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JP2010131524A - Method and apparatus for stream cleaning - Google Patents

Method and apparatus for stream cleaning Download PDF

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Publication number
JP2010131524A
JP2010131524A JP2008309912A JP2008309912A JP2010131524A JP 2010131524 A JP2010131524 A JP 2010131524A JP 2008309912 A JP2008309912 A JP 2008309912A JP 2008309912 A JP2008309912 A JP 2008309912A JP 2010131524 A JP2010131524 A JP 2010131524A
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cleaning
cleaning liquid
flowing water
substrate
cleaned
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Yoshinobu Kimura
義信 木村
Toshiyuki Yamamoto
俊幸 山本
Katsuo Hara
克雄 原
Ryo Yana
亮 梁
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Resonac Holdings Corp
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Showa Denko KK
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a method and an apparatus for stream cleaning which efficiently remove dust, etc. adhered to the surface of a substrate and prevent the dust, etc. from adhering again to the surface of the substrate after cleaning. <P>SOLUTION: The stream cleaning type cleaning method comprises causing a cleaning solution L laterally in the form of a laminar flow within a cleaning vessel 2 and immersing a target article W in the cleaning solution L for cleaning. The flow rate of a part of the cleaning solution L flowing along the bottom surface and both side surfaces within the cleaning vessel 2 is increased with respect to that of the bulk of the cleaning solution L flowing within the cleaning vessel 2. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

本発明は、被洗浄物として、例えば磁気記録媒体用基板や、磁気記録媒体の製造装置に用いられる部品、スパッタ装置のシールド板などの洗浄を行う際に好適に用いられる流水式洗浄方法及び流水式洗浄装置に関する。   The present invention relates to a flowing water cleaning method and flowing water suitably used for cleaning, for example, a substrate for a magnetic recording medium, a component used in a manufacturing apparatus for a magnetic recording medium, a shield plate of a sputtering apparatus, etc. The present invention relates to a type cleaning device.

例えば、ハードディスクドライブなどに用いられる磁気記録媒体用の基板には、中心孔が形成された円盤状のアルミニウム基板やガラス基板などが用いられている。このような磁気記録媒体用基板は、表面に研磨加工などの様々な表面処理工程を経て作製されるため、表面処理工程等の後には、基板の表面に付着した塵埃などを除去する基板洗浄工程が行われている。   For example, as a substrate for a magnetic recording medium used for a hard disk drive or the like, a disk-shaped aluminum substrate or a glass substrate having a central hole is used. Since such a magnetic recording medium substrate is manufactured through various surface treatment processes such as polishing on the surface, a substrate cleaning process for removing dust and the like adhering to the surface of the substrate after the surface treatment process and the like. Has been done.

また、磁気記録媒体の更なる高記録密度化が要求に伴って、磁気記録媒体の高い平坦度が求められる一方で、磁気記録媒体用基板の表面に付着した塵埃などを除去する以外にも、磁気記録媒体の製造装置に用いられる部品やスパッタ装置のシールド板などに付着した塵埃などを除去するための高度な洗浄技術が求められている。   In addition to the demand for higher recording density of magnetic recording media, high flatness of magnetic recording media is required, while other than removing dust and the like adhering to the surface of the magnetic recording medium substrate, There is a need for advanced cleaning techniques for removing dust and the like adhering to parts used in magnetic recording medium manufacturing apparatuses and shield plates of sputtering apparatuses.

このような磁気記録媒体用基板の洗浄装置としては、例えば、磁気ディスク基板などをワークとし、この表面に研磨加工などの表面処理を行った後、ワークの表面に付着している異物などを除去するために、複数の洗浄槽を用いてワークをコンベアにより順次複数の洗浄槽に搬送しながら、各洗浄槽にて液体を用いて洗浄する装置が提案されている(例えば、特許文献1参照。)。   As such a magnetic recording medium substrate cleaning apparatus, for example, a magnetic disk substrate or the like is used as a work, and after the surface treatment such as polishing is performed on the surface, foreign matters adhering to the work surface are removed. In order to do this, an apparatus has been proposed that uses a plurality of cleaning tanks to wash a workpiece using a liquid in each cleaning tank while sequentially transporting a workpiece to a plurality of cleaning tanks by a conveyor (see, for example, Patent Document 1). ).

しかしながら、この特許文献1に記載される洗浄装置では、洗浄槽に回転ブラシやシャワーなどを複数設け、基板の1枚1枚に洗浄液を供給しながら、回転ブラシを用いてスクラブ洗浄することになるが、回転ブラシが基板の表面に接触する構成のため、この基板表面に擦傷痕が生じてしまう虞がある。   However, in the cleaning apparatus described in Patent Document 1, scrub cleaning is performed using a rotating brush while providing a plurality of rotating brushes and showers in the cleaning tank and supplying cleaning liquid to each of the substrates. However, since the rotating brush is in contact with the surface of the substrate, there is a possibility that scratch marks may be generated on the surface of the substrate.

このため、回転ブラシを用いない洗浄方法として、例えば、洗浄槽の底部から洗浄液を供給し、この洗浄液を洗浄槽の上部からオーバーフローさせながら、洗浄槽内の洗浄液に基板を保持したホルダを浸漬させて基板の洗浄を行う方法が提案されている。   For this reason, as a cleaning method that does not use a rotating brush, for example, a cleaning liquid is supplied from the bottom of the cleaning tank, and the holder holding the substrate is immersed in the cleaning liquid in the cleaning tank while overflowing the cleaning liquid from the top of the cleaning tank. A method of cleaning the substrate has been proposed.

しかしながら、洗浄槽の下方から上方に向かって洗浄液を流す洗浄方法では、基板の表面から剥離した塵埃等を含む汚染物質が洗浄槽の上部から洗浄液と共に排出されずに一部が洗浄槽内に滞留してしまうことがあり、この洗浄槽内に洗浄液の淀みを生じさせることがあった。この場合、ホルダを洗浄槽から引き上げる際に、洗浄液内に滞留した汚染物質が基板の表面に再付着することがある。   However, in the cleaning method in which the cleaning liquid flows from the bottom to the top of the cleaning tank, contaminants including dust that has peeled off the surface of the substrate are not discharged together with the cleaning liquid from the upper part of the cleaning tank, but a part of the contaminant stays in the cleaning tank. In some cases, the cleaning liquid stagnates in the cleaning tank. In this case, when the holder is pulled up from the cleaning tank, contaminants staying in the cleaning liquid may reattach to the surface of the substrate.

一方、洗浄槽内に洗浄液を層流の状態で横方向に流しながら、この洗浄槽内の洗浄液に基板を保持したホルダを浸漬させることによって、基板の洗浄を行う流水式洗浄装置が提案されている(例えば、特許文献2などを参照。)。   On the other hand, there has been proposed a flowing water type cleaning apparatus that cleans a substrate by immersing a holder holding the substrate in the cleaning liquid in the cleaning tank while flowing the cleaning liquid in a laminar flow in the horizontal direction in the cleaning tank. (For example, see Patent Document 2).

