JP2011040444A - Protection member, exposure system, protection method, cleaning method, and method for manufacturing device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a protection member, an exposure system, a protection method, a cleaning method, and a method for manufacturing a device which can suppress an exposure failure. <P>SOLUTION: There are provided a liquid supply device 7 and a liquid recovery device 8 for forming a liquid immersion space LS so that at least a part of an optical path of an exposure light is filled with a liquid, and a liquid immersion area is movable from one to the other between a substrate holding part P and a plate member T. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a protection member, an exposure apparatus, a protection method, a cleaning method, and a device manufacturing method.

  An exposure apparatus used in a photolithography process includes a substrate holding unit that holds a substrate to be exposed. If foreign matter exists between the back surface of the substrate and the substrate holding part, for example, the flatness of the substrate is lowered, and an exposure failure occurs, and as a result, a defective device may occur. Therefore, for example, as disclosed in the following patent document, the substrate holder is cleaned.

US Pat. No. 5,559,582

  If a defect occurs in the cleaning of the substrate holding part, there is a possibility that an exposure defect such as a defect occurs in a pattern formed on the substrate. As a result, a defective device may occur.

  An object of an aspect of the present invention is to provide a protection member, an exposure apparatus, a protection method, and a cleaning method that can suppress the occurrence of exposure failure. Moreover, the aspect of this invention aims at providing the device manufacturing method which can suppress generation | occurrence | production of a defective device.

  According to the first aspect of the present invention, the first holding member includes a substrate holding unit that holds the substrate and a predetermined member that is disposed around the substrate holding unit, and the substrate holding unit is provided with the liquid. A protection member used to protect a predetermined member of an exposure apparatus that exposes a held substrate with exposure light, and a liquid immersion region from one of the predetermined member and the substrate held by the substrate holding portion to the other A protective member is provided that is movable.

  According to the second aspect of the present invention, there is provided an exposure apparatus including a holding unit that holds the protective member of the first aspect.

  According to the third aspect of the present invention, there is provided a device manufacturing method including exposing a substrate by the exposure apparatus according to the second aspect and developing the exposed substrate.

  According to the 4th aspect of this invention, the protection method which protects a predetermined member with the protection member of a 1st aspect is provided.

  According to the fifth aspect of the present invention, there is provided a cleaning method including a step of protecting a predetermined member by the protective member of the first aspect and a step of cleaning at least a part of the substrate holding part.

  According to the sixth aspect of the present invention, in the cleaning method of the fifth aspect, at least a part of the substrate holder is cleaned, and after cleaning, the substrate is held by the substrate holder and the substrate is exposed. And developing the exposed substrate. A device manufacturing method is provided.

  According to a seventh aspect of the present invention, in a device manufacturing method using an exposure apparatus that includes a movable member having a substrate holding portion that holds a substrate and a predetermined member that is disposed around the substrate holding portion, the substrate is exposed. In order to perform a second operation different from the first operation, the predetermined member is protected by a protective member, and the protective member is removed to perform the first operation, and the substrate is held by the substrate holding unit via the liquid. There is provided a device manufacturing method including exposing a substrate to be exposed and developing the exposed substrate.

According to the present invention, the occurrence of exposure failure can be suppressed. According to the present invention, it is possible to suppress the occurrence of defective devices.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings, but the present invention is not limited thereto. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. A predetermined direction in the horizontal plane is defined as an X-axis direction, a direction orthogonal to the X-axis direction in the horizontal plane is defined as a Y-axis direction, and a direction orthogonal to each of the X-axis direction and the Y-axis direction (that is, a vertical direction) is defined as a Z-axis direction. Further, the rotation (inclination) directions around the X axis, Y axis, and Z axis are the θX, θY, and θZ directions, respectively.

(First embodiment)
FIG. 1 is a schematic block diagram that shows an example of an exposure apparatus EX according to the present embodiment. The exposure apparatus EX of the present embodiment is an immersion exposure apparatus that exposes a substrate P with exposure light EL through a liquid LQ. In FIG. 1, the exposure apparatus EX illuminates the mask stage 1 that can move while holding the mask M, the substrate stage 2 that can move while holding the substrate P, and the mask M with the exposure light EL. And a projection optical system PL that projects an image of the pattern of the mask M illuminated by the exposure light EL onto the substrate P through the liquid LQ in the immersion space LS.

  The mask M includes a reticle on which a device pattern projected onto the substrate P is formed.

  The illumination system IL illuminates at least a part of the mask M arranged in the illumination area IR with the exposure light EL. In the present embodiment, ArF excimer laser light is used as the exposure light EL.

  The mask stage 1 can hold the mask M so that the lower surface (pattern forming surface) of the mask M and the XY plane are substantially parallel. The mask stage 1 is movable in three directions, ie, the X axis, the Y axis, and the θZ direction while holding the mask M.

  The projection optical system PL projects an image of the pattern of the mask M at a predetermined projection magnification onto at least a part of the substrate P arranged in the projection region PR. The projection optical system PL of the present embodiment is a reduction system whose projection magnification is, for example, 1/4, 1/5, or 1/8. Note that the projection optical system PL may be either an equal magnification system or an enlargement system. In the present embodiment, the optical axis AX of the projection optical system PL is substantially parallel to the Z axis.

  The projection optical system PL includes a terminal optical element 10 having an exit surface 11 that emits exposure light EL toward the image plane of the projection optical system PL. The last optical element 10 is an optical element closest to the image plane of the projection optical system PL among the plurality of optical elements of the projection optical system PL.

