JP2010129605A - Electronic component disposal box, electronic component mounting device, and electronic component mounting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress suction and mounting defects of electronic components due to contamination of a nozzle by cleaning an end of the nozzle in a short time. <P>SOLUTION: The present invention relates to an electronic component disposal box 50 in which an electronic component, in an abnormal state, held at an end of the nozzle is discarded inside through an upper-end opening, the disposal box 50 including a cleaning means 52 of sweeping and cleaning the end of the nozzle when the nozzle enters from an upper-end opening 51. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic component disposal box, an electronic component mounting apparatus, and an electronic component mounting method.

As an electronic component mounting apparatus of this type, a nozzle having an end capable of sucking and releasing the electronic component, and an electronic component in which an abnormal electronic component held at the end of the nozzle is disposed inside through the upper end opening Disposal box, supply part for supplying electronic parts, support part for supporting the mounted part on which the electronic parts are mounted, and moving means for moving the nozzle between the supply part, the mounted part, and the electronic component disposal box A configuration including the above is known. This electronic component mounting apparatus sucks and conveys an electronic component supplied to a supply unit and mounts it on a mounted portion or discards it in an electronic component disposal box.
By the way, in such an electronic component supply apparatus, solder paste, flux, adhesive, or the like adheres to the end of the nozzle and the end is contaminated. Due to this contamination, mounting of the electronic component by the nozzle is poor (takeaway). May occur. In addition, when solder paste, flux, adhesive, or the like enters the inside of the nozzle, the suction force may be insufficient, and the suction failure of the electronic component may occur. And if the electronic component is not properly picked up or mounted by the nozzle, it is discarded in the electronic component disposal box even if the electronic component is good. There is a problem of end.
As means for solving such a problem, for example, as shown in Patent Document 1 below, an electronic component mounting apparatus is mounted on a movable head so that the nozzle can be replaced, and the nozzle is passed through an internal passage of the head. It has been proposed that negative pressure or positive pressure can be alternatively supplied, and the nozzle is cleaned by air blowing to the outer periphery of the nozzle tip (nozzle end) when replacing the nozzle. .
JP 2007-35872 A

However, the means for cleaning the nozzle by blowing air to the end of the nozzle when replacing the nozzle has the following problems.
First, since cleaning is performed when the nozzle is replaced, if the same nozzle is used for a long time without replacing the nozzle, the end of the nozzle will not be cleaned, and the electronic components will be picked up and installed by the nozzle. There is a problem that the occurrence of defects cannot be suppressed.

  Further, in order to solve this problem, a method of determining the contamination state of the end of the nozzle from the tendency of occurrence of nozzle adsorption / mounting failure and replacing the nozzle when it is determined to be a predetermined contamination state is adopted. Even in this case, there is a problem that it takes time to replace the nozzle. Furthermore, in this case, since the determination is based on the tendency of nozzle suction / mounting failure, it is determined that the nozzle is in a predetermined contamination state after the suction / mounting failure due to contamination of the nozzle end actually occurs. In the period until the replacement, the suction operation must be performed with the nozzle whose end is contaminated. For this reason, there is a problem in that the occurrence of poor suction / mounting of electronic components by the nozzles during the period cannot be suppressed.

  The present invention has been made in view of the above-mentioned circumstances, and its purpose is to clean the end of the nozzle in a short time, and to suppress poor suction / mounting of electronic components due to contamination of the nozzle. An electronic component disposal box, an electronic component mounting apparatus, and an electronic component mounting method are provided.

In order to solve the above problems, the present invention proposes the following means.
An electronic component disposal box according to the present invention is an electronic component disposal box in which an abnormal electronic component held at an end of a nozzle is disposed inside through an upper end opening, and the nozzle is disposed inside the upper end opening. A cleaning means for wiping and cleaning the end portion of the nozzle when entering is provided.

According to the electronic component disposal box, since the cleaning means for wiping and cleaning the end portion of the nozzle when the nozzle enters the inside from the upper end opening, the electronic component is disposed in the electronic component disposal box. Therefore, when the nozzle is moved into the electronic component disposal box from its upper end opening, the end of the nozzle can be wiped and cleaned by the cleaning means, and the electronic component resulting from contamination of the end of the nozzle It is possible to suppress the occurrence of suction and mounting defects.
Also, in this way, in order to discard the electronic component in the electronic component disposal box, it is possible to clean the nozzle when entering the inside of the electronic component disposal box from its upper end opening, for example, when replacing the nozzle In comparison, the end of the nozzle can be cleaned in a short time.

  In addition, every time the electronic component is discarded in the electronic component disposal box, when the cleaning means is passed through the nozzle, the end of the nozzle is removed each time the electronic component is discarded due to the suction / mounting failure caused by the nozzle. Since cleaning becomes possible, the end of the nozzle can be cleaned immediately when the end of the nozzle is contaminated to such an extent that suction and mounting defects are caused. Therefore, in this case, it is possible to suppress the suction operation from being performed with a nozzle whose end is contaminated, and it is possible to further suppress the occurrence of suction / mounting failure of electronic components.

  The cleaning means includes a plurality of brush bodies that are disposed in the upper end opening and that contact the end of the nozzle to clean the end, and the plurality of brush bodies are arranged in the horizontal direction. While extending along one direction, you may arrange | position at intervals in the other direction orthogonal to this one direction.