このような洗浄液を層流の状態で横方向に流す洗浄方法では、汚染物質を含む洗浄液を浸漬槽の外へと速やかに排出することができるため、基板の表面に汚染物質が再付着することを防止することが可能である。
特開2001−96245号公報 特開平9−206708号公報
In such a cleaning method in which the cleaning liquid flows in a laminar flow in the lateral direction, the cleaning liquid containing the contaminant can be quickly discharged out of the immersion tank, so that the contaminant reattaches to the surface of the substrate. Can be prevented.
JP 2001-96245 A JP-A-9-206708

ところで、上述した特許文献2に記載された流水式洗浄装置では、被洗浄物から剥離した汚染物質が洗浄液の乱流に乗って被洗浄物に再付着することを防止するため、多孔状の整流板を流路内に設置し、この整流板を通すことによって洗浄液の流れを乱れのない一様な流れ(層流)となるように洗浄液の流れを調整している。   By the way, in the flowing water type cleaning apparatus described in Patent Document 2 described above, a porous rectifier is used in order to prevent contaminants separated from the object to be cleaned from adhering to the object to be cleaned due to the turbulent flow of the cleaning liquid. A plate is installed in the flow path, and the flow of the cleaning liquid is adjusted so that the flow of the cleaning liquid becomes a uniform flow (laminar flow) without disturbance by passing the current plate.

しかしながら、このような流水式洗浄装置において、洗浄槽内を流れる洗浄液が層流となるのは、この洗浄槽内に被洗浄物を浸漬しない場合である。一方、洗浄槽内に被洗浄物を浸漬した場合は、この洗浄槽内を流れる洗浄液が被洗浄物に乱されて乱流となり、この乱流によって被洗浄物に対する洗浄能力が低下してしまうことがあった。   However, in such a flowing water type cleaning apparatus, the cleaning liquid flowing in the cleaning tank becomes a laminar flow when the object to be cleaned is not immersed in the cleaning tank. On the other hand, when the object to be cleaned is immersed in the cleaning tank, the cleaning liquid flowing in the cleaning tank is disturbed by the object to be cleaned, resulting in a turbulent flow, and the cleaning ability for the object to be cleaned is reduced by this turbulent flow. was there.

そこで、本発明は、このような従来の事情に鑑みて提案されたものであり、被洗浄物の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが被洗浄物の表面に再付着することを防止した流水式洗浄方法及び流水式洗浄装置を提供することを目的とする。   Therefore, the present invention has been proposed in view of such conventional circumstances, and efficiently removes dust and the like adhering to the surface of the object to be cleaned, and these are re-applied to the surface of the object to be cleaned after cleaning. An object is to provide a flowing water cleaning method and a flowing water cleaning device that prevent adhesion.

本発明者は、上記課題を解決すべく鋭意検討を行った結果、洗浄槽内で洗浄液を層流の状態で横方向に流し、この洗浄液に被洗浄物を浸漬させて洗浄を行う際に、洗浄槽内に浸漬した被洗浄物により乱流が発生し、この乱流によって洗浄槽内の底面及び両側面において、被洗浄物の表面から離脱した塵埃や異物などの汚染物質が滞留し、この滞留した汚染物質が被洗浄物に再付着することで、被洗浄物に対する洗浄能力が低下することを解明した。   As a result of diligent studies to solve the above problems, the present inventors flowed the cleaning liquid in a laminar flow in a laminar flow state in the cleaning tank, and when the object to be cleaned is immersed in this cleaning liquid for cleaning, A turbulent flow is generated by the object to be cleaned immersed in the cleaning tank, and this turbulent flow causes contaminants such as dust and foreign matter separated from the surface of the object to be cleaned to stay on the bottom surface and both sides of the cleaning tank. It has been clarified that the cleaning ability for the object to be cleaned decreases due to the staying contaminants on the object to be reattached.

また、洗浄槽の底面や両側面に沿って流れる洗浄液の流れは、これらの面との抵抗により遅くなる。この場合、上述した汚染物質は、この部分に滞留し易くなり、この滞留した汚染物質が乱流により巻き上げられて、被洗浄物に再付着するものと考えられる。   Further, the flow of the cleaning liquid flowing along the bottom surface and both side surfaces of the cleaning tank becomes slow due to resistance with these surfaces. In this case, it is considered that the contaminants described above are likely to stay in this portion, and the staying contaminants are wound up by turbulent flow and reattached to the object to be cleaned.

そこで、本発明者は、洗浄槽内を流れる洗浄液の全体の流れに対して、この洗浄槽内の底面及び両側面に沿って流れる洗浄液の一部の流れを速くすることによって、上述した汚染物質を浸漬槽内から速やかに排出し、汚染物質が乱流により巻き上げられて、被洗浄物に再付着するといったことを低減できることを見出し、本発明を完成するに至った。   Therefore, the present inventor has made the above-mentioned contaminants faster by accelerating the partial flow of the cleaning liquid flowing along the bottom surface and both side surfaces in the cleaning tank with respect to the entire flow of the cleaning liquid flowing in the cleaning tank. Was quickly discharged from the immersion tank, and it was found that the contaminants could be wound up by turbulent flow and reattached to the object to be cleaned, and the present invention was completed.

