JP2010031073A - Curable resin composition - Google Patents
Curable resin composition Download PDFInfo
- Publication number
- JP2010031073A JP2010031073A JP2008191832A JP2008191832A JP2010031073A JP 2010031073 A JP2010031073 A JP 2010031073A JP 2008191832 A JP2008191832 A JP 2008191832A JP 2008191832 A JP2008191832 A JP 2008191832A JP 2010031073 A JP2010031073 A JP 2010031073A
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- Japan
- Prior art keywords
- group
- monomer
- weight
- polymer
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000011342 resin composition Substances 0.000 title claims abstract description 45
- 239000000178 monomer Substances 0.000 claims abstract description 128
- 229920000642 polymer Polymers 0.000 claims abstract description 70
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 58
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 57
- 229920001577 copolymer Polymers 0.000 claims abstract description 46
- 125000004432 carbon atom Chemical group C* 0.000 claims abstract description 20
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical group O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 claims abstract description 20
- 125000005370 alkoxysilyl group Chemical group 0.000 claims abstract description 19
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 12
- 150000004292 cyclic ethers Chemical group 0.000 claims abstract description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 5
- 238000007142 ring opening reaction Methods 0.000 claims abstract description 5
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 2
- 125000003545 alkoxy group Chemical group 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 abstract description 24
- 239000000758 substrate Substances 0.000 abstract description 17
- -1 alkoxide compound Chemical class 0.000 description 53
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 39
- 238000006116 polymerization reaction Methods 0.000 description 28
- 239000000243 solution Substances 0.000 description 28
- 238000001723 curing Methods 0.000 description 24
- 239000002904 solvent Substances 0.000 description 19
- 239000011248 coating agent Substances 0.000 description 16
- 150000001875 compounds Chemical class 0.000 description 16
- 239000000203 mixture Substances 0.000 description 16
- 239000003505 polymerization initiator Substances 0.000 description 16
- 238000012360 testing method Methods 0.000 description 14
- 230000015572 biosynthetic process Effects 0.000 description 13
- 238000000576 coating method Methods 0.000 description 13
- 239000003822 epoxy resin Substances 0.000 description 13
- 229920000647 polyepoxide Polymers 0.000 description 13
- 238000003786 synthesis reaction Methods 0.000 description 13
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 12
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 11
- 125000003700 epoxy group Chemical group 0.000 description 11
- 239000000463 material Substances 0.000 description 11
- 238000000034 method Methods 0.000 description 11
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 9
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 9
- 125000003566 oxetanyl group Chemical group 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 8
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 8
- 239000003513 alkali Substances 0.000 description 8
- 150000001983 dialkylethers Chemical class 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical group C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 7
- 150000001346 alkyl aryl ethers Chemical class 0.000 description 7
- 239000003054 catalyst Substances 0.000 description 7
- 125000000466 oxiranyl group Chemical group 0.000 description 7
- 239000007787 solid Substances 0.000 description 7
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 6
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 6
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 238000011156 evaluation Methods 0.000 description 6
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 6
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000008065 acid anhydrides Chemical class 0.000 description 5
- 239000002585 base Substances 0.000 description 5
- 239000012986 chain transfer agent Substances 0.000 description 5
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 5
- 239000010419 fine particle Substances 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 5
- 125000005475 oxolanyl group Chemical group 0.000 description 5
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000006185 dispersion Substances 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 150000002430 hydrocarbons Chemical group 0.000 description 4
- KQNPFQTWMSNSAP-UHFFFAOYSA-N isobutyric acid Chemical compound CC(C)C(O)=O KQNPFQTWMSNSAP-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- 150000003839 salts Chemical class 0.000 description 4
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 3
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 3
- 229940035437 1,3-propanediol Drugs 0.000 description 3
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000002947 alkylene group Chemical group 0.000 description 3
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 3
- 239000012776 electronic material Substances 0.000 description 3
- 235000011187 glycerol Nutrition 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- WWZKQHOCKIZLMA-UHFFFAOYSA-M octanoate Chemical compound CCCCCCCC([O-])=O WWZKQHOCKIZLMA-UHFFFAOYSA-M 0.000 description 3
- 239000003973 paint Substances 0.000 description 3
- 150000004714 phosphonium salts Chemical class 0.000 description 3
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 3
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 3
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000003566 sealing material Substances 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 150000003512 tertiary amines Chemical class 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical class O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- GRWFGVWFFZKLTI-IUCAKERBSA-N (-)-α-pinene Chemical compound CC1=CC[C@@H]2C(C)(C)[C@H]1C2 GRWFGVWFFZKLTI-IUCAKERBSA-N 0.000 description 2
- LTVUCOSIZFEASK-MPXCPUAZSA-N (3ar,4s,7r,7as)-3a-methyl-3a,4,7,7a-tetrahydro-4,7-methano-2-benzofuran-1,3-dione Chemical compound C([C@H]1C=C2)[C@H]2[C@H]2[C@]1(C)C(=O)OC2=O LTVUCOSIZFEASK-MPXCPUAZSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- WYGWHHGCAGTUCH-UHFFFAOYSA-N 2-[(2-cyano-4-methylpentan-2-yl)diazenyl]-2,4-dimethylpentanenitrile Chemical compound CC(C)CC(C)(C#N)N=NC(C)(C#N)CC(C)C WYGWHHGCAGTUCH-UHFFFAOYSA-N 0.000 description 2
- LCZVSXRMYJUNFX-UHFFFAOYSA-N 2-[2-(2-hydroxypropoxy)propoxy]propan-1-ol Chemical compound CC(O)COC(C)COC(C)CO LCZVSXRMYJUNFX-UHFFFAOYSA-N 0.000 description 2
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 description 2
- ATVJXMYDOSMEPO-UHFFFAOYSA-N 3-prop-2-enoxyprop-1-ene Chemical class C=CCOCC=C ATVJXMYDOSMEPO-UHFFFAOYSA-N 0.000 description 2
- XDQWJFXZTAWJST-UHFFFAOYSA-N 3-triethoxysilylpropyl prop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C=C XDQWJFXZTAWJST-UHFFFAOYSA-N 0.000 description 2
