JP2011035070A - Back sheet for solar cell module, and method of manufacturing the same - Google Patents

Abstract

Provided is a solar cell module back sheet that can easily manufacture a solar cell module using a back contact type solar cell and can increase the productivity thereof.
A back sheet for a solar cell module according to the present invention is provided on an insulating layer made of a composite material containing fibers and a resin, and one surface of the insulating layer, and is electrically connected to a solar cell. And a circuit layer 12 to be formed.
[Selection] Figure 1

Description

  The present invention relates to a back sheet for a solar cell module for fixing a back contact type solar cell having both a positive electrode (P-type semiconductor electrode) and a negative electrode (N-type semiconductor electrode) on the back surface, and a method for producing the same. About.

  In recent years, solar power generation, which is a power generation system using natural energy, has been rapidly spread. As shown in FIG. 5, the solar cell module for photovoltaic power generation includes a translucent substrate 120 disposed on the light receiving side, a back sheet 110 disposed on the back surface side, the translucent substrate 120 and the back. It has many solar cells 130 arranged between the sheets 110. The solar battery cell 130 is sealed by being sandwiched between sealing films 140a and 140b such as an ethylene / vinyl acetate copolymer (EVA) film.

Conventionally, in a solar cell module, a large number of solar cells 130, 130... Are electrically connected in series with a wiring material 150 having a width of 1 to 3 mm. Since the solar cell 130 is provided with a negative electrode (N-type semiconductor electrode) 131 on the front surface side which is the solar light-receiving surface 130a and a positive electrode (P-type semiconductor electrode) 132 on the back surface side, the solar battery cell 130 is connected with the wiring material 150 Then, the wiring material 150 overlapped on the light receiving surface 130a of the solar battery cell 130, and the area efficiency of photoelectric conversion tended to decrease.
In the arrangement of the electrodes described above, the wiring member 150 wraps around from the front side to the back side of the solar battery cell 130. In such a structure, the wiring member 150 is disconnected due to a difference in thermal expansion of each member. There was a thing.

Therefore, Patent Documents 1 and 2 propose a back contact type solar battery cell in which both a positive electrode and a negative electrode are installed on the back surface of the cell. In the solar cell of this system, it is possible to connect in series on the back surface, the light receiving area on the cell surface is not sacrificed, and the reduction in the area efficiency of photoelectric conversion can be prevented. Moreover, since it is not necessary to make the wiring material go around from the front side to the back side, disconnection of the wiring material due to the difference in thermal expansion of each member can be prevented.
When a solar cell module is manufactured using this back contact type solar cell, a large number of solar cells are electrically connected in series using a wiring material and then sealed with an EVA film. And was held between the translucent substrate and the back sheet.

JP 2005-11869 A JP 2009-111122 A

In recent years, as solar power generation has become widespread, cost reduction has been demanded, and improvement in productivity in manufacturing solar cell modules has become important. However, conventionally, in the method of manufacturing a solar cell module using a back contact type solar cell, since the plus electrode and the minus electrode are connected one by one using the wiring material on the ribbon, it is not simple, Productivity was not high.
The present invention has been made in view of the above problems, and can easily manufacture a solar cell module using a back contact type solar cell, and can increase the productivity of the solar cell module back sheet and its manufacture. It aims to provide a method.

The present invention has the following configuration.
[1] A solar battery comprising an insulating layer made of a composite material containing fibers and a resin, and a circuit layer provided on one surface of the insulating layer and electrically connected to the solar battery cell Module backsheet.
[2] The back sheet for a solar cell module according to [1], wherein a stud bump is provided on an electrode portion of the circuit layer that contacts the solar cell.
[3] The back sheet for a solar cell module according to [2], wherein a portion other than the electrode portion of the circuit layer is covered with an overcoat layer made of an insulating material.
[4] The solar cell module backsheet according to any one of [1] to [3], wherein a barrier layer is provided on the other surface of the insulating layer.
[5] The stud bump includes one or more metals selected from the group consisting of silver, copper, tin, lead, nickel, and gold, according to any one of [2] to [4]. Back sheet for solar cell module.
[6] Any of [2] to [5], wherein the stud bump is formed from a conductive paste containing one or more metals selected from the group consisting of silver, copper, tin, and solder. The back sheet | seat for solar cell modules of crab.
[7] The back sheet for a solar cell module according to [6], wherein the conductive paste is a low-temperature curing type.
[8] A circuit layer is formed by laminating a conductive layer on one surface of a semi-cured composite material layer containing fibers and a semi-cured thermosetting resin, applying heat and pressure treatment, and patterning the conductive layer. A method for producing a back sheet for a solar cell module.

