JP2010113207A - Photoelectric conversion module - Google Patents

Abstract

A connector-integrated photoelectric conversion module capable of effectively dissipating heat generated in an optical element or an IC is provided.
A substrate 9a, a flexible substrate 12 mounted on the substrate 9a via an FPC connector 19, and an optical path changing unit 10 formed on one surface of the flexible substrate 12 and optically coupled to an optical fiber 2. The optical element 11 formed on the other surface of the flexible substrate 12 and optically coupled to the core of the optical fiber 2 via the optical path changing means 10 and the receptacle 6 of the external electric device 5 provided at one end of the substrate 9a And an electrical connector 7 that is electrically connected to the optical element 11 and the electric wire 3, and a case 23 that covers the substrate 9 a, the flexible substrate 12, and the electrical connector 7, and is provided between the substrate 9 a and the case 23. A radiator plate 25 is provided.
[Selection] Figure 1

Description

  The present invention relates to a photoelectric conversion module for connecting an optical / electrical composite wire incorporating an optical fiber and an electric wire to an external electrical device.

  In order to cope with an increase in the amount of information associated with the rapid spread of the Internet and multimedia, development of an optical interconnection technology using an optical signal for signal transmission between devices of a processing apparatus is in progress.

  As a conventional photoelectric conversion module, for example, there are modules in which optical elements are arranged in a horizontal row at the connector end, optical fibers are connected to these optical elements, and electrical signals from each optical element are output. (For example, refer to Patent Document 1).

  By the way, even when optical interconnection is used, not only signals are transmitted by light, but also electrical connections such as low-speed signals, power supply, and grounding remain, and an optoelectric composite that combines electrical wiring and optical fiber. Lines are used.

  When connecting such a photoelectric composite wire to an external electrical device, a glass epoxy substrate 32 having an electrical wiring formed on its surface is prepared as shown in FIG. The optical fiber 34 of the photoelectric composite wire 38 is disposed so as to face the mounted optical element 33, and the electric wire 35 of the photoelectric composite wire 38 is electrically connected to the input terminal Pi of the electrical wiring. A connector 37 is electrically connected to the output terminal Po of the glass epoxy substrate 32 via a cable 36.

  An optical signal from the optical fiber 34 is converted into an electrical signal by the optical element 33 or the optical element 33 and an optical element control IC (not shown), and is passed to the connector 37 through the cable 36 connected to the output terminal Po. Is output. Similarly, the electric signal from the electric wire 35 input to the input terminal Pi is output to the connector 37 through the cable 36 electrically connected to the output terminal Po.

  In the photoelectric conversion module 31, the connector 37 is connected to an external electric device, whereby the photoelectric composite wire 38 is connected to the external electric device. In FIG. 3, the case where there is one optical fiber 34 and one electric wire 35 has been described for simplification of the drawing, but the same applies to the case where there are a plurality of optical fibers 34 and electric wires 35.

JP 2003-149512 A JP 2006-245025 A

  By the way, in the photoelectric conversion module 31, in order to integrate the glass epoxy substrate 32 and the connector 37 and to protect the optical fiber 34 and the optical element 33, the rear end portion of the connector 37 to the front end portion of the photoelectric composite line 38 is used. A protective cover is provided by molding resin so as to cover.

  However, if the photoelectric conversion module 31 is covered with a protective cover made of resin, there is a problem that it is difficult to effectively dissipate heat generated by the optical element 33, the optical element control IC, or the like.

  SUMMARY OF THE INVENTION An object of the present invention is to provide a connector-integrated photoelectric conversion module that can effectively dissipate heat generated in an optical element, an IC, or the like.

