JP2011173085A - Electrospray deposition (esd) apparatus and esd method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ESD apparatus and an ESD method capable of forming a film in a large area. <P>SOLUTION: Voltage is impressed to a solution formed by dissolving a material, a spray liquid having a charge produced by the impression is sprayed to an object to be treated, and when the impression is performed between the solution and a loading part which carry the object to be treated, the spray is performed by a plurality of nozzle parts having the solutions and the spray openings, and the impression is controlled to control electrostatic repulsion between the spray liquids by spraying through the adjoining nozzle part. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an ESD apparatus and an ESD method for forming an organic material by an electrostatic spray method (ESD method), and more particularly to an ESD apparatus and an ESD method suitable for forming a large area.

  Although the current mainstream of semiconductors is silicon, organic EL is attracting attention as a next-generation semiconductor, and attention is focused on practical application to displays and lighting. In addition, vacuum evaporation of low-molecular organic EL materials is the mainstream as a method for manufacturing an organic EL display. In the future, in order to reduce the price, it is expected to produce a polymer organic EL material in the atmosphere (non-vacuum) by a coating (printing) process.

  A spin coater or slit coater has been used for large-area film formation of organic materials in a non-vacuum, but there is a problem that mixing occurs because the substrate is melted during lamination. For this reason, a large area film forming method in a non-vacuum which is less affected by the solvent has been awaited.

  The ESD method is a method for responding to this. The ESD method has been studied since around 1880 as one of non-vacuum film forming methods, and is applied in fields such as agricultural chemical spraying, liquid electrostatic coating machines, and thin film formation. Recently, Patent Document 1 discloses a technique applied to nanofibers. Patent Document 1 discloses a technique in which the raw material liquid deposited by periodically changing the polarity of the raw material liquid (supply liquid) with respect to one nozzle has an alternate polarity and is successfully deposited without mutual electrostatic repulsion. Disclosure.

JP 2009-13535 A

  However, since the area sprayed from the nozzle part is limited, a plurality of adjacent nozzle parts are necessary to increase the area by the ESD method without increasing the tact time. When the supply liquid is ejected (sprayed) from a plurality of adjacent nozzle portions, the single nozzle portion accumulates on the processing target as will be described later. However, as shown in FIG. The sprayed charged particles having electrostatic repulsion repel each other, the amount of spray from the central nozzle is suppressed, and the spray flow of the peripheral nozzles flows to both sides. As a result, a region 12n where the spray liquid 12d does not exist or the density is low is formed in the central portion, resulting in a region 12m that is difficult to form, and there is a problem that cannot be applied particularly to fields requiring uniform patterning such as displays. .

The prior art does not disclose the above-described problem, and of course, does not disclose a solution to this problem. This problem becomes more prominent when the substrate is a dielectric.
An object of the present invention is to provide an ESD apparatus and an ESD method capable of forming a film on a large area.

  In order to achieve an object of the present invention, a voltage is applied to a solution in which a material is dissolved, a spray liquid having a charge generated by the application is sprayed toward a processing target, and the application is mounted on the mounting target. The spraying is performed by a plurality of nozzle portions having the solution and having spray ports, and the application is controlled so as to suppress electrostatic repulsion between spray liquids sprayed from adjacent nozzle portions. This is a first feature.

In order to achieve the object of the present invention, in addition to the first feature, the control applies the voltage so that the total charge amount of the spray liquid generated in a predetermined time in the plurality of nozzle portions becomes equal to positive and negative. This is the second feature.
Furthermore, in order to achieve the object of the present invention, in addition to the first or second feature, the suppression has a third feature in that the voltage having a different polarity is applied between the adjacent nozzle portions.

In order to achieve the object of the present invention, in addition to the first feature, the suppression has a fourth feature that an alternating voltage having a phase shift is applied between adjacent nozzle portions.
Furthermore, in order to achieve the object of the present invention, in addition to the first feature, the plurality of nozzle portions are arranged in a matrix of M rows and N columns (M and N are integers of 1 or more). It is characterized by.
In order to achieve the object of the present invention, in addition to the fifth feature, the nozzle portions of adjacent rows or columns (N and M are 2 or more) are shifted from each other by a half of the nozzle portion interval. The sixth feature.