すなわち、本発明は、以下の手段を提供する。
(1) 洗浄槽内で洗浄液を層流の状態で横方向に流し、この洗浄液に被洗浄物を浸漬させて洗浄を行う流水式洗浄方法であって、
前記洗浄槽内を流れる洗浄液の全体の流れに対して、前記洗浄槽内の底面及び両側面に沿って流れる洗浄液の一部の流れを速くすることを特徴とする流水式洗浄方法。
(2) 前記被洗浄物として、ホルダに保持された基板の洗浄を行う際に、この基板の主面が前記洗浄液の流れる方向と平行となるように前記ホルダを前記浸漬槽内に配置することを特徴とする前項(1)に記載の流水式洗浄方法。
(3) 前記ホルダに互いに平行な状態で複数並んで保持された基板に対して洗浄を行うことを特徴とする前項(1)又は(2)に記載の流水式洗浄方法。
(4) 前記基板として、磁気記録媒体用基板を洗浄することを特徴とする前項(1)〜(3)の何れか一項に記載の流水式洗浄方法。
(5) 洗浄槽内で洗浄液を層流の状態で横方向に流し、この洗浄液に被洗浄物を浸漬させて洗浄を行う流水式洗浄装置であって、
前記洗浄層内の洗浄液を供給する側に、この洗浄槽内を流れる洗浄液の流れを調整する整流板が配置され、
前記整流板には、前記洗浄液を供給する孔部が幅方向と高さ方向とに複数並んで設けられると共に、前記洗浄槽内の底面及び両側面に沿って並ぶ少なくとも1列以上の孔部については、他の孔部よりも相対的に径を大きくしていることを特徴とする流水式洗浄装置。
(6) 前記整流板は、前記洗浄層内の前記洗浄液が供給される側の空間と、前記被洗浄物が浸漬される側の空間との間を仕切るように配置されていることを特徴する前項(5)に記載の流水式洗浄装置。
(7) 前記洗浄層内の洗浄液を排出する側に、前記供給側の整流板と一致した形状の孔部を有する整流板が、前記供給側の整流板と対向して配置されていることを特徴する前項(5)又は(6)に記載の流水式洗浄装置。
(8) 前記排出側の整流板は、前記洗浄層内の前記洗浄液が排出される側の空間と、前記被洗浄物が浸漬される側の空間との間を仕切るように配置されていることを特徴する前項(7)に記載の流水式洗浄装置。
(9) 前記被洗浄物は、ホルダに保持された基板であり、この基板の主面が前記洗浄液の流れる方向と平行となるように前記ホルダが前記浸漬槽内に配置されることを特徴とする前項(5)〜(8)の何れか一項に記載の流水式洗浄装置。
(10) 前記ホルダには、前記基板が互いに平行な状態で複数並んで保持されることを特徴とする前項(5)〜(9)の何れか一項に記載の流水式洗浄装置。
(11) 前記基板は、磁気記録媒体用基板であることを特徴とする前項(5)〜(10)の何れか一項に記載の流水式洗浄装置。
That is, the present invention provides the following means.
(1) A flowing water cleaning method in which a cleaning liquid is caused to flow laterally in a laminar flow in a cleaning tank, and an object to be cleaned is immersed in the cleaning liquid for cleaning.
A flowing water type cleaning method characterized by accelerating a partial flow of the cleaning liquid flowing along the bottom surface and both side surfaces in the cleaning tank with respect to the entire flow of the cleaning liquid flowing in the cleaning tank.
(2) When cleaning the substrate held by the holder as the object to be cleaned, the holder is disposed in the immersion tank so that the main surface of the substrate is parallel to the direction in which the cleaning liquid flows. The running water type washing | cleaning method as described in the preceding clause (1) characterized by these.
(3) The flowing water cleaning method according to (1) or (2) above, wherein cleaning is performed on a plurality of substrates held side by side in parallel to the holder.
(4) The flowing water cleaning method according to any one of (1) to (3), wherein a magnetic recording medium substrate is cleaned as the substrate.
(5) A flowing water type cleaning apparatus for flowing a cleaning liquid in a laminar flow in a laminar flow in a cleaning tank and immersing an object to be cleaned in the cleaning liquid,
On the side of supplying the cleaning liquid in the cleaning layer, a rectifying plate for adjusting the flow of the cleaning liquid flowing in the cleaning tank is disposed,
The rectifying plate is provided with a plurality of holes for supplying the cleaning liquid side by side in the width direction and the height direction, and at least one row of holes arranged along the bottom surface and both side surfaces in the cleaning tank. Is a flowing water type cleaning device characterized in that the diameter is relatively larger than the other holes.
(6) The rectifying plate is disposed so as to partition a space on the side where the cleaning liquid is supplied in the cleaning layer and a space on the side where the object to be cleaned is immersed. The flowing water type washing apparatus according to the preceding item (5).
(7) On the side of discharging the cleaning liquid in the cleaning layer, a rectifying plate having a hole having a shape matching the rectifying plate on the supply side is disposed to face the rectifying plate on the supply side. The flowing water type washing apparatus according to the preceding item (5) or (6), which is characterized.
(8) The discharge-side rectifying plate is disposed so as to partition between a space on the side where the cleaning liquid in the cleaning layer is discharged and a space on which the object to be cleaned is immersed. The flowing water type washing apparatus according to the preceding item (7), characterized in that
(9) The object to be cleaned is a substrate held by a holder, and the holder is arranged in the immersion tank so that a main surface of the substrate is parallel to a direction in which the cleaning liquid flows. The flowing water type washing device according to any one of (5) to (8) above.
(10) The flowing water cleaning apparatus according to any one of (5) to (9), wherein a plurality of the substrates are held in parallel in the holder in a state parallel to each other.
(11) The flowing water cleaning apparatus according to any one of (5) to (10), wherein the substrate is a magnetic recording medium substrate.

以上のように、本発明によれば、被洗浄物の表面に付着した塵埃や異物などの汚染物質を効率良く除去すると共に、洗浄後にこれらの汚染物質が被洗浄物の表面に再付着するといったこと防止した洗浄能力の高い流水式洗浄方法及び流水式洗浄装置を提供することが可能である。   As described above, according to the present invention, contaminants such as dust and foreign matter adhering to the surface of the object to be cleaned are efficiently removed, and these contaminants are reattached to the surface of the object to be cleaned after cleaning. It is possible to provide a flowing water type cleaning method and a flowing water type cleaning apparatus with high cleaning ability.

以下、本発明を適用した流水式洗浄方法及び流水式洗浄装置について、図面を参照して詳細に説明する。なお、以下の説明で用いる図面は、特徴をわかりやすくするために、便宜上特徴となる部分を模式的に示している場合があり、各部の寸法比率などが実際と同じであるとは限らない。   Hereinafter, a flowing water cleaning method and a flowing water cleaning apparatus to which the present invention is applied will be described in detail with reference to the drawings. In the drawings used in the following description, in order to make the features easy to understand, the portions that become the features may be schematically shown for convenience, and the dimensional ratios of the portions are not always the same as the actual ones.

本実施形態では、例えば図1及び図2に示すような本発明を適用した流水式洗浄装置1を用いて、ハードディスクドライブに搭載される磁気記録媒体用の基板(被洗浄物)Wを洗浄する場合を例に挙げて説明する。   In the present embodiment, for example, a substrate (object to be cleaned) W for a magnetic recording medium mounted on a hard disk drive is cleaned using a flowing water type cleaning apparatus 1 to which the present invention is applied as shown in FIGS. A case will be described as an example.

なお、基板Wを洗浄する洗浄液Lとしては、基本的に純水が使用されるが、それ以外にも化学的な処理等が施された処理水などを使用することができる。具体的に、洗浄液Lとしては、例えば、純水や超純水の他に、イソプロピルアルコール等の有機溶剤、界面活性剤を含む薬液洗剤、アノード水、カソード水、純水で低濃度に希釈した酸性溶液やアルカリ性溶液、オゾン水や水素水などを挙げることができる。そして、これらの洗浄液Lは、洗浄対象となる基板(被洗浄物)Wに応じて適宜選択して使用することが可能である。   As the cleaning liquid L for cleaning the substrate W, pure water is basically used, but other than that, treated water subjected to chemical treatment or the like can be used. Specifically, as the cleaning liquid L, for example, in addition to pure water or ultrapure water, it is diluted to a low concentration with an organic solvent such as isopropyl alcohol, a chemical detergent containing a surfactant, anode water, cathode water, or pure water. An acidic solution, an alkaline solution, ozone water, hydrogen water, etc. can be mentioned. These cleaning liquids L can be appropriately selected and used according to the substrate (object to be cleaned) W to be cleaned.

