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JP2011148264A - Method for manufacturing resin molded article - Google Patents

Method for manufacturing resin molded article Download PDF

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Publication number
JP2011148264A
JP2011148264A JP2010013310A JP2010013310A JP2011148264A JP 2011148264 A JP2011148264 A JP 2011148264A JP 2010013310 A JP2010013310 A JP 2010013310A JP 2010013310 A JP2010013310 A JP 2010013310A JP 2011148264 A JP2011148264 A JP 2011148264A
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mold
resin
photocurable resin
base material
sheet
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Takeshi Nishimura
剛 西村
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Nissha Printing Co Ltd
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Nissha Printing Co Ltd
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  • Casting Or Compression Moulding Of Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for manufacturing a resin molded article capable of obtaining the resin molded article while properly processing an overflowing excessive photocurable resin. <P>SOLUTION: The distances between an exposed face 36 of a translucent resin part and a decorative sheet 21 have original values in each of individual sites in the resin molded article, and the method for manufacturing the resin molded article includes the step for obtaining a base material 23 having an overhanging part 24 of the decorative sheet 21 in at least a part of a peripheral part 31, the resin mounting step for mounting a photocurable resin on the base material 23, the mold mounting step for mounting the mold 43 from above the base material 23, for filling a gap 44 with the photocurable resin, and for holding the overflowing excessive photocurable resin by the overhanging part 24, and a photocuring step for irradiating the photocurable resin with light. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、透光性樹脂部の背面に該透光性樹脂部を通して模様を視認可能な加飾部を設けた樹脂成形品の製造方法に関する。   The present invention relates to a method for manufacturing a resin molded product in which a decorative portion that allows a pattern to be visually recognized through the light transmissive resin portion is provided on the back surface of the light transmissive resin portion.

奥行きのある視覚効果を得るために、透光性樹脂部の背面に段差やシボ等の凹部を形成し、その透光性樹脂部の背面に該透光性樹脂部を通して模様を視認可能な加飾フィルムや加飾シート等の加飾部を接着した樹脂成形品が知られている。   In order to obtain a deep visual effect, a concave portion such as a step or a wrinkle is formed on the back surface of the translucent resin portion, and the pattern can be visually recognized through the translucent resin portion on the back surface of the translucent resin portion. A resin molded product in which a decorative portion such as a decorative film or a decorative sheet is bonded is known.

しかし、樹脂成形品の背面に凹部が形成されていると、例えば当該樹脂成形品を他の部材に両面テープで張り合わせる等の際に、樹脂成形品と両面テープとが十分な接着状態が得られない。また、樹脂成形品と他の部材との間に隙間が生じて、防水性や機械的強度の低下を招く。   However, if a concave portion is formed on the back surface of the resin molded product, for example, when the resin molded product is bonded to another member with a double-sided tape, a sufficient adhesion state between the resin molded product and the double-sided tape is obtained. I can't. In addition, a gap is generated between the resin molded product and the other member, which causes a decrease in waterproofness and mechanical strength.

このため、樹脂成形品が他の部材に対して十分に面接触し、樹脂成形品と他の部材との間の隙間を無くすようにするためには、例えば、樹脂成形品の背面の凹部に樹脂を注入して、樹脂成形品の背面を平面に形成することが考えられる。   For this reason, in order to make the resin molded product have sufficient surface contact with other members and eliminate the gap between the resin molded product and the other members, for example, in the concave portion on the back surface of the resin molded product. It is conceivable to inject a resin and form the back surface of the resin molded product in a flat surface.

部材の凹部に樹脂を注入して平面に形成する方法については、従来より種々提案されている。例えば、特許文献1には、配置用金型の上に配置された部材としての樹脂フィルムの凹部に光硬化性樹脂を注入し、樹脂フィルムの凹部および光硬化性樹脂の上から透光性材料で構成した平面型を載置し、樹脂フィルムの凹部と平面型との間に光硬化性樹脂を充填しつつ余剰の光硬化性樹脂を溢出させ、平面型を介して光を光硬化性樹脂に照射して硬化させることで、光硬化性樹脂部の上面を平面に形成することが開示されている。   Various methods have been proposed in the past for forming a flat surface by injecting a resin into a concave portion of a member. For example, in Patent Document 1, a photocurable resin is injected into a concave portion of a resin film as a member arranged on a placement mold, and a translucent material is formed from above the concave portion of the resin film and the photocurable resin. Place a flat mold composed of the above, fill the photocurable resin between the concave portion of the resin film and the flat mold, overflow the excess photocurable resin, and light is transmitted through the flat mold It is disclosed that the upper surface of the photocurable resin portion is formed into a flat surface by being irradiated and cured.

ここで、特許文献1に開示された技術を、上述した樹脂成形品に適用することにより、樹脂成形品の背面の凹部に樹脂を注入して、樹脂成形品の背面を平面に形成することが考えられる。   Here, by applying the technique disclosed in Patent Document 1 to the above-described resin molded product, it is possible to inject resin into the concave portion on the back surface of the resin molded product and form the back surface of the resin molded product in a flat surface. Conceivable.

特開2008−246874号公報JP 2008-246874 A

しかし、上記構成では、溢出した余剰の光硬化性樹脂が、樹脂成形品の周縁部から背面側に流れて、樹脂成形品の支持台に付着したり、樹脂成形品の外観を損なうことがあった。   However, in the above configuration, the excess photo-curing resin that overflows may flow from the peripheral edge of the resin molded product to the back side, adhere to the support of the resin molded product, or impair the appearance of the resin molded product. It was.

本発明の目的は、溢出した余剰の光硬化性樹脂を適切に処理しつつ樹脂成形品を得ることができる樹脂成形品の製造方法を提供する点にある。   The objective of this invention is providing the manufacturing method of the resin molded product which can obtain a resin molded product, processing appropriately the excess photocurable resin which overflowed.

本発明の樹脂成形品の製造方法の第1特徴手段は、第1型と第2型とで加飾シートを挟持しつつ、前記加飾シートと前記第1型との間に形成したキャビティに透光性樹脂を注入したのち硬化させることで、透光性樹脂部の露出面と前記加飾シートとの距離が個々の部位毎に所期の値を有し、周縁部のうち少なくとも一部に前記加飾シートの張出部を備えた基材を得る基材形成工程;前記基材の加飾シートの露出面に光硬化性樹脂を載置する樹脂載置工程;前記基材および前記光硬化性樹脂の上から透光性材料で構成した型を載置し、当該型と前記基材との当接により形成された隙間に前記光硬化性樹脂を充填すると共に、前記型の周囲に溢出した余剰の前記光硬化性樹脂を前記張出部によって保持する型載置工程;前記型または前記透光性樹脂部の何れか一方を介して、光を前記光硬化性樹脂に照射する光硬化工程;を有する点にある。   The first characteristic means of the method for producing a resin molded product of the present invention is that a cavity formed between the decorative sheet and the first mold is sandwiched between the first mold and the second mold. By injecting the translucent resin and then curing, the distance between the exposed surface of the translucent resin portion and the decorative sheet has an expected value for each part, and at least a part of the peripheral portion The base material formation process which obtains the base material provided with the overhang | projection part of the said decorating sheet; The resin mounting process which mounts photocurable resin on the exposed surface of the decorating sheet of the said base material; The said base material and the said A mold composed of a translucent material is placed on the photocurable resin, the gap formed by the contact between the mold and the base material is filled with the photocurable resin, and the periphery of the mold A mold placing step of holding the excess photocurable resin overflowing in the projecting portion; the mold or the translucent tree In that it has a; through one of the parts, the light photocuring step for irradiating the photocurable resin.

基材の加飾シートの露出面に光硬化性樹脂を載置し、基材および光硬化性樹脂の上から型を載置する。このとき、載置された光硬化性樹脂は、型と基材との当接により形成された隙間に充填される。当該隙間から基材の周縁部に溢出した余剰の光硬化性樹脂は、基材の周縁部のうち少なくとも一部に備えられた張出部によって保持される。これにより、溢出した余剰の光硬化性樹脂が、基材の周縁部から下方に流れることを阻止できる。よって、本方法を用いることで、溢出した余剰の光硬化性樹脂が、基材の支持台に付着したり、基材の正面に回り込んで付着することを防止でき、健全な外観を有する樹脂成形品を効率よく得ることができる。   A photocurable resin is placed on the exposed surface of the decorative sheet of the substrate, and a mold is placed on the substrate and the photocurable resin. At this time, the placed photocurable resin is filled in a gap formed by the contact between the mold and the substrate. Excess photocurable resin overflowing from the gap to the peripheral edge of the substrate is held by an overhang provided at least in part of the peripheral edge of the substrate. Thereby, it can prevent that the excess photocurable resin which overflowed flows down from the peripheral part of a base material. Therefore, by using this method, the excess photo-curing resin overflowing can be prevented from adhering to the support base of the base material or wrapping around the front surface of the base material, and has a sound appearance. A molded product can be obtained efficiently.

本発明の第2特徴手段は、前記型の表面のうち前記基材に対向する面を平面に形成する点にある。   The 2nd characteristic means of this invention exists in the point which forms the surface facing the said base material in the plane among the surfaces of the said type | mold.

基材の加飾シートの露出面に光硬化性樹脂を載置し、基材および光硬化性樹脂の上から基材に対向する面を平面に形成した型を載置する。このとき、型の表面のうち基材に対向する面によって光硬化性樹脂の上面が平面に均される。型または透光性樹脂部の何れか一方を介して光を光硬化性樹脂に照射して硬化させる。このため、光硬化性樹脂部の上面、すなわち、樹脂成形品の背面を平面に形成することができる。   A photocurable resin is placed on the exposed surface of the decorating sheet of the base material, and a mold having a flat surface facing the base material is placed on the base material and the photocurable resin. At this time, the upper surface of the photocurable resin is leveled to a flat surface by the surface of the mold that faces the substrate. The photocurable resin is irradiated with light through either the mold or the translucent resin portion to be cured. For this reason, the upper surface of a photocurable resin part, ie, the back surface of a resin molded product, can be formed in a plane.

これにより、樹脂成形品を他の部材に接続する際に、樹脂成形品と他の部材とが十分に面接触する。このため、例えば樹脂成形品を他の部材に両面テープで張り合わせる作業が容易になる。また、樹脂成形品と他の部材との間の隙間を無くすことができ、防水性や機械的強度を維持することができる。   Thereby, when connecting the resin molded product to another member, the resin molded product and the other member are sufficiently in surface contact. For this reason, the operation | work which bonds a resin molded product to another member with a double-sided tape becomes easy, for example. Moreover, the clearance gap between a resin molded product and another member can be eliminated, and waterproofness and mechanical strength can be maintained.

本発明の第3特徴手段は、前記型載置工程において、前記型の表面のうち前記基材に対向する面に、前記光硬化性樹脂が付着しない剥離シートを設ける点にある。   The 3rd characteristic means of this invention exists in the point which provides the peeling sheet | seat which the said photocurable resin does not adhere to the surface which opposes the said base material among the surfaces of the said mold in the said mold mounting process.

基材の加飾シートの露出面に光硬化性樹脂を載置し、基材および光硬化性樹脂の上から基材に対向する面に剥離シートを設けた型を載置する。このとき、光硬化性樹脂と型との間に剥離シートが介在しているので、光硬化性樹脂が型に付着することは無い。よって、光硬化性樹脂部から型を取り外し易く、型を清掃する等の手間を省くことができる。   A photocurable resin is placed on the exposed surface of the decorative sheet of the substrate, and a mold provided with a release sheet is placed on the surface of the substrate and the photocurable resin facing the substrate. At this time, since the release sheet is interposed between the photocurable resin and the mold, the photocurable resin does not adhere to the mold. Therefore, it is easy to remove the mold from the photocurable resin portion, and the trouble of cleaning the mold can be saved.

