JP2010087224A - Led display device and method of manufacturing barrier for led display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To manufacture a barrier suitable for an LED display device having a narrow pixel interval. <P>SOLUTION: A plurality of stainless steel plates 123 are photo-etched respectively to form square holes 123a corresponding to positions of pixels 10 in a matrix form (Fig.4(a)). Then the plurality of stainless steel plates 123 are stacked, and heated and pressed under a vacuum to diffuse atoms on junction surfaces, thereby joining them together. Consequently, one metal plate 121 is formed (Fig.4(b)). Then a non-conductive black chromium plating film 122 is formed on the surface of the metal plate 121 by electroplating (Fig.4(c)). <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an LED display device in which pixels composed of LEDs are arranged in a matrix and each pixel is partitioned by a partition, and particularly has a feature in the partition. Moreover, it is related with the manufacturing method of the partition.

  Conventionally, there has been known an LED display device in which one pixel is composed of one or a plurality of LEDs and the pixels are arranged in a matrix on a substrate.

  In such an LED display device, in order to display a precise pattern, it is necessary to reduce the interval between pixels. However, light leakage to adjacent pixels tends to occur, and the sharpness of the display pattern is reduced. The display quality is significantly deteriorated due to blurring or color misregistration.

In order to solve this, it is conceivable to partition each pixel by providing a partition made of metal, resin, or ceramic. For example, in Patent Document 1, partition walls are formed by repeatedly applying paste-like alumina powder by screen printing, laminating, and then sintering.
JP2007-242856

  It is necessary to use a material having the following characteristics for a partition wall used in an LED display device with a narrow pixel interval. First, since the interval between the pixels is narrow, it is necessary that fine processing can be performed in the formation of the partition wall, the processing accuracy is high, and the processing shape can be maintained. Moreover, the heat resistance which does not deform | transform in resin sealing is also required. Moreover, it needs to be matte black so that there is no light leakage. Furthermore, since the partition walls are arranged on the wiring substrate, they are in contact with the wiring pattern, and since the distance between the pixels is narrow, there is a possibility of contact between the wire bonding and the partition walls. In consideration of these, the partition walls need to be non-conductive. It is.

  However, since resin has low heat resistance and low processing accuracy, it is not suitable as a material for partition walls. In addition, there is a problem that the metal material has conductivity and is difficult to be colored black. In addition, ceramics have a problem of poor workability. Thus, since the material conventionally used as a partition is not suitable as a partition used for an LED display device with a narrow pixel interval, the display quality cannot be improved using the partition.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to improve display quality by providing a partition suitable for an LED display device in which pixels are narrowed in an LED display device in which pixels are arranged in a matrix and partitioned for each pixel by a partition. Another object of the present invention is to provide a method for manufacturing the partition wall.

  According to a first aspect of the present invention, in the LED display device in which pixels composed of LEDs are arranged in a matrix and each pixel is partitioned by a partition, the surface of the partition is covered with a non-conductive black plating film. It is a metal plate in which a hole is formed, and the metal plate is obtained by laminating a plurality of thin metal plates and diffusion bonding them.

  Examples of non-conductive black plating include black chrome plating, black chromate, and black alumite.

  The metal thin plate may be a material that can be diffusion-bonded and can be black-plated, and all of the plurality of metal thin plates may be the same material or a combination of different materials. . For example, a material such as stainless steel can be used as the metal thin plate.

  The thickness of the metal thin plate is desirably 0.1 mm or less. If it is thicker than 0.1 mm, the processing accuracy of the metal thin plate by photoetching deteriorates, and it is difficult to form the partition wall in a desired shape. A more desirable range is 0.05 mm to 0.1 mm.

  A second invention is the LED display device according to the first invention, wherein the black plating film is a black chromium plating film.

  A third invention is the LED display device according to the first invention or the second invention, wherein the thin metal plate is a stainless steel plate.

  A fourth invention is the LED display device according to any one of the first to third inventions, wherein the metal thin plate has a thickness of 0.1 mm or less.

  A fifth invention is an LED display device according to any one of the first to fourth inventions, wherein a heat dissipation channel is provided inside the metal plate.

  According to a sixth aspect of the present invention, there is provided a method of manufacturing a partition for partitioning each pixel, which is used in an LED display device in which pixels configured with LEDs are arranged in a matrix. A matrix is formed on each of a plurality of metal thin plates by photoetching. A photo-etching step for forming holes in a shape, a diffusion bonding step for laminating a plurality of thin metal plates and bonding them by diffusion bonding to form a metal plate, and plating for applying non-conductive black plating on the surface of the metal plate A process for producing a partition for an LED display device.