本発明を適用した流水式洗浄装置1は、図1及び図2に示すように、基板Wを保持したホルダ50を洗浄液Lに浸漬させて基板Wの洗浄を行う洗浄槽2を備えている。   As shown in FIGS. 1 and 2, the flowing water type cleaning apparatus 1 to which the present invention is applied includes a cleaning tank 2 for cleaning the substrate W by immersing the holder 50 holding the substrate W in the cleaning liquid L.

ホルダ50には、中心孔が形成された円盤状の基板Wが互いに平行な状態で複数並んで保持されている。また、各基板Wは、ホルダ50に設けられた一対の支持プレート51a,51bによって、その中心孔を通る鉛直方向の中心線を挟んだ両側の外周部が支持されている。なお、これら一対の支持プレート51a,51bには、各基板Wの外周部が係合されるV字状の溝部(図示せず。)が設けられている。   The holder 50 holds a plurality of disk-shaped substrates W formed with a center hole in parallel with each other. In addition, each substrate W is supported by a pair of support plates 51 a and 51 b provided on the holder 50 at outer peripheral portions on both sides across a vertical center line passing through the center hole. The pair of support plates 51a and 51b are provided with V-shaped grooves (not shown) with which the outer peripheral portions of the respective substrates W are engaged.

各基板Wは、これら一対の支持プレート51a,51bに支持されることによって、縦置き状態(基板Wの主面が鉛直方向と平行となる状態)でホルダ50に保持されている。そして、このホルダ50は、各基板Wの主面が洗浄液Lの流れる方向と平行となるようにして、洗浄槽2の底面上に配置されている。なお、本例では、直径2.5インチの基板Wを約5mm間隔で1列に50枚程度並べてホルダ50に保持している。   Each substrate W is supported by the pair of support plates 51a and 51b, and is held by the holder 50 in a vertically placed state (a state where the main surface of the substrate W is parallel to the vertical direction). And this holder 50 is arrange | positioned on the bottom face of the washing tank 2 so that the main surface of each board | substrate W may become parallel to the direction through which the washing | cleaning liquid L flows. In this example, about 50 substrates W having a diameter of 2.5 inches are arranged in a row at intervals of about 5 mm and held in the holder 50.

洗浄槽2は、長方形を為す底壁2aと、底壁2aの周囲から立ち上がる4つの側壁2b,2c,2d,2eと、底壁2aと対向する上面の開口部2fとを有して、全体が略直方体状に形成されている。   The cleaning tank 2 has a rectangular bottom wall 2a, four side walls 2b, 2c, 2d, and 2e that rise from the periphery of the bottom wall 2a, and an opening 2f on the upper surface that faces the bottom wall 2a. Is formed in a substantially rectangular parallelepiped shape.

また、洗浄槽2の底壁2aには、洗浄液Lを供給する供給管3と、洗浄液Lを排出する排出口4とが設けられている。このうち、供給管3は、洗浄液Lの流れる長手方向の上流側の側壁2bの近傍に沿って複数並んで設けられている。また、供給管3は、その先端の供給口を側壁2b側に向けて洗浄液Lを供給することで、層流をより安定的に発生させることができる。一方、排出口4は、洗浄液Lの流れる長手方向の下流側の側壁2dの近傍に沿って複数並んで設けられている。   The bottom wall 2 a of the cleaning tank 2 is provided with a supply pipe 3 that supplies the cleaning liquid L and a discharge port 4 that discharges the cleaning liquid L. Among these, the supply pipe | tube 3 is provided in multiple numbers along the vicinity of the side wall 2b of the upstream of the longitudinal direction where the washing | cleaning liquid L flows. Further, the supply pipe 3 can generate a laminar flow more stably by supplying the cleaning liquid L with the supply port at the tip thereof toward the side wall 2b. On the other hand, a plurality of discharge ports 4 are provided side by side along the vicinity of the side wall 2d on the downstream side in the longitudinal direction in which the cleaning liquid L flows.

また、洗浄槽2の上流側には、この洗浄槽2内を流れる洗浄液Lの流れを調整する整流板5が、上記供給口3から供給された洗浄液Lが貯留される貯留空間S1と、上記ホルダ50が浸漬される浸漬空間S2との間を仕切るように設けられている。一方、洗浄槽2の下流側には、上記浸漬空間S2と、上記排出口4から洗浄液Lが排出される排出空間S3との間を仕切るように、整流板6が設けられている。   Further, on the upstream side of the cleaning tank 2, a rectifying plate 5 for adjusting the flow of the cleaning liquid L flowing in the cleaning tank 2 is provided with a storage space S1 in which the cleaning liquid L supplied from the supply port 3 is stored, and It is provided so as to partition the immersion space S2 in which the holder 50 is immersed. On the other hand, on the downstream side of the cleaning tank 2, a rectifying plate 6 is provided so as to partition the immersion space S2 and the discharge space S3 from which the cleaning liquid L is discharged from the discharge port 4.

このうち、供給側の整流板5は、貯留空間S1から浸漬空間S2に向かって流れる洗浄液Lの流れを整流し、浸漬空間S2内の洗浄液Lを層流の状態で横方向(水平方向)に流すためのものであり、洗浄液Lを供給する孔部5a,5bが幅方向と高さ方向とに複数並んで設けられた多孔板からなる。   Among these, the supply-side rectifying plate 5 rectifies the flow of the cleaning liquid L flowing from the storage space S1 toward the immersion space S2, and the cleaning liquid L in the immersion space S2 is laterally (horizontal) in a laminar state. It is for flowing, and is composed of a perforated plate in which a plurality of holes 5a and 5b for supplying the cleaning liquid L are provided side by side in the width direction and the height direction.

また、この整流板5に設けられた複数の孔部5a,5bのうち、洗浄槽2の底壁2a及び側壁2c,2eに沿って並ぶ少なくとも1列以上の孔部5bについては、他の孔部5aよりも相対的に径が大きくなっている。   Of the plurality of holes 5a and 5b provided in the rectifying plate 5, at least one or more rows of holes 5b arranged along the bottom wall 2a and the side walls 2c and 2e of the cleaning tank 2 have other holes. The diameter is relatively larger than the part 5a.

具体的に、この流水式洗浄装置1では、図3に示すように、洗浄槽2内の底壁2a及び側壁2c,2eに沿って並ぶ孔部5bの径を他の孔部5aよりも大きくすることによって、図1及び図2に示すように、洗浄槽2内を流れる洗浄液Lの全体の流れF1に対して、この洗浄槽2内の底面及び両側面に沿って流れる洗浄液Lの一部の流れF2(流速)が速くなるように調整されている。   Specifically, in this flowing water type cleaning apparatus 1, as shown in FIG. 3, the diameter of the hole 5b arranged along the bottom wall 2a and the side walls 2c and 2e in the cleaning tank 2 is larger than that of the other holes 5a. As a result, as shown in FIGS. 1 and 2, a part of the cleaning liquid L flowing along the bottom surface and both side surfaces in the cleaning tank 2 with respect to the entire flow F1 of the cleaning liquid L flowing in the cleaning tank 2. The flow F2 (flow velocity) is adjusted to be faster.

