JP2011013626A - Method of manufacturing display - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a display for reducing an area for arranging a wiring circuit for inspection to the utmost in a substrate including a TFT substrate.SOLUTION: The method of manufacturing display includes: a process of performing a TFT array inspection, thereafter, attaching a first substrate 31 and a second substrate 32 to each other such that the TFT substrate and a counter substrate face each other and a conductive member 48 is held between a first pad 44 and a second pad 46 and conducting electricity between the plurality of first pads 44 and second pads 46 via the conductive member 48; and a process of performing a panel lighting inspection for inspecting the display state of a display panel by supplying a second inspection signal to a plurality of lines via the second pads 46, the conductive members 48 and the first pads 44 from the inspecting terminal 47 of the second substrate 32.

Description

  The present invention relates to a method for manufacturing an active matrix drive type display device, for example.

  In recent years, demand for thin display devices such as liquid crystal display devices has been rapidly expanding, and needs for display quality and reliability are increasing day by day. For the thin display device, for example, a method of performing display by active matrix driving is suitably used. In this active matrix driving type thin display device, for example, a TFT substrate, which is an element substrate in which a plurality of thin film transistors (hereinafter abbreviated as TFTs) are arranged in a matrix, and the TFT substrate are arranged opposite to each other. And a counter substrate.

  A liquid crystal display device will be described as an example. In manufacturing the liquid crystal display device, after a TFT substrate and a counter substrate are formed, they are bonded to each other through a seal member and a liquid crystal layer. Various inspections are performed in the manufacturing process.

  For example, a panel lighting inspection is generally known in which a TFT substrate and a counter substrate are bonded to form a liquid crystal display panel, and then the panel is turned on and inspected before mounting an IC driver (for example, Patent Documents). 1-4). In the lighting inspection, in order to display an image pattern prepared in advance, a pixel defect, color unevenness, contrast, or the like is visually inspected by applying a driving signal for inspection to the signal line terminal and the scanning line terminal. .

  Also known is a TFT array inspection in which the TFT substrate is inspected in advance before being bonded to the counter substrate (see, for example, Patent Document 5). That is, in the TFT array inspection, first, a charge write voltage is applied to the signal line, and a voltage is applied to the scanning line, whereby charge is written to the capacitor element of the pixel to be inspected. Next, the charge is measured after a lapse of a certain time. Signal line shorts, disconnections, pixel defects, and the like can be detected based on the measured charge value.

  In Patent Document 1, as shown in FIG. 15 which is a plan view, a plurality of connection terminals 104 are arranged at predetermined intervals on one side of a TFT substrate 102 which constitutes a rectangular liquid crystal display panel 101 together with a counter substrate 103. In addition, it is disclosed that inspection terminals 105 for inputting inspection signals at the time of panel lighting inspection are provided on both outer sides.

  In Patent Document 2, as shown in FIG. 16 which is a plan view, an inspection electrode 107 is formed on a TFT substrate 102 constituting the liquid crystal display panel 101, and the inspection electrode 107 is opposed to the common transfer electrode 108. Connecting to the counter electrode of the substrate 103 is disclosed. Thus, an inspection signal is supplied from the inspection electrode 107 to the counter electrode via the common transition electrode 108 to perform a panel lighting inspection.

  Further, Patent Document 5 discloses a mother in which a plurality of wirings (gate wirings and source wirings) drawn from a panel region constituting a liquid crystal display panel are connected to a common wiring through TAB terminals and inspection resistors, respectively. Glass is disclosed.

JP 2004-205852 A JP 2004-012765 A JP 2007-079541 A JP 2008-003337 A JP 2003-248208 A

  Since the area where the wiring circuit for TFT array inspection and the wiring circuit for panel lighting inspection are formed is separated and removed after inspection and does not remain in the final product, the area is made as small as possible to reduce waste of substrate material. It is desirable.

