JP2010258093A - Light emitting device - Google Patents
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- JP2010258093A JP2010258093A JP2009104287A JP2009104287A JP2010258093A JP 2010258093 A JP2010258093 A JP 2010258093A JP 2009104287 A JP2009104287 A JP 2009104287A JP 2009104287 A JP2009104287 A JP 2009104287A JP 2010258093 A JP2010258093 A JP 2010258093A
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 53
- 238000006243 chemical reaction Methods 0.000 claims abstract description 53
- 239000000758 substrate Substances 0.000 claims abstract description 7
- 239000003086 colorant Substances 0.000 claims description 4
- 230000017525 heat dissipation Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 229910002601 GaN Inorganic materials 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 229910052594 sapphire Inorganic materials 0.000 description 3
- 239000010980 sapphire Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- -1 gallium nitride compound Chemical class 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 206010037660 Pyrexia Diseases 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8514—Wavelength conversion means characterised by their shape, e.g. plate or foil
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/8506—Containers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8515—Wavelength conversion means not being in contact with the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/858—Means for heat extraction or cooling
- H10H20/8583—Means for heat extraction or cooling not being in contact with the bodies
Landscapes
- Led Device Packages (AREA)
- Led Devices (AREA)
Abstract
【課題】点光源として好適に用いることができるLED発光装置を提供する。
【解決手段】上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたLED素子と、前記凹部に充実された透光性部材と、蛍光体を含有する板状体であって、前記基体の上端面に載置されて前記凹部の開口部を覆う波長変換部材と、を備えており、前記波長変換部材の下面と、前記LED素子の上部とが近接又は密接しているようにした。
【選択図】図1
An LED light-emitting device that can be suitably used as a point light source is provided.
A substrate having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, a translucent member filled in the recess, and a plate-like body containing a phosphor. And a wavelength conversion member that is placed on the upper end surface of the substrate and covers the opening of the concave portion, and the lower surface of the wavelength conversion member and the upper portion of the LED element are close to or in close contact with each other. I did it.
[Selection] Figure 1
Description
本発明は、点光源として好適に用いることができるLED発光装置に関する。 The present invention relates to an LED light-emitting device that can be suitably used as a point light source.
従来、窒化ガリウム系化合物半導体を用いて青色光又は紫外光を放射するLED素子と種々の蛍光体とを組み合わせることにより、白色をはじめとするLED素子の発光色とは異なる色の光を発する発光装置が開発されている(特許文献1)。このような、LED素子を用いた発光装置は、小型、省電力、長寿命等の長所があり、表示用光源や照明用光源として広く用いられている。 Conventionally, light emission that emits light of a color different from that of LED elements such as white by combining LED elements that emit blue light or ultraviolet light with various phosphors using a gallium nitride compound semiconductor An apparatus has been developed (Patent Document 1). Such a light emitting device using an LED element has advantages such as small size, power saving and long life, and is widely used as a light source for display and a light source for illumination.
近時、LED素子の高出力化が進められているが、そのエネルギー変換効率は未だ充分でなく、入力した電気エネルギーの大部分は熱になり、その発熱量は流す電流とともに増大する。 Recently, LED elements have been increased in output, but their energy conversion efficiency is not yet sufficient, most of the input electric energy becomes heat, and the amount of generated heat increases with the flowing current.
また、蛍光体の特性は温度に依存しており、温度が上昇すると発光効率が低下したり輝度が低下したりする。更に、蛍光体が熱により劣化することも知られている。このため、LED素子と蛍光体とが離れている方が、蛍光体がLED素子の発熱の影響を受けにくいため好ましい。 In addition, the characteristics of the phosphor depend on the temperature, and as the temperature rises, the light emission efficiency decreases and the luminance decreases. Furthermore, it is also known that the phosphor is deteriorated by heat. For this reason, it is preferable that the LED element and the phosphor are separated from each other because the phosphor is less susceptible to the heat generated by the LED element.