  7th invention is the manufacturing method of the partition for LED display devices characterized by black plating being black chrome plating in 6th invention.

  An eighth invention is the method of manufacturing a partition for an LED display device according to the sixth invention or the seventh invention, wherein the thin metal plate is a stainless steel plate.

  According to a ninth invention, in the sixth to eighth inventions, the metal thin plate has a thickness of 0.1 mm or less.

  According to a tenth aspect, in the sixth to ninth aspects, the photoetching step comprises photoetching each metal thin plate so that a heat dissipation channel is formed inside the metal plate. It is a manufacturing method of the partition for display apparatuses.

  The partition wall according to the first invention can be finely processed, has excellent processing accuracy, has heat resistance, is non-conductive and black. Therefore, this partition wall is suitable for an LED display device with a narrow pixel interval, and if the present invention is applied to an LED display device with a small pixel interval, a fine pattern display is possible because there is little light leakage to adjacent pixels. Quality can be improved.

  Further, as in the second invention, a black chrome plating film can be used as the non-conductive black plating film, and as in the third invention, a stainless steel plate can be used as the metal thin plate. In particular, as in the fourth invention, when the thickness of the metal thin plate is 0.1 mm or less, the processing accuracy of the metal thin plate is improved, so that the processing accuracy of the partition wall is also improved, and the display quality can be further improved. .

  Further, as in the fifth aspect of the invention, if a heat dissipation channel is provided inside the metal plate, heat can be efficiently absorbed by flowing a heat flow medium through the heat dissipation channel, resulting in deterioration of the element. Can be suppressed and energy saving can be achieved.

  In addition, according to the sixth to tenth inventions, a partition suitable for a matrix type LED display device with a narrow pixel interval can be manufactured, so that a matrix type LED display device capable of displaying a fine pattern is realized. Can do.

  Hereinafter, specific examples of the present invention will be described with reference to the drawings. However, the present invention is not limited to the examples.

  FIG. 1 is a top view of the LED display device according to the first embodiment. As shown in FIG. 1, the LED display device has a configuration in which pixels 10 are arranged in a matrix and each pixel 10 is partitioned by a partition wall 12. The interval between the pixels 10 is 1.475 mm. This LED display device is a device that displays patterns such as characters and figures by controlling the light emission of each pixel 10.

  The partition wall 12 is a flat plate having a lattice structure in which the planar shape is rectangular and coincides with the planar shape of the wiring substrate 11 and square holes are formed in a matrix corresponding to the positions of the pixels 10. The height of the partition wall is 1.0 mm, and the width of the grid line-shaped portion that separates the pixel 10 and the pixel 10 is 0.1 mm. The partition wall 12 is disposed on the wiring substrate 11, and is bonded to the wiring substrate 11 with an adhesive on the surface on the end side of the partition wall 12. Moreover, the partition 12 is comprised by the metal plate 121 and the matte black chrome plating film | membrane 122 formed in the surface of the metal plate 121 like the sectional view shown in FIG. Further, the metal plate 121 is obtained by laminating and joining a stainless plate 123 (corresponding to the metal thin plate of the present invention). The black chrome plating film 122 is insulative and has a film thickness of about 10 μm. The black chromium plating film 122 is formed using Hino Black SBCr manufactured by Ohino Kogyo Co., Ltd.

  FIG. 3 is an enlarged cross-sectional view of one pixel 10. Each pixel 10 is composed of one LED 13. A wiring pattern 15 is formed on the wiring substrate 11, and an n electrode and a p electrode (none of them are shown) of the LED 13 and the wiring patterns 15a and b are electrically connected via bonding wires 14a and b. Yes. The LED 13 is surrounded by a partition wall 12 in a square shape, and a sealing resin 16 is formed therein.

  The sealing resin 16 may be mixed with a phosphor or a diffusing material. For example, white light emission can be obtained by using a blue LED and mixing a yellow phosphor with a sealing resin. Further, LEDs having various emission colors can be used, and one pixel may be constituted by a plurality of LEDs. For example, a full color display may be performed by forming one pixel with a blue LED, a green LED, and a red LED. Further, instead of wire bonding mounting, flip chip mounting may be performed using a flip chip type LED.

  In the LED display device according to the first embodiment, each pixel 10 is partitioned by the partition wall 12, and the partition wall 12 is matte black, so that light leakage to the adjacent pixel 10 is small. Therefore, fine pattern display is possible and display quality is high.

  Next, the manufacturing process of the partition 12 is demonstrated with reference to FIG.

