JP2010287783A - Transfer apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a transfer apparatus that applies less stress to a plate-like member, such as a wafer, having brittleness when the plate-like member is an object to be transferred, and that effectively avoids cause of cracking of the wafer. <P>SOLUTION: The transfer apparatus 10 includes a support means 11 disposed on a lower surface side of the semiconductor wafer W to support it, and a moving means 12 of supporting the support means 11 movably. The support means 11 includes a support arm 20 capable of forming a closed loop which is partially opened by a first forming member 24 and second arm forming members 25, and a suction means 21 provided to the support arm 20. Sides of tips 25B of the second arm forming members 25 are provided to contact and leave each other. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a transfer apparatus, and more particularly to a transfer apparatus suitable for transferring a plate-like member such as a semiconductor wafer between a plurality of processes.

  Semiconductor wafers (hereinafter simply referred to as “wafers”) are transferred between a plurality of processes in order to perform various processes. For this wafer transfer, for example, a transfer device disclosed in Patent Document 1 is used. The transfer device is configured by a substantially U-shaped arm in a plan view, a wafer holding unit having a suction region on the upper surface side of the arm, a turning unit that connects the wafer holding unit, and the turning unit And a vertical movement means for moving the wafer holding portion up and down. The reason why a substantially U-shaped arm in plan view is adopted for such a transfer device is that when the wafer surface in contact with the arm is placed on another device as a placement surface, This is because a transfer member is interposed in the U-shape, and the arm is retracted after the wafer is transferred to the transfer member.

JP 2000-195926 A

  However, in the transfer apparatus disclosed in Patent Document 1, as shown in FIG. 6, since the wafer holding section has a U-shape having an open area K at the center, the wafer is in the open area K. This causes inconvenience that the wafer is bent, stress is applied to the wafer, and the wafer is broken in some cases. This is a phenomenon that can occur because a part of the region connected to the outer edge of the wafer is not supported by anything until it is close to the opposite side in the diametrical direction, and such inconvenience increases as the wafer diameter increases. In addition, it becomes apparent as the wafer is ground to an extremely thin thickness.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and in particular, makes it difficult to give stress to the plate-like member when a plate-like member having a weakness such as a wafer is a transfer target. Another object is to provide a transport device that can effectively avoid the cause of cracking of the plate-like member.

  In order to achieve the above-mentioned object, the present invention provides a transporting means provided on one surface side of a plate-like member for supporting the plate-like member and a moving means for movably supporting the support means. In the apparatus, the support means includes a support arm and suction means provided on the support arm, and the support arm includes a plurality of arm forming members capable of forming a partially openable closed loop. , Is adopted.

  In the present invention, the support arm includes a first arm forming member fixed to the moving means, and one or two second arm forming members rotatably connected to the first arm forming member. The two-arm forming member is attached to the first arm forming member via an urging means, and is provided so that the closed loop can be formed by the urging force of the urging means.

  The support arm includes a first arm forming member fixed to the moving means and one or two second arm forming members rotatably connected to the first arm forming member. The forming member can be attached to the first arm forming member via a driving unit and can be configured to be capable of forming and opening the closed loop by a driving force of the driving unit.

  Further, the support arm includes a first arm forming member fixed to the moving means, and one or two second arm forming members rotatably connected to the first arm forming member. The forming member is attached to the first arm forming member via an urging means and a driving means, and the closed loop can be formed by the urging force of the urging means, while the driving force of the driving means It is also possible to adopt a configuration in which the closed loop is provided so as to be openable.

  Moreover, it is good to take the structure which equips the front end side of the said arm formation member with the opening promotion means which accelerates | stimulates opening of an arm formation member.