なお、層流とは、流れの流線が線状を為して整然と流れる状態のことを言う。本例では、このような層流状態の洗浄液Lを一定の流速(例えば10mm/sec程度)で横方向(水平方向)に流している。これに対して、洗浄槽2内の底面及び両側面に沿って流れる洗浄液Lの流速は、この洗浄槽2内を流れる洗浄液Lの全体の流れよりも、好ましくは2〜4倍(例えば、20〜40mm/sec)程度速くなっている。   In addition, a laminar flow means the state in which the flow line of a flow flows orderly. In this example, the laminar cleaning liquid L is flowed in the lateral direction (horizontal direction) at a constant flow rate (for example, about 10 mm / sec). On the other hand, the flow rate of the cleaning liquid L flowing along the bottom surface and both side surfaces in the cleaning tank 2 is preferably 2 to 4 times (for example, 20 times) the entire flow of the cleaning liquid L flowing in the cleaning tank 2. About 40 mm / sec).

一方、排出側の整流板6は、洗浄槽2内を層流の状態で流れる洗浄液Lの流れをより安定化させるためのものであり、洗浄液Lを排出する孔部6a,6bが幅方向と高さ方向とに複数並んで設けられた多孔板からなる。   On the other hand, the discharge-side rectifying plate 6 is for stabilizing the flow of the cleaning liquid L flowing in the laminar flow in the cleaning tank 2, and the holes 6a and 6b for discharging the cleaning liquid L are formed in the width direction. It consists of a plurality of perforated plates provided side by side in the height direction.

また、排出側の整流板6は、上記図3に示す供給側の整流板5と一致した形状の孔部6a,6bを有して、上記供給側の整流板5と対向して配置されている。すなわち、この排出側の整流板6に設けられた複数の孔部6a,6bのうち、洗浄槽2の底壁2a及び側壁2c,2eに沿って並ぶ少なくとも1列以上の孔部6bについては、他の孔部6aよりも相対的に径が大きくなっている。   Further, the discharge-side rectifying plate 6 has holes 6a and 6b having a shape coincident with the supply-side rectifying plate 5 shown in FIG. 3, and is disposed to face the supply-side rectifying plate 5. Yes. That is, among the plurality of holes 6a and 6b provided in the discharge-side rectifying plate 6, at least one or more rows of holes 6b arranged along the bottom wall 2a and the side walls 2c and 2e of the cleaning tank 2 The diameter is relatively larger than the other holes 6a.

なお、本例では、基板Wとして、例えば大きさが10cm程度の磁気記録媒体用基板を洗浄する場合には、上記整流板5,6に設けられた複数の孔部5a,5b、6a,6bのうち、通常の孔部5a,6aの径が例えばφ0.5cmであるのに対し、洗浄槽2内の底壁2a及び側壁2d,2eに沿って並ぶ孔部5b,6bの径が例えばφ1cmである。また、各孔部5a,5b、6a,6bの幅方向及び高さ方向における中心間距離はそれぞれ例えば2cmである。   In this example, when a magnetic recording medium substrate having a size of about 10 cm is washed as the substrate W, a plurality of holes 5a, 5b, 6a, 6b provided in the rectifying plates 5, 6 are used. Among them, the diameter of the normal holes 5a, 6a is, for example, φ0.5 cm, whereas the diameter of the holes 5b, 6b arranged along the bottom wall 2a and the side walls 2d, 2e in the cleaning tank 2 is, for example, φ1 cm. It is. The center-to-center distances in the width direction and the height direction of the holes 5a, 5b, 6a, 6b are each 2 cm, for example.

一方、例えば大きさが30cm〜1m程度のスパッタ装置のシールド板を洗浄する場合には、上記整流板5,6に設けられた複数の孔部5a,5b、6a,6bのうち、通常の孔部5a,6aの径が例えばφ5cmであるのに対し、洗浄槽2内の底壁2a及び側壁2d,2eに沿って並ぶ孔部5b,6bの径が例えばφ10cmである。また、各孔部5a,5b、6a,6bの幅方向及び高さ方向における中心間距離はそれぞれ例えば20cmである。   On the other hand, for example, when cleaning a shield plate of a sputtering apparatus having a size of about 30 cm to 1 m, a normal hole among the plurality of holes 5a, 5b, 6a, 6b provided in the rectifying plates 5, 6 is used. Whereas the diameter of the portions 5a and 6a is, for example, φ5 cm, the diameter of the holes 5b and 6b arranged along the bottom wall 2a and the side walls 2d and 2e in the cleaning tank 2 is, for example, φ10 cm. The center-to-center distances in the width direction and the height direction of the holes 5a, 5b, 6a, 6b are each 20 cm, for example.

また、排出側の整流板6の高さは、洗浄液Lの一部を上部からオーバーフローさせるように、上記4つの側壁2b,2c,2d,2eよりも低く設定されている。   The height of the discharge-side rectifying plate 6 is set lower than the four side walls 2b, 2c, 2d, and 2e so that a part of the cleaning liquid L overflows from above.

さらに、この流水式洗浄装置1には、洗浄槽2内を流れる洗浄液Lを循環的に再使用するため、排出口4から排出された洗浄液Lが貯留されるリザーバータンク7と、リザーバータンク7に貯留された洗浄液Lを供給口3に圧送するためのポンプ8と、ポンプ8により圧送された洗浄液Lを浄化するフィルタ9とが設けられている。   Further, in this flowing water type cleaning apparatus 1, since the cleaning liquid L flowing in the cleaning tank 2 is reused cyclically, a reservoir tank 7 storing the cleaning liquid L discharged from the discharge port 4 and a reservoir tank 7 are provided. A pump 8 for pumping the stored cleaning liquid L to the supply port 3 and a filter 9 for purifying the cleaning liquid L pumped by the pump 8 are provided.

本発明を適用した流水式洗浄方法は、以上のような構造を有する流水式洗浄装置1を用いて、ホルダ50に保持された複数の基板Wに対する洗浄を行う。具体的に、この流水式洗浄装置1を用いた流水式洗浄方法では、洗浄槽2の浸漬空間S2内で洗浄液Lを層流の状態で水平方向に流しながら、この浸漬空間S2内の洗浄液Lに複数の基板Wを保持したホルダ50を浸漬させる。   In the flowing water cleaning method to which the present invention is applied, the plurality of substrates W held by the holder 50 are cleaned using the flowing water cleaning apparatus 1 having the above structure. Specifically, in the flowing water cleaning method using the flowing water cleaning device 1, the cleaning liquid L in the immersion space S2 is flowed in the horizontal direction in a laminar flow in the immersion space S2 of the cleaning tank 2, while the cleaning liquid L in the immersion space S2 is flowed in the horizontal direction. The holder 50 holding the plurality of substrates W is immersed in the substrate.