しかも、型の表面のうち基材に対向する面に剥離シートを設けることによって、溢出した余剰の光硬化性樹脂の広がりを制御できる。
つまり、剥離シートがない場合には、余剰の光硬化性樹脂は、型と基材との間を通って基材の周縁部に溢出する。このとき、光硬化性樹脂が型の表面のうち基材に対向する面だけでなく側面まで付着することがある。このため、光硬化性樹脂が型の表面のうち基材に対向する面とは反対側の面に回り込まないようにするために、型の厚みを厚くする必要がある。
In addition, by providing a release sheet on the surface of the mold that faces the substrate, it is possible to control the spread of the excess photocurable resin that has overflowed.
That is, when there is no release sheet, surplus photocurable resin passes between the mold and the base material and overflows to the peripheral edge of the base material. At this time, the photocurable resin may adhere not only to the surface of the mold facing the substrate but also to the side surface. For this reason, it is necessary to increase the thickness of the mold in order to prevent the photo-curing resin from wrapping around the surface of the mold opposite to the surface facing the substrate.

これに対し、剥離シートがある場合には、余剰の光硬化性樹脂は、剥離シートと基材との間を通って基材の周縁部に溢出する。このとき、光硬化性樹脂が型に付着しないので、光硬化性樹脂が型の表面のうち側面から基材に対向する面とは反対側の面まで回り込むことは無い。よって、型の厚みを薄くできる。   On the other hand, when there is a release sheet, surplus photocurable resin passes between the release sheet and the base material and overflows to the peripheral edge of the base material. At this time, since the photocurable resin does not adhere to the mold, the photocurable resin does not wrap around from the side surface to the surface opposite to the surface facing the substrate. Therefore, the thickness of the mold can be reduced.

本発明の樹脂成形品の製造方法の第4特徴手段は、第1型と第2型とで加飾シートを挟持しつつ、前記加飾シートと前記第1型との間に形成したキャビティに透光性樹脂を注入したのち硬化させることで、透光性樹脂部の露出面と前記加飾シートとの距離が個々の部位毎に所期の値を有し、周縁部のうち少なくとも一部に前記加飾シートの張出部を備えた基材を得る基材形成工程;前記基材の加飾シートの露出面に遅延型光硬化性樹脂を載置する樹脂載置工程;光を前記遅延型光硬化性樹脂に照射する光硬化工程;前記基材および前記遅延型光硬化性樹脂の上方に型を配置して該型と前記基材の加飾シートの露出面とを対向させ、前記型の表面のうち前記基材に対向する面に図柄層を含む転写シートを配置する転写シート配置工程;前記基材および前記遅延型光硬化性樹脂の上から前記型を載置し、前記転写シートと前記基材との間に形成された隙間に前記遅延型光硬化性樹脂を充填すると共に、前記型の周囲に溢出した余剰の前記遅延型光硬化性樹脂を前記張出部によって保持する型載置工程;前記基材および遅延型光硬化性樹脂部から前記型を取り外すと共に、前記転写シートから前記図柄層が剥離して、当該図柄層が前記基材および前記遅延型光硬化性樹脂部の少なくともいずれか一方の上面に転写される転写工程;を有する点にある。   The 4th characteristic means of the manufacturing method of the resin molded product of this invention is the cavity formed between the said decorating sheet and the said 1st type | mold, clamping the decorating sheet with the 1st type | mold and the 2nd type | mold. By injecting the translucent resin and then curing, the distance between the exposed surface of the translucent resin portion and the decorative sheet has an expected value for each part, and at least a part of the peripheral portion A base material forming step of obtaining a base material provided with a protruding portion of the decorative sheet; a resin placing step of placing a delayed photocurable resin on the exposed surface of the decorative sheet of the base material; A photocuring step of irradiating the delayed photocurable resin; a mold is disposed above the substrate and the delayed photocurable resin, and the mold and the exposed surface of the decorative sheet of the substrate are opposed to each other; A transfer sheet disposing step of disposing a transfer sheet including a design layer on a surface of the mold facing the substrate; The mold is placed from above the delay type photocurable resin, the gap formed between the transfer sheet and the base material is filled with the delay type photocurable resin, and the periphery of the mold A mold mounting step for holding the excess of the delayed photocurable resin overflowing in the projecting portion; removing the mold from the base material and the delayed photocurable resin portion, and removing the mold from the transfer sheet Is peeled off, and the pattern layer is transferred to the upper surface of at least one of the base material and the delayed photocurable resin portion.

基材の加飾シートの露出面に遅延型光硬化性樹脂を載置し、光を遅延型光硬化性樹脂に照射し、基材および遅延型光硬化性樹脂の上から基材に対向する面に図柄層を含む転写シートを設けた型を載置し、転写シートと基材との間に形成された隙間に遅延型光硬化性樹脂を充填する。このとき、転写シートと基材との間に形成された隙間には、予め光を照射した遅延型光硬化性樹脂が充填されているので、転写シートおよび型を介して光を遅延型光硬化性樹脂に照射する必要はない。よって、透光性を有さない転写シートおよび型であっても使用できる。   The delayed photocurable resin is placed on the exposed surface of the decorative sheet of the substrate, light is irradiated to the delayed photocurable resin, and the substrate is opposed to the substrate from above the delayed photocurable resin. A mold provided with a transfer sheet including a pattern layer on the surface is placed, and a delay type photocurable resin is filled in a gap formed between the transfer sheet and the substrate. At this time, the gap formed between the transfer sheet and the base material is filled with a delay type photocurable resin that has been irradiated with light in advance, so that the light is delayed through the transfer sheet and the mold. It is not necessary to irradiate the functional resin. Therefore, even transfer sheets and molds that do not have translucency can be used.

また、遅延型光硬化性樹脂と型との間に転写シートが介在しているので、遅延型光硬化性樹脂が型に付着することは無い。よって、基材および遅延型光硬化性樹脂部から型を取り外し易く、型を清掃する等の手間を省くことができる。しかも、転写シートから図柄層が剥離して、当該図柄層が基材および遅延型光硬化性樹脂部の上面に転写されるので、基材および遅延型光硬化性樹脂部の上面に図柄層を転写して所定の加飾を付与することができる。   Further, since the transfer sheet is interposed between the delay type photocurable resin and the mold, the delay type photocurable resin does not adhere to the mold. Therefore, it is easy to remove the mold from the base material and the delay type photocurable resin portion, and the trouble of cleaning the mold can be saved. Moreover, since the design layer is peeled off from the transfer sheet and the design layer is transferred to the upper surface of the base material and the delay type photocurable resin portion, the design layer is placed on the upper surface of the base material and the delay type photocurable resin portion. It can be transferred to give a predetermined decoration.

さらに、型の表面のうち基材に対向する面に転写シートを設けることによって、溢出した余剰の遅延型光硬化性樹脂の広がりを制御できる。
つまり、転写シートがない場合には、余剰の遅延型光硬化性樹脂は、型と基材との間を通って基材の周縁部に溢出する。このとき、遅延型光硬化性樹脂が型の表面のうち基材に対向する面だけでなく側面まで付着することがある。このため、遅延型光硬化性樹脂が型の表面のうち基材に対向する面とは反対側の面に回り込まないようにするために、型の厚みを厚くする必要がある。
これに対し、転写シートがある場合には、余剰の遅延型光硬化性樹脂は、転写シートと基材との間を通って基材の周縁部に溢出する。このとき、遅延型光硬化性樹脂が型に付着しないので、遅延型光硬化性樹脂が型の表面のうち側面から基材に対向する面とは反対側の面まで回り込むことは無い。よって、型の厚みを薄くできる。
Furthermore, by providing a transfer sheet on the surface of the mold that faces the substrate, it is possible to control the spread of the excess delayed photocurable resin that has overflowed.
That is, when there is no transfer sheet, surplus delayed type photocurable resin overflows between the mold and the base material and overflows to the periphery of the base material. At this time, the delayed photocurable resin may adhere not only to the surface facing the substrate but also to the side surface of the mold surface. For this reason, it is necessary to increase the thickness of the mold in order to prevent the delayed photocurable resin from wrapping around the surface of the mold opposite to the surface facing the substrate.
On the other hand, when there is a transfer sheet, the excessive delay type photocurable resin overflows between the transfer sheet and the base material and overflows to the peripheral edge of the base material. At this time, since the delayed photocurable resin does not adhere to the mold, the delayed photocurable resin does not wrap around from the side surface to the surface opposite to the surface facing the substrate. Therefore, the thickness of the mold can be reduced.