一方、LED素子と種々の蛍光体とを組み合わせてLED素子の発光色とは異なる色の光を発する発光装置では、蛍光体はLED素子が発した光により励起されて光を発するが、LED素子と蛍光体を含有する部材とが離れているほど、LED素子から発した光は当該部材の広いエリアに照射されるので、当該部材の広いエリアから蛍光が発し外側に広がる光として射出される。従って、LED素子と蛍光体を含有する部材とが離れているほど発光装置から発する光の集光化処理や平行化処理は困難になるので、点光源として用いる発光装置では、LED素子と蛍光体を含有する部材との距離は短い方が好ましい。 On the other hand, in a light emitting device that emits light of a color different from the emission color of the LED element by combining the LED element and various phosphors, the phosphor emits light when excited by the light emitted by the LED element. Since the light emitted from the LED element is applied to a wider area of the member as the distance between the member and the phosphor-containing member increases, fluorescence is emitted from the wide area of the member and emitted as light spreading outward. Accordingly, as the LED element and the phosphor-containing member are separated from each other, it becomes difficult to condense or parallelize light emitted from the light emitting device. Therefore, in the light emitting device used as a point light source, the LED element and the phosphor It is preferable that the distance from the member containing is short.
しかしながら、上述のとおり、LED素子と蛍光体との距離が短いと蛍光体がLED素子の発熱の影響を受けやすいという問題がある。 However, as described above, if the distance between the LED element and the phosphor is short, there is a problem that the phosphor is easily affected by the heat generated by the LED element.
本発明はかかる問題点に鑑みなされたものであって、点光源として好適に用いることができるLED発光装置を提供することをその主たる所期課題としたものである。 The present invention has been made in view of such problems, and it is a main intended problem to provide an LED light-emitting device that can be suitably used as a point light source.
すなわち本発明に係る発光装置は、上端面に開口する凹部を有した基体と、前記凹部の底面に実装されたLED素子と、前記凹部に充実された透光性部材と、蛍光体を含有する板状体であって、前記基体の上端面に載置されて前記凹部の開口部を覆う波長変換部材と、を備えており、前記波長変換部材の下面と、前記LED素子の上部とが近接又は密接していることを特徴とする。 That is, the light-emitting device according to the present invention includes a base body having a recess opening in the upper end surface, an LED element mounted on the bottom surface of the recess, a translucent member filled in the recess, and a phosphor. A wavelength conversion member that is placed on the upper end surface of the substrate and covers the opening of the recess, and the lower surface of the wavelength conversion member and the upper portion of the LED element are close to each other Or, it is characterized by being close.
このようなものであれば、波長変換部材の下面と、LED素子の上部とが近接又は密接していることにより、LED素子から発した光は波長変換部材の狭いエリアを照射し、このエリアに含まれる蛍光体を励起するので、波長変換部材の狭いエリアから外部へ向けて蛍光が発せられる。このため、本発明に係る発光装置は点光源として良好に作用し、集光化処理や平行化処理が容易となる。 If it is such, since the lower surface of the wavelength conversion member and the upper part of the LED element are close to or in close contact with each other, the light emitted from the LED element irradiates a narrow area of the wavelength conversion member. Since the contained phosphor is excited, fluorescence is emitted from a narrow area of the wavelength conversion member to the outside. For this reason, the light-emitting device according to the present invention works well as a point light source, and the condensing process and the parallelizing process become easy.
そして、波長変換部材を基体凹部の開口部を覆う板状体とすることにより、その表面積を増大させて放熱を容易にし、波長変換部材とLED素子とが近接又は密接することによる波長変換部材の温度上昇を抑制し、それに含まれる蛍光体の発光効率や輝度の低下や、熱劣化を防いでいる。 And by making a wavelength conversion member into the plate-shaped body which covers the opening part of a base part crevice, the surface area is increased, heat dissipation is made easy, and the wavelength conversion member by which a wavelength conversion member and an LED element adjoin or contact closely The temperature rise is suppressed, and the luminous efficiency and luminance of the phosphor contained in the phosphor are reduced, and thermal deterioration is prevented.
前記波長変換部材の位置決めを精度よく行うためには、前記基体の上端面に、前記波長変換部材の横方向の移動を妨げる突状部材が設けられていることが好ましい。 In order to position the wavelength conversion member with high accuracy, it is preferable that a protruding member that prevents the wavelength conversion member from moving in the lateral direction is provided on the upper end surface of the base.
前記波長変換部材からの放熱を更に効率的に行うためには、更に透光性放熱部材が前記波長変換部材の上面に載置されていることが好ましい。 In order to more efficiently dissipate heat from the wavelength conversion member, it is preferable that a translucent heat dissipation member is further placed on the upper surface of the wavelength conversion member.