According to the present invention, since the plate-like member can be supported in a state where the arm forming member constituting the support arm is in a closed loop, a part of the region connected to the outer edge of the plate-like member is near the opposite side in the diametrical direction. It is possible to eliminate the area that is not supported by anything up to. Thereby, even if the diameter and area of a plate-shaped member are large or extremely thin, the plate-shaped member can be transported while preventing deformation of the plate-shaped member. Moreover, since the support arm can form a closed loop that can be partially opened, even when a transfer member is interposed in the closed loop and the plate-like member is transferred to the transfer member, the arm forming member is retracted from the transfer position. It becomes possible to make it.
Furthermore, by attaching the second arm forming member to the first arm forming member via the biasing means, it is possible to form a closed loop that can be partially opened with a simple configuration.
Further, by attaching the second arm forming member to the first arm forming member via the driving means, the closed loop can be actively opened and closed by the power of the driving means.
Further, when the biasing means and the driving means are interposed between the first and second arm forming members, for example, when the wafer supported by the support arm is transferred to the transfer member, the transfer is performed in the closed loop. After interposing the member, the second arm forming member can be brought into contact with the delivery member, and the support arm can be pulled out against the urging force of the urging means. On the other hand, when the wafer supported by the transfer member is supported by the support arm, the second arm forming member is driven so that the second arm forming member is driven by the driving means to open the closed loop and then the transfer member is interposed in the closed loop. It is sufficient to perform control so as to close and form a closed loop, and simple control in which the driving direction of the driving means is one direction is sufficient.
Furthermore, when an opening promoting means is provided on the distal end side of the arm forming member, when the arm forming member is retracted from the delivery member located in the closed loop, the arm forming member is caught by the delivery member and cannot be retracted or is in a state of being caught Therefore, it is possible to prevent the arm forming member and the delivery member from being damaged by trying to forcefully retreat them from each other, and the arm forming members can be smoothly separated from each other.

(A) is a schematic plan view of the conveying apparatus according to the embodiment, and (B) is a front view sectional view of the suction means. The schematic front view of FIG. The schematic front view which shows the state which handed over the wafer to the lifter. The schematic plan view which shows the state which a support arm evacuates from on a table. The schematic plan view which shows a modification. Explanatory drawing of the conventional malfunction.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  1 and 2, the transfer device 10 is located on one surface (lower surface in FIG. 2) side of a wafer W as a plate-like member, and supports the wafer W, and the support device 11. It is provided with the moving means 12 supported so that a movement is possible.

  The support means 11 includes a support arm 20 and a suction means 21 provided on the support arm 20. The support arm 20 includes a first arm forming member 24 fixed to the moving means 12 and two second arm forming members 25 rotatably connected to the first arm forming member 24. The first arm forming member 24 includes a linear portion 24A that is detachably provided on the moving means 12, and a branch portion 24B that is bifurcated from the linear portion 24A and extends in a substantially semicircular arc shape. A pair of substantially 1/4 arc-shaped second arm forming members 25 are connected to both ends of 24B. The second arm forming member 25 has one end 25A side coupled to the first arm forming member 24 via a shaft and a spring (not shown) so as to be relatively rotatable. Accordingly, the other end (tip) 25B side is urged in the direction indicated by the arrow in FIG. 1 so that a closed loop can be formed, and the tip 25B side of the pair of second arm forming members 25 can contact and separate from each other. That is, it can be opened and closed. In the present embodiment, the support arm 20 interacts with the first arm forming member 24 to form a closed loop when the tips 25B of the second arm forming member 25 come into contact with each other, thereby forming a second arm forming member. When the tip ends 25B of 25 are separated from each other, a part of the closed loop can be opened. In addition, the 2nd arm formation member 25 is provided in the shape provided with the opening promotion edge 25C as an opening promotion means by notching so that the front-end | tip 25B side may reduce the width | variety gradually toward the front-end | tip 25B. .

  As shown in FIG. 1 (B), the suction means 21 is embedded in the first arm forming member 24 and the second arm forming member 25 and provided in a substantially circular shape in plan view. And a main body part 30 having a conical recess 30A provided in a substantially conical shape similar to a funnel, and being combined with the main body part 30 and being spaced apart from the conical recess 30A by a cross-sectional view. A conical member 33 having a substantially conical shape similar to a funnel that forms a closed-loop passage 32, a supply passage 34 communicating with the passage 32, and pressurization (not shown) for supplying air G as a fluid to the supply passage 34 And a pump. The passage 32 forms a closed-loop jet 32A at the upper end thereof. The conical member 33 is supported on the main body 30 by a support member (not shown) that does not fully close the passage 32. As a result, the air G ejected from the ejection port 32A through the passage 32 flows along the surface of the wafer W, and a negative pressure region A is formed between the inside of the closed loop of the ejection port 32A and the wafer W. The wafer W can be sucked and supported.