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical class C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- FYYIUODUDSPAJQ-XVBQNVSMSA-N [(1S,6R)-7-oxabicyclo[4.1.0]heptan-3-yl]methyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC1CC[C@H]2O[C@H]2C1 FYYIUODUDSPAJQ-XVBQNVSMSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- UAHWPYUMFXYFJY-UHFFFAOYSA-N beta-myrcene Chemical compound CC(C)=CCCC(=C)C=C UAHWPYUMFXYFJY-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- WQAQPCDUOCURKW-UHFFFAOYSA-N butanethiol Chemical compound CCCCS WQAQPCDUOCURKW-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 238000013329 compounding Methods 0.000 description 2
- 238000007334 copolymerization reaction Methods 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- 125000004122 cyclic group Chemical group 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- 239000012954 diazonium Substances 0.000 description 2
- 150000001989 diazonium salts Chemical class 0.000 description 2
- JQVDAXLFBXTEQA-UHFFFAOYSA-N dibutylamine Chemical compound CCCCNCCCC JQVDAXLFBXTEQA-UHFFFAOYSA-N 0.000 description 2
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 2
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 2
- 230000005660 hydrophilic surface Effects 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- MLFHJEHSLIIPHL-UHFFFAOYSA-N isoamyl acetate Chemical compound CC(C)CCOC(C)=O MLFHJEHSLIIPHL-UHFFFAOYSA-N 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- XMGQYMWWDOXHJM-UHFFFAOYSA-N limonene Chemical compound CC(=C)C1CCC(C)=CC1 XMGQYMWWDOXHJM-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 125000002950 monocyclic group Chemical group 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 2
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 150000003342 selenium Chemical class 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 238000010557 suspension polymerization reaction Methods 0.000 description 2
- CWERGRDVMFNCDR-UHFFFAOYSA-N thioglycolic acid Chemical compound OC(=O)CS CWERGRDVMFNCDR-UHFFFAOYSA-N 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- WTARULDDTDQWMU-RKDXNWHRSA-N (+)-β-pinene Chemical compound C1[C@H]2C(C)(C)[C@@H]1CCC2=C WTARULDDTDQWMU-RKDXNWHRSA-N 0.000 description 1
- WTARULDDTDQWMU-IUCAKERBSA-N (-)-Nopinene Natural products C1[C@@H]2C(C)(C)[C@H]1CCC2=C WTARULDDTDQWMU-IUCAKERBSA-N 0.000 description 1
- KNDQHSIWLOJIGP-UMRXKNAASA-N (3ar,4s,7r,7as)-rel-3a,4,7,7a-tetrahydro-4,7-methanoisobenzofuran-1,3-dione Chemical compound O=C1OC(=O)[C@@H]2[C@H]1[C@]1([H])C=C[C@@]2([H])C1 KNDQHSIWLOJIGP-UMRXKNAASA-N 0.000 description 1
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 description 1
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 1
- HSLFISVKRDQEBY-UHFFFAOYSA-N 1,1-bis(tert-butylperoxy)cyclohexane Chemical compound CC(C)(C)OOC1(OOC(C)(C)C)CCCCC1 HSLFISVKRDQEBY-UHFFFAOYSA-N 0.000 description 1
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- AEUVIXACNOXTBX-UHFFFAOYSA-N 1-sulfanylpropan-1-ol Chemical compound CCC(O)S AEUVIXACNOXTBX-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 description 1
- JPSKCQCQZUGWNM-UHFFFAOYSA-N 2,7-Oxepanedione Chemical compound O=C1CCCCC(=O)O1 JPSKCQCQZUGWNM-UHFFFAOYSA-N 0.000 description 1
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- ANEFWEBMQHRDLH-UHFFFAOYSA-N tris(2,3,4,5,6-pentafluorophenyl) borate Chemical compound FC1=C(F)C(F)=C(F)C(F)=C1OB(OC=1C(=C(F)C(F)=C(F)C=1F)F)OC1=C(F)C(F)=C(F)C(F)=C1F ANEFWEBMQHRDLH-UHFFFAOYSA-N 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
- CHJMFFKHPHCQIJ-UHFFFAOYSA-L zinc;octanoate Chemical compound [Zn+2].CCCCCCCC([O-])=O.CCCCCCCC([O-])=O CHJMFFKHPHCQIJ-UHFFFAOYSA-L 0.000 description 1
- DGVVWUTYPXICAM-UHFFFAOYSA-N β‐Mercaptoethanol Chemical compound OCCS DGVVWUTYPXICAM-UHFFFAOYSA-N 0.000 description 1
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- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
【課題】 基材に対する密着性に優れるとともに、耐熱性、耐薬品性に優れた硬化物の得られる硬化性樹脂組成物を得る。
【解決手段】 本発明の硬化性樹脂組成物は、下記式(1)
【化1】
(式中、Raは水素原子又は炭素数1〜7のアルキル基を示し、Aは単結合又は2価の炭化水素基を示す。Rb、Rcは炭素数1〜6のアルキル基等を示し、Rdは炭素数1〜6のアルキル基を示す。xは0又は1であり、yは1〜10の整数である)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aのみをモノマー成分とする重合体Aと、前記式(1)で表されるアルコキシシリル基含有ビニル単量体a、3〜5員の環状エーテル基を有するビニル単量体b、及び側鎖にε−カプロラクトン開環重合鎖部を有するヒドロキシル基含有ビニル単量体cをモノマー成分として含有してなる共重合体Bとを含む。
【選択図】 なしPROBLEM TO BE SOLVED: To obtain a curable resin composition capable of obtaining a cured product having excellent adhesion to a substrate and excellent heat resistance and chemical resistance.
The curable resin composition of the present invention has the following formula (1).
[Chemical 1]
(In the formula, R a represents a hydrogen atom or an alkyl group having 1 to 7 carbon atoms, A represents a single bond or a divalent hydrocarbon group. R b and R c represent an alkyl group having 1 to 6 carbon atoms, etc. R d represents an alkyl group having 1 to 6 carbon atoms, x is 0 or 1, and y is an integer of 1 to 10). A polymer A containing only the monomer a as a monomer component, an alkoxysilyl group-containing vinyl monomer a represented by the formula (1), a vinyl monomer b having a 3- to 5-membered cyclic ether group, and And a copolymer B containing a hydroxyl group-containing vinyl monomer c having an ε-caprolactone ring-opening polymer chain moiety in the side chain as a monomer component.
[Selection figure] None
Description
本発明は、アルコキシシリル基含有ビニル単量体のみをモノマー成分とする重合体と、アルコキシシリル基、環状エーテル基、及びε−カプロラクトン開環重合部位を含むヒドロキシル基含有基を有する共重合体とを含む硬化性樹脂組成物に関する。本発明の硬化性樹脂組成物は、塗料、コーティング剤、粘接着剤、電子材料用途(保護膜、封止材料、ナノインプリント用材料など)に有用である。 The present invention relates to a polymer comprising only an alkoxysilyl group-containing vinyl monomer as a monomer component, and a copolymer having an alkoxysilyl group, a cyclic ether group, and a hydroxyl group-containing group containing an ε-caprolactone ring-opening polymerization site. The present invention relates to a curable resin composition containing The curable resin composition of the present invention is useful for paints, coating agents, adhesives, and electronic materials (protective films, sealing materials, nanoimprint materials, etc.).
従来、熱や光により硬化して硬化塗膜を形成しうる組成物として、側鎖にエポキシ基を有する重合体を含む硬化性樹脂組成物、側鎖にイソシアネート基を有する重合体を含む硬化性樹脂組成物、アルコキシシラン基を含む重合体に、酸、塩基、有機金属触媒等を添加した硬化性樹脂組成物などが知られている。しかし、これらの硬化性樹脂組成物から得られる硬化塗膜では、硬化性、基材への密着性、耐薬品性、保存安定性等の要求性能をすべて満足させることはできない。 Conventionally, as a composition that can be cured by heat or light to form a cured coating film, a curable resin composition containing a polymer having an epoxy group in the side chain, a curable composition containing a polymer having an isocyanate group in the side chain A curable resin composition in which an acid, a base, an organometallic catalyst, or the like is added to a resin composition or a polymer containing an alkoxysilane group is known. However, cured films obtained from these curable resin compositions cannot satisfy all required performances such as curability, adhesion to a substrate, chemical resistance, and storage stability.
