JP2010182983A - Component mounting device, and component mounting method - Google Patents

Abstract

A component mounting apparatus and a component mounting method capable of preventing a reduction in work efficiency due to repeated execution of an unnecessary coating film forming operation.
In a component mounting apparatus in which a paste is transferred to a plurality of types of components having bumps formed on the lower surface and having different planar shapes and mounted on a substrate, whether or not a coating film has already been subjected to a transfer operation in a transfer stage is shown. The transfer information is stored for each unit section B in which the transfer stage is divided in association with the size of the component, and in the coating film forming process of forming the paste coating film on the coating film forming surface of the transfer stage 21b, the mounting target By referring to the component information and transfer information of the component, it is determined whether there is an untransferred section that can be used for the transfer operation, and the coating film forming operation is executed only when it is determined that there is no untransferred section. Like that. As a result, it is possible to prevent a decrease in work efficiency due to repeated execution of unnecessary coating film forming operations.
[Selection] Figure 10

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a bumped component having a connection terminal formed on a lower surface on a substrate.

When mounting a bumped component such as a flip chip or BGA on which a bump serving as a connection terminal is formed on a substrate, a bonding aid such as flux or solder paste (hereinafter simply referred to as “paste”). .)) Is supplied to the bump, and the bump is landed on the electrode of the substrate. For this reason, a paste transfer unit for transferring paste is disposed in a component mounting apparatus that targets such components with bumps (see, for example, Patent Document 1). In this patent document example, as a method of supplying the paste transferred to the bump, the paste was prepared to a predetermined film thickness by executing a coating film forming operation for moving the squeegee on the flat surface of the transfer table. Supply in the form of a coating film. Then, in the transfer table after being used for transfer, the coating film forming operation is performed again in order to level the surface of the coating film in which the concave portion is generated by the transfer.
JP 2007-305725 A

  By the way, the number and size of components to be mounted are not constant and may be different for each mounting operation. For this reason, when the mounting head accesses the paste transfer unit and performs the transfer operation, the effective transferable range on the coating film forming surface is not necessarily provided for transfer in a predetermined regular pattern. Is not limited. In other words, when only small-sized parts are continuously mounted, it is possible to effectively use the coating formation surface if the transfer target is sequentially transferred from the end of the coating formation surface at a constant pitch. is there. However, such regularity is not ensured when components of different sizes are mixed in the components to be mounted. For this reason, in the prior art, the coating film forming operation is performed again even though an effective transferable range exists on the coating film forming surface. As a result, the work efficiency is reduced by repeatedly performing the coating film forming operation which is not originally required.

  Then, an object of this invention is to provide the component mounting apparatus and component mounting method which can prevent the fall of work efficiency by repeating and performing unnecessary coating-film formation operation | movement.

The component mounting apparatus of the present invention is a component mounting apparatus that takes out a plurality of types of components having connection terminals formed on the lower surface and different planar shapes from a component supply unit by a mounting head and mounts them on a substrate, and holds the substrate A substrate holding unit for positioning, a head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit, and a mounting head moving path by the head moving mechanism. A paste transfer unit that supplies paste applied by transfer to the terminals of the components held by the head in the form of a coating film formed on the coating film forming surface of the transfer stage; and a component held by the mounting head. Transfer operation for transferring paste to the terminal by being lowered with respect to the coating film forming surface, and a coating film for forming the coating film in the paste transfer unit A transfer control unit that controls the composition operation, and transfer information indicating whether or not the coating film has already been subjected to the transfer operation in the transfer stage is stored for each unit section in which the transfer stage is divided in association with the size of the component. A transfer information storage unit, and a component information storage unit that stores component information including the size of the component to be mounted, and the transfer control unit refers to the component information and the transfer information to be mounted, The presence or absence of untransferred sections that can be used for the transfer operation is determined, and the coating film forming operation is executed only when it is determined that there are no untransferred sections.