  The present invention was devised to achieve the above object, and is an opto-electric conversion module for connecting an opto-electric composite wire incorporating an optical fiber and an electric wire to a receptacle of an external electric device, comprising: a substrate; A flexible board mounted on the board via an FPC connector; a support plate for supporting an end of the flexible board opposite to the FPC connector; and on one surface of the flexible board. An optical path changing means formed and optically coupled to the core of the optical fiber; an optical element provided on the other surface of the flexible substrate and optically coupled to the core of the optical fiber via the optical path changing means; and the substrate And is inserted into and connected to the receptacle of the external electric device and is electrically connected to the external electric device, and the optical element and the electric wire are electrically connected to the electric device. Electrical connector, and a case for covering the substrate, the flexible substrate, and the electrical connector so that an insertion connection portion of the electrical connector on the external electrical device side is exposed, and the optical element is mounted It is a photoelectric conversion module in which a heat radiating plate is arranged between the substrate supporting the flexible substrate and the case.

  The electric wire may be electrically connected to the electrical connector via a second substrate different from the substrate, and a metal plate may be disposed on the surface of the second substrate on the flexible substrate side.

  Spacers made of metal may be provided between the substrate and the flexible substrate, and between the second substrate and the case.

  The electrical connector includes a pair of upper and lower metal terminals electrically connected to the connection terminal of the receptacle, one metal terminal is electrically connected to the optical element through the substrate, and the other metal terminal is The electric wire may be electrically connected through the second substrate.

  The heat sink may be in contact with the case.

  The case may be made of metal.

  According to the present invention, by disposing the heat dissipation member between the case made of metal and the substrate, the heat generated in the optical element and the electronic component can be efficiently radiated from the substrate to the case. It is possible to prevent deterioration of characteristics due to heat generation of elements and electronic components.

  Preferred embodiments of the present invention will be described below with reference to the accompanying drawings.

  FIG. 1 is a longitudinal sectional view of the photoelectric conversion module according to the present embodiment.

  As shown in FIG. 1, the photoelectric conversion module 1 is for connecting an optical / electrical composite wire 4 including an optical fiber 2 and an electric wire 3 to an external electrical device 5.

  The photoelectric conversion module 1 converts an electrical signal from the external electrical device 5 into an optical signal and outputs the optical signal to the optical fiber 2 of the photoelectric composite line 4 or converts the optical signal from the optical fiber 2 into an electrical signal. This is converted and output to the external electric device 5.

  The photoelectric conversion module 1 includes a first substrate (substrate) 9a, a flexible printed circuit board (flexible substrate) 12 mounted on the first substrate 9a via an FPC (flexible printed circuit board) connector 19, and a flexible printed circuit. A support plate 20a for supporting the end of the substrate 12 opposite to the FPC connector 19 and an optical path provided on one surface (lower side in the drawing) of the flexible printed circuit board 12 and optically coupled to the core of the optical fiber 2 An optical waveguide 10 as a conversion means, an optical element 11 formed on the other surface (upper side in the drawing) of the flexible printed circuit board 12 and optically coupled to the core of the optical fiber 2 via the optical waveguide 10, and the optical element 11 are controlled. The control IC 18 to be connected to the receptacle 6 of the external electric device 5 provided at one end (the left side in the figure) of the first substrate 9a. The electrical connector 7 that is electrically connected to the device 5 and that is electrically connected to the optical element 11 and the electric wire 3, and the insertion connection portion of the electrical connector 7 on the external electrical device 5 side are exposed. A case 23 made of metal that covers the substrate 9 a, the flexible printed circuit board 12, and the electrical connector 7, and a heat radiating plate 25 disposed between the first substrate 9 a and the case 23 are mainly provided.

  Further, the photoelectric conversion module 1 includes a second substrate 9b different from the first substrate 9a, and the electric wire 3 of the photoelectric composite wire 4 is electrically connected to the electrical connector 7 via the second substrate 9b. Connected.

  The first substrate 9a and the second substrate 9b are rigid substrates made of, for example, glass epoxy, and electrical wirings 13 are formed on the front and back surfaces thereof.

  The electrical connector 7 includes a connector cover 15 inserted into the receptacle 6 and a pair of upper and lower metal terminals 8 projecting from the rear end surface (right side in the drawing) of the connector cover 15. A concave portion (insertion connecting portion) 17 for inserting and connecting the convex portion 16 provided on the receptacle 6 is formed on the distal end surface of the electrical connector 7. The metal terminal 8 is extended into the recess 17 so that the tip thereof substantially coincides with the tip of the connector cover 15.

