JP2011066718A - Imaging apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To increase the adhesive strength with an image sensor even in a structure in which the back surface of the image sensor and the side surface of a support opening are adhered.
SOLUTION: A lens unit, an image sensor 43 that matches the optical axis of the lens unit and the center normal of the light receiving surface, and a fixed frame plate 21 that fixes the image sensor 43 and couples it to the lens unit. The fixed frame plate 21 has an opening, the image sensor 43 is incorporated in the opening, and the back surface of the image sensor 43 is bonded and fixed to the inner wall of the opening of the fixed frame plate 21 by an adhesive. In addition, the four side surfaces of the opening are formed in a corrugated shape 54.
[Selection] Figure 5

Description

  The present invention relates to an imaging device including an imaging element.

  Today, there is a strong demand for miniaturization and thinning in portable imaging devices such as digital cameras and camera-equipped mobile phones, and highly integrated and high-density parts are incorporated inside. In addition, with an increase in the number of pixels of an image pickup device, the image pickup apparatus is required to have high accuracy for fixing the image pickup device to a lens barrel or the like. Therefore, in a configuration in which the image pickup device is fixed to the lens barrel, etc., and the plate (support) to which the image pickup device is bonded and fixed is screwed to the lens barrel etc., the plate is attached to the lens barrel etc. Adjust the orientation of the image sensor with respect to the plate so that the optical axis of the lens barrel and the center normal of the light receiving surface of the image sensor fixed to the plate are correctly aligned when attached. It was adhered and fixed to the plate.

  There are roughly two methods for bonding the plate (support) and the image sensor. In the first method, as disclosed in Patent Document 1 shown below, a rectangular through-hole corresponding to the outer shape (rectangular shape) of the image sensor is provided on the plate to which the image sensor is bonded and fixed. In this method, the image pickup device is fitted into the plate by fitting the image pickup device into the hole and injecting an adhesive into a gap formed between the inner wall of the through hole and the side surface portion of the image pickup device.

  In the second method, as disclosed in Patent Document 2 shown below, a through-hole smaller than the image sensor is provided in a plate to which the image sensor is bonded and fixed, and the image sensor is blocked by the bottom surface of the image sensor. In this state, the imaging element is adhered and fixed to the plate by injecting an adhesive into the through hole from the back side of the plate and curing the adhesive.

JP 2006-173890 A JP 2001-285722 A

  Compared with the method disclosed in Patent Document 2, the method disclosed in Patent Document 1 described above has a disadvantage that the amount of adhesive used for bonding the plate (support) and the image sensor is large.

  On the other hand, the method disclosed in Patent Document 2 described above can reduce the amount of adhesive used for bonding the plate (support) and the image sensor, compared to the method disclosed in Patent Document 1, There was a disadvantage that the adhesive strength was relatively weak.

  Therefore, the present invention has been made in view of the problems of the prior art as described above, and even if it is a structure in which the back surface of the imaging element is bonded and fixed to the support with an adhesive injected into the support opening, Increasing the adhesive strength with the imaging element increases reliability and improves quality, and the support can be downsized to increase the degree of freedom in the shape of the imaging device, thereby reducing the size of the imaging device. An object of the present invention is to provide an imaging device that can also contribute.

  An image pickup apparatus according to the present invention includes a lens unit, an image pickup element that matches an optical axis of the lens unit and a center normal of a light receiving surface, and a support that fixes the image pickup element and is coupled to the lens unit. An image pickup apparatus, wherein the support has an opening, the opening is disposed on a back surface of the image sensor, and the back surface of the image sensor is bonded and fixed to an inner wall of the opening of the support by an adhesive. The four side surfaces of the opening are formed in a corrugated shape.

  In the imaging device of the present invention, V-shaped recesses may be formed on the four side surfaces of the opening.

  In the imaging device of the present invention, a rectangular recess may be formed on four side surfaces of the opening.

  Furthermore, in the imaging apparatus of the present invention, semicircular concave portions may be formed on the four side surfaces of the opening.

  The adhesive may be an ultraviolet curable adhesive.

  Furthermore, in the imaging apparatus of the present invention, the support is coupled to the lens unit.

  In the imaging apparatus of the present invention, the imaging element is a CCD or a CMOS.

  According to the present invention, the back surface of the image sensor and the side surface of the opening of the support are bonded to each other. By increasing the adhesive strength with the image sensor, the reliability is improved and the quality can be improved. In addition, since the support can be reduced in size, it is possible to provide an imaging apparatus that can increase the degree of freedom of the shape of the imaging apparatus and contribute to downsizing of the imaging apparatus.