型締めによって第1型と第2型との間に加飾シートを挟持する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which clamps a decorating sheet between 1st type | mold and 2nd type | mold by mold clamping. 第1型と第2型とが互いに当接して形成されたキャビティに透光性樹脂を充填して、周縁部に加飾シートの張出部を備えた基材が形成されたた状態を示す縦断面図である。A state in which a substrate formed with a translucent resin in a peripheral portion and a protruding portion of a decorative sheet formed on a peripheral portion is shown by filling a cavity formed by contacting the first mold and the second mold with each other. It is a longitudinal cross-sectional view. 型開きによって第1型と第2型との間から基材を取り出す状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which takes out a base material from between a 1st type | mold and a 2nd type | mold by mold opening. 第1実施形態における、基材の加飾シートの露出面に光硬化性樹脂を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts photocurable resin in the exposed surface of the decorating sheet of a base material in 1st Embodiment. 第1実施形態における、基材および光硬化性樹脂の上から透光性材料で構成した型を載置し、型と基材との当接により形成された隙間に光硬化性樹脂を充填すると共に、型の周囲に溢出した余剰の光硬化性樹脂を張出部によって保持する状態を示す縦断面図である。In the first embodiment, a mold made of a translucent material is placed on the base material and the photocurable resin, and the gap formed by the contact between the mold and the base material is filled with the photocurable resin. It is a longitudinal cross-sectional view which shows the state which hold | maintains the excess photocurable resin which overflowed around the mold | type by the overhang | projection part. 第1実施形態における、基材および光硬化性樹脂部から型を取り外す状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which removes a type | mold from a base material and a photocurable resin part in 1st Embodiment. 周縁部に加飾シートの張出部を備えた基材を示す斜視図である。It is a perspective view which shows the base material provided with the overhang | projection part of the decorating sheet in the peripheral part. 第1実施形態における、加飾シートの縦断面図である。It is a longitudinal cross-sectional view of the decorating sheet in 1st Embodiment. 第2実施形態における、基材の加飾シートの露出面に光硬化性樹脂を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts photocurable resin in the exposed surface of the decorating sheet of a base material in 2nd Embodiment. 第2実施形態における、基材および光硬化性樹脂の上から透光性材料で構成した型を載置し、型と基材との当接により形成された隙間に光硬化性樹脂を充填すると共に、型の周囲に溢出した余剰の光硬化性樹脂を張出部によって保持する状態を示す縦断面図である。In the second embodiment, a mold made of a translucent material is placed on the substrate and the photocurable resin, and the photocurable resin is filled in the gap formed by the contact between the mold and the substrate. It is a longitudinal cross-sectional view which shows the state which hold | maintains the excess photocurable resin which overflowed around the mold | type by the overhang | projection part. 第2実施形態における、基材および光硬化性樹脂部から型を取り外す状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which removes a type | mold from a base material and a photocurable resin part in 2nd Embodiment. 第3実施形態における、基材の加飾シートの露出面に光硬化性樹脂を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts photocurable resin in the exposed surface of the decorating sheet of a base material in 3rd Embodiment. 第3実施形態における、基材および光硬化性樹脂の上から透光性材料で構成した型を載置し、型と基材との当接により形成された隙間に光硬化性樹脂を充填すると共に、型の周囲に溢出した余剰の光硬化性樹脂を張出部によって保持する状態を示す縦断面図である。In the third embodiment, a mold composed of a translucent material is placed on the base material and the photocurable resin, and the gap formed by the contact between the mold and the base material is filled with the photocurable resin. It is a longitudinal cross-sectional view which shows the state which hold | maintains the excess photocurable resin which overflowed around the mold | type by the overhang | projection part. 第3実施形態における、基材および光硬化性樹脂部から型を取り外す状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which removes a type | mold from a base material and a photocurable resin part in 3rd Embodiment. 第4実施形態における、図柄層を含む転写シートの縦断面図である。It is a longitudinal cross-sectional view of the transfer sheet containing a pattern layer in 4th Embodiment. 第4実施形態における、基材の加飾シートの露出面に光硬化性樹脂を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts photocurable resin in the exposed surface of the decorating sheet of a base material in 4th Embodiment. 第4実施形態における、型の表面のうち基材に対向する面に転写シートを配置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which arrange | positions a transfer sheet in the surface which opposes a base material among the surfaces of the type | mold in 4th Embodiment. 第4実施形態における、基材および遅延型光硬化性樹脂の上から透光性材料で構成した型を載置し、型と基材との当接により形成された隙間に遅延型光硬化性樹脂を充填すると共に、型の周囲に溢出した余剰の遅延型光硬化性樹脂を張出部によって保持する状態を示す縦断面図である。In the fourth embodiment, a mold composed of a translucent material is placed on the base material and the delay type photocurable resin, and the delay type photocuring property is formed in the gap formed by the contact between the mold and the base material. It is a longitudinal cross-sectional view which shows the state which fills resin and hold | maintains the excessive delay type photocurable resin which overflowed around the mold | type by the overhang | projection part. 第4実施形態における、基材および遅延型光硬化性樹脂部から型を取り外す状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which removes a type | mold from a base material and a delay type photocurable resin part in 4th Embodiment. 第5実施形態における、基材の加飾シートの露出面に光硬化性樹脂を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts photocurable resin in the exposed surface of the decorating sheet of a base material in 5th Embodiment. 第5実施形態における、基材および光硬化性樹脂の上から透光性材料で構成した型を載置する状態を示す縦断面図である。It is a longitudinal cross-sectional view which shows the state which mounts the type | mold comprised with the translucent material from the base material and photocurable resin in 5th Embodiment. 第5実施形態における、型と基材との当接により形成された隙間に光硬化性樹脂を充填すると共に、型の周囲に溢出した余剰の光硬化性樹脂を張出部によって保持する状態を示す縦断面図である。In the fifth embodiment, the gap formed by the contact between the mold and the base material is filled with the photocurable resin, and the excess photocurable resin overflowing around the mold is held by the overhanging portion. It is a longitudinal cross-sectional view shown.

〔第1実施形態〕
以下、本発明に係る樹脂成形品およびその製造方法について説明する。
[First Embodiment]
Hereinafter, the resin molded product and the manufacturing method thereof according to the present invention will be described.

(第1型および第2型)
図1に示すように、第1型1の上面(第2型2に対向する面)には、キャビティ3を形成するための第1凹部4、および、その第1凹部4を囲む第1パーティング面5が形成されている。第1凹部4は、側面部6と底面部7とを備えている。底面部7には、リブ8が形成されている。側面部6には、透光性樹脂を射出するゲート9が設けられている。
(First type and second type)
As shown in FIG. 1, a first recess 4 for forming a cavity 3 and a first party surrounding the first recess 4 are formed on the upper surface of the first mold 1 (the surface facing the second mold 2). A ring surface 5 is formed. The first concave portion 4 includes a side surface portion 6 and a bottom surface portion 7. Ribs 8 are formed on the bottom surface portion 7. The side surface 6 is provided with a gate 9 for injecting a translucent resin.

第2型2の下面(第1型1に対向する面)には、キャビティ3を形成するための第2凹部10、および、その第2凹部10を囲む第2パーティング面11が形成されている。第2凹部10は、側面部12と底面部13とを備えている。底面部13は、平面部14と、その平面部14を囲む傾斜部15と、その平面部14に形成された左右の階段部16とを備えている。   A second recess 10 for forming the cavity 3 and a second parting surface 11 surrounding the second recess 10 are formed on the lower surface of the second mold 2 (the surface facing the first mold 1). Yes. The second concave portion 10 includes a side surface portion 12 and a bottom surface portion 13. The bottom surface portion 13 includes a flat surface portion 14, an inclined portion 15 surrounding the flat surface portion 14, and left and right staircase portions 16 formed on the flat surface portion 14.

(基材形成工程)
図1〜図3を参照して、上記第1型1および第2型2を用いて基材23を形成する工程を説明する。
(Base material forming process)
With reference to FIGS. 1-3, the process of forming the base material 23 using the said 1st type | mold 1 and the 2nd type | mold 2 is demonstrated.

図1に示すように、加飾シート21を第2型2に取り付ける。このとき、加飾シート21が第2凹部10に嵌り込む。図示しないエア吸引装置によって加飾シート21を第2型に吸着固定する。   As shown in FIG. 1, the decorative sheet 21 is attached to the second mold 2. At this time, the decorative sheet 21 is fitted into the second recess 10. The decorative sheet 21 is adsorbed and fixed to the second mold by an air suction device (not shown).

図8に示すように、前記加飾シート21は、基体シート81上に射出成形と同時に後述する透光性樹脂部22を加飾する加飾層84を形成して構成されている。加飾層84は、図柄や送り方向マークや幅方向マークが表現された図柄層82と、透光性樹脂部22と図柄層82との接着性を向上させる接着層83とを備えている。さらに、図柄層82を保護したり、層間密着性を向上させるために、加飾層84にアンカー層等を加えてもよい。   As shown in FIG. 8, the decorative sheet 21 is configured by forming a decorative layer 84 on the base sheet 81 to decorate a translucent resin portion 22 described later at the same time as injection molding. The decorative layer 84 includes a design layer 82 on which a design, a feed direction mark, and a width direction mark are expressed, and an adhesive layer 83 that improves the adhesion between the translucent resin portion 22 and the design layer 82. Furthermore, an anchor layer or the like may be added to the decorative layer 84 in order to protect the design layer 82 or improve interlayer adhesion.

前記基体シート81には、ポリエチレンテレフタレート(PET)、アクリル(PMMA)、ポリカーボネート(PC)、アクリロニトリル・ブタジエン・スチレン(ABS)等が使用される。   For the base sheet 81, polyethylene terephthalate (PET), acrylic (PMMA), polycarbonate (PC), acrylonitrile / butadiene / styrene (ABS) or the like is used.

前記図柄層82は、樹脂をバインダーとして顔料や染料等の着色材を含有した着色インキにより構成される。バインダーとして使用される樹脂としては、ポリビニル系樹脂、ポリアミド(PA)系樹脂、ポリエステル系樹脂、PMMA系樹脂、ポリウレタン系樹脂、ポリビニルアセタール系樹脂、ポリエステルウレタン系樹脂、セルロースエステル系樹脂、アルキド樹脂等がある。図柄層82は、グラビア印刷法、スクリーン印刷法、オフセット印刷法等により基体シート81上に形成される。又、図柄として金属光沢を表現したい場合は、図柄層82は、真空蒸着法、スパッタリング法、イオンプレーティング法、鍍金法等により形成される金属薄膜層により構成される。   The design layer 82 is made of a colored ink containing a resin and a coloring material such as a pigment or a dye. Resins used as binders include polyvinyl resins, polyamide (PA) resins, polyester resins, PMMA resins, polyurethane resins, polyvinyl acetal resins, polyester urethane resins, cellulose ester resins, alkyd resins, etc. There is. The pattern layer 82 is formed on the base sheet 81 by a gravure printing method, a screen printing method, an offset printing method, or the like. When it is desired to express metallic luster as a pattern, the pattern layer 82 is constituted by a metal thin film layer formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method or the like.

前記接着層83は、透光性樹脂部22の種類に適した感熱性又は感圧性のある樹脂が使用される。透光性樹脂部22がPMMA系樹脂であれば、例えば、接着層83もPMMA系樹脂を使用するとよい。透光性樹脂部22がPC、ポリスチレン(PS)系樹脂であれば、例えば、接着層83は、これらの樹脂と親和性のある、PMMA、PS、PA系樹脂を使用するとよい。前記アンカー層には、熱硬化ウレタン樹脂等が使用される。接着層83およびアンカー層は、グラビアコート法、ロールコート法、コンマコート法、グラビア印刷法、スクリーン印刷法、オフセット印刷法等により樹脂シート上に形成される。   For the adhesive layer 83, a heat-sensitive or pressure-sensitive resin suitable for the type of the translucent resin portion 22 is used. If the translucent resin portion 22 is a PMMA resin, for example, the adhesive layer 83 may be a PMMA resin. If the translucent resin portion 22 is a PC or polystyrene (PS) resin, for example, the adhesive layer 83 may be made of PMMA, PS, or PA resin that has an affinity for these resins. A thermosetting urethane resin or the like is used for the anchor layer. The adhesive layer 83 and the anchor layer are formed on the resin sheet by a gravure coating method, a roll coating method, a comma coating method, a gravure printing method, a screen printing method, an offset printing method, or the like.

図2に示すように、図示しない駆動機構によって第2型2と第1型1とを近接移動させて型締めを行う。このとき、第1型1及び第2型2のパーティング面5,11が加飾シート21を挟んで互いに当接し、加飾シート21と第1型1との間にキャビティ3が形成される。加飾シート21の周縁が第1型1及び第2型2から外方に突出する。ゲート9から透光性樹脂をキャビティ3に射出して充填する。   As shown in FIG. 2, the second mold 2 and the first mold 1 are moved close to each other by a driving mechanism (not shown) to perform mold clamping. At this time, the parting surfaces 5 and 11 of the first mold 1 and the second mold 2 are in contact with each other with the decorative sheet 21 interposed therebetween, and the cavity 3 is formed between the decorative sheet 21 and the first mold 1. . The peripheral edge of the decorative sheet 21 protrudes outward from the first mold 1 and the second mold 2. A translucent resin is injected from the gate 9 into the cavity 3 and filled.

前記加飾シート21の接着層83は、第1型1側(下側)を向いている。これにより、接着層83によって加飾シート21と透光性樹脂部22とが強固に接着する。   The adhesive layer 83 of the decorative sheet 21 faces the first mold 1 side (lower side). Thereby, the decorative sheet 21 and the translucent resin portion 22 are firmly bonded by the adhesive layer 83.

図3に示すように、駆動機構によって第2型2と第1型1とを離間移動させて型開きを行う。エア吸引装置によるエア吸引を停止し、第1型1に備えたエジェクターピン(図示しない)を基材23の側に突出移動させる。これにより、基材23を第1型1から取り外す。このようにして、透光性樹脂部22の上面に加飾シート21が接着された基材23が形成される。   As shown in FIG. 3, the mold is opened by moving the second mold 2 and the first mold 1 apart by a drive mechanism. Air suction by the air suction device is stopped, and an ejector pin (not shown) provided in the first mold 1 is projected and moved to the base 23 side. Thereby, the base material 23 is removed from the first mold 1. In this way, the base material 23 having the decorative sheet 21 adhered to the upper surface of the translucent resin portion 22 is formed.

