JP2011128481A - Electrooptical device, method of manufacturing the same, and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electrooptical device having a hardly breakable substrate structure, a method of manufacturing the electrooptical device, and electronic equipment. <P>SOLUTION: The electrooptical device includes a display panel 12 which includes a first substrate including a plurality of organic EL elements and terminal parts 16a to 16c comprising a plurality of terminals electrically connected to the organic EL elements; a sealing material 26 disposed on the circumference of a display area 15 where the organic EL elements are disposed and at least a part of the circumference of each of the terminal parts 16a to 16c; and a second substrate disposed facing the first substrate across the sealing material 26, and having opening holes 71a to 71c formed in areas to overlap with the terminal parts 16a to 16c in plane view. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electro-optical device, a method for manufacturing the electro-optical device, and an electronic apparatus.

  As one of electro-optical devices, for example, an organic EL (electroluminescence) device is known (Patent Document 1). The organic EL device includes an organic EL element in which an organic film such as a light emitting layer is sandwiched between an anode and a cathode between a pair of substrates, and is electrically connected to the outside at one end of one substrate. Terminal portion. Since a relay substrate connected to the outside is mounted on the terminal portion, one substrate has a structure protruding from the other substrate by the region of the terminal portion. A sealing material for bonding the pair of substrates is provided so as to surround a light emitting region provided with a plurality of organic EL elements so as not to protrude from the terminal portion.

Japanese Patent Laid-Open No. 10-301072

  However, if the thickness of the substrate is reduced, the strength of the organic EL device is weakened, and there is a problem that cracks and chips are likely to occur particularly in the corners and end faces of the terminal portions.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 An electro-optical device according to this application example includes an electro-optical element, a first substrate including a terminal portion that is electrically connected to the electro-optical element, and the electro-optical element. A sealing material provided in the periphery of the provided element region and at least a part of the periphery of the terminal portion, and a region that is opposed to the first substrate via the sealing material and overlaps the terminal portion in plan view And an electro-optical panel having a second substrate provided with an opening or a notch.

  According to this configuration, since the opening or the notch is provided in a region overlapping the terminal portion in the second substrate, even if the second substrate is overlaid on the first substrate having the terminal portion, the terminal For example, a relay board can be connected to the part. In addition to the periphery of the element region, the seal material is provided on at least a part of the periphery of the terminal portion, whereby the strength of the periphery of the terminal portion can be improved.

  Application Example 2 In the electro-optical device according to the application example, it is preferable that the first substrate and the second substrate have substantially the same size.

  According to this configuration, since both substrates have the same size, the strength of the corner portion is increased in the region of the terminal portion after bonding compared to the case where the first substrate protrudes from the second substrate by the region of the terminal portion. Can be improved.

  Application Example 3 In the electro-optical device according to the application example, it is preferable that the sealing material is provided around the element region and at a corner portion of the first substrate on which the terminal portion is provided.

  According to this configuration, since the sealing material is provided at the corner portion of the first substrate on which the terminal portion is provided, the strength of the corner portion in the region where the terminal portion is provided on the pair of substrates can be improved. .

  Application Example 4 In the electro-optical device according to the application example, it is preferable that a terminal portion is provided on the first substrate, and the sealing material is provided so as to surround the terminal portion.

  According to this configuration, since the sealing material is also provided in the region between the terminal portions, even if the opening portion or the cutout portion is provided in the region overlapping the terminal portion in the second substrate, the periphery of the terminal portion is provided. Strength can be improved.

  Application Example 5 In the electro-optical device according to the application example, the first substrate includes a plurality of terminal portions, and the sealing material surrounds at least two of the plurality of terminal portions. Is preferably provided.

  According to this configuration, since the sealing material is provided so as to surround at least two terminal portions, it is possible to reduce the coating amount of the sealing material as compared with providing the sealing material for each terminal portion. it can.

  Application Example 6 In the electro-optical device according to the application example, it is preferable that the opening or the notch is provided so as to surround at least two of the plurality of terminal portions in a plan view.

  According to this configuration, since the opening or notch is provided so as to surround at least two terminal portions, it is easier to process compared to the case where an opening or notch is provided for each terminal portion. Can do. Further, it can be easily connected to the relay board.

  Application Example 7 In the electro-optical device according to the application example, the electro-optical panel has a thickness of 100 μm or less, and the electro-optical panel is sandwiched and laminated between a pair of transparent resin films. Preferably it is.

  According to this configuration, since the electro-optical panel is laminated with the resin film, the strength of the electro-optical panel can be reinforced. Moreover, since it laminates with the resin film, it can prevent that the broken material scatters when an electro-optical panel is damaged.

  Application Example 8 A method for manufacturing an electro-optical device according to this application example includes a first substrate provided with an electro-optical element and a terminal portion, and a second substrate disposed opposite to the first substrate with a sealing material interposed therebetween. And an electro-optic device having an electro-optic panel, wherein the electro-optic device is provided on at least a part of the periphery of the element region on the first substrate and the periphery of the terminal portion. An application step of applying a sealing material, an attaching step of attaching and attaching the second substrate to the first substrate via the sealing material, and a region overlapping the terminal portion in the second substrate in a plane A cutting step of cutting and exposing the terminal portion.

  According to this method, since the region of the second substrate that overlaps with the terminal portion in the cutting step is cut in the cutting step, even if the second substrate is overlaid on the first substrate having the terminal portion by the attaching step, the relay to the terminal portion is performed. A substrate can be connected. Further, since the sealing material is applied to at least a part of the periphery of the terminal portion in addition to the periphery of the element region by the application process, the strength of the periphery of the terminal portion can be improved.

  Application Example 9 In the method of manufacturing an electro-optical device according to the application example, the application step applies the sealing material around the element region and the corner portion of the first substrate on which the terminal portion is provided. It is preferable to do.

  According to this method, since the sealing material is applied to the corner portion of the first substrate provided with the terminal portion, the strength of the corner portion in the region where the terminal portion is provided in the pair of substrates can be improved.

  Application Example 10 In the method of manufacturing an electro-optical device according to the application example, it is preferable that the application step is to apply the sealing material so as to surround the terminal portion of the first substrate.