それを解決すべく、特開2007−223825号公報には、シランカップリング基等の反応性基を末端に有する高分子化合物と加水分解性の金属アルコキシド化合物とを含有する親水性塗布液組成物を調製し、それをガラス基板の表面に塗布、乾燥して表面親水性層を形成した耐熱ガラスが開示されている。この耐熱ガラスは、親水性を保持し、耐久性、透明性、保存安定性に優れた表面親水性層を備え、耐久性のある防汚性、防曇性を有するとされている。しかしながら、モノマー成分が複雑で、入手し難い単量体を用いる必要などがあった。 In order to solve this problem, Japanese Patent Application Laid-Open No. 2007-223825 discloses a hydrophilic coating liquid composition containing a polymer compound having a reactive group such as a silane coupling group at its terminal and a hydrolyzable metal alkoxide compound. A heat-resistant glass is disclosed in which a hydrophilic surface layer is formed by coating and drying it on the surface of a glass substrate. This heat-resistant glass is said to have a hydrophilic surface and a surface hydrophilic layer that is excellent in durability, transparency, and storage stability, and has durable antifouling properties and antifogging properties. However, the monomer component is complicated, and it is necessary to use a monomer that is difficult to obtain.
本発明者らは、モノマー成分がシンプルで、入手し易い単量体を用いて、耐溶剤性に優れるとともに、基材に対する密着性に優れた硬化物が得られる重合体として、アルコキシシリル基含有ビニル単量体のみをモノマー成分とする重合体を提案している。しかしながら、この重合体を含む組成物を硬化して得られる塗膜は、耐薬品性、特に耐アルカリ性についての性能が必ずしも充分でない。 The present inventors have a simple monomer component, an easily available monomer, an excellent solvent resistance, and a polymer that can provide a cured product with excellent adhesion to a substrate. A polymer having only a vinyl monomer as a monomer component is proposed. However, a coating film obtained by curing a composition containing this polymer does not always have sufficient chemical resistance, particularly alkali resistance performance.
従って、本発明の目的は、入手しやすい単量体から得られるポリマーを含み、基材に対する密着性に優れるとともに、耐熱性、耐薬品性(特に耐アルカリ性、耐溶剤性)に優れた硬化物の得られる硬化性樹脂組成物、及び該硬化性樹脂組成物を硬化して得られる硬化物を提供することにある。 Accordingly, an object of the present invention includes a polymer obtained from an easily available monomer, and has excellent adhesion to a substrate, and also has excellent heat resistance and chemical resistance (particularly alkali resistance and solvent resistance). It is in providing the curable resin composition obtained, and the hardened | cured material obtained by hardening | curing this curable resin composition.
本発明者らは、上記目的を達成するため鋭意検討した結果、アルコキシシリル基含有ビニル単量体のみをモノマー成分とする重合体と、アルコキシシリル基含有ビニル単量体と3〜5員の環状エーテル基を有するビニル単量体と側鎖にε−カプロラクトンを開環重合したヒドロキシル基含有ビニル単量体を単量体成分として含有する共重合体との混合物からなる硬化性樹脂組成物を基材に塗布して硬化させると、耐薬品性、耐溶剤性、耐アルカリ性に優れるとともに、特に基材に対する密着性に優れた硬化物の塗膜が得られることを見いだし、本発明を完成した。 As a result of intensive studies to achieve the above object, the present inventors have found that a polymer containing only an alkoxysilyl group-containing vinyl monomer as a monomer component, an alkoxysilyl group-containing vinyl monomer, and a 3- to 5-membered cyclic group. A curable resin composition comprising a mixture of a vinyl monomer having an ether group and a copolymer containing, as a monomer component, a hydroxyl group-containing vinyl monomer obtained by ring-opening polymerization of ε-caprolactone in the side chain. It was found that when applied to a material and cured, a coating film of a cured product having excellent chemical resistance, solvent resistance, and alkali resistance and particularly excellent adhesion to a substrate was found, and the present invention was completed.
すなわち、本発明は、下記式(1)
で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aのみをモノマー成分とする重合体Aと、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体a、3〜5員の環状エーテル基を有する一種又は複数種のビニル単量体b、及び側鎖にε−カプロラクトン開環重合鎖部を有する一種又は複数種のヒドロキシル基含有ビニル単量体cをモノマー成分として含有してなる共重合体Bとを含むことを特徴とする硬化性樹脂組成物を提供する。
That is, the present invention provides the following formula (1):
A polymer A containing only one or a plurality of alkoxysilyl group-containing vinyl monomers a represented by the formula (1), and one or a plurality of alkoxysilyl group-containing vinyl monomers represented by the formula (1) Body a, one or more kinds of vinyl monomers b having 3 to 5 membered cyclic ether groups, and one or more kinds of hydroxyl group-containing vinyl monomers having an ε-caprolactone ring-opening polymer chain moiety in the side chain A curable resin composition comprising a copolymer B containing c as a monomer component is provided.
この硬化性樹脂組成物において、重合体Aと共重合体Bとの含有比率が、重量比で、25:75〜75:25の範囲にあるのが好ましい。 In this curable resin composition, the content ratio of the polymer A and the copolymer B is preferably in the range of 25:75 to 75:25 by weight.
本発明は、また、前記の硬化性樹脂組成物を硬化して得られる硬化物を提供する。 The present invention also provides a cured product obtained by curing the curable resin composition.
本発明の硬化性樹脂組成物を硬化させることにより、耐薬品性、耐溶剤性、耐アルカリ性に優れるとともに、特に基材に対する密着性に優れた硬化物(硬化皮膜等)を得ることができる。また、本発明の硬化性樹脂組成物は硬化性及び保存安定性にも優れている。そのため、塗料、コーティング剤、粘接着剤等として利用でき、特に電子材料分野(保護膜、封止材料、ナノインプリント用材料など)で好適に使用できる。 By curing the curable resin composition of the present invention, it is possible to obtain a cured product (cured film or the like) that is excellent in chemical resistance, solvent resistance, and alkali resistance and particularly excellent in adhesion to a substrate. Moreover, the curable resin composition of this invention is excellent also in sclerosis | hardenability and storage stability. Therefore, it can be used as a paint, a coating agent, an adhesive, and the like, and can be suitably used particularly in the field of electronic materials (protective film, sealing material, nanoimprint material, etc.).
本発明の硬化性樹脂組成物は、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aのみをモノマー成分とする重合体Aと、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体a、3〜5員の環状エーテル基を有する一種又は複数種のビニル単量体b、及び側鎖にε−カプロラクトン開環重合鎖部を有する一種又は複数種のヒドロキシル基含有ビニル単量体cをモノマー成分として含有してなる共重合体Bとを含む。 The curable resin composition of the present invention includes a polymer A containing only one or a plurality of alkoxysilyl group-containing vinyl monomers a represented by the formula (1) as a monomer component, and the formula (1). One or more types of alkoxysilyl group-containing vinyl monomers a, one or more types of vinyl monomers b having a 3- to 5-membered cyclic ether group, and ε-caprolactone ring-opening polymer chain in the side chain And a copolymer B formed by containing one or more kinds of hydroxyl group-containing vinyl monomers c having a moiety as monomer components.