このとき、洗浄槽2内では、ホルダ50に保持された各基板Wの主面が洗浄液Lの流れる方向と平行とされて、これら各基板Wの間を層流状態の洗浄液Lが流れることになる。これにより、各基板Wの表面が洗浄液Lにより洗浄されて、これら各基板Wの表面に付着した塵埃や異物などの汚染物質が除去される。   At this time, in the cleaning tank 2, the main surface of each substrate W held by the holder 50 is parallel to the direction in which the cleaning liquid L flows, and the laminar cleaning liquid L flows between these substrates W. Become. As a result, the surface of each substrate W is cleaned with the cleaning liquid L, and contaminants such as dust and foreign matter adhering to the surface of each substrate W are removed.

また、この流水式洗浄装置1では、洗浄槽2内を流れる洗浄液Lの全体の流れF1に対して、この洗浄槽2内の底面及び両側面に沿って流れる洗浄液Lの一部の流れF2が速くなっている。これにより、上述した汚染物質を洗浄槽2内に滞留させることなく、この洗浄槽2の外側へと速やかに排出させることができる。したがって、本発明によれば、上述した汚染物質が乱流により巻き上げられて、基板Wに再付着するといったことを低減することができる。   Moreover, in this flowing water type | formula washing | cleaning apparatus 1, with respect to the whole flow F1 of the washing | cleaning liquid L which flows through the inside of the washing tank 2, the partial flow F2 of the washing | cleaning liquid L which flows along the bottom face and both side surfaces in this washing tank 2 is. It's getting faster. Thereby, the contaminants mentioned above can be quickly discharged to the outside of the cleaning tank 2 without staying in the cleaning tank 2. Therefore, according to this invention, it can reduce that the contaminant mentioned above is wound up by the turbulent flow, and it adheres to the board | substrate W again.

以上のようにして、本発明では、基板の表面に付着した塵埃などを効率良く除去すると共に、洗浄後にこれらが基板の表面に再付着することを防止した高度な基板洗浄を行うことが可能である。   As described above, according to the present invention, it is possible to efficiently remove dust and the like adhering to the surface of the substrate, and to perform advanced substrate cleaning that prevents them from reattaching to the surface of the substrate after cleaning. is there.

なお、本発明は、上記実施形態のものに必ずしも限定されるものではなく、本発明の趣旨を逸脱しない範囲において種々の変更を加えることが可能である。   In addition, this invention is not necessarily limited to the thing of the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention.

例えば、上記図3に示す整流板5,6には、通常の孔部5a,6aよりも径が拡大された孔部5b,6bが、洗浄槽2内の底面及び両側面の側から、それぞれ2列並んで設けられた構成となっているが、径が拡大された孔部5b,6bが並ぶ列の数については、少なくとも1列以上とし、その上限については、上記ホルダ50を洗浄槽2の底面上に配置したときに、この孔部3bから供給された洗浄液Lによって流速が高められた一部の流れが、ホルダ50に保持された各基板Wの間を直接通過しない数とすることが好ましい。   For example, the rectifying plates 5 and 6 shown in FIG. 3 have hole portions 5b and 6b having diameters larger than those of the normal hole portions 5a and 6a, respectively, from the bottom surface and both side surfaces in the cleaning tank 2, respectively. The number of rows in which the diameters of the holes 5b and 6b are arranged is at least one, and the upper limit of the number of rows 5b, 6b is set to the above-described holder 50. The number of portions of the flow whose flow rate is increased by the cleaning liquid L supplied from the hole 3b when passing on the bottom surface of the substrate does not pass directly between the substrates W held by the holder 50. Is preferred.

すなわち、上記ホルダ50に保持された各基板Wの間は、通常の孔部3aから供給される層流状態の洗浄液Lが流れるようにし、その外側を流速が高められた洗浄液Lが流れるようにすることが好ましい。本発明では、このような理由に基づいて、通常の孔部3aに対する径が拡大された孔部3bの配置や数、径などが設定されている。   That is, the laminar flow cleaning liquid L supplied from the normal hole 3a flows between the substrates W held by the holder 50, and the cleaning liquid L with an increased flow velocity flows outside thereof. It is preferable to do. In the present invention, based on such reasons, the arrangement, number, diameter, and the like of the hole 3b whose diameter with respect to the normal hole 3a is enlarged are set.

なお、この流水式洗浄装置1では、洗浄液Lを層流の状態で横方向に流すことができる構成であれば、上述した整流板5の他にも、層流発生手段として、例えば多孔質板や不織布などの通水抵抗を有した緩衝材等を使用してもよく、これらを組み合わせて洗浄槽2内を流れる洗浄液Lの流れを適宜調整することも可能である。   In addition, in this flowing water type | formula washing | cleaning apparatus 1, if it is the structure which can wash | clean the washing | cleaning liquid L in the state of a laminar flow, in addition to the current plate 5 mentioned above, as a laminar flow generation means, for example, a porous plate It is also possible to use a buffer material having water resistance such as a nonwoven fabric or the like, and to adjust the flow of the cleaning liquid L flowing in the cleaning tank 2 as appropriate by combining them.

さらに、本発明では、基板Wに対する洗浄能力を高めるため、浸漬空間S2内の洗浄液Lに超音波振動(例えば、200kHzで500W程度)を加えることも可能である。   Furthermore, in the present invention, in order to enhance the cleaning ability for the substrate W, it is also possible to apply ultrasonic vibration (for example, about 500 W at 200 kHz) to the cleaning liquid L in the immersion space S2.

また、上記ホルダ50は、一対の支持プレート51a,51bにより各基板Wの外周部を2点で支持する構成となっているが、このような構成に限らず、各基板Wを支持する外周部の位置や点数などについては、適宜変更して実施することが可能であり、例えば各基板Wの外周部を3点で支持したり、4点で支持したりすることが可能である。   Further, the holder 50 is configured to support the outer peripheral portion of each substrate W at two points by the pair of support plates 51a and 51b. However, the configuration is not limited to this configuration, and the outer peripheral portion supporting each substrate W. The position, the number of points, and the like can be appropriately changed and implemented. For example, the outer peripheral portion of each substrate W can be supported at three points or supported at four points.

また、各基板Wの外周部を支持する部材についても、上記支持プレート51a,51bのようなものに限定されるものではなく、洗浄槽2内を流れる洗浄液Lの流れを乱さないものであれば、その形状等については適宜変更して実施することが可能である。   Further, the members that support the outer peripheral portion of each substrate W are not limited to the support plates 51a and 51b as long as they do not disturb the flow of the cleaning liquid L flowing in the cleaning tank 2. The shape and the like can be changed as appropriate.

また、本発明は、上述した磁気記録媒体用の基板Wについて、表面処理工程等の後に表面に付着した塵埃や異物などを除去する工程とは別に、例えば磁性膜等を成膜した後や、潤滑剤を塗布する前の磁気記録媒体の洗浄にも適用することが可能である。   Further, the present invention, for the above-described magnetic recording medium substrate W, apart from the step of removing dust or foreign matter adhering to the surface after the surface treatment step or the like, for example, after forming a magnetic film or the like, The present invention can also be applied to cleaning of a magnetic recording medium before applying a lubricant.