前記透光性樹脂部22は、後述する樹脂成形品47が使用される製品に適した材質が使用される。例えば、ABS、PMMA、PS、スチレンアクリロニトリル(AS)、PC、ポリ塩化ビニル(PVC)、PP、PET樹脂等が挙げられる。また、透光性樹脂部22に、透明又は半透明の樹脂を使用することにより、加飾シート21に形成された図柄層82を樹脂成形品47の外部から視認することができる。尚、基体シート81が磨耗して図柄層82が露出することを防止するために、基体シート81の上に保護シートを設けることがある。このとき、基体シート81と保護シートとを同種の樹脂で構成すれば、基体シート81と保護シートとの密着性を向上させることができる。   The translucent resin portion 22 is made of a material suitable for a product in which a resin molded product 47 described later is used. Examples thereof include ABS, PMMA, PS, styrene acrylonitrile (AS), PC, polyvinyl chloride (PVC), PP, and PET resin. Moreover, the pattern layer 82 formed on the decorative sheet 21 can be visually recognized from the outside of the resin molded product 47 by using a transparent or translucent resin for the translucent resin portion 22. A protective sheet may be provided on the base sheet 81 in order to prevent the base sheet 81 from being worn out and exposing the design layer 82. At this time, if the base sheet 81 and the protective sheet are made of the same kind of resin, the adhesion between the base sheet 81 and the protective sheet can be improved.

(基材)
図7は、上記基材形成工程によって得られた矩形板状の基材23を示す。基材23の周端面31(周縁部の一例)には、その周端面31の上下方向の中央から該周端面31の全周に亘って加飾シート21の張出部24が張り出している。
(Base material)
FIG. 7 shows a rectangular plate-like base material 23 obtained by the base material forming step. On the peripheral end surface 31 (an example of the peripheral portion) of the base material 23, the overhanging portion 24 of the decorative sheet 21 extends from the center in the vertical direction of the peripheral end surface 31 over the entire circumference of the peripheral end surface 31.

張出部24は、前側部分24aと、後側部分24bと、左側部分24cと、右側部分24dとを備えている。   The overhang portion 24 includes a front part 24a, a rear part 24b, a left part 24c, and a right part 24d.

前記基材23の上面32は、平面部33と、その平面部33を囲む傾斜部34と、その平面部33に形成された左右の階段部35(凹部の一例)とを備えている。尚、平面部33は、第1型1の平面部14に対応し、傾斜部34は、第1型1の傾斜部15に対応し、階段部35は、第1型1の階段部16に対応している。   The upper surface 32 of the substrate 23 includes a flat portion 33, an inclined portion 34 that surrounds the flat portion 33, and left and right staircase portions 35 (an example of a concave portion) formed on the flat portion 33. The flat portion 33 corresponds to the flat portion 14 of the first mold 1, the inclined portion 34 corresponds to the inclined portion 15 of the first mold 1, and the staircase portion 35 corresponds to the staircase portion 16 of the first mold 1. It corresponds.

前記傾斜部34は、前側部分34aと、後側部分34bと、左側部分34cと、右側部分34dとを備えて、周端面31に向かうほど高くなるスロープ状に構成してある。   The inclined portion 34 includes a front side portion 34 a, a rear side portion 34 b, a left side portion 34 c, and a right side portion 34 d, and is configured in a slope shape that becomes higher toward the peripheral end surface 31.

前記平面部33は、それら階段部35の間に形成された中央側部分33aと、それら階段部35と傾斜部34の前側部分34aとの間に形成された前側部分33bと、それら階段部35と傾斜部34の後側部分34bとの間に形成された後側部分33cと、左側の階段部35と傾斜部34の左側部分34cとの間に形成された左側部分33dと、右側の階段部35と傾斜部34の右側部分34dとの間に形成された右側部分33eとを備えている。   The flat portion 33 includes a central side portion 33a formed between the staircase portions 35, a front side portion 33b formed between the staircase portions 35 and the front side portion 34a of the inclined portion 34, and the staircase portions 35. And a rear portion 33b formed between the rear portion 34b of the inclined portion 34, a left portion 33d formed between the left step portion 35 and the left portion 34c of the inclined portion 34, and a right step. A right portion 33e formed between the portion 35 and the right portion 34d of the inclined portion 34.

前記各階段部35は、長辺方向に沿う段部35a,35b,35cを短辺方向に3つ並べて、平面部33の中央側部分33aに向かうほど高くなるステップ状に構成してある。   Each of the staircase portions 35 is formed in a stepped shape such that three step portions 35a, 35b, and 35c along the long side direction are arranged in the short side direction and become higher toward the central side portion 33a of the flat surface portion 33.

図3に示すように、前記基材23の下面36には、基材23を所望の形状にカットするための溝37が形成されている。以上により、基材23の下面36(透光性樹脂部22の露出面)と加飾シート21との距離が、平面部33、傾斜部34、および階段部35の夫々に対応する部位毎に所期の値を有することになる。   As shown in FIG. 3, a groove 37 for cutting the base material 23 into a desired shape is formed on the lower surface 36 of the base material 23. As described above, the distance between the lower surface 36 of the base material 23 (exposed surface of the translucent resin portion 22) and the decorative sheet 21 corresponds to each of the flat portion 33, the inclined portion 34, and the staircase portion 35. Will have the expected value.

(樹脂載置工程)
図4に示すように、支持台41の上に基材23を配置し、ディスペンサ42によって基材23の上面32(加飾シート21が露出する面)の階段部35に光硬化性樹脂46を注入する。ディスペンサ42によって注入する光硬化性樹脂46の量には誤差を生じ得る。このため、階段部35に注入する光硬化性樹脂46の量を、階段部35と後述する石英ガラスで構成した透明型43の下面43a(基材23に対向する面)とで囲まれる隙間44の容積よりもやや多い量に設定する。これにより、基材23に透明型43を載置したときに、隙間44への空気の混入が防止される。尚、光硬化性樹脂46の粘度がやや高く、光硬化性樹脂46が表面張力で上向き凸の状態に盛り上がっていることが好ましい。
(Resin placement process)
As shown in FIG. 4, the base material 23 is arrange | positioned on the support stand 41, and the photocurable resin 46 is put on the step part 35 of the upper surface 32 (surface which the decorating sheet 21 exposes) of the base material 23 with the dispenser 42. As shown in FIG. inject. An error may occur in the amount of the photocurable resin 46 injected by the dispenser 42. For this reason, the gap 44 surrounded by the amount of the photocurable resin 46 to be injected into the stepped portion 35 is surrounded by the stepped portion 35 and the lower surface 43a (surface facing the base material 23) of the transparent mold 43 made of quartz glass described later. Set the amount slightly larger than the volume. Thereby, when the transparent mold | type 43 is mounted in the base material 23, mixing of the air to the clearance gap 44 is prevented. In addition, it is preferable that the viscosity of the photocurable resin 46 is slightly high, and the photocurable resin 46 is raised in a convex upward state due to surface tension.

使用可能な光硬化性樹脂46としては、アクリル系モノマー(単官能,2官能,多官能等)やアクリル系オリゴマー(エポキシアクリレート,ウレタンアクリレート,ポリエステルアクリレート等)に光ラジカル重合開始剤を配合したラジカル硬化型樹脂、あるいは、エキポシ樹脂やオキセタン樹脂に光カチオン重合開始剤を配合したカチオン硬化型樹脂等が挙げられる。これら光硬化性樹脂46は、硬化した光硬化性樹脂46の強度や硬化した光硬化性樹脂46と成形基材との密着性等を考慮して適宜選択可能である。   The usable photo-curable resin 46 is a radical in which a photo radical polymerization initiator is blended with an acrylic monomer (monofunctional, bifunctional, polyfunctional, etc.) or an acrylic oligomer (epoxy acrylate, urethane acrylate, polyester acrylate, etc.). Examples thereof include a curable resin, or a cationic curable resin obtained by blending an epoxy resin or an oxetane resin with a cationic photopolymerization initiator. These photocurable resins 46 can be appropriately selected in consideration of the strength of the cured photocurable resin 46, the adhesion between the cured photocurable resin 46 and the molding substrate, and the like.

(型載置工程)
図5に示すように、透明型43の上面43dには、透光性を有する透明型支持部48が固定されている。アクチュエータ(図示しない)により透明型支持部48を下方移動して、基材23の階段部35および光硬化性樹脂46の上から透明型43を水平状態を維持しつつ載置する。上述の如く、階段部35に注入する光硬化性樹脂46の量が階段部35と透明型43の下面43aとで囲まれる隙間44の容積よりもやや多い。このため、注入した光硬化性樹脂46は、隙間44に充填されつつ該隙間44から透明型43と基材23との間に溢出する。溢出した余剰の光硬化性樹脂46の一部は、基材23の傾斜部34によって堰き止められ、残りの光硬化性樹脂46は、基材23の傾斜部34を越えて基材23の周端面31を垂下する。垂下した光硬化性樹脂46は、基材23の周端面31の中央に備えられた張出部24によって保持される。
(Mold placement process)
As shown in FIG. 5, a transparent support 48 having translucency is fixed to the upper surface 43 d of the transparent mold 43. The transparent mold support portion 48 is moved downward by an actuator (not shown), and the transparent mold 43 is placed from above the stepped portion 35 of the base material 23 and the photocurable resin 46 while maintaining a horizontal state. As described above, the amount of the photocurable resin 46 injected into the stepped portion 35 is slightly larger than the volume of the gap 44 surrounded by the stepped portion 35 and the lower surface 43 a of the transparent mold 43. Therefore, the injected photocurable resin 46 overflows between the transparent mold 43 and the base material 23 from the gap 44 while being filled in the gap 44. A part of the excess photocurable resin 46 that overflows is blocked by the inclined portion 34 of the base material 23, and the remaining photocurable resin 46 passes over the inclined portion 34 of the base material 23 and surrounds the periphery of the base material 23. The end face 31 is suspended. The suspended photocurable resin 46 is held by the overhang portion 24 provided at the center of the peripheral end surface 31 of the base material 23.

これにより、溢出した余剰の光硬化性樹脂46が、基材23の周端面31から下方に流れることを阻止できる。よって、溢出した余剰の光硬化性樹脂46が、基材23の支持台41に付着したり、基材23の正面に回り込んで付着することを防止できる。尚、基材23の階段部35および光硬化性樹脂46の上から透明型43を載置する際に、基材23に傷が付かないように、型の下面43aと側面43bとに亘って断面形状がR状の曲面部43cが形成されている。   Thereby, the overflowing excess photocurable resin 46 can be prevented from flowing downward from the peripheral end surface 31 of the base material 23. Therefore, it is possible to prevent the excess photo-curing resin 46 that has overflowed from adhering to the support base 41 of the base material 23 or from adhering to the front surface of the base material 23. It should be noted that when the transparent mold 43 is placed from above the stepped portion 35 of the base material 23 and the photocurable resin 46, the base material 23 is covered with the lower surface 43a and the side surface 43b so as not to be damaged. A curved surface portion 43c having an R-shaped cross section is formed.

基材23の階段部35および光硬化性樹脂46の上から透明型43を載置する。このとき、透明型43の下面43aが、平面部33における中央側部分33aと当接する。これにより、仮に基材23に反りが生じている場合であっても、基材23を矯正した状態で固化させることができる。よって、透明型43を基材23から取り外したときに基材23の反りが少なくなる等、基材23の平面性が向上する。   A transparent mold 43 is placed on the stepped portion 35 of the base material 23 and the photocurable resin 46. At this time, the lower surface 43 a of the transparent mold 43 comes into contact with the central portion 33 a in the flat surface portion 33. Accordingly, even if the base material 23 is warped, the base material 23 can be solidified in a corrected state. Therefore, the flatness of the base material 23 is improved, for example, the warpage of the base material 23 is reduced when the transparent mold 43 is removed from the base material 23.