  According to this method, since the sealing material is applied so as to surround the terminal portion, the strength around the terminal portion can be improved even if the region of the second substrate overlapping the terminal portion is cut.

  Application Example 11 In the method of manufacturing an electro-optical device according to the application example, the first substrate is provided with a terminal portion, and the application step applies the sealing material so as to surround the terminal portion. It is preferable to do.

  According to this method, since the sealing material is also applied to the region between the terminal portions, the strength around the terminal portion is improved even if the opening portion or the cutout portion is provided in the terminal portion region of the second substrate. Can be made.

  Application Example 12 In the method of manufacturing the electro-optical device according to the application example, the first substrate is provided with a plurality of terminal portions, and the coating process includes at least two of the plurality of terminal portions. It is preferable to apply the sealing material so as to surround.

  According to this method, since the sealing material is applied so as to surround at least two terminal portions, the amount of the sealing material applied can be reduced as compared with the case where the sealing material is applied surrounding each terminal portion. .

  Application Example 13 In the method of manufacturing the electro-optical device according to the application example, it is preferable that the cutting step is performed so that at least two of the plurality of terminal portions are exposed in a plan view.

  According to this method, since the opening or the notch is formed so as to surround at least two terminal portions, it is easier to process than the case where the opening or the notch is formed for each terminal portion. can do. Further, it can be easily connected to the relay board.

  Application Example 14 In the method of manufacturing an electro-optical device according to the application example, the electro-optical panel is laminated with a thickness of the electro-optical panel being 100 μm or less and at least one of which is transparent. It is preferable to have a laminating process.

  According to this method, since the electro-optical panel is laminated with the resin film, the strength of the electro-optical panel can be reinforced. Further, since the lamination is performed with the resin film, it is possible to prevent the broken material from scattering when the electro-optical panel is damaged.

  Application Example 15 An electronic apparatus according to this application example includes the electro-optical device described above.

  According to this configuration, it is possible to provide an electronic apparatus including an electro-optical device that is not easily damaged.

1 is a schematic plan view illustrating a configuration of an organic EL device as an electro-optical device according to a first embodiment. The schematic cross section which follows the AA 'line of the organic electroluminescent apparatus shown in FIG. FIG. 3 is an equivalent circuit diagram illustrating an electrical configuration of the organic EL device. The schematic cross section which shows the structure of the display panel which comprises an organic electroluminescent apparatus. The schematic plan view which shows the structure of a display panel. FIG. 6 is a schematic cross-sectional view along the line BB ′ of the display panel shown in FIG. 5. The flowchart which shows the manufacturing method of the organic electroluminescent apparatus of 2nd Embodiment. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic plan view which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic diagram which shows a part of manufacturing method of an organic electroluminescent apparatus. The schematic perspective view which shows typically the structure of a display and an information portable terminal as an example of an electronic device provided with the display panel of 3rd Embodiment. The schematic plan view which shows the structure of the modification of a display panel. The schematic plan view which shows the structure of the modification of a display panel. The schematic plan view which shows the structure of the modification of a display panel. The schematic plan view which shows the structure of the modification of a display panel.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, embodiments of the invention will be described with reference to the drawings. Note that the drawings to be used are appropriately enlarged or reduced so that the part to be described can be recognized.

(First embodiment)
<Electro-optical device>
FIG. 1 is a schematic plan view showing a configuration of an organic EL device as an electro-optical device. FIG. 2 is a schematic cross-sectional view taken along the line AA ′ of the organic EL device shown in FIG. Hereinafter, the configuration of the organic EL device will be described with reference to FIGS. 1 and 2.

  As shown in FIG. 1, the organic EL device 11 includes a display unit 13 including a display panel 12 as an electro-optical panel having a rectangular outer shape. The display panel 12 has a display area 15 as an element area provided with a plurality of pixels 14 capable of displaying colors of R (red), G (green), B (blue), and three colors. The plurality of pixels 14 have a so-called stripe arrangement in which pixels 14 of the same color among the three colors are arranged in the direction along the short side in the display region 15. Note that the arrangement of the pixels 14 is not limited to this.

  The three terminal portions 16a, 16b, and 16c formed of a plurality of terminals provided along the long side of the display panel 12 are electrically connected to a display control unit (not shown) that drives and controls the display panel 12. In order to achieve this, a plurality of (for example, three) relay boards 17a, 17b, and 17c are mounted. The relay boards 17a, 17b, and 17c are, for example, flexible circuit boards (FPC), and have a surface on which an electronic component such as a driver IC that constitutes a part of a drive circuit that drives the display panel 12 is mounted. Can be adopted.

  As shown in FIG. 2, the display unit 13 of the organic EL device 11 has a structure in which the display panel 12 on which the relay substrate 17 a is mounted is sandwiched between a resin film 21 and a resin film 22.

  The display panel 12 includes a first substrate 31 having an organic electroluminescence element 23 (hereinafter, referred to as “organic EL element 23”) as an electro-optic element provided corresponding to each pixel 14, and also for each pixel 14. A second substrate 32 having a color filter 24 having a colored layer provided corresponding thereto is joined by a sealing material 26 with a sealing resin 25 having visible light permeability. The organic EL element 23 emits white light, and has a so-called top emission structure that enables color display when the white light passes through the color filter 24 and is emitted from the second substrate 32 side.

  The first substrate 31 is provided with a drive circuit (not shown) for driving the organic EL element 23 for each pixel 14, and the organic EL element 23 is formed on the drive circuit. The driving circuit includes a switching element such as a thin film transistor, wiring connected to the switching element, and the like, and a known configuration can be adopted.

  Thus, in the self-luminous display panel 12 having the organic EL element 23, the first substrate 31 can be a transparent glass substrate or an opaque silicon substrate, for example. On the other hand, a transparent glass substrate is used as the second substrate 32 on the side from which light emission from the organic EL element 23 is extracted.

  In this embodiment, after joining the 1st board | substrate 31 and the 2nd board | substrate 32, the process which makes the thickness of each board | substrate thin is performed by giving the surface mechanically or chemically. For example, the original thickness of each substrate is approximately 0.5 mm. And it grind | polishes so that the total thickness after a process may be set to about 100 micrometers or less (for example, about 80 micrometers). Therefore, the display panel 12 itself has a certain degree of flexibility.

