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JP2010282751A - Electronic component structure and connector with electronic component structure incorporated - Google Patents

Electronic component structure and connector with electronic component structure incorporated Download PDF

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Publication number
JP2010282751A
JP2010282751A JP2009133148A JP2009133148A JP2010282751A JP 2010282751 A JP2010282751 A JP 2010282751A JP 2009133148 A JP2009133148 A JP 2009133148A JP 2009133148 A JP2009133148 A JP 2009133148A JP 2010282751 A JP2010282751 A JP 2010282751A
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electronic component
housing
component structure
pair
chip resistor
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JP5370749B2 (en
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Kazuhiro Aso
和裕 麻生
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component structure, realizing soldering free. <P>SOLUTION: The electronic component structure is provided with an electronic component with an electrode fitted to either side in a width direction; a housing with one surface opened as an insertion port for inserting and pulling the electronic component and having a housing part for housing the electronic component inside; a pair of connection terminals each having a lead part and a contact piece to the electrode of the electronic component; and further, the lead part is protruded from a back wall of the housing to backward of the housing, and the pair of connection terminals are attached to the housing so as to store the contact pieces to the housing part. Both contact pieces of the pair of connection terminals are capable of bending, in a crossing direction to an insertion direction of the electronic component with respect to the housing part, and holding the electronic component, by elastically contacting from both sides of the width direction to the electrode of the electronic component housed in the housing part through the insertion port. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、電子部品構造体、及びそれを内蔵してなるコネクタに関する。   The present invention relates to an electronic component structure and a connector incorporating the same.

図9に示すように、コネクタハウジング1にモールド型電子部品3を収容したコネクタがある。モールド型電子部品3は、抵抗素子等の電子部品素子3Bを樹脂モールドするとともに、外部に例えば2本のリード端子部3Aを導出して構成されている。   As shown in FIG. 9, there is a connector in which a molded electronic component 3 is accommodated in a connector housing 1. The mold-type electronic component 3 is configured by resin-molding an electronic component element 3B such as a resistance element and leading out, for example, two lead terminal portions 3A to the outside.

コネクタハウジング1を相手側コネクタハウジング2に嵌合すると、4個の雄端子金具4Mが夫々雌端子金具4Fに接続されるとともに、一対のリード端子部3Aが夫々雌端子金具5に接続される。このようにすることで、モールド型電子部品3の電子部品素子3Bを介して両コネクタ1、2が電気的に接続されるので、コネクタの電気抵抗が測定できる。   When the connector housing 1 is fitted into the mating connector housing 2, the four male terminal fittings 4M are connected to the female terminal fitting 4F, respectively, and the pair of lead terminal portions 3A are connected to the female terminal fitting 5 respectively. By doing in this way, since both the connectors 1 and 2 are electrically connected via the electronic component element 3B of the mold type electronic component 3, the electrical resistance of the connector can be measured.

この種のモールド型電子部品3は、特許文献1に開示されているように、リード端子部に対してチップ抵抗を半田により固着する構成をとっていた。   As disclosed in Patent Document 1, this type of molded electronic component 3 has a configuration in which a chip resistor is fixed to a lead terminal portion with solder.

特開平10−214654号公報(第6図)Japanese Patent Laid-Open No. 10-214654 (FIG. 6)

上記のものは、リード端子部と電子部品とを半田により接続(固着)している。半田に付けを行う場合、半田の塗布工程、表面実装工程、リフロー工程が少なくとも必要であり、製造工程が複雑化し勝ちである。また、半田には鉛が含まれている。近年では環境に対する配慮から、鉛フリー化(鉛を含まない無鉛半田)が進んでいるが、それは高価で品質でも劣る。そのような状況から半田を使用しない半田レス化が強く要求されるようになってきており、それへの対応が急務となっている。   In the above, the lead terminal portion and the electronic component are connected (fixed) with solder. When attaching to solder, at least a solder application process, a surface mounting process, and a reflow process are required, and the manufacturing process tends to be complicated. The solder contains lead. In recent years, lead-free (lead-free solder containing no lead) has been promoted for environmental considerations, but it is expensive and inferior in quality. Under such circumstances, there has been a strong demand for a solderless method that does not use solder, and there is an urgent need to deal with it.