(光硬化工程)
図5に示すように、例えばUVランプ45(照射手段の一例)によって光を斜め下方に向けて照射する。光は透明型43および透明型支持部48を通過して光硬化性樹脂46に照射し、光硬化性樹脂46を硬化させる。
(Photocuring process)
As shown in FIG. 5, for example, light is irradiated obliquely downward by a UV lamp 45 (an example of irradiation means). The light passes through the transparent mold 43 and the transparent mold support portion 48 and is applied to the photocurable resin 46 to cure the photocurable resin 46.

(基材取出工程)
図6に示すように、アクチュエータにより透明型支持部48を上方移動して、基材23および光硬化性樹脂部46から透明型43を取り外す。尚、光硬化性樹脂部46から透明型43を取り外し易いように、透明型43には、予め離型剤を塗布してある。基材23の溝37に沿ってカットして、樹脂成形品47を得る。
(Substrate removal process)
As shown in FIG. 6, the transparent mold support 48 is moved upward by the actuator, and the transparent mold 43 is removed from the base material 23 and the photocurable resin 46. In addition, a release agent is applied to the transparent mold 43 in advance so that the transparent mold 43 can be easily detached from the photocurable resin portion 46. Cut along the groove 37 of the substrate 23 to obtain a resin molded product 47.

〔第2実施形態〕
図9〜図11に本発明に係る第2実施形態を示す。この実施形態は、基材23の形状については第1実施形態と同じである。しかし、透明型43の側に剥離シート51を設ける点で第1実施形態と異なっている。したがって、第1実施形態の構成と異なる構成についてのみ説明し、同じ構成については説明を省略する。
[Second Embodiment]
9 to 11 show a second embodiment according to the present invention. In this embodiment, the shape of the base material 23 is the same as that of the first embodiment. However, it differs from the first embodiment in that a release sheet 51 is provided on the transparent mold 43 side. Therefore, only the configuration different from the configuration of the first embodiment will be described, and the description of the same configuration will be omitted.

(樹脂載置工程)
図9に示すように、支持台41の上に基材23を配置し、ディスペンサ42によって基材23の階段部35に光硬化性樹脂46を注入する。このとき、透明型43の側に光硬化性樹脂46が付着しないフッ素樹脂製の剥離シート51が設けられている。剥離シート51は、透明型43の下面43aおよび曲面部43cの一部に接触している。剥離シート51を繰り出す繰出機構(図示しない)、および、剥離シート51を巻き取る巻取機構(図示しない)が備えられている。これにより、剥離シート51の透明型43の接触部分に傷が付いたときには、繰出機構および巻取機構を同時操作して、剥離シート51の透明型43の接触部分を新たなシートに交換することができる。
(Resin placement process)
As shown in FIG. 9, the base material 23 is placed on the support base 41, and the photocurable resin 46 is injected into the stepped portion 35 of the base material 23 by the dispenser 42. At this time, a release sheet 51 made of a fluororesin on which the photocurable resin 46 does not adhere is provided on the transparent mold 43 side. The release sheet 51 is in contact with the lower surface 43a of the transparent mold 43 and a part of the curved surface portion 43c. A feeding mechanism (not shown) for feeding the release sheet 51 and a winding mechanism (not shown) for winding the release sheet 51 are provided. Thus, when the contact portion of the transparent mold 43 of the release sheet 51 is damaged, the contact portion of the transparent mold 43 of the release sheet 51 is replaced with a new sheet by simultaneously operating the feeding mechanism and the winding mechanism. Can do.

(型載置工程)
図10に示すように、アクチュエータにより透明型支持部48を下方移動して、基材23の階段部35および光硬化性樹脂46の上から透明型43を水平状態を維持しつつ載置する。注入した光硬化性樹脂46は、隙間44に充填されつつ該隙間44から剥離シート51と基材23との間に溢出する。このとき、光硬化性樹脂46と透明型43との間に剥離シート51が介在しているので、光硬化性樹脂46が透明型43に付着することは無い。よって、透明型43を清掃する手間が省ける。また、光硬化性樹脂46が透明型43の側面43bから上面43や透明型支持部48まで回り込むことは無い。よって、型の厚みを薄くできる。
(Mold placement process)
As shown in FIG. 10, the transparent mold support 48 is moved downward by the actuator, and the transparent mold 43 is placed from above the stepped portion 35 of the substrate 23 and the photocurable resin 46 while maintaining the horizontal state. The injected photocurable resin 46 overflows between the release sheet 51 and the base material 23 from the gap 44 while being filled in the gap 44. At this time, since the release sheet 51 is interposed between the photocurable resin 46 and the transparent mold 43, the photocurable resin 46 does not adhere to the transparent mold 43. Therefore, the trouble of cleaning the transparent mold 43 can be saved. Further, the photocurable resin 46 does not go around from the side surface 43 b of the transparent mold 43 to the upper surface 43 or the transparent mold support portion 48. Therefore, the thickness of the mold can be reduced.

溢出した余剰の光硬化性樹脂46の一部は、基材23の傾斜部34によって堰き止められ、残りの光硬化性樹脂46は、基材23の傾斜部34を越えて基材23の周端面31を垂下する。垂下した光硬化性樹脂46は、基材23の周端面31の中央に備えられた張出部24によって保持される。   A part of the excess photocurable resin 46 that overflows is blocked by the inclined portion 34 of the base material 23, and the remaining photocurable resin 46 passes over the inclined portion 34 of the base material 23 and surrounds the periphery of the base material 23. The end face 31 is suspended. The suspended photocurable resin 46 is held by the overhang portion 24 provided at the center of the peripheral end surface 31 of the base material 23.

(光硬化工程)
図10に示すように、UVランプ45によって光を斜め下方に向けて照射する。光は透明型43および透明型支持部48を通過して光硬化性樹脂46に照射し、光硬化性樹脂46を硬化させる。
(Photocuring process)
As shown in FIG. 10, the UV lamp 45 irradiates light obliquely downward. The light passes through the transparent mold 43 and the transparent mold support portion 48 and is applied to the photocurable resin 46 to cure the photocurable resin 46.

(基材取出工程)
図11に示すように、アクチュエータにより透明型支持部48を上方移動して、基材23および光硬化性樹脂部46から透明型43を取り外す。このとき、剥離シート51は光硬化性樹脂46が付着しない特性を有するので、光硬化性樹脂部46から剥離シート51を設けた透明型43を取り外し易い。基材23の溝37に沿ってカットして、樹脂成形品47を得る。
(Substrate removal process)
As shown in FIG. 11, the transparent mold support portion 48 is moved upward by the actuator, and the transparent mold 43 is detached from the base material 23 and the photocurable resin portion 46. At this time, since the release sheet 51 has a characteristic that the photocurable resin 46 does not adhere, it is easy to remove the transparent mold 43 provided with the release sheet 51 from the photocurable resin portion 46. Cut along the groove 37 of the substrate 23 to obtain a resin molded product 47.

〔第3実施形態〕
図12〜図14に本発明に係る第3実施形態を示す。第2実施形態は、透明型43の側に剥離シート51を設ける構成であるのに対し、この実施形態では、図12〜図14に示すように、支持台41の側に剥離シート51を設けてある。それ以外の点では、第2実施形態とほぼ同じである。これにより、支持台41に繰出機構および巻取機構を収納する等、コンパクト化を図れる利点がある。
[Third Embodiment]
12 to 14 show a third embodiment according to the present invention. In the second embodiment, the release sheet 51 is provided on the transparent mold 43 side, whereas in this embodiment, the release sheet 51 is provided on the support base 41 side as shown in FIGS. It is. In other respects, it is almost the same as the second embodiment. Thereby, there exists an advantage which can attain compactization, such as accommodating a feeding mechanism and a winding mechanism in the support stand 41. FIG.

〔第4実施形態〕
図15〜図19に本発明に係る第4実施形態を示す。第2,第3実施形態は、剥離シート51がフッ素樹脂製であるのに対し、この実施形態では、剥離シート51を転写シート51で構成してある。転写シート51としては、図柄層を含まない場合と、図柄層を含む場合がある。
[Fourth Embodiment]
15 to 19 show a fourth embodiment according to the present invention. In the second and third embodiments, the release sheet 51 is made of a fluororesin, whereas in this embodiment, the release sheet 51 is composed of a transfer sheet 51. The transfer sheet 51 may or may not include a design layer.

図柄層を含まない転写シート51を使用する場合では、樹脂成形品47の製造工程は、第1〜第3実施形態と同じである。しかし、図柄層を含む転写シート51を使用する場合では、第1〜第3実施形態と同じ工程で樹脂成形品47を製造しようとすると、光硬化工程で透明型43の側から照射した光が、透明型43と光硬化性樹脂46との間に介在する転写シート51の図柄層によって遮蔽または捕捉されてしまい、光硬化性樹脂46まで到達し難くなる。このため、光硬化性樹脂46を良好に硬化させることができない不都合が生じる。このような不都合を回避すべく、光硬化性樹脂46に代えて遅延型光硬化性樹脂75を使用している。また、樹脂成形品47の製造工程は、第1〜第3実施形態とは大きく異なったものとなっている。   In the case of using the transfer sheet 51 that does not include the design layer, the manufacturing process of the resin molded product 47 is the same as in the first to third embodiments. However, in the case of using the transfer sheet 51 including the design layer, when the resin molded product 47 is manufactured in the same process as in the first to third embodiments, the light irradiated from the transparent mold 43 side in the photocuring process is generated. Further, it is shielded or captured by the design layer of the transfer sheet 51 interposed between the transparent mold 43 and the photocurable resin 46, and it is difficult to reach the photocurable resin 46. For this reason, the inconvenience which cannot harden the photocurable resin 46 favorably arises. In order to avoid such inconvenience, a delayed photocurable resin 75 is used in place of the photocurable resin 46. Moreover, the manufacturing process of the resin molded product 47 is significantly different from that of the first to third embodiments.

図15に示すように、転写シート51は、基体シート71上に射出成形と同時に透光性樹脂部22に転写される転写層77を形成して構成されている。転写層77は、樹脂成形品47の外表面を構成し内側の層等を保護するハードコート層73、図柄や送り方向マークや幅方向マークが表現された図柄層74、透光性樹脂部22と転写層77との接着性を向上させる接着層76を備えている。さらに、図柄層74を保護したり層間密着性を向上させたりするために、転写層77にアンカー層等を加えてもよい。基体シート71からの転写層77の剥離性を向上させるためには、基体シート71と転写層77との間に離型層72を形成することが好ましい。離型層72は、転写層77が転写された後も基体シート71上に残る層である。転写層77のうち必須の層は、図柄層74および接着層76であり、それ以外の層はなくてもよい。   As shown in FIG. 15, the transfer sheet 51 is configured by forming a transfer layer 77, which is transferred to the translucent resin portion 22 at the same time as injection molding, on a base sheet 71. The transfer layer 77 is a hard coat layer 73 that constitutes the outer surface of the resin molded product 47 and protects the inner layer, the pattern layer 74 on which a pattern, a feed direction mark, and a width direction mark are expressed, and the translucent resin portion 22. And an adhesive layer 76 for improving the adhesion between the transfer layer 77 and the transfer layer 77. Furthermore, an anchor layer or the like may be added to the transfer layer 77 in order to protect the pattern layer 74 or improve interlayer adhesion. In order to improve the peelability of the transfer layer 77 from the base sheet 71, it is preferable to form a release layer 72 between the base sheet 71 and the transfer layer 77. The release layer 72 is a layer that remains on the base sheet 71 even after the transfer layer 77 is transferred. The essential layers of the transfer layer 77 are the design layer 74 and the adhesive layer 76, and other layers may be omitted.