  Therefore, it is necessary for the display panel 12 itself to be weak against an external impact and to prevent scattering when it is damaged by the impact. In addition, the organic EL element 23 is sealed to prevent the intrusion of moisture or the like from the outside, and is laminated with the flexible resin films 21 and 22 for the purpose of ensuring a longer light emission life. ing.

  The resin film 21 used for laminating has an adhesive layer 21b formed by uniformly applying an adhesive on one surface of a transparent base film 21a having low gas permeability. Similarly, the resin film 22 has an adhesive layer 22b formed by uniformly applying a transparent adhesive on one surface of a transparent base film 22a having low gas permeability.

  Examples of the base films 21a and 22a include a PET (polyethylene terephthalate) film and a polycarbonate film. For the adhesive layers 21b and 22b, for example, a thermosetting epoxy resin can be used. Moreover, it is good also as an adhesive which has adhesiveness. Repair properties can be realized by using an adhesive.

  Lamination is performed with two resin films 21 and 22 with the display panel 12 sandwiched so that the adhesive layers 21b and 22b face each other. Further, in order to ensure moisture resistance of the organic EL element 23, in other words, sealing performance, spaces 27 and 28 that may be generated around the display panel 12 during lamination are filled with a sealing resin. . That is, the display panel 12 is laminated together with the sealing resin, and a part 29 of the protruding sealing resin is raised on the end surfaces of the resin films 21 and 22.

  The second substrate 32 is provided with an opening 71 a that exposes the terminal portion 16 a of the first substrate 31. An anisotropic conductive film (ACF) 33 is disposed on the terminal portion 16 a of the first substrate 31, and the relay substrate 17 a is mounted through the opening 71 a of the second substrate 32. The surface excluding the connection portion of the relay substrate 17a is insulative and is covered with a protective film such as polyimide or solder resist, for example, and the adhesion between the adhesive layers 21b and 22b of the resin films 21 and 22 and the protective film is improved. In order to ensure, intermediate adhesive layers 34 and 35 showing adhesiveness are provided at both interfaces.

  The display unit 13 having such a configuration is a so-called sheet shape (plate shape), and the display surface can be curved by following external stress to some extent.

  Since the display panel 12 includes the organic EL element 23 having a top emission structure, it is not necessary to extract light from the first substrate 31 side. Therefore, the resin film 22 covering the first substrate 31 does not have to be transparent, and may be an opaque resin film provided with a heat conductor such as a metal thin film that can be laminated. The heat conductor can dissipate heat generated by the light emission of the organic EL element 23.

  FIG. 3 is an equivalent circuit diagram showing an electrical configuration of the organic EL device. Hereinafter, the electrical configuration of the organic EL device will be described with reference to FIG.

  As shown in FIG. 3, the organic EL device 11 includes a plurality of scanning lines 41, a plurality of signal lines 42 extending in a direction intersecting the scanning lines 41, and a plurality of power supply lines 43 extending in parallel to the signal lines 42. Are wired in a grid pattern. An area partitioned by the scanning line 41 and the signal line 42 is configured as a pixel area. The signal line 42 is connected to the signal line drive circuit 44. The scanning line 41 is connected to the scanning line driving circuit 45.

  Each pixel region holds a switching TFT (Thin Film Transistor) 46 to which a scanning signal is supplied to the gate electrode via the scanning line 41 and a pixel signal supplied from the signal line 42 via the switching TFT 46. A holding capacitor 47 and a driving TFT 48 (hereinafter referred to as “TFT element 48”) to which a pixel signal held by the holding capacitor 47 is supplied to the gate electrode are provided. Further, in each pixel region, when electrically connected to the power supply line 43 via the TFT element 48, an anode 51 and a cathode 52 into which a drive current flows from the power supply line 43, and the anode 51 and the cathode 52 are connected. A functional layer 53 sandwiched therebetween is provided.

  The organic EL device 11 includes a plurality of organic EL elements 23 including an anode 51, a cathode 52, and a functional layer 53. The organic EL device 11 includes a display area composed of a plurality of organic EL elements 23.

  According to this configuration, when the scanning line 41 is driven and the switching TFT 46 is turned on, the potential of the signal line 42 at that time is held in the holding capacitor 47, and the TFT element 48 depends on the state of the holding capacitor 47. ON / OFF state is determined. Then, a current flows from the power supply line 43 to the anode 51 through the channel of the TFT element 48, and further a current flows to the cathode 52 through the functional layer 53. The functional layer 53 emits light with a luminance corresponding to the amount of current flowing therethrough.

  FIG. 4 is a schematic cross-sectional view showing the structure of the display panel constituting the organic EL device. Hereinafter, the structure of the display panel will be described with reference to FIG. In addition, in order to show the configuration in an easy-to-understand manner, the layer thickness, dimensional ratio, angle, and the like of each component are appropriately changed.

  As shown in FIG. 4, the display panel 12 in this embodiment has a so-called top emission structure in which light emitted from the functional layer 53 is emitted from the cathode 52 side. The display panel 12 includes a first substrate 31 and a second substrate 32 disposed to face the first substrate 31.

  Examples of the first substrate 31 include a glass substrate. In the present embodiment, non-alkali glass is used as the material of the first substrate 31. The thickness of the first substrate 31 is, for example, about 30 μm. In the present embodiment, a glass substrate having a thickness of, for example, about 0.5 mm is used as the material of the first substrate 31, and after being bonded to the second substrate 32, the first substrate 31 is processed to the above-described thickness by etching.

  In addition, since the display panel 12 is a top emission type, as the material of the first substrate 31, either a light transmissive material or a non-light transmissive material may be used.

  A circuit element layer 61 is provided on the first substrate 31. The circuit element layer 61 includes a base protective film (not shown), a TFT element 48, wiring, and the like. The TFT element 48 is provided corresponding to the pixel 14.

  A planarizing layer 62 is provided on the circuit element layer 61. The flattening layer 62 relaxes unevenness on the surface due to the TFT element 48 and wiring. The planarizing layer 62 includes a reflective layer 63 so as to overlap the anode 51 in a planar manner. The reflective layer 63 is made of a metal material having light reflectivity, and is made of, for example, an aluminum alloy.

