other surface of the suction plate 21 are formed. The suction hole 24 communicates with the negative pressure generator 25 via a piping tube.
As the negative pressure generator 25, a vacuum generator or the like that generates a reduced pressure state using a reduced pressure pump or compressed air can be used.

  In this manner, suction is performed from the suction hole 24 due to the negative pressure state generated in the negative pressure generation unit 25. The suction hole 24 communicates with the stepped groove portion 23, and the space between the stepped groove portion 23 and the porous adsorption portion 22 is in a negative pressure state. And suction is performed through the fine hole of the porous adsorption | suction part 22 which touches this space. In this way, suction with a uniform force is possible from the porous suction portion 22, and the workpiece 5 having a flat contact surface can be sucked by bringing the workpiece 5 into contact with the porous suction portion 22.

In addition, the porous adsorption | suction part 22 is comprised by the resin sintered material which sintered and molded the resin material. Sinter molding is a method in which raw material powder is filled in a mold and heated, and the surface layers of the raw material powder are fused (sintered) to form while leaving the space between the powders. As the raw material powder, polyethylene (PE), polypropylene (PP), polystyrene (PS), polyvinyl chloride (PVC), polycarbonate (PC), polyamide (PA), acrylic resin (PMMA), fluororesin (PVDF, PTFE) It is possible to employ a thermoplastic resin material such as. Thus, by comprising the porous adsorption | suction part 22 with a resin material, the damage of the workpiece | work adsorbed | sucked to the surface of the porous adsorption | suction part 22 can be prevented.
Further, as the material of the other porous adsorption portion 22, a porous sintered metal, porous ceramics made of alumina, zirconia, silicon carbide, silicon nitride or the like may be used.

As described above, in the suction device 20 of this embodiment, the porous porous suction portion 22 formed in a frame shape along the outer shape of the work 5 sucks the work 5. The part that adsorbs the work 5 is in the vicinity of the outer periphery of the work 5, and the adsorbing area is large, so that the work 5 can be adsorbed without warping or local deformation. Then, unnecessary stress is not applied to the work 5 and the work 5 can be prevented from cracking.
Moreover, since the adsorption | suction apparatus 20 does not contact the center part of the workpiece | work 5, and the porous adsorption | suction part 22, there is no possibility of adhesion of the dust etc. to the center part of the workpiece | work 5. FIG.
(Modification)

Next, a modification of the adsorption device according to the first embodiment will be described.
The adsorption device of this modification is different in that the porous adsorption part is not formed integrally as in the first embodiment but is formed separately. For this reason, the difference of a structure is demonstrated in detail.
FIG. 2 is a schematic plan view showing a modification of the adsorption device according to the first embodiment.

As shown in FIG. 2A, the adsorption device 20a includes four porous adsorption portions 22a, 22b, 22c, and 22d formed in a frame shape along the outer shape of the workpiece 5 on the surface of the adsorption plate 21. Yes. The porous adsorbing portion 22a and the porous adsorbing portion 22c, the porous adsorbing portion 22b and the porous adsorbing portion 22d are arranged in parallel to face each other, and the frame shape is separated into four.
Although not shown, the suction plate 21 is formed with a stepped groove portion as in the first embodiment, and a plurality of suction holes 24 penetrating from the stepped groove portion to the other surface of the suction plate 21 are formed. . The suction hole 24 communicates with the negative pressure generating part via a piping tube.

As another modified example, as illustrated in FIG. 2B, the suction device 20 b includes two porous suction portions 22 e and 22 f formed in a frame shape along the outer shape of the work 5 on the surface of the suction plate 21. I have. The porous adsorbing portions 22e and 22f each have two rectangular sides, and the frame shape is separated into two.
Although not shown, the suction plate 21 is formed with a stepped groove portion as in the first embodiment, and a plurality of suction holes 24 penetrating from the stepped groove portion to the other surface of the suction plate 21 are formed. . The suction hole 24 communicates with the negative pressure generating part via a piping tube.