さらに、本発明は、上述した磁気記録媒体用の基板Wを洗浄する場合に限らず、平板状の被洗浄物を洗浄する場合に好適に用いることが可能であるが、上記流水式洗浄装置1を用いて洗浄可能なものであれば、被洗浄物については特に限定されるものではない。   Furthermore, the present invention is not limited to the case of cleaning the substrate W for a magnetic recording medium described above, but can be suitably used for cleaning a flat object to be cleaned. The object to be cleaned is not particularly limited as long as it can be cleaned using the.

以下、実施例により本発明の効果をより明らかなものとする。なお、本発明は、以下の実施例に限定されるものではなく、その要旨を変更しない範囲で適宜変更して実施することができる。   Hereinafter, the effects of the present invention will be made clearer by examples. In addition, this invention is not limited to a following example, In the range which does not change the summary, it can change suitably and can implement.

(実施例1)
実施例1では、上記図1,2に示す流水式洗浄装置1を用いて、実際に基板Wの洗浄を行った。具体的には、長さ200cm、幅100cm、深さ200cmのSUS304製の洗浄槽2を用い、この洗浄槽2の上流側に貯留空間S1と浸漬空間S2との間を仕切るように幅100cm、高さ200cmの整流板5を配置した。この供給側の整流板5には、複数の孔部5a,5bが幅方向に4列、高さ方向に9列並んで設けられており、このうち、通常の孔部5aの径をφ5cmとしたのに対し、洗浄槽2内の底壁2a及び側壁2d,2eに沿って並ぶ1列の孔部5bの径をφ10cmとした。また、各孔部5a,5bの幅方向及び高さ方向における中心間距離はそれぞれ20cmである。一方、洗浄槽2の下流側には、供給側の整流板5と一致した形状の孔部6a,6bを有する整流板6を、浸漬空間S2と排出空間S3との間を仕切るように配置した。また、洗浄槽2の底面の外側には周波数38kHz、出力1200Wの超音波発信器を配置した。
Example 1
In Example 1, the substrate W was actually cleaned using the flowing water cleaning apparatus 1 shown in FIGS. Specifically, a cleaning tank 2 made of SUS304 having a length of 200 cm, a width of 100 cm, and a depth of 200 cm is used, and a width of 100 cm so as to partition the storage space S1 and the immersion space S2 on the upstream side of the cleaning tank 2, A rectifying plate 5 having a height of 200 cm was disposed. The supply-side rectifying plate 5 is provided with a plurality of holes 5a and 5b arranged in four rows in the width direction and nine rows in the height direction. Of these, the diameter of the normal hole 5a is φ5 cm. On the other hand, the diameter of the holes 5b in one row arranged along the bottom wall 2a and the side walls 2d and 2e in the cleaning tank 2 was set to φ10 cm. The center-to-center distances in the width direction and the height direction of the holes 5a and 5b are 20 cm, respectively. On the other hand, on the downstream side of the cleaning tank 2, a rectifying plate 6 having holes 6a and 6b having a shape corresponding to the rectifying plate 5 on the supply side is arranged so as to partition the immersion space S2 and the discharge space S3. . An ultrasonic transmitter having a frequency of 38 kHz and an output of 1200 W was disposed outside the bottom surface of the cleaning tank 2.

そして、この洗浄槽2内に、1ミクロンから50ミクロンの粉体が付着した洗浄力評価用のテストピース(外径50mm、厚み3mmの円盤状の基板)Wを50枚用意し、これを洗浄槽2内を流れる洗浄液Lに浸漬し、10分間の洗浄を行った。   In this cleaning tank 2, 50 test pieces (disc-shaped substrate having an outer diameter of 50 mm and a thickness of 3 mm) W to which a powder of 1 to 50 microns adheres are prepared and cleaned. It was immersed in the cleaning liquid L flowing in the tank 2 and cleaned for 10 minutes.

なお、洗浄液Lには純水を使用し、水温を45℃±5℃とした。また、洗浄槽2内を層流の状態で流れる洗浄液Lの平均流速(被洗浄物を浸漬しない状態での流速)は3m/分とした。フィルタ9には3ミクロンフィルタと1ミクロンフィルタとを2段で使用し、洗浄槽2内を流れる洗浄液Lを循環的に再使用した。   Note that pure water was used as the cleaning liquid L, and the water temperature was 45 ° C. ± 5 ° C. The average flow rate of the cleaning liquid L flowing in a laminar state in the cleaning tank 2 (the flow rate when the object to be cleaned is not immersed) was 3 m / min. As the filter 9, a 3 micron filter and a 1 micron filter were used in two stages, and the cleaning liquid L flowing in the cleaning tank 2 was reused cyclically.

実施例1では、洗浄後にテストピースWに残存する粉体の割合を評価したところ、粉体の平均除去率は、約99.8%であった。   In Example 1, when the ratio of the powder remaining on the test piece W after the cleaning was evaluated, the average removal rate of the powder was about 99.8%.

(比較例1)
比較例1では、供給側及び排出側の整流板5,6に設けられた孔部5a,6aの径を全てφ5cmとした以外は、実施例1と同様に50枚のテストピースWに対して洗浄を行った。そして、洗浄後にテストピースWに残存する粉体の割合を評価したところ、粉体の平均除去率は、約97.8%であり、実施例1の場合よりも洗浄能力が劣ることがわかった。
(Comparative Example 1)
In Comparative Example 1, 50 test pieces W were formed in the same manner as in Example 1 except that the diameters of the holes 5a and 6a provided in the rectifying plates 5 and 6 on the supply side and the discharge side were all φ5 cm. Washing was performed. And when the ratio of the powder remaining on the test piece W after the cleaning was evaluated, the average removal rate of the powder was about 97.8%, and it was found that the cleaning ability was inferior to that in the case of Example 1. .

図1は、本発明を適用した流水式洗浄装置の構成を示す平面図である。FIG. 1 is a plan view showing a configuration of a flowing water type cleaning apparatus to which the present invention is applied. 図2は、本発明を適用した流水式洗浄装置の構成を示す断面図である。FIG. 2 is a cross-sectional view showing a configuration of a flowing water type cleaning apparatus to which the present invention is applied. 図3は、整流板の構成を示す平面図である。FIG. 3 is a plan view showing the configuration of the current plate.