  An anode 51 is provided on the planarization layer 62. The anode 51 is made of a metal oxide conductive film having optical transparency such as ITO (Indium Thin Oxide). The material of the anode 51 may be IZO (Indium Zinc Oxide) (registered trademark). The anode 51 is electrically connected to the drain terminal of the TFT element 48 of the circuit element layer 61 for each pixel 14.

  In addition, since the display panel 12 is a top emission type, the material of the anode 51 does not necessarily have light transmittance. For example, a metal electrode made of aluminum or the like may be used. In addition, when a material that does not have optical transparency is used as the material of the anode 51, the reflective layer 63 need not be provided.

  A partition wall 64 is provided on the planarization layer 62. The partition wall 64 is made of, for example, acrylic resin and partitions the region of the pixel 14.

  A functional layer 53 is provided on the anode 51 and the partition wall 64. The functional layer 53 of the present embodiment is configured by sequentially stacking a hole injection layer, a hole transport layer, a light emitting layer, and an electron transport layer (in FIG. 4, one layer is illustrated). The hole injection layer is formed of, for example, a triarylamine (ATP) multimer. The hole transport layer is made of, for example, a triphenylamine derivative (TPD).

  The emission color of the light emitting layer is white. As the white light-emitting material, styrylamine-based light-emitting material, anthracene-based dopamine (blue), styrylamine-based light-emitting material, rubrene-based dopamine (yellow), or the like is used. The electron transport layer is formed of, for example, an aluminum quinolinol complex (Alq3). Each layer of the functional layer 53 is sequentially formed using, for example, a vacuum deposition method.

  A cathode 52 is provided on the functional layer 53. When the cathode 52 has a top emission structure as in the present embodiment, a transparent conductive material such as ITO, which is a material having optical transparency, is used. Moreover, you may make it comprise the cathode 52 with the alloy (Mg-Ag alloy) of magnesium and silver. An electron injection buffer layer made of lithium fluoride (LiF) or the like may be provided below the cathode 52.

  An electrode protective layer 65 is provided on the cathode 52 and the partition wall 64. The electrode protective layer 65 is made of, for example, a silicon compound such as silicon oxide or silicon oxynitride in consideration of light transmittance, adhesion, water resistance, gas barrier properties, and the like. Moreover, the thickness of the electrode protective layer 65 is preferably 100 nm or more, and the upper limit of the thickness is preferably 200 nm or less in order to prevent the occurrence of cracks due to the stress generated by covering the partition walls 64. The electrode protective layer 65 is formed using PVD (physical vapor deposition), CVD (chemical vapor deposition), ion plating, or the like.

  An organic buffer layer 66 is formed on the electrode protective layer 65. The organic buffer layer 66 is provided so as to fill the uneven portion of the electrode protection layer 65 formed in an uneven shape due to the influence of the shape of the partition wall 64, and the upper surface thereof is formed substantially flat.

  The organic buffer layer 66 is made of, for example, a thermosetting epoxy resin. The organic buffer layer 66 has a function of relieving stress generated by warping or deposition expansion of the first substrate 31 and the circuit element layer 61 and preventing the electrode protective layer 65 from peeling from the unstable partition wall 64. Have.

  Further, since the upper surface of the organic buffer layer 66 is substantially flattened, a gas barrier layer 67, which will be described later, made of a hard film formed on the organic buffer layer 66 is also flattened. Therefore, there is no portion where stress is concentrated, and thereby, the generation of cracks in the gas barrier layer 67 is prevented.

  The thickness of the organic buffer layer 66 is preferably about 3 μm to 5 μm. The organic buffer layer 66 is formed using, for example, a vacuum screen printing method, a slit coating method, an ink jet method, or the like.

  On the organic buffer layer 66, a gas barrier layer 67 is formed in a wide range so as to cover the organic buffer layer 66 and cover the terminal portion of the electrode protective layer 65. The gas barrier layer 67 is for preventing intrusion of oxygen and moisture, thereby suppressing deterioration of the organic EL element 23 due to oxygen and moisture. In consideration of transparency, gas barrier properties, and water resistance, the gas barrier layer 67 is preferably formed of a silicon compound containing nitrogen, that is, silicon nitride or silicon oxynitride. In the present embodiment, the first substrate 31 to the gas barrier layer 67 are referred to as “element substrate 36”. The second substrate 32 and the color filter 24 are collectively referred to as a “sealing substrate 37”.

  On the surface side of the element substrate 36 on which the organic EL element 23 is formed, that is, on the surface side on which the gas barrier layer 67 is formed, a sealing substrate 37 is disposed so as to face. The sealing substrate 37 is bonded to the gas barrier layer 67 of the element substrate 36 through the sealing material 26 and the sealing resin 25. The second substrate 32 that constitutes the sealing substrate 37 is made of, for example, inorganic glass having optical transparency. In the present embodiment, non-alkali glass is used as the material of the second substrate 32.

  The thickness of the second substrate 32 is, for example, about 30 μm. In the display panel 12, a glass substrate having a higher gas barrier property than the plastic substrate is used for the first substrate 31 and the second substrate 32, and flexibility is imparted by reducing the thickness of these glass substrates. Yes.

  The sealing material 26 is disposed in a non-display area between the first substrate 31 and the second substrate 32, and is provided in a frame shape along the outer periphery of the first substrate 31 (second substrate 32). The sealing material 26 is made of a material having a low moisture permeability. As the material of the sealing material 26, for example, a highly adhesive adhesive in which an acid anhydride is added as a curing agent to an epoxy resin and a silane coupling agent is added as an accelerator can be used.

  The sealing resin 25 is provided so as to fill the region surrounded by the element substrate 36, the sealing substrate 37, and the sealing material 26 without any gap. The sealing resin 25 is made of a highly light-transmitting resin such as acrylic, epoxy, or urethane. In view of heat resistance and water resistance, it is preferable to use an epoxy resin as the material of the sealing resin 25.

  The color filter 24 is provided on the organic EL element 23 side of the second substrate 32. The color filter 24 includes a color filter 24R corresponding to red (R) light, a color filter 24G corresponding to green (G) light, and a color filter 24B corresponding to blue (B) light. If the colors to be used are not distinguished, they are also simply called color filters 24). The color filter 24 is provided so as to overlap the organic EL element 23 in plan view.