  The component mounting method of the present invention includes a substrate holding unit that holds and positions a substrate, a head moving mechanism that moves a mounting head between the component supply unit and the substrate holding unit, and a mounting head that is mounted by the head moving mechanism. A paste transfer unit that is disposed in the movement path and that supplies the paste applied by transfer to the terminals of the component held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage; A transfer operation for transferring a paste to the terminal by lowering a component held by the mounting head with respect to the coating film forming surface, and a transfer for controlling a coating film forming operation for forming the coating film in the paste transfer unit. Transfer information indicating whether or not the coating film has already been subjected to a transfer operation in the transfer stage is related to the size of the component and the transfer step. Terminals for connection are formed on the lower surface by a component mounting apparatus that includes a transfer information storage unit that stores information for each unit section into which a section is divided and a component information storage unit that stores component information including the size of the component to be mounted. A component mounting method in which a plurality of types of components having different planar shapes are taken out from a component supply unit by a mounting head and mounted on a substrate, wherein the component is taken out from the component supply unit by the mounting head, and the paste transfer A coating film forming step for forming a coating film of the paste on the coating film forming surface of the transfer stage in the unit; and a paste to the terminal by lowering a component held by the mounting head with respect to the coating film forming surface A transfer step for transferring the component, and a component mounting step for transferring and mounting the component after the transfer step onto the substrate held by the substrate holding unit, In the coating film forming process, by referring to the component information and the transfer information of the component to be mounted, it is determined whether there is an untransferred section that can be used for the transfer operation, and it is determined that there is no untransferred section. The coating film forming operation is executed only when the

  According to the present invention, the transfer information indicating whether or not the coating film has already been subjected to the transfer operation in the transfer stage is stored for each unit section in which the transfer stage is divided in association with the size of the component, and the paste transfer unit. In the coating film forming process for forming the paste coating film on the coating film forming surface of the transfer stage in FIG. 1, the untransferred section that can be used for the transfer operation by referring to the component information and the transfer information of the component to be mounted By determining whether or not there is no untransferred section, the coating film forming operation is executed only when it is determined that there is no untransferred section. A decrease can be prevented.

  Next, an embodiment of the present invention will be described with reference to the drawings. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of components to be mounted in the component mounting apparatus according to an embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. FIG. 4 and FIG. 5 are operation explanatory views of the paste transfer unit provided in the component mounting apparatus of one embodiment of the present invention, and FIG. 6 is the present invention. FIG. 7 is an explanatory diagram of a unit section of a transfer stage in a paste transfer unit provided in the component mounting apparatus of one embodiment; FIG. 7 is a block diagram showing a configuration of a control system of the component mounting apparatus of one embodiment of the present invention; FIG. 8 is a process flow diagram showing a component mounting method according to an embodiment of the present invention, and FIGS. 9 and 10 are explanatory diagrams of a transfer operation in the component mounting method according to an embodiment of the present invention.

  First, the structure of the component mounting apparatus 1 will be described with reference to FIG. In FIG. 1, a transport path 3 is arranged in the X direction (substrate transport direction) at the center of the base 2. The conveyance path 3 conveys the board | substrate 4 with which components are mounted, hold | maintains and positions the board | substrate 4 in a component mounting position. Therefore, the transport path 3 is a substrate holding portion that holds and positions the substrate 4. On both sides of the conveyance path 3, a first component supply unit 5A and a second component supply unit 5B that supply components are disposed.

  A plurality of tape feeders 6 are arranged in the first component supply unit 5A. The tape feeder 6 pitch-feeds a tape holding components such as terminal-type chip components, and supplies these components to the pickup position of the mounting head described below. Two tray feeders 7A and 7B are arranged in parallel in the second component supply unit 5B, and the two tray feeders 7A and 7B respectively have different types of first component 8A and second component 8B. Supply to the pickup position of the mounting head in a grid arrangement. The first component 8A is a semiconductor package in which a semiconductor element is mounted on a thin resin substrate such as a BGA, and is connected to the substrate by solder bumps that are a plurality of terminals formed on the lower surface. The second component 8B is a component smaller than the first component 8A, such as a small bumped component or a component having a lead as a terminal. That is, the component mounting apparatus 1 has a function of taking out a plurality of types of components having connection terminals formed on the lower surface and having different planar shapes from the component supply unit by the mounting head and mounting them on the substrate.

  A Y-axis table 9A and a Y-axis guide 9B are disposed at both ends of the base 2 in the X direction, and an X-axis table 10 is installed on the Y-axis table 9A and the Y-axis guide 9B. A mounting head 11 is mounted on the X-axis table 10. The mounting head 11 is a multiple head including a plurality (three in this case) of unit mounting heads 12 and moves integrally with the substrate recognition camera 13.

