JP2011039759A - Touch panel device, method for manufacturing the same, display, and electronic equipment - Google Patents

Abstract

A highly reliable capacitively coupled touch panel device that is thin, has high light transmittance, and is easy to manufacture.
A touch panel device according to the present invention includes a substrate and a plurality of island-shaped electrode portions that are provided on one surface of the substrate and spaced apart from each other in the X-axis direction. The first bridge wiring 11 that connects the island-shaped electrode portions 12 to be connected and the island-shaped electrode portions 22 that are adjacent in the Y-axis direction different from the X-axis direction are connected and formed integrally with the island-shaped electrode portions 22. The second bridge wiring 21 and the insulating film 30 provided between the first bridge wiring 11 and the second bridge wiring 21 and a liquid phase on the surface of the first bridge wiring 11. A polyaniline film 13 made of a polyaniline is formed by a film forming method, and a polyaniline film 23 made of a polyaniline is formed on the surface of the second bridge wiring 21 by a liquid phase film forming method. Is There.
[Selection] Figure 2

Description

  The present invention relates to a touch panel device, a method for manufacturing the touch panel device, a display device, and an electronic apparatus.

  2. Description of the Related Art In recent years, touch panel devices have become widespread as input devices for operating electronic devices, such as automatic teller machines (ATMs). Such a touch panel device is mounted on the display surface side of various display devices such as a liquid crystal display device, and depending on the display content of the display device that is viewed through the touch panel device, an input instrument such as a touch pen or a human finger is used. By touching an arbitrary position on the touch surface by means of, for example, the contact position is specified, and various operations and inputs of the electronic device are performed. As such a touch panel device, various types of devices such as a resistive film method, a capacitive coupling method, and a surface acoustic wave method are known.

  In Patent Document 1, a plurality of first electrodes provided on the front surface of the film body and extending in parallel with each other and a first electrode group provided on the back surface of the film body and extending in a direction orthogonal to each other. A sensor substrate having a plurality of second electrodes, a filling layer having a thickness equivalent to that of the first electrode group in a region of the surface of the film body where the first electrode group does not exist, A capacitively coupled coordinate input device having a layer and a protective sheet attached to the surface of the first electrode group is disclosed. In this coordinate input device, when a user touches the surface of the protective sheet with a finger, a current value corresponding to a change in capacitance between the first electrode group and the second electrode group is measured and output. The coordinate position where the finger is pressed can be detected based on the current output value.

FIG. 14 is a cross-sectional view schematically showing a configuration of a conventional capacitive touch panel device. In the following description, the upper side in FIG. 14 is referred to as “upper” and the lower side is referred to as “lower”.
A touch panel device 900 shown in FIG. 14 includes a substrate 910, a Y electrode 920 formed on the lower surface of the substrate 910, an X electrode 930 formed on the upper surface of the substrate 910, and an upper side of the substrate 910 via the X electrode 930. The protective sheet 950 is provided, and the adhesive layer 940 is filled between the substrate 910 and the protective sheet 950 and adheres them. The upper surface of the protective sheet 950 is a touch surface in the touch panel device 900, and the touch panel device 900 detects the touch position when a finger or the like touches the touch surface.

  Here, the Y electrode 920 and the X electrode 930 are a plurality of linear electrodes extending in directions orthogonal to each other, and an electrostatic capacity is formed between the electrodes 920 and 930. Since the capacitance changes before and after the finger touches the touch surface, the touch panel device 900 is configured to detect the change in the capacitance at each of the electrodes 920 and 930 and specify the touch position. .

  However, in such a touch panel device 900, since the Y electrode 920 and the X electrode 930 are provided on different surfaces of the substrate 910, the manufacturing process is complicated. In particular, the Y electrode 920 and the X electrode 930 are formed through a complicated process in which a conductive film is formed and then patterned into a desired shape by a photolithography method and an etching method. This increases the cost of the entire process.

In addition, since electrodes are provided on both surfaces of the substrate 910, it is difficult to reduce the thickness of the touch panel device 900.
Further, although not shown in FIG. 14, a protective sheet for protecting the Y electrode 920 is also required, so that the number of layers constituting the touch panel device 900 is inevitably increased, and the light transmittance is inferior. That is also an issue.

JP-A-9-305289

  An object of the present invention is to provide a capacitive coupling type touch panel device that is thin, has high light transmission, and is highly reliable, and provides a manufacturing method that can efficiently manufacture the touch panel device. It is another object of the present invention to provide a high-performance display device and electronic device provided with the touch panel device.

The above object is achieved by the present invention described below.
The touch panel device of the present invention includes a touch panel substrate,
A plurality of island-shaped electrode portions provided on one side of the touch panel substrate and spaced apart from each other;
A first bridge wiring connecting between the island-shaped electrode portions adjacent in the first direction of the touch panel substrate;
A second bridge wiring that connects adjacent island electrode portions in a second direction different from the first direction, and is formed integrally with the island electrode portions;
Having an insulating film provided between the first bridge wiring and the second bridge wiring;
A polyaniline coating film formed by a liquid phase film formation method and made of polyaniline is provided on at least a part of at least one surface of the first bridge wiring and the second bridge wiring. And
As a result, it is possible to provide a capacitive coupling touch panel device that is thin, has high light transmittance, and high reliability.

In the touch panel device of the present invention, the polyaniline film is preferably formed by an inkjet method.
Thus, partial film formation is possible without preparing a mask or the like that covers the non-film formation region. Moreover, it can respond suitably even if the polyaniline to be formed has a fine pattern.

これにより、ポリアニリン被膜の安定性を十分に優れたものとしつつ、ポリアニリン被膜の導電性や、ブリッジ配線および絶縁膜に対する密着性等を特に優れたものとすることができ、タッチパネル装置の信頼性を特に優れたものとすることができる。 In the touch panel device of the present invention, the polyaniline is preferably represented by the following formula (1).

Thereby, while making the stability of the polyaniline coating sufficiently excellent, the conductivity of the polyaniline coating and the adhesion to the bridge wiring and the insulating film can be made particularly excellent, thereby improving the reliability of the touch panel device. It can be made particularly excellent.

In the touch panel device of the present invention, the degree of polymerization of the polyaniline is preferably 100 or more and 100,000 or less.
As a result, the adhesion of the polyaniline film to the bridge wiring and the insulating film, the film strength, and the like can be made particularly excellent, and the reliability of the touch panel device can be made particularly excellent.

In the touch panel device of the present invention, it is preferable that an average thickness of the polyaniline coating is 0.04 μm or more and 0.4 μm or less.
As a result, the adhesion of the polyaniline film to the bridge wiring and the insulating film, the film strength, and the like can be made particularly excellent, and the reliability of the touch panel device can be made particularly excellent.

In the touch panel device of the present invention, each of the first bridge wiring and the second bridge wiring is one or two selected from the group consisting of ITO, IZO, IGZO, FTO, ZnO, AZO, and ATO. It is preferable that it is comprised with the transparent conductive material of the seed | species or more.
Thereby, the transparency of the first bridge wiring and the second bridge wiring can be made particularly excellent, and the adhesion between the polyaniline coating and the insulating film can be made particularly excellent, and the touch panel The reliability of the apparatus can be made particularly excellent.

In the touch panel device of the present invention, it is preferable that at least central portions of the plurality of island-shaped electrode portions are respectively located on the same plane.
Thereby, the separation distance between the touch surface of the touch panel device and each island-shaped electrode portion is also substantially equal, and the variation in electrostatic capacitance generated between the user's finger and each island-shaped electrode portion is suppressed. For this reason, when detecting a touch position based on the change of electrostatic capacitance, the detection accuracy can be improved.

In the method for manufacturing a touch panel device of the present invention, a plurality of island-shaped electrode portions that are spaced apart from each other are formed on one surface side of the touch-panel substrate, and between the island-shaped electrode portions that are adjacent in the first direction of the touch-panel substrate. An island-like electrode portion for forming a first bridge wiring for connecting the first bridge wiring and the first bridge wiring forming step;
A polyaniline film forming step of forming a polyaniline film composed of polyaniline on the first bridge wiring by a liquid phase film forming method;
An insulating film forming step of forming an insulating film on the first bridge wiring covered with the polyaniline coating;
And a second bridge wiring forming step of forming a second bridge wiring for connecting the island-shaped electrode portions adjacent to each other in a second direction different from the first direction.
Accordingly, it is possible to provide a manufacturing method capable of efficiently manufacturing a capacitive touch panel device that is thin, has high light transmittance, and high reliability.
In the touch panel device manufacturing method of the present invention, after the second bridge wiring formation step, a step of forming a polyaniline film composed of polyaniline on the second bridge wiring by a liquid phase film forming method. It is preferable to have.
Thereby, the reliability of the touch panel device can be made particularly excellent.