  A light shielding layer 68 is provided so as to partition the color filters 24R, 24G, and 24B. The light shielding layer 68 is disposed so as to correspond to the partition wall 64. The light shielding layer 68 is made of a material having a light shielding property, and is made of, for example, Cr (chromium). An overcoat layer may be provided so as to cover the color filter 24 and the light shielding layer 68.

  The display panel 12 includes a pixel 14R that emits red light, a pixel 14G that emits green light, and a pixel 14B that emits blue light. Call). The color filters 24R, 24G, 24B are arranged corresponding to the pixels 14R, 14G, 14B.

  The white light emitted by the organic EL element 23 passes through the color filters 24R, 24G, and 24B, so that light of three different colors R, G, and B is emitted from the pixels 14R, 14G, and 14B. One pixel group is configured by the pixels 14R, 14G, and 14B, and various colors can be displayed by appropriately changing the luminance of the pixels 14R, 14G, and 14B in each pixel group. Therefore, a display panel capable of full color display or full color light emission can be provided.

  In the display panel 12, light emitted from the functional layer 53 to the cathode 52 side is emitted to the observation side. Further, the light emitted from the functional layer 53 to the anode 51 side is reflected by the reflective layer 63 and emitted to the observation side.

<Structure of electro-optical panel>
FIG. 5 is a schematic plan view showing a structure of a display panel as an electro-optical panel constituting the organic EL device. 6 is a schematic cross-sectional view taken along the line BB ′ of the display panel shown in FIG. Hereinafter, the configuration of the display panel will be described with reference to FIGS.

  As shown in FIGS. 5 and 6, in the display panel 12, a first substrate 31 and a second substrate 32 having substantially the same size are bonded to each other via a seal material 26. The sealing material 26 is provided so as to surround the display area 15. Furthermore, the sealing material 26 is provided so as to surround the periphery of the terminal portion 16 (16a, 16b, 16c). In other words, the sealing material 26 is provided between the pair of substrates (the first substrate 31 and the second substrate 32) except for the display region 15 and the terminal portion 16 region.

  As described above, the first terminal portion 16a, the second terminal portion 16b, and the third terminal portion 16c are provided on one end side of the first substrate 31. And in the area | region which planarly overlaps each terminal part 16a-16c in the 2nd board | substrate 32, the opening hole 71 (71a, 71b, 71c) as an opening part opened so that the area | region of terminal part 16a-16c may be enclosed. Is provided. That is, when viewed in plan from the second substrate 32 side, the terminal portions 16a to 16c provided on the first substrate 31 are exposed. Thereby, each terminal part 16a-16c can be connected with the relay boards 17a-17c via the opening holes 71a-71c.

  As described above, the second substrate 32 is configured to have substantially the same size as the first substrate 31, and the sealing material 26 is provided around the terminal portions 16 a to 16 c in addition to the periphery of the display region 15. That is, since the sealing material 26 is provided around the pair of substrates 31 and 32, the sealing material 26 is only around the display region 15, and the region of the terminal portion 16 on the first substrate 31 is the second substrate. The strength of the display panel 12 can be improved as compared with the case of projecting from the end face of 32. In particular, the strength of the corner portions 72a and 72b in the region where the terminal portion 16 of the display panel 12 is provided can be improved.

  In addition, the sealing material 26 is preferably provided up to the end surfaces of the substrates 31 and 32 between the first substrate 31 and the second substrate 32. Since the sealing material 26 is provided up to the end surface, no gap is generated between the substrates 31 and 32, so that impurities or the like can be prevented from entering the display region 15 or the like.

  As described above in detail, according to the organic EL device 11 of the first embodiment, the following effects can be obtained.

  (1) According to the first embodiment, since the opening holes 71a to 71c are provided around the second substrate 32 including the area overlapping the terminal portions 16a to 16c in plan view, the first substrate having the terminal portion 16 is provided. Even if the second substrate 32 is stacked on the substrate 31, the relay substrates 17a to 17c can be connected to the terminal portions 16a to 16c. In addition to the periphery of the display region 15, the strength of the periphery of the terminal portion 16 can be improved by providing the sealing material 26 around the terminal portions 16 a to 16 c.

  (2) According to the first embodiment, since the size of the first substrate 31 and the second substrate 32 is the same, compared to the case where the first substrate 31 protrudes from the second substrate 32 by the region of the terminal portion 16. Thus, the strength of the corner portions 72a and 72b and the end face can be improved in the region of the terminal portion 16 after joining.

  (3) According to the first embodiment, since the display panel 12 is laminated with the resin films 21 and 22, the strength of the display panel 12 can be reinforced. Moreover, since it laminates with the resin films 21 and 22, it can prevent that the broken material scatters when the display panel 12 is damaged.

(Second Embodiment)
<Method of manufacturing electro-optical device>
FIG. 7 is a flowchart showing a method for manufacturing an organic EL device as a method for manufacturing an electro-optical device. 8 to 10 are schematic plan views illustrating a part of the method for manufacturing the organic EL device. FIG. 11 is a schematic view illustrating a part of the method for manufacturing the organic EL device. Hereinafter, a method for manufacturing the organic EL device will be described with reference to FIGS. In the present embodiment, a method for cutting out one display panel from a mother substrate will be described.

  As shown in FIG. 7, in step S <b> 11, the pixel 14 is formed on the first substrate 31. Specifically, as shown in FIG. 4, a circuit element layer 61, a partition wall 64, an anode 51, a functional layer 53 including a light emitting layer, a cathode 52, and the like are formed on the first substrate 31. In FIG. 4, some of these components are omitted.

  In step S12, thin film sealing is performed on the pixels 14 on the first substrate 31 (see FIG. 4). Specifically, an electrode protective layer 65, an organic buffer layer 66, and a gas barrier layer 67 are formed so as to cover the pixels 14. This step can be performed using various film forming methods and patterning methods such as plasma CVD, sputtering, vapor deposition, droplet discharge, and various etching methods.