1 is an external perspective view of an image pickup apparatus (digital camera) according to an embodiment of the present invention. 1 is a perspective view showing an internal structure of an imaging apparatus (digital camera) according to an embodiment of the present invention. It is a perspective sectional view showing the composition of a lens unit and an image sensor unit according to an embodiment of the present invention. It is sectional drawing of the image pick-up element unit which concerns on the Example of this invention. It is a figure which shows an example of the side surface shape of the fixed frame board opening part which concerns on the Example of this invention. It is a figure which shows the other example of the side shape of the fixed frame board opening part which concerns on the Example of this invention.

  An imaging apparatus 10 according to an embodiment for carrying out the present invention includes a lens unit 41, an imaging element 43 that matches the optical axis of the lens unit 41 and the center normal of the light receiving surface, and a lens unit by fixing the imaging element 43. A fixed frame plate 21 to be coupled to 41, the fixed frame plate 21 has an opening, the opening is arranged on the back surface of the image sensor 43, and the back surface of the image sensor 43 is bonded to the fixed frame plate 21 by an adhesive. The image pickup apparatus is bonded and fixed to the inner wall of the opening, and the four side surfaces of the side surface of the opening are formed in a corrugated shape 54.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is an external perspective view of a digital camera 10 as an embodiment of an imaging apparatus according to the present invention, and FIG. 2 is a perspective view showing the internal structure of the digital camera 10.

  The digital camera 10 shown in FIG. 1 incorporates a lens unit including an inner zoom lens and an inner focus lens, and the first lens of the photographing lens is positioned near the upper corner of the front of the digital camera 10. A lens window 12 is provided, a flash light emission window 24 is provided so as to place a flash in the vicinity of the lens window 12, and a release button 19 is provided on the upper surface of the digital camera 10. On the back of 10 is a monitor screen, a zoom button and the like.

  As shown in FIG. 2, the digital camera 10 includes a first lens 45 that is positioned on the side of the digital camera 10 with the lens surface facing forward, and an image sensor 43 attached to the lower end. A unit 41 is built in, and a circuit board 15 and a battery 31 are built in the side of the lens unit 41.

  The lens unit 41 has an optical axis conversion element that changes the optical axis direction such as a prism by 90 degrees behind the first lens 45, and the center normal line of the light receiving surface of the image sensor 43 in the immediate vicinity of the image sensor 43. And a fixed lens or a fixed lens group, and an inner zoom lens and an inner focus lens, which are a plurality of movable lens groups, are provided between the fixed lens or the fixed lens group and the optical axis conversion element.

  The lens unit 41 moves only the zoom drive motor for driving the inner zoom lens, the zoom lead screw for moving the zoom lens in the optical axis direction by rotation of the motor, and the zoom lens only in parallel. And a focus drive motor and a focus lens drive mechanism for moving the focus lens.

  The circuit board 15 is provided with a memory card connector, a CPU for controlling the driving of the digital camera 10, and various other electronic components such as a plurality of LSIs, ICs, and memories.

  In the display unit, a liquid crystal display element and a backlight panel are overlapped and integrated, and an IC and a driver for driving the display element are incorporated.

  In this way, various parts are unitized, and the battery 31 and the flash light emission window 24 are arranged beside the lens unit 41 and the lens unit 41 is arranged vertically, so that assembly is easy and the optical path length in the lens unit 41 is Thus, the digital camera 10 having an optical zoom function in which the zoom magnification and the zoom ratio can be easily increased, the optical path length is long, and the change range of the zoom magnification and the zoom rate is increased.

  Here, the lens unit 41 and the imaging element unit 50 below the lens unit 41 will be described. FIG. 3 is a perspective sectional view of the lens unit 41 and the image sensor unit 50 coupled to the lens unit 41. As shown in FIG. 3, the imaging element unit 50 below the lens unit 41 includes a fixed frame plate 21 that is a support that supports the imaging element 43 on the back surface, and imaging that is arranged so that the imaging surface faces upward. It comprises an element 43 and a flexible printed circuit board 51 on which the image sensor 43 is mounted. Between the lens unit 41 and the image sensor unit 50, a low-pass filter 23 that reduces a false pattern in which a color that does not appear in the captured image and a fine pattern that causes moire, a low-pass filter 23, and an image sensor 43 are provided. An elastic body 30 is provided for preventing foreign matter from entering the imaging surface. In FIG. 3, the lens built in the lens unit 41 is not shown.

  FIG. 4 is a cross-sectional view in a state where the image sensor unit 50 according to the embodiment of the present invention is attached to the lens unit 41. A low-pass filter 23 is disposed below the lens unit 41, and the periphery of the low-pass filter 23 is covered below the low-pass filter 23 in order to prevent foreign matter from entering the imaging surface of the image sensor 43 and the lower surface of the low-pass filter 23. Thus, the center is opened, and the elastic body 30 in the shape of a frame is arranged.