  First, for each of the plurality of stainless steel plates 123, a resist film having the same pattern is formed by photolithography, and a portion where the resist film is not formed is etched by an etching solution such as an aqueous ferric chloride solution to correspond to the position of the pixel 10. The square holes 123a to be formed are formed in a matrix. Thereafter, the resist film is removed (FIG. 4A). Here, in order to etch accurately according to a desired pattern, the thickness of each stainless steel plate 123 is desirably 0.1 mm or less. More desirably, the thickness is 0.05 mm to 0.1 mm.

  Next, a plurality of stainless steel plates 123 are stacked and bonded by diffusing atoms on the bonding surface by heating and pressing in vacuum. In this diffusion bonding, bonding may be performed by a method called solid phase diffusion bonding or liquid phase diffusion bonding in which an insert metal is inserted between the bonding surfaces, or may be directly bonded without using an insert metal. There may be. Thereby, it can join without producing a void and a deformation | transformation, and the one metal plate 121 can be formed (FIG.4 (b)).

  Next, a non-conductive black chromium plating film 122 is formed on the surface of the metal plate 121 by electroplating using a plating bath mainly containing chromium chloride at a temperature of −10 to 10 ° C. and a pH of 1.5 to 2.5. Is formed (FIG. 4C).

  The above is the manufacturing process of the partition wall 12. Incidentally, in the LED display device of Example 1, the interval between the pixels 10 is as narrow as 1.475 mm. Therefore, the partition 12 used in the LED display device needs to satisfy the following requirements. First, since the interval between the pixels 10 is narrow, it is necessary that fine processing can be performed in the formation of the partition wall 12, the processing accuracy is high, and the processing shape can be maintained. Moreover, the heat resistance which does not deform | transform in resin sealing is also required. Moreover, it needs to be matte black so that there is no light leakage. Further, since the partition wall 12 is disposed on the wiring substrate 11, it may be in contact with the wiring pattern 15 and the spacing between the pixels 10 may be narrow, so that the bonding wires 14a and 14b and the partition wall 12 may contact each other. 12 must be non-conductive.

  Therefore, if the method for manufacturing the partition wall 12 is used, the thin stainless steel plate is processed by photoetching, so that fine processing can be performed with high accuracy. By applying black chrome plating, non-conductive and matte black are obtained. ing. Further, since it is a stainless steel material, it has heat resistance and hardness capable of maintaining its shape. As described above, the partition wall 12 manufactured by the above manufacturing method satisfies all the requirements applicable to the LED display device of Example 1 in which the interval between the pixels 10 is narrow.

  Next, the manufacturing process of the LED display device of Example 1 will be described with reference to FIG.

  First, the LEDs 13 are mounted on the wiring substrate 11 in a matrix, and the n and p electrodes of the LED 13 are electrically connected to the wiring patterns 15a and b via bonding wires 14a and b (FIG. 5A). )).

  Next, an adhesive is applied to the end portion 11 a on the wiring substrate 11, the partition wall 12 is disposed on the wiring substrate 11, and the wiring substrate 11 and the partition wall 12 are joined. Thereby, LED13 is divided for every hole provided in the partition 12 (FIG.5 (b)). Here, since the partition 12 is non-conductive, there is no problem even if the partition 12 contacts the wiring patterns 15a and 15b or the bonding wires 14a and 14b.

  Next, the sealing resin 16 is injected into each of the plurality of recesses surrounded by the partition wall 12 and the wiring substrate 11 and cured to individually seal the LEDs 13 (FIG. 5C). At this time, the wiring substrate 11 and the partition wall 12 are joined only at the end portion, and the other portions are not joined, and therefore there may be a gap between the wiring substrate 11 and the partition wall 12. However, the sealing resin 16 does not leak from the gap due to the viscosity of the sealing resin 16.

  The above is the manufacturing method of the LED display device. Thus, if the partition 12 applicable to the LED display device with a narrow interval between the pixels 10 is manufactured and the LED display device is manufactured using the partition 12, a fine pattern with less light leakage to the adjacent pixels 10 is obtained. An LED display device capable of display can be obtained.

  The LED display device of Example 2 is obtained by replacing the partition wall 12 used in the LED display device of Example 1 with a partition wall 22 shown in FIG.

  Similar to the partition wall 12, the partition wall 22 includes a metal plate 221 and a matte black chrome plating film 222 formed on the surface of the metal plate 221, and the metal plate 221 further includes a stainless steel plate 223 (main plate). (Equivalent to the metal thin plate of the invention) is laminated and diffusion bonded. In addition, a heat dissipation channel 29 is provided inside the metal plate 221.