  The substrate stage 2 can hold the substrate P so that the surface (exposure surface) of the substrate P and the XY plane are substantially parallel. The substrate stage 2 can move in six directions including the X-axis, the Y-axis, the Z-axis, the θX, θY, and θZ directions while holding the substrate P.

  Position information of the mask stage 1 and the substrate stage 2 in the X-axis direction and the Y-axis direction is measured by an interferometer system (not shown) including a laser interferometer. Further, the position information of the surface of the substrate P held on the substrate stage 2 is detected by a focus / leveling detection system (not shown).

  In the present embodiment, the substrate P is a circular substrate for manufacturing a device, and includes a film RG of a photosensitive material (photoresist). The substrate P includes a front surface Pa, an edge Pc, and a back surface Pb. The edge Pc includes the outer edge of the circular substrate P and has an annular shape. The surface Pa of the substrate P is liquid repellent with respect to the liquid LQ. In the present embodiment, the contact angle between the surface Pa and the liquid LQ is, for example, 90 ° or more.

  In the present embodiment, the edge Pc of the substrate P is liquid repellent with respect to the liquid LQ. The back surface Pb of the substrate P may be liquid repellent with respect to the liquid LQ.

  The immersion space LS is a space filled with the liquid LQ. In the present embodiment, water (pure water) is used as the liquid LQ.

  The exposure apparatus EX of the present embodiment includes a liquid supply device 7 and a liquid recovery device 8 in order to form the immersion space LS so that at least a part of the optical path of the exposure light EL is filled with the liquid LQ. .

  In the present embodiment, the immersion space LS is formed so that a partial region (local region) of the surface Pa of the substrate P arranged to face the emission surface 11 is covered with the liquid LQ. That is, in the present embodiment, the exposure apparatus EX has the substrate P disposed at a position away from the exit surface 11 of the last optical element 10 by a predetermined distance in the −Z direction when the substrate P is exposed, and the projection optical system PL A local liquid immersion method is employed in which the liquid immersion space LS is formed so that a part of the region on the substrate P including the projection region PR is covered with the liquid LQ.

  Next, the substrate stage 2 according to the present embodiment will be described with reference to FIGS.

  FIG. 2 is a side sectional view showing a part of the substrate stage 2. FIG. 3 is a plan view of the substrate stage 2 as viewed from above (+ Z side). In FIG. 3, the substrate P is not held by the substrate holding unit 5. In FIG. 3, the plate member T is not held by the plate member holding portion 6.

  The substrate stage 2 includes a stage main body ST, a substrate holding portion 5 provided on the stage main body ST and holding the substrate P, and a plate member holding portion 6 provided on the stage main body ST and holding the plate member T.

  In the present embodiment, the stage body ST is a plate-like member that is rectangular in the XY plane and has a thickness in the Z-axis direction, as shown in FIG. As shown in FIG. 3, the substrate holding part 5 has a circular shape in the XY plane, and is arranged at substantially the center of the stage main body ST. In the present embodiment, the substrate holding unit 5 can detachably hold the substrate P so that the surface Pa of the substrate P and the XY plane are substantially parallel, as shown in FIG. In the present embodiment, the substrate holding unit 5 holds the substrate P on the back surface Pb side of the substrate P, and holds the substrate P so that the front surface Pa of the substrate P and the exit surface 11 of the last optical element 10 face each other. Can do. In other words, the substrate holding unit 5 can hold the substrate P so that the surface Pa of the substrate P faces the emission surface 11 at a position away from the emission surface 11 in the −Z direction by a predetermined distance. Moreover, in this embodiment, the plate member holding | maintenance part 6 can hold | maintain the plate T so that attachment or detachment is possible so that the surface Ta and XY plane of the plate member T may become substantially parallel, as shown in FIG. In the present embodiment, the plate member holding portion 6 can hold the plate member T so that the surface Ta of the plate T and the exit surface 11 of the last optical element 10 face each other. That is, the plate member holding portion 6 can hold the plate member T so that the surface Ta of the plate member T faces the injection surface 11 at a position away from the emission surface 11 in the −Z direction by a predetermined distance.

  In the present embodiment, on the XY plane, on the upper surface of the stage main body ST, the substrate holding part 5 including the circular annular first rim part R1 and the circular annular second rim provided around the substrate holding part 5 are provided. A portion R2 and a plate member holding portion 6 including a rectangular annular third rim portion R3 provided around the second rim portion R2 are provided. A first gap G1 is provided between the first rim portion R1 and the second rim portion R2, and the upper surface of the stage body ST includes a bottom surface Ga of the first gap G1.

  In the present embodiment, the substrate holding unit 5 includes a first rim portion R1, an upper surface (chuck surface) 5a surrounded by the first rim portion R1, and a plurality of second rims provided on the chuck surface 5a and supporting the back surface Pb. 1 pin member P1 is included. The first pin member P1 includes an upper surface P1a that contacts the back surface Pb. In FIG. 3, the first pin member P1 is not shown.

  As shown in FIG. 3, the first rim portion R1 has a circular ring shape. The first rim portion R1 includes a contact surface R1a that contacts the back surface Pb, an inner side surface R1b, and an outer side surface R1c. The inner side surface R1b is formed in an annular shape along the outer edge of the chuck surface 5a, and extends from the chuck surface 5a to the contact surface R1a substantially parallel to the Z-axis direction. The outer side surface R1c is formed in a circular ring shape around the inner side surface R1b along the inner side surface R1b, and extends from the bottom surface Ga of the first gap G1 to the contact surface R1a substantially parallel to the Z-axis direction. The bottom surface Ga of the first gap G1 will be described later. In the present embodiment, the outer edge of the substrate holding portion 5 is defined by the outer side surface R1c of the first rim portion R1. The substrate holding unit 5 includes a plurality of first suction ports (not shown) provided on the chuck surface 5a. The plurality of first suction ports can be connected to a vacuum system (not shown) including a suction pump.

