JP2010129744A - Optical sensor module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical sensor module easy to assemble even if the module has a structure to essentially have an opening and to cover it. <P>SOLUTION: An opening 101 having a predetermined area is formed in a casing 100. A cover member 40 is provided in the opening 101. In the cover member 40, a flat plate member 41 facing the opening 101, and an elastic support member 42 for supporting the flat plate member 41 relative to a circuit board 20, are fixed to each other. A UV sensor element 10 is mounted on the cover member 40 side of the circuit board 20. Here, the support member 42 and the circuit board 20 are fixed, and thereby, a UV sensor module 1 including the cover member 40, the UV sensor element 10 and the circuit board 20 is formed. With this structure, a package type UV sensor module 1P is assembled only by providing the UV sensor module 1 in the casing 100 such that the flat plate member 41 faces the opening 101 of the casing 100. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an optical sensor module for measuring an irradiation amount of irradiation light such as ultraviolet rays.

  Conventionally, there are various types of optical sensor modules that measure the irradiation amount of light in a specific frequency band such as ultraviolet rays.

  Such an optical sensor module naturally has a casing. For example, in the case of an ultraviolet ray measuring apparatus, in order to measure the irradiation amount of ultraviolet rays, an opening is provided in the casing, and the wave receiving surface of the UV sensor. Must be pointed out of the enclosure. However, when the wave receiving surface of the UV sensor is directly exposed to the outside, the wave receiving surface is soiled or damaged, and the measurement performance such as wave receiving sensitivity is adversely affected.

Therefore, in the conventional optical sensor module, a translucent cover is provided to protect the optical sensor element and the circuit board on which the optical sensor element is mounted. For example, Patent Document 1 describes a structure in which an infrared detection element as an optical sensor element is arranged in a housing. In this apparatus, a thin-film optical filter is disposed so as to cover the opening surface of the housing from the outside, and a filter fixing jig is disposed so as to cover the optical filter. The filter fixing jig and the optical filter are fixed to the casing by fitting the filter fixing jig into a groove provided around the opening of the casing.
Japanese Utility Model Publication No. 2-124582

  However, if a structure as shown in Patent Document 1 is used, the device must be assembled through complicated processes such as fixing the optical sensor to the housing, installing an optical filter to the housing, and installing a filter fixing jig to the housing. I must. Further, since the number of components to be assembled increases, in order to assemble each component with high accuracy, a more careful work must be performed, resulting in an increased workload.

  An object of the present invention is to realize an optical sensor module that is easily assembled even if it has a structure that necessarily has an opening and must cover the opening.

  In the optical sensor module of the present invention, an optical sensor element that is sensitive to light of a specific frequency is mounted on a circuit board. Further, a cover member having a translucency at least in a region corresponding to the wave receiving surface of the optical sensor element is installed on the wave receiving surface side of the optical sensor element and fixed to the optical sensor element.

  The optical sensor module according to the present invention includes an integrated member in which the optical sensor element, the circuit board, and the cover member are integrated, and a housing having an opening on the wave receiving surface side of the optical sensor element. And a cover member consists of a shape which covers the opening part of a housing | casing.

  In this configuration, since the optical sensor element and the cover member are fixed integrally in advance, for example, when assembling to the housing as described above, it is not necessary to individually assemble each of them according to the opening of the housing. . That is, the optical sensor element and the cover member can be assembled without separately performing the process of assembling the optical sensor element in the housing according to the position of the opening and the process of assembling the cover member in the casing according to the opening. If the member to which the is fixed is assembled to the housing in accordance with the opening, the optical sensor element and the cover member to be installed in accordance with the opening are simultaneously installed at an accurate position with respect to the opening.

  Further, at least a part of the cover member of the optical sensor module of the present invention is made of an elastic body.

  In this configuration, since the cover member is partially an elastic body, if an integrated member in which the optical sensor element and the cover member are fixed is installed so that the cover member contacts from the inside of the housing, Thus, the optical sensor element and the cover member can be easily fixed and installed.

  Further, the cover member of the optical sensor module of the present invention is entirely made of an elastic body having translucency and having substantially the same thickness not less than the distance between the optical sensor element and the opening. And the cover member is formed so that it may closely_contact | adhere to the wave-receiving surface side of an optical sensor element.