In the method for manufacturing a touch panel device of the present invention, a plurality of island-shaped electrode portions that are spaced apart from each other are formed on one surface side of the touch-panel substrate, and between the island-shaped electrode portions that are adjacent in the first direction of the touch-panel substrate. An island-like electrode portion for forming a first bridge wiring for connecting the first bridge wiring and the first bridge wiring forming step;
An insulating film forming step of forming an insulating film on the first bridge wiring;
A second bridge wiring forming step of forming a second bridge wiring for connecting the island-shaped electrode portions adjacent in the second direction different from the first direction;
And a polyaniline film forming step of forming a polyaniline film made of polyaniline on the second bridge wiring by a liquid phase film forming method.
Accordingly, it is possible to provide a manufacturing method capable of efficiently manufacturing a capacitive touch panel device that is thin, has high light transmittance, and high reliability.

In the method for manufacturing a touch panel device of the present invention, the polyaniline film is preferably formed by an inkjet method.
Thus, partial film formation is possible without preparing a mask or the like that covers the non-film formation region. Moreover, it can respond suitably even if the polyaniline to be formed has a fine pattern.

The display device of the present invention includes the touch panel device of the present invention.
Thereby, a high performance display device provided with a touch panel device is obtained.
An electronic apparatus according to the present invention includes the display device according to the present invention.
Thereby, a high-performance electronic device is obtained.

It is a schematic plan view which shows suitable embodiment of a touchscreen apparatus. It is a schematic cross section of the touch panel device shown in FIG. It is a schematic cross section showing other embodiments of a touch panel device. It is process drawing which shows suitable embodiment of the manufacturing method of a touch panel apparatus. It is a perspective view which shows schematic structure of the droplet discharge apparatus used for manufacture of a touchscreen apparatus. It is a figure for demonstrating the discharge principle of a liquid material. It is a schematic cross section which shows the manufacturing process of a touchscreen apparatus. It is a schematic cross section which shows the manufacturing process of a touchscreen apparatus. It is a schematic cross section which shows the manufacturing process of a touchscreen apparatus. It is a schematic diagram of the droplet arrange | positioned at the cross | intersection part. 10A is a plan view corresponding to FIG. 7B, FIG. 10B is a plan view corresponding to FIG. 7C, and FIG. 10C is FIG. FIG. 10D is a plan view corresponding to FIG. 8A. It is a schematic diagram of the droplet arrange | positioned at the cross | intersection part. 11A is a plan view corresponding to FIG. 7B, FIG. 11B is a plan view corresponding to FIG. 7C, and FIG. 11C is FIG. It is a top view corresponding to d), and Drawing 11 (d) is a top view corresponding to Drawing 8 (a). FIG. 12A is a schematic view of a liquid crystal display device as a preferred embodiment of the display device of the present invention, FIG. 12A is a plan view, and FIG. 12B is an H-H ′ sectional view in the plan view. FIG. 2 is a schematic plan view and a schematic cross-sectional view of a liquid crystal display device 500. 1 is a perspective view showing a mobile personal computer as a preferred embodiment of an electronic apparatus of the present invention. It is sectional drawing which shows typically the structure of the conventional capacitive touch panel apparatus.

DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. In the following drawings, in order to make each configuration easy to understand, the actual structure and the scale and number of each structure are different.
<Touch panel device>
First, the touch panel device of the present invention will be described.
FIG. 1 is a schematic plan view of a touch panel device 100 according to the present embodiment. FIG. 2 is a schematic cross-sectional view of the touch panel device 100 taken along the line AA ′.

The touch panel device 100 includes a substrate (touch panel substrate) 1, an input region 2, and routing wiring 60.
The board | substrate 1 is shape | molded by the rectangular shape by planar view, and has a light transmittance and insulation. The substrate 1 is composed of various glass materials such as soda glass, non-alkali glass, borosilicate glass, and quartz glass, and various resin materials such as polyimide resin, acrylic resin, polyester resin, and polycarbonate resin. Can be used.

The input area 2 is an area surrounded by an alternate long and short dash line in FIG. 1 and is an area for detecting position information input to the touch panel.
In the input region 2, a plurality of X electrodes 10 and a plurality of Y electrodes 20 are arranged. The X electrode 10 extends along the X-axis direction (first direction) in the drawing, and the plurality of X electrodes 10 are arranged along the Y-axis direction (second direction). The Y electrodes 20 extend in the Y-axis direction in the drawing, and each Y electrode 20 is arranged along the X-axis direction. The X electrode 10 and the Y electrode 20 cross in the input region 2 by crossing each other's bridge wiring (bridge wiring 11, bridge wiring 21). Note that the bridge wiring 11 and the bridge wiring 21 are prevented from contacting each other because the insulating film 30 is interposed therebetween.

The X electrode 10 includes a plurality of island-shaped electrode portions 12 arranged in the X-axis direction (first direction) and a bridge wiring (first bridge wiring) 11 that connects adjacent island-shaped electrode portions 12 to each other. I have. The island-shaped electrode portion 12 is formed in a rectangular shape in plan view, and is arranged so that one diagonal line is along the X axis.
The Y electrode 20 includes a plurality of island-shaped electrode portions 22 arranged in the Y-axis direction (second direction) and a bridge wiring (second bridge wiring) 21 that connects adjacent island-shaped electrode portions 22 to each other. I have. The island-shaped electrode part 22 is formed in a rectangular shape in plan view, and is arranged so that one diagonal line is along the Y axis.

The island-like electrode portions 12 and the island-like electrode portions 22 are alternately arranged (checkered arrangement) in the X-axis direction and the Y-axis direction, and in the input region 2, the rectangular island-like electrode portions 12 and the island-like shapes are arranged. The electrode portions 22 are arranged in a matrix in plan view.
Each of the island electrode portion 12 and the island electrode portion 22 is one or two selected from the group consisting of ITO, IZO (indium zinc oxide; registered trademark), IGZO, FTO, ZnO, AZO, and ATO. It is preferably composed of more than one kind of material. Thereby, the transparency of the island-like electrode portion 12 and the island-like electrode portion 22 can be made particularly excellent, and the pattern of the island-like electrode portion (the island-like electrode portion 12, the island-like electrode portion 22) can be given to the user. Can be more reliably prevented from being seen.
The average thickness of the island-shaped electrode portion 12 and the island-shaped electrode portion 22 is preferably 20 nm or more and 300 nm or less, and more preferably 40 nm or more and 100 nm or less. Thereby, it can prevent more reliably that a user sees the pattern of the island-like electrode part (the island-like electrode part 12, the island-like electrode part 22), ensuring electrical conductivity.
The lead wiring 60 is connected to the X electrode 10 and the Y electrode 20, and is connected to a drive unit and an electric signal conversion / calculation unit (both not shown) provided in the touch panel device 100 or in an external device. Yes.

Next, the sectional view of FIG. 2 will be described.
An island-like electrode portion 12 (not shown), an island-like electrode portion 22, and a bridge wiring 11 are provided on the functional surface 1a, which is one surface of the substrate 1. In addition, a polyaniline film (first polyaniline film) 13 made of polyaniline is provided on the surface of the bridge wiring 11. Further, a polyaniline film (second polyaniline film) 23 made of polyaniline is provided on the surface of the bridge wiring 21. An insulating film 30 is provided between the bridge wiring 11 and the bridge wiring 21. In addition, the routing wiring 60 is disposed on the functional surface 1 a which is one surface of the substrate 1. The routing wiring 60 includes a first layer 60a disposed on the functional surface 1a and a second layer 60b stacked on the first layer 60a. A polyaniline film 61 made of polyaniline is provided on the surface of the routing wiring 60 (the surface of the second layer 60b). An insulating protective film 62 is formed so as to cover the routing wiring 60. A planarizing film 40 is formed to cover these electrodes and wiring. A protective substrate 50 is disposed on the planarizing film 40 via an adhesive layer 51. A shield layer 70 is provided on the back surface 1 b of the substrate 1.

  At least the central portions of the plurality of island-shaped electrode portions 12 and the island-shaped electrode portions 22 that constitute the touch panel device 100 are located on the same plane that is at an equal distance from the substrate 1. In this case, the separation distance between the touch surface of the touch panel device 100 and each of the island-shaped electrode portions (the island-shaped electrode portion 12 and the island-shaped electrode portion 22) is also substantially equal. The variation in electrostatic capacitance generated between the two is suppressed. For this reason, when detecting a touch position based on the change of electrostatic capacitance, the detection accuracy can be improved.