Furthermore, in order to achieve the object of the present invention, in addition to any of the first to sixth features, the seventh feature is that the solution is supplied to each of the plurality of nozzle portions. .
In order to achieve the object of the present invention, in addition to the seventh feature, the supply is characterized in that a plurality of types of solutions are supplied.

  According to the present invention, it is possible to provide an ESD apparatus and an ESD method capable of forming a film on a large area.

It is a figure which shows one Embodiment of the ESD apparatus of this invention. It is a figure which shows 1st Embodiment of the spraying part of this invention. It is a figure which shows the 1st Example which uses a DC voltage as an applied voltage to a solution. It is a figure which shows the 2nd Example using the alternating voltage from which the phase mutually shifted 180 degree | times as an applied voltage to a solution. It is a figure which shows the 3rd Example of an applied voltage when there is much electric charge generated in a solution when an applied voltage is given to a solution. It is a figure which shows the 4th Example of an applied voltage when the ratio of the electric charge amount which differs when the applied voltage is given to a solution differs and the ionization degree of a solution differs with polarity. It is a figure which shows the 5th Example of an applied voltage when the amount of electric charges which generate | occur | produces in a solution differs in polarity when the applied voltage is given to a solution. It is a figure which shows 2nd Embodiment of the spraying part of this invention. It is a figure which shows the example of the voltage applied to a solution, when forming a bulk heterojunction. It is a figure which shows 3rd Embodiment of the spraying part of this invention. It is a figure which shows 4th Embodiment of the spraying part of this invention. It is a figure which shows the principle of ESD method. It is a figure which shows the subject of this invention. It is a figure which shows the example which applies the applied voltages V1, V2, and V3 of the sine wave which mutually shifted 2/3 (pi) phase between the adjacent nozzle parts 10 shown in FIG.10 (b). It is a figure which shows the example which applies the applied voltage V1, V2, V3 of the rectangular wave which mutually shifted 1/3 (pi) phase between adjacent nozzle parts. It is a figure which shows the other method of nozzle part arrangement | positioning in 3rd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a diagram showing an embodiment of an ESD apparatus 100 according to the present invention.
The ESD apparatus is roughly divided into a spray unit 10 for spraying a solution, and a processing target (display substrate, film, etc., which will be described below as a representative display substrate P) conveyed from another adjacent processing device (not shown). A stage unit 20 to be placed, a mask unit 30 for defining a processing unit for a display substrate, a facility unit 40 having a facility for supplying or driving necessary components to each unit, a facility unit for receiving information from sensors in each unit, and the like It has the control part 50 and the base 60 which control.

  The spray unit 10 includes a nozzle unit 11 that sprays a solution from a spray port 11a at the tip of a glass capillary 11b containing a solution 12 in which a material (solute) is dissolved in a solvent, and has an electric charge from the nozzle unit provided in each nozzle unit. A guard ring 13 that defines a spray range of the spray liquid 12d sprayed, a liquid sensor 14 that measures the liquid quantity of the solution in the nozzle part, and a spray quantity sensor 15 that measures the spray quantity from the nozzle part 11. In order to avoid complexity, only one nozzle unit 11 is shown in FIG.

  The stage unit 20 includes a stage 21 that is grounded and made of a conductor on which the display substrate P is placed, and an imaging unit 22 that images the alignment mark 23 on the display substrate P.

  The mask unit 30 includes a mask 31 for forming a film 31b at a desired position on the display substrate P placed on the stage 21, a collimator 32 for focusing the sprayed solution 12 on the opening 31a on the mask 31, and a display substrate. P has a substrate protection shutter 33 for preventing excessive spraying and liquid dripping at the start of film formation.

  The facility unit 40 generates a predetermined voltage to the solution supply source 12T that supplies the solution 12 to each nozzle unit 11 of the spray unit 10, the spray voltage generation source 11D that generates the spray voltage of each nozzle unit 11, and the guard ring 13. Guard ring voltage generation source 13D, substrate position control drive unit 21K for moving stage 21, mask position drive unit 31K for adjusting the position of mask 31, collimator voltage generation sources 32D and 33 substrates for generating a voltage to be applied to collimator 32 A substrate protection shutter drive unit 33K for driving the protection shutter is provided.