  However, in general, in the wiring circuit for TFT array inspection, as described in Patent Document 5, in order to supply inspection signals to each wiring (gate wiring and source wiring), these wirings are replaced with high-resistance elements. It is necessary to connect to the common wiring through. On the other hand, in the wiring circuit for panel lighting inspection, in order to supply a common inspection signal to each wiring, it is necessary to connect these wirings directly to the common wiring without using a high resistance element.

  Therefore, in the above conventional display device manufacturing method, the wiring circuit for TFT array inspection and the wiring circuit for panel lighting inspection are separately formed on the substrate including the TFT substrate before division, and as a result, There is a problem that an area for arranging the wiring circuit increases.

  The present invention has been made in view of such various points, and an object of the present invention is to reduce as much as possible the area for arranging a wiring circuit for inspection on a substrate including a TFT substrate. is there.

  In order to achieve the above object, a first invention includes a TFT substrate on which a plurality of wirings connected to a plurality of TFTs are formed, and a counter substrate facing the TFT substrate, and a pixel is provided for each TFT. The present invention is directed to a method of manufacturing an active matrix display device in which is formed. The first insulating substrate is connected to the plurality of TFTs, the plurality of wirings, a plurality of mounting terminal portions formed on the plurality of wirings and mounted with circuit members, and connected to the mounting terminal portions, respectively. Forming a plurality of first pads and forming a first substrate including at least one TFT substrate; and a second pad on the second insulating substrate that can be opposed to the plurality of first pads. Forming a test substrate electrically connected to the second pad to form a second substrate including at least one counter substrate; and connecting the plurality of wirings on the first substrate to the plurality of wirings. (1) supplying a signal for inspection and performing a TFT array inspection for detecting the presence or absence of an electrical defect for each unit region constituting the pixel; and after performing the TFT array inspection, the TFT substrate and the counter substrate are Facing each other and The first substrate and the second substrate are bonded together so that the conductive member is sandwiched between the pad and the second pad, and the plurality of first pads and the second pad are interposed via the conductive member. A second inspection signal is supplied to the plurality of wirings from the inspection terminal of the second substrate via the second pad, the conductive member, and the first pad; And a step of performing panel lighting inspection for inspecting the display state of the display panel by lighting the display panel composed of the TFT substrate and the counter substrate which are bonded together.

  According to a second invention, in the first invention, in the step of forming the first substrate, a plurality of high resistance elements provided corresponding to the plurality of first pads, and the high resistance elements are interposed. And peripheral connection wirings connected in common to the plurality of first pads.

  According to a third invention, in the first or second invention, before the panel lighting inspection is performed, a part of the first substrate bonded to the second substrate is divided and removed, thereby removing the second. A step of exposing the inspection terminal of the substrate from the first substrate is performed.

  In a fourth aspect based on the third aspect, after performing the panel lighting inspection, a part of the second substrate including the region where the inspection terminal and the second pad are formed is divided and removed. .

-Action-
Next, the operation of the present invention will be described.

  In the first invention, first, on the first insulating substrate, a plurality of TFTs, a plurality of wirings, a plurality of mounting terminal portions formed on the plurality of wirings and mounted with circuit members, and each mounting terminal portion A plurality of first pads connected to each other are formed to form a first substrate including at least one TFT substrate.

  On the other hand, a second pad that can be opposed to the plurality of first pads and an inspection terminal that is electrically connected to the second pad are formed on the second insulating substrate, and includes at least one counter substrate. Two substrates are formed.

  Next, a first inspection signal is supplied to the plurality of wirings on the first substrate, and a TFT array inspection is performed to detect the presence or absence of an electrical defect for each unit region constituting the pixel. At this time, since the first pad is connected to each wiring via the mounting terminal portion, the first inspection signal is supplied to the wiring by inputting the first inspection signal to the first pad. Is possible.

  Thereafter, the first substrate and the second substrate are bonded so that the TFT substrate and the counter substrate face each other and the conductive member is sandwiched between the first pad and the second pad. As a result, the plurality of first pads and second pads are electrically connected to each other through the conductive member.

