JP2011102768A - Measuring method of heat characteristic - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress heat radiation from a measuring system using a simple method and match the passage heat flux on the sample high-temperature side with that on the low-temperature side in a method of measuring the heat characteristic such as thermal conductivity or contact thermal resistance in a stationary temperature field. <P>SOLUTION: Protective heating members are arranged at a constant interval while it does not abut on holding members, parallel to the main heat flow direction in the holding members for gripping a sample to be measured. The control temperature of a low-temperature side protective heating member and the longitudinal center temperature of the low-temperature side holding member are controlled equally. The passage heat flux on the high temperature side is compared with that on the low temperature side. When the passage heat flux on the high temperature side is large, the control temperature of the high-temperature side protective heating member is increased. When the passage heat flux on the low temperature side is large, the control temperature of the high-temperature side protective heating member is decreased. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for measuring thermal conductivity or contact thermal resistance by a steady method.

  In recent years, demands for energy saving of various devices are increasing, and there is a demand for a design in which members are effectively arranged at a place where heat should be transmitted and a place where heat should be blocked. For this reason, it has become very important to know the thermal characteristics of the members used. In particular, the thermal conductivity is an index representing the ease of heat transfer, and there is a high demand for measurement. In addition, as in the evaluation of heat transfer characteristics of heat transfer grease in electronic devices, measurement of contact thermal resistance of contact surfaces between members is also an important issue.

  Methods for measuring the thermal properties of materials have been extensively studied and various methods have been proposed. Broadly speaking, it can be classified into a stationary method in which the temperature field including the sample and the measurement system is kept constant over time and a non-stationary method in which measurement is performed using the transient temperature response of the sample. The steady method includes a flat plate direct method, a heat flow meter method, and a flat plate comparison method.

When the thermal conductivity is measured by a steady method, the heat flux q passing through the sample is measured in a state where a temperature difference ΔT is given to both surfaces of the sample. The thermal resistance R is obtained using the measured heat flux q and (Equation 1).
R = ΔT / q (Formula 1)
Further, the thermal conductivity λ of the sample is calculated using (Expression 2) with respect to the sample thickness d.
λ = d / R = d · q / ΔT (Formula 2)
This is a direct use of Fourier's law in heat conduction. Further, ΔT and q are similarly determined by overlapping two samples, and the thermal resistance in a state where the two samples are overlapped can also be obtained. The contact thermal resistance between two samples can be obtained by subtracting the thermal resistance of individual samples from the thermal resistance of the entire two samples.

  On the other hand, thin wire heating method (or hot wire method), flash method, and periodic heating method are classified as unsteady methods, and the measured value of flash method and periodic heating method is thermal diffusivity. The thermal conductivity is calculated using the thermal diffusivity, specific heat, and density. Since the measurement of specific heat and density requires another measuring device and is expensive, it is preferable to directly measure the thermal conductivity.

  The fine wire heating method can directly measure the thermal conductivity based on the temperature change of the heat generating part when heat is transferred from the fine wire-shaped heating element to the surrounding sample. However, if the temperature change centered on the thin line is disturbed by the influence of the interface with the outside, the measurement accuracy deteriorates. For the same reason, the measurement of contact thermal resistance requires a significant correction of the principle formula.

  From the above, the steady method that can measure the thermal conductivity and the contact thermal resistance in the same apparatus is an effective measurement method.

  As shown in FIG. 3, the flat plate comparison method, which is one of the steady methods, sandwiches the sample to be measured 40 between holding members 11a and 11b having a known thermal conductivity and holds the holding member 11a at a relatively high temperature. By maintaining 11b at a relatively low temperature, a heat flow is generated in the holding member and the sample to be measured. By giving a temperature difference ΔT to both ends of the sample and obtaining the heat flux q from the temperature distribution in the holding member, the thermal conductivity can be obtained from (Equation 2). Here, if heat is released from the holding member or the sample surface, the heat flux passing through the sample cannot be accurately estimated, and the thermal conductivity cannot be obtained.