In the invention according to claim 1 of the present application, a large number of solar cells can be electrically connected in series in one step by stacking the solar cells on the circuit layer provided on one surface of the insulating layer. That is, the lamination of the solar battery cells on the back sheet and the connection of the solar battery cells can be performed simultaneously. Therefore, according to the solar cell module backsheet of the invention according to claim 1 of the present application, a solar cell module using back contact type solar cells can be easily manufactured, and the productivity thereof can be increased.
Further, since the insulating layer is made of a composite material, adhesion with the circuit layer is increased. Furthermore, since the insulating layer is made of a composite material, the dimensional stability and rigidity of the solar cell module backsheet are high.

  In the invention according to claim 2 of the present application, the stud bump is provided in the electrode portion of the circuit layer, so that it can be easily connected to the electrode of the solar battery cell and the reliability of the electrical connection can be improved.

  In the invention according to claim 3 of the present application, since the portions other than the electrode portions of the circuit layer are covered with the overcoat layer, it is possible to prevent a short circuit between adjacent circuit layers. Moreover, when an EVA film is used for manufacture of a solar cell module, corrosion of the circuit layer due to acetic acid gas released from the EVA film can be prevented.

  In the invention according to claim 4 of the present application, since the barrier layer is provided on the other surface of the insulating layer, the long-term reliability such as weather resistance and insulation of the solar cell module can be improved.

  In the invention according to claim 5 of the present application, since the stud bump contains one or more metals selected from the group consisting of silver, copper, tin, lead, nickel, and gold, the electrode of the solar battery cell and the circuit layer Electric resistance can be lowered.

  In the invention according to claim 6 of the present application, the stud bump is formed from a conductive paste containing one or more metals selected from the group consisting of silver, copper, tin, and solder. A shape (for example, conical shape, cylindrical shape, etc.) that can be easily connected can be formed.

  In the invention according to claim 7 of the present application, since the conductive paste is a low temperature curing type, the electrode of the solar battery cell and the circuit layer can be electrically connected at a low temperature of 120 to 160 ° C.

  In the invention according to claim 8 of the present application, a conductive layer is laminated on one surface of the semi-cured composite material layer, subjected to heat and pressure treatment, and patterned to process the conductive layer. The circuit layer for connection can be easily formed. Moreover, according to the invention which concerns on Claim 8 of this application, the adhesiveness of an insulating layer and a circuit layer can be made high. Moreover, since the composite material is used as the insulating layer, the dimensional stability and rigidity of the obtained solar cell module backsheet can be increased.

It is a cross-sectional schematic diagram which shows one embodiment of the back sheet | seat for solar cell modules of this invention. It is a cross-sectional schematic diagram which shows one Embodiment of the manufacturing method of the solar cell module backsheet of this invention. It is a cross-sectional schematic diagram which shows an example of the solar cell module using the back sheet for solar cell modules shown in FIG. It is a cross-sectional schematic diagram which shows the manufacturing method of the solar cell module shown in FIG. It is a cross-sectional schematic diagram which shows an example of the conventional solar cell module.

(Back sheet for solar cell module)
An embodiment of the solar cell module backsheet (hereinafter abbreviated as “backsheet”) of the present invention will be described.
FIG. 1 shows a back sheet of this embodiment. The backsheet 10 includes an insulating layer 11, a circuit layer 12 provided on one surface of the insulating layer 11, a barrier layer 13 provided on the other surface of the insulating layer 11, and a solar cell of the circuit layer 12. It has a stud bump 14 provided on the electrode portion 12a in contact with the cell, and an overcoat layer 15 that covers a portion 12b of the circuit layer 12 other than the electrode portion 12a (hereinafter referred to as a non-electrode portion 12b).

[Insulation layer]
The insulating layer 11 is made of a composite material containing fibers and resin.
Examples of the fiber include glass cloth, glass nonwoven fabric, and paper. Examples of the resin include epoxy resin and phenol resin.