前記基体シート71には、ポリエチレンテレフタレート(PET)、ポリプロピレン(PP)、アクリル等の樹脂シート、金属箔、グラシン紙、コート紙、セロハン等のセルロース系シート等の材質が使用される。   The base sheet 71 is made of a material such as a resin sheet such as polyethylene terephthalate (PET), polypropylene (PP), or acrylic, a metal foil, a glassine paper, a coated paper, or a cellulosic sheet such as cellophane.

前記ハードコート層73には、アクリル(PMMA)系樹脂、ポリエステル系樹脂、塩化ビニル−酢酸ビニル共重合体系樹脂等のコポリマー等が使用される。ハードコート層73に硬度を持たせ樹脂成形品47の耐擦傷性を向上させる場合には、紫外線硬化性樹脂や電子線硬化性樹脂等が使用される。ハードコート層73は、グラビア印刷法、スクリーン印刷法、オフセット印刷法等により基体シート71上に形成される。   For the hard coat layer 73, a copolymer such as an acrylic (PMMA) resin, a polyester resin, or a vinyl chloride-vinyl acetate copolymer resin is used. In order to increase the hardness of the hard coat layer 73 and improve the scratch resistance of the resin molded product 47, an ultraviolet curable resin, an electron beam curable resin, or the like is used. The hard coat layer 73 is formed on the base sheet 71 by a gravure printing method, a screen printing method, an offset printing method, or the like.

前記図柄層74は、樹脂をバインダーとして顔料や染料等の着色材を含有した着色インキにより形成される。バインダーとして使用される樹脂は、ポリビニル系樹脂、ポリアミド(PA)系樹脂、ポリエステル系樹脂、PMMA系樹脂、ポリウレタン系樹脂、ポリビニルアセタール系樹脂、ポリエステルウレタン系樹脂、セルロースエステル系樹脂、アルキド樹脂等がある。図柄層74は、グラビア印刷法、スクリーン印刷法、オフセット印刷法等によりハードコート層73上に形成される。又、図柄として金属光沢を表現したい場合は、図柄層74は、真空蒸着法、スパッタリング法、イオンプレーティング法、鍍金法等により形成される金属薄膜層により構成される。図柄層74は、表現したい図柄に応じて、全面的に設定したり部分的に設定したりする。尚、「シート」には「フィルム」も含む。離型層72には、メラミン系樹脂等が使用される。接着層76には、透光性樹脂部22の材質に適した感熱性や感圧性を有する樹脂、例えば、透光性樹脂部22がPMMA樹脂であればPMMA樹脂が使用される。前記アンカー層には、熱硬化ウレタン樹脂等が使用される。離型層72、接着層76及びアンカー層は、グラビア印刷法、スクリーン印刷法等により印刷される。   The design layer 74 is formed of a colored ink containing a resin and a coloring material such as a pigment or a dye. Resins used as binders include polyvinyl resins, polyamide (PA) resins, polyester resins, PMMA resins, polyurethane resins, polyvinyl acetal resins, polyester urethane resins, cellulose ester resins, alkyd resins, etc. is there. The pattern layer 74 is formed on the hard coat layer 73 by a gravure printing method, a screen printing method, an offset printing method, or the like. When it is desired to express metallic luster as a pattern, the pattern layer 74 is constituted by a metal thin film layer formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method or the like. The symbol layer 74 is set entirely or partially depending on the symbol to be expressed. “Sheet” includes “film”. A melamine resin or the like is used for the release layer 72. For the adhesive layer 76, a heat-sensitive or pressure-sensitive resin suitable for the material of the translucent resin portion 22, for example, a PMMA resin is used if the translucent resin portion 22 is a PMMA resin. A thermosetting urethane resin or the like is used for the anchor layer. The release layer 72, the adhesive layer 76, and the anchor layer are printed by a gravure printing method, a screen printing method, or the like.

(樹脂載置工程)
図16に示すように、支持台41の上に基材23を配置し、ディスペンサ42によって基材23の上面32の階段部35に遅延型光硬化性樹脂75を注入する。
(Resin mounting process)
As shown in FIG. 16, the base material 23 is disposed on the support base 41, and the delay type photocurable resin 75 is injected into the stepped portion 35 on the upper surface 32 of the base material 23 by the dispenser 42.

通常の光硬化性樹脂は、光を照射すると即座に硬化する。これに対し、遅延型光硬化性樹脂75は、光を照射すると、一定時間(反応遅延時間)が経過するまでは硬化しない。一定時間経過後、遅延型光硬化性樹脂75の硬化が進行する。   Ordinary photo-curable resins are cured immediately upon irradiation with light. In contrast, when the delayed photocurable resin 75 is irradiated with light, it does not cure until a certain time (reaction delay time) has elapsed. After a certain period of time, the curing of the delayed photocurable resin 75 proceeds.

遅延型光硬化性樹脂75の一例として、エキポシ樹脂やオキセタン樹脂に光カチオン重合開始剤を配合したカチオン硬化型樹脂に、反応遅延剤としてアルコキシシラン類、シロキサン類、シラノール類等のSi−Oのσ結合を有する化合物を配合したものが挙げられる。このSi−Oのσ結合を有する化合物は、光カチオン重合開始剤に光を照射したときに生じるカチオン成長種と優先的に反応する。このため、カチオン成長種によるエキポシ樹脂やオキセタン樹脂の硬化を一定時間遅延させることができる。   As an example of the delayed photocurable resin 75, a cationic curable resin in which a photocationic polymerization initiator is blended with an epoxy resin or an oxetane resin, and a Si-O such as an alkoxysilane, a siloxane, or a silanol as a reaction retarder. The thing which mix | blended the compound which has (sigma) bond is mentioned. The compound having a σ bond of Si—O reacts preferentially with the cation-growing species generated when the photocationic polymerization initiator is irradiated with light. For this reason, hardening of the epoxy resin and the oxetane resin by the cation-growing species can be delayed for a certain time.

(光硬化工程)
図16に示すように、UVランプ45によって光を斜め下方に向けて照射する。光は透明型43および透明型支持部48を通過して遅延型光硬化性樹脂75に照射する。このとき、遅延型光硬化性樹脂75の硬化は進行していない。
(Photocuring process)
As shown in FIG. 16, the UV lamp 45 irradiates light obliquely downward. The light passes through the transparent mold 43 and the transparent mold support portion 48 and is applied to the delayed photocurable resin 75. At this time, the curing of the delayed photocurable resin 75 has not progressed.

(転写シート配置工程)
図17に示すように、転写シート51を、基体シート71が透明型43の下面43aおよび曲面部43cの一部に接触するように配置する。
(Transfer sheet placement process)
As shown in FIG. 17, the transfer sheet 51 is arranged so that the base sheet 71 is in contact with the lower surface 43a of the transparent mold 43 and a part of the curved surface portion 43c.

(型載置工程)
図18に示すように、アクチュエータにより透明型支持部48を下方移動して、基材23の階段部35および遅延型光硬化性樹脂75の上から透明型43を水平状態を維持しつつ載置する。注入した遅延型光硬化性樹脂75は、隙間44に充填されつつ該隙間44から転写シート51と基材23との間に溢出する。
(Mold placement process)
As shown in FIG. 18, the transparent mold support 48 is moved downward by the actuator, and the transparent mold 43 is placed on the stepped portion 35 of the base material 23 and the delay type photocurable resin 75 while maintaining the horizontal state. To do. The injected delay type photocurable resin 75 overflows between the transfer sheet 51 and the base material 23 from the gap 44 while being filled in the gap 44.

溢出した余剰の遅延型光硬化性樹脂75の一部は、基材23の傾斜部34によって堰き止められ、残りの遅延型光硬化性樹脂75は、基材23の傾斜部34を越えて基材23の周端面31を垂下する。垂下した遅延型光硬化性樹脂75は、基材23の周端面31の中央に備えられた張出部24によって保持される。   A part of the excess delay type photocurable resin 75 that overflows is blocked by the inclined portion 34 of the base material 23, and the remaining delay type photocurable resin 75 passes over the inclined portion 34 of the base material 23 and is based on it. The peripheral end surface 31 of the material 23 is suspended. The delayed type photocurable resin 75 that is suspended is held by the overhang portion 24 provided at the center of the peripheral end surface 31 of the substrate 23.

尚、光を照射してから一定時間が経過するまでに透明型43を載置することが好ましい。一定時間経過後に透明型43を載置しようとしても、遅延型光硬化性樹脂75の硬化が既に進行しているため、遅延型光硬化性樹脂75を所望の形状に成形することが困難となるためである。   In addition, it is preferable to mount the transparent mold | type 43 after a fixed time passes after irradiating light. Even if the transparent mold 43 is to be placed after a certain period of time, since the curing of the delayed photocurable resin 75 has already progressed, it becomes difficult to mold the delayed photocurable resin 75 into a desired shape. Because.

光を照射してから所定時間が経過すると、遅延型光硬化性樹脂75が完全に硬化するともに、接着層76が遅延型光硬化性樹脂部75に接着する。   When a predetermined time elapses after the light irradiation, the delayed photocurable resin 75 is completely cured and the adhesive layer 76 is bonded to the delayed photocurable resin portion 75.

前記転写シート51の接着層76は、基材23側(下側)を向いている。これにより、接着層76によって転写層77と遅延型光硬化性樹脂部75とが強固に接着する。   The adhesive layer 76 of the transfer sheet 51 faces the base material 23 side (lower side). As a result, the transfer layer 77 and the delayed photocurable resin portion 75 are firmly bonded by the adhesive layer 76.

(転写工程)
図19に示すように、所定時間経過後、アクチュエータにより透明型支持部48を上方移動して、基材23および遅延型光硬化性樹脂部75から透明型43を取り外す。このとき、転写シート51から転写層77が剥離して、基材23および遅延型光硬化性樹脂部75の上面に転写される。
(Transfer process)
As shown in FIG. 19, after a predetermined time has elapsed, the transparent mold support portion 48 is moved upward by the actuator, and the transparent mold 43 is removed from the base material 23 and the delay type photocurable resin portion 75. At this time, the transfer layer 77 is peeled off from the transfer sheet 51 and transferred to the upper surfaces of the base material 23 and the delayed photocurable resin portion 75.

よって、遅延型光硬化性樹脂部75から透明型43を取り外し易く、透明型43を清掃する手間を省くことができる。加えて、基材23および遅延型光硬化性樹脂部75の上面に図柄層74を転写して所定の加飾を付与することができる。しかも、基材23および遅延型光硬化性樹脂部75の上面にハードコート層73を形成して表面に傷が付くことを防止できる。   Therefore, it is easy to remove the transparent mold 43 from the delay type photocurable resin portion 75, and the trouble of cleaning the transparent mold 43 can be saved. In addition, the design layer 74 can be transferred to the upper surface of the base material 23 and the delay type photocurable resin portion 75 to give a predetermined decoration. In addition, it is possible to prevent the surface from being scratched by forming the hard coat layer 73 on the upper surface of the base material 23 and the delay type photocurable resin portion 75.