  In this case, since the plurality of brush bodies extend along the one direction and are spaced apart from each other in the other direction, the plurality of brush bodies adjacent to each other in the other direction are arranged. The end of the nozzle can be cleaned by allowing the nozzle to enter the electronic component disposal box while contacting the nozzle and the brush body through the gap. Therefore, for example, compared with the case where the brush bodies are irregularly arranged as the cleaning means, it is easy to pass the cleaning means through the nozzle, and the end of the nozzle can be easily cleaned.

  When the brush bodies are arranged so as to be as small as possible while maintaining the size between the brush bodies adjacent in the other direction so that the nozzle can pass through, the brush bodies are covered with the lid of the electronic component disposal box. It can be a body. Therefore, in this case, when the electronic component is dropped from the end of the nozzle after the nozzle has entered the electronic component disposal box, the brush body prevents the electronic component from jumping out of the electronic component disposal box. it can.

  In the electronic component disposal box, side opening portions that are continuous with the upper end opening portion are respectively formed on both end surfaces facing the one direction, and the brush body gradually moves from one end to the other end in the one direction. Further, it may be extended to incline toward the inside of the electronic component disposal box along the vertical direction.

  In this case, the brush body is extended so as to incline toward the inside of the electronic component disposal box along the vertical direction from one end to the other end in the one direction. Brush the nozzle by simply moving the nozzle along the one direction from the side opening formed on the end surface on one end side in the one direction to the side opening formed on the end surface on the other end side in the one direction. The end of the nozzle can be cleaned simply by passing the gap between the bodies. Therefore, compared with the case where the nozzle is moved from the inside along the vertical direction to the outside after moving from the outside of the electronic component disposal box along the vertical direction, for example, the nozzle is moved again. The movement of the nozzle can be simplified, and the end of the nozzle can be more easily cleaned.

  An electronic component mounting apparatus according to the present invention includes an electronic component disposal box according to the present invention, a nozzle having an end capable of sucking and releasing the electronic component, a supply unit for supplying the electronic component, and an electronic component. A support unit that supports a mounted part on which the nozzle is mounted, and a moving unit that moves the nozzle between the supply unit, the mounted part, and the electronic component disposal box. Is.

  According to the electronic component mounting apparatus, since the electronic component disposal box according to the present invention is provided, the end portion of the nozzle is cleaned in a short time, and electronic component adsorption / mounting failure due to nozzle contamination is suppressed. can do.

  The electronic component mounting method according to the present invention includes a nozzle having an end capable of sucking and releasing the electronic component, a supply unit for supplying the electronic component, and a support for supporting the mounted portion on which the electronic component is mounted. An electronic component disposal box in which an abnormal electronic component held at the end of the nozzle is discarded through an upper end opening, and between the supply unit, the mounted portion, and the electronic component disposal box And a moving means for moving the nozzle, and the electronic component disposal box includes a cleaning means for wiping and cleaning the end of the nozzle when the nozzle enters the inside from the upper end opening. An electronic component mounting method using an electronic component mounting apparatus, wherein the electronic component supplied by the supply unit is sucked by the nozzle, and the electronic component sucked by the nozzle is mounted on the mounted portion. Let An attachment step, and at least one of the adsorption step and the attachment step and after the attachment step, the imaging step of imaging the nozzle from the end side, and the nozzle A disposal step of moving the electronic component to the electronic component disposal box and discarding the electronic component in the electronic component disposal box, and a determination step of determining whether to perform the disposal step based on an imaging result of the imaging step. Further, the disposal step is performed by causing the nozzle to enter the inside of the electronic component disposal box.

  According to the electronic component mounting method described above, the disposal step is performed by allowing the nozzle to enter the electronic component disposal box, so that the nozzle end is cleaned each time the disposal step is performed due to a suction or mounting failure caused by the nozzle. It is possible to clean the end of the nozzle immediately when the end of the nozzle is contaminated to such an extent that suction and mounting defects are caused. Accordingly, it is possible to suppress the suction operation with the nozzle having the contaminated end portion, and it is possible to suppress the occurrence of the suction / mounting failure of the electronic component.

  In addition, when the determination process is performed both between the adsorption process and the mounting process and after the mounting process, it is difficult to absorb the electronic component by the nozzle in the adsorption process, and the electronic mounted on the mounted part in the mounting process. It is possible to determine both the take-out of the part by the nozzle. Therefore, it is possible to more reliably suppress the suction operation with the nozzle having a contaminated end as compared with the case where the determination is made at only one of the timings.

  The electronic component mounting apparatus includes a plurality of brush bodies in which the cleaning unit is disposed in the upper end opening and contacts the end of the nozzle to clean the end. The brush body is configured to extend along one direction in the horizontal direction and to be spaced apart from each other in the other direction orthogonal to the one direction, and to supply compressed air to the inside of the nozzle An internal cleaning process for cleaning the inside of the nozzle may be provided, and the internal cleaning process may be performed in the disposal process.

In this case, since the internal cleaning process is performed in the disposal process, not only the end of the nozzle but also the inside of the nozzle can be cleaned, and the occurrence of poor suction and mounting of electronic components can be further suppressed.
When the brush bodies are arranged so as to be as small as possible while maintaining the size between the brush bodies adjacent in the other direction so that the nozzle can pass through, the brush bodies are covered with the lid of the electronic component disposal box. The body can be made. Therefore, in this case, the internal cleaning process is performed in the disposal process, so that even if the electronic components in the electronic component disposal box are about to eject outward due to the compressed air supplied to the inside of the nozzle, Can be suppressed by the brush body.

  According to the electronic component disposal box, the electronic component mounting apparatus, and the electronic component mounting method according to the present invention, the end of the nozzle is cleaned in a short time, and the adsorption / mounting failure of the electronic component due to the contamination of the nozzle is suppressed. be able to.