  The moving means 12 employs a known articulated robot. The moving means 12 includes first to third swivel arms 40 to 42 each having a motor (not shown) in a connecting portion, and a vertical movement that allows the first to third swivel arms 40 to 42 to be moved vertically by a motor (not shown). The moving part 44 is provided. Thereby, the support means 11 attached to the 3rd turning arm 42 can be freely moved within a predetermined range in the XYZ space. A motor (not shown) capable of rotating the support means 11 around the axis L is provided at the tip of the third turning arm 42.

  Next, taking the case of transferring from the wafer cassette 50 to the table 60 that supports the wafer W as an example, a method for transporting the wafer W by the transport apparatus 10 according to the present embodiment will be described.

  The second arm forming member 25 of the support means 11 is brought into contact with each other and kept in a closed loop shape by a biasing force of a spring (not shown). Then, the support means 11 is inserted into the wafer cassette 50 that drives the moving means 12 and accommodates the wafers W in multiple stages.

  As shown in FIG. 2, when the support means 11 enters the wafer cassette 50 and is positioned on the lower surface side of the wafer W, air G from a pressure pump (not shown) is supplied into the passage 32 constituting the suction means 21. The suction means 21 sucks and supports the wafer W in a non-contact state on the upper surface sides of the first and second arm forming members 24 and 25.

With the wafer W sucked in this way, the support means 11 comes out of the magazine 50 via the moving means 12, and the lifter 61 as a delivery member rises and moves to the upper side of the waiting table 60.
Then, as shown in FIG. 3, when the support means 11 is lowered so that the lifter 61 is interposed in the closed loop of the support arm 20 and the lower surface side of the wafer W is brought into contact with the upper surface of the lifter 61, the lifter 61 While 61 starts suction of the wafer W by a suction means (not shown), the ejection of air from the slit 32A is stopped.

  When the wafer W is transferred to the lifter 61, the support means 11 is retracted to the side of the table 60 by the moving means 12, as shown in FIG. The second arm forming member 25 is in contact with the lifter 61 and resists the urging force of a spring (not shown) provided at the connecting portion of the first and second arm forming members 24 and 25 to form the second arm. The support means 11 can be extracted from the lifter 61 because the tips 25B of the members 25 are separated from each other. At this time, since the opening promotion edge 25C is provided on the second arm forming member 24, the second arm forming member 25 is caught by the lifter 61 and cannot be retreated, or the second arm forming member 25 attempts to retreat from the caught state forcibly. It is possible to prevent the first and second arm forming members 24 and 25 and the lifter 61 from being damaged. And after the 2nd arm formation member 25 passes the position used as the maximum diameter of the lifter 61, the front-end | tip 25B gradually approaches by the urging | biasing force of the spring which is not shown in figure, and when it passes the lifter 61, it becomes a closed loop shape again. Retract to the side of the lifter 61. Thereafter, the lifter 61 is lowered, the wafer W is supported on the entire surface by the table 60, and a predetermined process such as attaching an adhesive sheet or the like to the upper surface of the wafer W is performed.

  A case where the wafer W after the predetermined processing on the table 60 is transferred to another process by the transfer apparatus 10 is also conceivable. In this case, it is possible to use one configured such that the one end 25A side of the second arm forming member 25 is connected to the first arm forming member 24 so as to be relatively rotatable via a motor (not shown) as a driving means. . Then, the lifter 61 is raised, and the support means 11 is positioned on the lower surface side of the wafer W in a state where the tip 25B side of the second arm forming member 25 is separated by a motor (not shown). Then, the tip 25B of the second arm forming member 25 is brought into contact with the motor 61 (not shown) so that the lifter 61 is interposed in the closed loop of the support arm 20, and the wafer W is sucked and supported by the suction means 21 in the same manner as described above. The lifter 61 stops adsorbing the wafer W and descends, so that the wafer W can be received and transferred to another process.