The control device 50 includes a control unit 51, and a peripheral device 52 such as a recording device 52A that records measurement results and operating states of the ESD device such as normal and abnormal states of each unit and a display device 52B that displays them.
The control unit 51 includes various control programs 53P, information 53J such as measurement results and operating status of the ESD device, data 53 for controlling each unit, control data 53D such as conditions, the facility unit 40 and the peripheral device 52. And an interface 54 for exchanging signals with various sensors, and a CPU 55 for managing them. Each control means includes a component of the facility part, its control program, control data, and a CPU 55 for controlling the control program. For example, the voltage application control means includes a spray voltage generation source 11D, a spray amount control program 11P described later, control data 53D necessary for spray amount control, and a CPU. The solution supply control means has a similar configuration.

  In the control program, the solution supply source 12T is controlled based on the measurement results from the liquid amount measurement sensor 14, the spray meter side sensor 15, and the imaging means 22, and the predetermined conditions incorporated in the control data 53D. A solution supply program 12P for managing the amount of solution in the nozzle unit 11; a spray amount control program 11P for controlling the spray voltage generation source 11D to spray the solution 12 from the nozzle unit 11; and a guard ring voltage generation source 13D for controlling the spray range. The prescribed spray range control program 13P, the substrate position control drive unit 21K, and the substrate position control program 21P for moving the display substrate P for positioning and film formation by the alignment mark 23, the mask position drive unit 31K, and the mask 31 Mask position adjustment program 31P for adjusting the position of the collimator, and collimator voltage generation source 32D A display board protection program 33P to prevent excessive spraying or dripping to control the controlled spray focused program to focus the spray 12d @ 32 P and the substrate protective shutter driver 33K display substrate P.

  With the configuration shown in FIG. 1, nozzle portions are provided in a row corresponding to the width of the display substrate, the display substrate P is moved from the front side to the back side of the paper surface, and the solution 12 is sprayed continuously or intermittently. A pattern defined by the plurality of openings 31a is formed on the display substrate.

FIG. 12 is a diagram showing the basic principle of ESD. When a voltage of several kV is applied to the liquid in the nozzle portion 11, an electrostatic force having surface tension or electric charge acts on the liquid. When the electrostatic force increases and exceeds the surface tension, the liquid is distorted into a conical shape (referred to as a Taylor cone) 12a. The liquid injection breaks due to the instability of the liquid column 12b of the positive charge (applied voltage is a negative voltage) generated from the tip of the Taylor cone, and a droplet 12c having a positive charge is generated therefrom. The solvent of the droplet evaporates and the electrification density increases, and the droplet repeats splitting due to electrostatic (Coulomb) repulsion. The dried particles are attracted to the grounded conductor 21a (stage 21 in FIG. 1) to form a thin film on the glass display substrate P provided on the conductor 21a. In the following description, the Taylor cone 12a, the liquid column 12b, and the liquid droplet 12c are collectively referred to as a spray liquid 12d. In this figure, a voltage is applied to the liquid, but the nozzle portion may be formed of a conductor and the voltage may be applied to the nozzle portion.
However, as described with reference to FIG. 13, if a plurality of nozzle portions are provided adjacent to each other as described with reference to FIG. 13, a sprayed liquid does not exist or a low density region 12 n is formed at the center of the display substrate P, and the film is formed on the display substrate. A region 12m that is difficult to be formed is formed, and uniform film formation cannot be performed.

FIG. 2 shows a first embodiment of the spray unit 10 that solves the above-described problems. 2A shows the configuration of the spray section when viewed from the paper surface side of FIG. 1, and FIG. 2B shows the arrangement of the nozzle section 11 when viewed from the top of the apparatus. As shown in FIG. 2 (a), the spray unit 10 arranges a plurality of nozzle units 11 in the row direction corresponding to the width W of the display substrate P (six in this embodiment). Are arranged in a plurality of rows (4 rows in this embodiment) in the row direction, and a total of 24 are arranged in a matrix. For the description to be described later, reference numerals A1, A2,... Are attached to the columnar arrangement in the row direction in order from the top.
FIG. 2A shows the state of the A1 column.

