JP2010238755A - Land structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a land structure capable of, easily and at low cost, achieving a work in response to necessity of electronic component mounting and a work in response to necessity of inter-ground connection. <P>SOLUTION: Wide portions 20, 20 are provided halfway in a wiring pattern 2, and lands 3, 3 are placed on and fixed to the wide portions 20, 20. An interval between the wide portions 20, 20 is substantially adapted to an inter-terminal distance of an electronic component to be mounted, and a pattern part between the wide portions 20, 20 is used as a connection portion 21. Consequently, when the electronic component is necessary, the connection portion 21 is cut, so that the electronic components can be mounted on the lands 3, 3. Further, when it is not necessary to mount the electric component, the connection portion 21 is left as it is without being cut, so that a wiring pattern can be used. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a land structure on which an electronic component can be mounted.

FIG. 27 is a perspective view showing a land structure according to one conventional example, and FIG. 28 is a plan view showing a land structure according to another conventional example.
As the land structure provided on the wiring pattern, there is one corresponding to the electronic components 110 and 111 having different sizes as shown in FIG. 27 (see, for example, Patent Document 1).
In this land structure 100, a pair of solder resists 103, 103 are formed at opposite ends of a pair of lands 101, 101 to which a large electronic component 110 is soldered, and the small lands 102, 102 are formed by these solder resists. 103 and 103 are provided inside.
As a result, when a large electronic component 110 is being manufactured by soldering, there is a change in the specifications of the electronic device and the small electronic component 111 is changed. The electronic component 111 can be soldered to the small lands 102 and 102. As described above, the small electronic component 111 can be soldered to the lands 102 and 102 having a size corresponding to the small electronic component 111 to prevent the small electronic component 111 from standing or slipping.

In addition, as a land structure provided between the grounds, there is a structure corresponding to the characteristics of the grounds 203 and 204 as shown in FIG. 28 (see, for example, Patent Document 2).
The land structure 200 has a structure in which a pair of lands 201 and 202 are provided at opposite edges of two grounds 203 and 204 arranged adjacent to each other on the substrate surface. Thus, when the grounds 203 and 204 cannot be directly connected due to the difference in characteristics, the circuit elements 210 such as capacitors and inductors are mounted on the lands 201 and 202, the grounds 203 and 204 are connected, and the two grounds 203 and 204 are connected. The potential between them is stabilized.

JP 2000-124577 A JP 2008-130484 A

However, the conventional land structure described above has the following problems.
The land structure 100 shown in FIG. 27 is convenient when not only the large electronic component 110 but also the small electronic component 111 is mounted on the lands 101 and 101 and the lands 102 and 102. However, there are cases where it is not necessary to mount these electronic components themselves depending on the specifications and the prototype results. In such a case, in the land structure 100, it is necessary to electrically connect a short-circuit component to the lands 101, 101 (102, 102), which increases extra work and increases the component cost.
Also in the land structure 200 shown in FIG. 28, when the grounds 203 and 204 having the same characteristics are connected, the circuit element 210 must be mounted on the lands 201 and 202 and the grounds 203 and 204 must be connected. Cost is high.

  The present invention has been made to solve the above-described problems, and has a land structure that can easily and inexpensively implement work corresponding to the necessity of mounting electronic components and work corresponding to the necessity of connection between grounds. The purpose is to provide.

In order to solve the above-described problem, the land structure according to the first aspect of the present invention has a distance substantially corresponding to the distance between the terminals of the electronic component to be mounted on the pair of land mounting portions that can be mounted without protruding the land. Thus, it is formed in the middle of the wiring pattern on the substrate, and a pair of lands are fixed on the pair of land mounting portions.
With this configuration, when it is necessary to mount an electronic component, the pattern portion between the pair of land placement portions is cut. The necessary electronic components are placed on a pair of lands that are electrically disconnected, and the input / output terminals of the electronic components are soldered to the pair of lands, thereby placing the electronic components on the pair of lands. Can be implemented.
In addition, when it is not necessary to mount electronic components, the pattern portion between the pair of land mounting portions is not cut and left as it is, so that the wiring pattern can be changed without mounting a short-circuit component. Can be used.

According to a second aspect of the present invention, in the land structure according to the first aspect, two wiring patterns having a pair of land mounting portions on which a pair of lands are fixed are arranged in parallel, and the two wirings are arranged. By making a pair of lands on the pattern coincide with each other, a configuration in which a four-terminal electronic component can be mounted is adopted.
With this configuration, after cutting the pattern portion between the land mounting portions, a pair of input / output terminals of the four terminals of the electronic component are connected to a pair of lands on one wiring pattern, and the other By connecting the input and output terminals of a pair on a pair of lands on the other wiring pattern, a four-terminal electronic component can be mounted.
Further, when it is not necessary to mount a four-terminal electronic component, the wiring pattern can be used by leaving the pattern portion between the land mounting portions without cutting.

According to a third aspect of the present invention, in the land structure according to the first aspect, three or more wiring patterns having a pair of land mounting portions each having a pair of lands fixed thereto are arranged side by side. By making a pair of lands on the wiring pattern coincide with each other, an array type electronic component can be mounted.
With this configuration, after cutting the pattern portion between the land mounting portions, the input / output terminals of each pair of array-type electronic components can be mounted on a pair of lands on each wiring pattern.
Further, when it is not necessary to mount array type electronic components, the wiring pattern can be used by leaving the pattern portion between the land mounting portions without cutting.