〔第5実施形態〕
図20〜図22に本発明に係る第5実施形態を示す。この実施形態は、基材23の構成、透明型43を載置するときの透明型43の姿勢等が第1〜第3実施形態と異なっている。したがって、第1〜第3実施形態の構成と異なる構成についてのみ説明し、同じ構成については説明を省略する。
[Fifth Embodiment]
20 to 22 show a fifth embodiment according to the present invention. This embodiment is different from the first to third embodiments in the configuration of the base material 23, the posture of the transparent mold 43 when the transparent mold 43 is placed, and the like. Therefore, only a configuration different from the configurations of the first to third embodiments will be described, and the description of the same configuration will be omitted.

(基材)
第1〜第3実施形態では、基材23の平面部33には、左右の階段部35が形成されている。これに対し、この実施形態では、図20〜図22に示すように、基材23の平面部61には、1つの階段部62が形成されている。
(Base material)
In the first to third embodiments, left and right step portions 35 are formed on the flat surface portion 33 of the base material 23. On the other hand, in this embodiment, as shown in FIGS. 20 to 22, one step portion 62 is formed on the flat portion 61 of the base material 23.

前記基材23の平面部61は、階段部62と傾斜部34の前側部分(図示しない)との間に形成された前側部分(図示しない)と、階段部62と傾斜部34の後側部分(図示しない)との間に形成された後側部分(図示しない)と、階段部62と傾斜部34の左側部分34cとの間に形成された左側部分61aと、階段部62と傾斜部34の右側部分34dとの間に形成された右側部分61bとを備えている。   The planar portion 61 of the base member 23 includes a front portion (not shown) formed between the staircase portion 62 and the front portion (not shown) of the inclined portion 34, and a rear portion of the staircase portion 62 and the inclined portion 34. A rear side portion (not shown) formed between (not shown), a left side portion 61a formed between the staircase portion 62 and the left side portion 34c of the inclined portion 34, and the staircase portion 62 and the inclined portion 34. Right side portion 61b formed between the right side portion 34d and the right side portion 34d.

前記階段部62は、長辺方向に沿う段部62a,62bを短辺方向に2つ並べて、平面部61の右側部分61bに向かうほど高くなるステップ状に構成してある。   The stepped portion 62 is configured in a stepped shape such that two stepped portions 62 a and 62 b along the long side direction are arranged in the short side direction and become higher toward the right side portion 61 b of the flat surface portion 61.

(透明型および透明型支持部)
第1〜第3実施形態では、透明型43の上面43dには、透光性を有する透明型支持部48が固定されている。これに対し、この実施形態では、図20〜図22に示すように、透明型43の上面43dの左右側には、夫々ロッド58が立設されている。それらロッド58が、夫々透明型支持部48の貫通孔48aに挿通されている。透明型43の上面43dと透明型支持部48の下面48bとの間には、ロッド59の外側を巻回する圧縮バネ59が装備されている。ロッド59から径方向外方側に突出して透明型支持部48の上面48cを係止する係止部材60が設けられている。これにより、透明型43が基材23に接触していないときは、左下向きの傾斜状態を維持し、透明型43が基材23に接触したときには、傾斜状態から水平状態に姿勢変更するように構成してある。
(Transparent and transparent support parts)
In the first to third embodiments, a transparent support 48 having translucency is fixed to the upper surface 43 d of the transparent mold 43. On the other hand, in this embodiment, as shown in FIGS. 20 to 22, rods 58 are erected on the left and right sides of the upper surface 43 d of the transparent mold 43, respectively. The rods 58 are inserted through the through holes 48a of the transparent support portions 48, respectively. A compression spring 59 is provided between the upper surface 43 d of the transparent mold 43 and the lower surface 48 b of the transparent mold support 48 so as to wind the outside of the rod 59. A locking member 60 that protrudes radially outward from the rod 59 and locks the upper surface 48 c of the transparent support 48 is provided. As a result, when the transparent mold 43 is not in contact with the base material 23, the inclined state is maintained in the lower left direction. When the transparent mold 43 is in contact with the base material 23, the posture is changed from the inclined state to the horizontal state. It is configured.

(樹脂載置工程)
図20に示すように、支持台41の上に基材23を配置し、ディスペンサ42によって基材23の階段部62に光硬化性樹脂を注入する。このとき、光硬化性樹脂は、その上向き凸の状態の光硬化性樹脂の頂点が階段部62の中央よりもやや左側寄りに位置している。
(Resin placement process)
As shown in FIG. 20, the base material 23 is placed on the support base 41, and a photocurable resin is injected into the stepped portion 62 of the base material 23 by the dispenser 42. At this time, the top of the photocurable resin in the upward convex state is positioned slightly to the left of the center of the staircase 62.

(型載置工程)
図21に示すように、アクチュエータにより透明型支持部48を下方移動する。このとき、透明型43は左下向きの傾斜状態を維持している。透明型43の下面43aの左端が平面部61の左側部分61aに当接する。このとき、注入した光硬化性樹脂は、先ず基材23の平面部61の左側部分61aと階段部35の左側の段部62bとの間の溝部63(階段部35の一番深い箇所)に充填されつつ、その一部が溝部63から左側に流動して、透明型43と基材23の傾斜部34の左側部分34cとの間に溢出する。左側に溢出した余剰の光硬化性樹脂の一部は、基材23の傾斜部34の左側部分34cによって堰き止められ、残りの光硬化性樹脂は、基材23の傾斜部34の左側部分34cを越えて基材23の周端面31を垂下する。垂下した光硬化性樹脂は、基材23の周端面31の中央部に備えられた張出部24の左側部分24cによって保持される。
(Mold placement process)
As shown in FIG. 21, the transparent support 48 is moved downward by the actuator. At this time, the transparent mold 43 maintains a left-downward inclined state. The left end of the lower surface 43 a of the transparent mold 43 abuts on the left side portion 61 a of the flat portion 61. At this time, the injected photo-curing resin is first in the groove portion 63 (the deepest portion of the step portion 35) between the left portion 61a of the flat portion 61 of the base member 23 and the step portion 62b on the left side of the step portion 35. While being filled, a part of the fluid flows to the left side from the groove part 63 and overflows between the transparent mold 43 and the left side part 34 c of the inclined part 34 of the base material 23. A part of the excess photocurable resin overflowing to the left side is blocked by the left side portion 34c of the inclined portion 34 of the base material 23, and the remaining photocurable resin is left side portion 34c of the inclined portion 34 of the base material 23. The peripheral end surface 31 of the base material 23 is suspended over the distance. The suspended photocurable resin is held by the left side portion 24 c of the overhang portion 24 provided at the central portion of the peripheral end surface 31 of the base material 23.

同時に、残りの光硬化性樹脂が溝部63から右側に流動して、透明型43と基材23の傾斜部34の右側部分34dとの間に溢出する。右側に溢出した余剰の光硬化性樹脂の一部は、基材23の傾斜部34の右側部分34dによって堰き止められ、残りの光硬化性樹脂は、基材23の傾斜部34の右側部分34dを越えて基材23の周端面31を垂下する。垂下した光硬化性樹脂は、基材23の周端面31の中央部に備えられた張出部24の右側部分24dによって保持される。   At the same time, the remaining photocurable resin flows to the right side from the groove 63 and overflows between the transparent mold 43 and the right side portion 34 d of the inclined portion 34 of the base material 23. A part of the excess photocurable resin overflowing to the right side is blocked by the right side portion 34d of the inclined portion 34 of the base material 23, and the remaining photocurable resin is left sided 34d of the inclined portion 34 of the base material 23. The peripheral end surface 31 of the base material 23 is suspended over the distance. The suspended photocurable resin is held by the right side portion 24 d of the overhang portion 24 provided at the central portion of the peripheral end surface 31 of the base material 23.

図22に示すように、アクチュエータにより透明型支持部48を更に下方移動すると、透明型43は左下向きの傾斜状態から水平状態に姿勢変更して、透明型43の下面43aの右端が平面部61の右側部分61bに当接する。このとき、溝部63は既に充填されている。さらに、透明型43の下面43aの左端が平面部61の左側部分61aに当接しているので、溢出する光硬化性樹脂が溝部63から左側に流動することはほとんど無い。しかも、基材23の傾斜部34の右側部分34dには、溢出する光硬化性樹脂を堰き止める余力はほとんど無い。このため、溢出した余剰の光硬化性樹脂は、ほぼ全量が基材23の傾斜部34の右側部分34dを越えて基材23の周端面31を垂下する。垂下した光硬化性樹脂は、基材23の周端面31の中央部に備えられた張出部24の右側部分24dによって保持される。このようにして、注入した光硬化性樹脂は、階段部62と透明型43の下面43aとで囲まれる隙間44に充填される。   As shown in FIG. 22, when the transparent mold support 48 is further moved downward by the actuator, the transparent mold 43 changes its posture from the lower left inclined state to the horizontal state, and the right end of the lower surface 43 a of the transparent mold 43 is flat. The right side part 61b of this is contacted. At this time, the groove 63 is already filled. Furthermore, since the left end of the lower surface 43a of the transparent mold 43 is in contact with the left portion 61a of the flat surface portion 61, the overflowing photocurable resin hardly flows from the groove portion 63 to the left side. In addition, the right side portion 34d of the inclined portion 34 of the base material 23 has little remaining capacity to dam up the overflowing photocurable resin. For this reason, almost all of the overflowing excess photocurable resin hangs down the peripheral end surface 31 of the substrate 23 beyond the right side portion 34 d of the inclined portion 34 of the substrate 23. The suspended photocurable resin is held by the right side portion 24 d of the overhang portion 24 provided at the central portion of the peripheral end surface 31 of the base material 23. In this way, the injected photocurable resin is filled in the gap 44 surrounded by the stepped portion 62 and the lower surface 43 a of the transparent mold 43.

このように、他方側に向かうほど穴の深さが深くなる階段部62の場合には、階段部62の他方側に光硬化性樹脂を注入し、他方側が下向きに傾斜した透明型43を載置して、光硬化性樹脂を穴の深さが深い箇所から浅い箇所に流動させる。これにより、他方側に向かうほど穴の深さが深くなる階段部62であっても良好に充填できる。   Thus, in the case of the staircase portion 62 whose depth becomes deeper toward the other side, a photocurable resin is injected into the other side of the staircase portion 62, and the transparent mold 43 with the other side inclined downward is mounted. Then, the photocurable resin is caused to flow from a deep hole to a shallow hole. Thereby, even if it is the step part 62 whose depth of a hole becomes deep as it goes to the other side, it can be filled favorably.

張出部24の左側部分24cによって保持される光硬化性樹脂の量は、張出部24の右側部分24dによって保持される光硬化性樹脂の量よりも少ない。よって、張出部24の左側部分24cの突出量が小さくできる。さらに、注入する光硬化性樹脂の量や透明型43の傾斜角等を調節することで、基材23の傾斜部34の左側部分34cを越えて基材23の周端面31を垂下する光硬化性樹脂を無くすことができ、張出部24の左側部分24cを無くすことも可能である。   The amount of the photocurable resin held by the left side portion 24c of the overhang portion 24 is smaller than the amount of the photocurable resin held by the right side portion 24d of the overhang portion 24. Therefore, the protrusion amount of the left side portion 24c of the overhang portion 24 can be reduced. Further, by adjusting the amount of the photocurable resin to be injected, the inclination angle of the transparent mold 43, and the like, the photocuring that hangs down the peripheral end surface 31 of the base material 23 beyond the left side portion 34c of the inclined portion 34 of the base material 23. The conductive resin can be eliminated, and the left side portion 24c of the overhang portion 24 can be eliminated.