  Under the elastic body 30, an imaging element 43 that is positioned with respect to the fixed frame plate 21 and bonded and fixed to the opening of the fixed frame plate 21 with an ultraviolet curable adhesive 52, and the imaging element 43 are mounted. A flexible printed circuit board 51 is disposed. A fixed frame plate 21 for supporting the image sensor 43 is disposed below the flexible printed circuit board 51.

  Here, positioning of the fixed frame plate 21 and the flexible printed circuit board 51 on which the image sensor 43 is mounted will be described. Since the degree of perpendicularity of the image pickup surface of the image pickup element 43 with respect to the optical axis of the lens unit 41 greatly affects the image pickup performance, the image pickup element 43 needs to be mounted in a range of an inclination error of about several tens of μm. The lens barrel 41 and the fixed frame plate 21 of the lens unit 41 can be made of metal or hard resin, so that the fixed frame plate 21 can be accurately coupled to the lens unit 41. The fixed frame plate 21 and the image sensor 43 need to be coupled with high accuracy. Therefore, when the image sensor 43 mounted on the flexible printed circuit board 51 is bonded to the fixed frame plate 21, the light receiving surface of the image sensor 43 is placed on the optical axis adjuster using an optical axis adjuster including a bonding jig (not shown). Adjust the pitch angle, roll angle, and yaw angle to be perpendicular to the optical axis, and adjust the center of the light receiving surface of the image sensor 43 so that the optical axis on the optical axis adjuster matches, The back surface of the image sensor 43 and the side surface (inner wall surface) of the opening of the fixed frame plate 21 are bonded with an ultraviolet curable adhesive 52.

  The imaging device unit 50 in which the back surface of the imaging device 43 and the opening side surface of the fixed frame plate 21 are fixed by the ultraviolet curable adhesive 52 is set at a predetermined position of the lens unit 41 and is in a direction perpendicular to the optical axis. The lens unit 41 is coupled by fastening screws 57 (described later) to the screw holes on the left and right sides of the fixed frame plate 21 while finely adjusting the position. Thus, in the digital camera 10, the perpendicularity between the optical axis of the lens unit 41 and the light receiving surface of the image sensor 43 is ensured, and the center of the light receiving surface of the image sensor 43 and the optical axis of the lens unit 41 are aligned.

  Next, each part of the image sensor unit 50 will be described in detail. FIG. 5 is a perspective view of the image sensor unit 50 according to the present invention. The image sensor unit 50 includes an image sensor 43, a flexible printed circuit board 51, and a fixed frame plate 21.

  The image sensor 43 is a CCD (Charge Coupled Device) that can capture a high-speed subject image with high pixels without distortion, and is small in size and low in manufacturing cost, or can perform parallel processing when outputting a video signal. In addition, it is a complementary metal oxide semiconductor (CMOS) that can read signals at high speed and consumes little power.

  The fixed frame plate 21 is a metal plate having an opening at the center, and has an opening bonded to the back surface of the image sensor 43. The fixed frame plate 21 is fitted into the central portion so as to surround the imaging element 43 and the flexible printed circuit board 51 below the lens unit 41 described above, and also fulfills the function of securing the rigidity of the lens unit 41.

  The opening of the fixed frame plate 21 is opened at the back surface position of the image sensor 43, and UV curing adhesive is performed by injecting a highly viscous UV curable adhesive 52 into the opening of the fixed frame plate 21 and quickly curing it. The back surface of the image sensor 43 and the side surface of the opening of the fixed frame plate 21 can be bonded and fixed without causing the agent 52 to flow into the gap on the back surface side of the image sensor.

  In adhering the image sensor 43 to the fixed frame plate 21, first, the image sensor 43 and the fixed frame plate 21 mounted on the flexible printed circuit board 51 are set in an optical axis adjuster including an adhesive jig (not shown). The pitch angle, roll angle, and yaw angle are adjusted by the optical axis adjuster so that the light receiving surface of the image sensor 43 is perpendicular to the optical axis of the optical axis adjuster, and the center of the light receiving surface of the image sensor 43 is further adjusted. And the optical axis of the optical axis adjuster are adjusted so that the optical axis is aligned, and then the image sensor 43 is bonded and fixed to the fixed frame plate 21.

  Further, the fixed frame plate 21 is provided with screw holes for coupling with the lens unit 41 described above at three places, two on the right side and one on the left side, and the screws 57 described above are attached to the three screw holes. Thus, the fixed frame plate 21 can be coupled to the lens unit 41 without rotating.

