JP2010062826A - Converter for receiving satellite broadcast and antenna mounted therewith - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a converter for receiving satellite broadcast, which can obtain a stable output signal and can be manufactured at a low cost, and also to provide an antenna mounted with the same. <P>SOLUTION: The converter for receiving satellite broadcast is equipped with: a metal chassis 1; a high-frequency circuit board 4 which is disposed on the metal chassis 1 and introduces electric waves in a high-frequency band which has been received by an antenna; and a projecting portion 51 which is disposed on the same plane as the high-frequency circuit board 4 and projects in such a manner that a part of it may face the high-frequency circuit board 4. The projecting portion 51 includes an intermediate-frequency amplifying circuit board 5 closely connected to the high-frequency circuit board 4 and a metal connection member 9 for connecting the high-frequency circuit board 4 and the intermediate-frequency amplifying circuit board 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a satellite broadcast receiving converter and an antenna equipped with the same, and more particularly to a satellite broadcast receiving converter in which a high frequency circuit board and an intermediate frequency amplifier circuit board are separated and an antenna equipped with the same.

  An example of a conventional satellite broadcast receiving converter will be described with reference to FIGS. FIG. 11 is a cross-sectional view showing an example of a conventional satellite broadcast receiving converter. A radio wave signal 21 having a frequency of 12 GHz collected by the parabolic reflector is received by the primary radiator 12 formed integrally with the metal chassis 1 and sent to the waveguide 11 formed integrally with the metal chassis 1. It is done. The transmitted radio wave signal 21 is input to the high-frequency circuit board 4 through the probe 2. On the high-frequency circuit board 4, a low-noise amplifier circuit, a local oscillator, a mixer circuit, and the like are formed. A metal frame 3 that shields these circuit portions is fixed with screws 15 so as to sandwich the high-frequency circuit board 4 with the metal chassis 1. The signal received by the probe 2 is converted to an intermediate frequency of 1 to 2 GHz by a low noise amplifier circuit, a local oscillator, and a mixer circuit. An intermediate frequency amplifier that amplifies an intermediate frequency signal is mounted on the subsequent stage of the high frequency circuit board 4. The intermediate frequency signal amplified by the intermediate frequency amplifier is externally output from the output terminal 8. Since the satellite broadcast receiving converter is used outdoors, a plastic waterproof cover 16 is provided at the opening of the primary radiator 12 in order to ensure airtightness. Further, a liquid sealing material 7 such as silicon is applied to a contact portion between the metal frame 3 and the metal chassis 1 and a contact portion between the screw 15 and the metal frame 3.

  FIG. 12 is a cross-sectional view showing another example of a conventional satellite broadcast receiving converter. The difference from the satellite broadcast receiving converter shown in FIG. 11 is that the circuit board is separated, a low noise amplifier having a frequency of 12 GHz, a local oscillator and a mixer circuit unit are formed on the high frequency circuit board 4 in the previous stage, and an intermediate frequency is formed in the subsequent stage. An intermediate frequency amplifier circuit board 5 on which an amplifier is formed is disposed. A metal frame 3 for shielding is fixed on the high-frequency circuit board 4. The high frequency circuit board 4 and the intermediate frequency amplification circuit board 5 are connected by fixing the connecting member 9 with solder 17 or the like. The signal converted to the intermediate frequency by the high-frequency circuit board 4 is sent to the intermediate frequency amplifier circuit board 5 through the connecting member 9 to be amplified and output from the output terminal 8 to the outside. Moreover, in order to ensure airtightness, the metal cover 6 is provided so that the metal frame 3 and the whole circuit board may be covered. Further, a liquid sealing material 7 is applied to the entire circumference of the contact portion between the metal cover 6 and the metal chassis 1.