  In step S13 (application process), the sealing material 26 is formed on the first substrate 31 on the side where the pixels 14 are formed. Specifically, this will be described with reference to FIG. The pixels 14 and the like described above are formed on the first mother substrate 12a '. First, as shown in FIG. 8, a sealing material 26 is applied around the display area 15 and around the terminal portions 16a to 16c in the first mother substrate 12a '. Thereby, the sealing material 26 is applied over the entire periphery of the region to be the first substrate 31. In addition, the broken line in FIG. 8 has shown the outer periphery shape used as the display panel 12 (1st board | substrate 31) later.

  As the sealing material 26, for example, an epoxy adhesive is used. As a method for forming the sealing material 26, for example, the sealing material 26 made of an ultraviolet curable resin is applied onto the first mother substrate 12a 'by a dispenser application method (screen printing method) or the like. In addition, a spacer is mixed in the sealing material 26.

  In step S14, the sealing resin 25 is applied to the region (display region 15) surrounded by the sealing material 26 on the first mother substrate 12a '. In detail, the sealing resin 25 made of a thermosetting resin is applied on the first mother substrate 12a 'by a dispenser application method or a droplet discharge method. Further, as the sealing resin 25, a resin that becomes transparent after curing is used. Thus, the element substrate 36 side is completed.

  In step S21, the color filter 24 and the light shielding layer 68 are formed on the mother substrate (second mother glass substrate) on which the second substrate 32 is provided, and the sealing substrate 37 side is completed.

  In step S31 (sticking step), the element substrate 36 (mother substrate) and the sealing substrate 37 (mother substrate) are bonded together with the sealing material 26 and the sealing resin 25 interposed therebetween. Specifically, contact and pressure bonding are performed in a state where the element substrate 36 and the sealing substrate 37 are aligned (positioned) in a reduced pressure environment. At this time, the element substrate 36 and the sealing substrate 37 are supported by a spacer included in the sealing material 26 and are bonded together with a certain interval.

  In step S32, the sealing material 26 is cured. Specifically, the sealing material 26 is cured by irradiating the sealing material 26 made of an ultraviolet curable resin with ultraviolet rays from the sealing substrate 37 side.

  In step S33, the sealing resin 25 is cured. Specifically, the sealing resin 25 is cured by performing a heat treatment on the sealing resin 25 made of a thermosetting resin. As a heat treatment method, for example, a method of heating the element substrate 36 and the sealing substrate 37 after bonding in a baking furnace can be used.

  In step S34, the first substrate 31 and the second substrate 32 are etched to reduce the thickness to a predetermined thickness, for example, about 30 μm. As the etchant, for example, an aqueous solution in which hydrofluoric acid (hydrofluoric acid) is diluted is used. The etching solution may be an aqueous solution of hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid or the like. In the etching method, the first substrate 31 and the second substrate 32 may be immersed in an etching solution, or the etching solution may be showered (sprayed). Note that the substrate in this state is referred to as a display panel precursor 12a.

  In step S35 (cutting step), the display panel precursor 12a is cut along a cutting line corresponding to the shape of the display panel 12 and separated into pieces (cut out the display panel 12), and the terminal portion 16a on the second substrate 32 is cut. Cut around the area that overlaps ~ 16c. Specifically, this will be described with reference to FIG. First, as shown in FIG. 9, it cut | disconnects along the outer periphery shape used as the display panel 12 from the display panel precursor 12a. As a cutting method, for example, a laser cutting method is used. Then, the circumference | surroundings of the area | region which overlaps planarly with the terminal parts 16a-16c provided in the 1st board | substrate 31 in the 2nd board | substrate 32 are cut | disconnected, and the 1st opening hole 71a-the 3rd opening hole 71c are formed.

  The cutting conditions by the laser cutting method are as follows, for example. The laser is a UV laser (wavelength: 266 nm). The light source is an excimer laser. The frequency is 50 kHz. The laser output is 1W. The scanning speed is 30 mm / s. In addition, when cut | disconnecting the 1st opening hole 71a-the 3rd opening hole 71c in the 2nd board | substrate 32, a laser output is 0.75W, for example. Thus, the display panel 12 as shown in FIG. 10 is cut out from the display panel precursor 12a.

  As described above, the sealing material 26 is applied around the display area 15 on the first substrate 31, and the sealing material 26 is applied also to the areas around the terminal portions 16 a to 16 c so as to have the same size as the first substrate 31. Since the second substrate 32 is bonded, the region around the terminal portions 16a to 16c can be held between the pair of substrates 31 and 32, and the strength around the terminal portions 16a to 16c can be improved.

  In step S36, the relay boards 17a, 17b, and 17c are connected to the terminal portions 16a, 16b, and 16c provided on the first board 31 (see FIGS. 1 and 2). More specifically, for connection between the terminal portions 16a to 16c and the relay substrates 17a to 17c, the anisotropic conductive film 33 is disposed in the opening holes 71a to 71c formed in the second substrate 32, and anisotropic conductive This is done via the membrane 33.

  In step S37 (lamination step), the display panel 12 is laminated. Specifically, for example, as shown in FIG. 11A, the respective members are put in a stacked state and set in the laminating apparatus 75. Specifically, the display panel 12 and the resin film 21 (see FIG. 2) are stacked on the resin film 22 and set in the laminator 75. In FIG. 11, only the pressure roller 76 of the laminating apparatus 75 is illustrated.

  Next, as shown in FIG.11 (b), it pressurizes from the side shown by the arrow, and it heats and crimps | bonds it in the range of 80 to 120 degreeC. In the portion sandwiched between the pressure rollers 76, the resin films 21 and 22 are melted by the heat of the rollers, and are further pressurized and bonded to each other. As a method of thermocompression bonding, a method using a hot plate type parallel plate or a pair of heat and pressure rollers is preferable. Further, a vacuum pressure bonding apparatus may be used. Thus, the organic EL device 11 is completed.

  As described above in detail, according to the method for manufacturing the organic EL device 11 of the second embodiment, the following effects can be obtained.

  (4) According to the second embodiment, in the cutting step (step S35), the region overlapping the terminal portions 16a to 16c in the second substrate 32 is cut, so that the terminal portion 16 is bonded by the bonding step (step S31). Even if the second substrate 32 is overlapped on the first substrate 31 having the above, the relay substrates 17a to 17c can be connected to the terminal portions 16a to 16c. Moreover, since the sealing material 26 is applied to the periphery of the terminal portions 16a to 16c in addition to the periphery of the display region 15 in the sealing material forming step (step S13), the strength of the periphery of the terminal portions 16a to 16c can be improved. it can.