  Therefore, as a means for suppressing the heat radiation from the periphery of the sample to be measured, one in which the environment is evacuated and the heat insulating member around the sample is auxiliary heated is considered (Patent Document 1). After the sample is placed in the vacuum chamber, the side surface of the sample is surrounded by a heat insulating member. When a temperature difference is given to both ends of the sample, a temperature distribution is generated in the sample. At this time, by using the external auxiliary heating device to generate a temperature distribution in the heat insulating member that is substantially the same as the temperature distribution generated in the sample, the temperature difference between the opposing surfaces of the sample and the heat insulating member is reduced, and heat dissipation is suppressed Yes.

  In addition, as a method for performing measurement while suppressing heat dissipation in the atmosphere, a structure that suppresses convection around the sample and a structure in which a plurality of compensation heaters are provided around the holding member and the sample are also considered (Patent Document 2). ). FIG. 6 is a schematic diagram of a thermal conductivity measuring device disclosed in Patent Document 2. The sample 40 and the sample holding member 11 are arranged vertically, and a temperature sensor 62 is provided at a position where the sample holding member and the protective heating unit 61 provided around the holding member face each other. A plurality of temperature measurement points of the holding member are provided in the direction of the main heat flow in order to obtain the heat flux from the temperature distribution of the holding member. Further, the protection heating unit includes a compensation heater 63, and controls the temperature of the compensation heater so that the temperatures of the holding member and the protection heating unit facing each other become equal. Moreover, in order to control the temperature of a some compensation heater independently, the compensation heaters have the structure insulated. Further, the compensation heater and the holding member are not in direct contact with each other, and the clearance between the holding member and the compensation heater portion is subdivided in the height direction by the fin-like heat insulating material 64 in contact with the holding member in order to suppress convection of the gap. It has a structure.

Special registration 02832334 Japanese Unexamined Patent Publication No. 2006-145446

  However, in the method described in Patent Document 1, a technique for measuring the thermal conductivity in a vacuum chamber is disclosed, but equipment such as a vacuum chamber and a vacuum pump is required, and the measurement becomes large. Moreover, in the method of patent document 2, although heat conductivity and contact thermal resistance can be measured in air | atmosphere, the heat insulation fin which reduces the air convection between a measurement part and a thermal radiation suppression part is provided. Such measures are complex in structure and costly. In addition, since a large number of heater temperatures are controlled independently, the control is complicated, and it takes time to calibrate a large number of temperature sensors.

  Furthermore, both the protective heating methods described in Patent Document 1 and Patent Document 2 control the temperature of the opposing surfaces of the sample and the protective heating unit equally to suppress the generation of heat radiation from the sample and the holding member. However, it is very difficult to match the heat flux q shown in FIG. 3 in the holding members on both sides of the sample.

  Therefore, an object of the present invention is to provide a method for measuring thermal characteristics such as thermal conductivity and contact thermal resistance by actively matching the heat flux q in the holding member on the high temperature side and the low temperature side.

  In order to achieve the above object, in the present invention, a first holding member and a second holding member for holding a sample to be measured, and a surface for holding the sample to be measured of the first holding member and the second holding member. The first and second main heating means are disposed on the end surface opposite to the first and provide a temperature difference between the first holding member and the second holding member, and the first holding member and the second holding member. First and second protective heating means disposed around the member for controlling the temperature of the first holding member and the second holding member, and the heat flux q1 and the second passing through the first holding member Heat having means for measuring the heat flux q2 passing through the holding member, and control means for controlling the temperature of the first and second protective heating means so that the measured heat flux q1 and heat flux q2 are equal. A characteristic measurement device is provided.