Patent Document 1 discloses a prior art document that discloses a satellite broadcast receiving converter that can reliably suppress output return loss with a simple structure even if the circuit board is small in size relative to the housing. In the satellite broadcast receiving converter disclosed in Patent Document 1, an auxiliary board is simply electrically connected between a small circuit board and an output terminal, whereby a conductor connected to the output terminal is provided. I try to shorten it. Further, Patent Document 2 is a prior art document that discloses a high-performance electronic device that does not leak unnecessary signals between two high-frequency circuits. In the electronic device disclosed in Patent Document 2, a printed circuit board on which a high-frequency circuit is formed is housed in a compartment divided into two, and both circuits are connected by a connection terminal provided with a radio wave absorber. .
JP 2004-200844 A Japanese Patent Laid-Open No. 10-106823

  In the satellite broadcast receiving converter shown in FIG. 11, the entire circuit is formed of one high-frequency circuit board, and the entire high-frequency circuit board is covered with a metal frame. A high-frequency circuit board corresponding to a frequency of 12 GHz or the like is expensive because Teflon (registered trademark) or the like is used as a base material, and a metal frame is usually expensive because it is formed by die casting such as aluminum. This has been an obstacle in reducing the cost of satellite converters.

  In order to solve the above problem, the satellite broadcast receiving converter shown in FIG. 12 uses a high-frequency circuit board and an intermediate frequency amplifier to reduce the amount of high-frequency circuit board that uses an expensive base material such as Teflon (registered trademark). The circuit board is separated. However, in order to ensure the airtightness of the circuit unit, a metal cover is provided so as to enclose the high-frequency circuit board and the intermediate-frequency amplifier circuit board. This metal cover is usually manufactured by pressing, etc., but if the shape of the metal cover is large and complicated, the press process will increase and the number of molds required for each process will increase. Could not be done. In addition, since the high frequency circuit section and the intermediate frequency circuit section are shielded by an integral metal cover, the intermediate frequency band signal may circulate to the previous high frequency circuit section, adversely affecting the circuit and causing problems such as parasitic oscillation. It was a factor.

  The satellite broadcast receiving converter described in Patent Document 1 is provided with an auxiliary board separate from the circuit board in order to shorten the length of the conductive wire connecting the output terminal and the board, and the number of components increases. This may hinder cost reduction. Although the electronic device described in Patent Document 2 reduces the leakage of a transmission signal by connecting a circuit with a connection terminal provided with a radio wave absorber, the radio wave cannot be sufficiently absorbed depending on the frequency of an unnecessary signal. In some cases.

  The present invention has been made to solve the above problems, and provides a satellite broadcast receiving converter and an antenna equipped with the same, which can obtain a stable output signal and can be manufactured at low cost. Objective.

  A satellite broadcast receiving converter according to the present invention includes a metal chassis, a high-frequency circuit board that is disposed in the metal chassis and into which a radio wave in a high frequency band received by an antenna is introduced, and is on the same plane as the high-frequency circuit board. An intermediate frequency amplifying circuit board which is disposed and has a protruding part protruding so as to face a part of the high frequency circuit board, the protruding part being in close contact with the high frequency circuit board; and the high frequency circuit board and the intermediate frequency amplifying circuit A metal connecting member for connecting the substrate. The high-frequency circuit board and the intermediate-frequency amplifier circuit board each have a hole in a connection region where they are in contact with each other. The hole of the high frequency circuit board is provided at the end of the signal output pattern of the high frequency circuit board. The hole of the intermediate frequency amplifier circuit board is provided at the end of the signal input pattern formed on the lower surface side of the intermediate frequency amplifier circuit board. The connecting member communicates and connects the respective holes of the high frequency circuit board and the intermediate frequency amplification circuit board, and transmits an output signal from the high frequency circuit board to the intermediate frequency amplification circuit board.

  According to the present invention, it is possible to obtain a stable output signal by reducing radio wave leakage by closely connecting the high frequency circuit board and the protruding portion of the intermediate frequency amplification circuit board, and an expensive high frequency circuit board. It is possible to provide a satellite broadcast receiving converter that can be manufactured at a low cost by downsizing and an antenna equipped with the converter.