[Circuit layer]
The circuit layer 12 is a layer electrically connected to the solar battery cell. The circuit layer 12 has a pattern in which a large number of solar cells stacked on the backsheet 10 are electrically connected in series.
As a material constituting the circuit layer 12, a material having low electric resistance, for example, copper, aluminum, iron-nickel alloy or the like is used. Moreover, a conductive polymer can also be used.
The surface of the circuit layer 12 is preferably roughened with a corrosive chemical such as formic acid, sulfuric acid, or nitric acid in order to improve the adhesion between the stud bump 14 and the overcoat layer 15.

[Barrier layer]
The barrier layer 13 is a layer that adjusts air permeation. As the barrier layer 13, a material having long-term reliability such as weather resistance and insulation is used. For example, a fluororesin film, a low oligomer / heat-resistant polyethylene terephthalate (PET) film / polyethylene naphthalate (PEN) film, silica (SiO ₂ ) A vapor deposition film, an aluminum foil, etc. are used.

[Stud bump]
The stud bump 14 is a member that assists electrical connection between the circuit layer 12 and the solar battery cell, and is arranged to correspond to the electrode of the solar battery cell. The stud bump 14 of this embodiment has a truncated cone shape, and the tip protrudes from the surface of the overcoat layer 15.
As the material of the stud bump 14, a material having a low electric resistance is used. Especially, since the electrical resistance with the circuit layer 12 becomes low, it is preferable to contain 1 or more types of metals chosen from the group which consists of silver, copper, tin, lead, nickel, and gold.

Since the stud bump 14 has high viscosity and can be easily formed into a desired shape such as a truncated cone, one type selected from the group consisting of silver, copper, tin, and solder (copper and lead are the main components). It is preferable that the conductive paste contains the above metal.
The conductive paste is preferably a low temperature curing type. If the conductive paste is a low-temperature curing type, the solar cell electrode and the circuit layer 12 can be electrically connected at a low temperature of 120 to 160 ° C. Since 120 to 160 ° C. is a temperature at which softening, melting, and crosslinking of an EVA film that can be used as a sealing film occurs, when an EVA film is used as a sealing film, the solar cell can be easily processed. The electrode of the cell and the stud bump 14 formed from the conductive paste can be more easily electrically connected.
Low temperature curing type conductive paste contains polymer and conductive filler, and develops conductivity by physical contact of conductive filler by curing polymer, coordinated or reduced silver or copper to organic matter The thing which contains a nanoparticle and expresses electroconductivity by carrying out low temperature sintering (120-160 degreeC) is mentioned. The latter material is preferable in that the electric resistance becomes lower.

[Overcoat layer]
The overcoat layer 15 is made of an insulating material. Examples of the insulating material constituting the overcoat layer 15 include an epoxy resin, an acrylic resin, and a urethane resin. These resins may be used alone or in combination of two or more.
In addition, the above resin may contain one or more inorganic powders selected from the group consisting of silica (SiO ₂ ), mica, alumina, and barium sulfate.

[Function and effect]
By laminating solar cells on the circuit layer 12 provided on one surface of the insulating layer 11 on the backsheet 10, the solar cells can be electrically connected in series. Thus, since the lamination | stacking to the back seat | sheet 10 of a photovoltaic cell and the connection of photovoltaic cells can be performed simultaneously, a photovoltaic module can be manufactured easily and the productivity can be made high.
The insulating layer 11 in contact with the circuit layer 12 is made of a composite material, and the semi-cured composite material layer for forming the insulating layer 11 contains a semi-cured thermosetting resin. The insulating layer 11, the circuit layer 12, and the barrier layer 13 are cross-linked by the treatment. Therefore, the adhesion between the insulating layer 11, the circuit layer 12, and the barrier layer 13 is high. Furthermore, since the insulating layer 11 is made of a composite material, the dimensional stability and rigidity of the backsheet 10 are excellent. In particular, for example, it is more excellent in dimensional stability and rigidity than a back sheet made of a PET base material or a PEN base material that has been widely used conventionally. Therefore, when the insulating layer 11 is made of a composite material, the back sheet 10 has excellent physical properties.