本発明は上記のような事情に基づいて完成されたものであって、半田レス化を実現させた電子部品構造体、及びそれを内蔵したコネクタを提供することを目的とする。   The present invention has been completed based on the above-described circumstances, and an object thereof is to provide an electronic component structure that realizes solder-less and a connector incorporating the electronic component structure.

本発明は、幅方向の両側に電極を設けた電子部品と、一面が前記電子部品を挿抜する差し込み口として開口し、かつ内部に前記電子部品を収容する収容部を設けたハウジングと、リード部と前記電子部品の電極に対する接触片とを有する一対の端子金具と、を備えてなり、前記ハウジングの奥壁から前記リード部をハウジング後方に突出させ、前記接触片を前記収容部に収めるように前記一対の端子金具を前記ハウジングに取り付けた電子部品構造体であって、前記一対の端子金具の両接触片は前記収容部に対する前記電子部品の挿入方向に交差する方向に撓み可能とされ、前記差し込み口を通じて収容部内に収められた前記電子部品の電極に対して幅方向の両側から弾性的に接触して前記電子部品を保持する構成であるところに特徴を有する。
この発明では、電子部品を収容部に収容させると、一対の接触片が電極に対して幅方向の両側から弾性的に接触して電子部品を保持する。しかも、接触片は電子部品の電極に接触するから、端子金具に対する電子部品の電気的な接続も合わせて図られる。従って、電子部品の半田付けを廃止することが可能となる。
The present invention provides an electronic component provided with electrodes on both sides in the width direction, a housing having one surface opened as an insertion port for inserting and removing the electronic component, and an accommodating portion for accommodating the electronic component therein, and a lead portion And a pair of terminal fittings having contact pieces with respect to the electrodes of the electronic component, wherein the lead portion protrudes rearward from the back wall of the housing, and the contact piece is accommodated in the housing portion. An electronic component structure in which the pair of terminal fittings is attached to the housing, wherein both contact pieces of the pair of terminal fittings are deflectable in a direction intersecting an insertion direction of the electronic component with respect to the housing portion, It is characterized in that the electronic component is held by elastic contact from both sides in the width direction with respect to the electrode of the electronic component housed in the accommodating portion through the insertion port. .
In this invention, when the electronic component is accommodated in the accommodating portion, the pair of contact pieces elastically contact the electrodes from both sides in the width direction to hold the electronic component. In addition, since the contact piece contacts the electrode of the electronic component, the electrical connection of the electronic component to the terminal fitting is also achieved. Therefore, it is possible to eliminate the soldering of the electronic component.

この発明の実施態様として、以下の構成とすることが好ましい。
・前記差し込み口を閉止するキャップを備える。このようにしておけば、ハウジング内への異物の混入を防止することが可能となる。
As an embodiment of the present invention, the following configuration is preferable.
-A cap for closing the insertion port is provided. If it does in this way, it will become possible to prevent mixing of the foreign material in a housing.

・前記キャップに、前記電子部品の先端を、板厚方向の両側から保持する一対の保持部を形成する。このようにしてけば、電子部品の支持が安定する。 -A pair of holding | maintenance part which hold | maintains the front-end | tip of the said electronic component from the both sides of a plate | board thickness direction in the said cap is formed. In this way, the support of the electronic component is stabilized.

本発明によれば、電子部品の半田付けを廃止することが可能となる。   According to the present invention, it is possible to eliminate the soldering of electronic components.