  In the present embodiment, the plate member holding portion 6 includes a second rim portion R2, a third rim portion R3, a chuck surface 6a formed between the second rim portion R2 and the third rim portion R3, a chuck And a second pin member P2 provided on the surface 6a. In FIG. 3, the second pin member P2 is not shown.

  As shown in FIG. 3, the second rim portion R2 is provided concentrically with the first rim portion R1 around the first rim portion R1. The second rim portion R2 includes R2a that contacts the back surface Tb, an inner side surface R2b that faces the outer side surface R1c of the first rim portion R1 via the first gap G1, and an outer side surface R2c. The inner side surface R2b is formed in a circular ring shape substantially parallel to the outer side surface R1c, and extends from the bottom surface Ga of the first gap G1 to the contact surface R2a substantially parallel to the Z-axis direction. The outer side surface R2c is formed in an annular shape around the inner side surface R2b along the inner side surface R1b, and extends from the chuck surface 6a to the contact surface R2a.

  As shown in FIG. 3, the third rim portion R3 is formed in a rectangular ring shape along the outer edge of the stage body ST. The third rim portion R3 includes R3a that contacts the back surface Tb, an inner side surface R3b, and an outer side surface R3c. The inner side surface R3b is formed in a rectangular ring shape along the outer edge of the chuck surface 6a, and extends from the chuck surface 6a to the contact surface R3a substantially parallel to the Z-axis direction. The outer side surface R3c is formed in a rectangular ring shape around the inner side surface R3b along the inner side surface R3b. The chuck surface 6a is formed between the outer side surface R2c and the inner side surface R3b, and a plurality of second pin members P2 are arranged on the chuck surface 6a. The second pin member P2 includes an upper surface P2a that contacts the back surface Tb. In the present embodiment, the outer edge of the plate member holding portion 6 is defined by the inner side surface R2b of the second rim portion R2b and the outer side surface R3c of the third rim portion R3.

  The plate member holding part 6 includes a plurality of second suction ports (not shown) provided on the chuck surface 6a. The plurality of second suction ports can be connected to a vacuum system (not shown) including a suction pump.

  In the present embodiment, the first gap G1 includes an outer side surface R1c, an inner side surface R2b, and a bottom surface Ga formed between the outer side surface R1c and the inner side surface R2b. As shown in FIG. 3, the gap G1 has a circular ring shape. In the present embodiment, the bottom surface Ga is flat in the XY plane.

  Next, a state where the substrate P and the plate member T are held by the substrate holding unit 5 and the plate member holding unit 6 will be described with reference to FIGS.

  FIG. 4 is a plan view of the substrate P held by the substrate holding part 5 and the plate member T held by the plate member holding part 6 as viewed from above (+ Z side).

  In the state where the substrate P is placed on the substrate holding part 5, as shown in FIG. 2, a first space S1 surrounded by the back surface Pb, the inner side surface R1b, and the chuck surface 5a of the substrate P is formed. . By sucking (exhausting) the gas in the first space S1 through the first suction port, the substrate P is held on the first rim portion R1 of the substrate holding portion 5 and the first pin member P1. Further, the substrate P can be removed from the substrate holding part 5 by stopping the exhaust of the gas from the first space S1.

  In the present embodiment, as shown in FIG. 4, the plate member T has a rectangular outer shape in the XY plane, and is provided with a circular opening substantially at the center. The circular opening is circular according to the outer shape of the substrate P placed on the substrate holding unit 5. As will be described later, in the present embodiment, the plate member T can cover the plate member holding portion 6. Therefore, the plate member T is disposed around the substrate holding unit 5. In the present embodiment, the plate member T includes a front surface Ta, an inner edge Tc that defines a circular opening, an outer edge Td that defines a rectangular outer shape, and a back surface Tb. The front surface Ta and the back surface Tb are formed between the inner edge Tc and the outer edge Td.

  In the present embodiment, the surface Ta and the inner edge Tc of the plate member T are liquid repellent with respect to the liquid LQ. In this embodiment, the plate member T includes a metal base material such as stainless steel and a film of a liquid repellent material formed on the base material. The surface Ta of the plate member T is formed of a liquid repellent material film. Examples of the liquid repellent material include PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), and Teflon (registered trademark). The plate member T itself may be formed of a liquid repellent material. In this embodiment, the contact angle of the surface of the plate member T with respect to the liquid LQ is 90 degrees or more, for example.

  In a state where the plate member T is placed on the plate member holding portion 6, as shown in FIG. 2, the plate member T is surrounded by the back surface Tb, the outer side surface R2c, the inner side surface R3b, and the chuck surface 6a. A second space S2 is formed. By sucking (exhausting) the gas in the second space S2 through the second suction port, the plate is placed on the second rim portion R2, the third rim portion R3, and the second pin member P2 of the plate member holding portion 6. The member T is held. By stopping the exhaust of gas from the second space S2, the plate member T can be removed from the plate member holding portion 6.