  By driving the X-axis table 10 and the Y-axis table 9A, the mounting head 11 moves in the XY direction, and components are picked up from the first component supply unit 5A and the second component supply unit 5B by the suction nozzle 12a of the unit mounting head 12. (See FIG. 2 (c)), and transported and mounted on the substrate 4 positioned and held on the transport path 3. The X-axis table 10 and the Y-axis table 9A constitute a head moving mechanism that moves the mounting head 11 between the first component supply unit 5A and the second component supply unit 5B and the conveyance path 3 that is a substrate holding unit. To do.

  A component recognition camera 14, a nozzle stocker 15, and a paste transfer unit 16 are disposed on the movement path of the mounting head 11 between the conveyance path 3 and the second component supply unit 5 </ b> B. While the mounting head 11 picked up from each component supply unit moves to the substrate 4, the mounting head 11 passes above the component recognition camera 14, thereby recognizing the component held by the mounting head 11. To do. The nozzle stocker 15 stores a plurality of types of suction nozzles 12a corresponding to the types of components mounted on the substrate 4, and when the mounting head 11 accesses the nozzle stocker 15, the suction nozzles corresponding to the components to be mounted are stored. It can be selected and installed.

  The paste transfer unit 16 supplies a solder bonding paste, which is a highly viscous liquid material used as a bonding aid during solder bonding, in a thin film state on a table. By lowering the component held by the mounting head 11 with respect to the coating film forming surface 21a (see FIG. 3B) of the paste transfer unit 16, the paste is supplied to the connection terminals of the component by transfer. This transfer operation is executed by the transfer control unit 30b (see FIG. 7) controlling the mounting head 11, the above-described head moving mechanism, and the paste transfer unit 16.

Next, with reference to FIG. 2, the first component 8 </ b> A and the second component 8 </ b> B that are paste transfer targets by the paste transfer unit 16 among the components to be mounted will be described. As shown in FIGS. 2A and 2B, a plurality of bumps 8a are formed in a lattice arrangement on the lower surface of the main body 8 of the first component 8A and the second component 8B. When mounting the first component 8A and the second component 8B, in order to improve solder jointability and further to reinforce the amount of solder, a solder containing active ingredients and solder containing solder particles in the flux Paste etc. are supplied. As shown in FIG. 2C, the paste is supplied in advance by using the paste transfer unit 16 to preliminarily place the first component 8A and the second component 8B, whose upper surface of the main body 8 is held by the suction nozzle 12a. It is performed by moving up and down (arrow a) with respect to the coating film 17a of the formed paste 17. As a result, the paste 17 is supplied by transfer to the bumps 8a which are terminals for bonding.

  Next, the function and structure of the paste transfer unit 16 will be described. The paste transfer unit 16 is arranged in the moving path of the mounting head 11 by the head moving mechanism, and is paste applied to the plurality of types of first components 8A and second components 8B held by the mounting head 11 by transfer. 17 is supplied in the form of a coating film 17a formed on the coating film forming surface 21a. As shown in FIG. 3, a transfer table 21 is disposed on the upper surface of the moving table 20 so as to be horizontally movable in the Y direction. As shown in FIG. 4B, the transfer table 21 is reciprocated in the Y direction by a linear motion mechanism 28 including a motor 25, a feed screw 26, and a nut 27 built in the movement table 20. The operation is performed by the transfer control unit 30b (see also FIG. 7) controlling the motor 25.

  On the upper surface of the transfer table 21, a smooth coating film forming surface 21a for forming a coating film of the paste 17 is provided. The coating film forming surface 21a has a rectangular planar shape, and a rectangular transfer stage 21b is set on the coating film forming surface 21a. The transfer stage 21b is a range that can be effectively used for transferring the paste 17 to the first component 8A and the second component 8B. In this embodiment, the size of the target component is described later. It is divided into unit sections according to With this configuration, the first component 8 </ b> A and the second component 8 </ b> B held by the mounting head 11 are moved up and down with respect to the paste transfer unit 16 in the process of moving the mounting head 11 holding a plurality of components to the substrate 4. Thus, the paste 17 can be supplied to the bumps 8a of the first component 8A and the second component 8B by transfer.