Further, as will be described later, when the solar cell sealed with the sealing film is laminated on the back sheet 10, the stud bump 14 penetrates the sealing film, so that the electrode of the solar cell is electrically connected. Can be connected more easily. Further, by using the stud bump 14, the connection can be made reliably and with a sufficient area, so that the reliability of the electrical connection can be improved.
Further, since the backsheet 10 has the overcoat layer 15, it is possible to prevent short circuit between the circuit layers 12 adjacent to each other, and when the EVA film is used as a sealing film, the backsheet 10 is released from the EVA film. Corrosion of the circuit layer 12 by acetic acid gas can be prevented.

(Back sheet manufacturing method)
A method for manufacturing the backsheet 10 of this embodiment will be described.
In the method for manufacturing the backsheet 10 of the present embodiment, first, as shown in FIG. 2A, a conductive layer is formed on one surface of a semi-cured composite material layer 11a containing fibers and a semi-cured thermosetting resin. 16 is laminated, a barrier layer 13 is laminated on the other surface of the semi-cured composite material layer 11a, and a heat and pressure treatment is performed. By this treatment, the semi-cured composite material layer 11a becomes the insulating layer 11.
Here, as the conductive layer 16, for example, a metal foil of metal such as copper, aluminum, iron-nickel alloy can be used. Moreover, the layer containing a conductive polymer may be sufficient.

Next, as shown in FIG. 2B, a resist pattern 17 is provided on the conductive layer 16, and etching is performed to form a circuit layer 12 as shown in FIG. 2C. In the formation of the circuit layer 12, photolithography is applied.
In photolithography, first, a resist layer is provided on the entire surface of the conductive layer 16. At that time, as the resist layer, a dry film resist may be used, or a wet resist may be applied to the conductive layer 16 and formed.
Next, a photomask is disposed on the resist layer, exposed, and developed to provide a resist pattern 17. Next, the conductive layer 16 not covered with the resist pattern 17 is removed by etching. Etching may be either dry etching or wet etching, but usually wet etching is applied.
Thereafter, the resist pattern 17 is peeled off. Thus, the conductive layer 16 is patterned to obtain the circuit layer 12.

  The surface of the obtained circuit layer 12 may be roughened. When the surface of the circuit layer 12 is roughened, the adhesion of the stud bumps 14 can be improved. For the roughening treatment, for example, a method of bringing a corrosive chemical solution into contact with the surface of the circuit layer 12 can be applied.

Next, as shown in FIG. 2D, an overcoat layer 15 is formed by applying an insulating overcoat material to the non-electrode portion 12 b of the circuit layer 12.
As the overcoat material, for example, a coating solution containing a thermoplastic resin, a coating solution containing a thermosetting component, a coating solution containing a photocurable component, and the like can be used. When a coating solution containing a thermoplastic resin is used, a drying process is performed after coating. When a coating solution containing a thermosetting component is used, a thermosetting treatment is performed after coating. When using the coating liquid containing a photocurable component, a photocuring process is performed.

Next, stud bumps 14 are formed on the electrode portions 12 a of the circuit layer 12. As a method for forming the stud bump 14, for example, a method such as plating, screen printing, dispensing, or transfer can be applied. In this case, it is preferable to use a conductive paste containing one or more metals selected from the group consisting of silver, copper, tin, and solder because it can be easily formed into a desired shape such as a truncated cone. Furthermore, a low-temperature curing type conductive paste is more preferable in that the electrode of the solar battery cell and the stud bump 14 can be more easily electrically connected.
The back sheet 10 shown in FIG. 1 is obtained by the above manufacturing method.

In the method for manufacturing the backsheet 10, the conductive layer 16 is laminated on one surface of the semi-cured composite material layer 11a, subjected to heat and pressure treatment, and the conductive layer 16 laminated on the insulating layer 11 is subjected to pattern processing. The layer 12 can be easily formed.
Moreover, according to the said manufacturing method, the adhesiveness of the insulating layer 11 and the circuit layer 12 can be made high. Moreover, since the composite material is used as the insulating layer 11, the dimensional stability and rigidity of the obtained back sheet 10 can be increased.

(Solar cell module)
The back sheet 10 is used in a solar cell module.
FIG. 3 shows a solar cell module using the back sheet 10. This solar cell module 1 includes a translucent substrate 20 disposed on the light receiving surface side, a back sheet 10 disposed on the back surface side, and a large number of suns disposed between the translucent substrate 20 and the back sheet 10. ... and the sealing layer 40 which seals the solar battery cells 30, 30 ....