  Each of the bridge wiring 11 and the bridge wiring 21 is composed of one or more materials selected from the group consisting of ITO, IZO, IGZO, FTO, ZnO, AZO, and ATO. preferable. As a result, the transparency of the bridge wiring 11 and the bridge wiring 21 can be made particularly excellent, and the adhesion between the polyaniline coating (rianiline coating 13 and rianiline coating 23) and the insulating film 30 is particularly excellent. The reliability of the touch panel device 100 can be made particularly excellent.

  The polyaniline film 13 is provided so as to contact both the bridge wiring 11 and the insulating film 30. By having such a polyaniline coating 13, the adhesion between the bridge wiring 11 and the insulating film 30 (adhesion through the polyaniline coating 13) can be improved, and the durability of the touch panel device 100 can be improved. Reliability can be improved. Further, by having the polyaniline coating 13, the conductivity between the island-shaped electrode portion 12 and the island-shaped electrode portion 12 connected by the bridge wiring 11 (conductivity as the bridge wiring 11 and the polyaniline coating 13 as a whole) is particularly excellent. Therefore, sensing with higher stability can be realized. In the illustrated configuration, the polyaniline film 13 is provided on the entire surface of the bridge wiring 11 (a part outside the part in contact with the substrate 1), but the polyaniline film (first polyaniline film) 13 is formed on the bridge wiring 11. (First bridge wiring) 11 may be provided so as to cover only a part of the surface.

  The polyaniline coating 23 is provided in contact with both the bridge wiring 21 and the insulating film 30. By having such a polyaniline coating 23, the adhesion between the bridge wiring 21 and the insulating film 30 (adhesion through the polyaniline coating 23) can be improved, and the durability of the touch panel device 100 can be improved. Reliability can be improved. Further, by having the polyaniline coating 23, the conductivity between the island-like electrode portion 12 and the island-like electrode portion 12 connected by the bridge wiring 21 (conductivity as the bridge wiring 11 and the polyaniline coating 13 as a whole) is particularly excellent. Therefore, sensing with higher stability can be realized. In the illustrated configuration, the polyaniline film 23 is provided on the entire surface of the bridge wiring 21 (the part outside the part in contact with the substrate 1). However, the polyaniline film (second polyaniline film) 23 is formed on the bridge wiring 21. (Second bridge wiring) 21 may be provided so as to cover only a part of the surface of 21.

  Polyaniline is highly transparent and has a small refractive index difference from the constituent materials of the bridge wiring (bridge wiring 11 and bridge wiring 21) as described above. Therefore, it is possible to reliably prevent the user from seeing the pattern of the bridge wirings 11 and 21 (polyaniline coatings 13 and 23), and to reliably prevent the appearance of the touch panel device 100 from being adversely affected. it can.

  In this embodiment, both the polyaniline film 13 and the polyaniline film 23 are formed by a liquid phase film formation method. Thereby, the following effects are obtained. That is, the composition (polyaniline film forming composition) used for forming the polyaniline film 13 and the polyaniline film 23 is excellent in affinity with the bridge wiring 11 and the bridge wiring 21 made of the materials described above. For this reason, at the time of manufacturing a touch panel device (when forming a polyaniline film), the polyaniline film forming composition is selectively attached to the target site (the surface of the bridge wiring) to easily form the polyaniline film with the target pattern. In addition, the adhesiveness with the bridge wiring can be strengthened while forming reliably. Further, by forming the polyaniline film 13 and the polyaniline film 23 by the liquid phase film forming method, the productivity of the touch panel device 100 can be made particularly excellent, and the manufacturing cost can be suppressed.

Examples of the liquid phase film forming method for forming the polyaniline coating 13 and the polyaniline coating 23 include a screen printing method, an ink jet method, a sol-gel method, and the like, and an ink jet method is preferable. Thus, partial film formation is possible without preparing a mask or the like that covers the non-film formation region. Further, even if the polyaniline coating 13 and the polyaniline coating 23 to be formed have a fine pattern, it can be suitably handled.
The polyaniline constituting the polyaniline coating 13 and the polyaniline coating 23 is preferably represented by the following formula (1).

  Thereby, the stability of the polyaniline coating (polyaniline coating 13, polyaniline coating 23) is sufficiently excellent, and the conductivity of the polyaniline coating and the adhesion to the bridge wiring (bridge wiring 11, bridge wiring 21) and the insulating film 30 are improved. The touch panel device 100 can be made particularly excellent in reliability.

In formula (1), n is 0.3 or more and 0.7 or less, but is preferably 0.4 or more and 0.6 or less. Moreover, in Formula (1), m is 0.3 or more and 0.7 or less, but is preferably 0.4 or more and 0.6 or less.
The degree of polymerization of the polyaniline constituting the polyaniline coating 13 and the polyaniline coating 23 is preferably 100 or more and 100,000 or less, more preferably 1000 or more and 50000 or less. When the degree of polymerization of the polyaniline is within the above range, the conductivity of the polyaniline film, the adhesion to the bridge wiring (bridge wiring 11, bridge wiring 21) and the insulating film 30, the film strength, etc. are particularly excellent. Thus, the reliability of the touch panel device 100 can be made particularly excellent.

  The average thickness of the polyaniline coating 13 and the polyaniline coating 23 is preferably 0.04 μm or more and 0.4 μm or less, and more preferably 0.08 μm or more and 0.2 μm or less. When the average thickness of the polyaniline coating 13 and the polyaniline coating 23 is a value within the above range, the pattern of the polyaniline coating (polyaniline coating 13 and polyaniline coating 23) is reliably prevented from being visually recognized, and the bridge portion The resistance can be reduced, and the adhesion of the polyaniline film to the bridge wiring (bridge wiring 11 and bridge wiring 21) and the insulating film 30, the film strength, and the like can be made particularly excellent. The reliability can be made particularly excellent.

The insulating film 30 insulates the bridge wiring 11 and the bridge wiring 21 that intersect three-dimensionally. The insulating film 30 can be formed, for example, by applying polysiloxane, acrylic resin, acrylic monomer or the like using a printing method, and drying and solidifying it.
When formed using polysiloxane, the insulating film 30 is an inorganic insulating film made of silicon oxide. When acrylic resin and acrylic monomer are employed, the insulating film 30 is an organic insulating film made of a resin material.

The relative dielectric constant of the constituent material of the insulating film 30 is preferably 4.0 or less, and more preferably 3.5 or less. Thereby, the parasitic capacitance in the intersection part of bridge wiring can be reduced, and the position detection performance of a touch panel can be made more excellent.
In addition, the refractive index of the constituent material of the insulating film 30 is preferably 2.0 or less, and more preferably 1.7 or less. Thereby, the refractive index difference with the board | substrate 1, X electrode 10, and Y electrode 20 can be made small, and it can prevent more reliably that a user sees the pattern of the insulating film 30. FIG.

The first layer 60a of the routing wiring 60 is obtained by extending the X electrode 10 or the Y electrode 20 to a region outside the input region 2, and is a group made of ITO, IZO, IGZO, FTO, ZnO, AZO, and ATO. It is preferably composed of one or two or more materials selected from the following.
The second layer 60b is laminated on the first layer 60a, and reduces the wiring resistance of the routing wiring 60. As a constituent material of the second layer 60b, for example, a material containing at least one of a metal such as Au, Ag, Al, Cu, and Pd and carbon (nanocarbon such as graphite and carbon nanotube) is used. . In addition, the second layer 60b can be formed using an organic compound, nanoparticles, nanowires, or the like containing the above materials. The constituent material of the second layer 60b is not particularly limited as long as the sheet resistance can be made smaller than that of the first layer 60a.

  In the present embodiment, a polyaniline film (third polyaniline film) 61 made of polyaniline is provided on the surface of the routing wiring 60 (the surface of the second layer 60b). Thus, by providing the polyaniline film 61 on the surface of the routing wiring 60, the disconnection of the routing wiring 60 can be more reliably prevented, and the durability and reliability of the touch panel device 100 are particularly excellent. can do. Further, by having the polyaniline coating 61, it is possible to prevent oxidation of the metal material constituting the routing wiring 60 (second layer 60b) and to form a stable passive film, which is more stable. Sensing can be realized. Such an effect is considered to be due to the fact that polyaniline has noble metal properties (high redox potential). In the illustrated configuration, the polyaniline film 61 is provided on the entire surface of the second layer 60b of the routing wiring 60 (the part outside the part in contact with the first layer 60a). However, the polyaniline film (third polyaniline film) is provided. The coating 61 may be provided so as to cover only a part of the surface of the second layer 60 b of the routing wiring 60.