  In this configuration, since the cover member is formed of a single member having translucency, the light sensor element and the cover member have a simpler structure, and assembly and positioning are facilitated.

  The optical sensor module of the present invention further includes a second circuit board connected to the circuit board and disposed on the side of the circuit board facing the side on which the optical sensor element is mounted. Furthermore, the optical sensor module uses a conductive connection member having elasticity for connection between the circuit board and the second circuit board.

  In this configuration, the optical sensor element and the cover member can be easily attached to the housing when the circuit board including the integral member is further configured to be mounted on the second circuit board or the like in the subsequent stage in terms of electrical circuit. The optical sensor element and the cover member, including the circuit board, can be fixed to the casing by the elastic force by the conductive connection member between the circuit board and the second circuit board.

  In the optical sensor module of the present invention, at least a region corresponding to the wave receiving surface of the cover member is made of a material that transmits only light having a specific frequency to which the optical sensor element is sensitive.

  In this configuration, for example, if the optical sensor element is a UV sensor, the cover member is made of a material that transmits only ultraviolet rays. Thereby, the apparatus which can measure correctly only the light of the specific frequency which is a measuring object can be assembled easily.

  Further, the optical sensor module of the present invention has a structure in which at least a region corresponding to the wave receiving surface of the cover member is integrally formed with a plurality of layers that generate refraction between layers.

  In this configuration, since the transmitted light is condensed on the wave receiving surface of the optical sensor element due to refraction by the interlayer of the cover member, the measurement can be performed more efficiently. At this time, since a plurality of layers are integrally formed, it is not necessary to assemble each layer, and an optical sensor module with better measurement efficiency can be easily assembled.

  According to the present invention, an optical sensor module installed on a structure that necessarily has an opening and must cover the opening can be easily assembled with fewer steps.

The optical sensor module according to the present invention will be described. In the following embodiments, a UV sensor module including a UV sensor element will be described as an example of the optical sensor module.
FIG. 1 is a side sectional view showing a main configuration of a UV sensor module 1 according to the first embodiment. FIG. 2 is a side cross-sectional view showing the main configuration of a packaged UV sensor module 1P in which the UV sensor module 1 of the present embodiment is incorporated in a housing 100.

  The package type UV sensor module 1P includes a housing 100 in which an opening 101 having a predetermined opening area is formed. The housing 100 has a rectangular parallelepiped shape having an internal space with a small thickness (length in the vertical direction in FIG. 1), for example.

  A circuit board 20 is installed inside the housing 100, and the UV sensor element 10 is mounted on one surface of the circuit board 20. In terms of electrical circuit, the UV sensor element 10 outputs a predetermined voltage signal in response to ultraviolet rays, and the circuit board 20 generates a predetermined detection signal by amplifying the voltage signal from the UV sensor element 10 or the like. The output is output from an output terminal (not shown) or supplied to a display element such as an LED (not shown).

  On the other hand, the UV sensor element 10 is mechanically mounted on the opening 101 side of the housing 100 with respect to the circuit board 20. At this time, the UV sensor element 10 is arranged so that the wave receiving surface 11 faces the opening 101 side and is in a region corresponding to the opening 101. A cover member 40 is installed on the mounting surface of the circuit board 20 on the UV sensor element 10 side. At this time, the cover member 40, the UV sensor element 10, and the circuit board 20 are the UV sensor module 1 fixed to each other.

  The cover member 40 has a structure in which the flat plate member 41 and the support member 42 are fixed by bonding or the like. The flat plate member 41 is made of a translucent material that transmits at least ultraviolet light, and has a larger area than the opening 101. The flat plate member 41 has a support member 42 fixed to the peripheral end. The support member 42 is made of a material having a predetermined elasticity and has a predetermined height. The support member 42 supports the flat plate member 41 so that the flat plate member 41 covers the entire UV sensor element 10 from the wave receiving surface 11 side of the UV sensor element 10. At this time, the support member 42 is fixed to the flat plate member 41 and is also fixed to the circuit board 20 with an adhesive or the like.

  The cover member 40 is installed so that the flat plate member 41 covers the entire opening 101 and the end of the flat plate member 41 comes into contact with the inner wall surface of the casing 100 on the opening 101 side. At this time, the cover member 40 is installed so that the flat plate member 41 applies a pressing force toward the inner wall surface of the housing 100 by the elastic force of the support member 42.