本発明の一実施形態に係る電子部品構造体の平面図The top view of the electronic component structure which concerns on one Embodiment of this invention 電子部品構造体の側面図Side view of electronic component structure 図2中のB−B線断面図(電子部品構造体を分解した状態を示す)2 is a cross-sectional view taken along line BB in FIG. 図2中のB−B線断面図(電子部品構造体の組み付け状態を示す)BB sectional view in FIG. 2 (shows the assembled state of the electronic component structure) 図1中のA−A線断面図AA line sectional view in FIG. 図1をC方向から見た図Fig. 1 is a view from the direction C 図1をD方向から見た図Fig. 1 is a view from the direction D 電子部品構造体をコネクタに取り付けた状態を示す断面図Sectional drawing which shows the state which attached the electronic component structure to the connector 電子部品を内蔵したコネクタの構成例を示す図The figure which shows the structural example of the connector which incorporated the electronic component

本発明の一実施形態を図1ないし図8によって説明する。
本電子部品構造体Uは、チップ抵抗(本発明の「電子部品」に相当)50と、ハウジング60と、一対の接続端子71A、71Bと、キャップ100を主体に構成されている。尚、以下の説明において、図1における左側を後側、図1における右側を前側として説明を行う。
An embodiment of the present invention will be described with reference to FIGS.
The electronic component structure U is mainly composed of a chip resistor 50 (corresponding to an “electronic component” of the present invention), a housing 60, a pair of connection terminals 71A and 71B, and a cap 100. In the following description, the left side in FIG. 1 is the rear side, and the right side in FIG. 1 is the front side.

ハウジング60は合成樹脂製である。ハウジング60は箱型をしており、内部に収容部61が形成されている。ハウジング60の一面(図3の右側の壁面)は、チップ抵抗50を挿抜する差し込み口66として開口しており、この差し込み口66を通じて収容部61にチップ抵抗50を出入りさせることが可能となっている。   The housing 60 is made of synthetic resin. The housing 60 has a box shape, and an accommodating portion 61 is formed inside. One surface of the housing 60 (the wall surface on the right side in FIG. 3) is opened as an insertion port 66 for inserting and removing the chip resistor 50, and the chip resistor 50 can be moved into and out of the housing portion 61 through the insertion port 66. Yes.

接続端子71A、71Bは金属製の板材をプレス加工したものであり、対称な形状をしている。これら接続端子71A、71Bは、金属板を2重に重ね合わせた形状のリード部72を有する。リード部72の形状は全体としては板状をなしており、前後方向(図3に示す左右方向)に長い形状をしている。そして、リード部72のうち、一方側の金属板は前方(図3に示す右側)に延設されており、接触片75を構成している。   The connection terminals 71A and 71B are formed by pressing a metal plate and have a symmetric shape. Each of the connection terminals 71A and 71B has a lead portion 72 having a shape in which metal plates are overlapped. The lead portion 72 has a plate shape as a whole, and has a long shape in the front-rear direction (left-right direction shown in FIG. 3). In addition, the metal plate on one side of the lead portion 72 extends forward (on the right side shown in FIG. 3) and constitutes a contact piece 75.

接触片75は、リード部72との境界部分で外側に斜めに傾斜した後、前方に向かって水平に延びている。そして、図3に示すように、接触片75の先端部分は、後側(図3に示す左側)に折り返されている。この折り返した部分は山型をしており、その頂部はチップ抵抗50の電極55に対する接点77となっている。   The contact piece 75 is inclined obliquely outward at the boundary portion with the lead portion 72 and then extends horizontally toward the front. And as shown in FIG. 3, the front-end | tip part of the contact piece 75 is return | folded by the back side (left side shown in FIG. 3). The folded portion has a mountain shape, and the top portion thereof is a contact 77 for the electrode 55 of the chip resistor 50.