(First embodiment)
Hereinafter, a first embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the drawings.
FIG. 1 is a schematic perspective view showing a first embodiment of an electronic component mounting apparatus according to the present invention. FIG. 2 is a longitudinal sectional view of a nozzle in the electronic component mounting apparatus shown in FIG. FIG. 3 is an enlarged perspective view of an electronic component disposal box in the electronic component mounting apparatus shown in FIG. FIG. 4 is a diagram showing a brush body provided in the electronic component disposal box shown in FIG.

  The electronic component mounting apparatus 1 includes a nozzle 3 having an end 2 capable of sucking and releasing the electronic component E, a component supply device (supply unit) 4 for supplying the electronic component E, and a production in which the electronic component E is mounted. An electronic component disposal in which an abnormal electronic component E held on the end 2 of the nozzle 3 and the substrate transport device (supporting portion) 5 that supports the substrate (attached portion) P is disposed inside through the upper end opening 51 A moving unit 6 for moving the nozzle 3 between the box 50, the component supply device 4, the production substrate P and the electronic component disposal box 50 is provided. Furthermore, in the present embodiment, a head 7 on which a plurality of nozzles 3 are detachably mounted, an image pickup means 8 for picking up images of the nozzles 3 from the end 2 side of the nozzles 3, and a nozzle on which a plurality of replacement nozzles 3 are arranged. A station 9, a control unit 10 that controls the respective components, and a base 11 on which the respective components are fixed are provided.

  The base 11 is formed in a rectangular parallelepiped shape, and its lower surface is placed and fixed on a horizontal plane (not shown). In the following, the direction along one side of the base 11 in a plan view from the upper surface of the base 11 is the X direction (one direction), the direction orthogonal to the X direction in the plan view is the Y direction (the other direction), and the X A direction perpendicular to both the direction and the Y direction is referred to as a Z direction (vertical direction).

The head 7 includes the plurality of nozzles 3 and a columnar nozzle casing 7 a in which the plurality of nozzles 3 are accommodated.
The nozzle casing 7a is held by an X table 13 which will be described later so that the central axis thereof is parallel to the Z direction. In the illustrated example, eight nozzles 3 are provided, and are arranged at equal intervals around the central axis of the nozzle casing 7a.

As shown in FIG. 2, the nozzle 3 is formed so as to extend in a predetermined direction, and a nozzle hole 3 a penetrating the nozzle 3 along the extending direction of the nozzle 3 is formed in the nozzle 3. Has been. A flat end surface 2a is formed on one end side of the nozzle 3 in the extending direction, and a positive / negative pressure supply means 12 for supplying positive pressure or negative pressure to the inside of the nozzle 3 on the other end side. Is connected. The positive pressure / negative pressure supply means 12 includes, for example, an ejector, a valve, a compressor, and the like, and its operation is controlled by the control unit 10.
According to the nozzle 3 configured as described above, the negative pressure is supplied to the inside of the nozzle 3 by the positive pressure / negative pressure supply means 12 so that the electronic component E is adsorbed on the end surface 2a on one end side, The suction can be released by supplying a positive pressure into the nozzle 3 by the pressure / negative pressure supply means 12.

In the illustrated example, the size along the orthogonal direction orthogonal to the extending direction on the end surface 2a on the one end side of the nozzle 3 is the size L1, and the end portion 2 on the one end side is the extending direction. Along the direction of the other end, the size along the orthogonal direction is reduced, and the size along the orthogonal direction on the other end side of the end portion 2 is a size L2 ( However, L2> L1). That is, the end portion 2 on one end side of the nozzle 3 is formed in a tapered shape.
As shown in FIG. 1, the nozzle 3 is held inside the nozzle casing 7a in a state where the extending direction coincides with the Z direction and the end portion 2 protrudes from the lower end of the nozzle casing 7a. .

  The moving means 6 includes an X table 13 that moves the head 7 along the X direction, a Y table 14 that moves the X table 13 along the Y direction, and a turn that turns the head 7 about its central axis. Means (not shown) and raising / lowering means (not shown) for raising and lowering the nozzles 3 in the head 7 in the Z direction. Each movement of these moving means 6 is controlled by the control unit 10.

The Y table 14 is provided along the Y direction at each end of the base 11 in the X direction. In the illustrated example, the Y table 14 is spaced apart from the upper surface of the base 11 by a fixed height from the ball screw 14a extending in the Y direction, a servo motor 14b for rotating the ball screw 14a around the central axis of the ball screw 14a. And a table base portion 14c that supports the servo motor 14b at a position.
In the illustrated example, support portions 14d are respectively extended downward at both ends of the table base portion 14c in the X direction so that a gap is formed between the table base portion 14c and the base 11. ing.
The operation of the servo motor 14b is controlled by the control unit 10.

The X table 13 extends along the X direction and has a table body 13a in which the ball screws 14a of the Y table 14 are respectively inserted at both ends, a ball screw 13b extending along the X direction, and a ball screw 13b. And a servo motor 13c supported by the table main body 13a while rotating around the central axis of the ball screw 13b.
In the illustrated example, the table main body 13a has the lower surfaces of both end portions in the X direction supported on the upper surface of the table base portion 14c of the Y table 14, respectively. Further, the head 7 is held on the ball screw 13b of the X table 13 via a mediating member 13d.
The operation of the servo motor 13c is controlled by the control unit 10.