  Next, a second inspection signal is supplied from the inspection terminal of the second substrate to the plurality of wirings via the second pad, the conductive member, and the first pad. In this way, a panel lighting inspection for inspecting the display state of the display panel is performed by lighting the display panel composed of the TFT substrate and the counter substrate bonded to each other.

  Therefore, in the present invention, the first pad formed on the first substrate can be used in common for the panel lighting inspection and the TFT array inspection. Furthermore, since the second pad and the inspection terminal are formed on the second substrate, it is possible to significantly reduce the area for arranging the inspection wiring circuit on the first substrate.

  In the second invention, in the step of forming the first substrate, the plurality of high resistance elements provided corresponding to the plurality of first pads and the plurality of first pads via the respective high resistance elements are commonly used. A connected peripheral connection wiring is formed. Therefore, it is possible to perform the TFT array inspection while connecting each wiring to the peripheral connection wiring through each first pad or the like.

  In the third invention, before performing the panel lighting inspection, a part of the first substrate bonded to the second substrate is divided and removed. As a result, the inspection terminal of the second substrate can be exposed from the first substrate, so that the second inspection signal can be easily supplied to the inspection terminal.

  In the fourth invention, after the panel lighting inspection is further performed, a part of the second substrate including the region where the inspection terminal and the second pad are formed is divided and removed. Accordingly, the area of the second substrate can be reduced, so that the display device of the final product can be further downsized.

  According to the present invention, the first pad formed on the first substrate can be commonly used for panel lighting inspection and TFT array inspection. Furthermore, since the second pad and the inspection terminal are formed on the second substrate, the area for arranging the inspection wiring circuit on the first substrate can be greatly reduced.

FIG. 1 is an enlarged plan view showing a part of the second substrate in the first embodiment. FIG. 2 is an enlarged plan view showing a part of the first substrate in the first embodiment. FIG. 3 is an enlarged cross-sectional view showing a part of the bonded substrate base material in the first exemplary embodiment. FIG. 4 is an enlarged cross-sectional view of a part of the liquid crystal display panel that is inspected for lighting. FIG. 5 is a cross-sectional view showing a schematic configuration of the liquid crystal display device. FIG. 6 is a cross-sectional view showing a connection structure between the first pad and the second pad. FIG. 7 is a plan view showing a configuration of a TFT as a high resistance element. FIG. 8 is a plan view showing the appearance of the first substrate. FIG. 9 is a plan view showing the appearance of the second substrate. FIG. 10 is a plan view showing the appearance of the bonded substrate matrix. FIG. 11 is a flowchart showing the manufacturing process of this embodiment. FIG. 12 is a circuit diagram showing a circuit configuration of the TFT substrate. FIG. 13 is an enlarged cross-sectional view showing a part of the bonded substrate in the second embodiment. FIG. 14 is an enlarged plan view showing a part of the first substrate in the second embodiment. FIG. 15 is a plan view showing a main part of a conventional liquid crystal display device. FIG. 16 is a plan view showing a main part of a conventional liquid crystal display device.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiment.

Embodiment 1 of the Invention
1 to 12 show Embodiment 1 of the present invention.

  Here, FIG. 5 is a cross-sectional view showing a schematic configuration of the liquid crystal display device 1. FIG. 12 is a circuit diagram showing a circuit configuration of the TFT substrate 11.

  In the present embodiment, a liquid crystal display device 1 will be described as an example of a display device.

-Configuration of liquid crystal display device-
As shown in FIG. 5, the liquid crystal display device 1 includes a liquid crystal display panel 10 and a backlight unit 15 disposed on the back side of the liquid crystal display panel 10 (that is, the side opposite to the user).

  The liquid crystal display panel 10 includes a TFT substrate 11 and a counter substrate 12 disposed to face the TFT substrate 11. A liquid crystal layer 13 is provided between the TFT substrate 11 and the counter substrate 12 so as to be surrounded by a frame-shaped sealing member 14 and sealed. The liquid crystal layer is made of, for example, a nematic liquid crystal material. The seal member 14 is made of, for example, an epoxy resin that is cured by ultraviolet rays and heat.