係る接続端子71A、71Bは、ハウジング60にインサートされることで、成形と同時にハウジング60に固定されるようになっている。具体的に説明すると、接続端子71A、71Bは図3に示すように、接点77同士を向かい合わせるようにして幅方向に平行に向かい合って並んでいる。そして、ハウジング60の奥壁62を前後に貫通しており、接続端子71A、71Bをリード部72をハウジング60の後方に突出させ、接触片75を収容部61に収さめた状態でハウジング60に固定されている。   The connection terminals 71 </ b> A and 71 </ b> B are inserted into the housing 60 to be fixed to the housing 60 at the same time as molding. Specifically, as shown in FIG. 3, the connection terminals 71A and 71B are arranged in parallel with each other in the width direction so that the contacts 77 face each other. The housing 60 penetrates the back wall 62 in the front-rear direction, and the connection terminals 71A and 71B are protruded to the rear of the housing 60 and the contact piece 75 is accommodated in the housing portion 61 in the housing 60. It is fixed.

上記各接続端子71A、71Bの接触片75は、リード部72との境界となる基端部75Aを基点として、収容部61に対するチップ抵抗50の挿入方向に交差する方向(具体的には図3の矢印方向)に全体が撓み可能となっている。そして、両接触片75の接点77間の距離Fは、後述するチップ抵抗50の幅寸法より、幾らか狭い寸法に設定されている。   The contact piece 75 of each of the connection terminals 71A and 71B has a direction intersecting with the insertion direction of the chip resistor 50 with respect to the housing portion 61 (specifically, FIG. The whole can be bent in the direction of the arrow. The distance F between the contact points 77 of both contact pieces 75 is set to be somewhat narrower than the width dimension of the chip resistor 50 described later.

次に、チップ抵抗50は角型をしており、図3に示すように、平面方向から見たときには、前後方向に長い矩形状をしている。このチップ抵抗50は、幅方向(図3の上下方向)の両側の各縁部がそれぞれ電極55となっている。係るチップ抵抗50は、図3に示すように、差し込み口66を通じて、ハウジング60の収容部61の内部に挿入することができる。   Next, the chip resistor 50 has a rectangular shape, and has a rectangular shape that is long in the front-rear direction when viewed from the planar direction, as shown in FIG. The chip resistor 50 has electrodes 55 at each edge on both sides in the width direction (vertical direction in FIG. 3). The chip resistor 50 can be inserted into the housing portion 61 of the housing 60 through the insertion port 66 as shown in FIG.

そして、ハウジング60の収容部61にチップ抵抗50を差し込むと、一対の接触片75の接点77が、チップ抵抗50に対して幅方向の両側から弾性的に接触する。これにより、チップ抵抗50は図4にて示すように、幅方向の両側を一対の接触片75にて支えられた状態となり、保持される。また、チップ抵抗50の幅方向の両側は共に電極55となっているから、接触片75がそこに弾性的に接触することで、チップ抵抗50と接続端子71A、71Bとが電気的に接続された状態になる。   When the chip resistor 50 is inserted into the housing portion 61 of the housing 60, the contact points 77 of the pair of contact pieces 75 come into elastic contact with the chip resistor 50 from both sides in the width direction. Thereby, as shown in FIG. 4, the chip resistor 50 is held and supported by the pair of contact pieces 75 on both sides in the width direction. Further, since both sides in the width direction of the chip resistor 50 are electrodes 55, the chip resistor 50 and the connection terminals 71A and 71B are electrically connected by the contact piece 75 being elastically in contact therewith. It becomes a state.

また、図5に示すように、ハウジング60の上面壁63Uと下面壁63Lには、係止突起68が形成されている。係止突起68は、次に説明するキャップ100を係止させる機能を担っている。かかる係止突部68は後端が切り立つストッパ面となっており、また、前側は緩やかに傾斜するテーパ状をなす。また、ハウジング60の上下両面壁63U、63Lの後端部には、凹状の逃がし溝69が形成されている(図1参照)。この逃がし溝69はキャップ100に形成された取り付け片110に対する干渉を避けるための逃がしである。   Further, as shown in FIG. 5, locking projections 68 are formed on the upper surface wall 63 </ b> U and the lower surface wall 63 </ b> L of the housing 60. The locking projection 68 has a function of locking the cap 100 described below. Such a locking projection 68 is a stopper surface with a rear end cut off, and the front side has a tapered shape that is gently inclined. In addition, concave escape grooves 69 are formed at the rear ends of the upper and lower double-side walls 63U and 63L of the housing 60 (see FIG. 1). The escape groove 69 is a relief for avoiding interference with the mounting piece 110 formed in the cap 100.