[重合体A]
重合体Aは式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aのみをモノマー成分としている。なお、本明細書において、単量体、モノマー成分というときは、重合反応に使用される重合開始剤、連鎖移動剤、及びそれらの分解物などは含まない。
[Polymer A]
The polymer A contains only one or a plurality of alkoxysilyl group-containing vinyl monomers a represented by the formula (1) as a monomer component. In the present specification, the term “monomer” or “monomer component” does not include a polymerization initiator, a chain transfer agent, or a decomposition product thereof used for the polymerization reaction.
式(1)で表されるアルコキシシリル基含有ビニル単量体aにおけるRaは水素原子又は炭素数1〜7のアルキル基を示し、Aは単結合又は2価の炭化水素基を示す。Rb、Rcは、同一又は異なって、炭素数1〜6のアルキル基、アリール基又は炭素数1〜6のアルコキシ基を示し、Rdは炭素数1〜6のアルキル基を示す。xは0又は1であり、yは1〜10の整数である。yが2〜10の整数の場合、y個のRb、Rcは、それぞれ、同一であっても異なっていてもよい。 In the alkoxysilyl group-containing vinyl monomer a represented by the formula (1), Ra represents a hydrogen atom or an alkyl group having 1 to 7 carbon atoms, and A represents a single bond or a divalent hydrocarbon group. R b and R c are the same or different and each represents an alkyl group having 1 to 6 carbon atoms, an aryl group or an alkoxy group having 1 to 6 carbon atoms, and R d represents an alkyl group having 1 to 6 carbon atoms. x is 0 or 1, and y is an integer of 1 to 10. When y is an integer of 2 to 10, y R b and R c may be the same or different.
Raにおける炭素数1〜7のアルキル基としては、例えば、メチル、エチル、プロピル、イソプロピル、ブチル、イソブチル、s−ブチル、ペンチル、ヘキシル、ヘプチル基等の直鎖状又は分岐鎖状アルキル基が挙げられる。これらのなかでも、メチル基、エチル基が好ましい。Raとしては、特に、水素原子又はメチル基が好ましい。 Examples of the alkyl group having 1 to 7 carbon atoms in R a include linear or branched alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, pentyl, hexyl, heptyl groups and the like. Can be mentioned. Among these, a methyl group and an ethyl group are preferable. R a is particularly preferably a hydrogen atom or a methyl group.
式(1)中、Aにおける2価の炭化水素基としては、例えば、メチレン、エチレン、プロピレン、テトラメチレン、エチルエチレン、ペンタメチレン、ヘキサメチレン等などの直鎖状又は分枝鎖状のアルキレン基;フェニレン基等のアリーレン基;シクロへキシレン基等のシクロアルキレン基;これらを2以上結合した基などが挙げられる。これらのなかでも、炭素数1〜6の直鎖状又は分岐鎖状アルキレン基が好ましく、特に、メチレン、エチレン、プロピレン基などの炭素数1〜3の直鎖状又は分枝鎖状アルキレン基が好ましい。 In the formula (1), examples of the divalent hydrocarbon group for A include linear or branched alkylene groups such as methylene, ethylene, propylene, tetramethylene, ethylethylene, pentamethylene, hexamethylene and the like. An arylene group such as a phenylene group; a cycloalkylene group such as a cyclohexylene group; a group in which two or more of these are bonded. Among these, a linear or branched alkylene group having 1 to 6 carbon atoms is preferable, and in particular, a linear or branched alkylene group having 1 to 3 carbon atoms such as methylene, ethylene, and propylene group. preferable.
Rb、Rc、Rdにおける炭素数1〜6のアルキル基としては、例えば、メチル、エチル、プロピル、イソプロピル、ブチル、イソブチル、s−ブチル、ペンチル、ヘキシル基等の直鎖状又は分岐鎖状アルキル基が挙げられる。これらのなかでも、メチル、エチル、プロピル、イソプロピル基等の炭素数1〜3の直鎖状又は分岐鎖状アルキル基が好ましい。 Examples of the alkyl group having 1 to 6 carbon atoms in R b , R c and R d include linear or branched chains such as methyl, ethyl, propyl, isopropyl, butyl, isobutyl, s-butyl, pentyl and hexyl groups. An alkyl group. Among these, a linear or branched alkyl group having 1 to 3 carbon atoms such as methyl, ethyl, propyl, and isopropyl groups is preferable.
Rb、Rcにおけるアリール基としては、例えば、フェニル、ナフチル基等が挙げられる。 Examples of the aryl group in R b and R c include phenyl and naphthyl groups.
Rb、Rcにおける炭素数1〜6のアルコキシル基としては、例えば、メトキシ、エトキシ、プロポキシ、イソプロポキシ、ブトキシ、イソブトキシ、s−ブトキシ、ペントキシ、ヘキシルオキシ基等の直鎖状又は分岐鎖状アルコキシル基が挙げられる。 Examples of the alkoxyl group having 1 to 6 carbon atoms in R b and R c include linear or branched chain such as methoxy, ethoxy, propoxy, isopropoxy, butoxy, isobutoxy, s-butoxy, pentoxy, hexyloxy group, etc. An alkoxyl group is mentioned.
式(1)で表されるアルコキシシリル基含有ビニル単量体aの代表的な例として、例えば、ビニルトリメトキシシラン、ビニルトリエトキシシラン、ビニルメチルジメトキシシラン、ビニルメチルジエトキシシラン、γ−(メタ)アクリロイルオキシプロピルトリメトキシシラン、γ−(メタ)アクリロイルオキシプロピルトリエトキシシラン、γ−(メタ)アクリロイルオキシプロピルメチルジメトキシシラン、γ−(メタ)アクリロイルオキシプロピルメチルジエトキシシラン、γ−(メタ)アクリロイルオキシプロピルトリエトキシシラン、β−(メタ)アクリロイルオキシエチルトリメトキシシラン、β−(メタ)アクリロイルオキシエチルトリエトキシシラン、γ−(メタ)アクリロイルオキシブチルフェニルジメトキシシラン、γ−(メタ)アクリロイルオキシブチルフェニルジエトキシシラン等のアルコキシシリル基含有重合性不飽和化合物等が挙げられ、これらから選択される1種又は2種以上を組み合わせて用いることができる。 As typical examples of the alkoxysilyl group-containing vinyl monomer a represented by the formula (1), for example, vinyltrimethoxysilane, vinyltriethoxysilane, vinylmethyldimethoxysilane, vinylmethyldiethoxysilane, γ- ( (Meth) acryloyloxypropyltrimethoxysilane, γ- (meth) acryloyloxypropyltriethoxysilane, γ- (meth) acryloyloxypropylmethyldimethoxysilane, γ- (meth) acryloyloxypropylmethyldiethoxysilane, γ- (meth) ) Acryloyloxypropyltriethoxysilane, β- (meth) acryloyloxyethyltrimethoxysilane, β- (meth) acryloyloxyethyltriethoxysilane, γ- (meth) acryloyloxybutylphenyldimethoxysilane, γ- ( Data) acryloyloxy-butylphenyl diethoxy silane alkoxysilyl group-containing polymerizable unsaturated compounds such as and the like, can be used singly or in combination of two or more kinds selected from these.