本発明に係る発光装置の発光色の経時的な変化を抑制するためには、前記波長変換部材は、異なる色の光を発する蛍光領域が並設されてなるものであることが好ましい。 In order to suppress the temporal change of the emission color of the light emitting device according to the present invention, it is preferable that the wavelength conversion member is formed by arranging fluorescent regions that emit light of different colors in parallel.
本発明に係る発光装置が白色光を発するものである場合、その色調むらを抑制するためには、前記LED素子は、近紫外光を発するものであり、前記蛍光体は、赤色光を発する蛍光体(以下、赤色蛍光体という。)、緑色光を発する蛍光体(以下、緑色蛍光体という。)、及び、青色光を発する蛍光体(以下、青色蛍光体という。)であることが好ましい。 When the light emitting device according to the present invention emits white light, the LED element emits near-ultraviolet light in order to suppress uneven color tone, and the phosphor emits red light. The phosphor (hereinafter referred to as red phosphor), the phosphor emitting green light (hereinafter referred to as green phosphor), and the phosphor emitting blue light (hereinafter referred to as blue phosphor) are preferable.
このような構成の本発明によれば、熱による蛍光体の変化を抑制しつつ点光源として作用する発光装置を得ることができるので、例えば、当該発光装置を顕微鏡用の光源として用いて、小型のレンズにより観測対象物上に良好に集光することができる。このため、本発明に係る発光装置を光源として用いることにより顕微鏡の小型化も可能となる。 According to the present invention having such a configuration, it is possible to obtain a light-emitting device that acts as a point light source while suppressing changes in phosphor due to heat. For example, the light-emitting device can be used as a light source for a microscope and can be compact. With this lens, the light can be condensed well on the observation object. For this reason, the microscope can be miniaturized by using the light emitting device according to the present invention as a light source.
以下に本発明の一実施形態について図面を参照して説明する。 An embodiment of the present invention will be described below with reference to the drawings.
本実施形態に係る発光装置1は、図1及び図2に示すように、上端面21に開口する凹部22を有した基体2と、凹部22の底面221に実装されたLED素子3と、凹部22に充実された透光性部材4と、基体2の上端面21に載置されて凹部22の開口部を覆う波長変換部材5と、波長変換部材5の上面に載置された透光性放熱部材6と、を備えたものである。 As shown in FIGS. 1 and 2, the light-emitting device 1 according to the present embodiment includes a base 2 having a recess 22 that opens to the upper end surface 21, an LED element 3 mounted on the bottom surface 221 of the recess 22, and a recess A translucent member 4 enriched in 22, a wavelength conversion member 5 placed on the upper end surface 21 of the substrate 2 and covering the opening of the recess 22, and a translucency placed on the upper surface of the wavelength conversion member 5. The heat radiating member 6 is provided.
各部を詳述する。
基体2は、上端面21に開口する凹部22を有するものであり、例えば、アルミナや窒化アルミニウム等の熱伝導率が高い絶縁材料を成型してなるものが挙げられる。
Each part will be described in detail.
The base 2 has a recess 22 that opens to the upper end surface 21. For example, a base 2 is formed by molding an insulating material having high thermal conductivity such as alumina or aluminum nitride.
基体2は、その凹部22の底面221に後述するLED素子3を実装するものであるが、当該底面221には、LED素子3が電気的に接続されるための配線導体(図示しない。)が形成されている。この配線導体が基体2内部に形成された配線層(図示しない。)を介して発光装置1の外表面に導出されて外部電気回路基板に接続されることにより、LED素子3と外部電気回路基板とが電気的に接続される。 The base body 2 mounts an LED element 3 to be described later on the bottom surface 221 of the recess 22, and a wiring conductor (not shown) for electrically connecting the LED element 3 to the bottom surface 221. Is formed. This wiring conductor is led to the outer surface of the light emitting device 1 through a wiring layer (not shown) formed inside the base 2 and connected to the external electric circuit board, whereby the LED element 3 and the external electric circuit board are connected. Are electrically connected.