  In FIG. 2B, the white circle mark indicates the applied voltage V1, and the black circle mark indicates the nozzle portion 11 applied with the applied voltage V2. The solution 12 is supplied in the direction of the arrow 12k through a supply pipe 12h provided for each of the columns A1 to A4. Although the number of columns in the row direction is four in this embodiment, it may be one, or the number of columns may be further increased in some cases.

  The voltage application control means in this embodiment is means for always applying the applied voltage V1 and the applied voltage V2 to different polarities. That is, by applying voltages having different polarities between the adjacent nozzle portions 11, the spray liquid 12d sprayed from the respective adjacent nozzle portions has different polarities and does not cause electrostatic repulsion. Therefore, the spray liquid 12d having a constant profile can be stably obtained from each nozzle portion. 2 shows a state in which a negative voltage is applied to the applied voltage V1 and a positive voltage is applied to the applied voltage V2. The voltage application control means is composed of the control data described in FIG.

  As shown in FIGS. 2 (a) and 2 (b), the spray liquid has a profile in which the concentration in the vicinity of the center is deep and becomes thinner toward the periphery. However, with respect to the moving direction Pv of the display substrate P, a film having a uniform and uniform concentration is formed on the display substrate. In addition, with respect to a direction perpendicular to the moving direction (left and right direction on the paper surface), if a non-uniform portion occurs between the nozzle portions 11, the display substrate P is moved again in the opposite direction by shifting the nozzle portion interval by 1/2. By spraying, uniform spray solution can be applied to the entire substrate surface.

As a result, in the present embodiment, a uniform film having a pattern by the mask 31 (see FIG. 1) can be formed.
Further, it is possible to control the spraying range of each nozzle part by controlling the spraying range of each nozzle part from the guard ring applied voltages V3 and V4 applied to the guard ring 13 provided in each nozzle part. The applied voltage V3 and the applied voltage V4 are determined to wait for the same polarity as the applied voltage V1 and V2.
Furthermore, in the above-described embodiment, an example of four columns A1 to A4 is shown. As the number of columns increases, the moving speed of the display substrate can be increased, but only one column of A1 may be used.

Next, examples of the voltages V1 and V2 applied to the solution for forming a uniform film will be described with reference to FIGS. These waveform data are stored as control data 53D shown in data FIG. 1, and are formed when an operator inputs conditions via the display device 52B or the like according to the processing contents.
FIG. 3 is a diagram showing a first embodiment using a DC voltage having a constant peak value as the applied voltages V1 and V2. FIG. 3A shows an example in which the applied voltages V1 and V2 have a pulsed DC voltage V having different polarities. FIG. 3B shows an example in which the applied voltages V1 and V2 have continuous DC voltages V having different polarities.

  FIG. 4 is a diagram showing a second embodiment in which AC voltages having constant peak values that are 180 degrees out of phase with each other are used as the applied voltages V1 and V2. 4A shows an example where the applied voltages V1 and V2 are rectangular wave voltages V having a constant peak value, and FIG. 4B is a sinusoidal voltage where the applied voltages V1 and V2 are constant peak values. Here is an example. In addition, when an AC voltage is used, not only can electrostatic repulsion be prevented, but spray liquids having different polarities are alternately deposited so that they are deposited while neutralizing without repelling each other, so that a thick film can be formed. The AC frequency is preferably a low frequency. Above several hundred Hz, there is a tendency to lose self-neutralization and adhesion. Preferably, it is 60 Hz or less.

  FIG. 5 is a diagram showing a third example of the applied voltage when the applied voltage V1, V2 is applied to the solution 12 and the amount of charge generated in the solution is large. In this case, an interval is provided to suppress recombination in FIG. 3A of the first embodiment and the second embodiment. FIG. 5 shows the applied voltage V1 of FIG. 4A of the second embodiment.