  Above the transfer table 21, a squeegee unit 22 including a first squeegee member 23A and a second squeegee member 23B is disposed. Each of the first squeegee member 23A and the second squeegee member 23B has a length that can substantially cover the X direction of the coating film forming surface 21a, and a first squeegee lifting mechanism built in the squeegee unit 22, respectively. 24A and the second squeegee lifting mechanism 24B can be moved up and down, that is, can move forward and backward with respect to the coating film forming surface 21a.

  The first squeegee elevating mechanism 24A and the second squeegee elevating mechanism 24B are controlled by the transfer control unit 30b, and both the first squeegee member 23A and the second squeegee member 23B can be arbitrarily raised and lowered. Accordingly, the first squeegee member 23A and the second squeegee member 23B can maintain a predetermined film formation gap g between the lower end portion and the coating film forming surface 21a, and the lower end portion is formed as a coating film. It is possible to make sliding contact with the surface 21a.

  Then, the paste 17 is supplied onto the coating film forming surface 21a, and the linear motion mechanism 28 is driven in a state where the first squeegee member 23A and the second squeegee member 23B are maintained at the positions shown in FIG. By moving the transfer table 21 horizontally, the first squeegee member 23A and the second squeegee member 23B move relative to the transfer table 21 in the horizontal direction, thereby forming a film forming gap g on the coating film forming surface 21a. A film forming operation for forming a coating film of the paste 17 having a film thickness corresponding to is performed.

  Therefore, the linear motion mechanism 28 that horizontally moves the transfer table 21 moves the first squeegee member 23A and the second squeegee member 23B relative to the transfer table 21 to move the transfer table 21 to the coating film forming surface 21a. A coating film forming means for performing a coating film forming operation for forming a coating film of the paste 17 having a film thickness corresponding to the film forming gap g is configured. This coating film forming operation is controlled by the transfer control unit 30b.

Next, the coating film forming operation and the film scraping operation performed by the paste transfer unit 16 will be described with reference to FIGS. First, FIG. 4A shows an end of the first squeegee member 23A and the second squeegee member 23B on the coating film forming surface 21a before starting the coating film forming operation (the right end part in this example). ) And the paste 17 is supplied between the first squeegee member 23A and the second squeegee member 23B. Here, an example in which film formation is performed by the first squeegee member 23A is shown, and at the start of the film formation operation, a film formation gap g between the lower end portion of the first squeegee member 23A and the coating film forming surface 21a. Is set to an appropriate film thickness t for transferring an appropriate amount of paste 17 to the bumps 8a of the first component 8A, and the second squeegee member does not hinder the flow of the paste 17 during coating film formation. 23B is raised (arrow f).

  Next, the linear motion mechanism 22 (see FIG. 3B) built in the moving table 20 is driven to move the transfer table 21 in the direction of the arrow h as shown in FIG. 4B. As a result, the paste 17 is spread by the first squeegee member 23A on the coating film forming surface 21a, and the coating film 17a having a film thickness t is formed on the coating film forming surface 21a. Then, as shown in FIG. 4C, the transfer table 21 is further moved in the direction of the arrow h, thereby forming a coating film 17a having a film thickness t on the coating film forming surface 21a.

  In the above-described film forming operation example, the example in which the coating film is formed by the first squeegee member 23A has been shown, but it is also possible to form the coating film by the second squeegee member 23B. In this case, the left end portion side of the coating film forming surface 21a becomes the film forming start end portion, and the transfer table 21 is moved in the direction opposite to the arrow a, whereby the coating of the paste 17 is similarly performed on the coating film forming surface 21a. A film is formed.

  Next, the scraping operation of the paste 17 will be described with reference to FIG. When the paste 17 is supplied to the first component 8A and the second component 8B by the coating film formed on the coating film forming surface 21a, the coating film becomes rough every time it is transferred, so that it becomes unusable. Therefore, it is necessary to scrape the rough coating film so that a film forming operation can be performed. That is, as shown in FIG. 5A, in a state where the paste 17 is irregularly extended on the coating film forming surface 21a, the second squeegee member 23B is lowered and slidably contacted with the coating film forming surface 21a. Next, the transfer table 21 is moved in the arrow d direction. Thereby, as shown in FIG. 5B, the paste 17 on the coating film forming surface 21a is scraped by the second squeegee member 23B, and is in a state almost the same as that before the film formation shown in FIG. 4A. It becomes.