  In the present embodiment, the polyaniline film 61 is formed by a liquid phase film formation method. Thereby, the following effects are obtained. That is, the composition (polyaniline film forming composition) used for forming the polyaniline film 61 is excellent in affinity with the lead wiring 60 (second layer 60b) made of the material as described above. For this reason, at the time of manufacturing the touch panel device 100 (at the time of forming the polyaniline film 61), the composition for forming the polyaniline film is selectively attached to the target portion (the surface of the routing wiring 60 (second layer 60b)), While easily and reliably forming the polyaniline film 61 having a desired pattern, the adhesion to the lead wiring 60 (second layer 60b) can be strengthened. Further, by forming the polyaniline film 61 by a liquid phase film forming method, the productivity of the touch panel device 100 can be made particularly excellent, and the manufacturing cost can be suppressed.

As the liquid phase film forming method for forming the polyaniline film 61, an ink jet method is particularly preferable. Thus, partial film formation is possible without preparing a mask or the like that covers the non-film formation region. Further, even if the polyaniline film 61 to be formed has a fine pattern, it can be suitably handled.
The polyaniline constituting the polyaniline film 61 preferably satisfies the same conditions as the polyaniline as the constituent material of the polyaniline film 13 and the polyaniline film 23 described above. As a result, the stability of the polyaniline coating 61 is sufficiently excellent, and the conductivity of the polyaniline coating 61 and the adhesion to the lead wiring 60 (second layer 60b) and the insulating protective film 62 are particularly excellent. The reliability of the touch panel device 100 can be made particularly excellent.

Further, the average thickness of the polyaniline coating 61 is preferably 0.04 μm or more and 0.4 μm or less, and more preferably 0.08 μm or more and 0.2 μm or less. When the average thickness of the polyaniline coating 61 is within the above range, the resistance at the portion where the routing wiring 60 is provided can be reliably reduced, and the routing wiring 60 of the polyaniline coating 61 (second layer) 60b), the adhesion to the insulating protective film 62, the film strength, and the like can be made particularly excellent, and the reliability of the touch panel device 100 can be made particularly excellent.
The insulating protective film 62 that covers the routing wiring 60 is made of an insulating material, like the insulating film 30. For example, printing using polysiloxane, an acrylic resin, an acrylic monomer, or the like as a forming material is used. It can be formed by the method. Therefore, the insulating protective film 62 can be formed at the same time in the process of forming the insulating film 30.

The planarizing film 40 is formed so as to cover at least the input region 2 of the functional surface 1a of the substrate 1 and planarizes unevenness on the functional surface 1a side due to the X electrode 10 and the Y electrode 20. As shown in the drawing, the planarizing film 40 is preferably formed so as to cover substantially the entire functional surface 1a (excluding the external connection terminal portion). Since the functional surface 1a side of the substrate 1 is planarized by the planarizing film 40, the substrate 1 and the protective substrate 50 can be bonded uniformly over almost the entire surface.
Further, the refractive index of the constituent material of the planarizing film 40 is preferably 2.0 or less, and more preferably 1.7 or less. Thereby, the refractive index difference with the board | substrate 1, the X electrode 10, and the Y electrode 20 can be made small, and the wiring pattern of the X electrode 10 or the Y electrode 20 can be made hard to see for a user.

  The protective substrate 50 is light transmissive. The protective substrate 50 is composed of various glass materials such as soda glass, non-alkali glass, borosilicate glass, and quartz glass, and various resin materials such as polyimide resin, acrylic resin, polyester resin, and polycarbonate resin. Can be used. Alternatively, when the touch panel device 100 of the present embodiment is disposed on the front surface of a display device such as a liquid crystal panel or an organic EL panel, an optical element substrate (polarizing plate or A phase difference plate or the like can also be used. The protective substrate 50 may be a joined body of a plate material made of the glass material or resin material and the optical element substrate, for example.

The shield layer 70 is made of, for example, one or two or more materials (transparent conductive material) selected from the group consisting of ITO, IZO, IGZO, FTO, ZnO, AZO, and ATO. It can be formed by forming a film on the surface opposite to 1a. Moreover, it is good also as a structure which prepared the film comprised with the said transparent conductive material, and adhere | attached the said film on the back surface 1b of the board | substrate 1. FIG.
By providing the shield layer 70, the electric field is effectively cut off on the back surface 1 b side of the substrate 1. Thereby, it is possible to prevent the electric field of the touch panel device 100 from acting on the display device or the like, or the electric field of an external device such as the display device from acting on the touch panel device 100.
In the configuration shown in FIG. 2, the shield layer 70 is provided on the back surface 1 b of the substrate 1. However, as shown in FIG. 3, the shield layer 70 </ b> A can be formed on the functional surface 1 a side of the substrate 1.

  In the touch panel device 100A shown in FIG. 3, a shield layer 70A is formed on the functional surface 1a of the substrate 1, and an insulating film 80A is formed to cover the shield layer 70A. The configuration on the insulating film 80A is the same as that of the touch panel device 100 shown in FIG. In the touch panel device 100A, since the shield layer 70A, the X electrode 10, the Y electrode 20, the routing wiring 60, and the like are formed on one surface of the substrate 1, the manufacturing process can be avoided, and the productivity of the touch panel device is particularly improved. It can be excellent.

Here, the operation principle of the touch panel device 100 will be briefly described.
First, a predetermined potential is supplied to the X electrode 10 and the Y electrode 20 from the driving unit (not shown) through the lead wiring 60.
For example, a ground potential (ground potential) is input to the shield layer 70.
When a finger is brought closer to the input region 2 from the protective substrate 50 side in the state where the potential is supplied as described above, each of the finger brought close to the protective substrate 50 and each of the X electrode 10 and the Y electrode 20 in the vicinity of the approach position. Parasitic capacitance is formed between Then, in the X electrode 10 and the Y electrode 20 in which the parasitic capacitance is formed, a temporary potential drop is caused to charge the parasitic capacitance.

The drive unit senses the potential of each electrode, and immediately detects the X electrode 10 and the Y electrode 20 in which the above-described potential drop has occurred. Then, the position information of the finger in the input area 2 is detected by analyzing the detected electrode position by the electric signal conversion / calculation unit.
Specifically, the Y coordinate in the input area 2 at the position where the finger approaches is detected by the X electrode 10 extending in the X axis direction, and the X electrode in the input area 2 is detected by the Y electrode 20 extending in the Y axis direction. Coordinates are detected.

<Method for manufacturing touch panel device>
Next, a method for manufacturing the touch panel device will be described.
Hereinafter, a method of manufacturing the touch panel device 100 shown in FIGS. 1 and 2 will be described with reference to the drawings. FIG. 4 is a process diagram showing a preferred embodiment of a manufacturing method of a touch panel device, FIG. 5 is a perspective view showing a schematic configuration of a droplet discharge device IJ, and FIG. 6 explains a principle of discharging a liquid material by a piezo method. FIGS. 7, 8, and 9 are schematic cross-sectional views illustrating the manufacturing process of the touch panel device 100. FIG. 10 is an explanatory view showing more specifically the polyaniline film forming step (first polyaniline film forming step) S30, the insulating film forming step S40 and the bridge wiring forming step S50. FIG. 10A is a plan view corresponding to FIG. FIG. 10B is a plan view corresponding to FIG. FIG. 10C is a plan view corresponding to FIG. FIG. 10D is a plan view corresponding to FIG. Moreover, FIG. 11 is process drawing which shows the manufacturing method which concerns on a modification, and FIG. 11 (a)-FIG.11 (d) are figures corresponding to FIG.10 (a)-FIG.10 (d), respectively. .

  As shown in FIG. 4, the manufacturing method of the touch panel device according to the present embodiment has a first layer of island-shaped electrode portions 12, island-shaped electrode portions 22, bridge wirings 11, and routing wirings 60 on the functional surface 1 a of the substrate 1. An island-shaped electrode portion for forming 60a, a first bridge wiring forming step S10, a second layer forming step S20 for stacking the second layer 60b on the first layer 60a of the routing wiring 60, and completing the routing wiring 60; A polyaniline film forming step (first polyaniline film forming step) S30 in which a polyaniline film 13 is formed on the surface of the bridge wiring 11 and a polyaniline film 61 is formed on the surface of the routing wiring 60 (second layer 60b), and a polyaniline film An insulating film 30 is formed on the bridge wiring 11 covered with 13, and an insulating property is provided on the routing wiring 60 covered with the polyaniline film 61. An insulating film forming step S40 for forming the protective film 62, a second bridge wiring forming step S50 for forming the bridge wiring 21 for connecting the adjacent island electrode portions 22 via the insulating film 30, and a bridge A polyaniline film forming step (second polyaniline film forming step) S60 for forming the polyaniline film 23 on the surface of the wiring 21, and a flattening film forming step for forming the flattening film 40 for flattening the functional surface 1a side of the substrate 1 (Protective film forming step) S70, protective substrate bonding step (adhesive layer forming step) S80 for bonding the protective substrate 50 to the planarizing film 40 via the adhesive layer 51, and forming the shield layer 70 on the back surface 1b of the substrate 1. And a shield layer forming step (conductive film forming step) S90.