  FIG. 6 is a diagram showing a fourth embodiment of the applied voltage when the applied voltages V1 and V2 are applied to the solution 12 and the ratio of the generated charge amount varies depending on the degree of ionization according to the polarity of the solution. In this case, a DC bias is applied in the second and third embodiments. FIG. 6 shows the applied voltage V1 of the third embodiment.

  FIG. 7 is a diagram showing a fifth example of the applied voltage when the applied voltages V1 and V2 are applied to the solution 12 and the amount of charge generated in the solution differs depending on the polarity. In this case, the peak value is changed according to the polarity in the first embodiment. In the second and third embodiments, the ratio of the application time is changed. FIG. 7 shows the applied voltage V1 of the third embodiment.

  As shown in FIGS. 5 to 7, it is desirable to apply the voltage so that the total charge amount of the spray liquid generated in a predetermined time in the plurality of nozzle portions is equal to positive and negative. 3 and 4 and other application methods described later are basically the same. As a result, one charge is not accumulated on the display substrate and there is no bias, so that stable film formation can be achieved.

  Next, a second embodiment of the spray unit 10 is shown in FIG. Since the second embodiment is the same as the first embodiment in the basic configuration, FIG. 8 is only a diagram corresponding to FIG. 2B shown in the first embodiment, which is necessary for explaining the different points. Show. A first point different from the first embodiment is that a plurality of solutions are required for film formation. In this embodiment, two types of necessary solutions are shown. For this purpose, the solution 12A and the solution 12B are supplied every other row, that is, the solution 12A is supplied to the A1 row and the A3 row, and the solution 12B is supplied to the A2 row and the A4 row. A plurality of solutions required for film formation can be sprayed separately without mixing to form a film from a plurality of solutions, so-called bulk heterojunction.

  When forming the bulk heterojunction, the phases between the applied voltages V1 and V2 to the solution 12A and the solution 12B are shifted by 90 degrees as shown in FIG. As a result, the spray amount peaks of different solutions can be shifted and sprayed, and film formation with a uniform film thickness can be achieved. However, electrostatic repulsion may occur because the same polarity state occurs between the nozzle portions 11 between adjacent rows. If the electrostatic repulsion affects the uniformity of film formation, measures such as slightly changing the distance between the columns are necessary.

A second point different from the first embodiment is that a pair (hereinafter simply referred to as a bulk pair) that forms a bulk hetero-junction (row A3, row A4) with respect to the bulk pair (row A1, row A2). In other words, the nozzles are arranged in the lateral direction (perpendicular to the moving direction of the display substrate P) with a shift of ½ the nozzle portion interval. As a result, it is possible to uniformly form the film on the entire display substrate without moving the display substrate P in the opposite direction as in the first embodiment. In this case, as in the first different point, electrostatic repulsion may occur because the same polarity state occurs between adjacent nozzle portions 11 in the A2 row and A3 row between the bulk pairs. If it affects the uniformity of the electrostatic repulsion deposition, measures such as changing the distance between the bulk pairs are required.
The applied voltages V1 and V2 described in the first embodiment can also be applied to the second embodiment. Moreover, since two types of solutions are used in the second embodiment, only two rows A1 and A2 may be used as in the first embodiment.

  In the second embodiment described above, even when a plurality of different solutions are required for film formation, the film can be formed in a large area, and a film having a uniform pattern is also formed using the mask 31. it can.

  Next, a third embodiment of the spray unit 10 is shown in FIG. In the first and second embodiments, examples of the two-phase AC applied voltages V1 and V2 are shown as voltages applied to the solution. In the third embodiment, an example using the three-phase AC applied voltages V1, V2, and V3 is shown. Indicates. FIG. 10A shows the configuration of the spraying section 10 in the A1 row, which will be described later, when viewed from the surface side of the paper in FIG. 1, and FIG. 10B shows the arrangement of the nozzle section 11 when viewed from the top of the apparatus. Show. The method for assigning the reference numerals of the columns in the nozzle arrangement is the same as in FIG. The numbers next to the circles indicating the nozzle portion 11 indicate the phase relationship of the applied voltage to each nozzle portion when the phase of the applied voltage V2 in FIG. That is, in FIG. 10B, the applied voltage V1 whose phase is advanced by 2 / 3π phase with respect to V2 is applied to the nozzle portion 11 indicated by white circles with reference to the phase of the applied voltage V2 of the nozzle portion 11 indicated by black circles. The nozzle portion 11 indicated by a double circle shows a state where an applied voltage V3 having a 2 / 3π phase delay with respect to V2 is applied.