  Of course, it is also possible to scrape the paste 17 by the first squeegee member 23A. Similarly, as shown in FIG. 5C, the paste 17 is extended in an irregular shape on the coating film forming surface 21a. In this state, the first squeegee member 23A is lowered and brought into sliding contact with the coating film forming surface 21a, and then the transfer table 21 is moved in the direction of arrow e. Thereby, as shown in FIG.5 (d), the paste 17 on the coating-film formation surface 21a is scraped by the 1st squeegee member 23A. That is, in the present embodiment, the first squeegee member 23A and the second squeegee member 23B as the film forming members both serve as a scraping member that scrapes off the coating film on the coating film forming surface 21a. ing.

  Next, with reference to FIG. 6, the unit section set on the transfer stage 21b of the coating film forming surface 21a will be described. In FIG. 6, a plurality of unit sections B obtained by dividing a rectangular transfer stage 21b into a lattice shape (here, a 6 × 3 lattice array in the X and Y directions) are set on the upper surface of the coating film forming surface 21a. Yes. Here, the sizes x1 and y1 of the unit section B in the X direction and the Y direction are the components (here, the first component 8A and the second component 8B) that are the targets of paste transfer in the component mounting apparatus 1. ) Is set larger than at least the size of the smallest component (here, the second component 8B).

  Desirably, when a plurality (three in this embodiment) of these parts are held by the mounting head 11 which is a multiple head, the plurality of parts are simultaneously lowered and collectively. The size of the unit section B is set in consideration of the arrangement pitch of the unit mounting heads 12 in the mounting head 11 so that the paste 17 can be transferred. That is, in the present embodiment, the unit section B has a form in which the transfer stage 21b is divided in association with the size of the part to be transferred. In setting the unit section B, a standard setting may be fixedly employed, or a new unit section B may be set every time the target board type is switched.

  The unit block B set in this way corresponds to a matrix code (Xi, Yi) indicating each position on the transfer stage 21b. In the present embodiment, whether or not the unit section B has already been subjected to the transfer operation of the paste 17 is stored for each unit section B in the execution process of the transfer operation. Thereby, in the transfer stage 21b, after the coating film forming operation is performed, it is possible to determine whether or not there is an untransferred section that is not yet used for paste transfer and can be used for the next transfer operation. In the present embodiment, a lattice arrangement as shown in FIG. 6 is adopted as the unit section for dividing the transfer stage 21b, but the method for dividing the transfer stage 21b into unit sections is arbitrary. In short, any form may be adopted as long as it can clearly distinguish between a range already used for transfer and a range not yet used for transfer.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 30 includes a mounting control unit 30a and a transfer control unit 30b. The mounting control unit 30a controls the component mounting operation by the X-axis table 10, the Y-axis table 9A, and the mounting head 11. The transfer control unit 30b lowers the first component 8A and the second component 8B held by the mounting head 11 with respect to the coating film forming surface 21a, thereby applying the paste 17 to the bumps 8a serving as connection terminals. The transfer operation for transferring and the coating film forming operation for forming the coating film 17a in the paste transfer unit 16 are controlled.

  The storage unit 31 includes a component information storage unit 31a and a transfer information storage unit 31b. The component information storage unit 31a stores component information about components to be mounted in the device. These pieces of component information include data on the size of the component. The transfer information storage unit 31b stores transfer information indicating whether or not the formed coating film 17a has already been subjected to a transfer operation in the transfer stage 21b for each unit section B into which the transfer stage 21b is divided.

  In the execution process of the transfer operation, the component information storage unit 31a and the transfer information storage unit 31b are always referred to, and when executing a new transfer operation, in the untransferred section at the time, that is, in the next transfer operation. The presence / absence of a unit block B that can be used is determined. If it is determined that there is a unit block B that can be used in the transfer operation, the transfer operation is executed for the unit block B. Only when it is determined that there is no unit section B that can be used in the transfer operation, the transfer information storage unit 31b causes the paste transfer unit 16 to execute a new coating film forming operation.