  As shown in FIG. 2, the surface Pa of the substrate P held by the substrate holding part 5 and the surface Ta of the plate member T held by the plate member holding part 6 are substantially flush with each other. Also, as shown in FIGS. 2 and 4, between the substrate P (edge Pc) held by the substrate holding part 5 and the plate member T (inner edge Tc) held by the plate member holding part 6, A second gap G2 is formed. A first gap G1 is formed in the −Z direction of the second gap G2. In the XY plane, the size of the first gap G1 is larger than the size of the second gap G2. In the present embodiment, the size of the second gap G2 is determined so that the liquid LQ does not enter the second gap G2 due to the surface tension of the liquid LQ. The immersion space LS can be moved from one of the surface Pa of the substrate P held by the substrate holding part 5 and the surface Ta of the plate member T held by the plate member holding part 6 to the other. That is, the immersion space LS can be moved from the surface Pa to the surface Ta via the second gap G2. In FIG. 2, the immersion space LS can be formed on the second gap G2 (+ Z axis direction). The size of the second gap G2 is, for example, 1 mm or less. In the present embodiment, the size of the second gap G2 is 0.2 mm or less. In the present embodiment, the substrate P (edge Pc) held by the substrate holder 5 and the plate member T (inner edge Tc) held by the plate member holder 6 are close to each other.

  Next, an example of the protective member 4 used in the exposure apparatus EX of the present embodiment will be described. In the present embodiment, the protection member 4 is for protecting the inner edge Tc of the plate member T.

Fig.5 (a) is the top view which looked at the protection member 4 from upper direction (+ Z side). FIG. 5B is a side cross-sectional view taken along the line AB of FIG. In order to simplify the description, the protection member 4 will be described using the XYZ orthogonal coordinate system used in the description of the exposure apparatus EX.
The protection member 4 is a member having an opening K at the center. As shown in FIG. 5B, the protection member 4 includes a circular annular cylindrical portion 4A and a circular annular protruding portion 4B extending in the radial direction from the center of the opening K from the + Z side end of the cylindrical portion 4A. Including. As shown in FIG. 5B, the cylindrical portion 4A has a thickness in the X-axis direction and extends in the Z-axis direction. As shown in FIG. 5B, the protrusion 4B has a thickness in the Z-axis direction and extends in the XY plane.
The cylindrical portion 4A includes a surface 4a, a bottom surface 4d, and an inner side surface 4b that faces the opening K and extends from the surface 4a to the bottom surface 4d substantially parallel to the Z-axis direction. 4 A of cylindrical parts are arrange | positioned on the outer side of the inner side surface 4b with respect to the center of the opening part K, and include the outer side surface 4c extended from the bottom face 4d. The surface 4a is substantially parallel to the XY plane and is flat. The bottom surface 4d is formed between the inner side surface 4b and the outer side surface 4c, is substantially parallel to the XY plane, and is flat.
The protrusion 4B includes a front surface 4e, a back surface 4g, and an outer side surface 4f extending from the front surface 4e to the back surface 4g substantially parallel to the Z-axis direction. The surface 4e is flush with the surface 4a. The surface 4e is substantially parallel to the XY plane and is flat. The back surface 4g is substantially parallel to the XY plane and is flat. The back surface 4g extends from the outer side surface 4f to the outer side surface 4b. In the present embodiment, in the XY plane, the size of the bottom surface 4d is smaller than the size of the flush surfaces of the surface 4a and the surface 4e.
In this embodiment, the protection member 4 is made of a synthetic resin. In the present embodiment, the protection member 4 is made of, for example, Teflon (registered trademark). The protective member 4 may be formed of, for example, PFA (Tetrafluoroethylene-perfluoroalkylvinylether copolymer), PTFE (Polytetrafluoroethylene), PEEK (polyetheretherketone), or the like. The protective member 4 is not limited to a synthetic resin. For example, metallic titanium may be used.

  A state in which the protection member 4 protects the plate member T will be described with reference to FIGS. 6 and 7.

  FIG. 6 is a plan view of the substrate stage 2 in which the plate member T is protected by the protection member 4 as viewed from above (+ Z side). FIG. 7 is a part of a side sectional view of the substrate stage 2 taken along line CD in FIG.

  As shown in FIG. 7, the protection member 4 is placed in the first gap G1.

  In the state in which the plate member T is protected by the protection member 4, as shown in FIG. 7, the outer side surface 4c is in contact with the inner edge Tc, the inner side surface 4b is in contact with the outer side surface R1c, and the bottom surface 4d is the bottom surface. In contact with Ga, the back surface 4g is in contact with the front surface Ta. Therefore, as shown in FIG. 6, all of the inner edge Tc of the plate member T is protected by the protection member 4. Therefore, in the XY plane, the shape of the protection member 4 is determined according to the shape of the inner edge Tc. The protection member 4 covers the inner edge Tc so that the surface 4a is substantially parallel to the XY plane.

  The outer side surface 4c and the inner side surface R2b are not in contact with each other with a gap therebetween. Further, since the size of the bottom surface 4d is smaller than the size of the first gap G1, as shown in FIG. 7, the protective member 4 is placed on a part of the bottom surface Ga.

  In the present embodiment, the protection member 4 is detachably mounted from the first gap G1.

  Next, an example of the operation of the exposure apparatus EX having the above-described configuration will be described.

  First, the substrate P before exposure is loaded onto the substrate holding part 5 of the substrate stage 2 using a predetermined transport device.