  Further, the sample to be measured is sandwiched between the first holding member and the second holding member, and the first holding member and the second holding member are arranged on a surface opposite to the end surface that sandwiches the sample to be measured. The first and second main heating means heat the first holding member and the second holding member to provide a temperature difference between the first holding member and the second holding member. The heat flux q1 passing through the first holding member and the heat flow passing through the second holding member are the temperatures of the first and second protective heating means disposed around the holding member and the second holding member. The bundle q2 is controlled to be equal, and the thermal characteristics of the sample to be measured are calculated from the temperatures of the first holding member and the second holding member and the heat flux q1 or q2 controlled to be equal. A method for measuring thermal properties is provided.

  As described above, according to the invention of the present application, the passing heat flux on the high temperature side and the low temperature side of the sample is determined, and the control temperature of the protective heating member is determined. By performing the protective heating, the heat fluxes on the high temperature side and the low temperature side can be controlled equally. This makes it possible to measure thermal properties such as thermal conductivity or contact thermal resistance by a steady method without requiring a convection suppression method or a large number of protective heating members between the holding member and the protective heating member in the atmosphere. .

It is a figure explaining the structure of the thermal conductivity measuring apparatus concerning a 1st Example. It is a schematic diagram of the cross section perpendicular | vertical to the main heat flow direction of the thermal conductivity measuring apparatus concerning a 1st Example. It is a figure showing the measurement principle of the thermal conductivity in a stationary comparison method. It is a flowchart which shows the procedure which matches the heat flux of the high temperature side and low temperature side concerning 1st Example. It is a figure explaining the to-be-measured sample periphery part of the contact thermal resistance measuring method concerning a 2nd Example. It is a figure explaining a prior art example.

  In order to measure thermal properties such as thermal conductivity and contact thermal resistance for various samples and measurement conditions, the present inventor does not control the temperature of the holding member and the protective heating unit equally, but the sample. It was noted that it is more effective to make the heat flux q actively match on both sides of the sandwich. DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention for realizing the above will be described with reference to the drawings.

(First embodiment)
(Device configuration)
FIG. 1 is a configuration diagram of a thermal conductivity measuring apparatus according to an embodiment of the present invention. The sample 40 to be measured is sandwiched between the holding member 11a and the holding member 11b. The main heating section 12a (first main heating) is provided on the end surface opposite to the measured sample 40 of each of the holding members 11a (first holding member) and 11b (second holding member) having a known thermal conductivity (λs). Means) and 12b (second main heating means) are respectively attached. The main heating parts 12a and 12b can be controlled to a predetermined temperature. By holding the main heating parts 12a and 12b at different temperatures, a temperature distribution and a heat flux q are generated in the holding members 11a and 11b. Further, the protective heating members 13a (first protective heating means) and 13b (second protective members) arranged at regular intervals around the holding member so as to follow the main heat flow direction of the holding member represented by the arrow x in FIG. Heating means).

  A temperature distribution along the main heat flow direction x of the holding member is measured by a plurality of temperature sensors 111 provided on each of the holding members 11a and 11b. In the present embodiment, the length of the holding member is 60 mm, and the temperature sensor is provided at 5, 15, 25, and 45 mm from the end surface on the non-contact side with the main heating unit. Cooling members 14a and 14b are connected to the opposite surfaces of the main heating portions 12a and 12b connected to the holding members.

  The measuring unit 10a includes a holding member 11a, a heating unit 12a, a protective heating member 13a, and a cooling member 14a. The measuring unit 10b includes a holding member 11b, a heating unit 12b, a protective heating member 13b, and a cooling member 14b. The measuring unit 10a is connected to a pressurizing force generating mechanism 23 via a load cell 24, and can measure and control the pressurizing force. The pressurizing force generation mechanism 23 moves one measuring part in the main heat flow direction of the holding member. The pressurizing force generating mechanism is operated by means such as static load, air pressure, and spring force, and can measure thermal conductivity or contact thermal resistance with an arbitrary pressurizing force. The measurement units 10a and 10b are housed in the measurement chamber 31, and can be measured while stabilizing the environment.