  One end of the first board 9a is connected to one metal terminal 8 (upper side in the figure) of the electrical connector 7, and one end of the second board 9b is connected to the other metal terminal 8 (lower side in the figure). The terminals 8 and the electric wirings 13 of the substrates 9a and 9b are electrically connected with solder or the like.

  In the present embodiment, the optical fiber 2 of the photoelectric composite wire 4 is connected to the back side (the lower side in the drawing) of the first substrate 9a, and the heat sink 25 is arranged on the front side (the upper side in the drawing) of the first substrate 9a. Set up. The optical fiber 2 is optically connected to the optical waveguide 10 formed on the back surface (the lower side in the drawing) of the flexible printed circuit board 12, and the flexible printed circuit board 12 is connected to the back surface of the first substrate 9 a via the FPC connector 19. To be implemented.

  The flexible printed circuit board 12 will be described in detail with reference to FIG.

  As shown in FIG. 2, an optical waveguide 10 is formed on the back surface (lower side in the drawing) of the flexible printed circuit board 12, and an optical element 11 and a control unit for controlling the optical element 11 are formed on the front surface (upper side in the drawing). IC 18 is mounted. The flexible printed circuit board 12 is made of polyimide, which is a material that is transparent (low loss) to optical signals, for example.

  The optical element 11 includes a light receiving element such as a PD (photodiode) or a light emitting element such as an LD (laser diode). The optical element 11 and the control IC 18 are electrically connected to electrical wirings 12a formed on the surface of the flexible printed circuit board 12, respectively.

  The optical waveguide 10 includes a core 28 and a clad 29, and an optical fiber 2 is mounted at an end of the optical waveguide 10 and a mounting groove for coupling the core of the optical fiber 2 and the core 28 of the optical waveguide 10 (see FIG. (Not shown) is provided on the flexible printed circuit board 12.

  A mirror 30 for optically connecting the optical waveguide 10 and the optical element 11 mounted on the flexible printed circuit board 12 is formed on the core 28 of the optical waveguide 10.

  The mirror 30 is provided to be inclined at 45 degrees with respect to the optical axis of the light propagating through the core 28, and reflects the light propagating through the core 28 from the optical fiber 2 side to the optical element 11 side. Alternatively, the light emitted from the optical element 11 is reflected by the inclined surface of the mirror 30 and enters the core 28 on the optical fiber 2 side.

  The flexible printed circuit board 12 is mounted on the first substrate 9 a via the FPC connector 19 with the surface on which the optical element 11 and the control IC 18 are mounted as the first substrate 9 a side.

  In the present embodiment, an example is shown in which the flexible printed circuit board 12 and the optical waveguide 10 are configured as separate components. However, the optical waveguide 10 can be integrally formed in the flexible printed circuit board 12.

  The other end of the flexible printed circuit board 12 is supported by a support plate 20a provided on the back surface of the first substrate 9a. The support plate 20a supports the flexible printed circuit board 12 and the optical waveguide 10 formed on the surface thereof. The flexible printed circuit board 12 is supported by the FPC connector 19 and the support plate 20a so that the optical element 11 and the first substrate 9a are separated (a space is formed). A glass cover 21 is provided below the connecting portion between the optical waveguide 10 and the optical fiber 2. In addition, a supporting plate 20b for supporting the optical fiber 2 is provided on the first substrate 2a behind the connecting portion.

  On the back surface (the lower side in the drawing) of the second substrate 9b, a voltage conversion IC 22 for converting a voltage supplied from the external electric device 5 side into a voltage at which the optical element 11 operates is provided. A metal plate 26 for shielding noise generated in the voltage conversion IC 22 is disposed on the surface of the 9b flexible printed circuit board 12 (upper side in the drawing).