基体2の上端面21には後述する波長変換部材5が載置されているが、基体2の上端面21の角部には横断面L字状の突状部材23が設けられており、波長変換部材5の横方向の移動を妨げるように構成してあり、これにより波長変換部材5の位置決めが可能となる。また、基体2の上端面21に載置された波長変換部材5の熱は基体2を伝わって放出される。 A wavelength conversion member 5 to be described later is placed on the upper end surface 21 of the base 2, but a protruding member 23 having an L-shaped cross section is provided at the corner of the upper end surface 21 of the base 2. The wavelength conversion member 5 is positioned so as to prevent the conversion member 5 from moving in the lateral direction. Further, the heat of the wavelength conversion member 5 placed on the upper end surface 21 of the base 2 is released through the base 2.
LED素子3は、例えば、サファイア基板上に窒化ガリウム系化合物半導体がn型層、発光層及びp型層の順に積層されたものであり、このようなLED素子3は青色光や紫外光を発する。 The LED element 3 is formed, for example, by laminating a gallium nitride-based compound semiconductor in the order of an n-type layer, a light emitting layer, and a p-type layer on a sapphire substrate. Such an LED element 3 emits blue light or ultraviolet light. .
LED素子3は、窒化ガリウム系化合物半導体を下(凹部22の底面221側)にして凹部22の底面221に半田バンプや金バンプ等を用いてフリップチップ実装されている。 The LED element 3 is flip-chip mounted on the bottom surface 221 of the concave portion 22 using solder bumps, gold bumps, or the like with the gallium nitride compound semiconductor facing down (the bottom surface 221 side of the concave portion 22).
透光性部材4は、凹部22に充実されてLED素子3を封止しており、例えば、透光性及び耐熱性に優れ、LED素子3との屈折率差が小さいシリコーン樹脂等からなるものである。 The translucent member 4 is filled in the concave portion 22 and seals the LED element 3. For example, the translucent member 4 is made of a silicone resin having excellent translucency and heat resistance and having a small difference in refractive index from the LED element 3. It is.
波長変換部材5は、内部に蛍光体51を含有する等厚な平板状のものであり、基体2の上端面21に載置されて凹部22の開口部を覆っており、その下面とLED素子3の上部とは近接又は密接している。このような波長変換部材5としては、例えば、透光性及び耐熱性に優れ、透光性部材4との屈折率差が小さいシリコーン樹脂中に蛍光体51が分散しているものが挙げられ、シート状やフィルム状に成形されていてもよい。 The wavelength conversion member 5 is a flat plate having an equal thickness and containing the phosphor 51 therein. The wavelength conversion member 5 is placed on the upper end surface 21 of the base 2 and covers the opening of the recess 22. 3 is close to or close to the top. Examples of such a wavelength conversion member 5 include those in which the phosphor 51 is dispersed in a silicone resin that is excellent in translucency and heat resistance and has a small refractive index difference from the translucent member 4. It may be formed into a sheet or film.
波長変換部材5が含有する蛍光体51としては特に限定されず、例えば、赤色蛍光体、緑色蛍光体、青色蛍光体、黄色蛍光体等が挙げられる。 It does not specifically limit as the fluorescent substance 51 which the wavelength conversion member 5 contains, For example, a red fluorescent substance, a green fluorescent substance, a blue fluorescent substance, a yellow fluorescent substance etc. are mentioned.
透光性放熱部材6は、波長変換部材5の熱を放出するためのものであり、板状体をなし、波長変換部材5の上面に載置されている。このような透光性放熱部材6としては、例えば、サファイアやダイアモンド等の熱伝導率が高く透光性に優れた材料からなるものが挙げられる。 The translucent heat radiating member 6 is for releasing the heat of the wavelength conversion member 5, has a plate-like body, and is placed on the upper surface of the wavelength conversion member 5. As such a translucent heat radiating member 6, what consists of material with high heat conductivity, such as sapphire and diamond, and was excellent in translucency is mentioned, for example.