  According to the moving means 6 configured as described above, the nozzle 3 is moved in the X direction and the Y direction above the base 11 by the X table 13, the Y table 14 and the turning means, and the nozzle 3 is moved by the lifting means. The nozzle 3 can be moved in the Z direction so as to approach or separate from the base 11.

The board | substrate conveyance apparatus 5 is provided in the upper surface of the base 11, and conveys the production board | substrate P from a front process to a back process. The production substrate P transported to a predetermined mounting position by the substrate transport device 5 is supported by the substrate transport device 5 at the mounting position. In the illustrated example, the substrate transport device 5 is formed so as to transport the production substrate P along the X direction, and both ends of the substrate transport device 5 in the X direction are connected to the table base portion 14 c of the Y table 14. It is connected to the pre-process and the post-process through the base 11.
The operation of the substrate transfer device 5 is controlled by the control unit 10.

The component supply device 4 is provided in the vicinity of the substrate transport device 5 in the Y direction on the upper surface of the base 11. In the example shown in the drawing, the component supply device 4 is composed of a plurality of tape feeders 4a arranged in the X direction. Each tape feeder 4a is detachably mounted with a reel-like tape on which electronic parts E are held at regular intervals. The tape feeder 4a feeds the tape to the tip of the tape feeder 4a for a predetermined supply. The electronic component E is supplied to the position.
The operation of the component supply device 4 is controlled by the control unit 10.

The imaging means 8 is provided in the vicinity of the component supply device 4 on the upper surface of the base 11 and images the head 7 positioned above. The imaging unit 8 includes, for example, a camera and an illumination unit that irradiates the head 7 during imaging by the camera.
In addition, the imaging unit 8 is electrically connected to the control unit 10, and sends the captured imaging data (imaging result) to the control unit 10 and its operation is controlled by the control unit 10.

The electronic component disposal box 50 is provided in the vicinity of the imaging means 8 on the upper surface of the base 11 and is fixed with the upper end opening 51 facing upward. The electronic component disposal box 50 is formed in a rectangular shape in the plan view, and one side in the plan view matches the X direction, and the other side in the plan view matches the Y direction. Are arranged to be.
As shown in FIG. 3, the electronic component disposal box 50 is provided with a cleaning means 52 that wipes and cleans the end 2 of the nozzle 3 when the nozzle 3 enters the inside from the upper end opening 51. Yes. In the present embodiment, the cleaning means 52 includes a plurality of brush bodies 53 that are disposed in the upper end opening 51 and clean the end 2 by contacting the end 2 of the nozzle 3.

As shown in FIG. 4, the brush body 53 includes a core portion 53a made of an elastic body formed in a linear shape, and hairs 53b that protrude radially from the outer surface of the core portion 53a. The core portion 53a is made of, for example, rubber, and the hair portion 53b is made of, for example, nylon.
In the present embodiment, as shown in FIG. 3, the plurality of brush bodies 53 extend along the X direction and are spaced from each other in the Y direction. Further, the brush bodies 53 are arranged so that the interval between the brush bodies 53 adjacent in the Y direction is as small as possible while maintaining the size through which the nozzle 3 can pass. In the illustrated example, the interval between the brush bodies 53 adjacent to each other in the Y direction is L3 larger than the size L1 and smaller than the size L2. Thereby, these brush bodies 53 can be used as the lid body of the electronic component disposal box 50.
In the illustrated example, both ends of the brush body 53 are fixed to upper ends of both end faces 54 of the electronic component disposal box 50 facing the X direction. Further, in the illustrated example, seven brush bodies 53 are arranged in parallel in the Y direction, but the number of brush bodies 53 is not limited to seven.

The control unit 10 controls the component supply device 4, the substrate transfer device 5, the moving unit 6, the imaging unit 8, and the positive / negative pressure supply unit 12.
Further, the control unit 10 can determine whether the posture of the electronic component E sucked by the nozzle 3 is a normal posture or an abnormal state based on the imaging data sent from the imaging means 8. In the present embodiment, when the imaging data sent from the imaging means 8 matches the image data stored in advance in the control unit 10 corresponding to the electronic component E, it is in a normal posture, and otherwise it is in an abnormal state. Judge that there is.
Note that the electronic component E is in an abnormal state is a state in which the posture of the electronic component E held by the nozzle 3 is abnormal (abnormal posture), or a state in which the electronic component E sucked by the nozzle 3 is missing or missing. , And a state in which the electronic component E is not separated from the nozzle 3 due to adhesive force such as solder attached to the nozzle 3 (defective mounting).

  Further, the control unit 10 can determine whether or not the electronic component E is held at the end 2 of the nozzle 3 based on the imaging data sent from the imaging unit 8. In the present embodiment, when the imaging data sent from the imaging means 8 matches the image data obtained by imaging the nozzle 3 stored in the control unit 10 in advance from the end 2 side, it is not retained. It is determined that it is held.

Next, an example of an electronic component mounting method using the electronic component mounting apparatus 1 configured as described above will be described.
First, an operator of this apparatus mounts a tape on the component supply apparatus 4, and the control unit 10 performs a preparation process for transporting the production substrate P to the mounting position by the substrate transport apparatus 5.

Next, an adsorption process is performed in which the electronic component E supplied by the component supply device 4 is adsorbed by the nozzle 3.
In this process, first, the control unit 10 causes the component supply device 4 to feed out the tape and supply the electronic component E to the supply position. Next, the control unit 10 controls the moving means 6 to move one of the plurality of nozzles 3 upward to the supply position and lower the nozzle 3. Then, the control unit 10 controls the positive pressure / negative pressure supply means 12 to adsorb the electronic component E to the end surface 2 a of the nozzle 3.