According to a fourth aspect of the present invention, in the land structure according to the first aspect, on the ground adjacent to both sides of the wiring pattern, a pair of lands different from the pair of lands are provided as a straight line between the pair of lands. And a separate straight line between the pair of lands are orthogonal to each other so that a three-terminal electronic component can be mounted.
With this configuration, after the pattern portion between the land mounting portions is cut, the pair of input / output terminals of the electronic component are connected to the pair of lands on the wiring pattern, and the other terminals are separated from each other. By connecting to a pair of lands, a three-terminal electronic component can be mounted on the lands.
Further, when it is not necessary to mount a three-terminal electronic component, a wiring pattern can be used by leaving the pattern portion between the land mounting portions without cutting.

According to a fifth aspect of the present invention, in the land structure according to the third aspect, a pair of lands separate from the pair of lands are provided on the ground adjacent to both sides of the three or more wiring patterns. By fixing so that the straight line between the lands and the straight line between the separate pair of lands are orthogonal to each other, an array type electronic component having a ground terminal can be mounted.
With this configuration, after cutting the pattern portion between the land mounting portions, the three pairs of input / output terminals of the electronic component are connected to each pair of lands on the three or more wiring patterns, and the other terminals are connected to each other. By connecting to a pair of separate lands, an array type electronic component having a ground terminal can be mounted on the lands.
Further, when it is not necessary to mount this electronic component, the wiring pattern can be used by leaving the pattern portion between the land mounting portions without cutting.

  According to a sixth aspect of the present invention, in the land structure according to any one of the first to fifth aspects, the width of the land mounting portion is wider than that of a portion of the wiring pattern excluding the land mounting portion. It was set as the structure which is the set wide part.

By the way, the ground formed on the substrate includes a frame ground (chassis ground) for applying a reference potential, a power supply ground, and a signal ground for flowing a return current. The signal ground includes a digital ground and an analog ground.
The grounds having different characteristics may be connected to each other to stabilize the potential without any problem, and conversely, may cause noise interference with each other.
Further, there are cases where the potential is stabilized and noise interference is caused by separating the grounds having different characteristics. When noise interference occurs, the potential can be stabilized by connecting the grounds with electronic components such as a capacitor and an inductor.
Accordingly, it has been desired to devise a land structure that can easily and inexpensively connect or disconnect grounds having different characteristics or the same characteristics in response to problems such as noise interference.
Accordingly, the invention of claim 7 electrically connects the first ground and the second ground provided on the substrate or the like with one or more narrow connection portions, and each pair of lands, It is set as the structure fixed to the both ends vicinity of each said connection part so that each connection part may be pinched | interposed.
With this configuration, when it is determined that the potential can be stabilized by electrically separating the first ground and the second ground, one or more of the connection portions are disconnected. By doing so, the first ground and the second ground can be electrically separated.
When it is determined that the problem such as noise interference can be solved by connecting the first ground and the second ground using electronic components such as capacitors, all of the one or more connection portions After cutting, the electronic component can be mounted on each pair of lands sandwiching each connection portion.
In addition, since the first ground and the second ground are connected, potential stability can be realized, and when it is determined that no problem occurs, the connection portion is not disconnected and is left as it is. Thus, the electrical connection state between the first ground and the second ground can be maintained.

The invention according to claim 8 is the land structure according to claim 7, wherein the first ground is provided on the surface of the substrate, and the second ground is provided on the back surface of the substrate or an intermediate layer inside the substrate, A ground portion is provided on the surface of the substrate in a state close to the first ground and connected to the second ground through a via hole, and the connection portion is interposed between the island-shaped ground portion and the first ground. Each pair of lands is configured to be fixed in the vicinity of both ends of each connection portion so as to sandwich each connection portion.
With this configuration, by cutting the connection portion, the island-shaped ground portion and the first ground are separated, and as a result, the back surface of the substrate connected to the ground portion through the via hole or the second intermediate layer inside the substrate. The electrical connection between the first ground and the first ground on the substrate surface is released.
Then, after all the connection portions are cut, the electronic components can be connected to each pair of lands in the ground portion and the first ground, and as a result, the electronic components are connected to the first ground and the second ground. Can be interposed.
Moreover, the electrical connection state of a 1st ground and a 2nd ground can be maintained by leaving as it is, without cut | disconnecting a connection part.

According to a ninth aspect of the present invention, in the land structure according to the seventh aspect, the first ground is provided on a substrate fixed with screws on the second ground, and the island-shaped ground portion is defined as the first ground. Provided on the substrate in close proximity and connected to the second ground through screws, a connecting portion is interposed between the island-shaped ground portion and the first ground, and each pair of lands is connected to each connecting portion. It is set as the structure fixedly provided in the vicinity of the both ends of each said connection part so that it may pinch | interpose.
With this configuration, for example, when noise in the substrate is conducted to the second ground through the first ground, the connection portion, the ground portion, and the screw, and noise emission occurs from the second ground, the connection portion is Noise emission can be prevented by placing the electronic component for noise removal on the land above the first ground and the ground portion after being cut or after cutting.
In addition, when a problem such as noise emission does not occur, the normal state can be maintained by leaving the connection portion as it is.