  Next, negative pressure is applied to the first space S1 by sucking (exhausting) the gas in the first space S1 surrounded by the substrate holding part 5 and the back surface Pb of the substrate P through the first suction port. Thus, the substrate P is attracted and held by the substrate holding unit 5.

  Next, the substrate stage 2 is moved below the projection optical system PL so that the last optical element 10 and the substrate P face each other, and the liquid LQ is filled with at least part of the optical path of the exposure light EL. The immersion space LS is formed. An immersion space LS is formed by the liquid supply device 7 and the liquid recovery device 8. The liquid supply of the liquid supply device 7 and the liquid recovery of the liquid recovery device 8 may be started in a state where the terminal optical element 10 and the substrate P face each other. For example, US Patent Application No. 2007/0127006 As disclosed in the specification, the immersion space LS may be moved from the other stage (member) onto the substrate P while the immersion space LS is maintained below the projection optical system PL. .

  In a state where the optical path of the exposure light EL between the last optical element 10 and the substrate P is filled with the liquid LQ, the exposure light EL is emitted from the illumination system IL. The exposure light EL emitted from the illumination system IL illuminates the mask M. The exposure light EL that has passed through the mask M is irradiated onto the substrate P via the projection optical system PL and the liquid LQ in the immersion space LS. As a result, the pattern image of the mask M is projected onto the surface Pa of the substrate P, and the substrate P is exposed with the exposure light EL.

  After the exposure of the substrate P is completed, the supply of the liquid LQ is stopped by the liquid supply device 7, and the liquid LQ in the immersion space LS is recovered by the liquid recovery device 8. After collecting the liquid LQ from the surface Pa of the substrate P, the suction operation by the vacuum system is stopped. The substrate P after exposure is unloaded from the substrate holder 5 of the substrate stage 2 using a predetermined transport device. Thus, the exposure process for the substrate P is completed. For example, as disclosed in the specification of US Patent Application No. 2007/0127006, after the exposure of the substrate P is completed, the substrate P is maintained in a state where the immersion space LS is maintained below the projection optical system PL. The substrate P may be unloaded from the substrate stage 2 after the immersion space LS is moved from above to another stage (member).

  In the exposure sequence including the replacement process of the substrate P and the exposure process of the substrate P, foreign matters (contaminants, particles) are caused by the upper surface P1a of the first pin member P1 of the substrate holding part 5 and / or the contact surface R1a of the first rim part. There is a possibility to adhere to. When the upper surface P1a and / or the contact surface R1a are contaminated, for example, the flatness of the substrate P held by the substrate holding unit 5 may be lowered. As a result, exposure failure may occur. Therefore, the substrate holding part 5 is cleaned. In order to simplify the description, the case where the upper surface P1a is cleaned will be described.

  Therefore, the cleaning of the upper surface P1a is performed using a cleaning tool CD as shown in FIG. 7, for example, every predetermined time interval or every time a predetermined number of substrates P are exposed. The cleaning of the upper surface P1a is different from the exposure sequence including the replacement process of the substrate P and the exposure process of the substrate P. In the present embodiment, the cleaning tool CD is provided in the exposure apparatus EX. The cleaning tool CD can clean the upper surface P1a by a control device (not shown) in the exposure apparatus. When cleaning the upper surface P1a, the substrate stage 2 is disposed, for example, at a substrate replacement position. The cleaning tool and the cleaning method are disclosed in, for example, US Pat. No. 5,559,582, and detailed description thereof is omitted.

  During the cleaning of the upper surface P1a with the cleaning tool CD, there is a possibility that the cleaning tool CD and the inner edge Tc of the plate member T held by the plate member holding portion 6 come into contact with each other. When the inner edge Tc of the plate member T held by the plate member holding portion 6 is deformed or damaged, for example, the second portion between the substrate P (surface Pa) and the plate member T (surface Ta) is formed. There is a possibility that the immersion space LS cannot be formed on the two gaps G2. In addition, a part of the plate member T is peeled off at the inner edge Tc to become a foreign substance, which increases the possibility of contaminating the exposure apparatus EX (for example, the last optical element 10). Further, the foreign matter may come into contact with a clean substrate P that is subsequently carried into the exposure apparatus EX, and contamination may be increased. In addition, the foreign matter may adhere to the terminal optical element 10 and a pattern formed on the substrate P may be defective.

  Therefore, in the present embodiment, the inner edge Tc is covered with the protective member 4 described above, and the upper surface P1a is cleaned.

  Prior to cleaning the upper surface P1a, the protection member 4 is held in the first gap G1. In the present embodiment, the protection member 4 is installed in the first gap G1 by an operator. In this embodiment, the protection member 4 covers the entire inner edge Tc. Therefore, when cleaning the upper surface P1a in the vicinity of the first rim portion R1 with the cleaning tool CD, the cleaning tool CD comes into contact with the protection member 4. Since the protection member 4 covers the inner edge Tc, the cleaning tool CD can be prevented from coming into contact with the inner edge Tc. Therefore, the inner edge Tc can be prevented from being deformed or damaged as compared with the case where the cleaning tool CD is in contact with the inner edge Tc. When the protection member 4 is made of synthetic resin, even when the protection member 4 and the plate member T are in contact with each other, the deformation of the inner edge Tc of the plate member T can be suppressed.

  After the cleaning of the upper surface P1a is completed, the protection member 4 is removed from the first gap G1. The protection member 4 is removed from the inner edge Tc. An exposure sequence including the replacement process of the substrate P and the exposure process of the substrate P is started.