符号の説明Explanation of symbols

1…流水式洗浄装置 2…洗浄槽 3…供給口 4…排出口 5…供給側の整流板 5a…通常の孔部 5b…経が拡大された孔部 6…排出側の整流板 6a…通常の孔部 6b…径が拡大された孔部 7…リザーバータンク 8…ポンプ 9…フィルタ   DESCRIPTION OF SYMBOLS 1 ... Flowing-water-type washing apparatus 2 ... Cleaning tank 3 ... Supply port 4 ... Discharge port 5 ... Supply side baffle plate 5a ... Normal hole part 5b ... Hole through which passage was expanded 6 ... Discharge side baffle plate 6a ... Normal Hole 6b ... Hole with enlarged diameter 7 ... Reservoir tank 8 ... Pump 9 ... Filter

Claims (11)

洗浄槽内で洗浄液を層流の状態で横方向に流し、この洗浄液に被洗浄物を浸漬させて洗浄を行う流水式洗浄方法であって、
前記洗浄槽内を流れる洗浄液の全体の流れに対して、前記洗浄槽内の底面及び両側面に沿って流れる洗浄液の一部の流れを速くすることを特徴とする流水式洗浄方法。
A flowing water cleaning method in which a cleaning liquid is caused to flow laterally in a laminar flow in a cleaning tank, and an object to be cleaned is immersed in the cleaning liquid for cleaning.
A flowing water type cleaning method characterized by accelerating a partial flow of the cleaning liquid flowing along the bottom surface and both side surfaces in the cleaning tank with respect to the entire flow of the cleaning liquid flowing in the cleaning tank.
前記被洗浄物として、ホルダに保持された基板の洗浄を行う際に、この基板の主面が前記洗浄液の流れる方向と平行となるように前記ホルダを前記浸漬槽内に配置することを特徴とする請求項1に記載の流水式洗浄方法。   When cleaning the substrate held by the holder as the object to be cleaned, the holder is disposed in the immersion tank so that the main surface of the substrate is parallel to the direction in which the cleaning liquid flows. The flowing water type cleaning method according to claim 1. 前記ホルダに互いに平行な状態で複数並んで保持された基板に対して洗浄を行うことを特徴とする請求項1又は2に記載の流水式洗浄方法。   The flowing water type cleaning method according to claim 1 or 2, wherein a plurality of substrates held side by side in parallel with the holder are cleaned. 前記基板として、磁気記録媒体用基板を洗浄することを特徴とする請求項1〜3の何れか一項に記載の流水式洗浄方法。   The flowing water cleaning method according to claim 1, wherein a magnetic recording medium substrate is cleaned as the substrate. 洗浄槽内で洗浄液を層流の状態で横方向に流し、この洗浄液に被洗浄物を浸漬させて洗浄を行う流水式洗浄装置であって、
前記洗浄層内の洗浄液を供給する側に、この洗浄槽内を流れる洗浄液の流れを調整する整流板が配置され、
前記整流板には、前記洗浄液を供給する孔部が幅方向と高さ方向とに複数並んで設けられると共に、前記洗浄槽内の底面及び両側面に沿って並ぶ少なくとも1列以上の孔部については、他の孔部よりも相対的に径を大きくしていることを特徴とする流水式洗浄装置。
It is a flowing water type cleaning device for flowing a cleaning solution in a laminar flow in a laminar flow in a cleaning tank and immersing an object to be cleaned in this cleaning solution for cleaning.
On the side of supplying the cleaning liquid in the cleaning layer, a rectifying plate for adjusting the flow of the cleaning liquid flowing in the cleaning tank is disposed,
The rectifying plate is provided with a plurality of holes for supplying the cleaning liquid side by side in the width direction and the height direction, and at least one row of holes arranged along the bottom surface and both side surfaces in the cleaning tank. Is a flowing water type cleaning device characterized in that the diameter is relatively larger than the other holes.
前記整流板は、前記洗浄層内の前記洗浄液が供給される側の空間と、前記被洗浄物が浸漬される側の空間との間を仕切るように配置されていることを特徴する請求項5に記載の流水式洗浄装置。   The said baffle plate is arrange | positioned so that the space by the side to which the said washing | cleaning liquid in the said washing | cleaning layer may be supplied, and the space by which the said to-be-cleaned material is immersed may be partitioned off. The flowing water type cleaning device described in 1. 前記洗浄層内の洗浄液を排出する側に、前記供給側の整流板と一致した形状の孔部を有する整流板が、前記供給側の整流板と対向して配置されていることを特徴する請求項5又は6に記載の流水式洗浄装置。   A rectifying plate having a hole having a shape that coincides with the rectifying plate on the supply side is disposed opposite to the rectifying plate on the supply side on the side of discharging the cleaning liquid in the cleaning layer. Item 7. The flowing water cleaning device according to Item 5 or 6. 前記排出側の整流板は、前記洗浄層内の前記洗浄液が排出される側の空間と、前記被洗浄物が浸漬される側の空間との間を仕切るように配置されていることを特徴する請求項7に記載の流水式洗浄装置。   The discharge-side rectifying plate is disposed so as to partition between a space on the cleaning layer where the cleaning liquid is discharged and a space on which the object to be cleaned is immersed. The flowing water type washing apparatus according to claim 7. 前記被洗浄物は、ホルダに保持された基板であり、この基板の主面が前記洗浄液の流れる方向と平行となるように前記ホルダが前記浸漬槽内に配置されることを特徴とする請求項5〜8の何れか一項に記載の流水式洗浄装置。   The object to be cleaned is a substrate held by a holder, and the holder is arranged in the immersion tank so that a main surface of the substrate is parallel to a direction in which the cleaning liquid flows. The flowing water type | mold washing apparatus as described in any one of 5-8. 前記ホルダには、前記基板が互いに平行な状態で複数並んで保持されることを特徴とする請求項5〜9の何れか一項に記載の流水式洗浄装置。   The flowing water cleaning apparatus according to any one of claims 5 to 9, wherein a plurality of the substrates are held side by side in the holder in parallel with each other. 前記基板は、磁気記録媒体用基板であることを特徴とする請求項5〜10の何れか一項に記載の流水式洗浄装置。   The flowing water type cleaning apparatus according to claim 5, wherein the substrate is a magnetic recording medium substrate.
JP2008309912A 2008-12-04 2008-12-04 Method and apparatus for stream cleaning Pending JP2010131524A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019030290A (en) * 2018-07-24 2019-02-28 細田工業株式会社 Food material washing device
CN113410656A (en) * 2017-07-28 2021-09-17 三星电机株式会社 Antenna module including flexible substrate

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JPH11319737A (en) * 1998-05-20 1999-11-24 Nec Yamagata Ltd Apparatus for cleaning plate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6018544U (en) * 1983-07-15 1985-02-07 パイオニア株式会社 Washing tank equipment
JPH09206708A (en) * 1996-02-02 1997-08-12 Supii De Fuamu Clean Syst Kk Running water type washing device
JPH1050654A (en) * 1996-08-01 1998-02-20 Nec Corp Wafer-treating apparatus
JPH11319737A (en) * 1998-05-20 1999-11-24 Nec Yamagata Ltd Apparatus for cleaning plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113410656A (en) * 2017-07-28 2021-09-17 三星电机株式会社 Antenna module including flexible substrate
JP2019030290A (en) * 2018-07-24 2019-02-28 細田工業株式会社 Food material washing device

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