According to a tenth aspect of the present invention, in the land structure according to the seventh aspect, the second ground is a shield case of an electronic component.
The shield case is normally connected to the first ground of the substrate. In such a case, the shield case is similar to a state in which grounds having different characteristics are connected to each other, and noise interference may occur. In such a case, according to the present invention, according to the state of noise interference, it is possible to cope by cutting the connecting portion or mounting the noise countermeasure electronic component on the land after cutting the connecting portion. it can.

According to an eleventh aspect of the present invention, in the land structure according to the ninth aspect, the second ground is a chassis of an electronic device.
For example, noise in the board may be conducted to the chassis of the electronic device through the first ground, the connection part, the ground part, and the screw, and a part of the chassis becomes an antenna, and noise emission may occur. In addition, when another board is connected to the chassis, noise interference between the boards may occur through the chassis.
In such a case, according to the present invention, the noise from the chassis can be obtained by cutting the connecting portion or mounting the noise removing electronic component on the land above the first ground and the ground portion after the cutting. Radiation can be prevented, and noise interference between substrates can be prevented.

  As described above in detail, according to the land structure according to the first to sixth aspects of the present invention, when mounting an electronic component is necessary, the pattern portion between the pair of land mounting portions is cut. In this way, electronic components can be easily mounted on a pair of lands, and when no mounting of electronic components is necessary, no work is required. Thus, there is an excellent effect that the work can be performed easily and at low cost. That is, according to the necessity of noise countermeasure parts such as a capacitor and an inductor, the work can be performed easily and at low cost.

In particular, according to the invention of claim 2, since it is possible to mount a 4-terminal electronic component, it is possible to perform the work easily and at low cost according to the necessity of a noise countermeasure component such as a common mode choke coil. Can do.
According to the invention of claim 3, the work can be performed easily and at low cost according to the necessity of the array type electronic component.
Further, according to the invention of claim 4, since it is possible to mount a three-terminal electronic component, it is possible to perform the work easily and at a low cost according to the necessity of a noise countermeasure component such as a three-terminal capacitor. it can.
Furthermore, according to the invention of claim 5, according to the necessity of the array type electronic component having the ground terminal, the operation can be easily performed at low cost.

  Further, according to the land structure according to the seventh to eleventh aspects of the present invention, when mounting of an electronic component is necessary, it is only necessary to cut the connecting portion that connects the first ground and the second ground. Electronic components can be easily mounted on a pair of lands, and when it is necessary to disconnect the connection between the first ground and the second ground, it is easy to disconnect the connection portion. When the first ground and the second ground can be separated from each other, and when it is necessary to maintain the connection between the first ground and the second ground, the first ground and the second ground are left without performing any work. Therefore, there is an effect that the work can be performed easily and at low cost in accordance with the necessity of mounting electronic components. In particular, it is effective for work of connecting and disconnecting between the first ground and the second ground having different characteristics and mounting of electronic components.

1 is a perspective view showing a land structure according to a first embodiment of the present invention. It is a top view which shows the land structure of FIG. It is a top view for demonstrating the cutting method of a connection part. It is a disassembled perspective view which shows the relationship between the terminal of an electronic component, and a land. It is a perspective view which shows the mounting state of an electronic component. It is a top view which shows the land structure based on 2nd Example of this invention. It is a perspective view which shows the mounting method of an electronic component. It is a top view which shows the land structure based on 3rd Example of this invention. It is a perspective view which shows the mounting method of an electronic component. It is a top view which shows the land structure based on 4th Example of this invention. It is a perspective view which shows the mounting method of an electronic component. It is a top view which shows the land structure based on 5th Example of this invention. It is a perspective view which shows the mounting method of an electronic component. It is a perspective view which shows the land structure based on 6th Example of this invention. It is a top view which shows the land structure of FIG. It is a top view which shows the state which the connection part cut | disconnected. It is a top view which shows the state which mounted the electronic component in the land. It is a top view which shows the land structure based on 7th Example of this invention. It is arrow AA sectional drawing of FIG. It is sectional drawing which shows the state which mounted the electronic component in the land. It is a top view which shows the land structure based on 8th Example of this invention. It is arrow BB sectional drawing of FIG. It is sectional drawing which shows the state which mounted the electronic component in the land. It is a top view which shows the land structure based on 9th Example of this invention. It is a perspective view which shows the modification of 1st-5th Example. It is sectional drawing which shows the modification of 7th Example. It is a perspective view which shows the land structure concerning one prior art example. It is a top view which shows the land structure concerning another prior art example.

  The best mode of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a land structure according to a first embodiment of the present invention, and FIG. 2 is a plan view showing the land structure of FIG.

  As shown in FIG. 1, the land structure 1-1 of this embodiment has a structure in which a pair of lands 3 and 3 are provided in the middle of the linear wiring pattern 2.

  Specifically, the wiring pattern 2 is a thin film formed by printing, for example, copper or the like on a printed wiring board 10 as a substrate in a straight line or a curved line, and is a signal line, a power line, or the like. The wiring pattern 2 has a pair of land mounting portions 20 and 20 in the middle thereof.