  As described above, the substrate P before exposure is loaded onto the substrate holding unit 5 of the substrate stage 2 using a predetermined transport device. In a state where the optical path of the exposure light EL between the last optical element 10 and the substrate P is filled with the liquid LQ, an image of the pattern of the mask M is projected onto the surface Pa of the substrate P, and the substrate P is exposed with the exposure light EL. Exposed. In the exposure sequence, the immersion space LS moves from one of the substrate P (Pa) and the plate member T (surface Ta) to the other with the protective member 4 removed.

  As described above, in the present embodiment, when the upper surface P1a and / or the contact surface R1a is cleaned, the protective member 4 that covers the inner edge Tc is used, so that the cleaning tool CD contacts the inner edge Tc. Can be suppressed. Therefore, deformation and damage of the plate member T can be suppressed. Therefore, the occurrence of exposure failure can be suppressed, and the occurrence of defective devices can be suppressed.

  In the above-described embodiment, the protection member 4 is a circular annular member that covers the entire inner edge Tc, but the shape of the protection member 4 is not limited to this. A shape that covers a part of the inner edge Tc may be used. Further, a member that covers the entire surface Ta and the outer edge Td of the plate member T together with the inner edge Tc of the plate member T may be used.

  A conductive member may be used for the protective member 4. Examples of the conductive member include a conductive plastic in which carbon is contained in a polyethylene-based plastic. Furthermore, at least a part of the protective member 4 may be grounded. In this case, the protection member 4 includes a ground wire connected to the protection member 4. As a result, even when static electricity is generated when the protective member 4 is detached from the plate member T, the protective member 4 is grounded, so that the plate member T is prevented from being charged.

  In the above-described embodiment, the protective member 4 is placed in the first gap G1, but the place where the protective member 4 is installed is not limited to this. For example, a place for installing the protective member 4 may be provided on the chuck surface 5a in the vicinity of the inner side surface R1b of the first rim portion R1, and the protective member 4 may be installed.

  In addition, although the protection member 4 was mounted in the 1st gap G1, and the protection member 4 was hold | maintained, the method of hold | maintaining with the 1st gap G1 is not restricted to this. For example, a suction port that can be connected to the vacuum system may be provided on the bottom surface Ga of the first gap G1, and the protective member 4 may be attracted and held in the first gap G1. That is, the method for holding the protective member 4 in the first gap G1 can be selected as appropriate.

  Moreover, in the above-mentioned embodiment, although the protective member 4 was installed in the 1st gap G1 by the operator, the protective member 4 may convey and install the protective member 4 in the 1st gap G1 with a conveying apparatus. . When the protection member 4 is transported to the first gap G1 by the transport device, there is a possibility that a long time is spent on the alignment operation between the first gap G1 and the protection member 4. A reference position may be used for alignment between the first gap G1 and the protection member 4. By using the reference position, it is possible to shorten the time required for installing the protective member 4 in the first gap G1. For example, a through hole of a support member that supports and raises and lowers the back surface Pb of the substrate P disposed in the substrate holding portion disclosed in Japanese Patent Application Publication No. 1-214042 is used as the reference position.

  The transport apparatus may be provided in the exposure apparatus EX, or an operator may support and operate the transport apparatus.

  In the above-described embodiment, the cleaning tool CD is provided in the exposure apparatus EX. However, the exposure apparatus EX may not be provided. For example, an operator may support the cleaning tool CD during cleaning.

  In the above-described embodiment, the cleaning tool CD is cleaned by a control device (not shown), but the cleaning tool CD may be cleaned by an operator's operation. Also in this case, since the protective member 4 that covers the inner edge Tc is used for cleaning, deformation and damage of the plate member T can be suppressed.

  In the above-described embodiment, the protective member 4 that protects the inner edge Tc of the plate member T has been described. However, the protective member used in the exposure apparatus EX is not limited to this. For example, the outer edge Td of the plate member T may be protected. A rectangular annular protective member that covers the outer edge Td of the plate member T may be used. As shown in FIG. 8, the outer edge Td of the plate member T and the movable stage MB may approach each other via the third gap G3. The size of the third gap G3 is determined so that the liquid LQ does not enter the third gap G3 due to the surface tension of the liquid LQ. Note that the outer edge Td and the movable stage MB may be brought into contact without providing the third gap G3. When the outer edge Td of the plate member T is deformed, for example, an immersion space LS is formed on the third gap G3 between the plate member T (surface Ta) and another stage (movable member MB (surface MBa)). It may not be possible. Further, when the immersion space LS is moved from one of the surface Ta of the plate member T and the surface MBa of the movable member MB to the other, the liquid LQ that forms the immersion space LS from the outer edge Td of the plate member T and the movable member MB. May cause problems such as leakage. Other stages may not be movable members. The other stage is movable by mounting a measuring member (measuring instrument) for measuring the exposure light as disclosed in, for example, US Pat. No. 6,897,963 and European Patent Application No. 1713113. It may be at least part of the measurement stage. Further, a stage as disclosed in the above-mentioned US Patent Application No. 2007/0127006 may be used.

  When the outer edge Td is covered with a protective member, a new place for holding the protective member may be provided on the substrate stage 2.

  In the above-described embodiment, the protection member 4 that covers the inner edge Tc is used at the timing of cleaning the substrate holding unit 5, but the timing of using the protection member is not limited to this. For example, when the substrate stage 2 is transported / transported, at least one of the inner edge Tc and the outer edge Td of the plate member T placed on the substrate stage 2 may be covered with a protective member.