キャップ100は合成樹脂製とされ、図5、図6に示すように、ハウジング60の差し込み口66に隙間なく嵌合する大きさの本体部105を有する。この本体部105の内面側であって高さ方向の中央部分(接続端子71A、71Bの中心線Lの上下両側)には、図5に示すように、上下一対のアーム部106、107が形成されている。両アーム部106、107は、本体部105の内面から収容部61側に向かってほぼ水平に延びており、収容部61内に差し込み可能とされている。   The cap 100 is made of a synthetic resin, and has a main body 105 having a size that fits into the insertion port 66 of the housing 60 without a gap, as shown in FIGS. As shown in FIG. 5, a pair of upper and lower arm portions 106 and 107 are formed on the inner surface side of the main body portion 105 and in the central portion in the height direction (upper and lower sides of the center line L of the connection terminals 71A and 71B). Has been. Both arm portions 106 and 107 extend substantially horizontally from the inner surface of the main body portion 105 toward the housing portion 61 side, and can be inserted into the housing portion 61.

そして、両アーム部106、107の先端には、断面円形状の押さえ突起108がそれぞれ形成されている。両アーム部106、107に形成された押さえ突起108は上下方向に向かい合っており、両間にはチップ抵抗50をわずかな挿入抵抗でもって挿入させる程度の隙間が設けられている。   A pressing protrusion 108 having a circular cross section is formed at the tip of both arm portions 106 and 107, respectively. The pressing protrusions 108 formed on both the arm portions 106 and 107 face each other in the vertical direction, and a gap is provided between them so that the chip resistor 50 can be inserted with a slight insertion resistance.

また、本体部105の上端側と下端側には、取り付け片110がそれぞれ設けられている。取り付け片110は、ハウジング60の上下両面壁63U、63Lを挟み込むことができるように、上下に互いに向かい合っている。これら取り付け片107には、係止突起68に対応して係止孔118を設けている。   Further, attachment pieces 110 are provided on the upper end side and the lower end side of the main body portion 105, respectively. The attachment pieces 110 face each other up and down so that the upper and lower side walls 63U and 63L of the housing 60 can be sandwiched. The mounting pieces 107 are provided with locking holes 118 corresponding to the locking protrusions 68.

係るキャップ100は、図3に示すようにチップ抵抗50をハウジング60に収容した後、ハウジング60に対して前方側から被せ付けるように組み付けられる。組み付けを行うと、キャップ100の本体部105がハウジング60の差し込み口66に隙間なく嵌って、ハウジング60の差し込み口66を閉止できる。そして、ハウジング60の各係止突起68に、キャップ100の各係止孔118が係止することにより、キャップ100はハウジング60に固定される。   The cap 100 is assembled so that the chip resistor 50 is accommodated in the housing 60 as shown in FIG. When assembled, the main body portion 105 of the cap 100 fits into the insertion port 66 of the housing 60 without a gap, and the insertion port 66 of the housing 60 can be closed. The cap 100 is fixed to the housing 60 by the locking holes 118 of the cap 100 being locked to the locking protrusions 68 of the housing 60.

また、キャップ100をハウジング60に組み付ける過程では、収容部61内にて保持されたチップ抵抗50の前端部が、キャップ100に形成された両アーム部106、107に形成された押さえ突起108間に差し込まれる。これにより、チップ抵抗50の前端部は、図5に示すように、両押さえ突起108により板厚方向(ここでは、上下方向)の両側から挟まれた状態となる。   Further, in the process of assembling the cap 100 to the housing 60, the front end portion of the chip resistor 50 held in the housing portion 61 is located between the pressing protrusions 108 formed on both arm portions 106 and 107 formed on the cap 100. Plugged in. Thereby, as shown in FIG. 5, the front end portion of the chip resistor 50 is sandwiched by both pressing projections 108 from both sides in the plate thickness direction (here, the vertical direction).