  The position where the temperature sensor is disposed can be arbitrarily selected, and the end surface temperature can be directly measured by disposing it on the end surfaces of the holding members 11a and 11b on the non-connecting side. It is also possible to obtain the end face temperature by extrapolation from the outputs of a plurality of temperature sensors.

  In addition, since the measurement units 10a and 10b are vertically symmetric with respect to the sample holding unit, either the upper measurement unit 10a or the lower measurement unit 10b may be on the high temperature side. The temperature dependency of the thermal conductivity or the contact thermal resistance can be measured by appropriately adjusting the temperatures of the main heating portions on the high temperature side and the low temperature side.

  FIG. 2 shows a cross-sectional view of a plane perpendicular to the main heat flow of the measurement unit. In this embodiment, the holding member 11 has a columnar shape, and the protective heating member 13 is a split half-cylindrical member having the same central axis as the holding member 11. In this embodiment, the holding member has a cross-sectional shape of 12 mm in diameter, but can be arbitrarily determined according to the mode of the sample to be measured. The surface of the protective heating member that faces the holding member is made of the same highly heat conductive material as the holding member. In this embodiment, the holding member is made of an aluminum alloy, but copper, carbon steel, or the like can also be used.

  The protective heating member is fixed so that the distance of the space with the holding member is constant in the axial direction. In this embodiment, the distance between the protective heating member and the holding member is 0.5 mm. A temperature sensor 131 and a heating element 132 are embedded or fixed in the protective heating member. The output of the temperature sensor 131 is introduced into the temperature control device 22 and used for temperature control of the protective heating member. Although the temperature control point of each of the protective heating members on the high temperature side and the low temperature side is one point, the temperature distribution on the surface is small because the surface member has high thermal conductivity.

  A cooling means 15 capable of cooling the protective heating member is provided on the side opposite to the holding member side with the heating element of the protective heating member as a center. Although FIG. 2 shows the cooling means by refrigerant circulation, a Peltier element or the like can also be used. The cooling means can be arbitrarily operated, and the protective heating member can be cooled as required.

(Operation)
Next, the operation of each temperature control unit during measurement will be described with reference to FIG. In step S11, the sample to be measured sandwiched between the holding members gives a predetermined temperature difference to the upper and lower main heating sections and starts heating.

  In step S12, it is determined whether the temperatures in the high temperature side and low temperature side holding members are stable and have reached a steady state. In this example, when the temperature change at each temperature measurement point in the holding member was 0.2 ° C./5 minutes or less, it was determined as a steady state, but the above criteria are selected according to the measurement purpose. It is not limited to the values described in the examples.

  If the decision result in the step S12 is NO, a control temperature T4 of the low temperature side protection heating member is set equal to a predetermined temperature Tbset of the low temperature side holding member in a step S16. In this example, Tbset was set as the axially central temperature of the low temperature side holding member. By repeating Step S12 and Step S16, T4 and Tbset are controlled to substantially the same temperature during measurement. In this embodiment, the determination in step S12 is performed at 2-minute intervals.

When the determination result in step S12 is YES, in step S13, the heat flux passing through the high temperature side holding member (hereinafter referred to as high temperature side heat flux) q1 and the heat flux passing through the low temperature side holding member (hereinafter referred to as low temperature side heat flux) q2. Compare The heat flux q is calculated by (Equation 3) using the temperature distribution of the holding members 11a and 11b and the known thermal conductivity λs of the holding member.
q = −λs · (dT / dx) (Formula 3)
In this embodiment, when the ratio q2 / q1 between the low temperature side heat flux and the high temperature side heat flux is 0.99 to 1.01, it is determined that the heat flux on the high temperature side and the low temperature side are equal, but the above standard is measured. It is selected according to the purpose, and is not limited to the values described in the present embodiment.

  If the decision result in the step S13 is YES, a temperature distribution in the holding member in a steady state is recorded in a step S14, and the process ends in a step S15. When the determination result in step S13 is NO, q1 ≠ q2, and in step S17, the magnitude relationship between q1 and q2 is determined.