  A satellite broadcast receiving converter according to an embodiment of the present invention will be described below with reference to the drawings.

  FIG. 1 is a perspective view showing a converter for receiving satellite broadcast according to an embodiment of the present invention. In the satellite broadcast receiving converter according to the present embodiment, as shown in FIG. 1, a satellite broadcast receiving converter 19 is disposed at the end of the arm portion 13 provided at the lower part of the parabolic reflector 18. . The satellite broadcast receiving converter 19 receives the radio wave signal 21 reflected by the parabolic reflector 18 and transmits an output signal from the output coaxial cable 20.

  FIG. 2 is a sectional view of the satellite broadcast receiving converter according to the present embodiment. FIG. 3 is a bottom view of the high frequency circuit board and the intermediate frequency amplifier circuit board according to the present embodiment. FIG. 4 is an enlarged view of a connection portion between the high frequency circuit board and the intermediate frequency amplification circuit board according to the present embodiment. As shown in FIG. 2, radio wave signals 21 of a frequency of 12 GHz collected by the parabolic reflector are received by the primary radiator 12 formed integrally with the metal chassis 1 and formed integrally with the metal chassis 1. To the waveguide 11. The transmitted radio wave signal 21 is introduced into the high-frequency circuit board 4 through the probe 2. On the high-frequency circuit board 4, a low-noise amplifier circuit, a local oscillator, a mixer circuit, and the like are formed. A metal frame 3 that shields these circuit portions is fixed with screws 15 so as to sandwich the high-frequency circuit board 4 with the metal chassis 1. The signal received by the probe 2 is converted to an intermediate frequency of 1 to 2 GHz by a low noise amplifier circuit, a local oscillator, and a mixer circuit.

  As shown in FIG. 3, the intermediate frequency amplifier circuit board 5 is disposed on the same plane as the high frequency circuit board 4 and has a protruding portion 51 that protrudes so that a part thereof faces the lower surface of the high frequency circuit board 4. The protrusion 51 is in close contact with and connected to the high-frequency circuit board 4. In the present embodiment, the protrusion 51 is disposed so as to face the lower surface of the high-frequency circuit board 4, but the protrusion 51 may be disposed so as to face the upper surface of the high-frequency circuit board 4. As shown in FIG. 4, the high-frequency circuit board 4 and the intermediate-frequency amplifier circuit board 5 each have a hole in a connection region where they are in contact with each other. The hole of the high frequency circuit board 4 is provided at the end of the signal output pattern of the high frequency circuit board 4. The hole of the intermediate frequency amplifier circuit board 5 is provided at the end of the signal input pattern formed on the lower surface side of the intermediate frequency amplifier circuit board 5. The connection member 91 communicates and connects the respective holes of the high-frequency circuit board 4 and the intermediate frequency amplification circuit board 5.

  The signal converted to the intermediate frequency on the high-frequency circuit board 4 is applied to the connecting member 91 connected to the hole provided at the end of the signal output pattern located at the rear part of the high-frequency circuit board 4 with the solder 17. Sent. The connection member 91 includes a columnar portion and a head having an enlarged diameter. The connection member 91 is connected to the high-frequency circuit board 4 at the end on the head side, and the protruding portion of the intermediate frequency amplification circuit board 5 at the other end. 51 is connected to a hole provided in 51 by solder 17. The signal transmitted to the connecting member 91 is transmitted to the signal input pattern 52 provided on the lower surface side of the intermediate frequency amplifier circuit board 5 and is formed on the upper surface side of the intermediate frequency amplifier circuit board 5 through the through hole 54. It is sent to the frequency amplification circuit. The signal amplified by the intermediate frequency amplifier circuit is output from the output terminal 8 to the outside. By connecting the high frequency circuit board 4 and the intermediate frequency amplification circuit board 5 in this way, leakage of radio waves at the connecting portion is prevented. Further, the periphery of the protruding portion 51 of the intermediate frequency amplifier circuit board 5 is provided on the upper surface of the metal chassis 1 in order to further reduce radio wave leakage at the connection portion between the high frequency circuit board 4 and the intermediate frequency amplifier circuit board 5. You may make it surround with the side surface and bottom face of a recessed part.