そのため、組み付け完了時には、チップ抵抗50に対して、幅方向(一対の接触片75による位置規制作用)と共に板厚方向(一対の押さえ突起108による位置規制作用)についても位置規制が働くこととなり、収容部61内におけるチップ抵抗50の保持がより確実なものとなる。   Therefore, when the assembly is completed, the position restriction acts on the chip resistor 50 in the width direction (position restriction action by the pair of contact pieces 75) as well as in the plate thickness direction (position restriction action by the pair of pressing protrusions 108). The chip resistor 50 can be held more securely in the housing portion 61.

以上説明したように、本実施形態によれば、チップ抵抗50を収容部61に収容させると、接触片75がチップ抵抗50に対して幅方向の両側から弾性的に接触する。これにより、チップ抵抗50はハウジング60に保持される。しかも、接触片75はチップ抵抗50の電極55に接触するから、接続端子71A、71Bに対するチップ抵抗50の電気的な接続も合わせて図られる。従って、チップ抵抗50の半田付けを廃止することが可能となる。   As described above, according to the present embodiment, when the chip resistor 50 is accommodated in the accommodating portion 61, the contact piece 75 elastically contacts the chip resistor 50 from both sides in the width direction. Thereby, the chip resistor 50 is held in the housing 60. In addition, since the contact piece 75 contacts the electrode 55 of the chip resistor 50, the electrical connection of the chip resistor 50 to the connection terminals 71A and 71B is also achieved. Therefore, it is possible to eliminate the soldering of the chip resistor 50.

また、チップ抵抗50は接触片75によって弾性的に保持されているので、収容部61内のチップ抵抗50を引き抜いてやれば、接触片75からチップ抵抗50を着脱させることが可能であり、必要に応じてチップ抵抗50を交換できる。   Further, since the chip resistor 50 is elastically held by the contact piece 75, the chip resistor 50 can be detached from the contact piece 75 if the chip resistor 50 in the housing portion 61 is pulled out. The chip resistor 50 can be exchanged according to

また、本実施形態では、キャップ100を設けて差し込み口66を閉止するようにしてあるので、収容部61に異物が混入する恐れがない。無論、キャップ100はハウジング60に対して着脱可能となっているので、チップ抵抗50の交換作業に支障を来たすことはない。   Further, in the present embodiment, the cap 100 is provided to close the insertion port 66, so that there is no possibility that foreign matter is mixed into the accommodating portion 61. Of course, since the cap 100 can be attached to and detached from the housing 60, the replacement work of the chip resistor 50 is not hindered.

尚、上記した電子部品構造体Uは、図8に示すように、フード210にリード部72を水平に突出させるようにして、コネクタハウジング201に組み付けられて用いられる。具体的には、コネクタハウジング201にはフード210に連通する収容部203が形成されており、そこに電子部品構造体Uが収容される構成となっている。そして、収容した電子部品構造体Uをリテーナ250により保持する構成となっている。リテーナ250は、フード210の内周側に嵌め合わせることが可能な筒型となっている。リテーナ250の奥壁251には、リード部72を挿通させる貫通孔255が形成され、その周囲には収容部20側に突出して規制壁253が形成されている。   The electronic component structure U described above is used by being assembled to the connector housing 201 so that the lead portion 72 protrudes horizontally from the hood 210 as shown in FIG. Specifically, the connector housing 201 is formed with an accommodating portion 203 that communicates with the hood 210, and the electronic component structure U is accommodated therein. And the accommodated electronic component structure U is held by the retainer 250. The retainer 250 has a cylindrical shape that can be fitted to the inner peripheral side of the hood 210. A through hole 255 through which the lead portion 72 is inserted is formed in the inner wall 251 of the retainer 250, and a regulating wall 253 is formed around the through hole 255 so as to protrude toward the housing portion 20 side.