  Therefore, according to such an embodiment, when the wafer W is transferred, the first and second arm forming members 24 and 25 are configured to support the wafer W in a closed loop shape. Since it is possible to eliminate a region that is not supported by any part of the region connected to the outer edge of the wafer until it is close to the diametrically opposite side, it is possible to effectively prevent the wafer from being bent and deformed as in the past. The effect that the crack accompanying this can be avoided is acquired.

As described above, the best configuration, method and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.
Therefore, the description limited to the shape disclosed above is an example for easy understanding of the present invention, and does not limit the present invention. The description by the name of the member which remove | excluded one part or all part is included in this invention.

For example, the number of the second arm forming members 25 may be one as shown in FIG. In this case, one end side of the second arm forming member 25 is rotatably connected to one end side of the first arm forming member 24, while the other end (tip) of the second arm forming member 25 is connected to the first arm forming member 14. The other end can be contacted and separated. Here, the 2nd arm formation member 25 is provided in planar view substantially D shape, and the linear part functions as the opening promotion edge 25C.
Further, one or two second arm forming members 25 are provided at the connecting portion of the first and second arm forming members 24 and 25 via an urging means such as a spring (not shown) and a driving means such as a motor, and urging is performed. The second arm forming member 24 may be contacted to form a closed loop by the urging force of only the means, while the second arm forming member 24 may be separated to open the closed loop only by the driving force of the motor. Good.

  Further, the notch of the opening promoting edge 25C may be formed in an arc shape. Further, as an opening promoting means, a rotatable roller, a bearing, or the like may be disposed on the tip 25B side of the second arm forming member 25. Even with such a configuration, when the support means 11 is removed from the lifter 61, the rollers, bearings, and the like abut against the lifter 61 and rotate, so that the tips 25B of the second arm forming member 25 are separated from each other. A part of the closed loop can be opened.

  Further, the suction means 21 is not limited to the configuration for ejecting the air G, and suction holes are formed on the upper surface sides of the first and second arm forming members 24, 25, and the suction holes are connected to a vacuum pump to form a wafer. You may comprise so that W may be adsorbed and supported.

  Further, the moving means 12 is not limited to the articulated robot, and may be configured by a motor, an air cylinder, a hydraulic cylinder, or the like, or may be configured by combining them.

  Further, the plate-like member is not limited to the semiconductor wafer W, and other plate-like members such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

  In addition, one or two second arm forming members 25 rotatably connected to the first arm forming member 24 are rotatably connected so as to form or open a closed loop via a biasing means or a driving means. It is good also as a structure to be.

DESCRIPTION OF SYMBOLS 10 Conveying device 11 Support means 12 Moving means 20 Support arm 21 Suction means 24 First arm forming member 25 Second arm forming member 25B Tip 25C Opening promotion edge (opening promotion means)
A Negative pressure region G Gas (fluid)
W Semiconductor wafer (plate member)

Claims (5)

In a transport device comprising a support means for supporting the plate-like member located on one surface side of the plate-like member, and a moving means for supporting the support means movably,
The support means includes a support arm and suction means provided on the support arm,
The carrier device is configured to include a plurality of arm forming members capable of forming a closed loop that can be partially opened.   The support arm includes a first arm forming member fixed to the moving means and one or two second arm forming members rotatably connected to the first arm forming member. The conveying device according to claim 1, wherein the conveying device is attached to the first arm forming member via an urging means, and the closed loop can be formed by an urging force of the urging means.   The support arm includes a first arm forming member fixed to the moving means and one or two second arm forming members rotatably connected to the first arm forming member. 2. The conveying device according to claim 1, wherein the conveying device is attached to the first arm forming member via a driving unit, and can be formed and opened by the driving force of the driving unit. .   The support arm includes a first arm forming member fixed to the moving means and one or two second arm forming members rotatably connected to the first arm forming member. Is attached to the first arm forming member via an urging means and a driving means, and is provided so that the closed loop can be formed by the urging force of the urging means, while the closed loop is formed by the driving force of the driving means. The transport apparatus according to claim 1, wherein the transport apparatus is provided so as to be openable.   5. The transport device according to claim 1, further comprising an opening promoting unit that promotes the opening of the arm forming member on a distal end side of the arm forming member.

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