The manufacturing process of the touch panel device 100 of this embodiment includes a process of forming a film by a droplet discharge method which is a kind of printing method. Therefore, prior to the description of the method for manufacturing the touch panel device, the droplet discharge device will be described.
A droplet discharge device IJ shown in FIG. 5 includes a droplet discharge head 1001, an X-axis direction drive shaft 1004, a Y-axis direction guide shaft 1005, a control device CONT, a stage 1007, a cleaning mechanism 1008, and a base. 1009 and a heater 1015. As the droplet discharge device, an electromechanical conversion type droplet discharge device using a piezoelectric element (piezoelectric element) is preferably used.

The stage 1007 supports the substrate P to which a liquid material (pattern forming liquid material) is applied by the droplet discharge device IJ, and includes a fixing mechanism (not shown) that fixes the substrate P to a reference position. ing.
The droplet discharge head 1001 is a multi-nozzle type droplet discharge head including a plurality of discharge nozzles, and the longitudinal direction and the X-axis direction are made to coincide. The plurality of discharge nozzles are provided on the lower surface of the droplet discharge head 1001 at regular intervals. A liquid material is discharged from the discharge nozzle of the droplet discharge head 1001 to the substrate P supported by the stage 1007.

An X-axis direction drive motor 1002 is connected to the X-axis direction drive shaft 1004. The X-axis direction drive motor 1002 is a stepping motor or the like, and rotates the X-axis direction drive shaft 1004 when a drive signal in the X-axis direction is supplied from the control device CONT. When the X-axis direction drive shaft 1004 rotates, the droplet discharge head 1001 moves in the X-axis direction.
The Y-axis direction guide shaft 1005 is fixed so as not to move with respect to the base 1009. The stage 1007 includes a Y-axis direction drive motor 1003. The Y-axis direction drive motor 1003 is a stepping motor or the like, and moves the stage 1007 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device CONT.
The control device CONT supplies a droplet discharge control voltage to the droplet discharge head 1001. In addition, a driving pulse signal for controlling movement of the droplet discharge head 1001 in the X-axis direction is supplied to the X-axis direction driving motor 1002, and a driving pulse signal for controlling movement of the stage 1007 in the Y-axis direction is supplied to the Y-axis direction driving motor 1003. Supply.

  The cleaning mechanism 1008 is for cleaning the droplet discharge head 1001. The cleaning mechanism 1008 includes a Y-axis direction drive motor (not shown). The cleaning mechanism moves along the Y-axis direction guide shaft 1005 by driving the Y-axis direction drive motor. The movement of the cleaning mechanism 1008 is also controlled by the control device CONT.

Here, the heater 1015 is a means for heat-treating the substrate P by lamp annealing, and performs evaporation and drying of a solvent (solvent, dispersion medium) contained in the liquid material applied on the substrate P. The heater 1015 is also turned on and off by the control device CONT.
The droplet discharge device IJ is arranged in the X axis direction on the lower surface of the droplet discharge head 1001 with respect to the substrate P while relatively scanning the droplet discharge head 1001 and the stage 1007 supporting the substrate P. Droplets are ejected from a plurality of ejection nozzles.

  In FIG. 6, a piezo element 1022 is installed adjacent to a liquid chamber 1021 that stores a liquid material. The liquid material is supplied to the liquid chamber 1021 via a liquid material supply system 1023 including a material tank that stores the liquid material. The piezo element 1022 is connected to the drive circuit 1024, and a voltage is applied to the piezo element 1022 via the drive circuit 1024 to deform the piezo element 1022, whereby the liquid chamber 1021 is deformed and the liquid is discharged from the discharge nozzle 1025. Material is dispensed. In this case, the amount of distortion of the piezo element 1022 is controlled by changing the value of the applied voltage. Further, the strain rate of the piezo element 1022 is controlled by changing the frequency of the applied voltage. Since the droplet discharge by the piezo method does not apply heat to the material, it has an advantage of hardly affecting the composition of the material.

Here, the description returns to the method for manufacturing the touch panel device. Hereinafter, each process will be described in detail with reference to FIGS. In these process drawings, the process of forming the structure shown in FIG. 2 is shown.
[Island-like electrode part / first bridge wiring formation process]
First, the island-shaped electrode portion / first bridge wiring forming step S10 will be described.
In the island-shaped electrode portion / first bridge wiring forming step S10, for example, ITO, IZO, IGZO, FTO, ZnO, AZO are formed on the substrate 1 which is a glass substrate by the droplet discharge device IJ shown in FIG. And the droplet of the liquid material containing the electroconductive particle comprised from the 1 type, or 2 or more types of material selected from the group which consists of ATO is selectively provided (arrange | positioned). Specifically, on the substrate 1, the island-like electrode portion 12, the bridge wiring 11, the island-like electrode portion 22 that is a part of the Y electrode 20, and the island-like electrode portion 12 and the island-like electrode portion 22 are extended. A pattern of the liquid material composed of the first layer 60a of the drawn lead-out wiring 60 is formed. Thereafter, the liquid material (droplet) applied on the substrate 1 is dried. As a result, as shown in FIG. 7 (a), the X electrode 10 (island electrode portion 12, bridge wire 11), the island electrode portion 22, and the lead wire made of an aggregate of conductive particles are formed on the substrate 1 as shown in FIG. 60 first layers 60a are formed.

  In the present embodiment, in this step S10, by discharging droplets containing conductive particles, the island-shaped electrode portion 12, the bridge wiring 11, the island-shaped electrode portion 22, and the first layer 60a of the routing wiring 60 are formed. Although formed, instead of the droplet discharge method, for example, another liquid phase film formation method may be used. Further, a pattern forming method by a photolithography method may be used. That is, after forming a conductive film (for example, an ITO film) over almost the entire functional surface 1a of the substrate 1 by sputtering or the like, the conductive film is patterned by using a photolithography method and an etching method, whereby the island-shaped electrode portion 12, the bridge wiring 11, the island-shaped electrode portion 22, and the first layer 60 a of the routing wiring 60 may be formed.

  In addition, for the formation of the first layer 60a of the island-shaped electrode portion 12, the island-shaped electrode portion 22, the bridge wiring 11, and the routing wiring 60, a composition (liquid material) having the same composition may be used. You may use the composition (liquid material) of a different composition. Even when a composition having a different composition is used in each part, an ink jet method using a droplet discharge device can be suitably used. Further, the formation of the first layer 60a of the island-shaped electrode portion 12, the island-shaped electrode portion 22, the bridge wiring 11, and the routing wiring 60 may be formed at the same time or in a predetermined order. There may be. For example, after the droplets are ejected in a pattern corresponding to the island-shaped electrode portions 12 and the island-shaped electrode portions 22 to be formed and dried to form the island-shaped electrode portions 12 and the island-shaped electrode portions 22, the bridge wiring 11 Alternatively, the droplets may be discharged in a pattern corresponding to the first layer 60 a of the routing wiring 60 and dried to form the bridge wiring 11 and the first layer 60 a of the routing wiring 60.

[Second layer forming step]
Next, the second layer forming step S20 will be described.
In the second layer forming step S20, droplets of a liquid material containing the constituent material of the second layer 60b of the routing wiring 60 are discharged and arranged on the first layer 60a by the droplet discharge device IJ. As the liquid material for forming the second layer 60b, for example, a liquid material containing metal particles such as silver particles can be used. Thereafter, the discharged droplets are dried. As a result, as shown in FIG. 7B, a low-resistance second layer 60b is formed on the first layer 60a, and a routing wiring 60 having a two-layer structure is formed on the substrate 1 outside the input region 2. The

  As a liquid material for forming the second layer 60b of the routing wiring 60, for example, a liquid material containing metal particles such as silver particles or a liquid material containing graphite or carbon nanotubes can be used. Metal particles and carbon particles are dispersed in the liquid material in the form of nanoparticles and nanowires. When the second layer 60b is a metal film, a liquid material containing an organometallic compound may be used.

[Polyaniline film forming step (first polyaniline film forming step)]
Next, the polyaniline film forming step (first polyaniline film forming step) S30 will be described.
In the polyaniline film forming step (first polyaniline film forming step) S30, as shown in FIG. 10B, droplets of a liquid material containing polyaniline are discharged onto the surface of the bridge wiring 11 by the droplet discharge device IJ. Deploy. Thereafter, the discharged droplets are dried. As a result, a polyaniline film (first polyaniline film) 13 is formed on the surface of the bridge wiring 11 as shown in FIG. Further, in this step, liquid material droplets containing polyaniline are discharged and arranged on the surface of the bridge wiring 11 and are also discharged and arranged on the surface of the second layer 60 b of the routing wiring 60. As a result, a polyaniline film (first polyaniline film) 13 is formed on the surface of the bridge wiring 11, and a polyaniline film (third polyaniline film) 61 is formed on the surface of the second layer 60b of the routing wiring 60. .