Examples of the translucent substrate 20 include a glass substrate and a transparent resin substrate. Examples of the transparent resin constituting the transparent resin substrate include acrylic resin, polycarbonate, and polyethylene terephthalate.
The solar battery cell 30 used in the present embodiment example is of a back contact type having a plus electrode and a minus electrode on the back surface. Examples of the solar battery cell 30 include a single crystal silicon type, a polycrystalline silicon type, an amorphous silicon type, a compound type, and a dye sensitized type. Among these, the single crystal silicon type is preferable in terms of excellent power generation efficiency.
The sealing layer 40 is formed of a sealing film. As the sealing film, for example, an EVA film, an ethylene / (meth) acrylate copolymer film, a fluororesin film such as polyvinylidene fluoride, or the like is used. Usually, two or more sealing films are used so as to sandwich the solar battery cell 30 therebetween.

  Since the solar cell module 1 uses the back sheet 10, the back contact type solar cells 30 are stacked, and at the same time, a large number of solar cells 30, 30... Are electrically connected in series. Can be obtained. Therefore, it is easily manufactured.

This solar cell module 1 is manufactured by the following manufacturing method, for example.
That is, first, as shown in FIG. 4, the sealing film 40 a, the solar battery cell 30, the sealing film 40 b, and the translucent substrate 20 are laminated on the back sheet 10. In that case, it arrange | positions so that the stud bump 14 of the back sheet 10 may oppose the electrode 31 of the photovoltaic cell 30. FIG.
Next, the laminate of the back sheet 10 / the sealing film 40a / the solar battery cell 30 / the sealing film 40b / the translucent substrate 20 is heated and pressurized. By this heating and pressurization, the stud bump 14 is penetrated through the sealing film 40a to contact the electrode 31 of the solar battery cell 30, and further, the tip end of the stud bump 14 is crushed to ensure a sufficient connection area.
By the above method, the back sheet 10, the sealing film 40 a, the solar battery cell 30, the sealing film 40 b, and the translucent substrate 20 are brought into close contact with each other, and the solar battery cell 30 is electrically connected in series with the circuit layer 12. To obtain the solar cell module 1 shown in FIG.

  As described above, the back sheet 10 is excellent in dimensional stability and rigidity. Therefore, when manufacturing the solar cell module 1, the sealing film 40a, the solar battery cell 30, the sealing film 40b, and the translucent substrate 20 can be laminated on the back sheet 10 with high positional accuracy.

(Other embodiment examples)
Note that the present invention is not limited to the above embodiment. For example, although the back sheet 10 of the above embodiment has the barrier layer 13, the stud bump 14 and the overcoat layer 15, these are optional. However, it is preferable to have the barrier layer 13 in terms of improving the long-term reliability of the solar cell module. Moreover, it is preferable to have the stud bump 14 at the point which can manufacture a solar cell module more simply. In addition, it is preferable to have the overcoat layer 15 in that the short circuit between the circuit layers 12 adjacent to each other can be prevented and the corrosion of the circuit layer 12 by the acetic acid gas released from the EVA film can be prevented.
The shape of the stud bump 14 is not limited to a truncated cone, but may be a cone, a cylinder, a triangular pyramid, a hemisphere, or the like. However, the shape of the stud bump 14 is preferably a shape that easily penetrates the sealing film 40 a such as a conical shape or a cylindrical shape and that is excellent in connectivity with the electrode 31 of the solar battery cell 30.

First, as shown in FIG. 2A, a thickness of 35 μm is formed on one surface of a semi-cured composite material layer 11a made of a composite material having a thickness of 200 μm (trade name: MCL-E-67N, manufactured by Hitachi Chemical Co., Ltd.). The conductive layer 16 (trade name: JTC copper foil, made by Nikko Metal) is laminated, and the barrier layer 13 (trade name: made by Tedlar, DuPont) having a thickness of 25 μm is formed on the other surface of the semi-cured composite material layer 11a. Lamination was performed to obtain a laminate. Next, the laminate was heated and pressurized under the conditions of a degree of vacuum: 2 kPa, a temperature: 170 ° C., a pressure: 2 MPa, and a heating and pressing time of 120 minutes. By this treatment, the semi-cured composite material layer 11a was changed to the insulating layer 11.
Next, a dry film resist (trade name: RY3315, manufactured by Hitachi Chemical Co., Ltd.) was attached to the surface of the conductive layer 16 using a roll laminator at a temperature of 110 ° C. and a conveyance speed of 0.5 m / min. Thereafter, a resist pattern 17 as shown in FIG. 2B is formed by exposure using a photomask (exposure amount: 80 mJ / cm ² ) and development (1% by mass of Na ₂ CO ₃ , temperature: 30 ° C.). Formed.
Next, after etching the exposed conductive layer 16 with copper chloride (temperature: 50 ° C.), the resist pattern 17 is peeled off with an aqueous solution of sodium hydroxide at 50 ° C. and 5 mass%, as shown in FIG. Thus, the circuit layer 12 having a circuit pattern was formed.