  The counter substrate 12 includes a color filter (not shown) having R, G, and B colored layers, a common electrode (not shown) made of a transparent conductive film such as ITO, and a black matrix (not shown) as a light shielding film. ) Etc. are formed.

  The liquid crystal display panel 10 has a display area (not shown) and a frame-shaped non-display area provided around the display area. As shown in FIG. 12, a plurality of pixels 17 arranged in a matrix are formed in the display area. Here, the pixel is a minimum unit of display for each color, and is also referred to as a dot.

  The TFT substrate 11 is a so-called active matrix substrate. As shown in FIG. 12, a plurality of gate wirings 21 are formed on the TFT substrate 11 so as to extend in parallel to each other. In addition, a plurality of source lines 22 are formed on the TFT substrate 11 in parallel with each other, and are arranged so as to be orthogonal to the gate lines 21. Further, on the TFT substrate 11, a plurality of capacitor wirings 23 are arranged between the adjacent gate wirings 21 and formed in parallel to each other.

  Each pixel 17 is formed in a region partitioned by the gate wiring 21, the source wiring 22 and the capacitor wiring 23, for example. Each pixel 17 is provided with a pixel electrode (not shown) for driving the liquid crystal layer 13 and a TFT (Thin-Film Transistor) 24 for switching the pixel electrode. A source electrode (not shown) of the TFT 24 is connected to the source line 22, while a gate electrode (not shown) is connected to the gate line 21. The drain electrode (not shown) of the TFT 24 is connected to the pixel electrode. In other words, a pixel 17 is formed for each TFT 24.

  In each pixel 17, a liquid crystal capacitor 25 is formed between the pixel electrode and the common electrode of the counter substrate 12, and an auxiliary capacitor 26 is formed to maintain the liquid crystal capacitor constant. The auxiliary capacitor 26 is formed between the drain electrode side of the TFT 24 and the capacitor wiring 23.

  In the liquid crystal display device 1, the video signal is supplied from the source line 22 to the pixel electrode via the TFT 24 in a state where the scanning signal is supplied from the gate line 21 to the TFT 24 and the TFT 24 is turned on. . Thereby, a desired display is performed.

-Manufacturing method-
Next, a method for manufacturing the liquid crystal display device 1 will be described.

  Here, FIG. 1 is an enlarged plan view showing a part of the second substrate 32. FIG. 2 is an enlarged plan view showing a part of the first substrate 31. FIG. 3 is an enlarged sectional view showing a part of the bonded substrate matrix 33. FIG. 4 is an enlarged cross-sectional view showing a part of the liquid crystal display panel 10 that is inspected for lighting.

  FIG. 6 is a cross-sectional view showing a connection structure between the first pad 44 and the second pad 46. FIG. 7 is a plan view showing a configuration of a TFT as the high resistance element 51. FIG. 8 is a plan view showing the appearance of the first substrate 31. FIG. 9 is a plan view showing the appearance of the second substrate 32. FIG. 10 is a plan view showing the appearance of the bonded substrate matrix 33. FIG. 11 is a flowchart showing the manufacturing process of this embodiment.

<First substrate forming step>
As shown in FIG. 11, first, in step S1, a first substrate forming process is performed. In this step, a first substrate 31 including at least one TFT substrate 11 is formed. In FIG. 8, for example, the first substrate 31 including four first substrates 31 is shown, but the number of TFT substrates 11 included in the first substrate 31 is not particularly limited.

  Hereinafter, the inspection wiring circuit formed at the end of the gate wiring 21 will be described. The inspection wiring circuit formed on the source wiring 22 side can be formed in the same manner.