  With such a configuration, even if the UV sensor element 10 is arranged in the casing 100 having the opening 101, the flat plate member 41 of the cover member 40 is installed in the opening 101. 10 can receive ultraviolet rays from the outside without being directly exposed to the external environment.

Such a package type UV sensor module 1P is assembled through the following steps.
Although not shown, the housing 100 has a structure that can be divided in the thickness direction, and includes two components, an upper housing member having an opening 101 and a lower housing member on which the circuit board 20 is installed. Consists of.

  When assembling the package type UV sensor module 1P, first, the UV sensor module 1 in which the cover member 40, the UV sensor element 10, and the circuit board 20 are fixedly installed to each other is installed on the inner wall surface of the lower casing member. . At this time, the UV sensor module 1 is installed so that the circuit board 20 contacts the inner wall surface of the lower casing member. Here, if the installation position of the UV sensor module 1 is previously marked on the inner wall surface of the lower housing member, the UV sensor module 1 is placed at a predetermined installation position, that is, a position corresponding to the opening 101 after assembly. The UV sensor module 1 can be installed so that the sensor element 10 is arranged.

  Next, the lower casing member is installed so as to cover the upper casing member, and the lower casing member and the upper casing member are joined. At this time, since the UV sensor module 1 is installed in a predetermined position in advance, the flat plate member 41 of the cover member 40 is disposed inside the opening 101 so as to cover the opening 101. At this time, since the flat plate member 41 is pressed against the inner wall surface of the housing 100 by the elastic force of the support member 42, the flat plate member 41 is fixed in position relative to the housing 100. As a result, the UV sensor element 10 fixed integrally with the flat plate member 41 via the support member 42 and the circuit board 20 is also fixed in position relative to the housing 100.

  As described above, by using the configuration of the present embodiment, the packaged UV sensor module 1P can be assembled very easily.

  In the above description, the example in which the UV sensor module 1 is first installed on the lower casing member has been described. However, the UV sensor module 1 may be first installed on the upper casing member. In this case, the flat plate member 41 may be installed so as to cover the entire surface of the opening 101 while looking at the position of the opening 101. Even with this method, the packaged UV sensor module 1P can be easily assembled.

  In the above description, the example in which the flat plate member 41 of the cover member 40 is simply brought into contact with the inner wall surface of the housing 100 has been described. However, the contact portion between the flat plate member 41 and the housing 100 is made of an adhesive or the like. It may be adhered. Thereby, the flat plate member 41 of the cover member 40 can be fixedly installed at the position 91 of the opening 101 more reliably.

Next, a package type UV sensor module 2P according to the second embodiment will be described with reference to the drawings.
FIG. 3 is a side sectional view showing the main configuration of the packaged UV sensor module 2P according to the second embodiment.

  As shown in FIG. 3, the packaged UV sensor module 2P of the present embodiment is entirely made of an elastic body instead of the cover member 40, compared to the packaged UV sensor module 1P shown in the first embodiment. The cover member 50 is used. At this time, the cover member 50, the UV sensor element 10, and the circuit board 20 are the UV sensor module 2 fixed to each other.

  The cover member 50 is made of a translucent elastic body that transmits at least ultraviolet rays. The cover member 50 has a shape that covers the surfaces of the UV sensor element 10 and the circuit board 20 and has a substantially uniform thickness as a whole, and is in close contact with the surfaces of the UV sensor element 10 and the circuit board 20. The thickness of the cover member 50 is such that the end surface of the cover member 50 abuts the inner wall surface around the opening 101 with a predetermined pressing force when the circuit board 20 to which the cover member 50 is closely attached is installed in the housing 100. It is set to such a dimension.

  Even with such a structure, the UV sensor module 2 to which the cover member 50, the UV sensor element 10, and the circuit board 20 are fixed can be fixedly installed in an area corresponding to the opening 101 of the housing. Furthermore, since the entire cover member 50 is an elastic body, the UV sensor module 2 is securely fixed to the housing 100 even if a slight error occurs between the thickness inside the housing 100 and the thickness of the UV sensor module 2. Can be installed.

  The UV sensor module 2 including the elastic cover member 50, the UV sensor element 10, and the circuit board 20 can be easily manufactured as follows.

