JP2011027439A5 - - Google Patents
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- Publication number
- JP2011027439A5 JP2011027439A5 JP2009170529A JP2009170529A JP2011027439A5 JP 2011027439 A5 JP2011027439 A5 JP 2011027439A5 JP 2009170529 A JP2009170529 A JP 2009170529A JP 2009170529 A JP2009170529 A JP 2009170529A JP 2011027439 A5 JP2011027439 A5 JP 2011027439A5
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- substrate
- conductive substrate
- wiring substrate
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims 6
- 239000000523 sample Substances 0.000 claims 2
- 238000004519 manufacturing process Methods 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
Claims (1)
- コンタクトプローブ及び第１電極が形成された非導電性基板を第２電極が形成された配線基板上に固着させるステップと、
上記非導電性基板の一部を除去し、上記配線基板上の第２電極を露出させるステップと、
上記非導電性基板上の第１電極と上記配線基板上の第２電極とをワイヤボンディングするステップとを備えたことを特徴とするプローブカードの製造方法。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009170529A JP5266155B2 (ja) | 2009-07-21 | 2009-07-21 | プローブカードの製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009170529A JP5266155B2 (ja) | 2009-07-21 | 2009-07-21 | プローブカードの製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011027439A JP2011027439A (ja) | 2011-02-10 |
| JP2011027439A5 true JP2011027439A5 (ja) | 2012-07-26 |
| JP5266155B2 JP5266155B2 (ja) | 2013-08-21 |
Family
ID=43636371
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009170529A Expired - Fee Related JP5266155B2 (ja) | 2009-07-21 | 2009-07-21 | プローブカードの製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5266155B2 (ja) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102692066B1 (ko) * | 2022-08-18 | 2024-08-06 | 미르텍알앤디 주식회사 | 디스플레이 부품 검사 소켓용 실리콘 패턴체 및 그 제조방법 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04162696A (ja) * | 1990-10-26 | 1992-06-08 | Fujitsu Ltd | Ｅｃパッドの形成方法 |
| JPH05203519A (ja) * | 1992-01-29 | 1993-08-10 | Seiko Instr Inc | 圧力センサの製造方法 |
| JP2552084B2 (ja) * | 1994-02-24 | 1996-11-06 | 山一電機株式会社 | リードユニット |
| JP4590032B2 (ja) * | 2000-01-24 | 2010-12-01 | 東京エレクトロン株式会社 | プローブの製造方法 |
| JP2007208230A (ja) * | 2006-02-01 | 2007-08-16 | Seiko Npc Corp | 貼り合わせ基板のダイシング方法 |
| JP2008286657A (ja) * | 2007-05-18 | 2008-11-27 | Advantest Corp | プローブカードおよびそれを備えた電子部品試験装置 |
| KR101106968B1 (ko) * | 2007-07-24 | 2012-01-20 | 가부시키가이샤 아드반테스트 | 콘택터, 프로브 카드 및 콘택터의 실장방법 |
-
2009
- 2009-07-21 JP JP2009170529A patent/JP5266155B2/ja not_active Expired - Fee Related
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