FIG. 14 shows an example in which applied voltages V1, V2, and V3 of a three-phase alternating current sine wave having a phase shift of 2 / 3π are applied between adjacent nozzle portions 10 as shown in FIG. On the other hand, FIG. 15 shows an example in which applied voltages V1, V2, and V3 of a three-phase alternating current rectangular wave having a phase shift of 1 / 3π are mutually applied between adjacent nozzle portions. Further, in order to avoid electrostatic repulsion, FIG. 15A is an example in which application is performed such that spraying is not performed simultaneously between adjacent nozzles, and FIG. 15B always has reverse polarity between adjacent nozzle portions. In this example, the waveform of V2 is obtained by inverting ± of the waveform of V2 in FIG. FIG. 15B shows an example in which charge balance is prioritized so that the charge-up caused by the formed charged particles can be canceled by the next spray, and the potential of the substrate to be sprayed becomes zero. In FIGS. 14 and 15, if a four-phase alternating current is used, the adjacent nozzle portions are shifted from each other by 1 / 4π in the rectangular wave and 1 / 2π in the sine wave. Further, in the case of n-phase alternating current, the adjacent nozzle portions are shifted in phase by 1 / nπ with a rectangular wave and 2 / nπ with a sine wave.
In this way, by arranging the adjacent nozzle portions 11 so as to have a phase shift, the influence of electrostatic repulsion is reduced and the film can be uniformly formed.

  In addition, each row is arranged so that the nozzle portion interval is shifted by ½ in the horizontal direction on the paper surface, and among the two types of solutions 12A and 12B, the solution 12A is supplied to the A1 row and the A4 row, and the solution 12B is supplied to the A2 row and A3. Then, the bulk pairs (A1 row, A4 row), (A2 row, A3 row) are formed, and the regions that are shifted from each other by 1/2 of the nozzle portion interval are in charge. As a result, a film can be uniformly formed on the entire display substrate. Of course, as in the second embodiment, (A1 row, A2 row) (A3 row, A4 row) form bulk pairs, respectively, and the arrangement is shifted by 1/2 of the nozzle portion interval in the horizontal direction of the paper in units of bulk pairs. Also good.

  FIG. 16 shows another method of nozzle arrangement according to the third embodiment. In FIG. 16, white circles indicate the nozzle portion 11. FIG. 16A basically shows the arrangement shown in FIG. 10B although the number of nozzle portions is different. On the other hand, in FIG. 16B, in order to avoid the influence of electrostatic repulsion, the nozzle portions are separated from each other and arranged in one step with respect to the rows and columns.

  In addition, the waveform of the applied voltage of the third embodiment can be the one shown in FIG. 4A and FIG. 5 to FIG. 7 shown in the first embodiment.

  In the third embodiment, the same effects as those of the first or second embodiment can be obtained.

  Finally, FIG. 10 shows a fourth embodiment of the spray unit 10 in FIG. In the first embodiment, the polarity is inverted every other nozzle portion 11, but in the fourth embodiment, the polarity is inverted every two or every two rows. Electrostatic repulsion is more likely to occur as the distance between the nozzles is shorter and the applied voltage is higher. However, if the uniformity of film formation is long enough to be within the allowable range or the applied voltage can be set low, It is also possible to arrange them as follows. In the fourth embodiment, the same effects as in any of the first to third embodiments can be obtained as long as the above-described conditions are satisfied.

  The present invention can be applied to manufacturing apparatuses such as organic thin film solar cells, organic EL lighting, digital signage, and organic sensors in addition to display apparatus manufacturing apparatuses.