本実施形態に係る発光装置1のうち、LED素子3として近紫外光を発するものを用い、蛍光体51として、赤色蛍光体、緑色蛍光体及び青色蛍光体を用いたものでは、LED素子3が発した近紫外光によって励起された赤色蛍光体、緑色蛍光体及び青色蛍光体が発する赤色光、緑色光及び青色光が混ざり合って白色光が発せられる。そして、LED素子3が発する近紫外光は発光装置1の発光色である白色に実質的に影響しない。このため、例えば、LED素子3が青色光を発するものであって、当該青色光が波長変換部材5に含まれる蛍光体51から発した光と混ざり合うように構成してある場合は、発光装置1の発光面において光路長の差に由来する色調むらが生じやすいが、LED素子3が近紫外光を発するものであって、蛍光体51が、赤色蛍光体、緑色蛍光体及び青色蛍光体である発光装置1は、このような色調むらを生じにくい。 Among the light emitting devices 1 according to the present embodiment, the LED element 3 that emits near ultraviolet light is used, and the phosphor 51 that uses a red phosphor, a green phosphor, and a blue phosphor is used. White light is emitted by mixing red light, green light, and blue light emitted by the red, green, and blue phosphors excited by the emitted near-ultraviolet light. The near-ultraviolet light emitted from the LED element 3 does not substantially affect the white color that is the emission color of the light-emitting device 1. Therefore, for example, when the LED element 3 emits blue light, and the blue light is configured to be mixed with light emitted from the phosphor 51 included in the wavelength conversion member 5, the light emitting device Although the color unevenness due to the difference in the optical path length is likely to occur on the light emitting surface 1, the LED element 3 emits near-ultraviolet light, and the phosphor 51 is composed of a red phosphor, a green phosphor and a blue phosphor Some light emitting devices 1 are less likely to cause such uneven color tone.
そして、このような、LED素子3として近紫外光を発するものを用い、蛍光体51として、赤色蛍光体、緑色蛍光体及び青色蛍光体を用いた発光装置1が発する混合光は、プランク軌跡上を移動するものであって、極めて太陽光に近い自然な白色となる。 The LED element 3 that emits near-ultraviolet light is used, and the mixed light emitted from the light emitting device 1 using the red phosphor, the green phosphor, and the blue phosphor as the phosphor 51 is on the Planck locus. The natural white color is very close to sunlight.
このような実施形態に係る発光装置1であれば、波長変換部材5の下面と、LED素子3の上部とが近接又は密接していることにより、LED素子から発した光は波長変換部材5の狭いエリアを照射し、そのエリアに含まれる蛍光体51を励起するので、波長変換部材5の狭いエリアから外部へ向けて蛍光が発せられる。このため、本発明に係る発光装置は点光源として良好に作用し、集光化処理や平行化処理が容易となる。 In the light-emitting device 1 according to such an embodiment, the light emitted from the LED element is generated by the wavelength conversion member 5 because the lower surface of the wavelength conversion member 5 and the upper part of the LED element 3 are close to or in close contact with each other. Since a narrow area is irradiated and the phosphors 51 included in the area are excited, fluorescence is emitted from the narrow area of the wavelength conversion member 5 to the outside. For this reason, the light-emitting device according to the present invention works well as a point light source, and the condensing process and the parallelizing process become easy.
また、波長変換部材5を基体2凹部22の開口部を覆う板状体とすることにより、その表面積を増大させて放熱を容易にし、波長変換部材5とLED素子3とが近接又は密接することによる波長変換部材5の温度上昇を抑制し、それに含まれる蛍光体51の発光効率や輝度の低下や、熱劣化を防いでいる。 Moreover, by making the wavelength conversion member 5 into a plate-like body that covers the opening of the base 2 recess 22, the surface area is increased to facilitate heat dissipation, and the wavelength conversion member 5 and the LED element 3 are close to or in close contact with each other. The temperature rise of the wavelength conversion member 5 due to the above is suppressed, and the luminous efficiency and luminance of the phosphor 51 contained therein are reduced, and thermal deterioration is prevented.
更に、波長変換部材5の上に透光性放熱部材6を載置することにより、波長変換部材5から効率的に熱を放出することが可能となり、波長変換部材5に含まれる蛍光体51の発光効率や輝度の低下や、熱劣化を、より一層効果的に防ぐことができる。 Furthermore, by placing the translucent heat radiating member 6 on the wavelength conversion member 5, it becomes possible to efficiently release heat from the wavelength conversion member 5, and the phosphor 51 included in the wavelength conversion member 5 can be released. It is possible to more effectively prevent a decrease in luminous efficiency and luminance and thermal deterioration.