(光硬化工程)
図22に示すように、UVランプ45によって光を斜め下方に向けて照射する。光は透明型43および透明型支持部48を通過して光硬化性樹脂に照射し、光硬化性樹脂を硬化させる。
(Photocuring process)
As shown in FIG. 22, the UV lamp 45 irradiates light obliquely downward. The light passes through the transparent mold 43 and the transparent mold support portion 48 and is applied to the photocurable resin to cure the photocurable resin.

(基材取出工程)
アクチュエータにより透明型支持部48を上方移動して、基材23および光硬化性樹脂部46から透明型43を取り外す。基材23の溝37に沿ってカットして、樹脂成形品47を得る。
〔別実施形態〕
(Substrate removal process)
The transparent mold support part 48 is moved upward by the actuator, and the transparent mold 43 is removed from the base material 23 and the photocurable resin part 46. Cut along the groove 37 of the substrate 23 to obtain a resin molded product 47.
[Another embodiment]

(1)上記第2実施形態では、剥離シート51がフッ素樹脂製である構成を例示した。しかし、これに限られるものではなく、剥離シート51が光硬化性樹脂が付着しない特性を有する材質であればよい。 (1) In the second embodiment, the configuration in which the release sheet 51 is made of a fluororesin is exemplified. However, it is not restricted to this, The release sheet 51 should just be a material which has the characteristic that photocurable resin does not adhere.

(2)上記各実施形態では、光は透明型43および透明型支持部48を通過して光硬化性樹脂46に照射し、光硬化性樹脂46を硬化させる構成を例示した。しかし、光は基材23を通過して光硬化性樹脂46に照射し、光硬化性樹脂46を硬化させてもよい。このとき、基材23は光を透過する材質である必要がある。 (2) In each of the above-described embodiments, the configuration in which light passes through the transparent mold 43 and the transparent mold support portion 48 and is irradiated to the photocurable resin 46 to cure the photocurable resin 46 is exemplified. However, the light may pass through the base material 23 and irradiate the photocurable resin 46 to cure the photocurable resin 46. At this time, the base material 23 needs to be made of a material that transmits light.

さらに、上記第4実施形態では、光は透明型43および透明型支持部48を通過しないで遅延型光硬化性樹脂75に照射してもよい。具体的には、透明型43および透明型支持部48を基材23の上方から退避させておき、光を遅延型光硬化性樹脂75に直接照射したのち、透明型43および透明型支持部48を基材23の上方に移動してもよい。このとき、透明型43に代えて金属製の型等の透光性を有しない型が使用可能である。   Further, in the fourth embodiment, light may be applied to the delay type photocurable resin 75 without passing through the transparent mold 43 and the transparent mold support portion 48. Specifically, the transparent mold 43 and the transparent mold support portion 48 are retracted from above the base material 23, and light is directly applied to the delayed photocurable resin 75, and then the transparent mold 43 and the transparent mold support section 48. May be moved above the substrate 23. At this time, instead of the transparent mold 43, a mold having no translucency, such as a metal mold, can be used.

(3)上記各実施形態では、透光性材料が石英ガラスである構成を例示した。しかし、これに限られるものではない。例えば、透光性材料が紫外線透過ガラス、紫外線透過プラスチック、CaF2単結晶等であってもよい。 (3) In each of the above embodiments, the configuration in which the translucent material is quartz glass is exemplified. However, it is not limited to this. For example, the translucent material may be ultraviolet transmissive glass, ultraviolet transmissive plastic, CaF 2 single crystal, or the like.

(4)上記各実施形態では、基材23として、透光性樹脂部22の上面に加飾シート21が接着された構成を例示したが、さらに、透光性樹脂部22の下面に加飾フィルムが接着されてもよい。 (4) In each of the above embodiments, as the base material 23, the configuration in which the decorative sheet 21 is bonded to the upper surface of the translucent resin portion 22 is exemplified. A film may be adhered.

(5)上記各実施形態では、光硬化性樹脂がUV(紫外線)硬化型樹脂である構成を例示した。しかし、これに限られるものではない。例えば、光硬化性樹脂がVL(可視光)硬化型樹脂であってもよい。 (5) In the above embodiments, the configuration in which the photocurable resin is a UV (ultraviolet) curable resin is exemplified. However, it is not limited to this. For example, the curable resin may be a VL (visible light) curable resin.

本発明は、透光性樹脂部の背面に該透光性樹脂部を通して模様を視認可能な加飾部を設けた各種樹脂成形品に適応可能である。   The present invention can be applied to various resin molded products in which a decorative portion capable of visually recognizing a pattern is provided on the back surface of the translucent resin portion.

1 第1型
2 第2型
3 キャビティ
21 加飾シート,転写シート
22 透光性樹脂,透光性樹脂部
32 加飾シートの露出面
36 露出面
23 基材
24 張出部
31 周縁部
43 透光性材料で構成した型
44 隙間
51 剥離シート
73 図柄層
75 遅延型透光性樹脂,遅延型透光性樹脂部
DESCRIPTION OF SYMBOLS 1 1st type 2 2nd type 3 Cavity 21 Decorating sheet, transfer sheet 22 Translucent resin, translucent resin part 32 Exposed surface 36 of decorated sheet Exposed surface 23 Base material 24 Overhang part 31 Peripheral part 43 Transparent Mold 44 composed of a light-sensitive material 51 Gap 51 Release sheet 73 Pattern layer 75 Delay type translucent resin, delay type translucent resin portion

Claims (4)

第1型と第2型とで加飾シートを挟持しつつ、前記加飾シートと前記第1型との間に形成したキャビティに透光性樹脂を注入したのち硬化させることで、透光性樹脂部の露出面と前記加飾シートとの距離が個々の部位毎に所期の値を有し、周縁部のうち少なくとも一部に前記加飾シートの張出部を備えた基材を得る基材形成工程;
前記基材の加飾シートの露出面に光硬化性樹脂を載置する樹脂載置工程;
前記基材および前記光硬化性樹脂の上から透光性材料で構成した型を載置し、当該型と前記基材との当接により形成された隙間に前記光硬化性樹脂を充填すると共に、前記型の周囲に溢出した余剰の前記光硬化性樹脂を前記張出部によって保持する型載置工程;
前記型または前記透光性樹脂部の何れか一方を介して、光を前記光硬化性樹脂に照射する光硬化工程;
を有する樹脂成形品の製造方法。
Translucent by injecting a translucent resin into a cavity formed between the decorative sheet and the first mold and holding the decorative sheet between the first mold and the second mold, and then curing. A distance between the exposed surface of the resin portion and the decorative sheet has a predetermined value for each part, and a base material provided with a protruding portion of the decorative sheet on at least a part of the peripheral portion is obtained. Substrate forming step;
A resin placing step of placing a photocurable resin on the exposed surface of the decorative sheet of the substrate;
A mold composed of a translucent material is placed on the base material and the photocurable resin, and the photocurable resin is filled in a gap formed by contact between the mold and the base material. A mold placing step for holding the excess photocurable resin overflowing around the mold by the overhanging portion;
A photocuring step of irradiating the photocurable resin with light through either the mold or the translucent resin portion;
A method for producing a resin molded product having
前記型の表面のうち前記基材に対向する面を平面に形成する請求項1に記載の樹脂成形品の製造方法。   The manufacturing method of the resin molded product of Claim 1 which forms the surface which opposes the said base material among the surfaces of the said mold | die in a plane. 前記型載置工程において、前記型の表面のうち前記基材に対向する面に、前記光硬化性樹脂が付着しない剥離シートを設ける請求項1又は2に記載の樹脂成形品の製造方法。   The method for producing a resin molded product according to claim 1 or 2, wherein, in the mold placing step, a release sheet to which the photocurable resin does not adhere is provided on a surface of the mold that faces the substrate. 第1型と第2型とで加飾シートを挟持しつつ、前記加飾シートと前記第1型との間に形成したキャビティに透光性樹脂を注入したのち硬化させることで、透光性樹脂部の露出面と前記加飾シートとの距離が個々の部位毎に所期の値を有し、周縁部のうち少なくとも一部に前記加飾シートの張出部を備えた基材を得る基材形成工程;
前記基材の加飾シートの露出面に遅延型光硬化性樹脂を載置する樹脂載置工程;
光を前記遅延型光硬化性樹脂に照射する光硬化工程;
前記基材および前記遅延型光硬化性樹脂の上方に型を配置して該型と前記基材の加飾シートの露出面とを対向させ、前記型の表面のうち前記基材に対向する面に図柄層を含む転写シートを配置する転写シート配置工程;
前記基材および前記遅延型光硬化性樹脂の上から前記型を載置し、前記転写シートと前記基材との間に形成された隙間に前記遅延型光硬化性樹脂を充填すると共に、前記型の周囲に溢出した余剰の前記遅延型光硬化性樹脂を前記張出部によって保持する型載置工程;
前記基材および遅延型光硬化性樹脂部から前記型を取り外すと共に、前記転写シートから前記図柄層が剥離して、当該図柄層が前記基材および前記遅延型光硬化性樹脂部の少なくともいずれか一方の上面に転写される転写工程;
を有する樹脂成形品の製造方法。
Translucent by injecting a translucent resin into a cavity formed between the decorative sheet and the first mold and holding the decorative sheet between the first mold and the second mold, and then curing. A distance between the exposed surface of the resin portion and the decorative sheet has a predetermined value for each part, and a base material provided with a protruding portion of the decorative sheet on at least a part of the peripheral portion is obtained. Substrate forming step;
A resin placing step of placing a delayed photocurable resin on the exposed surface of the decorative sheet of the substrate;
A photocuring step of irradiating the delayed photocurable resin with light;
The surface which faces the said base material among the surfaces of the said mold, arrange | positions a type | mold above the said delay type photocurable resin, makes this type | mold and the exposed surface of the decorating sheet | seat of the said base material oppose A transfer sheet disposing step of disposing a transfer sheet including a pattern layer on the sheet;
The mold is placed over the base material and the delay type photocurable resin, and the delay type photocurable resin is filled in a gap formed between the transfer sheet and the base material, and A mold placing step for holding the excess of the delayed type photocurable resin overflowing around the mold by the overhanging portion;
The mold is removed from the base material and the delay type photocurable resin portion, and the design layer is peeled from the transfer sheet, and the design layer is at least one of the base material and the delay type photocurable resin portion. A transfer process to be transferred to one upper surface;
A method for producing a resin molded product having
JP2010013310A 2010-01-25 2010-01-25 Method for manufacturing resin molded article Withdrawn JP2011148264A (en)

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Country Link
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105745056A (en) * 2013-11-14 2016-07-06 柯尼卡美能达株式会社 Method for producing optical element, and optical element
JP2020090088A (en) * 2018-12-07 2020-06-11 イントップス カンパニー,リミテッド Method for manufacturing real material product with composite layer using liquid reaction curing method
JP2020097220A (en) * 2018-10-31 2020-06-25 ザ・ボーイング・カンパニーThe Boeing Company Composite part compaction device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105745056A (en) * 2013-11-14 2016-07-06 柯尼卡美能达株式会社 Method for producing optical element, and optical element
CN105745056B (en) * 2013-11-14 2018-09-04 柯尼卡美能达株式会社 The manufacturing method and optical element of optical element
JP2020097220A (en) * 2018-10-31 2020-06-25 ザ・ボーイング・カンパニーThe Boeing Company Composite part compaction device
JP7456746B2 (en) 2018-10-31 2024-03-27 ザ・ボーイング・カンパニー Compression equipment for composite parts
JP2020090088A (en) * 2018-12-07 2020-06-11 イントップス カンパニー,リミテッド Method for manufacturing real material product with composite layer using liquid reaction curing method

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