  First, a plurality of TFTs 24 and a plurality of wirings such as a gate wiring 21 and a source wiring 22 made of a metal material such as an aluminum alloy are formed on a glass substrate 41 as a first insulating substrate by photolithography and etching. To do. As shown in FIG. 2, the gate terminal 21 and the source line 22 are respectively provided with mounting terminal portions 43 at the end portions drawn out to the non-display area. As shown in FIG. 5, an FPC 42 or the like as a circuit member 42 is mounted on the mounting terminal portion 43. Further, a plurality of first pads 44 respectively connected to the mounting terminal portions 43 are simultaneously formed on the glass substrate 41 in the same process as the gate wiring 21 or the source wiring 22.

  Here, as shown in FIG. 6, a gate insulating film 54 that covers the gate wiring 21, the mounting terminal portion 43, and the first pad 44 is formed on the glass substrate 41. A protective film 55 made of an insulating film is laminated on the surface of the gate insulating film 54.

  As shown in FIG. 2, the gate insulating film 54 and the protective film 55 are formed by penetrating the contact hole 56 in the region where the mounting terminal portion 43 is disposed, as shown in FIG. A contact hole 57 is formed in the formed region. Thus, the first transparent conductive portion 36 made of a transparent conductive film such as ITO is formed on the surface of the protective film 55 in the region where the mounting terminal portion 43 is disposed. As a result, the first transparent conductive portion 36 is connected to the mounting terminal portion 43 through the contact hole 56.

  A second transparent conductive portion 37 made of a transparent conductive film such as ITO, which is the same as the pixel electrode, is formed on the surface of the protective film 55 in the region where the first pad 44 is disposed. As a result, the second transparent conductive portion 37 is connected to the first pad 44 through the contact hole 57.

  Further, in the first substrate forming step, a plurality of high resistance elements 51 provided corresponding to the plurality of first pads 44 are connected in common to the plurality of first pads 44 via the respective high resistance elements 51. Peripheral connection wiring 52 is formed. The peripheral connection wiring 52 is formed of the same material as the gate wiring 21 and extends in a direction orthogonal to the gate wiring 21. That is, the peripheral connection wiring 52 is formed at the same time in the same process as the gate wiring 21.

  As shown in FIG. 7, the high resistance element 51 is composed of, for example, two TFTs. Here, the high resistance element refers to, for example, a TFT element or an element that can have a resistance as high as this. Each TFT constituting the high resistance element 51 includes a gate portion 64 connected to the first pad 44 or the peripheral connection wiring 52, a semiconductor layer portion 61 overlapping the gate portion 64, and a source overlapping a part of the semiconductor layer portion 61. Part 62 and drain part 63. The gate portion 64 is covered with the gate insulating film 54 and the protective film 55 (not shown in FIG. 7), and a contact hole 65 is formed through the gate insulating film 54 and the protective film 55. .

  The high resistance element 51 can be formed simultaneously with the TFT 24 formed in each pixel 17. Thus, the first substrate 31 is formed as shown in FIG.

<TFT array inspection process>
Next, in step S3, a TFT array inspection process is performed. In this step, a first inspection signal is supplied to the gate wiring 21 and the source wiring 22 in the first substrate 31 to detect the presence or absence of an electrical defect for each unit region constituting the pixel 17.

  That is, as shown in FIG. 2, the plurality of probe pins 58 are simultaneously brought into contact with the second transparent conductive portion 37 on each first pad 44. In FIG. 2, only one probe pin 58 is shown, and the other probe pins are not shown. As a result, the first inspection signal is supplied to the unit region via the mounting terminal portion 43 and the gate wiring 21.

  At this time, since the high resistance element 51 is interposed between the first pad 44 and the peripheral connection wiring 52, the first inspection signal can be supplied to each gate wiring 21. Then, each TFT 24 is controlled to be turned on, and charge is written in each unit region to charge the auxiliary capacitor 26 and the like of each pixel. Thereafter, the TFT 24 is controlled to be turned off, and the electric charge written in each unit region is read out. Thereby, the presence or absence of an electrical defect can be inspected for each unit region (for each pixel 17).