The land placement portions 20 and 20 are portions for placing the lands 3 and 3 without protruding. Further, each land mounting portion 20 is a wide portion whose width is set wider than the width of the wiring pattern 2 excluding the land mounting portion 20. Hereinafter, the land mounting portion 20 will be described as a “wide portion 20”.
As shown in FIG. 2, the wide portions 20 and 20 have a width W that is about four times the width w of the wiring pattern 2 in this embodiment. Moreover, the space | interval D of the wide parts 20 and 20 respond | corresponds substantially to the distance between the terminals of the below-mentioned electronic component mounted.
The lands 3 and 3 are rectangular thin films or thin plates formed of a conductor such as copper, for example, and are placed and fixed on the wide portions 20 and 20 without protruding. The lands 3 and 3 are members for mounting electronic components, and the distance between the lands 3 and 3 is set substantially equal to the distance D between the wide portions 20 and 20.
From the above, for example, when the wiring pattern 2 is a signal line and the electronic component to be mounted is a 1005 size chip component, the width W of the wide portion 20 and the width w of the wiring pattern 2 are 0.8 mm, The wide portions 20 and 20 each having a size of about 0.5 mm × 0.3 mm are arranged at an interval D of about 0.4 mm.
Further, in the land structure 1-1 of this embodiment, there is a wiring pattern portion 21 having a length close to the interval D between the lands 3 and 3, and the wide portions 20 and 5 in which the lands 3 and 3 are fixedly provided. The 20 spaces are electrically connected through this portion 21. Hereinafter, the pattern portion 21 will be described as “connecting portion 21”.

Next, the operation and effect of the land structure of this embodiment will be described.
FIG. 3 is a plan view for explaining a method of cutting the connection portion 21, FIG. 4 is an exploded perspective view showing the relationship between the terminals of the electronic component and the lands 3 and 3, and FIG. 5 is an electronic component. It is a perspective view which shows the mounting state.
In the printed wiring board 10 provided with the land structure 1-1 of this embodiment, in order to take measures against noise entering the wiring pattern 2, it is necessary to mount electronic components as noise countermeasure components on the lands 3 and 3. There is.

In such a case, as shown in FIG. 3 (a), using a cutter (not shown), the connecting portion 21 between the wide portions 20 and 20 is cut along the center line L, and the space between the lands 3 and 3 is cut. Keep it electrically disconnected.
As shown in FIG. 3A, when the connection portion 21 is cut, the edge of the connection portion 21 that has been cut and separated comes close via the cut C. For this reason, when there is a possibility that an extra stray capacitance is generated in the portion of the cut C and a problem may occur, it is preferable to cut the connection portion 21 almost completely as shown in FIG. .

After cutting the connection portion 21, as shown in FIG. 4, the electronic component 11 such as a capacitor or inductor, which is a noise countermeasure component, is positioned above the lands 3 and 3, and both terminals 11a and 11a are connected to the lands 3 and 3, respectively. Set to 3.
After that, as shown in FIG. 5, with the terminals 11a and 11a in contact with the lands 3 and 3, the electronic component 11 is placed on the lands 3 and 3, and fixed by soldering (not shown), The electronic component 11 can be mounted on the lands 3 and 3.
As described above, according to the land structure 1-1 of this embodiment, the noise countermeasure electronic component 11 can be mounted on the lands 3 and 3 simply by cutting the connection portion 21, so that it is easy and quick. Noise countermeasures can be taken.

Further, when noise countermeasures are not required for the wiring pattern 2, the connecting portion 21 between the wide portions 20 and 20 is left as it is without being cut. Thereby, the wiring pattern 2 can be used normally.
On the other hand, the conventional land structure 100 shown in FIG. 27 has a structure in which the electrical connection between the lands is completely cut off. Therefore, even when noise countermeasures are unnecessary, the short-circuit component is used. The lands must be electrically connected to each other, and parts and mounting work are required.
On the other hand, according to the land structure 1-1 of this embodiment, as described above, since the lands 3 and 3 are connected in advance by the connecting portion 21, no short-circuit component is required, and the work Omission and cost reduction can be achieved.
As described above, according to the land structure 1-1 of this embodiment, noise countermeasures and noise evaluation can be easily performed. Therefore, shortening of the development cycle of electronic equipment and reduction of the number of trial productions can be expected.

Next explained is the second embodiment of the invention.
FIG. 6 is a plan view showing a land structure according to a second embodiment of the present invention, and FIG. 7 is a perspective view showing a method for mounting an electronic component.
The land structure of this embodiment is different from the first embodiment in that it corresponds to a four-terminal electronic component.
Specifically, as shown in FIG. 6, two wiring patterns 2-1 and 2-2 having the same structure are arranged in parallel on the printed wiring board 10, and each wiring pattern 2-1 (2- In 2), wide portions 20 and 20 are provided, and lands 3 and 3 are fixed on the wide portions 20 and 20. Thereby, the connection part 21 is interposed between the lands 3 and 3 of the wiring pattern 2-1 (2-2).
Then, the lands 3 and 3 of the wiring patterns 2-1 and 2-2 are set so as to coincide with each other, and a four-terminal electronic component can be mounted.