  When the determination result in step S17 is YES, q1> q2, and in step S18, the control temperature T3 of the high-temperature side protection heating member is increased by a predetermined temperature. In the present embodiment, the first change amount of T3 is set to 3 ° C., and the change width of T3 is reduced every time step S18 is repeated. The change width can be set arbitrarily. If the change width is reduced, the number of repetitions until the temperature stabilizes increases, but it is easy to avoid an overshoot state where q1 <q2.

  If the determination result in step S17 is false, that is, if q1 <q2, T3 is decreased by a predetermined temperature. In this embodiment, the predetermined temperature to be lowered is 0.5 ° C., but can be arbitrarily selected. It is also effective to reduce the predetermined temperature range to be lowered after the repetition of step S17 several times.

  The above determination is repeated, the temperature distributions in the high temperature side and low temperature side holding members at the time when q1 and q2 become equal are recorded, and the measurement is terminated (step S15). The thermal conductivity λ can be obtained according to the procedure of (Equation 2) by calculating ΔT and q from the temperature distribution of the holding member.

  As an example of the present invention, a sample having a diameter of 12 mm and a thickness of 2 mm was used as a sample to be measured, and the states of the high-temperature side heat flux q1 and the low-temperature side heat flux q2 were measured. In Example 1, the temperature T1 of the high temperature side main heating part 11a was controlled to 80 ° C. The main heating part on the low temperature side was not heated, and cooling water was circulated through the cooling member. The display temperature T2 of the low temperature side main heating portion 12b was stable at 25 to 26 ° C. The control temperature T3 of the high temperature protection heating member 13b was set to be 3.3 ° C. higher than the longitudinal center position temperature Taset of the high temperature side holding member. The control temperature T4 of the low-temperature side protection heating member 13b was controlled to be equal to the temperature Tbset at the longitudinal center position of the low-temperature side holding member.

  In Example 2, the temperature of the control temperature T3 of the high temperature protective heating member 13b was set 5.3 ° C. higher than the longitudinal center position temperature Taset of the high temperature side holding member 13b. Similarly, in Example 3, the temperature of the control temperature T3 of the high temperature protection heating member 13b was set 5.3 ° C. higher than the longitudinal center position temperature Taset of the high temperature side holding member 13b. The other conditions in Examples 2 and 3 are the same as in Example 1. Further, as Comparative Example 1, when heating by the protective heating member in Example 1 was not performed, as Comparative Example 2, measurement was performed when T3 was controlled to be equal to Taset. The measurement results of Examples 1, 2, and 3 and Comparative Examples 1 and 2 are shown in Table 1. Further, for each example and comparative example, the ratio q2 / q1 between the low temperature side and high temperature side heat fluxes was determined and shown in Table 1.

  In Examples 1, 2, and 3, q2 / q1 is 0.99 to 1.00, which indicates that q1 and q2 can be controlled equally by temperature control of a pair of protective heating members on the high temperature side and the low temperature side, respectively. . The heat flux q passing through the sample was determined by the average value of q1 and q2.

  On the other hand, in Comparative Example 1, q2 / q1 is 0.87, indicating that the influence of heat radiation cannot be ignored unless heating is performed by the protective heating member. In Comparative Example 2, q2 / q1 is 0.96, and q1 and q2 cannot be made equal by simply controlling the protective heating member temperature and the holding member average temperature equally.

  The result of the thermal conductivity measurement according to the embodiment of the present invention is confirmed. When a temperature difference ΔT is given to the both end faces of the holding member for the sample to be measured having a thickness d, a heat flux q is obtained. In actual measurement, as shown in FIG. 5B, a contact thermal resistance Rc exists between the sample to be measured and the holding member. In the ceramic sample used in this example, when the sample thickness is 1 mm or less, the contact thermal resistance Rc between the ceramic and the holding member affects the thermal conductivity measurement result by 10% or more.