  First, the UV sensor element 10 is mounted on the circuit board 20. At this time, the UV sensor element 10 is mounted on each circuit board 20 portion on the collective circuit board using a collective circuit board in which a plurality of the same circuit boards 20 are taken. Next, the liquid resin material which becomes the base of the cover member 50 is apply | coated to the mounting surface side of the UV sensor element 10 of the said collective circuit board in the collective circuit board state. The liquid resin material is, for example, a two-component material that is cured by mixing, and the cover member 50 is formed by applying and curing two types of liquid materials so as to obtain the thickness. Then, the individual UV sensor modules 2 are obtained by cutting the UV sensor modules 2 formed in a multi-state in this way into the respective UV sensor modules 2. By using such a manufacturing method, a plurality of UV sensor modules 2 including the cover member 50, the UV sensor element 10, and the circuit board 20 can be manufactured simultaneously. And by using the UV sensor module 2 manufactured in this way, the process load can be reduced when the packaged UV sensor module 2P is mass-produced.

Next, a package type UV sensor module 3P according to a third embodiment will be described with reference to the drawings.
FIG. 4A is a side sectional view showing the main configuration of the packaged UV sensor module 3P shown in the present embodiment, and FIG. 4B shows the main configuration of the packaged UV sensor module 4P shown in the present embodiment. It is side surface sectional drawing.

  The package type UV sensor module 3P shown in FIG. 4A is a flat plate member of the cover member 60 (the cover member 40 in FIG. 2) compared to the package type UV sensor module 1P shown in FIG. 2 of the first embodiment. 61 (the flat plate member 41 in FIG. 2) has a two-layer structure of an inner layer plate 611 and an outer layer plate 612.

  Similarly, the package type UV sensor module 4P shown in FIG. 4B is different from the package type UV sensor module 2P shown in FIG. 3 of the second embodiment in the cover member 70 (the cover member 50 in FIG. 3). Is a two-layer structure of an inner layer 71 and an outer layer 72. In the case of such a two-layer structure, for example, the outer layer plate 612 and the outer layer 72 are made of a material that transmits ultraviolet light but not visible light, and the inner layer plate 611 and the inner layer 61 are made of specific ultraviolet light (for example, UV-A or UV-A). By using a material that transmits B or the like, it is possible to configure an ultraviolet ray measuring apparatus that can reduce the frequency of the measurement target without being visible from the outside. Further, by changing the dielectric constants of the outer layer plate 612 (outer layer 72) and the inner layer plate 611 (inner layer 61), the ultraviolet rays are refracted at the layer boundary surface, and the ultraviolet rays are collected on the wave receiving surface 11 of the UV sensor element 10. You can also That is, by using such a two-layer structure, a higher-performance ultraviolet measuring device can be realized.

  At this time, by using a member in which the respective layers constituting the flat plate member 61 and the cover member 70 of the cover member 60 are fixed, it is possible to easily assemble even such an ultraviolet measuring device with good performance.

  In the present embodiment, a two-layer structure has been described as an example, but a multi-layer structure of three or more layers may be used.

Next, an optical sensor module according to a fourth embodiment will be described with reference to the drawings.
FIG. 5 is a side sectional view showing the main configuration of the package type UV sensor module 5P of the present embodiment.

  In each of the above-described embodiments, the optical sensor module having a single casing has been described as an example. However, as illustrated in FIG. 5, the optical sensor module 5 may be mounted on another electronic device.

  As in the above-described embodiments, the optical sensor module 5 includes the UV sensor module 5 in which the UV sensor element 10, the circuit board 20, and the cover member 40 'are fixed to each other. Here, the cover member 40 ′ includes a flat plate member 41 and a support member 42 ′, and these two members are formed of a material having no elasticity.

  Such a packaged UV sensor module 5P has the function of a casing as the packaged UV sensor module 5P, and is housed in a casing 100 ′ that functions as a casing of an electronic device to which the UV sensor module 5 is mounted. Has been. At this time, the UV sensor module 5 is disposed so that the flat plate member 41 of the cover member 40 ′ covers the entire surface of the opening 101 of the housing 100 ′. The UV sensor module 5 is supported by a conductive elastic body 800 on the mounting surface of the main circuit board 800 disposed on the side facing the surface on which the UV sensor element 10 is mounted. The conductive elastic body 800 is brought into contact with the circuit electrode on the circuit board 20 and the circuit electrode of the main circuit board 800, whereby the circuit board 20 and the main circuit board 800 are electrically connected.