なお、本発明は前記実施形態に限られるものではない。 The present invention is not limited to the above embodiment.
例えば、突状部材23は、図3に示すように、横断面矩形状のものであってもよい。 For example, the protruding member 23 may have a rectangular cross section as shown in FIG.
また、波長変換部材5は、互いに異なる色の光を発する蛍光体51が均一に分散されているものでなくともよく、互いに異なる色の光を発する蛍光領域が並設されているものであってもよい。すなわち、例えば、図4に示すように、赤色蛍光体を含有する赤色蛍光領域R、緑色蛍光体を含有する緑色蛍光領域G、及び、青色蛍光体を含有する青色蛍光領域Bが横方向に並設されていれば、青色蛍光体が発した青色光や緑色蛍光体が発した緑色光が他の蛍光体51に吸収されることがないのでエネルギー変換効率を高くすることができ、また、波長変換部材5において、赤色蛍光領域R、緑色蛍光領域G及び青色蛍光領域Bが下面からこの順で厚さ方向に積層されている場合は、LED素子3に近い赤色蛍光体ほど速く劣化するので、発光装置1の発光色が変化しやすいが、各蛍光領域が横方向に並設されている場合は、各蛍光体51の劣化速度に差が付きにくいので、発光装置1の発光色が変化しにくい。 Further, the wavelength conversion member 5 does not have to have the phosphors 51 emitting light of different colors uniformly dispersed, and is provided with fluorescent regions emitting light of different colors in parallel. Also good. That is, for example, as shown in FIG. 4, a red fluorescent region R containing a red phosphor, a green fluorescent region G containing a green phosphor, and a blue fluorescent region B containing a blue phosphor are arranged in the horizontal direction. If it is provided, the blue light emitted from the blue phosphor and the green light emitted from the green phosphor are not absorbed by the other phosphors 51, so that the energy conversion efficiency can be increased, and the wavelength In the conversion member 5, when the red fluorescent region R, the green fluorescent region G, and the blue fluorescent region B are laminated in the thickness direction in this order from the lower surface, the red phosphor closer to the LED element 3 deteriorates faster, The light emission color of the light emitting device 1 is likely to change. However, when the fluorescent regions are arranged in parallel in the horizontal direction, the light emission color of the light emitting device 1 changes because it is difficult for the phosphor 51 to deteriorate. Hateful.
また、赤色蛍光領域R、緑色蛍光領域G及び青色蛍光領域Bを並設する態様としては、図4に示すものに限られず、図5に示すように、赤色蛍光領域R、緑色蛍光領域G及び青色蛍光領域Bが放射状に設けられていてもよい。 Further, the mode in which the red fluorescent region R, the green fluorescent region G, and the blue fluorescent region B are arranged side by side is not limited to that shown in FIG. 4, but as shown in FIG. 5, the red fluorescent region R, the green fluorescent region G, and Blue fluorescent regions B may be provided radially.
更に、波長変換部材5の周縁には、図5に示すように、熱伝導率の高い、アルミナ、窒化アルミニウム、炭化ケイ素、アルミニウム、銅、銀、金、カーボン、サファイア、ダイアモンド等の粒子が分散されてなる放熱領域Hが形成されていてもよい。このように波長変換部材5の周縁に放熱領域Hが形成されていれば、より一層効率的に波長変換部材5の熱を放出することができる。 Further, as shown in FIG. 5, particles such as alumina, aluminum nitride, silicon carbide, aluminum, copper, silver, gold, carbon, sapphire, and diamond are dispersed around the periphery of the wavelength conversion member 5. The formed heat dissipation area H may be formed. Thus, if the heat dissipation area H is formed at the periphery of the wavelength conversion member 5, the heat of the wavelength conversion member 5 can be released more efficiently.
更に、LED素子3から発した紫外光のうち、蛍光体51に吸収されずに外部に射出される紫外光を遮断するために、波長変換部材5又は透光性放熱部材6の上にUVカットフィルター等が設けられていてもよい。 Further, in order to block out the ultraviolet light emitted from the LED element 3 without being absorbed by the phosphor 51, the UV cut is applied on the wavelength conversion member 5 or the translucent heat radiating member 6. A filter or the like may be provided.