Next, the surface of the circuit layer 12 was subjected to a surface roughening treatment by contacting a microetching agent (trade name: CZ8100, manufactured by MEC) at 30 ° C. for 50 seconds.
Next, an insulating overcoat material (trade name: SR7000, manufactured by Hitachi Chemical Co., Ltd.) was applied to the non-electrode portion 12b of the circuit layer 12 by a screen printer. Thereafter, pre-baking is performed at 70 ° C. for 30 minutes, irradiation with 2000 mJ / cm ² ultraviolet rays is performed with a high-pressure mercury lamp, post-baking is performed at 170 ° C. for 60 minutes, and an overcoat layer as shown in FIG. 15 was formed.
Next, a silver paste (trade name: SD1114, manufactured by Harima Kasei Co., Ltd.) was printed on the electrode portion 12a of the circuit layer 12 by a screen printer to form a truncated conical stud bump 14. Thereby, the back sheet 10 was obtained.

Next, as shown in FIG. 4, an EVA film (sealing film 40 a), a solar battery cell 30, an EVA film (sealing film 40 b), and a glass substrate (translucent substrate 20) are formed on the back sheet 10. Laminated. In that case, it arrange | positioned so that the stud bump 14 of the back sheet 10 may oppose the electrode 31 of the photovoltaic cell 30. FIG.
Subsequently, the laminated body of the back sheet 10 / the sealing film 40a / the solar battery cell 30 / the sealing film 40b / the translucent substrate 20 was heated and pressurized, and the stud bumps 14 were penetrated through the sealing film 40a. Thereby, the stud bump 14 and the electrode 31 of the solar battery cell 30 were connected, and the solar battery module 1 shown in FIG. 3 was obtained.

10 Back sheet (back sheet for solar cell module)
DESCRIPTION OF SYMBOLS 11 Insulating layer 11a Semi-hardened composite material layer 12 Circuit layer 12a Electrode part 12b Non-electrode part 13 Barrier layer 14 Stud bump 15 Overcoat layer 16 Conductive layer 17 Resist pattern 20 Translucent substrate 30 Solar cell 31 Electrode 40 Sealing layer 40a, 40b Sealing film 110 Back sheet 120 Translucent substrate 130 Solar cell 131 Negative electrode (N-type semiconductor electrode)
132 Plus electrode (P-type semiconductor electrode)
140a, 140b Sealing film 150 Wiring material

Claims (8)

  A back for a solar battery module, comprising: an insulating layer made of a composite material containing fibers and a resin; and a circuit layer provided on one surface of the insulating layer and electrically connected to the solar battery cell. Sheet.   The stud sheet is provided in the electrode part which contacts the photovoltaic cell of the said circuit layer, The solar cell module backsheet of Claim 1 characterized by the above-mentioned.   The portion other than the electrode portion of the circuit layer is covered with an overcoat layer made of an insulating material.   The back sheet for a solar cell module according to claim 1, wherein a barrier layer is provided on the other surface of the insulating layer.   5. The solar cell module according to claim 2, wherein the stud bump contains one or more metals selected from the group consisting of silver, copper, tin, lead, nickel, and gold. Back sheet.   6. The sun according to claim 2, wherein the stud bump is formed of a conductive paste containing one or more metals selected from the group consisting of silver, copper, tin, and solder. Battery module backsheet.   The back sheet for a solar cell module according to claim 6, wherein the conductive paste is of a low temperature curing type.   Forming a circuit layer by laminating a conductive layer on one surface of a semi-cured composite material layer containing fibers and a semi-cured thermosetting resin, applying a heat and pressure treatment, and patterning the conductive layer; A method for producing a solar cell module backsheet.

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