  By using such a configuration, even if the UV sensor module 5 is mounted in another electronic device, the parts related to the UV sensor module 5 can be easily assembled.

  At this time, since the conductive elastic body 800 is installed between the circuit board 20 of the UV sensor module 5 and the main circuit board 800, the cover member 40 ′ of the UV sensor module 5 is enclosed in the housing as in the above-described embodiment. It can be pressed against the inner wall surface of the body 100 '. Thereby, it can install in the stable state, without the installed UV sensor module 5 shifting | deviating.

  In the present embodiment, the example in which the support member does not have elasticity in the optical sensor module shown in the first embodiment is shown. However, the support member has elasticity as in the first embodiment. Alternatively, the configuration of another embodiment may be used.

  Further, in each of the above descriptions, the case where the cover member has elasticity has been described as an example, but the cover member may not have elasticity.

  In the above description, an example in which the UV sensor module and the casing are separately provided has been described. However, the UV sensor module in which the casing as illustrated in FIG. 6 is also integrally formed may be used. FIG. 6 is a side sectional view showing the main configuration of the UV sensor module 6 in which the housing is also integrally formed.

  The UV sensor module 6 further includes a casing 100 ″ that is joined to the circuit board 20 and the cover member 40 with respect to the UV sensor module 1 shown in FIG. 1 of the first embodiment. 100 ″ may be a housing for the UV sensor module 6 alone or an electronic device housing on which the UV sensor module 6 is mounted.

It is side surface sectional drawing which shows the main structures of the UV sensor module 1 which concerns on 1st Embodiment. 1 is a side sectional view showing a main configuration of a packaged UV sensor module 1P in which a UV sensor module 1 of a first embodiment is incorporated in a housing 100. FIG. It is side surface sectional drawing which shows the main structures of the package type UV sensor module 2P which concerns on 2nd Embodiment. It is side surface sectional drawing which shows the main structures of package type UV sensor module 3P, 4P shown in 3rd Embodiment. It is side surface sectional drawing which shows the main structures of the package type UV sensor module 5P of 4th Embodiment. It is side surface sectional drawing which shows the main structures of the UV sensor module 6 in which the housing | casing was also formed integrally.

Explanation of symbols

1, 2, 3, 4, 5-UV sensor module, 1P, 2P, 3P, 4P, 5P-package type UV sensor module, 10-UV sensor, 11-receiving surface, 20-circuit board, 40, 40 ', 50, 60, 70—cover member, 41—flat plate member, 42, 42 ′, 62—support member, 611—inner layer plate, 62—outer layer plate, 71—inner layer, 72—outer layer, 91, 91 ′, 92, 93 94-integral member 100, 100'-housing 101-opening

Claims (7)

An optical sensor element sensitive to light of a specific frequency;
A circuit board on which the optical sensor element is mounted;
A cover member installed on the wave receiving surface side of the photosensor element, at least a region corresponding to the wave receiving surface of the photosensor element has translucency and is fixed to the photosensor element; Optical sensor module. An internal member in which the optical sensor element, the circuit board and the cover member are integrated, and a housing having an opening on the wave receiving surface side of the optical sensor element;
The optical sensor module according to claim 1, wherein the cover member has a shape covering an opening of the housing.   The optical sensor module according to claim 1, wherein at least a part of the cover member is made of an elastic body.   The said cover member has translucency as a whole, consists of the elastic body which consists of substantially the same thickness, and is formed so that it may closely_contact | adhere to the wave-receiving surface side of the said optical sensor element. The optical sensor module according to any one of the above. A second circuit board connected to the circuit board and disposed on the side of the circuit board facing the side on which the photosensor element is mounted;
The optical sensor module according to any one of claims 1 to 4, wherein a conductive connection member having elasticity is used for connection between the circuit board and the second circuit board.   The optical sensor module according to claim 1, wherein at least a region corresponding to the wave receiving surface of the cover member is made of a material that transmits only light having a specific frequency to which the optical sensor element is sensitive.   The optical sensor module according to claim 1, wherein at least a region corresponding to the wave receiving surface of the cover member has a structure in which a plurality of layers that generate refraction between layers are integrally formed.

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