  The electric wire 3 of the photoelectric composite wire 4 is connected to an electric wiring 13 formed on the back surface of the second substrate 9b, and is electrically connected to the metal terminal 8 through a through hole (not shown) formed in the second substrate 9b. Connected to. Between the metal plate 26 and the support plate 20b, a support plate 20c for supporting the rear end portions of the substrates 9a and 9b is provided.

  Although not shown, a cable for electrically connecting the first substrate 9a and the second substrate 9b may be provided as appropriate.

  In the photoelectric conversion module 1, in order to protect the optical fiber 2, the optical element 11, the control IC 18, and the voltage conversion IC 22, from the rear end portion of the electrical connector 7 to the front end portion of the photoelectric composite wiring 4, both substrates 9a, A case 23 made of metal is provided so as to cover 9b. As the case 23, for example, a material having high thermal conductivity such as a copper alloy may be used. The case 23 can be made compact by forming it so that the width of the case 23 is substantially the same as the width of the substrates 9a and 9b.

  The case 23 may be formed so as to cover, for example, from the rear end portion of the electrical connector 7 to the middle of both the boards 9a and 9b. The case 23 covers at least an electronic component (heating member) such as an IC, If the electronic component and the case 23 are formed so as to be thermally connected, a heat dissipation effect can be obtained.

  A heat sink 25 made of metal, silicon, carbon material, or the like is provided between the case 23 and the first substrate 9a. The heat radiating plate 25 is provided over substantially the entire surface of the first substrate 9 a and is disposed so as to contact the case 23.

  In addition, a first spacer 24 a is interposed between the back surface of the first substrate 9 a and the flexible printed circuit board 12, and a second spacer 24 b is interposed between the second substrate 9 b and the case 23. Is done. These spacers 24a and 24b are preferably made of a material having high thermal conductivity, and can be fixed to the electric wiring 13 formed on the first substrate 9a and the second substrate 9b with solder, so that they are made of metal. It is desirable to use

  When connecting the first spacer 24a to the flexible printed circuit board 12 or when connecting the second spacer 24b to the case 23, a heat conductive sheet made of heat conductive silicone rubber or the like, or an epoxy-based heat conductive adhesive It is desirable to connect via a heat conductive adhesive made of an agent. Similarly, when connecting the heat sink 25 to the case 23, it is desirable to connect via a heat conductive sheet or a heat conductive adhesive.

  The receptacle 6 provided in the external electrical device 5 includes an electrical connector insertion hole 27 that accommodates the distal end portion of the connector cover 15 and a convex portion 16 that fits into the concave portion 17 of the electrical connector 7. On the upper and lower surfaces of the convex portion 16, there are provided connection terminals 16a that come into contact with and electrically connect to the metal terminals 8 when fitted into the concave portion 17, respectively.

  The operation of this embodiment will be described.

  In the photoelectric conversion module 1, the first substrate 9a is connected to the metal terminal 8 of the electrical connector 7, and the case 23 is provided so as to cover the electrical connector 7 and the first substrate 9a. The case 23 and the first substrate A heat radiating plate 25 is disposed between 9a and 9a.

  A heat radiating plate 25 is disposed between the case 23 and the first substrate 9a, and the spacers 24, 25 are formed of a metal material, so that heat generated from the electronic components such as the optical element 11 and the control IC 18 is generated. The heat can be transferred to the first substrate 9a through the spacer 24, and can be radiated to the metal case 23 through the heat radiating plate 25 disposed on the surface of the first substrate 9a. Heat generated from electronic components such as the control IC 18 can be efficiently wasted (dissipated).

  In the photoelectric conversion module 1, the optical fiber 2 is mounted on the flexible printed circuit board 12 having a mounting groove. Furthermore, the flexible printed circuit board 12 to which the optical fiber 2 is connected is mounted on the first substrate 9a via the FPC connector 19, and the optical fiber 2 can be easily mounted on the first substrate 9a. it can.

  The optical waveguide 10 is positioned and provided on the flexible printed circuit board 12 so that the optical axes of the optical fiber 2 mounted in the mounting groove and the optical waveguide 10 coincide with each other. Therefore, the optical axes of the optical fiber 2 and the optical element 11 can be easily matched.