DESCRIPTION OF SYMBOLS 10: Spray part 11: Nozzle part 11D: Spray voltage generation part 12: Solution 12a: Taylor cone 12b: Liquid column 12c: Droplet 12d: Spray liquid 12h: Supply piping 12T: Solution supply part 13: Guard ring 13D: Guard ring Voltage generation unit 14: Liquid amount sensor 15: Spray amount sensor 20: Stage unit 21: Stage 21K: Substrate position control drive unit 22: Alignment mark imaging means 23: Alignment mark 30: Mask unit 31: Mask 31a: Mask opening 31K: Mask position drive unit 32: Collimator 32D: Collimator voltage generation unit 33: Substrate protection shutter 33K: Substrate protection shutter drive unit 40: Facility unit 50: Control device 51: Control unit 52: Peripheral device 52A: Recording device 52B: Display Device 53: Memory 53D: Data for controlling each part , Condition control data 53P: control program
53J: Information such as the measurement result and the operating state of the ESD device 54: Interface 55: CPU
60: Pedestal 100: ESD device A1, A2,...: Nozzle column number P: Display substrate V1, V2, V3: Applied voltage to solution V4, V5, V6: Guard ring applied voltage.

Claims (19)

In an ESD device having a spray unit that applies a voltage to a solution in which a material is dissolved and sprays a spray liquid having a charge generated by the application toward a processing target, and a mounting unit on which the processing target is mounted.
The spray unit includes a plurality of nozzle units having the solution and having spray ports, and voltage application control means for applying the voltage so as to suppress electrostatic repulsion between spray liquids sprayed from the plurality of nozzle units. An ESD device characterized by comprising:   2. The ESD device according to claim 1, wherein the voltage application control unit applies the voltage so that a total charge amount of the spray liquid generated in a predetermined time in the plurality of nozzle portions becomes equal to positive and negative.   The ESD apparatus according to claim 1, wherein the voltage application control unit applies voltages having different polarities between adjacent nozzle portions.   3. The ESD device according to claim 1, wherein the voltage application control unit applies a voltage having a polarity different from that of the other nozzle units to at least one of the plurality of nozzle units.   The ESD apparatus according to claim 1, wherein the voltage application control unit applies an alternating voltage having a phase shift between adjacent nozzle portions.   5. The ESD device according to claim 1, wherein the voltage application control unit applies an alternating voltage having a phase shift between at least one pair of adjacent nozzle portions.   7. The ESD apparatus according to claim 1, wherein the plurality of nozzle portions are arranged in a matrix of M rows and N columns (M and N are integers of 1 or more).   The ESD device according to claim 7, wherein the nozzle portions between adjacent rows or columns (N and M are 2 or more) are shifted from each other by a half of the nozzle portion interval.   The ESD apparatus according to claim 1, further comprising a solution supply control unit that supplies the solution to the plurality of nozzle portions.   The ESD apparatus according to claim 9, wherein the solution supply control unit supplies a plurality of types of solutions.   The ESD device according to claim 1, wherein the application time is changed according to the polarity of the solution generated by the application of the voltage. An ESD method comprising applying a voltage to a solution in which a material is dissolved, spraying a spray liquid having a charge generated by the application toward a processing target, and performing the application with a mounting portion on which the processing target is mounted. In
The spraying is performed by a plurality of nozzle portions having the solution and having spray ports, and the application is controlled so as to suppress electrostatic repulsion between spray liquids sprayed from adjacent nozzle portions. ESD method.   13. The ESD method according to claim 12, wherein the control applies the voltage so that the total charge amount of the spray generated in the plurality of nozzle portions at a predetermined time is equal to positive and negative.   The ESD method according to claim 12 or 13, wherein the suppression applies the voltages having different polarities between the adjacent nozzle portions.   The ESD method according to claim 12 or 14, wherein the suppression applies an alternating voltage having a phase shift between adjacent nozzle portions.   13. The ESD method according to claim 12, wherein the plurality of nozzle portions are arranged in a matrix of M rows and N columns (M and N are integers of 1 or more).   17. The ESD method according to claim 16, wherein the nozzle portions between adjacent rows or columns (N and M are 2 or more) are shifted from each other by a half of the nozzle portion interval.   The ESD method according to claim 12, wherein the solution is supplied to each of the plurality of nozzle portions.   The ESD method according to claim 18, wherein the supply supplies a plurality of types of solutions.

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