そして、電子部品構造体Uのリード部72を貫通孔255に通しつつ、リテーナ250をフード210の奥側に向けて差し込むと、リテーナ250に設けられたロック部260が、コネクタハウジング201に係止する。この係止状態では、リテーナ250の規制壁253の端面が電子部品構造体Uのハウジング60の壁(奥壁62)に突き当たる。これにより、電子部品構造体Uは抜け止めされた状態に保持される。   Then, when the retainer 250 is inserted toward the back side of the hood 210 while passing the lead portion 72 of the electronic component structure U through the through hole 255, the lock portion 260 provided on the retainer 250 is locked to the connector housing 201. To do. In this locked state, the end surface of the restriction wall 253 of the retainer 250 abuts against the wall (back wall 62) of the housing 60 of the electronic component structure U. Thereby, the electronic component structure U is held in a state where it is prevented from being detached.

そして、上記したコネクタ200(コネクタハウジング201に電子部品構造体Uを収容してなるコネクタ)に、相手側コネクタ(図略)に嵌合させると、電子部品構造体Uの接続端子71A、71Bの各リード部72が夫々、相手側コネクタの雌端子金具に接続される。このようにすることで、電子部品構造体Uのチップ抵抗50を介して両コネクタが電気的に接続されるので、コネクタの電気抵抗が測定できる。   When the connector 200 (a connector in which the electronic component structure U is accommodated in the connector housing 201) is fitted to the mating connector (not shown), the connection terminals 71A and 71B of the electronic component structure U are connected. Each lead portion 72 is connected to a female terminal fitting of the mating connector. By doing in this way, since both connectors are electrically connected via the chip resistor 50 of the electronic component structure U, the electrical resistance of the connector can be measured.

<他の実施形態>
本発明は上記記述及び図面によって説明した実施形態に限定されるものではなく、例えば次のような実施形態も本発明の技術的範囲に含まれる。
<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.

(1)上記実施形態では、電子部品の一例として、チップ抵抗を例示したが、この他のチップ状部品、例えば、ダイオードチップなどについても適用が可能である。   (1) In the above embodiment, the chip resistor is exemplified as an example of the electronic component. However, the present invention can also be applied to other chip-like components such as a diode chip.

(2)上記実施形態では、接続端子をハウジングに対してインサートすることにより固定する構成のものを例示したが、接続端子の固定方法はインサートに限定されるものではなく、圧入など他の固定方法も適宜用いることが可能である。   (2) In the above embodiment, the connection terminal is fixed by inserting it into the housing. However, the connection terminal fixing method is not limited to the insert, and other fixing methods such as press-fitting. Can also be used as appropriate.

(3)上記実施形態では、電子部品構造体Uの組み付け手順として、まず、ハウジング60にチップ抵抗50を挿入し、その後、キャップ100を取り付ける手順を例にとったが、組み付け手順はこれに限定されるものではなく、例えば、キャップ100に対してチップ抵抗50を予め保持しておき、チップ抵抗付きのキャップ100をハウジング60に取り付けるようにしてもよい。   (3) In the above embodiment, as an assembling procedure of the electronic component structure U, the procedure of first inserting the chip resistor 50 into the housing 60 and then attaching the cap 100 is taken as an example, but the assembling procedure is limited to this. For example, the chip resistor 50 may be held in advance with respect to the cap 100, and the cap 100 with the chip resistor may be attached to the housing 60.

50…チップ抵抗(本発明の「電子部品」に相当)
55…電極
60…ハウジング
62…奥壁
66…差し込み口
71A、71B…接続端子
72…リード部
75…接触片
77…接点
100…キャップ
106、107…アーム
108…押さえ突起(本発明の「押さえ部」に相当する)
50: Chip resistor (corresponding to “electronic component” of the present invention)
55 ... Electrode 60 ... Housing 62 ... Back wall 66 ... Insertion port 71A, 71B ... Connection terminal 72 ... Lead part 75 ... Contact piece 77 ... Contact 100 ... Cap 106, 107 ... Arm 108 ... Pressing protrusion ("Pressing part" of the present invention Is equivalent to