Next, the operation and effect of the land structure 1-2 of this embodiment will be described.
By constructing the land structure 1-2 on the differential transmission path composed of the wiring patterns 2-1 and 2-2, noise enters the differential transmission paths 2-1 and 2-2. If there is a risk, noise countermeasures can be taken easily.
That is, as shown in FIG. 7, the connection portion 21 of the wiring pattern 2-1 (2-2) is cut, a cut C is made, and a four-terminal electronic component 12 such as a common mode choke coil is connected to two pairs of lands. 3 and 3 are mounted.
Specifically, one input / output terminal 12a, 12a of the electronic component 12 is connected to the lands 3, 3 of the wiring pattern 2-1, and the other input / output terminal 12b, 12b is connected to the wiring pattern 2-2. By connecting on the lands 3 and 3, the electronic component 12 is mounted on the differential transmission path composed of the wiring patterns 2-1 and 2-2.
Further, when noise countermeasures are not required for the differential transmission lines 2-1 and 2-2, it is not necessary to mount the electronic component 12. Thus, the wiring patterns 2-1 and 2-2 can be used as the differential transmission path.

As described above, according to the land structure 1-2 of this embodiment, the four-terminal electronic component 12 such as a common mode choke coil can be mounted easily and at low cost according to the necessity.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

Next explained is the third embodiment of the invention.
FIG. 8 is a plan view showing a land structure according to a third embodiment of the present invention, and FIG. 9 is a perspective view showing a method for mounting an electronic component.
The land structure of this embodiment is different from the first and second embodiments in that it corresponds to an array type electronic component.
Specifically, as shown in FIG. 8, n (n = an integer of 3 or more) wiring patterns 2-1 to 2-n having the same structure are arranged on the printed wiring board 10 in parallel. The wiring pattern 2-1 (2-2 to 2-n) is provided with wide portions 20 and 20, and the lands 3 and 3 are fixed on the wide portions 20 and 20, respectively. Thereby, the connection part 21 is interposed between the lands 3 and 3 of the wiring pattern 2-1 (2-2).
Then, the lands 3 and 3 of the wiring patterns 2-1 to 2-n are set to coincide with each other, so that an array type electronic component can be mounted.

Next, the operation and effect of the land structure 1-3 of this embodiment will be described.
When an array type electronic component is mounted on the wiring patterns 2-1 to 2-n in which the land structure 1-3 is configured, as shown in FIG. 9, the wiring patterns 2-1 (2-2 to 2-n) The connection part 21 is cut and a cut C is made.
Thereby, the array-type electronic component 13 can be mounted on the two pairs of lands 3 and 3.
Specifically, the input / output terminals 13a and 13a of the electronic component 13 are connected to the lands 3 and 3 of the wiring patterns 2-1 (2-2 to 2-n), whereby the electronic component 13 is wired. It can be mounted on patterns 2-1 to 2-2n.
If it is not necessary to mount the electronic component 13, the wiring patterns 2-1 to 2-n can be used by leaving them as they are.

As described above, according to the land structure 1-3 of this embodiment, the array-type electronic component 13 can be mounted easily and at low cost according to the necessity.
Other configurations, operations, and effects are the same as those in the first and second embodiments, and thus description thereof is omitted.

Next explained is the fourth embodiment of the invention.
FIG. 10 is a plan view showing a land structure according to a fourth embodiment of the present invention, and FIG. 11 is a perspective view showing a method for mounting an electronic component.
The land structure of this embodiment is different from the first embodiment in that it corresponds to a three-terminal electronic component.
That is, as shown in FIG. 10, in the land structure 1-4 of this embodiment, a pair of grounds 22, 22 are provided on both sides of the wiring pattern 2 on the printed wiring board 10, and the land 3, Lands 3 ′ and 3 ′ separate from 3 are fixed to the grounds 22 and 22, respectively.
Specifically, the grounds 22 and 22 are disposed in a state where the edges thereof are close to both sides of the connection portion 21. The lands 3 'and 3' are arranged so that the straight line M1 between the lands 3 and 3 and the straight line M2 between the lands 3 'and 3' are orthogonal to each other, which enables mounting of a three-terminal electronic component. It has become.

Next, the operation and effect of the land structure 1-4 of this embodiment will be described.
When it becomes necessary to mount an electronic component 14 such as a three-terminal capacitor on the wiring pattern 2 as a countermeasure against noise, the connection portion 21 of the wiring pattern 2 is cut and cut as shown in FIG. Insert C.
The input / output terminals 14a and 14a of the electronic component 14 are connected to the lands 3 and 3 of the wiring pattern 2 and the ground terminals 14b and 14b are connected to the lands 3 'and 3' of the grounds 22 and 22, respectively. The electronic component 13 can be mounted on the wiring pattern 2.
Further, when it is not necessary to mount the electronic component 14, the wiring pattern 2 can be used by leaving the connection portion 21 without cutting it.

As described above, according to the land structure 1-4 of this embodiment, the three-terminal electronic component 14 can be mounted. Therefore, according to the necessity of the noise countermeasure component such as a three-terminal capacitor, the work is performed. It can be carried out easily and at low cost.
Since other configurations, operations, and effects are the same as those in the first embodiment, description thereof is omitted.