At this time, in this embodiment, the electronic component E is attracted to all the nozzles 3 mounted on the head 7.
That is, after the electronic component E is picked up by one nozzle 3, the control unit 10 controls the moving means 6 to raise the nozzle 3 and to turn the head 7. The adjacent nozzle 3 is moved above the supply position. On the other hand, the control unit 10 causes the component supply device 4 to feed out the tape and supply another electronic component E to the supply position. The control unit 10 lowers the nozzle 3 located above the supply position by the moving unit 6, and then adsorbs the electronic component E to the end surface 2 a of the nozzle 3 by the positive pressure / negative pressure supply unit 12. The above operation is repeated by the number of nozzles 3.

Next, in the present embodiment, a first imaging process (imaging process) for imaging the nozzle 3 from the end 2 side is performed.
In this process, first, the control unit 10 controls the moving unit 6 to move one nozzle 3 above the imaging unit 8. Next, the control unit 10 causes the imaging unit 8 to image the nozzle 3 from the end 2 side. At this time, the control unit 10 causes the control unit 10 to send out imaging data that is a result of imaging by the imaging unit 8.

At this time, in this embodiment, all nozzles 3 mounted on the head 7 are imaged from the end 2 side.
In other words, after imaging one nozzle 3 from the end 2 side, the control unit 10 controls the moving means 6 to pivot the head 7, and the nozzle 3 adjacent to the nozzle 3 around the central axis line. Is moved above the supply position. Next, the control unit 10 causes the imaging unit 8 to image the nozzle 3 from the end 2 side. The above operation is repeated by the number of nozzles 3.

Next, whether the disposal step is performed based on the imaging result of the first imaging step before the disposal step of moving the nozzle 3 to the electronic component disposal box 50 and discarding the electronic component E in the electronic component disposal box 50 A first determination step (determination step) is performed to determine whether or not.
In this process, first, the control unit 10 determines whether the posture of the electronic component E sucked by the nozzle 3 is a normal posture or an abnormal state based on the imaging data sent from the imaging means 8. Here, in this embodiment, the posture of the electronic component E is determined for all the nozzles 3 before moving to the next step. If it is determined that the posture of the electronic component E held for any one of the nozzles 3 is abnormal, a discarding process is performed for the nozzle 3.
Below, the case where there exists the nozzle 3 determined to hold | maintain the electronic component E in an abnormal state is demonstrated. If all the electronic components E sucked by the nozzles 3 in the head 7 are in the normal posture, the mounting step described later is performed without performing the discarding step.

  FIG. 5 is a process diagram for explaining an electronic component mounting method using the electronic component mounting apparatus shown in FIG. 1, and is a sectional view of each of the nozzle and the electronic component disposal box before the disposal step. FIG. 6 is a process diagram illustrating a state in which the nozzle has entered the electronic component disposal box after the state illustrated in FIG. 5. FIG. 7 is a diagram illustrating a state in which the nozzle is turned back to the outside of the electronic component disposal box after the state illustrated in FIG. 6.

Next, a disposal step is performed in which the nozzle 3 is moved to the electronic component disposal box 50 and the electronic component E is disposed in the electronic component disposal box 50. In this embodiment, the disposal step is performed by causing the nozzle 3 to enter the electronic component disposal box 50. Further, in the present embodiment, in the discarding process, an internal cleaning process is performed in which compressed air is supplied to the inside of the nozzle 3 to clean the inside of the nozzle 3.
In this process, as shown in FIG. 5, first, the control unit 10 controls the moving means 6 so that the nozzle 3 in which the posture of the electronic component E to be held is determined to be in an abnormal state in the first determination step is changed to electronic. It is moved above the component disposal box 50. Next, as shown in FIG. 6, the control unit 10 controls the moving unit 6 to move the nozzle 3 downward, so that the nozzle 3 enters the inside from the upper end opening 51 of the electronic component disposal box 50. Let

At this time, the core 53a of the brush body 53 is formed of an elastic body, and the end 2 of the nozzle 3 is tapered, so that the nozzle 3 moves to the end 2 while moving downward. The core 53a of the brush body 53 that contacts the outer surface moves so as to be pushed toward the Y direction. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 and cleaned.
That is, at this time, the nozzle 3 enters the inside of the electronic component disposal box 50 while bringing the nozzle 3 and the brush body 53 into contact with each other through the gaps between the plurality of brush bodies 53 adjacent in the Y direction. 3 end 2 can be cleaned. Therefore, for example, compared with the case where the brush body 53 is irregularly arranged as a cleaning means, it becomes easier to pass the cleaning means 52 through the nozzle 3, and the end portion 2 of the nozzle 3 can be easily cleaned. .

Next, the control unit 10 controls the positive pressure / negative pressure supply means 12 to supply compressed air (positive pressure) to the inside of the nozzle 3, and the abnormal state electrons held at the end 2 of the nozzle 3. The electronic component E is discarded in the electronic component disposal box 50 by dropping the component E. Thereby, it becomes possible to perform an internal cleaning process, discarding the electronic component E. FIG.
Further, by performing the internal cleaning process in the disposal process, not only the end 2 of the nozzle 3 but also the inside of the nozzle 3 can be cleaned, and the occurrence of poor adsorption and mounting of the electronic component E is further suppressed. be able to. In addition, since the brush body 53 is arranged to be a lid of the electronic component disposal box 50, the electronic component E in the electronic component disposal box 50 is directed outward by the compressed air supplied into the nozzle 3. Even when it is about to fly out, this popping out can be suppressed by the brush body 53.