  FIG. 5 shows an enlarged view of a connection portion of another connection form between the high frequency circuit board and the intermediate frequency amplifier circuit board according to the present embodiment. As shown in FIG. 5, the connection member 92 has an L-shape, and one end of the connection member 92 is formed in a hole formed at the end of the signal output pattern located at the rear of the high-frequency circuit board 4. They are connected by solder 17. The other end of the connection member 92 is connected to the signal input pattern 52 provided on the lower surface of the protruding portion 51 of the intermediate frequency amplification circuit board 5 by the solder 17. FIG. 6 shows an enlarged view of a connection portion of another connection form between the high frequency circuit board and the intermediate frequency amplifier circuit board according to the present embodiment. As shown in FIG. 6, the connecting member 93 has a U-shape, and one end of the connecting member 93 is formed at the end of the signal output pattern located at the rear of the high-frequency circuit board 4 and soldered to the hole. 17 is connected. The other end of the connection member 93 is connected to the hole provided at the base of the protruding portion 51 of the intermediate frequency amplification circuit board 5 by the solder 17 from the upper surface side. In any of the above connection forms, since the ground pattern 53 is formed on the upper surface of the protruding portion 51, the connection portion is shielded so that radio waves do not leak upward.

  Furthermore, in order to reduce leakage of radio waves to the outside, a metal frame 3 that covers the high-frequency circuit board 4 and a metal cover that covers the intermediate frequency amplifier circuit board 5 may be provided. In order to effectively reduce radio wave leakage, the rear end surface 31 of the metal frame 3 and the front end surface 64 of the metal cover 6 are arranged in close contact with each other. FIG. 7 is a diagram showing an example of the shape of the metal cover according to the present embodiment. 7A is a top view of the metal cover, FIG. 7B is a sectional view around the metal cover, and FIG. 7C is an enlarged view of the lower part of the metal cover. As shown in FIG. 7, in order to arrange the rear end face 31 of the metal frame 3 and the front end face 64 of the metal cover 6 so as to be in close contact with each other, a contact portion is provided at the lower part on the rear end face side of the metal cover 6. ing. The contact portion may be a hemispherical protrusion 61. A rear-stage rib 14 for reinforcing the metal chassis 1 is provided at a rear stage where the intermediate frequency amplifier circuit board 5 is placed on the metal chassis 1. By bringing the hemispherical protrusion 61 into contact with the rear rib 14 of the metal chassis 1, the metal cover 6 is pressed against the metal frame 3 and arranged so as to be in close contact therewith.

  FIG. 8 is a view showing another shape of the metal cover according to the present embodiment. 8A is a top view of the metal cover, FIG. 8B is a sectional view around the metal cover, and FIG. 8C is an enlarged view of the lower part of the metal cover. As shown in FIG. 8, in order to arrange the rear end face 31 of the metal frame 3 and the front end face 64 of the metal cover 6 so as to be in close contact with each other, a linear rib-like protrusion is formed on the lower part of the rear end face side of the metal cover 6. 62 may be provided. The metal cover 6 is pressed against the metal frame 3 by being brought into contact with the rear-stage ribs 14 of the metal chassis 1 by bringing the linear rib-shaped protrusions 62 into contact with each other. FIG. 9 is a view showing another shape of the metal cover according to the present embodiment. 9A is a top view of the metal cover, FIG. 9B is a sectional view around the metal cover, and FIG. 9C is an enlarged view of the lower part of the metal cover. As shown in FIG. 9, a leaf spring part 63 may be provided in the lower part on the rear end face side of the metal cover 6 instead of the protrusion. In this case, since the rear end surface 31 of the metal frame 3 and the front end surface 64 of the metal cover 6 can be more firmly adhered to each other by the spring pressure of the plate spring portion 63, the shield can be reliably shielded. Further, in order to prevent radio wave leakage from the periphery of the connection portion between the metal cover 6 and the metal chassis 1, the metal chassis 1 may be provided with a concave counterbore. By doing in this way, the connection part of the metal cover 6 can be enclosed by the side surface and bottom face of the metal chassis 1, and the electromagnetic wave is prevented from leaking.