Next explained is the fifth embodiment of the invention.
FIG. 12 is a plan view showing a land structure according to a fifth embodiment of the present invention, and FIG. 13 is a perspective view showing a method for mounting an electronic component.
The land structure of this embodiment is different from the third embodiment in that it corresponds to an array type electronic component having a ground terminal.
That is, as shown in FIG. 12, in the land structure 1-5 of this embodiment, n wiring patterns 2-1 to 2-n in which a pair of grounds 22 and 22 are arranged on the printed wiring board 10 in parallel. Lands 3 'and 3' separate from the lands 3 and 3 of the wiring patterns 2-1 (2-2 to 2-n) are fixed to the grounds 22 and 22, respectively.

Next, the operation and effect of the land structure 1-5 of this embodiment will be described.
When the electronic component 15 having a ground terminal is mounted on the wiring patterns 2-1 to 2-n as a noise countermeasure or the like, as shown in FIG. 13, each wiring pattern 2-1 (2-2 to 2-2) is mounted. -N) Cut the connecting portion 21 and make a cut C.
The input / output terminals 15a and 15a of the electronic component 15 are connected to the lands 3 and 3 of the wiring patterns 2-1 (2-2 to 2-n), and the ground terminals 15b and 15b are connected to the ground 22. The electronic component 15 can be mounted on the wiring pattern 2 by connecting to the 22 lands 3 ′ and 3 ′.
Further, when it is not necessary to mount the electronic component 15, the wiring patterns 2-1 to 2-n can be used by leaving the connection portion 21 as it is without cutting.

As described above, according to the land structure 1-5 of this embodiment, the work can be easily and inexpensively performed according to the necessity of the array-type electronic component 15 having the ground terminal.
Since other configurations, operations, and effects are the same as those of the third embodiment, description thereof is omitted.

Next explained is the sixth embodiment of the invention.
FIG. 14 is a perspective view showing a land structure according to the sixth embodiment of the present invention, and FIG. 15 is a plan view showing the land structure of FIG.

  As shown in FIG. 14, in the land structure 1-6 of this embodiment, a ground 4 as a first ground and a ground 5 as a second ground are connected by a narrow connection portion 6 and a pair of the ground structures 1-6. The lands 3 and 3 are fixed to the grounds 4 and 5, respectively.

  Specifically, as shown in FIG. 15, the grounds 4 and 5 are signal grounds having different characteristics provided on the same printed wiring board 10. For example, the ground 4 is a digital ground and the ground 5 is an analog. The ground.

Although the connecting portion 6 can be provided at a plurality of locations between the grounds 4 and 5, in order to facilitate understanding, in this embodiment, an example in which the grounds 4 and 5 are electrically connected by one connecting portion 6 is used. Show.
The lands 3 and 3 are fixed in the vicinity of both end portions of the connection portion 6 so as to sandwich the connection portion 6.

Next, the operation and effect of the land structure of this embodiment will be described.
FIG. 16 is a plan view showing a state in which the connecting portion 6 is cut, and FIG. 17 is a plan view showing a state in which electronic parts are mounted on the lands 3 and 3.
If it is determined that the potential can be stabilized by electrically disconnecting the grounds 4 and 5, the connection portion 6 is disconnected. That is, as shown in FIG. 16, the grounds 4 and 5 can be electrically disconnected by cutting the connection portion 6 along the center line L and making the cut C.

Further, when grounds having different characteristics such as the grounds 4 and 5 are close to each other, noise interference or the like is likely to occur.
Therefore, if it is determined that such problems as noise interference can be solved by connecting the grounds 4 and 5 using electronic components such as capacitors, the grounds 4 and 5 are connected by electronic components. To do.
That is, after cutting the connection portion 6, the electronic component 11 such as a capacitor or an inductor, which is a noise countermeasure component, is mounted on the lands 3 and 3.
Specifically, as shown in FIG. 17, with the terminals 11a and 11a in contact with the lands 3 and 3, the electronic component 11 is placed on the lands 3 and 3 and fixed by soldering or the like (not shown). Thus, the electronic component 11 can be mounted on the lands 3 and 3.
As described above, according to the land structure 1-6 of this embodiment, the noise countermeasure electronic component 11 can be mounted on the lands 3 and 3 simply by cutting the connection portion 6, so that it is easy and quick. Noise countermeasures can be taken.

  Further, by connecting the grounds 4 and 5, potential stability can be realized, and when it is determined that no problem occurs, the connection part 6 is not disconnected and left as it is. , 5 can be maintained.

  Thus, according to the land structure 1-6 of this embodiment, there is an effect that the operation can be easily performed at low cost in accordance with the necessity of mounting the electronic component 11. In particular, it is effective to apply the land structure 1-6 to grounds having different characteristics such as the grounds 4 and 5.

Next, a seventh embodiment of the present invention will be described.
18 is a plan view showing a land structure according to a seventh embodiment of the present invention, and FIG. 19 is a cross-sectional view taken along the line AA in FIG.
This embodiment is different from the sixth embodiment in that the land structure is applied to the ground provided on both sides of the printed wiring board.