重合体Aは、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体のみからなるモノマー成分を重合に付すことにより得ることができる。重合方法の詳細については後述する。 The polymer A can be obtained by subjecting a monomer component consisting only of one or plural kinds of alkoxysilyl group-containing vinyl monomers represented by the formula (1) to polymerization. Details of the polymerization method will be described later.
重合体Aの重量平均分子量は、一般に500〜20000程度であるが、好ましくは700〜5000、さらに好ましくは2000〜5000である。重合体Aの重量平均分子量は、重合開始剤の種類や量、連鎖移動剤の種類や量などにより調整できる。重合体Aの分散度(重量平均分子量Mw/数平均分子量Mn)は1〜3程度であり、好ましくは1〜2.6である。 The weight average molecular weight of the polymer A is generally about 500 to 20000, preferably 700 to 5000, and more preferably 2000 to 5000. The weight average molecular weight of the polymer A can be adjusted by the kind and amount of the polymerization initiator, the kind and amount of the chain transfer agent, and the like. The degree of dispersion (weight average molecular weight Mw / number average molecular weight Mn) of the polymer A is about 1 to 3, and preferably 1 to 2.6.
例えば、重合開始剤の使用量を、全単量体成分100重量部に対して、例えば7〜30重量部程度、好ましくは10〜25重量部程度、より好ましくは10〜20重量部程度とすることにより、重量平均分子量が700〜5000である低分子量の重合体を再現性良く製造できる。重合開始剤の使用量が全単量体成分100重量部に対して、7重量部未満の場合には、得られる重合体Aの重量平均分子量が5000を超える場合が多く、また、得られる重合体Aの分散度が2.6を超えて、高分子量成分が多くなりやすく、この重合体を含む硬化性樹脂組成物を硬化したときには、基材との密着性が悪くなる傾向となる。一方、重合開始剤の使用量が全単量体成分100重量部に対して、30重量部超の場合には、反応終了後の系内の残留開始剤量が多くなるため、この重合体を含む硬化性樹脂組成物を基材に塗布して硬化したときには、塗膜の耐溶剤性が低下しやすくなる。また、加熱によって重合開始剤を分解処理すると、その加熱により高分子量の樹脂が生成し、結果としてこの重合体からなる硬化性樹脂組成物を基材に塗布して硬化したときに基材との密着性が悪くなる傾向となる。 For example, the amount of the polymerization initiator used is, for example, about 7 to 30 parts by weight, preferably about 10 to 25 parts by weight, and more preferably about 10 to 20 parts by weight with respect to 100 parts by weight of the total monomer components. Thus, a low molecular weight polymer having a weight average molecular weight of 700 to 5,000 can be produced with good reproducibility. When the amount of the polymerization initiator used is less than 7 parts by weight with respect to 100 parts by weight of the total monomer components, the weight average molecular weight of the obtained polymer A often exceeds 5000, and the resulting weight When the dispersion degree of the combined A exceeds 2.6 and the high molecular weight component tends to increase, when the curable resin composition containing this polymer is cured, the adhesion with the base material tends to deteriorate. On the other hand, when the amount of the polymerization initiator used is more than 30 parts by weight with respect to 100 parts by weight of the total monomer components, the amount of residual initiator in the system after the reaction is increased, When the curable resin composition containing is applied to a substrate and cured, the solvent resistance of the coating film tends to be lowered. Further, when the polymerization initiator is decomposed by heating, a high molecular weight resin is generated by the heating. As a result, when the curable resin composition comprising this polymer is applied to the substrate and cured, Adhesion tends to be poor.
[共重合体B]
共重合体Bは、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aに対応するモノマー単位、3〜5員の環状エーテル基を有する一種又は複数種のビニル単量体bに対応するモノマー単位、及び側鎖にε−カプロラクトン開環重合鎖部を有する一種又は複数種のヒドロキシル基含有ビニル単量体cに対応するモノマー単位を少なくとも含んでいる。
[Copolymer B]
The copolymer B is a monomer unit corresponding to one or more kinds of alkoxysilyl group-containing vinyl monomers a represented by the formula (1), and one or more kinds having a 3- to 5-membered cyclic ether group. It contains at least a monomer unit corresponding to the vinyl monomer b and a monomer unit corresponding to one or plural kinds of hydroxyl group-containing vinyl monomers c having an ε-caprolactone ring-opening polymerization chain portion in the side chain.
式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aとしては、前記のものを使用できる。 As the one or plural alkoxysilyl group-containing vinyl monomers a represented by the formula (1), those described above can be used.
共重合体Bにおいて、3〜5員の環状エーテル基を有するビニル単量体bには、オキシラン環(エポキシ基)含有重合性不飽和化合物、オキセタン環(オキセタニル基)含有重合性不飽和化合物、オキソラン環(オキソラニル基)含有重合性不飽和化合物が含まれる。 In the copolymer B, the vinyl monomer b having a 3- to 5-membered cyclic ether group includes an oxirane ring (epoxy group) -containing polymerizable unsaturated compound, an oxetane ring (oxetanyl group) -containing polymerizable unsaturated compound, An oxolane ring (oxolanyl group) -containing polymerizable unsaturated compound is included.