  FIG. 10 is a cross-sectional view of the metal frame and the metal cover as viewed from above according to the present embodiment. As shown by the hatched portion in FIG. 10, the contact portion between the metal frame 3 and the metal cover 6 and the metal chassis 1, the contact portion between the metal frame mounting screw and the metal frame 3, and the metal A liquid sealing material 7 may be applied to the contact portion between the frame 3 and the metal cover 6. By doing in this way, a waterproof effect can be acquired, maintaining airtightness.

  By adopting the structure of the above embodiment, the area of the high-frequency circuit board 4 such as a frequency of 12 GHz band can be reduced, so that the amount of expensive base materials such as Teflon (registered trademark) used for the high-frequency circuit board 4 is reduced. it can. Moreover, since the metal frame 3 is also small and can be formed in a simple shape, the manufacturing cost of the metal frame 3 can be reduced. Furthermore, radio wave leakage can be reduced by the structure of the above-mentioned connecting part, and problems such as parasitic oscillations that occur when a signal in the intermediate frequency band wraps around to the preceding high-frequency circuit part can be prevented, and a more stable output signal can be obtained. be able to. The above effect can also be obtained in an antenna equipped with the satellite broadcast receiving converter of the present invention.

  In addition, the said embodiment disclosed this time is an illustration in all the points, Comprising: It does not become the basis of limited interpretation. Therefore, the technical scope of the present invention is not interpreted only by the above-described embodiment, but is defined based on the description of the scope of claims. Further, all modifications within the meaning and scope equivalent to the scope of the claims are included.

It is the perspective view which showed the converter for satellite broadcast reception based on one Embodiment of this invention. 2 is a cross-sectional view of a satellite broadcast receiving converter according to the embodiment. FIG. It is a bottom view of a high frequency circuit board and an intermediate frequency amplification circuit board concerning the embodiment. The enlarged view of the connection part of the high frequency circuit board and intermediate frequency amplifier circuit board based on the embodiment is shown. The enlarged view of the connection part of another connection form of the high frequency circuit board and intermediate frequency amplifier circuit board based on the embodiment is shown. The enlarged view of the connection part of another connection form of the high frequency circuit board and intermediate frequency amplifier circuit board based on the embodiment is shown. (A) is a top view of an example of the shape of a metal cover, (B) is a sectional view around the metal cover, and (C) is an enlarged view of the lower part of the metal cover. (A) is a top view of another shape of the metal cover, (B) is a sectional view around the metal cover, and (C) is an enlarged view of the lower part of the metal cover. (A) is a top view of another shape of the metal cover, (B) is a sectional view around the metal cover, and (C) is an enlarged view of the lower part of the metal cover. It is sectional drawing which looked at the metal frame and metal cover based on the same embodiment from the upper part. It is sectional drawing which showed an example of the converter for the conventional satellite broadcast reception. It is sectional drawing which showed another example of the conventional converter for satellite broadcast reception.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Metal chassis, 2 Probe, 3 Metal frame, 4 High frequency circuit board, 5 Intermediate frequency amplification circuit board, 6 Metal cover, 7 Liquid seal material, 8 Output terminal, 9, 91, 92, 93 Connection member, 10 Cabinet, 11 Waveguide, 12 Primary radiator, 13 Arm, 14 Rear rib, 15 Screw, 16 Waterproof cover, 17 Solder, 18 Parabolic reflector, 19 Satellite broadcast receiving converter, 20 Output coaxial cable, 21 Radio signal , 31 Rear end face, 51 Protruding part, 52 Signal input pattern, 53 Ground pattern, 54 Through hole, 61 Hemispherical protrusion, 62 Line-like protrusion, 63 Leaf spring part, 64 Front end face