Claims (4)

幅方向の両側に電極を設けた電子部品と、
一面が前記電子部品を挿抜する差し込み口として開口し、かつ内部に前記電子部品を収容する収容部を設けたハウジングと、
リード部と前記電子部品の電極に対する接触片とを有する一対の接続端子と、を備えてなり、
前記ハウジングの奥壁から前記リード部をハウジング後方に突出させ、前記接触片を前記収容部に収めるように前記一対の接続端子を前記ハウジングに取り付けた電子部品構造体であって、
前記一対の接続端子の両接触片は前記収容部に対する前記電子部品の挿入方向に交差する方向に撓み可能とされ、前記差し込み口を通じて収容部内に収められた前記電子部品の電極に対して幅方向の両側から弾性的に接触して前記電子部品を保持する構成であることを特徴を有する電気部品構造体。
An electronic component provided with electrodes on both sides in the width direction;
A housing having one surface opened as an insertion port for inserting and removing the electronic component, and an accommodating portion for accommodating the electronic component therein;
A pair of connecting terminals having a lead portion and a contact piece for the electrode of the electronic component,
An electronic component structure in which the lead portion protrudes rearward from the rear wall of the housing and the pair of connection terminals are attached to the housing so that the contact piece is accommodated in the housing portion,
Both contact pieces of the pair of connection terminals can be bent in a direction intersecting the insertion direction of the electronic component with respect to the housing portion, and the width direction with respect to the electrode of the electronic component housed in the housing portion through the insertion port An electric component structure having a configuration in which the electronic component is held elastically from both sides of the electronic component.
前記差し込み口を閉止するキャップを備えることを特徴とする請求項1に記載の電子部品構造体。   The electronic component structure according to claim 1, further comprising a cap that closes the insertion opening. 前記キャップに、前記電子部品の前端部を板厚方向の両側から挟んで支持する一対の押さえ部を形成したことを特徴とする請求項1又は請求項2に記載の電子部品構造体。   3. The electronic component structure according to claim 1, wherein a pair of pressing portions that support the front end portion of the electronic component from both sides in the plate thickness direction are formed on the cap. コネクタハウジング内に請求項1ないし請求項3のいずれか一項に記載の電子部品構造体を内蔵してなるコネクタ。   A connector comprising the electronic component structure according to any one of claims 1 to 3 incorporated in a connector housing.
JP2009133148A 2009-06-02 2009-06-02 Electronic component structure and connector including the electronic component structure Expired - Fee Related JP5370749B2 (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012134054A (en) * 2010-12-22 2012-07-12 Yazaki Corp Connection structure of electronic component
WO2014126031A1 (en) * 2013-02-14 2014-08-21 矢崎総業株式会社 Electronic component connection structure
JP2014175119A (en) * 2013-03-07 2014-09-22 Nec Engineering Ltd Connector

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JPS6399784U (en) * 1986-12-18 1988-06-28
JP2007287642A (en) * 2006-03-20 2007-11-01 Auto Network Gijutsu Kenkyusho:Kk Joint connector with built-in capacitor

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
JPS6399784U (en) * 1986-12-18 1988-06-28
JP2007287642A (en) * 2006-03-20 2007-11-01 Auto Network Gijutsu Kenkyusho:Kk Joint connector with built-in capacitor

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012134054A (en) * 2010-12-22 2012-07-12 Yazaki Corp Connection structure of electronic component
CN103270652A (en) * 2010-12-22 2013-08-28 矢崎总业株式会社 Connection structure of electronic components
US8979572B2 (en) 2010-12-22 2015-03-17 Yazaki Corporation Connection structure of electronic component
WO2014126031A1 (en) * 2013-02-14 2014-08-21 矢崎総業株式会社 Electronic component connection structure
JP2014157679A (en) * 2013-02-14 2014-08-28 Yazaki Corp Connection structure of electronic component
JP2014175119A (en) * 2013-03-07 2014-09-22 Nec Engineering Ltd Connector

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