オキシラン環(エポキシ基)含有重合性不飽和化合物としては、例えば、オキシラニル(メタ)アクリレート、グリシジル(メタ)アクリレート、2−メチルグリシジル(メタ)アクリレート、2−エチルグリシジル(メタ)アクリレート、2−オキシラニルエチル(メタ)アクリレート、2−グリシジルオキシエチル(メタ)アクリレート、3−グリシジルオキシプロピル(メタ)アクリレート、グリシジルオキシフェニル(メタ)アクリレート等のオキシラン環(単環)を含む重合性不飽和化合物((メタ)アクリル酸エステル誘導体など);3,4−エポキシシクロヘキシル(メタ)アクリレート、3,4−エポキシシクロヘキシルメチル(メタ)アクリレート、2−(3,4−エポキシシクロヘキシル)エチル(メタ)アクリレート、2−(3,4−エポキシシクロヘキシルメチルオキシ)エチル(メタ)アクリレート、3−(3,4−エポキシシクロヘキシルメチルオキシ)プロピル(メタ)アクリレートなどの3,4−エポキシシクロヘキサン環等のエポキシ基含有脂環式炭素環を含む重合性不飽和化合物((メタ)アクリル酸エステル誘導体など);5,6−エポキシ−2−ビシクロ[2.2.1]ヘプチル(メタ)アクリレート等の5,6−エポキシ−2−ビシクロ[2.2.1]ヘプタン環を含む重合性不飽和化合物((メタ)アクリル酸エステル誘導体など);エポキシ化ジシクロペンテニル(メタ)アクリレート[3,4−エポキシトリシクロ[5.2.1.02,6]デカン−9−イル(メタ)アクリレート;3,4−エポキシトリシクロ[5.2.1.02,6]デカン−8−イル(メタ)アクリレート]、エポキシ化ジシクロペンテニルオキシエチル(メタ)アクリレート[2−(3,4−エポキシトリシクロ[5.2.1.02,6]デカン−9−イルオキシ)エチル(メタ)アクリレート;2−(3,4−エポキシトリシクロ[5.2.1.02,6]デカン−8−イルオキシ)エチル(メタ)アクリレート]、エポキシ化ジシクロペンテニルオキシブチル(メタ)アクリレート、エポキシ化ジシクロペンテニルオキシヘキシル(メタ)アクリレートなどの3,4−エポキシトリシクロ[5.2.1.02,6]デカン環を含む重合性不飽和化合物((メタ)アクリル酸エステル誘導体など)などが挙げられる。他のオキシラン環(エポキシ基)含有重合性不飽和化合物として、エポキシ基を含むビニルエーテル化合物、エポキシ基を含むアリルエーテル化合物等を用いることもできる。 Examples of the oxirane ring (epoxy group) -containing polymerizable unsaturated compound include oxiranyl (meth) acrylate, glycidyl (meth) acrylate, 2-methylglycidyl (meth) acrylate, 2-ethylglycidyl (meth) acrylate, and 2-oxy Polymerizable unsaturated compounds containing an oxirane ring (monocyclic) such as ranylethyl (meth) acrylate, 2-glycidyloxyethyl (meth) acrylate, 3-glycidyloxypropyl (meth) acrylate, glycidyloxyphenyl (meth) acrylate, etc. ((Meth) acrylic acid ester derivatives, etc.); 3,4-epoxycyclohexyl (meth) acrylate, 3,4-epoxycyclohexylmethyl (meth) acrylate, 2- (3,4-epoxycyclohexyl) ethyl (meth) acrylate Epoxy group-containing fats such as 3,4-epoxycyclohexane rings such as 2- (3,4-epoxycyclohexylmethyloxy) ethyl (meth) acrylate and 3- (3,4-epoxycyclohexylmethyloxy) propyl (meth) acrylate Polymerizable unsaturated compounds containing a cyclic carbocycle (such as (meth) acrylic acid ester derivatives); 5,6-epoxy such as 5,6-epoxy-2-bicyclo [2.2.1] heptyl (meth) acrylate Polymerizable unsaturated compounds containing a 2-bicyclo [2.2.1] heptane ring (such as (meth) acrylic acid ester derivatives); epoxidized dicyclopentenyl (meth) acrylate [3,4-epoxytricyclo [5] .2.1.0 2,6 ] decan-9-yl (meth) acrylate; 3,4-epoxytricyclo [5.2.1.0 2, 6] decan-8-yl (meth) acrylate], epoxidized dicyclopentenyloxyethyl (meth) acrylate [2- (3,4-epoxytricyclo [5.2.1.0 2,6] decane -9 -Yloxy) ethyl (meth) acrylate; 2- (3,4-epoxytricyclo [5.2.1.0 2,6 ] decan-8-yloxy) ethyl (meth) acrylate], epoxidized dicyclopentenyloxy Polymerizable unsaturated compounds containing a 3,4-epoxytricyclo [5.2.1.0 2,6 ] decane ring such as butyl (meth) acrylate and epoxidized dicyclopentenyloxyhexyl (meth) acrylate ((meta ) Acrylic acid ester derivatives, etc.). As another oxirane ring (epoxy group) -containing polymerizable unsaturated compound, a vinyl ether compound containing an epoxy group, an allyl ether compound containing an epoxy group, or the like can also be used.
オキセタン環(オキセタニル基)含有重合性不飽和化合物としては、例えば、オキセタニル(メタ)アクリレート、3−メチル−3−オキセタニル(メタ)アクリレート、3−エチル−3−オキセタニル(メタ)アクリレート、(3−メチル−3−オキセタニル)メチル(メタ)アクリレート、(3−エチル−3−オキセタニル)メチル(メタ)アクリレート、2−(3−メチル−3−オキセタニル)エチル(メタ)アクリレート、2−(3−エチル−3−オキセタニル)エチル(メタ)アクリレート、2−[(3−メチル−3−オキセタニル)メチルオキシ]エチル(メタ)アクリレート、2−[(3−エチル−3−オキセタニル)メチルオキシ]エチル(メタ)アクリレート、3−[(3−メチル−3−オキセタニル)メチルオキシ]プロピル(メタ)アクリレート、3−[(3−エチル−3−オキセタニル)メチルオキシ]プロピル(メタ)アクリレートや、オキセタニル基を含むビニルエーテル化合物、オキセタニル基を含むアリルエーテル化合物などが挙げられる。 Examples of the oxetane ring (oxetanyl group) -containing polymerizable unsaturated compound include oxetanyl (meth) acrylate, 3-methyl-3-oxetanyl (meth) acrylate, 3-ethyl-3-oxetanyl (meth) acrylate, (3- Methyl-3-oxetanyl) methyl (meth) acrylate, (3-ethyl-3-oxetanyl) methyl (meth) acrylate, 2- (3-methyl-3-oxetanyl) ethyl (meth) acrylate, 2- (3-ethyl -3-Oxetanyl) ethyl (meth) acrylate, 2-[(3-methyl-3-oxetanyl) methyloxy] ethyl (meth) acrylate, 2-[(3-ethyl-3-oxetanyl) methyloxy] ethyl (meta ) Acrylate, 3-[(3-Methyl-3-oxetanyl) methyloxy] propyl Pill (meth) acrylate, 3 - and [(3-ethyl-3-oxetanyl) methyloxy] propyl (meth) acrylate, vinyl ether compounds containing oxetanyl group, and allyl ether compounds containing oxetanyl group.
オキソラン環(オキソラニル基)含有重合性不飽和化合物としては、例えば、テトラヒドロフルフリル(メタ)アクリレートや、オキソラニル基を含むビニルエーテル化合物、オキソラニル基を含むアリルエーテル化合物などが挙げられる。 Examples of the oxolane ring (oxolanyl group) -containing polymerizable unsaturated compound include tetrahydrofurfuryl (meth) acrylate, vinyl ether compounds containing an oxolanyl group, and allyl ether compounds containing an oxolanyl group.
共重合体Bにおいて、3〜5員の環状エーテル基[オキシラン環(エポキシ基)、オキセタン環(オキセタニル基)、オキソラン環(オキソラニル基)]は硬化性基として作用する。3〜5員の環状エーテル基は、主に耐薬品性(耐溶剤性、耐アルカリ性等)の向上に寄与する。 In the copolymer B, a 3- to 5-membered cyclic ether group [oxirane ring (epoxy group), oxetane ring (oxetanyl group), oxolane ring (oxolanyl group)] acts as a curable group. The 3- to 5-membered cyclic ether group mainly contributes to improvement of chemical resistance (solvent resistance, alkali resistance, etc.).
ビニル単量体bとしては、なかでもオキシラン環(エポキシ基)含有重合性不飽和化合物が好ましく、特に、エポキシ基が脂環式炭素環(単環又は多環)上に形成されている脂環式エポキシ基を含むビニル単量体が好ましい。 As the vinyl monomer b, an oxirane ring (epoxy group) -containing polymerizable unsaturated compound is preferable, and in particular, an alicyclic ring in which an epoxy group is formed on an alicyclic carbocycle (monocyclic or polycyclic). Vinyl monomers containing a formula epoxy group are preferred.