As in this modification, the frame-like porous adsorption portions 22a to 22f are formed separately, so that the intake air intake system can be divided, and the strength of each intake air is adjusted to warp the workpiece 5 Can be further reduced.
(Second Embodiment)

Next, the adsorption device of the second embodiment will be described. In this embodiment, the configuration of the suction portion is different from that of the first embodiment. For this reason, about the same structure as 1st Embodiment, the same code | symbol is attached | subjected and demonstrated.
FIG. 3 shows a configuration of the adsorption device in the present embodiment, FIG. 3 (a) is a schematic plan view, and FIG. 3 (b) is a schematic cross-sectional view taken along the line BB in FIG.

The suction device 26 includes a rectangular flat plate-like suction plate 21, a large number of needle-like suction portions 27 protruding from the suction plate 21, and a negative pressure generating portion 25 communicating with the needle-like suction portion 27. .
The suction plate 21 has a flat surface made of a metal material such as aluminum or stainless steel. The needle-like suction part 27 is composed of a hollow needle (pipe-like needle) and has a small hole for suction. A needle-like suction portion 27 is disposed on the surface of the suction plate 21 along the outer shape of the workpiece 5. Specifically, a needle-like suction portion 27 is provided inside a little from the outer shape of the workpiece 5. Further, the needle-like suction portion 27 is disposed so as to protrude at the same height as one surface of the suction plate 21, and the suction surface is formed in parallel and flat with the one surface.
In addition, what is necessary is just to determine suitably the number which arrange | positions the needle-shaped adsorption | suction part 27 with a workpiece | work weight, suction force, etc. FIG.

A plurality of suction holes 24 communicating with the needle-like suction portion 27 are formed on the other surface of the suction plate 21. And the suction hole 24 is connected to the negative pressure generation part 25 via the piping tube.
As the negative pressure generator 25, a vacuum generator or the like that generates a reduced pressure state using a reduced pressure pump or compressed air can be used.

In this manner, suction is performed from the suction hole 24 due to the negative pressure state generated in the negative pressure generation unit 25. The suction hole 24 communicates with the needle-like suction part 27, and suction is performed through a small hole in the needle-like suction part 27.
In this manner, suction from a large number of needle-like suction portions 27 is possible, and the workpiece 5 having a flat contact surface can be sucked by bringing the workpiece 5 into contact with the needle-like suction portions 27.

As described above, in the suction device 26 of the present embodiment, a large number of needle-like suction portions 27 formed along the outer shape of the workpiece 5 suck the workpiece 5. The part that adsorbs the workpiece 5 is near the outer periphery of the workpiece 5, and further, the adsorption is performed at the needle tip and the adsorption area is small, so that the workpiece 5 can be adsorbed without warping or local deformation. Then, unnecessary stress is not applied to the work 5 and the work 5 can be prevented from cracking.
Further, since the suction device 26 does not contact the central portion of the work 5 and the needle-like suction portion 27, there is no fear of adhesion of dust or the like to the central portion of the work 5.
(Third embodiment)

Next, a droplet discharge device provided with the adsorption device described above will be described.
FIG. 4 is a schematic plan view showing the configuration of the droplet discharge device of this embodiment. FIG. 5 is a schematic side view showing the configuration of the droplet discharge device excluding the robot. FIG. 6 is a schematic cross-sectional perspective view showing the configuration of the droplet discharge head. FIG. 7 is a schematic perspective view showing the configuration of the robot. In each figure, orthogonal coordinates are displayed for explanation.
As shown in FIG. 4, the droplet discharge device 1 sucks a workpiece 5 such as a glass substrate or a semiconductor substrate, a robot 10 as a transfer device that moves the suction device 20, and feeds and unloads the workpiece. A feeding / dispensing material section 30, a camera 35 capable of imaging the workpiece 5 sucked by the suction device 20, a drawing stage 40 on which the workpiece 5 is placed, a droplet discharge head 50 for applying droplets to the workpiece 5, It has.

The feeding / unloading material section 30 is disposed on the base 8, and includes a pedestal 31 and a feeding / feeding material stage 32 disposed on the pedestal 31. The feeding / dispensing material unit 30 is a place where the workpiece 5 is temporarily placed before or after the droplet application, and the workpiece 5 is placed on the feeding / feeding material stage 32.
The camera 35 is arranged on the base 8 and arranged so that the focal point is upward (+ Z axis direction). The camera 35 can capture an image of the workpiece 5 sucked by the suction device 20. The camera 35 is arranged near the drawing stage 40.