  As shown in FIG. 5, the opening in the fixed frame plate 21 has a corrugated shape 54 on the four inner walls. Thus, by making the shape of the inner walls of the four sides into the corrugated shape 54, the adhesive area between the inner wall of the opening of the fixed frame plate 21 and the ultraviolet curable adhesive 52 is increased, and the adhesive strength can be increased. . For example, when the opening inner wall shape is a straight line and when the opening inner wall shape of the fixed frame plate 21 is a corrugated shape 54 with an opening angle of 90 degrees as shown in FIG. 5 (that is, on the inner wall surface of the opening). (When a V-shaped recess is formed), the adhesion area is about 1.3 times.

  As described above, by increasing the bonding area, the bonding strength can be increased, and it is possible to prevent the image sensor 43 from being displaced due to a drop impact, the repulsive force of the elastic body 30, a change with time, and an environmental change. In addition, the increased adhesive strength can increase the degree of freedom of the shape of the digital camera 10 and contribute to downsizing.

  Further, the shape of the side surface (inner wall surface) of the opening in the fixed frame plate 21 is not limited to the corrugated shape 54 shown in FIG. 5, but, for example, a concave portion of a rectangular shape 56 as shown in FIG. The shape formed in this, and the shape by which the semicircular recessed part was formed in the one surface may be sufficient. In short, any shape that can increase the bonding area is acceptable.

  As described above, according to the present embodiment, the back surface of the image sensor 43 is bonded and fixed to the support by the adhesive injected into the support opening, and the shape of the side surface of the opening of the fixed frame plate 21 is By increasing the adhesive strength between the fixed frame plate 21 and the image sensor 43 as the corrugated shape 54, the reliability can be improved and the quality can be improved, and the fixed frame plate 21 can be downsized to reduce the size of the digital camera. It is possible to provide a digital camera 10 (imaging device) that can increase the degree of freedom of the 10 shapes and contribute to the downsizing of the digital camera 10.

  In addition, even if the side surface of the opening of the fixed frame plate 21 is formed with a rectangular 56-shaped recess, increasing the adhesive strength between the fixed frame plate 21 and the image sensor 43 increases reliability and improves quality. In addition, by providing a digital camera 10 (imaging device) that can contribute to the miniaturization of the digital camera 10 by increasing the degree of freedom of the shape of the digital camera 10 by reducing the size of the fixed frame plate 21. can do.

  Furthermore, even if a semicircular recess is formed on the side surface of the opening of the fixed frame plate 21, the adhesive strength between the fixed frame plate 21 and the image pickup device 43 is increased to improve reliability and improve quality. In addition, by providing a digital camera 10 (imaging device) that can contribute to the miniaturization of the digital camera 10 by increasing the degree of freedom of the shape of the digital camera 10 by reducing the size of the fixed frame plate 21. can do.

  Then, by bonding the fixed frame plate 21 and the image pickup element 43 with the ultraviolet curable adhesive 52, it is possible to shorten the adhesion time and to prevent the adhesive from contracting during curing.

  Further, the imaging element 43 and the fixed frame plate 21 are positioned and then bonded and fixed to form a unit, and then combined with the lens unit 41, thereby contributing to shortening of manufacturing time and yield.

  The image pickup element 43 is not limited to the CCD, and the same effect can be obtained with a CMOS.

  In addition, this invention is not limited to the above Example, A change and improvement are freely possible in the range which does not deviate from the summary of invention.

10 Digital camera (imaging device) 12 Lens window
15 Circuit board 19 Release button
21 Fixed frame plate 23 Low-pass filter
24 Flash emission window 30 Elastic body
31 Battery 41 Lens unit
43 Image sensor 45 First lens
50 Image sensor unit 51 Flexible printed circuit board
52 UV curable adhesive 54 Wave shape
56 Rectangular 57 Screw

Claims (7)

A lens unit;
An image sensor that matches the optical axis of the lens unit with the center normal of the light receiving surface;
A support that fixes the imaging device and is coupled to the lens unit;
An imaging device in which the support has an opening, the opening is disposed on the back surface of the imaging device, and the back surface of the imaging device is bonded and fixed to the inner wall of the opening of the support by an adhesive. There,
An image pickup apparatus, wherein four side surfaces of the opening are formed in a corrugated shape.   The imaging apparatus according to claim 1, wherein a V-shaped recess is formed on four side surfaces of the opening.   The imaging apparatus according to claim 1, wherein rectangular recesses are formed on four side surfaces of the opening.   The imaging apparatus according to claim 1, wherein a semicircular recess is formed on each side surface of the opening.   The imaging apparatus according to claim 1, wherein the adhesive is an ultraviolet curable adhesive.   The imaging apparatus according to claim 1, wherein the support is coupled to the lens unit. The image pickup apparatus according to claim 1, wherein the image pickup element is a CCD or a CMOS.

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