<Second substrate forming step>
On the other hand, a second substrate forming process is performed in step S2 separately from step S1. In this step, a second substrate 32 including at least one counter substrate 12 is formed. In FIG. 9, for example, the second substrate 32 including four counter substrates 12 is illustrated, but the number of the counter substrates 12 included in the second substrate 32 is not particularly limited.

  First, a common electrode (not shown) made of a transparent conductive film such as ITO is formed in a solid shape on a glass substrate 45 as a second insulating substrate, for example, and a color filter layer (not shown), a black matrix, etc. It is formed by lithography and etching. The black matrix is formed of a metal film such as chromium.

  Further, as shown in FIG. 1, the second pad 46, the common wiring 35 and the inspection terminal 47 electrically connected to the second pad 46 are formed on the glass substrate 45. A plurality of second pads 46 are formed so as to be able to face the plurality of first pads 44, and are respectively connected to the common wiring 35. The inspection terminal 47 is connected to the common wiring 35. The second pad 46, the common wiring 35, and the inspection terminal 47 are made of the same metal film such as chromium as the black matrix, and are simultaneously formed in the same process by photolithography and etching.

  Further, at least a part of each second pad 46 is covered with a third transparent conductive portion 38 extending in a strip shape. On the other hand, the inspection terminal 47 is also covered with the fourth transparent conductive portion 39. The third transparent conductive portion 38 and the fourth transparent conductive portion 39 are made of ITO, which is the same material as the common electrode, and are simultaneously formed in the same process as the common electrode by photolithography and etching. Thus, the second substrate 32 is formed as shown in FIG.

<Lamination process>
Next, in step S4, a bonding process is performed. In this step, the first substrate 31 shown in FIG. 8 and the second substrate 32 shown in FIG. 9 are bonded together to form a bonded substrate matrix 33 shown in FIG.

  First, as shown in FIG. 1, for example, a conductive seal 48 as a conductive member is applied to the third transparent conductive portion 38 of the second substrate 32. The conductive seal 48 is a seal material in which conductive particles such as carbon and metal are dispersed. For example, a material similar to that of the seal member 14 can be applied as the seal material. The conductive seal 48 is formed in a strip shape extending along the third transparent conductive portion 38. The conductive seal 48 is not limited to the second substrate 32 but can be provided in a strip shape along the second transparent conductive portion of the first pad 44 in the first substrate 31.

  Further, the sealing member 14 is applied on the first substrate 31 or the second substrate 32, and each is formed into a rectangular frame shape. Subsequently, the liquid crystal material is dropped and supplied into the frame of the seal member 14.

  Thereafter, as shown in FIGS. 3 and 6, the TFT substrate 11 and the counter substrate 12 subjected to the TFT array inspection are opposed to each other, and a conductive seal 48 is provided between the first pad 44 and the second pad 46. The first substrate 31 and the second substrate 32 are bonded to each other so as to be held. As a result, the plurality of first pads 44 and second pads 46 are electrically connected to each other through the conductive seal 48.

<First parting process>
Next, in step S5, a first dividing step is performed before performing a panel lighting inspection described later. In this step, a part of the first substrate 31 bonded to the second substrate 32 is parted and removed, so that the inspection terminals 47 of the second substrate 32 are exposed from the first substrate 31.

  That is, the second substrate 32 is divided along the dividing line A in FIGS. 1 to 3, and the first substrate 31 is divided along the dividing line B. As a result, the inspection terminal 47 is exposed as shown in FIG. The division of the first substrate 31 or the second substrate 32 can be performed at the same time for the constituent regions of the display panels adjacent in the bonded substrate base material 33.