また、基体2の凹部22の内側壁面に高反射率の金属薄膜を設けることにより、凹部22の内側壁面がリフレクタとして機能するものであってもよい。 Further, the inner wall surface of the recess 22 may function as a reflector by providing a metal thin film having a high reflectance on the inner wall surface of the recess 22 of the base 2.
更に、透光性放熱部材6は、図5に示すように、凸レンズとして機能するものであってもよい。 Furthermore, the translucent heat radiating member 6 may function as a convex lens, as shown in FIG.
また、LED素子3は基体2に設けられた配線導体にワイヤボンディングを用いて接続されていてもよい。 Further, the LED element 3 may be connected to a wiring conductor provided on the base 2 using wire bonding.
その他、本発明は上記の各実施形態に限られず、本発明の趣旨を逸脱しない限り、前述した種々の構成の一部又は全部を適宜組み合わせて構成してもよい。 In addition, the present invention is not limited to the above-described embodiments, and may be configured by appropriately combining some or all of the various configurations described above without departing from the spirit of the present invention.
このように本発明によれば、熱による蛍光体の変化を抑制しつつ点光源として作用するLED発光装置を得ることができる。 Thus, according to this invention, the LED light-emitting device which acts as a point light source, suppressing the change of the fluorescent substance by a heat | fever can be obtained.
1・・・発光装置
2・・・基体
3・・・LED素子
4・・・透光性部材
5・・・波長変換部材
6・・・透光性放熱部材
DESCRIPTION OF SYMBOLS 1 ... Light-emitting device 2 ... Base | substrate 3 ... LED element 4 ... Translucent member 5 ... Wavelength conversion member 6 ... Translucent heat dissipation member
Claims (5)
前記凹部の底面に実装されたLED素子と、
前記凹部に充実された透光性部材と、
蛍光体を含有する板状体であって、前記基体の上端面に載置されて前記凹部の開口部を覆う波長変換部材と、を備えており、
前記波長変換部材の下面と、前記LED素子の上部とが近接又は密接していることを特徴とする発光装置。 A base body having a recess opening in the upper end surface;
LED elements mounted on the bottom surface of the recess,
A translucent member filled in the recess;
A plate-like body containing a phosphor, and a wavelength conversion member that is placed on the upper end surface of the substrate and covers the opening of the recess, and
The light emitting device, wherein a lower surface of the wavelength conversion member and an upper portion of the LED element are close to or in close contact with each other.
前記蛍光体は、赤色光を発する蛍光体、緑色光を発する蛍光体、及び、青色光を発する蛍光体である請求項1、2、3又は4記載の発光装置。 The LED element emits near ultraviolet light,
5. The light emitting device according to claim 1, wherein the phosphor is a phosphor that emits red light, a phosphor that emits green light, and a phosphor that emits blue light.
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WO2013055574A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Wavelength conversion component with improved thermal conductive characteristics for remote wavelength conversion |
JP2019102636A (en) * | 2017-12-01 | 2019-06-24 | スタンレー電気株式会社 | Light-emitting device |
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JP4471356B2 (en) * | 2004-04-23 | 2010-06-02 | スタンレー電気株式会社 | Semiconductor light emitting device |
JP4582773B2 (en) * | 2004-09-14 | 2010-11-17 | スタンレー電気株式会社 | LED device |
JP4868960B2 (en) * | 2006-06-30 | 2012-02-01 | 株式会社ファインラバー研究所 | Light emitting device and manufacturing method thereof |
JP2008071954A (en) * | 2006-09-14 | 2008-03-27 | Mimaki Denshi Buhin Kk | Light source device |
JP5480466B2 (en) * | 2007-06-26 | 2014-04-23 | パナソニック株式会社 | Light emitting device |
JP2009016689A (en) * | 2007-07-06 | 2009-01-22 | Toshiba Lighting & Technology Corp | Lighting device |
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WO2013055574A1 (en) * | 2011-10-13 | 2013-04-18 | Intematix Corporation | Wavelength conversion component with improved thermal conductive characteristics for remote wavelength conversion |
JP2019102636A (en) * | 2017-12-01 | 2019-06-24 | スタンレー電気株式会社 | Light-emitting device |
JP7080625B2 (en) | 2017-12-01 | 2022-06-06 | スタンレー電気株式会社 | Light emitting device |
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