  As the substrate P in each of the above embodiments, not only a semiconductor wafer for manufacturing a semiconductor device, but also a glass substrate for a display device, a ceramic wafer for a thin film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) or the like is applied.

  In the above embodiment, the immersion exposure apparatus that exposes the substrate P with the exposure light EL via the liquid LQ has been described as an example. However, the present invention is applied to an exposure apparatus and an exposure method that do not use the liquid LQ. be able to.

  In addition, although the liquid LQ of the above-mentioned embodiment is water, liquids other than water may be sufficient. The liquid LQ is preferably a liquid LQ that is transmissive to the exposure light EL, has a refractive index as high as possible, and is stable with respect to the projection optical system or a photosensitive material (photoresist) film that forms the surface of the substrate. For example, as the liquid LQ, hydrofluoroether (HFE), perfluorinated polyether (PFPE), fomblin oil, cedar oil, or the like can be used. A liquid LQ having a refractive index of about 1.6 to 1.8 may be used. In addition, various fluids such as a supercritical fluid can be used as the liquid LQ.

  In the above-described embodiment, the projection optical system PL fills the light path on the exit side (image plane side) of the last optical element 10 with the liquid LQ, but is disclosed in International Publication No. 2004/019128. As described above, it is also possible to employ a projection optical system in which the optical path on the incident side (object plane side) of the last optical element 10 is filled with the liquid LQ.

  As the exposure apparatus EX, in addition to the step-and-scan type scanning exposure apparatus (scanning stepper) that scans and exposes the pattern of the mask M by moving the mask M and the substrate P synchronously, the mask M and the substrate P Can be applied to a step-and-repeat type projection exposure apparatus (stepper) in which the pattern of the mask M is collectively exposed while the substrate P is stationary and the substrate P is sequentially moved stepwise.

  Furthermore, in the step-and-repeat exposure, after the reduced image of the first pattern is transferred onto the substrate P using the projection optical system while the first pattern and the substrate P are substantially stationary, the second pattern With the projection optical system, the reduced image of the second pattern may be partially overlapped with the first pattern and collectively exposed on the substrate P (stitch type batch exposure apparatus). ). Further, the stitch type exposure apparatus can be applied to a step-and-stitch type exposure apparatus in which at least two patterns are partially transferred on the substrate P, and the substrate P is sequentially moved.

  Further, as disclosed in, for example, US Pat. No. 6,611,316, two mask patterns are synthesized on a substrate via a projection optical system, and one shot on the substrate is obtained by one scanning exposure. The present invention can also be applied to an exposure apparatus that performs double exposure of a region almost simultaneously. The present invention can also be applied to proximity type exposure apparatuses, mirror projection aligners, and the like.

  The present invention also relates to a twin stage type exposure apparatus having a plurality of substrate stages as disclosed in US Pat. No. 6,341,007, US Pat. No. 6,208,407, US Pat. No. 6,262,796, and the like. It can also be applied to.

  Furthermore, as disclosed in, for example, US Pat. No. 6,897,963, etc., a substrate stage for holding a substrate, a reference member on which a reference mark is formed, and / or a measurement stage on which various photoelectric sensors are mounted. The present invention can also be applied to other exposure apparatuses.

  The type of the exposure apparatus EX is not limited to an exposure apparatus for manufacturing a semiconductor element that exposes a semiconductor element pattern on the substrate P, but an exposure apparatus for manufacturing a liquid crystal display element or a display, a thin film magnetic head, an image sensor (CCD). ), An exposure apparatus for manufacturing a micromachine, a MEMS, a DNA chip, a reticle, a mask, or the like.

  In each of the above embodiments, an ArF excimer laser may be used as a light source device that generates ArF excimer laser light as the exposure light EL. For example, as disclosed in US Pat. No. 7,023,610. A harmonic generator that outputs pulsed light with a wavelength of 193 nm may be used, including a solid-state laser light source such as a DFB semiconductor laser or a fiber laser, an optical amplification unit having a fiber amplifier, a wavelength conversion unit, and the like. Furthermore, in the above-described embodiment, each illumination area and the projection area described above are rectangular, but other shapes such as an arc shape may be used.

  In each of the above-described embodiments, a light-transmitting mask in which a predetermined light-shielding pattern (or phase pattern / dimming pattern) is formed on a light-transmitting substrate is used. You can use a mask. Further, as disclosed in, for example, U.S. Pat. No. 6,778,257, a variable shaping mask (an electronic mask, an active mask, an active mask, or the like) that forms a transmission pattern, a reflection pattern, or a light emission pattern based on electronic data of a pattern to be exposed. Alternatively, an image generator may be used. The variable shaping mask includes, for example, a DMD (Digital Micro-mirror Device) which is a kind of non-light emitting image display element (spatial light modulator). Further, a pattern forming apparatus including a self-luminous image display element may be provided instead of the variable molding mask including the non-luminous image display element. As a self-luminous type image display element, for example, CRT (Cathode Ray Tube), inorganic EL display, organic EL display (OLED: Organic Light Emitting Diode), LED display, LD display, field emission display (FED: Field Emission Display) And a plasma display panel (PDP).

  In each of the above embodiments, the exposure apparatus provided with the projection optical system PL has been described as an example. However, the present invention can be applied to an exposure apparatus and an exposure method that do not use the projection optical system PL.

  Further, as disclosed in, for example, International Publication No. 2001/035168, an exposure apparatus (lithography system) that exposes a line and space pattern on the substrate P by forming interference fringes on the substrate P. The present invention can also be applied to.