<Panel lighting inspection process>
Next, in step S6, a panel lighting inspection process is performed. In this step, the probe pin 59 is brought into contact with each exposed inspection terminal 47, whereby the gate wiring is connected from the inspection terminal 47 via the second pad 46, the conductive seal 48, and the first pad 44. The second inspection signal is supplied to 21. Similarly, the inspection signal is supplied to the source wiring 22. Then, the display state of the liquid crystal display panel 10 is inspected by turning on the liquid crystal display panel 10 composed of the TFT substrate 11 and the counter substrate 12 bonded to each other. Accordingly, the presence or absence of disconnection of electrodes and wiring, short circuit, and image unevenness is inspected.

  The panel lighting inspection is an operation in which a pulse voltage is applied between the electrodes to display on the liquid crystal display element, and the display state of the liquid crystal is checked visually or with a measuring device.

<Second parting process>
Next, in step S6, a panel lighting inspection process is performed. In this step, after the panel lighting inspection is performed, a part of the second substrate 32 including the region where the inspection terminal 47 and the second pad 46 are formed is divided and removed.

  That is, the second substrate 32 is divided along the dividing line C in FIGS. 1, 2, and 4, and the first substrate 31 is divided along the dividing line D. As a result, as shown in FIG. 5, the inspection wiring circuit used for the TFT array inspection and the panel lighting inspection is removed, and the mounting terminal portion 43 is exposed from the counter substrate 12. Becomes smaller.

  Thereafter, the FPC 42 is mounted on the mounting terminal portion 43 via an ACF (not shown) or the like, the backlight unit 15 is disposed on the opposite side of the TFT substrate 11 from the liquid crystal layer 13, and the liquid crystal display device 1 is manufactured. It becomes.

-Effect of Embodiment 1-
Therefore, according to the first embodiment, the first pad 44 formed on the first substrate 31 can be commonly used for panel lighting inspection and TFT array inspection. Furthermore, since the second pad 46 and the inspection terminal 47 are formed on the second substrate 32, the area for arranging the inspection wiring circuit on the first substrate 31 can be greatly reduced. Further, the space of the second substrate 32 can be used effectively. As a result, the waste of the mother glass as the substrate material can be reduced, and the substrate material can be used effectively.

  Further, the first pad 44 (TFT array inspection terminal) and the high resistance element 51 of the first substrate 31 and the peripheral connection wiring 52 are arranged outside the first substrate 31 without providing an additional space. It becomes possible.

  In addition, before the panel lighting inspection, a part of the first substrate 31 is parted and removed so that the inspection terminal 47 is exposed from the first substrate 31, so that the second inspection is performed on the inspection terminal 47. The business signal can be easily supplied.

  Further, after the panel lighting inspection is performed, a part of the second substrate including the region where the inspection terminal 47 and the second pad 46 are formed is divided and removed, so that the area of the second substrate 32 is reduced. Thus, the final liquid crystal display device 1 can be further downsized, particularly in the non-display area.

  Further, in the second substrate 32, each second pad 46 is connected to the inspection terminal 47 through the common wiring 35. Therefore, in the panel lighting inspection, the second inspection signal is collectively sent from the second substrate 32 side. Can be supplied. Accordingly, the inspection signal can be input significantly easily.

<< Embodiment 2 of the Invention >>
13 and 14 show Embodiment 2 of the present invention.

  FIG. 13 is an enlarged cross-sectional view showing a part of the bonded substrate matrix 33 in the second embodiment. FIG. 14 is an enlarged plan view showing a part of the first substrate 31 in the second embodiment. In the following embodiments, the same portions as those in FIGS. 1 to 12 are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the second embodiment, the high resistance element 51 and the peripheral connection wiring 52 are not provided in the first embodiment.

  That is, as shown in FIGS. 13 and 14, a first pad 44 is formed on the mounting terminal portion 43, and this first pad 44 constitutes an end portion of the inspection wiring circuit on the first substrate 31. Yes. On the other hand, on the second substrate 32, as in the first embodiment, the second pad 46, the common wiring 35, and the inspection terminal 47 are formed.

  Also in the second embodiment, as shown in FIG. 14, a plurality of probe pins 58 are brought into contact with the second transparent conductive portion 37 on the first pad 44 of the first substrate 31, whereby the first inspection signal is transmitted. This is supplied to each TFT 24 via the gate wiring 21. Then, a TFT array inspection is performed.