共重合体Bにおいて、側鎖にε−カプロラクトン開環重合鎖部を有するヒドロキシル基含有ビニル単量体cとしては、例えば、多価アルコールとアクリル酸又はメタクリル酸とのモノエステル化物[例えば、2−ヒドロキシエチル(メタ)アクリレート、2−ヒドロキシプロピル(メタ)アクリレート、3−ヒドロキシプロピル(メタ)アクリレート、4−ヒドロキシブチル(メタ)アクリレート、6−ヒドロキシヘキシル(メタ)アクリレートなど]にε−カプロラクトンを開環重合した化合物(6−ヘキサノリド付加重合物、ε−カプロラクトンの重合度1〜6程度)を挙げることができる。 In the copolymer B, examples of the hydroxyl group-containing vinyl monomer c having an ε-caprolactone ring-opening polymerization chain moiety in the side chain include monoesterified products of polyhydric alcohol and acrylic acid or methacrylic acid [for example, 2 -Hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, etc.] Examples thereof include ring-opened polymerization compounds (6-hexanolide addition polymer, degree of polymerization of ε-caprolactone of about 1 to 6).
側鎖にε−カプロラクトン開環重合鎖部を有するヒドロキシル基含有ビニル単量体cの代表的な例として、2−ヒドロキシエチル(メタ)アクリレートの6−ヘキサノリド付加重合物(重合度1〜6)(ダイセル化学工業株式会社製のプラクセルFAシリーズ、プラクセルFMシリーズ等)などが挙げられる。 As a representative example of the hydroxyl group-containing vinyl monomer c having an ε-caprolactone ring-opening polymerization chain portion in the side chain, a 6-hexanolide addition polymer of 2-hydroxyethyl (meth) acrylate (degree of polymerization 1 to 6) (Plaxel FA series, Plaxel FM series, etc. manufactured by Daicel Chemical Industries, Ltd.).
共重合体Bにおいて、側鎖にε−カプロラクトン開環重合鎖部を有するヒドロキシル基含有ビニル単量体cに対応するモノマー単位は、主に、タックフリーでの柔軟性付与や溶媒への溶解性の向上、他原料との相溶性の向上に寄与する。 In the copolymer B, the monomer unit corresponding to the hydroxyl group-containing vinyl monomer c having an ε-caprolactone ring-opening polymerization chain portion in the side chain mainly includes tack-free flexibility and solubility in a solvent. This contributes to improving the compatibility with other raw materials.
共重合体Bにおいて、ビニル単量体aに対応するモノマー単位、ビニル単量体bに対応するモノマー単位及びビニル単量体cに対応するモノマー単位は、それぞれ、1種であってもよく、2種以上存在していてもよい。 In the copolymer B, the monomer unit corresponding to the vinyl monomer a, the monomer unit corresponding to the vinyl monomer b, and the monomer unit corresponding to the vinyl monomer c may each be one kind, Two or more kinds may be present.
ビニル単量体aに対応するモノマー単位の共重合体Bに占める割合は、共重合体Bを構成する全モノマー単位に対して、例えば1〜95重量%、好ましくは10〜90重量%、さらに好ましくは20〜85重量%である。 The proportion of the monomer unit corresponding to the vinyl monomer a in the copolymer B is, for example, 1 to 95% by weight, preferably 10 to 90% by weight, based on all the monomer units constituting the copolymer B. Preferably, it is 20 to 85% by weight.
ビニル単量体bに対応するモノマー単位の共重合体Bに占める割合は、共重合体Bを構成する全モノマー単位に対して、例えば1〜95重量%、好ましくは5〜80重量%、さらに好ましくは12〜70重量%である。 The proportion of the monomer unit corresponding to the vinyl monomer b in the copolymer B is, for example, 1 to 95% by weight, preferably 5 to 80% by weight, based on all monomer units constituting the copolymer B. Preferably it is 12 to 70% by weight.
ビニル単量体cに対応するモノマー単位の共重合体Bに占める割合は、共重合体Bを構成する全モノマー単位に対して、例えば0.1〜95重量%、好ましくは0.2〜50重量%、さらに好ましくは0.2〜30重量%である。 The proportion of the monomer unit corresponding to the vinyl monomer c in the copolymer B is, for example, 0.1 to 95% by weight, preferably 0.2 to 50%, based on all monomer units constituting the copolymer B. % By weight, more preferably 0.2 to 30% by weight.
ビニル単量体aに対応するモノマー単位とビニル単量体bに対応するモノマー単位とビニル単量体cに対応するモノマー単位の総和の共重合体Bに占める割合は、共重合体Bを構成する全モノマー単位に対して、例えば40重量%〜100重量%、好ましくは50〜100重量%、さらに好ましくは60〜100重量%、特に好ましくは80〜100重量%である。 The proportion of the monomer unit corresponding to the vinyl monomer a, the monomer unit corresponding to the vinyl monomer b, and the monomer unit corresponding to the vinyl monomer c to the copolymer B constitutes the copolymer B For example, it is 40 to 100% by weight, preferably 50 to 100% by weight, more preferably 60 to 100% by weight, and particularly preferably 80 to 100% by weight, based on the total monomer units.
共重合体Bは、ビニル単量体aに対応するモノマー単位とビニル単量体bに対応するモノマー単位とビニル単量体cに対応するモノマー単位のみで構成されていてもよいが、ビニル単量体aに対応するモノマー単位、ビニル単量体bに対応するモノマー単位及びビニル単量体cに対応に対応するモノマー単位に加えて、他のモノマー単位を含んでいてもよい。他のモノマー単位としては、ビニル単量体a、ビニル単量体b及びビニル単量体cと共重合可能な重合性単量体に対応するモノマー単位であって、基材に対する密着性及び耐薬品性を損なわないような構造単位であれば特に限定されない。 The copolymer B may be composed of only a monomer unit corresponding to the vinyl monomer a, a monomer unit corresponding to the vinyl monomer b, and a monomer unit corresponding to the vinyl monomer c. In addition to the monomer unit corresponding to the monomer a, the monomer unit corresponding to the vinyl monomer b, and the monomer unit corresponding to the vinyl monomer c, other monomer units may be included. The other monomer unit is a monomer unit corresponding to a polymerizable monomer copolymerizable with vinyl monomer a, vinyl monomer b, and vinyl monomer c, and has adhesion and resistance to a substrate. It is not particularly limited as long as it is a structural unit that does not impair the chemical properties.
このような共重合体Bが含んでいてもよい他のモノマー単位を形成しうる単量体として、(メタ)アクリル酸アルキルエステル、(メタ)アクリル酸シクロアルキルエステル、(メタ)アクリル酸アリールエステル、(メタ)アクリル酸アラルキルエステル、芳香族ビニル化合物、ヒドロキシル基含有単量体[(メタ)アクリル酸ヒドロキシアルキルエステル]、カルボキシル基又は酸無水物基含有単量体が挙げられる。これらの単量体は単独で又は2種以上を組み合わせて使用できる。 As monomers that can form other monomer units that may be contained in such a copolymer B, (meth) acrylic acid alkyl ester, (meth) acrylic acid cycloalkyl ester, (meth) acrylic acid aryl ester (Meth) acrylic acid aralkyl ester, aromatic vinyl compound, hydroxyl group-containing monomer [(meth) acrylic acid hydroxyalkyl ester], carboxyl group or acid anhydride group-containing monomer. These monomers can be used alone or in combination of two or more.