The drawing stage 40 is connected to a linear motion mechanism such as a ball screw and is configured to be movable along the guide rail 45. The guide rail 45 is fixed to the base 8, and the drawing stage 40 can move in the Y-axis direction.
Two struts 64 that rise upward (in the + Z-axis direction) from the base 8 are formed, and guide rails 65 that bridge both ends of the struts 64 are provided. The guide rail 65 is disposed so as to extend in the X-axis direction.
A carriage 60 is sandwiched between the guide rails 65, and the carriage 60 is connected to a linear motion mechanism such as a ball screw and is configured to be movable along the guide rails 65 in the X-axis direction.

The carriage 60 is provided with a droplet discharge head 50 as a droplet discharge portion so as to face the base 8.
A direction in which the droplet discharge head 50 and the workpiece 5 are relatively moved when droplets are discharged is referred to as a main scanning direction, and a direction orthogonal to the main scanning direction is referred to as a sub-scanning direction. The sub-scanning direction is a direction in which the droplet discharge head 50 and the workpiece 5 are relatively moved when a line feed is made. In the present embodiment, the X-axis direction is the main scanning direction, and the Y-axis direction is the sub-scanning direction.

  As shown in FIG. 6, the droplet discharge head 50 includes a plurality of nozzles 55 in a nozzle plate 56, a pressure chamber 53 communicating with an opening of each nozzle 55, and a diaphragm 52 constituting one wall surface of the pressure chamber 53. A piezoelectric element 51 such as PZT for deforming the diaphragm 52 and a common ink chamber 54 for feeding a liquid material such as ink into each pressure chamber 53 are provided.

  The diaphragm 52 is formed of a thin plate that can be elastically deformed, and is in contact with the tip of the piezoelectric element 51. With such a configuration, when the piezoelectric element 51 contracts, the diaphragm 52 bends upward and the pressure chamber 53 expands, the liquid material in the common ink chamber 54 flows into the pressure chamber 53. When the piezoelectric element 51 expands after the elapse of a predetermined time, the diaphragm 52 returns to its original state, and the pressure chamber 53 contracts, the liquid material in the pressure chamber 53 is compressed and droplets are ejected from the opening of the nozzle 55. . At this time, it is possible to draw on the work depending on from which of the many nozzles 55 formed in the droplet discharge head 50 the droplet is discharged.

Next, a robot as a transport device for the droplet discharge device will be described.
As shown in FIG. 7, the robot 10 is a scalar type robot, and a support base 12 is installed on a flat base 11. A rotation mechanism 12a including a motor, an angle detector, a speed reducer, and the like is provided inside the support base 12. The output shaft of the motor is connected to the speed reducer, and the output shaft of the speed reducer is connected to the first arm portion 13 disposed above the support base 12. An angle detector is connected to the output shaft of the motor and detects the rotation angle of the output shaft of the motor. Thereby, the rotation mechanism 12a can detect the rotation angle of the 1st arm part 13, and can rotate it to a desired angle.

  On the first arm portion 13, a rotation mechanism 14 is installed at the end opposite to the support base 12. The rotation mechanism 14 includes a motor, an angle detector, a speed reducer, and the like, and has the same function as the rotation mechanism 12 a installed in the support base 12. The output shaft of the rotation mechanism 14 is connected to the second arm portion 15. Thereby, the rotation mechanism 14 can detect the rotation angle of the second arm portion 15 and rotate it to a desired angle.

On the second arm portion 15, an elevating mechanism and a rotating mechanism 16 are disposed at the end opposite to the rotating mechanism 14.
The suction device 20 described in the first embodiment for holding a workpiece is provided below the lifting mechanism and the rotation mechanism 16. The suction device 20 can be moved in the vertical direction (Z-axis direction) and rotated on the XY plane by the lifting mechanism and the rotating mechanism 16.

Within the operating range of the suction device 20 attached to the robot 10, the supply / discharge material unit 30, the camera 35, and the drawing stage 40 are arranged.
As described above, the suction device 20 attached to the robot 10 can suck the workpiece 5 by the feeding / dispensing material unit 30, convey the workpiece 5 above the camera 35, and place the workpiece 5 on the drawing stage 40. Yes.