Next, a component mounting process flow by the component mounting apparatus 1 will be described with reference to FIG. In this component mounting process, a plurality of types of components (first component 8A and second component 8B) having different planar shapes are formed on the lower surface by bumps 8a serving as connection terminals, and second components are mounted by the mounting head 11. A component mounting method in which the component is taken out from the supply unit 5B and mounted on the substrate 4 is shown. First, a component is removed from the second component supply unit 5B by the mounting head 11 (component extraction step) (ST1). In parallel with this operation, the paste transfer unit 16 forms a coating film of the paste 17 on the coating film forming surface 21a of the transfer stage 21b (coating film forming step) (ST2). Then, the component 17 held by the mounting head 11 is lowered with respect to the coating film forming surface 21a, whereby the paste 17 is transferred to the bumps 8a which are terminals (transfer process) (ST3). Next, the component after the transfer process is transported and mounted on the substrate 4 held in the transport path 3 which is a substrate holding part (component mounting process).

  Next, an example of the execution process of this transfer process will be described with reference to FIGS. First, FIG. 9 shows an example of the transfer operation when the mounting target is only the second component 8B having a smaller size. In this case, in one mounting turn by the mounting head 11, the three second components 8B are taken out, and the transfer operation is collectively performed on these second components 8B. That is, first, as shown in FIG. 9A, the transfer operation is performed on three unit sections B of (1, 1), (2, 1), and (3, 1). As a result, the transfer information storage unit 31b is written to the effect that the transfer operation has already been performed for these unit sections B (see the hatching range).

  In the next mounting turn, as shown in FIG. 9A, the transfer operation is performed on the three unit sections B of (4, 1), (5, 1), and (6, 1). Information that the transfer operation has already been performed for these unit sections B is written in the information storage unit 31b. Then, as shown in FIG. 9C, the transfer operation is executed for the three unit sections B (1, 2), (2, 2), and (3, 2), and the same processing is repeated thereafter. Executed. As described above, in the case where parts of the same size are continuously transferred, the coating film 17a formed on the transfer stage 21b can be effectively used for transfer in accordance with the regularity set in advance.

  On the other hand, FIG. 10 shows a transfer operation example when the first component 8A and the second component 8B of different types and sizes depending on the mounting head 11 are mixedly mounted. First, in FIG. 10A, as in the example shown in FIG. 9A, the transfer operation is performed on three unit sections B of (1, 1), (2, 1), and (3, 1). Execute. As a result, the transfer information storage unit 31b is written to the effect that the transfer operation has already been performed for these unit sections B (see the hatching range). Next, the first component 8A is to be mounted. In this case, since the mounting head 11 can hold only one first component 8A in one mounting turn, one first component 8A is lowered with respect to the transfer stage 21b in the transfer operation.

  That is, as shown in FIG. 10B, the first part 8A is transferred from the four unit sections B (4, 1), (5, 1), (4, 2), and (5, 2). Lower relative to range. As a result, the transfer information storage unit 31b is written to the effect that the transfer operation has already been performed for these unit sections B (see the hatching range). Next, as shown in FIG. 10C, the first component 8A is also the target of the transfer operation in the next mounting turn. In this case, it is lowered with respect to the transfer range consisting of four unit sections B of (1, 2), (2, 2), (1, 3), (2, 3), and these unit sections are similarly For B, the fact that the transfer operation has already been executed is written.

  In the next mounting turn, when the transfer target is the second component 8B, there is an untransferred section that can be used for the transfer operation that collectively executes the three second components 8B at this time. Therefore, the transfer operation is performed using these untransferred sections (for example, (3, 3) (4, 3) (5, 3)). On the other hand, in the next mounting turn, when the transfer target is the first component 8A, there is no untransferred section that can be used for the transfer operation for the first component 8A at this time. Therefore, a new coating film forming operation is executed. That is, first, the scraping operation of the paste 17 shown in FIG. 5 is performed, and then the coating film forming operation shown in FIG. 4 is executed, and then the transfer operation for the next first part 8A is executed.

That is, in the electronic component mounting method shown in the present embodiment, in the coating film forming process shown in FIG. 8, by referring to the component information and transfer information of the component to be mounted, the untransferred section provided for the transfer operation Only when it is determined that there is no untransferred section, the coating film forming operation is executed. Thereby, even when components of different sizes are mixed in the components to be mounted, the work operation that has occurred in the prior art is wasted, that is, there is an effective transferable range in the transfer stage 21b. It is possible to eliminate the waste of performing the coating film forming operation again. Accordingly, it is possible to prevent a decrease in work efficiency due to repeated execution of a coating film forming operation that is not originally required.