The relationship between the contact thermal resistance Rc, the thickness d, the thermal conductivity λ, ΔT, and q is expressed by (Expression 4).
ΔT / q = 2Rc + d / λ (Formula 4)
A coefficient of Rc of 2 indicates that there are contact surfaces on both sides of the sample. In order to correct the influence of Rc on the thermal conductivity measurement, n samples S1, S2,..., Sn of the same material (thickness di, temperature difference ΔTi at both ends ΔTi, heat flux qi in the measurement of individual samples) And Rc and λ in (Equation 4) are determined by the method of least squares. At this time, the thermal conductivity λ can be obtained from (Equation 5).
λ = {(Σdi) × (Σdi) −n × Σ (di × di)} / {(Σdi) (Σ (ΔTi / qi)) − n × Σ (di × ΔTi / qi)} (Formula 5)
The result of having measured the thermal conductivity of two types of ceramics shown in Table 2 using (Formula 5) is shown. The range of the measured value is a range in which the thermal conductivity is considered to be included with a confidence interval of 95% as a result of the determination of the thermal conductivity by the least square method of (Equation 5). The measurement was performed a total of 12 times, with the ceramic 1 having a thickness of 0.5, 1, 2, 3, and 4 mm twice each twice, and the ceramic 2 having a thickness of 1, 2, 3, and 4 mm three times each.

  As described above, according to the method using a plurality of samples to be measured having different thicknesses, the difference between the measured value of the thermal conductivity of the ceramic member having a known thermal conductivity and the literature value is within 7%.

  According to the above embodiment, by performing temperature control using the protective heating member having one temperature control point for each of the high temperature side and low temperature side holding members, the high temperature side and low temperature side of the sample to be measured are controlled. The heat flux can be controlled equally. Thereby, thermal conductivity can be measured without using a complicated convection suppression means or a heat dissipation suppression method between the holding member and the protective heating member.

  It is also possible to measure contact thermal resistance using the thermal conductivity measuring device shown in FIG. Hereinafter, a method for measuring contact thermal resistance using the thermal conductivity measurement method shown in FIG. 1 will be described with reference to FIG.

As shown in FIG. 5A, when the holding members are brought into contact with each other and a temperature difference is given to the main heating portion, the temperature difference ΔT of the holding member contact surface, the passing heat flux q, and the contact thermal resistance Rc are ( Similar to Equation 1), it can be obtained from Equation 6.
Rc = ΔT / q (Formula 6)
According to the said structure, the difference in contact thermal resistance can be measured by changing the surface shape of a holding member. In addition, it is possible to apply a heat conductive grease to the surface of the holding member and use it for evaluating heat transfer properties of the grease.

  Further, it is possible to measure the contact thermal resistance by sandwiching the sample to be measured according to the following procedure. As shown in FIG. 5B, ΔT, q, thermal conductivity λ, thickness when the sample to be measured (thermal conductivity λ, thickness d) is sandwiched between holding members 11a, 11b and heated by the main heating member. The relationship between d and the contact thermal resistance Rc is expressed by the above-described (Formula 4). If ΔT, q, λ, and d are known, the contact thermal resistance between the sample and the holding member can be calculated.

  Moreover, when calculating | requiring the contact thermal resistance between the two samples X and Y, the following procedures are followed. First, using the sample to be measured X (thermal conductivity λX, thickness dX), the sample X to be measured is held between the holding members 11a and 11b at a predetermined pressure, and held at the high temperature side at a predetermined average temperature of the sample to be measured. A temperature difference ΔTX and a heat flux qX between the end face of the member and the end face of the low temperature side holding member are measured. The sample holding state is as shown in FIG.

  Second, using the sample to be measured Y (thermal conductivity λY, thickness dY), applying a predetermined pressure and holding the sample Y by the holding member, the temperature of the sample to be measured is the same as the measurement of the sample X to be measured. The difference ΔTY and the heat flux qY are measured.