  As described above, the exposure apparatus EX according to the embodiment of the present application maintains various mechanical subsystems including the respective constituent elements recited in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy. Manufactured by assembling. In order to ensure these various accuracies, before and after assembly, various optical systems are adjusted to achieve optical accuracy, various mechanical systems are adjusted to achieve mechanical accuracy, and various electrical systems are Adjustments are made to achieve electrical accuracy. The assembly process from the various subsystems to the exposure apparatus includes mechanical connection, electrical circuit wiring connection, pneumatic circuit piping connection and the like between the various subsystems. Needless to say, there is an assembly process for each subsystem before the assembly process from the various subsystems to the exposure apparatus. When the assembly process of the various subsystems to the exposure apparatus is completed, comprehensive adjustment is performed to ensure various accuracies as the entire exposure apparatus. The exposure apparatus is preferably manufactured in a clean room where the temperature, cleanliness, etc. are controlled.

  As shown in FIG. 9, a microdevice such as a semiconductor device includes a step 201 for designing a function / performance of the microdevice, a step 202 for producing a mask (reticle) based on the design step, and a substrate as a base material of the device. Substrate processing step 204 including substrate processing (exposure processing) including exposing the substrate with exposure light using a mask pattern and developing the exposed substrate according to the above-described embodiment. The device is manufactured through a device assembly step (including processing processes such as a dicing process, a bonding process, and a package process) 205, an inspection step 206, and the like.

Note that the requirements of the above-described embodiments can be combined as appropriate. In addition, as long as permitted by law, the disclosure of all published publications and US patents related to the exposure apparatus and the like cited in the above-described embodiments and modifications are incorporated herein by reference.

4 --- Protective member, 5 --- Substrate holding part, 6 --- Plate member holding part, T --- Plate member, Tc --- Inner edge, Td --- Outer edge

It is a schematic block diagram which shows the exposure apparatus EX which concerns on this embodiment. It is a sectional side view which shows an example of a part of substrate stage 2 concerning this embodiment. It is a top view which shows an example of the substrate stage 2 which concerns on this embodiment. It is a top view which shows an example of the substrate stage 2 which concerns on this embodiment. (A) It is a top view which shows an example of the protection member 4 which concerns on this embodiment. (B) It is a sectional side view which shows an example of the protection member 4 which concerns on this embodiment. It is a top view which shows an example of the substrate stage 2 which concerns on this embodiment. It is a sectional side view which shows an example of a part of substrate stage 2 concerning this embodiment. It is a sectional side view which shows an example of a part of substrate stage 2 concerning this embodiment. It is a flowchart which shows an example of the manufacturing process of a microdevice.

Claims (17)

A first movable member having a substrate holding part for holding a substrate and a predetermined member arranged around the substrate holding part, and exposing the substrate held by the substrate holding part via liquid with exposure light A protective member used to protect the predetermined member of the exposure apparatus,
A protective member capable of moving the liquid immersion region from one of the predetermined member and the substrate held by the substrate holding portion to the other.   The liquid immersion area includes a substrate held by the predetermined member and the substrate holding unit in a state where the first edge of the predetermined member and the substrate held by the substrate holding unit are separated by a gap. The protective member according to claim 1, wherein the protective member is movable from one side to the other side and protects at least a part of the first edge.   Further, the exposure apparatus includes a second movable member different from the first movable member, and the second member and the second movable member are in contact with or in proximity to each other, and the predetermined member and the second movable member are in contact with each other. The protection member according to claim 1, wherein the liquid immersion region of the liquid is movable from one side to the other side of the second movable member, and protects at least a part of the second edge.   The protection member according to claim 3, wherein the second movable member includes a measurement member that measures the exposure light.   The protective member according to claim 1, wherein the predetermined member is liquid repellent with respect to the liquid.   The protection member according to claim 1, wherein the protection member is detachable from the predetermined member.   The protective member according to claim 6, wherein when the liquid immersion area moves from one of the predetermined member and the substrate held by the substrate holding portion to the other, the protective member is removed from the predetermined member.   The protection member as described in any one of Claims 1-7 which suppresses the cleaning member and the said predetermined member which clean the said board | substrate holding part contacting.   The protection member according to claim 1, wherein the predetermined member is a plate member that is detachable from the first movable member.   An exposure apparatus comprising a holding unit that holds the protective member according to claim 1. Exposing the substrate by the exposure apparatus according to claim 10;
Developing the exposed substrate. A device manufacturing method comprising:   The protection method which protects the said predetermined member using the protection member as described in any one of Claims 1-9. A step of protecting the predetermined member by the protective member according to claim 1;
Cleaning at least a part of the substrate holder. The cleaning method according to claim 13, wherein at least a part of the substrate holder is cleaned;
A device manufacturing method comprising: holding the substrate by the substrate holding unit after the cleaning; exposing the substrate; and developing the exposed substrate. In a device manufacturing method using an exposure apparatus comprising a movable member having a substrate holding part for holding a substrate and a predetermined member arranged around the substrate holding part,
Protecting the predetermined member with a protective member to perform a second operation different from the first operation of exposing the substrate;
Removing the protective member to perform the first operation, and exposing a substrate held by the substrate holding unit via a liquid;
Developing the exposed substrate. A device manufacturing method comprising:   The device manufacturing method according to claim 15, wherein the second operation includes cleaning of the movable member. The device manufacturing method according to claim 15 or 16, wherein, in the first operation, the liquid immersion area is moved from one of the substrate held by the substrate holding unit and the predetermined member to the other.