Next, as shown in FIG. 7, the control unit 10 controls the moving means 6 to move the nozzle 3 from the inside of the electronic component disposal box 50 to the outside. At this time, the core portion 53a of the brush body 53 that has been pushed in the Y direction by the nozzle 3 moves so as to return to the position before being pushed by the elastic force. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 again and cleaned. At this time, since the electronic component E is not held at the end 2 of the nozzle 3, the end 2 of the nozzle 3 can be more reliably cleaned.
And the control part 10 repeats the discard process shown above regarding all the nozzles 3 determined that the electronic component E is hold | maintained in the abnormal state in the 1st determination process.

Next, a mounting process for mounting the electronic component E sucked by the nozzle 3 on the production substrate P is performed.
In this process, the control unit 10 moves the nozzle 3 in which the posture of the electronic component E to be held is determined to be the normal posture in the first determination step onto the production substrate P transported to the mounting position. An electronic component E is mounted on P.

  In this embodiment, the position of the nozzle 3 on the production substrate P is adjusted by the moving unit 6 with respect to all the nozzles 3 in which the posture of the electronic component E to be held is determined to be the normal posture in the first determination step. The mounting process shown above is repeated. At this time, when the electronic component E required for the production substrate P has been mounted, the control unit 10 causes the substrate conveyance device 5 to convey the production substrate P to the next process, and other processes from the previous process. The production substrate P is transported to the predetermined position and supported.

Next, in the present embodiment, the second imaging step (imaging step) and the second determination step (determination step) are performed in order to check whether the electronic component E mounted on the production board P is brought home by the nozzle 3 in the mounting step. . Here, regarding the second imaging step and the second determination step, the description of the same parts as the first imaging step and the first determination step described above will be omitted, and only different points will be described.
In the second imaging step, the control unit 10 causes the imaging unit 8 to image from the end 2 side only for the nozzle 3 in which the posture of the electronic component E to be held is determined to be the normal posture in the first determination step.

In the second determination step, the control unit 10 determines whether or not the electronic component E is held at the end portion 2 of the nozzle 3 based on the imaging data imaged in the second imaging step, and is not held. If it is determined that the electronic component E has not been taken home, it is determined that the electronic component E has been taken home if it has been held.
Then, in the second determination step, the discarding step described above is performed for all the nozzles 3 that are determined to be brought home.

According to the electronic component mounting apparatus 1 configured as described above, the end 2 of the nozzle 3 is wiped and cleaned in the electronic component disposal box 50 when the nozzle 3 enters the inside from the upper end opening 51. Since the cleaning means 52 is provided, the end of the nozzle 3 when the nozzle 3 is inserted into the electronic component disposal box 50 from the upper end opening 51 in order to discard the electronic component E in the electronic component disposal box 50. It is possible to clean the portion 2 by wiping with the cleaning means 52, and it is possible to suppress the occurrence of suction / mounting failure of the electronic component E due to contamination of the end portion 2 of the nozzle 3.
Further, in this way, the nozzle 3 can be cleaned when the nozzle 3 enters the electronic component disposal box 50 from the upper end opening 51 in order to discard the electronic component E in the electronic component disposal box 50. The end 2 of the nozzle 3 can be cleaned in a shorter time than when the nozzle 3 is replaced.

  In addition, since the disposal process is performed by causing the nozzle 3 to enter the electronic component disposal box 50, the end 2 of the nozzle 3 is cleaned each time the disposal process is performed due to a suction or mounting failure caused by the nozzle 3. The end 2 of the nozzle 3 can be cleaned immediately when the end 2 of the nozzle 3 is contaminated to such an extent that suction and mounting defects are caused. Accordingly, it is possible to suppress the suction operation with the nozzle 3 having the contaminated end portion 2, and it is possible to suppress the occurrence of suction / mounting failure of the electronic component E.

  In addition, since the first determination process and the second determination process are performed both between the suction process and the mounting process and after the mounting process, the suction failure of the electronic component E by the nozzle 3 in the suction process, and the mounting It is possible to determine both the take-back of the electronic component E mounted on the production substrate P in the process by the nozzle 3. Therefore, it is possible to more reliably suppress the suction operation with the nozzle 3 having the contaminated end portion 2 as compared with the case where the determination is performed at only one of the timings.

(Second Embodiment)
Next, a second embodiment of the electronic component mounting apparatus according to the present invention will be described.
In the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals, description thereof is omitted, and only different points will be described.
FIG. 8 is a schematic perspective view of an electronic component disposal box in the second embodiment of the electronic component mounting apparatus according to the present invention.

In the electronic component mounting apparatus 30 of the present embodiment, as shown in FIG. 8, side opening portions 61 that are continuous with the upper end opening portion 51 are respectively formed on both end surfaces 54 facing the X direction in the electronic component disposal box 60. ing. In the illustrated example, the side opening 61 is formed over the entire upper portion of the both end faces 54.
The brush body 53 provided in the cleaning means 62 is extended so as to incline toward the inside of the electronic component disposal box 60 along the Z direction gradually from one end to the other end in the X direction. ing. Further, in the illustrated example, a plurality of brush bodies 53 are arranged along the Z direction, and adjacent ones along the Z direction are arranged at least at the other end in the X direction. ing. In FIG. 8, a portion of the cleaning means 62 is not shown for easy viewing of the drawing. In FIG. 8, the number of the brush bodies 53 arranged along the Z direction is four, but the number is not limited to four.