That is, as shown in FIGS. 18 and 19, in the land structure 1-7 of this embodiment, the ground 4 as the first ground is provided on the surface 10a of the printed wiring board 10, and the ground as the second ground. 5 is provided on the back surface 10 b of the printed wiring board 10. ,
The island-shaped ground portion 7 is provided on the surface 10 a of the printed wiring board 10 in a state of being close to the ground 4. The ground portion 7 is connected to the ground 5 on the back surface 10 b of the printed wiring board 10 through the via hole 50.
The connecting portion 6 is interposed between the ground portion 7 and the ground 4, and the ground portion 7 and the ground 4 are electrically connected.
The lands 3 and 3 are fixed in the vicinity of both end portions of the connecting portion 6 so as to sandwich the connecting portion 6.

Next, the operation and effect of the land structure of this embodiment will be described.
FIG. 20 is a cross-sectional view showing a state where electronic components are mounted on lands 3 and 3.
When it is determined that the potential can be stabilized by electrically disconnecting the grounds 4 and 5, the connection part 6 is disconnected and the connection between the ground 4 and the ground part 7 is disconnected. As a result, the electrical connection between the ground 5 and the ground 4 connected to the ground portion 7 through the via hole 50 is released.

When it is determined that a problem such as noise interference occurs between the lands 4 and 5, the grounds 4 and 5 are electrically connected by electronic components.
That is, as shown in FIG. 20, after cutting the connection portion 6, the electronic component 11 that is a noise countermeasure component is mounted on the land 3 on the ground portion 7 and the land 3 on the ground 4.

In addition, when it is determined that the grounds 4 and 5 are electrically connected to each other, the connection state of the grounds 4 and 5 is maintained by leaving the connection unit 6 without disconnecting. can do.
Other configurations, operations, and effects are the same as those in the sixth embodiment, and thus description thereof is omitted.

Next, an eighth embodiment of the present invention will be described.
21 is a plan view showing a land structure according to the eighth embodiment of the present invention, and FIG. 22 is a sectional view taken along the line BB in FIG.
This embodiment differs from the sixth and seventh embodiments in that the land structure is applied to the ground and chassis of a printed wiring board assembled to the chassis of the electronic device.

That is, as shown in FIGS. 21 and 22, in the land structure 1-8 of this embodiment, the printed wiring board 10 is fixed to the chassis 8 as the second ground with screws 80. The ground 4 as the first ground is provided on the surface 10 a of the printed wiring board 10.
A circular ground portion 7 is provided on the surface 10 a of the printed wiring board 10 in a state of being close to the ground 4. The ground portion 7 is connected to the chassis 8 through screws 80.
In addition, four connection portions 6 are interposed between the ground portion 7 and the ground 4, and electrically connect the ground portion 7 and the ground 4.
Each pair of lands 3 and 3 is fixed in the vicinity of both end portions of each connection portion 6 so as to sandwich each connection portion 6.

Next, the operation and effect of the land structure of this embodiment will be described.
FIG. 23 is a cross-sectional view showing a state where electronic components are mounted on the lands 3 and 3.
For example, in FIG. 22, when noise in the printed wiring board 10 is conducted to the chassis 8 through the lands 3, 3, the connection part 6, the ground part 7 and the screw 80, a part of the chassis 8 becomes an antenna, and the noise Radiation may occur. Further, when another printed wiring board is assembled to the chassis 8, noise interference between the boards may occur through the chassis 8.
When it is determined that such noise interference may occur, the four connecting portions 6 are disconnected and the connection between the ground 4 and the ground portion 7 is disconnected. As a result, the electrical connection between the chassis 8 connected to the ground portion 7 through the screw 80 and the ground 4 is released.

  Further, in order to determine that a strong noise countermeasure should be taken, as shown in FIG. 23, after cutting the connecting portion 6, the electronic component 11 which is a noise countermeasure component is connected to each pair of lands 3,3. 3 is mounted.

  In addition, when it is determined that the grounds 4 and 5 are electrically connected to each other, the connection state of the grounds 4 and 5 is maintained by leaving the connection unit 6 without disconnecting. can do.

Thus, according to the land structure 1-8 of this embodiment, prevention of noise radiation from the chassis 8 and prevention of noise interference between substrates can be realized easily and at low cost.
Other configurations, operations, and effects are the same as those in the sixth and seventh embodiments, and thus description thereof is omitted.

Next, a ninth embodiment of the present invention will be described.
FIG. 24 is a plan view showing a land structure according to the ninth embodiment of the present invention.
This embodiment differs from the sixth to eighth embodiments in that the land structure is applied to the ground of the printed wiring board and the shield case.

That is, as shown in FIG. 24, in the land structure 1-9 of this embodiment, the ground 4 as the first ground is provided on the surface of the printed wiring board 10, and the shield case 9 as the second ground. Is mounted in the non-ground region 10c on the surface.
The shield case 9 is a case in which an electronic component such as an IC is electromagnetically shielded, and is electrically connected to the ground 4 through a plurality of connection portions 6.
Each pair of lands 3 and 3 is fixed in the vicinity of both end portions of each connection portion 6 so as to sandwich each connection portion 6.

Next, the operation and effect of the land structure of this embodiment will be described.
The shield case 9 is normally connected to the ground 4 of the printed wiring board 10 as shown in FIG. However, since the characteristics of the ground 4 and the shield case 9 are different, a noise interference problem may occur.
In such a case, all the connection parts 6 are cut, and the connection between the ground 4 and the shield case 9 is cut.