Claims (13)

A metal chassis,
A high-frequency circuit board that is disposed in the metal chassis and into which radio waves in a high frequency band received by an antenna are introduced;
An intermediate frequency amplifier circuit that is disposed on the same plane as the high-frequency circuit board, has a protruding part that protrudes so as to face the high-frequency circuit board, and the protruding part is closely connected to the high-frequency circuit board. A substrate,
A metal connection member for connecting the high-frequency circuit board and the intermediate frequency amplifier circuit board;
The high-frequency circuit board and the intermediate-frequency amplifier circuit board each have a hole in a connection region that is in contact with each other,
The hole of the high-frequency circuit board is provided at an end of a signal output pattern of the high-frequency circuit board,
The hole of the intermediate frequency amplifier circuit board is provided at an end of a signal input pattern formed on the lower surface side of the intermediate frequency amplifier circuit board,
The connection member communicates and connects the holes of the high-frequency circuit board and the intermediate frequency amplifier circuit board, and transmits an output signal from the high-frequency circuit board to the intermediate frequency amplifier circuit board. Receive converter.   The connection member includes a columnar portion and a head having an enlarged diameter, the head-side end is solder-connected to the hole of the high-frequency circuit board, and the other end is the intermediate frequency amplifier circuit The satellite broadcast receiving converter according to claim 1, wherein the converter is connected to the hole of the substrate by soldering.   The connection member has an L-shape, one end of the connection member is solder-connected to the hole of the high-frequency circuit board, and the other end of the connection member is the intermediate frequency amplification circuit board The satellite broadcast receiving converter according to claim 1, wherein the converter is connected to the signal input pattern formed on the lower surface side by soldering.   The connection member has a U-shape, one end of the connection member is solder-connected to the hole of the high-frequency circuit board, and the other end of the connection member is the intermediate frequency amplification circuit board The satellite broadcast receiving converter according to claim 1, wherein the converter is solder-connected to a hole provided at a base of the projecting portion from above.   The satellite broadcast receiving converter according to any one of claims 1 to 4, wherein a periphery of the projecting portion of the intermediate frequency amplifier circuit board is surrounded by a side surface and a bottom surface of a recess provided on an upper surface of the metal chassis.   The satellite broadcast receiving converter according to any one of claims 1 to 5, wherein a ground pattern is formed on an upper surface of the protruding portion of the intermediate frequency amplifier circuit board. A metal frame covering the high-frequency circuit board;
A metal cover that covers the intermediate frequency amplification circuit board;
The satellite broadcast receiving converter according to any one of claims 1 to 6, wherein the rear end surface of the metal frame and the front end surface of the metal cover are in contact with each other so as to be in close contact with each other. In the rear stage where the intermediate frequency amplifier circuit board on the metal chassis is placed, a rear rib for reinforcing the metal chassis is provided,
The satellite broadcast receiving converter according to claim 7, wherein a contact portion for bringing the metal cover into close contact with the rear rib of the metal chassis is provided on a rear end surface portion of the metal cover.   The satellite broadcast receiving converter according to claim 8, wherein the contact portion is a hemispherical protrusion.   The satellite broadcast receiving converter according to claim 8, wherein the contact portion has a linear rib shape.   The satellite broadcast receiving converter according to claim 8, wherein the contact portion has a leaf spring shape.   The metal frame and the contact portion between the metal cover and the metal chassis, the contact portion between the metal frame mounting screw and the metal frame, and the metal frame and the metal cover The satellite broadcast receiving converter according to any one of claims 7 to 11, wherein a liquid sealing material is applied to each of the contact portions.   An antenna equipped with the satellite broadcast receiving converter according to claim 1.

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