  As described above, the composition (polyaniline film forming composition) used for forming the polyaniline film 13 and the polyaniline film 61 includes the bridge wiring 11 and the lead wiring 60 (second layer 60b) made of the materials described above. Excellent affinity. For this reason, in this step, the composition (polyaniline film forming composition) is selectively attached to the target site (the surface of the bridge wiring 11 and the surface of the routing wiring 60 (second layer 60b)). A polyaniline film having a pattern to be formed can be easily and reliably formed. Further, the adhesion of the formed polyaniline coating 13 to the bridge wiring 11 and the adhesion of the polyaniline coating 61 to the routing wiring 60 (second layer 60b) can be strengthened.

  The polyaniline film (first polyaniline film) 13 and the polyaniline film (third polyaniline film) 61 may be formed using compositions (liquid materials) having the same composition or different compositions. A composition (liquid material) may be used. Even when a composition having a different composition is used in each part, an ink jet method using a droplet discharge device can be suitably used. The polyaniline film (first polyaniline film) 13 and the polyaniline film (third polyaniline film) 61 may be formed simultaneously or in a predetermined order. Good. For example, after discharging droplets in a pattern corresponding to the polyaniline film (first polyaniline film) 13 to be formed and drying to form the polyaniline film (first polyaniline film) 13, the polyaniline film (third The polyaniline coating (third polyaniline coating) 61 may be formed by discharging droplets in a pattern corresponding to the (polyaniline coating) 61 and drying.

[Insulating film formation process]
Next, the insulating film forming step S40 will be described.
In the insulating film forming step S30, the droplets are selectively placed on the region on the polyaniline film 13 by the droplet discharge device IJ, as shown in FIGS. 7D and 10C. Thereafter, the liquid material on the substrate 1 is heated and solidified by drying, whereby the insulating film 30 is formed on the polyaniline coating 13.

  When forming the insulating film 30, it is preferable to dispose droplets at least in a region on the polyaniline film 13 without any gap as shown in FIG. Thereby, the insulating film 30 having no holes or cracks reaching the polyaniline coating 13 can be formed, and insulation failure in the insulating film 30 and disconnection of the polyaniline coating 23 and the bridge wiring 21 are prevented.

Further, as shown in FIG. 7 (d), the droplets are selectively disposed not only on the region on the polyaniline film 13 but also on the region on the polyaniline film 61. Thereafter, the liquid material on the substrate 1 is heated and dried and solidified to form an insulating protective film 62 that covers the polyaniline film 61.
As the liquid material, for example, a liquid material containing polysiloxane, an acrylic resin, or an acrylic monomer can be used.

[Second Bridge Wiring Formation Process]
Next, the second bridge wiring formation step S50 will be described.
In the second bridge wiring formation step S50, as shown in FIG. 8A and FIG. 10D, ITO, IZO and over the island-like electrode portions 22 and the insulating film 30 arranged adjacent to each other. A liquid material droplet containing conductive particles made of one or more materials selected from the group consisting of ZnO is applied (arranged) to the wiring shape. Thereafter, the liquid material on the substrate 1 is dried and solidified. Thereby, the bridge wiring 21 that connects the island-shaped electrode portions 22 is formed.
In the bridge wiring formation step S40, it is preferable to form the bridge wiring 21 by using the same liquid material as that used in the island-shaped electrode portion / first bridge wiring formation step S10.

[Polyaniline film forming step (second polyaniline film forming step)]
Next, the polyaniline film forming step (second polyaniline film forming step) S60 will be described.
In the polyaniline film forming step (second polyaniline film forming step) S60, droplets of a liquid material containing polyaniline are discharged and arranged on the surface of the bridge wiring 21 by the droplet discharge device IJ. Thereafter, the discharged droplets are dried. Thereby, as shown in FIG. 8B, a polyaniline film (second polyaniline film) 23 is formed on the surface of the bridge wiring 21.

  As described above, the composition (polyaniline film forming composition) used for forming the polyaniline film 23 is excellent in affinity with the bridge wiring 21 made of the material as described above. Therefore, in this step, the composition (polyaniline film-forming composition) is selectively attached to the target site (the surface of the bridge wiring 21), and the polyaniline film 23 having the target pattern is easily and reliably formed. can do. Moreover, the adhesiveness with respect to the bridge | bridging wiring 21 of the polyaniline film 23 formed can be strengthened.

[Planarization film forming process]
Next, the planarization film forming step S70 will be described.
In the planarization film forming step S70, as shown in FIG. 8C, a planarization film 40 made of an insulating material is formed on almost the entire functional surface 1a side for the purpose of planarizing the functional surface 1a side of the substrate 1. To do.
The planarizing film 40 can be formed using a liquid material similar to the liquid material for forming the insulating film 30 used in the insulating film forming step S40, but for the purpose of planarizing the functional surface 1a side of the substrate 1 Therefore, it is preferable to use a resin material.

[Protective substrate bonding process]
Next, the protective substrate bonding step S80 will be described.
In the protective substrate bonding step S80, as shown in FIG. 9A, an adhesive is disposed between the protective substrate 50 and the planarization film 40 that are separately prepared, and protection is performed via an adhesive layer 51 made of the adhesive. The substrate 50 and the planarizing film 40 are bonded together. The protective substrate 50 is composed of various glass materials such as soda glass, non-alkali glass, borosilicate glass, and quartz glass, and various resin materials such as polyimide resin, acrylic resin, polyester resin, and polycarbonate resin. In addition to the light-transmitting transparent substrate, an optical element substrate such as a polarizing plate or a retardation plate may be used. The protective substrate 50 may include the optical element substrate in addition to the plate material made of the glass material or the resin material, for example. In this case, the plate material and the optical element substrate may be prepared separately and joined in this step. As the adhesive constituting the adhesive layer 51, a transparent resin material or the like can be used.

[Shield layer formation process]
Next, the shield layer forming step S90 will be described.
In the shield layer forming step S90, as shown in FIG. 9B, a shield layer 70 made of a conductive film is formed on the back surface 1b of the substrate 1 (the surface opposite to the functional surface 1a). The shield layer 70 can be formed using a known film formation method such as a vacuum film formation method, a screen printing method, an offset method, or a droplet discharge method. For example, when the shield layer 70 is formed using a printing method such as a droplet discharge method, the ITO used in the island-shaped electrode portion / first bridge wiring formation step S10 and second bridge wiring formation step S50, A liquid material containing conductive particles composed of one or more materials selected from the group consisting of IZO and ZnO can be suitably used.
In addition to the method of forming the shield layer 70 by film formation on the substrate 1, a film having a conductive film formed on one surface or both surfaces thereof is separately prepared and the film is bonded to the back surface 1b of the substrate 1. The conductive film on the film may be used as the shield layer 70.

For example, the insulating film 30 may be formed as shown in FIG. Hereinafter, the method shown in FIG. 11 will be described.
First, as described above (see FIG. 10B), a polyaniline film (first polyaniline film) 13 is formed on the surface of the bridge wiring 11 (see FIG. 11B).
Thereafter, as shown in FIG. 11C, in the insulating film forming step S40, the insulating film 30 having a partially constricted shape is formed. More specifically, the width of the insulating film 30 in the arrangement direction of the island-shaped electrode portions 22 (the extending direction of the Y electrode 20) is narrow at the center portion 30a in the horizontal direction (the extending direction of the X electrode 10) in the drawing, It forms so that it may become gradually wide toward the edge parts 30b and 30b.

  In the second bridge wiring formation step S50, as shown in FIG. 11D, the bridge wiring 21 is formed so as to pass through the central portion 30a (constricted portion) of the insulating film 30. With such a manufacturing method, when a droplet for forming the bridge wiring 21 is disposed on the substrate 1, the protruding portion on the end 30 b side of the insulating film 30 wets and spreads the droplet. It functions as a weir member that prevents Thereby, it is possible to effectively prevent the bridge wiring 21 and the X electrode 10 from being short-circuited, and the touch panel device 100 can be manufactured with a high yield.

According to the manufacturing method of the touch panel device 100 of the present embodiment described in detail above, the following effects can be obtained.
First, in the manufacturing method of the present embodiment, the connection structure of the Y electrode 20 intersecting with the X electrode 10 is formed by using a droplet discharge method, so that the number of man-hours can be reduced as compared with the conventional method. The manufacturing cost of the apparatus can be suppressed.
More specifically, in the conventional connection structure forming step, (1) a step of forming an interlayer insulating film, (2) a step of forming a contact hole in the interlayer insulating film, and (3) a region including the contact hole. And a step of patterning the bridge wiring.