  Similarly to the first embodiment, by bringing the probe pin 59 into contact with the third transparent conductive portion 38 on the second pad 46, a second inspection signal is sent to each pixel 17 via the conductive seal 48 or the like. Supply. Then, the panel lighting inspection is performed to inspect the display state.

  Therefore, the same effects as those of the first embodiment can be obtained by the second embodiment. In addition, since the second inspection signal is supplied from the second substrate 32 side to each pixel 17 through the conductive seal 48 and the like, the high resistance element 51 and the peripheral connection wiring are provided on the first substrate 31. 52 can be omitted.

<< Other Embodiments >>
In the first and second embodiments, the liquid crystal display device 1 has been described as an example. However, the present invention is not limited thereto, and can be similarly applied to other display devices such as an organic EL display device. .

  The first and second insulating substrates 41 and 45 are not limited to glass substrates, and other insulating substrates such as plastic substrates can be applied. Further, although the transmissive liquid crystal display device that performs transmissive display has been described, the present invention can be similarly applied to a reflective display device that performs reflective display.

  As described above, the present invention is useful for, for example, a method of manufacturing an active matrix drive type display device.

1 Liquid crystal display device
10 Liquid crystal display panel
11 TFT substrate
12 Counter substrate
17 pixels
21 Gate wiring
22 Source wiring
23 Capacitive wiring
24 TFT
31 First substrate
32 Second substrate
41 Glass substrate (first insulating substrate)
42 FPC (Circuit member)
43 Mounting terminal
44 First pad
45 Glass substrate (second insulating substrate)
46 2nd pad
47 Inspection terminal
48 Conductive seal (conductive member)
51 High resistance element
52 Peripheral connection wiring

Claims (4)

A method of manufacturing an active matrix type display device comprising a TFT substrate on which a plurality of wirings connected to a plurality of TFTs are formed and a counter substrate facing the TFT substrate, and wherein a pixel is formed for each TFT. There,
A plurality of TFTs, a plurality of wirings, a plurality of mounting terminal portions formed on the plurality of wirings and mounted with circuit members, and connected to the mounting terminal portions, respectively, on a first insulating substrate Forming a plurality of first pads to form a first substrate including at least one of the TFT substrates;
A second pad that can be opposed to the plurality of first pads and a test terminal that is electrically connected to the second pad are formed on the second insulating substrate, and includes at least one of the counter substrates. Forming a second substrate;
Supplying a first inspection signal to the plurality of wirings on the first substrate, and performing a TFT array inspection for detecting the presence or absence of an electrical defect for each unit region constituting the pixel;
After the TFT array inspection, the first substrate and the second substrate are arranged such that the TFT substrate and the counter substrate face each other and the conductive member is held between the first pad and the second pad. And bonding the plurality of first pads and second pads to each other through the conductive member;
The TFT substrate bonded to each other by supplying a second inspection signal to the plurality of wirings from the inspection terminal of the second substrate via the second pad, the conductive member, and the first pad. And a panel lighting inspection step of inspecting the display state of the display panel by lighting the display panel made of the counter substrate. In the manufacturing method of the display device according to claim 1,
In the step of forming the first substrate, a plurality of high resistance elements provided corresponding to the plurality of first pads and the plurality of first pads are commonly connected via the high resistance elements. A method for manufacturing a display device, comprising forming a peripheral connection wiring. In the manufacturing method of the display device according to claim 1 or 2,
Before performing the panel lighting inspection, a part of the first substrate bonded to the second substrate is parted and removed to expose the inspection terminals of the second substrate from the first substrate. A manufacturing method of a display device characterized by the above. In the manufacturing method of the display device according to claim 3,
A method of manufacturing a display device, comprising: separating and removing a part of the second substrate including a region where the inspection terminal and the second pad are formed after performing the panel lighting inspection.

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