  In this embodiment, the electric wire 3 is connected to a second substrate 9b different from the first substrate 9a, and the metal plate 26 is arranged on the surface side (flexible printed circuit board 12 side) of the second substrate 9b. Has been established. Thereby, it is possible to prevent the noise generated from the voltage conversion IC 22 from affecting the control IC 18 that drives the optical element 11.

  As described above, the optical fiber 2 is mounted on the first substrate 9a, the electric wire 3 is mounted on the second substrate 9b, and the metal plate 26 is mounted on the surface side (flexible printed circuit board 12 side) of the second substrate 9b. By disposing, the photoelectric conversion module 1 with little signal deterioration can be realized.

  Moreover, in the photoelectric conversion module 1, since the flexible printed circuit board 12 is supported by the first spacer 24, the flexible printed circuit board 12 can be stably held.

  In the above embodiment, the surface side (the upper side in the drawing) of the second substrate 9b is connected to the metal terminal 8, but the second substrate 9b is inserted between the upper and lower metal terminals 8 and the second substrate 9b. You may make it connect the back surface (illustration lower side) of this with the metal terminal 8 of the lower side. This eliminates the need for forming a through hole in the second substrate 9b, thereby reducing the manufacturing cost.

  In the above embodiment, the case 23 is used as a protective cover for protecting the optical element 11 and the ICs 18 and 22, but a resin is molded so as to cover the outer periphery of the case 23, and a separate protective cover is provided. May be. In this case, the case 23 is preferably extended to the tip of the electrical connector 7 so that the tip of the case 23 is not covered with resin so that heat is radiated from the tip of the case 23.

It is a cross-section figure of the photoelectric conversion module of this invention. It is a cross-section figure of the flexible printed circuit board used for the photoelectric conversion module of the present invention. It is a top view of a conventional photoelectric conversion module.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Photoelectric conversion module 2 Optical fiber 3 Electric wire 4 Photoelectric composite wire 5 External electric equipment 6 Receptacle 7 Electrical connector 9a 1st board | substrate (board | substrate)
9b Second substrate 10 Optical waveguide (optical path changing means)
11 Optical Element 12 Flexible Printed Circuit Board (Flexible Board)
19 FPC connector 25 Heat sink

Claims (6)

A photoelectric conversion module for connecting an optical / electrical composite wire containing an optical fiber and an electric wire to a receptacle of an external electrical device,
A substrate, a flexible substrate mounted on the substrate via an FPC connector, a support plate for supporting an end of the flexible substrate opposite to the FPC connector, and one surface of the flexible substrate An optical path changing unit that is formed on and optically couples with the core of the optical fiber; an optical element that is provided on the other surface of the flexible substrate and optically couples with the core of the optical fiber through the optical path changing unit; An electrical connector provided at one end of the substrate, inserted into and connected to the receptacle of the external electrical device and electrically connected to the external electrical device, and electrically connected to the optical element and the electric wire; A case that covers the substrate, the flexible substrate, and the electrical connector so that the insertion connecting portion of the electrical connector on the electrical device side is exposed; Photoelectric conversion module, wherein a heat radiating plate is disposed between the substrate and the casing for supporting the flexible substrate whose serial optical element is mounted.   The electric wire is electrically connected to the electrical connector via a second substrate different from the substrate, and a metal plate is disposed on a surface of the second substrate on the flexible substrate side. The photoelectric conversion module as described.   The photoelectric conversion module according to claim 2, wherein a spacer made of metal is provided between the substrate and the flexible substrate and between the second substrate and the case.   The electrical connector includes a pair of upper and lower metal terminals electrically connected to the connection terminal of the receptacle, one metal terminal is electrically connected to the optical element through the substrate, and the other metal terminal is The photoelectric conversion module according to claim 2, wherein the photoelectric conversion module is electrically connected to the electric wire via the second substrate.   The photoelectric conversion module according to claim 1, wherein the heat radiating plate is in contact with the case.   The photoelectric conversion module according to claim 1, wherein the case is made of metal.

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