As is apparent from a comparison between the above-described conventional process and the process of the present embodiment, in the manufacturing method according to the present embodiment, a photolithography process (and an etching process) for forming a contact hole in the interlayer insulating film in the conventional process. ), And a photolithography process and an etching process for patterning the bridge wiring are also unnecessary.
Therefore, according to the manufacturing method of the present embodiment, the costly photolithography process can be reduced, and the manufacturing cost of the touch panel device can be reduced. Further, in the droplet discharge method, since droplets are selectively arranged only in the region where each film is formed, the amount of material used can be suppressed, and the raw material cost also contributes to a reduction in manufacturing cost.

  In the manufacturing method of the present embodiment, the X electrode 10 (the island-shaped electrode portion 12 and the bridge wiring 11) and the island-shaped electrode portion 22 are formed in the same layer on the substrate 1. Thereby, compared with the case where the X electrode 10 and the Y electrode 20 are formed in separate layers via an interlayer insulating film, the man-hour required for patterning the X electrode 10 or the Y electrode 20 can be reduced. Manufacturing cost can be reduced.

  In the manufacturing method of the present embodiment, the rectangular island-shaped electrode portions 12 and the island-shaped electrode portions 22 are formed on the substrate 1 in a staggered matrix, and the adjacent island-shaped electrode portions 12 and the adjacent islands are formed. The electrode portions 22 are arranged so as to be close to each other at their corners. The corner portions of the adjacent island electrode portions 12 are connected by the bridge wiring 11, and the corner portions of the adjacent island electrode portions 22 are connected by the bridge wiring 11. Thereby, adjacent island-shaped electrode parts 12 and island-shaped electrode parts 22 can be connected with the shortest distance, and the length of the bridge wirings 11 and 21 can be made the shortest. Therefore, it is possible to reduce the plane area of the intersection between the X electrode 10 and the Y electrode 20 and to make the structure at the intersection difficult to visually recognize.

Moreover, since the bridge wiring 11 and the bridge wiring 21 with a narrow line width can be shortened, the wiring resistance of the X electrode 10 and the Y electrode 20 can be reduced.
In addition, in this embodiment, although the shape of the island-shaped electrode part 12 and the island-shaped electrode part 22 is a square in plan view, other than this, for example, a rectangular shape such as a rhombus, a polygonal shape, It may be circular or the like.

  Further, in the method shown in FIG. 11, the insulating film 30 is formed in a planar shape constricted in a region where the bridge wiring 21 is formed. As a result, the insulating film 30 located on the side of the constricted region can suppress the wetting and spreading of the droplets of the bridge wiring 21, thereby preventing erroneous wiring in which the X electrode 10 and the Y electrode 20 are connected. The manufacturing yield of the touch panel device can be improved.

  Further, in the touch panel device 100 of the present embodiment, the routing wiring 60 formed around the input region 2 includes a first layer 60a in which the X electrode 10 and the Y electrode 20 are extended, and a sheet rather than the first layer 60a. It has a structure in which a second layer 60b having a low resistance is stacked. Thereby, a touch panel device in which the wiring resistance of the routing wiring 60 is reduced can be obtained. Therefore, the scale of peripheral circuits such as a buffer circuit that amplifies the signal from the input region 2 can be reduced, so that power consumption can be further suppressed.

In the touch panel device 100 of the present embodiment, it is preferable that the insulating protective film 62 around the input region 2 is formed of a material containing the same component as the insulating film 30 formed at the intersection of the bridge wirings 11 and 21. . Thereby, since the insulating film 30 and the insulating protective film 62 can be formed in the same process, it becomes the structure which can reduce a man-hour and can reduce manufacturing cost.
In the touch panel device 100 of the present embodiment, the functional surface 1 a side of the substrate 1 is flattened by the flattening film 40. According to this configuration, the functional surface 1a side of the substrate 1 and the protective substrate 50 can be bonded almost over the entire surface, and bubbles can be prevented from being mixed into the adhesive layer 51. Further, the X electrode 10 and the Y electrode 20 formed on the substrate 1 can be protected by the planarizing film 40, and the reliability of the touch panel device 100 can be made particularly excellent.

In addition, since the protective substrate 50 is bonded to the planarizing film 40 via the adhesive layer 51, it is ensured that an air layer having a small refractive index is formed between the protective substrate 50 and the planarizing film 40. Can be prevented. As a result, it is possible to prevent light from being reflected at the interface between the air layer and the protective substrate 50 or the interface between the air layer and the planarizing film, thereby obtaining good quality as a touch panel device disposed on the front side of the display device. be able to.
In the touch panel device 100 of the present embodiment, the shield layer 70 is formed on the back surface 1 b of the substrate 1. Accordingly, an unnecessary electric field can be blocked by the shield layer 70, and noise can be prevented from entering the input area 2 of the touch panel device 100 and the electric field of the touch panel device 100 can be prevented from leaking to an external device such as a display device. can do.

  In the manufacturing method of the present invention, a polyaniline film may be formed on the surface of at least one of the first bridge wiring and the second bridge wiring by a liquid phase film forming method, thereby reducing the thickness and light transmittance. A high-capacitance capacitive touch panel device can be efficiently manufactured, but the first polyaniline film 13 is formed on the first bridge wiring 11 as in the present embodiment. In particular, the reliability of the manufactured touch panel device 100 is excellent by having both the polyaniline film forming step and the second polyaniline film forming step of forming the second polyaniline film 23 on the second bridge wiring 21. Can be.

<Display device>
Next, the display device of the present invention will be described.
In this embodiment, a liquid crystal display device including a touch panel device will be described as an example of the display device.
12A and 12B are schematic views of a liquid crystal display device as a preferred embodiment of the display device of the present invention. FIG. 12A is a plan view, and FIG. 12B is a cross-sectional view taken along line HH ′ in the plan view. is there.

As shown in FIG. 12A, the liquid crystal display device 500 includes an element substrate 410, a counter substrate 420, and an image display region 410a.
The element substrate 410 is a rectangular substrate having a wider plane area than the counter substrate 420.
The counter substrate 420 is an image display side in the liquid crystal display device 500, and various glass materials such as soda glass, alkali-free glass, borosilicate glass, and quartz glass, polyimide resin, acrylic resin, polyester resin, and polycarbonate resin. The substrate is made of a transparent material such as various resin materials. The counter substrate 420 is bonded to the central portion of the element substrate 410 through a sealing material 452.

The image display area 410 a is a planar area of the corresponding substrate 420 and is an inner area of a peripheral parting line 453 provided along the inner periphery of the sealing material 452.
In the periphery of the counter substrate 420 in the element substrate 410, the data line driving circuit 401, the scanning line driving circuit 404, the connection terminal 402 connected to the data line driving circuit 401 and the scanning line driving circuit 404, and the counter substrate 420 A wiring 405 or the like for connecting the scanning line driving circuits 404 arranged to face each other is arranged.

Next, a cross section of the liquid crystal display device 500 will be described.
A pixel electrode 409, an alignment film 418, and the like are stacked on the surface of the element substrate 410 on the liquid crystal layer 450 side.
A light shielding film (black matrix) 423, a color filter 422, a common electrode 425, an alignment film 429, and the like are stacked on the surface of the counter substrate 420 on the liquid crystal layer 450 side.

A liquid crystal layer 450 is sandwiched between the element substrate 410 and the counter substrate 420.
The touch panel device 100 of the present invention is arranged on the outer surface (opposite side of the liquid crystal layer 450) of the counter substrate 420 with the adhesive layer 101 interposed therebetween.
Since the liquid crystal display device 500 includes the touch panel device 100, position information such as a finger can be reliably detected. For example, the liquid crystal display device 500 can stably perform display according to the detection result over a long period of time. Of performance.

  Further, in the liquid crystal display device 500 of the present embodiment, each layer of the touch panel device 100 may be formed on the outer surface (opposite side of the liquid crystal layer 450) of the counter substrate 420. Thereby, the counter substrate 420 of the liquid crystal display device 500 and the substrate 1 of the touch panel device 100 can be made common, so that the manufacturing cost can be further reduced and the liquid crystal display device 500 can be reduced in weight.

The liquid crystal display device 500 may include the touch panel device 100A described above instead of the touch panel device 100.
In this embodiment, the liquid crystal display device has been described as an example of the display device of the present invention. However, the display device of the present invention is a display device other than the liquid crystal display device such as an organic EL device or an electrophoretic display device. May be.