  FIG. 7A is an enlarged plan view showing a part of the uppermost stainless plate 223A, and FIG. 7B is an enlarged view of a part of the second stainless plate 223B from the uppermost layer. It is the shown top view. The stainless plates 223A and 223B are provided with holes 223a at positions corresponding to the pixels 10. The stainless steel plate 223A is provided with a hole 29a which is a part of the heat radiation channel 29 and is an inlet / outlet of the heat flow medium at a position not continuous with the hole 223a. Further, the stainless plate 223B is provided with a linear hole 29b which is a part of the heat radiation channel 29 and continues to the hole 29a. Hereinafter, linear holes, which are part of the heat dissipation flow path 29, are similarly provided in the stainless steel plate 223 below the stainless steel plate 223B so as to form a continuous flow path. Another entrance / exit of the heat dissipation channel 29 may be provided by providing a hole in the wiring board 10 that is continuous with the heat dissipation channel 29, or may be a linear cut as shown in FIG. An entry / exit may be provided on the side surface of the partition wall 22 by providing the notch 29c.

  In the photoetching process of the manufacturing process of the partition wall 12, the partition wall 22 is formed by forming a partial pattern of the heat dissipation channel 29 on each stainless steel plate 223, and the diffusion bonding process and the plating process other than that of the partition wall 12 are performed. It can manufacture by making it the same as a manufacturing process.

  The shape of the heat radiation channel 29 is not limited to the above shape, and the shape is not particularly limited as long as the heat flow medium can flow. A typical flow path may be provided, or a branch may be provided. A plurality of flow paths may be provided.

  In the LED display device of Example 2, since the heat dissipation channel 29 is formed inside the partition wall 22, the heat released from the LED 13 can be absorbed by flowing a heat flow medium through the heat dissipation channel 29. , Can dissipate heat efficiently. Thereby, deterioration of an LED display device can be suppressed and energy saving can be achieved.

  In each of the embodiments, square holes are formed in the partition in a matrix shape, but the shape is not limited to a square, and holes such as a circle may be formed.

  In each embodiment, stainless steel is used as the material of the partition wall, but a metal thin plate made of a material other than stainless steel can be used as long as it can be diffusion bonded and can be subjected to black chrome plating. Good. Moreover, all the metal thin plates may be made of the same material, or may be diffusion bonded by combining different materials.

  Moreover, although black chrome plating is used in each Example, it is not restricted to this, What is necessary is just non-conductive and black plating.

  According to the present invention, a matrix type LED display device capable of displaying a fine pattern can be realized.

The figure which looked at the LED display device of Example 1 from the upper part. FIG. FIG. 6 is a cross-sectional view of the pixel 10. The figure explaining the manufacturing process of the partition 12. FIG. 3 is a diagram illustrating a manufacturing configuration of the LED display device according to the first embodiment. FIG. The top view shown about a part of stainless steel plate 223. FIG.

Explanation of symbols

10: Pixel 11: Wiring board 12, 22: Partition wall 13: LED
14: Bonding wire 15: Wiring pattern 16: Sealing resin 121, 221: Metal plate 122, 222: Black chromium plating film 123, 223: Stainless steel plate 29: Heat dissipation channel

Claims (10)

In the LED display device in which pixels composed of LEDs are arranged in a matrix, and each pixel is partitioned by a partition wall,
The partition wall is a metal plate whose surface is covered with a non-conductive black plating film and in which holes are formed in a matrix shape,
The metal plate is formed by laminating a plurality of thin metal plates and diffusion bonding them.
An LED display device characterized by that.   The LED display device according to claim 1, wherein the black plating film is a black chrome plating film.   The LED display device according to claim 1, wherein the metal thin plate is a stainless steel plate.   4. The LED display device according to claim 1, wherein the metal thin plate has a thickness of 0.1 mm or less. 5.   The LED display device according to any one of claims 1 to 4, wherein a heat-dissipating flow path is provided inside the metal plate. In the manufacturing method of the partition for partitioning for every said pixel used for the LED display device by which the pixel constituted by LED is arranged in a matrix form,
A photoetching step of forming holes in a matrix by photoetching in each of the plurality of thin metal plates;
A diffusion bonding step of laminating a plurality of the thin metal plates and bonding them by diffusion bonding to form a metal plate;
A plating step of applying non-conductive black plating to the surface of the metal plate;
The manufacturing method of the partition for LED display devices characterized by having.   The method for manufacturing a partition for an LED display device according to claim 6, wherein the black plating is black chrome plating.   The method of manufacturing a partition for an LED display device according to claim 6 or 7, wherein the metal thin plate is a stainless steel plate.   The method for manufacturing a partition for an LED display device according to any one of claims 6 to 8, wherein the thin metal plate has a thickness of 0.1 mm or less.   10. The photoetching step of photoetching each of the metal thin plates so that a heat dissipation channel is formed inside the metal plate. The manufacturing method of the partition for LED displays of this.

Images