Next, electric control of the droplet discharge device will be described.
FIG. 8 is an electric control block diagram of the droplet discharge device.
The droplet discharge device 1 includes a control device that controls its operation. The control device includes a CPU (Central Processing Unit) 70 that performs various types of arithmetic processing as a processor, and a memory 80 that stores various types of information.

The main scanning driving device 92, the sub scanning driving device 93, the head driving circuit 94 for driving the droplet discharge head 50, the camera operating circuit 95 for operating the camera 35, the robot driving circuit 96 for driving the robot 10, and the suction device 20 are operated. The suction device operating circuit 97 is connected to the CPU 70 via the input / output interface 91 and the data bus 90.
The main scanning drive device 92 is a device that controls the movement of the drawing stage 40, and the sub-scanning drive device 93 is a device that controls the movement of the carriage 60.

  The memory 80 is a concept including a semiconductor memory such as a RAM and a ROM, and an external storage device such as a hard disk and a CD-ROM. Functionally, a storage area for storing program software 81 in which a control procedure of the operation in the droplet discharge device 1 is described is set. Furthermore, a storage area for storing discharge position data 82 which is coordinate data of the discharge position in the work is also set.

The CPU 70 performs control for discharging droplets to a predetermined position of the work according to the program software 81 stored in the memory 80.
The CPU 70 includes a main scanning control unit 71, a sub-scanning control unit 72, a discharge control unit 73, a camera control unit 74, a robot control unit 75, a work position calculation unit 76, and a work placement position calculation unit 77.

The main scanning control unit 71 performs control for moving the droplet discharge head 50 in the main scanning direction by a predetermined scanning amount, and the sub scanning control unit 72 performs scanning movement for moving the workpiece in the sub scanning direction at a predetermined speed. Take control.
The discharge control unit 73 performs calculations related to the droplet discharge of the droplet discharge head 50.

The camera control unit 74 controls the operation of the camera so as to capture an image of the workpiece, and the robot control unit 75 controls the movement of the robot such as suction and conveyance of the workpiece.
The workpiece position calculation unit 76 performs image processing on the workpiece image picked up by the camera, and calculates the workpiece position during conveyance based on the position information of the robot.
The workpiece placement position calculation unit 77 calculates the position where the workpiece should be placed on the drawing stage based on the workpiece position obtained by the workpiece position calculation unit 76. Then, this position information is sent to the robot controller 75 via the data bus 90.

Next, the operation of the droplet discharge device having such a configuration will be described.
FIG. 9 is a plan view showing the alignment mark of the workpiece. FIG. 10 is a schematic diagram for explaining the operation of the droplet discharge device.
As shown in FIG. 9, an alignment mark 5 a is formed in advance on one surface of the work 5. In this embodiment, at least two alignment marks 5a are formed at predetermined positions on the work 5 on the surface opposite to the surface on which drawing is performed. The alignment mark 5a is preferably different from the hue on the surface of the workpiece 5.

As shown in FIG. 10A, the robot is driven and the suction plate 21 of the suction device 20 sucks the workpiece 5 placed on the supply / discharge material stage 32 of the supply / discharge material part 30.
In this state, the workpiece 5 is conveyed and reaches above the camera 35 as shown in FIG. An alignment mark is formed on the back surface of the workpiece 5, and the camera 35 images the workpiece 5 being conveyed and recognizes the alignment mark.
Here, the position information of the work 5 is calculated from the position information of the robot hand and the position information from the alignment mark by the work position calculation unit of the CPU. Subsequently, the work placement position calculation unit calculates a position where the work 5 should be placed on the drawing stage based on the work position obtained by the work position calculation unit, and generates position information thereof.

Then, the workpiece 5 is conveyed by passing over the camera 35 and stops above the drawing stage 40. Subsequently, the robot is driven and the suction plate 21 is lowered, and the work 5 is placed on the drawing stage 40 based on the position information generated by the work position calculation unit, as shown in FIG.
The position of the workpiece 5 placed on the drawing stage is not shifted from the droplet discharge head 50 for discharging droplets, and it is not necessary to correct the workpiece position.
After placing the workpiece 5 on the drawing stage 40, the robot is driven, and the suction device 20 returns to the upper side of the supply / discharge material stage 32 and stands by.