  The component mounting apparatus and the component mounting method of the present invention have an effect of preventing a reduction in work efficiency due to repeated execution of an unnecessary coating film forming operation, and a component on which bumps are formed. Useful in the field of mounting on a substrate.

The top view of the component mounting apparatus of one embodiment of this invention Explanatory drawing of the mounting object component in the component mounting apparatus of one embodiment of this invention Structure explanatory drawing of the paste transcription | transfer unit with which the component mounting apparatus of one embodiment of this invention was equipped Operation | movement explanatory drawing of the paste transcription | transfer unit with which the component mounting apparatus of one embodiment of this invention was equipped Operation | movement explanatory drawing of the paste transcription | transfer unit with which the component mounting apparatus of one embodiment of this invention was equipped Explanatory drawing of the unit division of the transcription | transfer stage in the paste transcription | transfer unit with which the component mounting apparatus of one embodiment of this invention was equipped The block diagram which shows the structure of the control system of the component mounting apparatus of one embodiment of this invention Process flow figure which shows the component mounting method of one embodiment of this invention Explanatory drawing of transcription | transfer operation | movement in the component mounting method of one embodiment of this invention Explanatory drawing of transcription | transfer operation | movement in the component mounting method of one embodiment of this invention

1 Component mounting device 3 Transport path (board holding part)
4 Substrate 5A First component supply unit 5B Second component supply unit 8A First component 8B Second component 8a Bump 9A Y-axis table (head moving mechanism)
10 X-axis table (head movement mechanism)
DESCRIPTION OF SYMBOLS 11 Mounting head 12 Unit mounting head 16 Paste transfer unit 17 Paste 17a Coating film 20 Transfer table 21 Transfer table 21a Coating film formation surface 21b Transfer stage B Unit section

Claims (2)

A component mounting apparatus that takes out a plurality of types of components with different connection planes formed on the lower surface from a component supply unit by a mounting head and mounts them on a substrate.
A substrate holding unit for holding and positioning the substrate, a head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit, and a moving path of the mounting head by the head moving mechanism A paste transfer unit for supplying a paste applied by transfer to the terminal of the component held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage;
A transfer operation for transferring a paste to the terminal by lowering a component held by the mounting head with respect to the coating film forming surface, and a transfer for controlling a coating film forming operation for forming the coating film in the paste transfer unit. A transfer information storage unit that stores transfer information indicating whether or not the coating film has already been subjected to a transfer operation in the transfer stage for each unit section in which the transfer stage is divided in association with the size of the component; A component information storage unit that stores component information including the size of the component to be mounted,
The transfer control unit determines whether there is an untransferred section that can be used for the transfer operation by referring to the component information and the transfer information to be mounted, and when it is determined that there is no untransferred section The component mounting apparatus, wherein only the coating film forming operation is executed. A substrate holding unit for holding and positioning the substrate; a head moving mechanism for moving the mounting head between the component supply unit and the substrate holding unit; and a moving path of the mounting head by the head moving mechanism, A paste transfer unit that supplies paste applied by transfer to the terminals of the component held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage, and the component held by the mounting head A transfer control unit for controlling the transfer operation for transferring the paste to the terminal by lowering the coating film forming surface and the coating film forming operation for forming the coating film in the paste transfer unit, and the transfer stage For each unit section in which the transfer stage indicating the transfer information indicating whether or not the coating film has already been subjected to the transfer operation is related to the size of the component. A component mounting apparatus including a transfer information storage unit that stores information and a component information storage unit that stores component information including the size of a component to be mounted. A component mounting method in which a component is removed from a component supply unit by a mounting head and mounted on a board,
A component take-out step of taking out components from the component supply unit by the mounting head, a coating film forming step of forming a coating film of the paste on a coating film forming surface of the transfer stage in the paste transfer unit, and holding by the mounting head A transfer step of transferring the paste to the terminal by lowering the component that has been lowered with respect to the coating film forming surface, and a component mounting step of transferring and mounting the component after the transfer step onto the substrate held by the substrate holding portion Including
In the coating film forming step, by referring to the component information and the transfer information of the component to be mounted, it is determined whether there is an untransferred section that can be used for the transfer operation, and it is determined that there is no untransferred section A component mounting method, wherein the coating film forming operation is executed only when it is performed.

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