(Third embodiment)
<Electronic equipment>
FIG. 12 is a schematic perspective view schematically showing a configuration of a display and an information portable terminal as an example of an electronic apparatus including the display panel according to the present invention. Hereinafter, configurations of the display and the portable information terminal will be described with reference to FIG.

  As shown in FIG. 12A, the display 81 is a book-type display using the above-described organic EL device 11 of the first embodiment as electronic papers 82 and 83 which are display units. The display 81 is provided with a hinge portion 84 provided with a connector (not shown) that can be connected to the wiring portion of the organic EL device 11 at a portion corresponding to a book binding margin.

  A connector is attached to the hinge portion 84 so as to be rotatable about a rotation axis, and the connected electronic paper 82 and 83 can be rolled like normal paper. A plurality of electronic papers 82 and 83 may be detachably connected to the hinge portion 84. Thereby, it is possible to provide a display 81 that can carry as many electronic papers 82 and 83 as necessary (like a loose leaf).

  As illustrated in FIG. 12B, a personal digital assistant (PDA) 91 includes a main body 94 having a plurality of operation buttons 92 and a display unit 93. The main body 94 has a size that fits in the palm of the hand, and the display unit 93 includes the organic EL device 11 as the electro-optical device of the first embodiment. By operating a plurality of operation buttons 92, various types of information such as an address book and a schedule book can be displayed on the display unit 93. Since the organic EL device 11 which is a thin and self-luminous display device is mounted, the main body 94 can be configured to be thinner. That is, a small and thin portable information terminal 91 can be provided.

  Further, since the display panel 12 is sealed with the resin films 21 and 22, for example, even if the portable information terminal 91 is accidentally dropped, the display panel 12 is hardly damaged by an external impact. Even if it is broken, a safe portable information terminal 91 is realized in which fragments of the display panel 12 are not scattered.

  The electronic device on which the organic EL device 11 can be mounted is not limited to the book-type display 81 and the portable information terminal 91 described above, and can be mounted on various electronic devices. For example, a personal computer, a digital still camera, a digital video camera, a DVD viewer, an in-vehicle display such as a car navigation device, an electronic notebook, a POS terminal, an audio device, an electronic advertisement medium called a digital signage, and the like.

  As described above in detail, according to the electronic device of the third embodiment, the following effects can be obtained.

  (5) According to the third embodiment, by providing the organic EL device 11 described above, it is possible to provide an electronic apparatus having a substrate structure that is not easily damaged.

  In addition, embodiment is not limited above, It can also implement with the following forms.

(Modification 1)
As described above, the present invention is not limited to providing the sealing material 26 so as to surround the periphery of the terminal portions 16a to 16c. 13 to 15 are schematic plan views showing the structure of a display panel according to a modification. For example, sealing materials 126, 226, and 326 may be provided as in the display panels 112, 212, and 312 shown in FIGS.

  The display panel 112 shown in FIG. 13 has three terminal portions 16a to 16c arranged side by side on one end side of the display panel 112, as in the first embodiment. The sealing material 126 is provided around the display area 15 and is provided so as to surround the entire three terminal portions 16a to 16c. In addition, an opening hole 171 is provided in the second substrate 32 along the shape of the sealing material 126 provided in the region of the terminal portion 16. According to this, although the sealing material 126 is not provided between the terminal portions 16a to 16c, the first side 112a, the second side 112b, and the third side of the display panel 112 so as to surround the entire three terminal portions 16a to 16c. Since the sealing material 126 is disposed up to the side 112c, the strength of the end surface (sides 112a to 112c) of the display panel 112 and the corner portions 172a and 172b can be improved. Moreover, the application amount of the sealing material 126 can be reduced as compared with the display panel 12 of the first embodiment.

  As in the first embodiment, the display panel 212 shown in FIG. 14 has three terminal portions 16a to 16c arranged side by side on one end side of the display panel 212. The sealing material 226 is provided around the display area 15 and around the three sides of each of the terminal portions 16a to 16c. Specifically, a region without the sealing material 226 extends from one side of each of the terminal portions 16 a to 16 c to the first side 212 a of the display panel 212. That is, the sealing material 226 is provided along the shape of the relay boards 17a to 17c connected to the terminal portions 16a to 16c. In addition, three cutout portions 271a, 271b, and 271c are provided on the second substrate 32 along the shape of the sealing material 226 provided in the region of the terminal portions 16a to 16c.

  According to this, since the sealing material 226 is provided between the corner portions 272a and 272b of the first side 212a of the display panel 212 and the terminal portions 16a to 16c, the sealing material is provided only around the display area 15. Compared with the case where it is provided, the strength of the corner portions 272a and 272b and the end face (first side 212a) of the display panel 212 can be improved. Further, the sealing material 226 and the cutout portions 271a to 271c are provided along the shape of the relay substrates 17a to 17c, and the relay substrates 17a to 17c can be directly arranged and joined to the first substrate 31, so that the terminal portion 16a. It is easy to connect the relay boards 17a to 17c to .about.16c.

  The display panel 312 shown in FIG. 15 has three terminal portions 16a to 16c arranged side by side on one end side of the display panel 312 as in the first embodiment. The sealing material 326 is provided around the display area 15 and is provided along the second side 312b and the third side 312c of the area where the terminal portion 16 is provided. In addition, a notch 371 is provided in the second substrate 32 along the shape of the sealing material 326 provided around the terminal portion 16.

  According to this, since the sealing material 326 is provided along the second side 312b and the third side 312c in the display panel 312, compared with the case where the sealing material is provided only around the display region 15. In addition, the strength of the corner portions 372a and 372b and the end surfaces (sides 312b and 312c) of the display panel 312 can be improved. Furthermore, since the notch 371 is largely provided from the region overlapping the terminal 16 on the second substrate 32 to the first side 312a, it is easy to connect the relay boards 17a to 17c to the terminals 16a to 16c. be able to. In addition, the application amount of the sealing material 326 can be reduced.