Thereafter, as shown in FIG. 10D, the carriage 60 moves to approach the drawing stage 40, and droplets are applied from the droplet discharge head 50 to the work 5. If necessary, the drawing stage 40 is moved in the sub-scanning direction to make a line feed, and the droplets are applied to the workpiece 5.
When the application of droplets to the workpiece 5 is completed, the carriage 60 returns to the standby position. Then, the robot is driven to suck and convey the work 5 on which the suction plate 21 is placed on the drawing stage 40, and is placed on the supply / discharge material stage 32.

As described above, in the droplet discharge device 1 of the present embodiment, the droplet discharge device is provided with the suction device 20 that does not give warpage or local deformation to the workpiece 5. For this reason, unnecessary stress is not applied to the workpiece 5 when the workpiece 5 is sucked, and the workpiece can be prevented from cracking.
Further, the droplet discharge device 1 does not warp or locally deform the workpiece 5 during the conveyance of the workpiece, and can accurately recognize the image of the workpiece 5 while the workpiece 5 is adsorbed.

  In addition, in the said embodiment, although the adsorption | suction apparatus in 1st Embodiment was equipped in the droplet discharge apparatus, you may provide the adsorption apparatus demonstrated in 2nd Embodiment.

  DESCRIPTION OF SYMBOLS 1 ... Droplet discharge apparatus, 5 ... Work, 5a ... Alignment mark, 8 ... Base, 10 ... Robot as a conveying apparatus, 11 ... Base, 12 ... Supporting base, 12a ... Rotation mechanism, 13 ... 1st arm part DESCRIPTION OF SYMBOLS 14 ... Rotation mechanism, 15 ... 2nd arm part, 16 ... Lifting mechanism and rotation mechanism, 20 ... Adsorption apparatus, 20a, 20b ... Adsorption apparatus, 21 ... Adsorption plate, 22 ... Porous adsorption part, 22a-22f ... Porous Material adsorbing part, 23 ... stepped groove part, 24 ... suction hole, 25 ... negative pressure generating part, 26 ... adsorbing device, 27 ... needle-like adsorbing part, 30 ... feeding / discharging material part, 31 ... pedestal, 32 ... feeding / discharging material Stage, 35 ... Camera, 40 ... Drawing stage, 45 ... Guide rail, 50 ... Droplet ejection head as droplet ejection unit, 51 ... Piezoelectric element, 52 ... Vibration plate, 53 ... Pressure chamber, 54 ... Common ink chamber, 55 ... Nozzle, 56 ... Nozzle plate, 60 ... Carry , 64 ... support column, 65 ... guide rail, 70 ... CPU, 71 ... main scanning control unit, 72 ... sub-scanning control unit, 73 ... discharge control unit, 74 ... camera control unit, 75 ... robot control unit, 76 ... work position Calculation unit 77... Work placement position calculation unit 80. Memory 81. Program software 82 82 Discharge position data 90. Data bus 91 91 Input / output interface 92 Main scanning drive device 93 Sub-scanning drive Device 94 head driving circuit 95 camera operating circuit 96 robot driving circuit 97 suction device operating circuit

Claims (4)

An adsorption device for adsorbing a workpiece,
An adsorption plate;
A porous porous adsorbing portion provided in the adsorbing plate and formed in a frame shape along the outer shape of the workpiece;
And a negative pressure generating unit communicated with the porous adsorption unit. The adsorption device according to claim 1,
A frame-shaped porous adsorbing portion is formed separately. An adsorption device for adsorbing a workpiece,
An adsorption plate;
A needle-like suction portion projecting from a plurality of hollow needles provided on the suction plate and formed at the same height along the outer shape of the workpiece;
A suction device comprising: a negative pressure generating unit communicated with the needle-shaped suction unit. A droplet discharge device for applying droplets to a workpiece,
The adsorption device according to any one of claims 1 to 3,
A transport device for moving the suction device;
A droplet discharge apparatus comprising: a droplet discharge head that discharges droplets onto the workpiece.

Images