  Further, when it is determined that strong noise countermeasures should be taken, after disconnecting the connection portion 6, electronic components (not shown) are mounted on each pair of lands 3 and 3.

  Further, when it is determined that the ground 4 and the shield case 9 are electrically stable, the ground 4 and the shield case 9 can be left as it is without cutting the connection portion 6. The connection state with can be maintained.

Thus, according to the land structure 1-9 of this embodiment, it is possible to easily prevent noise interference between the ground 4 and the shield case 9 at a low cost.
Other configurations, operations, and effects are the same as those in the sixth to eighth embodiments, and thus description thereof is omitted.

In addition, this invention is not limited to the said Example, A various deformation | transformation and change are possible within the range of the summary of invention.
For example, in the first to fifth embodiments, as shown in FIG. 1, the land mounting portion 20 is wider than the width of the portion of the wiring pattern 2 excluding the land mounting portions 20 and 20. Although the case of the “wide portion 20” is illustrated, as shown in FIG. 25, the land structure having the land placement portions 20 and 20 having a width equal to the width of the wiring pattern 2 is excluded from the scope of the present invention. is not.
In the seventh embodiment, as shown in FIG. 19, the example in which the ground 5 as the second ground is provided on the back surface of the printed wiring board 10 has been described. However, as shown in FIG. The land structure in which the printed wiring board 10 is a multilayer board, the ground 5 is provided in the intermediate layer 10d inside the printed wiring board 10, and the ground 5 is connected to the ground 4 through the via hole 50 is also within the scope of the present invention. Of course, it is included.

  1-1 to 1-9 ... land structure, 2, 2-1 to 2-n ... wiring pattern, 3, 3 '... land, 4, 5, 22 ... ground, 6, 21 ... connection part, 7 ... ground part 8 ... Chassis, 9 ... Shield case, 10 ... Printed circuit board, 10a ... Front surface, 10b ... Back surface, 10c ... Non-ground area, 11-15 ... Electronic components, 11a-14a, 12b, 13a-15a ... Terminal, 14b 15b: ground terminal, 20: wide part, 50: via hole, 51: capacitor, 80 ... screw.

Claims (11)

A pair of land mounting portions that can be mounted without protruding lands are formed in the middle of the wiring pattern on the substrate at an interval substantially corresponding to the distance between the terminals of the electronic component to be mounted.
A pair of lands are fixed on the pair of land mounting portions.
Land structure characterized by that. The land structure according to claim 1,
By arranging two wiring patterns having the pair of land mounting portions on which the pair of lands are fixed, and aligning the pair of lands on the two wiring patterns. Enables mounting of 4-terminal electronic components,
Land structure characterized by that. The land structure according to claim 1,
Three or more wiring patterns having the one pair of land mounting portions to which the one pair of lands are fixed are arranged in parallel, and the one pair of lands on the three or more wiring patterns are made to coincide with each other. This makes it possible to mount array-type electronic components.
Land structure characterized by that. The land structure according to claim 1,
On the ground adjacent to both sides of the wiring pattern, a pair of lands separate from the pair of lands are formed, and a straight line between the pair of lands and a straight line between the pair of lands are separated. By fixing so as to be orthogonal, it was possible to mount electronic components with 3 terminals.
Land structure characterized by that. The land structure according to claim 3,
A pair of lands separate from the pair of lands are arranged on the ground adjacent to both sides of the three or more wiring patterns, and a straight line between the pair of lands and a pair of lands of the separate bodies. By mounting so that the straight line is orthogonal, it was possible to mount array-type electronic components with ground terminals.
Land structure characterized by that. In the land structure according to any one of claims 1 to 5,
The land mounting portion is a wide portion whose width is set wider than the width of the portion excluding the land mounting portion in the wiring pattern.
Land structure characterized by that. The first ground and the second ground provided on the substrate or the like are electrically connected by one or more narrow connection portions, and each pair of lands is sandwiched between the connection portions. Fixed near both ends of each connection,
Land structure characterized by that. The land structure according to claim 7,
Providing the first ground on the surface of the substrate;
The second ground is provided on the back surface of the substrate or an intermediate layer inside the substrate,
An island-shaped ground portion is provided on the surface of the substrate in a state close to the first ground and connected to the second ground through a via hole,
The connecting portion is interposed between the island-shaped ground portion and the first ground,
Each pair of lands was fixed in the vicinity of both end portions of each connection portion so as to sandwich each connection portion.
Land structure characterized by that. The land structure according to claim 7,
Providing the first ground on a substrate fixed with screws on the second ground;
An island-shaped ground portion is provided on the substrate in the state of being close to the first ground and connected to the second ground through the screw.
The connecting portion is interposed between the island-shaped ground portion and the first ground,
Each pair of lands was fixed in the vicinity of both end portions of each connection portion so as to sandwich each connection portion.
Land structure characterized by that. The land structure according to claim 7,
The second ground is a shield case for electronic components.
Land structure characterized by that. The land structure according to claim 9, wherein
The second ground is a chassis of an electronic device.
Land structure characterized by that.

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