(Modification 2)
As described above, the present invention is not limited to connecting the three relay boards 17a to 17c to the display panel 12. FIG. 16 is a schematic plan view showing a configuration of a modified organic EL device. For example, IC chips 417a and 417b for driving the display panel 412 are mounted on the two terminal portions 16a and 16b of the organic EL device (display panel 412) shown in FIG. 16 (COG: Chip On Glass), and the rest The relay substrate 17c may be connected to one terminal portion 16c. According to this, connection with the outside (a display control part etc.) can be performed by one relay board 17c.

(Modification 3)
As described above, the present invention is not limited to being applied to a top emission type organic EL device, and may be applied to, for example, a bottom emission type organic EL device.

(Modification 4)
The electro-optical device to which the present invention is applied is not limited to the organic EL device 11 described above, and may be a liquid crystal device, a plasma display, electronic paper, or the like.

  DESCRIPTION OF SYMBOLS 11 ... Organic EL device as an electro-optical device, 12, 112, 212, 312, 412 ... Display panel as an electro-optical panel, 12a ... Display panel precursor, 12a '... First mother substrate, 13 ... Display unit, 14 , 14R, 14G, 14B ... pixels, 15 ... display area as element area, 16, 16a, 16b, 16c ... terminal part, 17a, 17b, 17c ... relay board, 21, 22 ... resin film, 21a, 22a ... base Material film, 21b, 22b ... Adhesive layer, 23 ... Organic EL element as electro-optical element, 24, 24R, 24G, 24B ... Color filter, 25 ... Sealing resin, 26, 126, 226, 326 ... Sealing material, 27 , 28 ... Space, 29 ... Part of the sealing resin, 31 ... First substrate, 32 ... Second substrate, 33 ... Anisotropic conductive film, 34, 35 ... Intermediate adhesive layer, 36 ... Elementary Substrate 37 ... Sealing substrate 41 ... Scanning line 42 ... Signal line 43 ... Power supply line 44 ... Signal line driving circuit 45 ... Scanning line driving circuit 46 ... Switching TFT 47 ... Holding capacitor 48 ... TFT element 51... Anode 52. Cathode 53. Functional layer 61. Circuit element layer 62 Flattening layer 63 Reflecting layer 64 Partition 50 65 Electrode protective layer 66 Organic buffer layer 67 ... Gas barrier layer, 68 ... Light shielding layer, 71, 71a, 71b, 71c, 171 ... Opening hole as opening, 72a, 72b, 172a, 172b, 272a, 272b, 372a, 372b ... Corner, 75 ... Laminating apparatus 76 ... Pressure roller, 81 ... Display, 82, 83 ... Electronic paper, 84 ... Hinge part, 112a, 112b, 112c, 212a, 312a, 312b, 312c ... Side 271a, 271b, 271c, 371 ... cut-out portion, 417a, 417b ... IC chip.

Claims (15)

A first substrate comprising: an electro-optic element; and a terminal portion including a terminal electrically connected to the electro-optic element;
A sealant provided around at least a part of the periphery of the element region where the electro-optical element is provided and around the terminal portion;
A second substrate disposed opposite to the first substrate via the sealing material and provided with an opening or a notch in a region overlapping the terminal portion in plan view;
An electro-optical device having an electro-optical panel. The electro-optical device according to claim 1,
The electro-optical device, wherein the first substrate and the second substrate have substantially the same size. The electro-optical device according to claim 1 or 2,
The electro-optical device, wherein the sealing material is provided around the element region and at a corner portion of the first substrate on which the terminal portion is provided. An electro-optical device according to any one of claims 1 to 3,
The first substrate is provided with a terminal portion,
The electro-optical device, wherein the sealing material is provided so as to surround the terminal portion. An electro-optical device according to any one of claims 1 to 3,
The first substrate is provided with a plurality of terminal portions,
The electro-optical device, wherein the sealing material is provided so as to surround at least two of the plurality of terminal portions. The electro-optical device according to claim 5,
The electro-optical device, wherein the opening or the notch is provided so as to surround at least two of the plurality of terminal portions in a plan view. The electro-optical device according to any one of claims 1 to 6,
The electro-optical panel has a thickness of 100 μm or less,
The electro-optical device is characterized in that at least one of the electro-optical panels is sandwiched and laminated between a pair of transparent resin films. A method of manufacturing an electro-optical device having an electro-optical panel, comprising: a first substrate provided with an electro-optical element and a terminal portion; and a second substrate disposed opposite to the first substrate with a sealant interposed therebetween. And
An application step of applying a sealing material to the periphery of the element region where the electro-optical element is provided on the first substrate, and to at least a part of the periphery of the terminal portion;
An attaching step of attaching the second substrate to the first substrate so as to face the first substrate through the sealing material;
A cutting step in which the terminal portion is exposed by cutting a region overlapping the terminal portion in the second substrate;
A method for manufacturing an electro-optical device. A method for manufacturing an electro-optical device according to claim 8,
The method of manufacturing an electro-optical device, wherein in the coating step, the sealing material is applied to a periphery of the element region and a corner portion of the first substrate on which the terminal portion is provided. A method of manufacturing the electro-optical device according to claim 8 or 9,
In the coating process, the sealing material is coated so as to surround the terminal portion of the first substrate. A method for manufacturing an electro-optical device according to any one of claims 8 to 10,
The first substrate is provided with a terminal portion,
In the coating step, the sealing material is coated so as to surround the terminal portion. A method for manufacturing an electro-optical device according to any one of claims 8 to 10,
The first substrate is provided with a plurality of terminal portions,
In the coating step, the sealing material is coated so as to surround at least two of the plurality of terminal portions. A method of manufacturing an electro-optical device according to claim 12,
The method of manufacturing an electro-optical device, wherein the cutting step includes cutting so that at least two of the plurality of terminal portions are exposed in a plan view. A method of manufacturing an electro-optical device according to any one of claims 8 to 13,
The electro-optical panel has a thickness of 100 μm or less,
A method for manufacturing an electro-optical device, comprising: a laminating step of laminating the electro-optical panel between a pair of resin films, at least one of which is transparent.   An electronic apparatus comprising the electro-optical device according to claim 1.

Images