  In the illustrated example, a plurality of support brush bodies 63 that support the brush bodies 53 extend in the Z direction and are spaced from each other in the Y direction in each side opening 61. Has been placed. In the illustrated example, the supporting brush body 63 includes a core portion and a hair portion, similarly to the brush body 53, and each of the core portion and the hair portion is formed of the same material as the brush body 53. Further, the supporting brush body 63 disposed in the one side opening 61 and the supporting brush body 63 disposed in the other side opening 61 correspond to each other. They are arranged to face each other in the X direction. In the illustrated example, the upper end of the support brush body 63 is at the same position as the upper end of the electronic component disposal box 60 in the Z direction. The brush body 53 has one end fixed to the supporting brush body 63 disposed in the side opening 61 on one side and the other end in the side opening 61 on the other side. Is fixed to another supporting brush body 63 arranged opposite to the supporting brush body 63 to which is fixed.

  One end of each of the plurality of brush bodies 53 arranged in the Z direction is fixed to the upper end of a supporting brush body 63 arranged in the side opening 61 on one side. Also, the other end of each of the brush bodies 53 arranged in the Z direction has a support brush arranged in the side opening 61 on the other side so that the adjacent ones in the Z direction are equally spaced from each other. It is fixed to the body 63.

  In the illustrated example, among the brush bodies 53 arranged in the Z direction, the uppermost one of the brush bodies 53 located on the upper side is the supporting brush body 63 arranged in the side opening 61 on the other side. It is fixed at the top of the. Of the plurality of brush bodies 53 arranged in the Z direction, the lower end of the lowermost one is the lower end of the supporting brush body 63 arranged in the side opening 61 on the other side. It is fixed to.

Next, an example of an electronic component mounting method using the electronic component mounting apparatus 30 configured as described above will be described. FIG. 9 is a process diagram for explaining an electronic component mounting method using the electronic component disposal box shown in FIG.
The electronic component mounting method in the present embodiment is different from the electronic component mounting method in the first embodiment in the disposal process. In the following, as a result of performing the first determination step or the second determination step, the posture of the electronic component E held at the end 2 of the predetermined nozzle 3 is abnormal, or the nozzle 3 brings back the electronic component E. An example of a method for carrying out the discarding process of the electronic component E held by the nozzle 3 when it is determined will be described.

  First, as illustrated in FIG. 9, the control unit 10 controls the moving unit 6 to move the nozzle 3 to one end side in the X direction with respect to the electronic component disposal box 60, and the lower end of the nozzle 3 is It is lowered so as to be located above the lower end of the side opening 61 and below the upper end of the side opening 61 in the Z direction. Next, the control unit 10 controls the moving means 6 to move the nozzle 3 along the X direction, and passes the nozzle 3 through the side opening 61 and the upper end opening 51 on one side to the electronic component disposal box 60. Enter inside. Thereafter, the control unit 10 controls the positive pressure / negative pressure supply means 12 to supply compressed air to the inside of the nozzle 3, thereby dropping the electronic component E held at the end 2 of the nozzle 3, thereby The electronic component E is discarded in the component disposal box 60.

  Next, the control unit 10 controls the moving unit 6 to move the nozzle 3 along the X direction. Here, the nozzle 3 is lowered so that the lower end of the nozzle 3 is located above the lower end of the side opening 61 and below the upper end of the side opening 61 in the Z direction, and the Z Of the plurality of brush bodies 53 arranged in the direction, the other end of the lowermost one is fixed to the lower end of the supporting brush body 63 arranged in the side opening 61 on the other side. Therefore, in the process of moving the nozzle 3 along the X direction, the end 2 of the nozzle 3 is located at the lowest position among at least a plurality of brush bodies 53 arranged in the Z direction. To touch. Thereby, the edge part 2 of the nozzle 3 is wiped by the brush body 53 and cleaned.

According to the electronic component mounting apparatus 30 configured as described above, the same operational effects as those of the electronic component mounting apparatus 1 of the first embodiment can be achieved.
Further, the brush body 53 is extended in the electronic component disposal box 60 so as to incline toward the inside of the electronic component disposal box 60 along the vertical direction from one end to the other end in the X direction. Since the nozzle 3 is simply moved along the X direction from the side opening 61 on one side to the side opening 61 on the other side, the gap between the brush bodies 53 is passed through. The end 2 of the nozzle 3 can be cleaned. Therefore, compared with the case where the nozzle 3 is moved from the inside along the Z direction to the outside after moving the nozzle 3 from the outside of the electronic component disposal box 60 along the Z direction, for example. The movement of the nozzle 3 can be simplified, and the end 2 of the nozzle 3 can be more easily cleaned.

Further, since the brush bodies 53 that are adjacent to each other along the Z direction are arranged at least at the other end in the X direction, the brush body 53 is disposed from the side opening 61 on one side to the other side. The plurality of brush bodies 53 can be brought into contact with the end portion 2 of the nozzle 3 on the other end side in the X direction of the brush body 53 by moving the nozzle 3 along the X direction to the side opening 61. Therefore, the end 2 of the nozzle 3 can be more reliably cleaned.
In the present embodiment, the plurality of brush bodies 53 are arranged along the Z direction. However, the present invention is not limited to this, and a plurality of brush bodies 53 may not be arranged in the Z direction.

The technical scope of the present invention is not limited to the above embodiment, and various modifications can be made without departing from the spirit of the present invention.
For example, in each of the above embodiments, the first determination process and the second determination process are performed. However, the present invention is not limited to this, and the determination process is performed between the adsorption process and the mounting process and after the mounting process. It is sufficient to carry out at at least one of the timings.