  Third, as shown in FIG. 5 (c), the measurement samples X and Y are held in series at a predetermined pressure by holding members 11a and 11b, and are the same as the measurement of the measurement samples X and Y. At the average temperature of the sample to be measured, the temperature difference ΔTZ and the heat flux qZ are measured. Here, a procedure is shown in which the measured samples X and Y are individually measured and then the measured samples X and Y are sandwiched and measured in series, but the reverse order is also conceivable.

When the contact thermal resistance does not depend on the thickness of the sample to be measured, the contact thermal resistance Rc between the sample to be measured X and the sample to be measured Y is obtained by (Equation 7).
Rc = ΔTZ / qZ− (ΔTX / qX + ΔTY / qY + dX / λX + dY / λY) / 2 (Formula 7)
The thermal conductivity of the samples X and Y to be measured can be obtained by the method described in Example 1. Alternatively, the thermal diffusivity α, the density ρ, and the specific heat c may be measured and derived by the thermal conductivity λ = α × ρ × c.

As an example, the result of measuring the contact thermal resistance of test numbers 1 to 5 shown in Table 3 is shown. The contact thermal resistance between the ceramic 1 of Example 1 and the aluminum alloy holding member was measured by applying fluorine grease between the holding member and the ceramic 1. Since only the ceramic plate is used as the sample, when (Formula 4) is deformed, the contact thermal resistance Rc is obtained by (Formula 8).
Rc = (ΔT / q−d / λ) / 2 (Formula 8)
Here, the literature value of 3.1 W / mK was used as the thermal conductivity of the ceramic. When the ceramics 1 having thicknesses of 0.5, 1, 2, 3, and 4 mm were used as samples, 1.8 to 3.7e-5 m2K / W was obtained as the contact thermal resistance between the ceramic 1 and the holding member.

DESCRIPTION OF SYMBOLS 10 Measurement part 11 Holding member 12 Main heating member 13 Protection heating member 14 Cooling member 15 Cooling member 15 for protection heating part 21 Holding member temperature measurement part 22 Temperature control device 23 Pressure generating mechanism 24 Load cell 31 Measurement chamber 40 Sample to be measured

Claims (4)

A first holding member and a second holding member that sandwich the sample to be measured;
The first holding member and the second holding member are arranged on the end surface opposite to the surface that holds the sample to be measured, and provide a temperature difference between the first holding member and the second holding member. 1, a second main heating means;
First and second protective heating means disposed around the first holding member and the second holding member and controlling the temperature of the first holding member and the second holding member;
Means for measuring the heat flux q1 passing through the first holding member and the heat flux q2 passing through the second holding member, and the first and second so that the measured heat flux q1 and heat flux q2 are equal. An apparatus for measuring thermal characteristics, comprising a control means for controlling the temperature of the two protective heating means.   2. The thermal characteristic according to claim 1, wherein the means for measuring the heat fluxes q <b> 1 and q <b> 2 are a plurality of temperature sensors arranged in the axial direction of the first holding member and the second holding member. Measuring device. The sample to be measured is sandwiched between the first holding member and the second holding member,
The first holding member and the second holding member are arranged by the first and second main heating means disposed on the opposite end surfaces of the first holding member and the second holding member to the surface that holds the sample to be measured. Heating the holding member, providing a temperature difference between the first holding member and the second holding member,
The temperature of the first and second protective heating means disposed around the first holding member and the second holding member is set to the heat flux q1 passing through the first holding member and the second holding member. Control the heat flux q2 to pass through to be equal,
The thermal characteristics of the sample to be measured are calculated from the temperature of the first holding member and the second holding member and the heat flux q1 or q2 controlled to be equal to each other. Method.   The temperature control of said 1st protection heating means and a 2nd protection heating means is performed by the temperature of the axial direction center part of a 1st holding member and a 2nd holding member. Of measuring thermal properties of

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