<Electronic equipment>
Next, the electronic apparatus of the present invention will be described.
In this embodiment, a mobile personal computer will be described as an example of an electronic device.
FIG. 13 is a perspective view showing a mobile personal computer as a preferred embodiment of the electronic apparatus of the present invention.
As shown in FIG. 13, the mobile personal computer 1100 includes a display unit 1101 and a main body unit 1103 having a keyboard 1102. A mobile personal computer 1100 includes the liquid crystal display device 500 of the above embodiment in a display unit 1101.

Since the mobile personal computer 1100 includes the liquid crystal display device 500 in the display unit 1101, position information of a finger or the like can be reliably detected. For example, display according to the detection result is stable over a long period of time. High performance that can be done.
In this embodiment, a mobile personal computer has been described as an example of the electronic apparatus of the present invention. However, the electronic apparatus of the present invention is a mobile type such as a mobile phone, a portable audio device, a PDA (Personal Digital Assistant), etc. Electronic devices other than personal computers may be used.

As mentioned above, although this invention was demonstrated based on suitable embodiment, this invention is not limited to these.
For example, in the touch panel device, the display device, and the electronic device of the present invention, the configuration of each unit can be replaced with any configuration that exhibits the same function, and any configuration can be added.

  In the above-described embodiment, the case where the polyaniline coating is provided on the surfaces of both the first bridge wiring and the second bridge wiring is representatively described. However, the polyaniline coating is formed by using the first bridge wiring. And it may be provided only on one surface of the second bridge wiring. The polyaniline film is not limited to being formed on the entire surface of the first bridge wiring and / or the second bridge wiring, but may be provided only on a part of the surface.

  In the above-described embodiment, the shield layer 70 is described as being performed at the end of the touch panel device manufacturing process. However, the shield layer 70 can be formed at an arbitrary timing. For example, the board | substrate 1 in which the shield layer 70 was previously formed can also be used for the process after the island-shaped electrode part / first bridge wiring formation process S10. Moreover, you may arrange | position a shield layer formation process between the arbitrary processes to island-shaped electrode part and 1st bridge | bridging wiring formation process S10-protection board joining process S80.

In the above-described embodiment, the shield layer 70 is formed on the back surface 1b of the substrate 1. However, the shield layer 70A is provided on the functional surface 1a side of the substrate 1 like the touch panel device 100A according to the modification shown in FIG. Is formed, the step of forming the shield layer 70A and the step of forming the insulating film 80A are performed prior to the island-shaped electrode portion / first bridge wiring formation step S10. Also in this case, the shield layer 70A can be formed by the same method as in the shield layer forming step S90. Further, the formation process of the insulating film 80A can be the same as the insulating film formation process S40, for example.
In the above-described embodiment, in the insulating film forming step S40, as shown in FIG. 10, the insulating film 30 having a substantially rectangular shape in plan view is formed. However, the formation of the bridge wiring 21 is further facilitated. Therefore, the shape of the insulating film 30 may be changed.

  DESCRIPTION OF SYMBOLS 1 ... Board | substrate (touch panel board | substrate) 1a ... Functional surface 1b ... Back surface 10 ... X electrode (1st electrode) 11 ... Bridge wiring (1st bridge wiring) 12 ... Island-shaped electrode part 13 ... Polyaniline film (1st polyaniline film) 20 ... Y electrode (second electrode) 21 ... Bridge wiring (second bridge wiring) 22 ... Island-like electrode portion 23 ... Polyaniline coating (second polyaniline coating) 2 ... Input region 30, 80A ... Insulating film 30a ... Central portion 30b ... End portion 40 ... Flattening film 50 ... Protective substrate 51 ... Adhesive layer 60 ... Lead-out wiring 60a ... First layer 60b ... Second layer 61 ... Polyaniline coating (third polyaniline coating) 62 ... Insulating protective film 70, 70A ... shield layer (conductive film) 100, 100A ... touch panel device IJ ... droplet ejection device 1001 ... droplet ejection head 10 DESCRIPTION OF SYMBOLS 2 ... X-axis direction drive motor 1003 ... Y-axis direction drive motor 1004 ... X-axis direction drive shaft 1005 ... Y-axis direction guide shaft 1007 ... Stage 1008 ... Cleaning mechanism 1009 ... Base 1015 ... Heater CONT ... Control device P ... Substrate 1021 ... Liquid chamber 1022 ... Piezo element 1023 ... Liquid material supply system 1024 ... Drive circuit 1025 ... Discharge nozzle S10 ... Island-shaped electrode portion / first bridge wiring forming step S20 ... Second layer forming step S30 ... Polyaniline film forming step (first) 1 polyaniline film forming process) S40 ... insulating film forming process S50 ... second bridge wiring forming process S60 ... polyaniline film forming process (second polyaniline film forming process) S70 ... flattening film forming process (protective film forming process) S80 ... Protective substrate bonding process (adhesive layer type) S90 ... Shield layer forming step (conductive film forming step) 101 ... Adhesive layer 401 ... Data line driving circuit 402 ... Connecting terminal 404 ... Scanning line driving circuit 405 ... Wiring 409 ... Pixel electrode 410 ... Element substrate 410a ... Image display Area 418 ... Alignment film 420 ... Opposite substrate 422 ... Color filter 423 ... Light shielding film (black matrix) 425 ... Common electrode 429 ... Alignment film 450 ... Liquid crystal layer 452 ... Sealing material 453 ... Peripheral part-off 500 ... Liquid crystal display device 1100 ... Mobile type Personal computer 1101 ... Display unit 1102 ... Keyboard 1103 ... Main body unit 900 ... Touch panel device 910 ... Substrate 920 ... Y electrode 930 ... X electrode 940 ... Adhesive layer 950 ... Protective sheet

Claims (13)

A touch panel substrate;
A plurality of island-shaped electrode portions provided on one side of the touch panel substrate and spaced apart from each other;
A first bridge wiring connecting between the island-shaped electrode portions adjacent in the first direction of the touch panel substrate;
A second bridge wiring that connects adjacent island electrode portions in a second direction different from the first direction, and is formed integrally with the island electrode portions;
Having an insulating film provided between the first bridge wiring and the second bridge wiring;
A polyaniline coating film formed by a liquid phase film formation method and made of polyaniline is provided on at least a part of at least one surface of the first bridge wiring and the second bridge wiring. Touch panel device.   The touch panel device according to claim 1, wherein the polyaniline film is formed by an inkjet method. The touch panel device according to claim 1, wherein the polyaniline is represented by the following formula (1).

  The touch panel device according to any one of claims 1 to 3, wherein a degree of polymerization of the polyaniline is 100 or more and 100,000 or less.   5. The touch panel device according to claim 1, wherein an average thickness of the polyaniline coating is 0.04 μm or more and 0.4 μm or less.   Each of the first bridge wiring and the second bridge wiring is made of one or more transparent conductive materials selected from the group consisting of ITO, IZO, IGZO, FTO, ZnO, AZO, and ATO. The touch panel device according to claim 1, which is configured.   The touch panel device according to any one of claims 1 to 6, wherein at least central portions of the plurality of island-shaped electrode portions are respectively located on the same plane. A plurality of island-shaped electrode portions spaced apart from each other are formed on one surface side of the touch panel substrate, and a first bridge wiring is formed to connect the adjacent island-shaped electrode portions in the first direction of the touch panel substrate. An island-shaped electrode portion and a first bridge wiring forming step;
A polyaniline film forming step of forming a polyaniline film composed of polyaniline on the first bridge wiring by a liquid phase film forming method;
An insulating film forming step of forming an insulating film on the first bridge wiring covered with the polyaniline coating;
And a second bridge wiring forming step for forming a second bridge wiring for connecting the island-shaped electrode portions adjacent to each other in a second direction different from the first direction. Production method.   The touch panel device according to claim 8, further comprising a step of forming a polyaniline film made of polyaniline on the second bridge wiring by a liquid phase film forming method after the second bridge wiring forming step. Manufacturing method. A plurality of island-shaped electrode portions spaced apart from each other are formed on one surface side of the touch panel substrate, and a first bridge wiring is formed to connect the adjacent island-shaped electrode portions in the first direction of the touch panel substrate. An island-shaped electrode portion and a first bridge wiring forming step;
An insulating film forming step of forming an insulating film on the first bridge wiring;
A second bridge wiring forming step of forming a second bridge wiring for connecting the island-shaped electrode portions adjacent in the second direction different from the first direction;
A method of manufacturing a touch panel device, comprising: forming a polyaniline film made of polyaniline on the second bridge wiring by a liquid phase film forming method.   The method for manufacturing a touch panel device according to claim 8, wherein the polyaniline film is formed by an inkjet method.   A display device comprising the touch panel device according to claim 1.   An electronic apparatus comprising the display device according to claim 12.

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