  In each of the above embodiments, the nozzle 3 is moved relative to the electronic component disposal boxes 50 and 60 when the nozzle 3 enters the electronic component disposal boxes 50 and 60. However, the present invention is not limited to this. For example, the electronic component disposal boxes 50 and 60 may be moved with respect to the nozzle 3. That is, the electronic component disposal boxes 50 and 60 and the nozzle 3 may be relatively moved so that the nozzle 3 enters the inside of the electronic component disposal boxes 50 and 60.

Further, in each of the above embodiments, the brush body 53 extends along the X direction and is spaced apart from each other in the Y direction. The brush body 53 may be arranged irregularly.
The electronic component mounting apparatuses 1 and 30 are not limited to those shown in the above embodiments, and include electronic component disposal boxes 50 and 60, a nozzle 3, a component supply device 4, a substrate transfer device 5, and a moving means 6. I just need it.

  In addition, it is possible to appropriately replace the constituent elements in the embodiment with known constituent elements without departing from the spirit of the present invention, and the above-described modified examples may be appropriately combined.

1 is a schematic perspective view showing a first embodiment of an electronic component mounting apparatus according to the present invention. It is a longitudinal cross-sectional view of the nozzle in the electronic component mounting apparatus shown in FIG. It is an expansion perspective view of the electronic component disposal box in the electronic component mounting apparatus shown in FIG. It is a figure which shows the brush body with which the electronic component disposal box shown in FIG. 3 is equipped. FIG. 2 is a process diagram for explaining an electronic component mounting method using the electronic component mounting apparatus shown in FIG. 1, and is a cross-sectional view of each of a nozzle and an electronic component disposal box before a disposal step. FIG. 6 is a process diagram illustrating a state in which the nozzle has entered the electronic component disposal box after the state illustrated in FIG. 5. It is a figure which shows the state which the nozzle turned back to the exterior of the electronic component disposal box after the state shown in FIG. The typical perspective view of the electronic component disposal box in 2nd Embodiment of the electronic component conveying apparatus which concerns on this invention is shown. It is one process figure for demonstrating the electronic component mounting method using the electronic component disposal box shown in FIG.

Explanation of symbols

E Electronic Component P Production Board 1, 30 Electronic Component Mounting Device 2 Nozzle End 3 Nozzle 4 Component Supply Device (Supply Unit)
5 Substrate transfer device (attached part)
6 Moving means 50, 60 Electronic component disposal box 51 Upper end opening 52, 62 electronic component disposal box 52, 62 Cleaning means 53 Brush body 54 Both end surfaces facing the X direction in the electronic component disposal box (both ends facing one direction in the electronic component disposal box) surface)
61 Side opening

Claims (6)

An electronic component disposal box in which an abnormal electronic component held at the end of the nozzle is disposed inside through the upper end opening,
An electronic component disposal box, comprising: cleaning means for wiping and cleaning an end portion of the nozzle when the nozzle enters the inside from the upper end opening. The electronic component disposal box according to claim 1,
The cleaning means includes a plurality of brush bodies disposed in the upper end opening and cleaning the end by contacting the end of the nozzle,
The plurality of brush bodies are extended along one direction in the horizontal direction, and are disposed at intervals from each other in the other direction orthogonal to the one direction. The electronic component disposal box according to claim 2,
Side opening portions that are continuous with the upper end opening portion are respectively formed on both end surfaces facing the one direction in the electronic component disposal box,
The brush body is extended so as to incline toward the inside of the electronic component disposal box along the vertical direction gradually from one end to the other end in the one direction. . Electronic component disposal box according to any one of claims 1 to 3,
A nozzle having an end capable of sucking and releasing the electronic component;
A supply unit for supplying electronic components;
A support portion for supporting a mounted portion on which an electronic component is mounted;
Moving means for moving the nozzle between the supply part, the mounted part, and the electronic component disposal box;
An electronic component mounting apparatus comprising: A nozzle having an end capable of sucking and releasing the electronic component;
A supply unit for supplying electronic components;
A support portion for supporting a mounted portion on which an electronic component is mounted;
An electronic component disposal box in which the electronic component in an abnormal state held at the end of the nozzle is disposed inside through the upper end opening,
Moving means for moving the nozzle between the supply part, the mounted part, and the electronic component disposal box;
An electronic component mounting method using an electronic component mounting apparatus, wherein the electronic component disposal box includes a cleaning unit that wipes and cleans an end of the nozzle when the nozzle enters the inside from the upper end opening. Because
An adsorption step of adsorbing the electronic component supplied by the supply unit with the nozzle;
A mounting step of mounting the electronic component sucked by the nozzle on the mounted portion,
Between at least one of the adsorption process and the mounting process and after the mounting process,
An imaging step of imaging the nozzle from the end side;
A disposal step of moving the nozzle to the electronic component disposal box and discarding the electronic component in the electronic component disposal box;
A determination step of determining whether to perform the discarding step based on the imaging result of the imaging step,
The electronic component mounting method, wherein the discarding step is performed by causing the nozzle to enter the electronic component disposal box. The electronic component mounting method according to claim 5,
The electronic component mounting apparatus is
The cleaning means includes a plurality of brush bodies that are disposed in the upper end opening and that contact the end portion of the nozzle to clean the end portion, and the plurality of brush bodies are arranged in the horizontal direction. Extending along the direction, and arranged to be spaced from each other in the other direction orthogonal to the one direction,
An internal cleaning step of cleaning the inside of the nozzle by supplying compressed air to the inside of the nozzle;
The electronic component mounting method, wherein the internal cleaning step is performed in the disposal step.

Images