共重合体Bの重量平均分子量は、例えば500〜100000、好ましくは1000〜40000、さらに好ましくは2000〜30000程度である。共重合体Bの分散度(重量平均分子量Mw/数平均分子量Mn)は1〜3程度である。 The weight average molecular weight of the copolymer B is, for example, 500 to 100,000, preferably 1000 to 40000, and more preferably about 2000 to 30000. The degree of dispersion (weight average molecular weight Mw / number average molecular weight Mn) of the copolymer B is about 1 to 3.
[重合方法]
重合体Aは、前記のように、式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体のみからなるモノマー成分を重合に付すことにより製造できる。また、共重合体Bは、式(1)で表されるアルコキシシリル基含有ビニル単量体aと、3〜5員の環状エーテル基を有するビニル単量体bと、側鎖にε−カプロラクトン開環重合鎖部を有するヒドロキシル基含有ビニル単量体cと、必要に応じて他の共重合性単量体とを含む単量体混合物を重合(共重合)に付すことにより製造できる。
[Polymerization method]
As described above, the polymer A can be produced by subjecting a monomer component consisting only of one or plural kinds of alkoxysilyl group-containing vinyl monomers represented by the formula (1) to polymerization. The copolymer B is composed of an alkoxysilyl group-containing vinyl monomer a represented by the formula (1), a vinyl monomer b having a 3- to 5-membered cyclic ether group, and ε-caprolactone in the side chain. It can be produced by subjecting a monomer mixture containing a hydroxyl group-containing vinyl monomer c having a ring-opening polymer chain portion and another copolymerizable monomer as necessary to polymerization (copolymerization).
重合に用いられる重合開始剤としては、通常のラジカル開始剤が使用できる。例えば、2,2′−アゾビスイソブチロニトリル、2,2′−アゾビス(2,4−ジメチルバレロニトリル)、2,2′−アゾビス(4−メトキシ−2,4−ジメチルバレロニトリル)、ジメチル−2,2′−アゾビス(2−メチルプロピオネート)、2,2−アゾビス(イソ酪酸)ジメチル、ジエチル−2,2′−アゾビス(2−メチルプロピオネート)、ジブチル−2,2′−アゾビス(2−メチルプロピオネート)等のアゾ化合物、ベンゾイルペルオキシド、ラウロイルペルオキシド、t−ブチルペルオキシピバレート、t−ブチルペルオキシオクトエート、1,1−ビス(t−ブチルペルオキシ)シクロヘキサン等の有機過酸化物、過酸化水素などが挙げられる。過酸化物をラジカル重合開始剤として使用する場合、還元剤を組み合わせてレドックス型の開始剤としてもよい。上記のなかでもアゾ化合物が好ましく、特に、2,2′−アゾビスイソブチロニトリル、2,2′−アゾビス(2,4−ジメチルバレロニトリル)、2,2−アゾビス(イソ酪酸)ジメチルが好ましい。 As the polymerization initiator used for polymerization, a normal radical initiator can be used. For example, 2,2'-azobisisobutyronitrile, 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (4-methoxy-2,4-dimethylvaleronitrile), Dimethyl-2,2'-azobis (2-methylpropionate), 2,2-azobis (isobutyric acid) dimethyl, diethyl-2,2'-azobis (2-methylpropionate), dibutyl-2,2 Azo compounds such as' -azobis (2-methylpropionate), benzoyl peroxide, lauroyl peroxide, t-butylperoxypivalate, t-butylperoxyoctoate, 1,1-bis (t-butylperoxy) cyclohexane, etc. An organic peroxide, hydrogen peroxide, etc. are mentioned. When a peroxide is used as a radical polymerization initiator, a redox initiator may be combined with a reducing agent. Of these, azo compounds are preferred, and in particular, 2,2′-azobisisobutyronitrile, 2,2′-azobis (2,4-dimethylvaleronitrile), and 2,2-azobis (isobutyric acid) dimethyl. preferable.
重合開始剤の使用量は、円滑な共重合を損なわない範囲で適宜選択できるが、通常、全単量体成分及び重合開始剤の総量に対して、1〜30重量%程度であり、好ましくは5〜25重量%程度である。 The amount of the polymerization initiator used can be appropriately selected within a range that does not impair smooth copolymerization, but is usually about 1 to 30% by weight, preferably based on the total amount of all monomer components and polymerization initiator. It is about 5 to 25% by weight.
重合に際しては、ラジカル重合において一般的に使用されている連鎖移動剤を併用してもよい。具体例としては、チオール類(n−ドデシルメルカプタン、n−オクチルメルカプタン、n−ブチルメルカプタン、tert−ブチルメルカプタン、n−ラウリルメルカプタン、メルカプトエタノール、メルカプトプロパノール、トリエチレングリコールジメルカプタン等)、チオール酸類(メルカプトプロピオン酸、チオ安息香酸、チオグリコール酸、チオリンゴ酸、メルカプト酢酸2−エチルヘキシル等)、アルコール類(イソプロピルアルコール等)、アミン類(ジブチルアミン等)、次亜燐酸塩類(次亜燐酸ナトリウム等)、α−メチルスチレンダイマー、タービノーレン、ミルセン、リモネン、α−ピネン、β−ピネン等を挙げることができ、連鎖移動剤の量は全ラジカル重合性単量体の量に対して、好ましくは0.001〜3重量%である。連鎖移動剤を使用する場合は、予め重合性ビニル単量体に混合させておくことが好ましい。 In the polymerization, a chain transfer agent generally used in radical polymerization may be used in combination. Specific examples include thiols (such as n-dodecyl mercaptan, n-octyl mercaptan, n-butyl mercaptan, tert-butyl mercaptan, n-lauryl mercaptan, mercaptoethanol, mercaptopropanol, triethylene glycol dimercaptan). Mercaptopropionic acid, thiobenzoic acid, thioglycolic acid, thiomalic acid, 2-ethylhexyl mercaptoacetate), alcohols (isopropyl alcohol, etc.), amines (dibutylamine, etc.), hypophosphites (sodium hypophosphite, etc.) , Α-methylstyrene dimer, terbinolene, myrcene, limonene, α-pinene, β-pinene and the like, and the amount of the chain transfer agent is preferably 0. 001-3 weight It is. When using a chain transfer agent, it is preferable to mix with a polymerizable vinyl monomer in advance.
重合は、溶液重合、塊状重合、懸濁重合、塊状−懸濁重合、乳化重合など、スチレン系ポリマーやアクリル系ポリマーを製造する際に用いる慣用の方法により行うことができる。これらのなかでも溶液重合が好ましい。モノマー、重合開始剤は、それぞれ、反応系に一括供給してもよく、その一部又は全部を反応系に滴下してもよい。例えば、一定温度に保持したモノマーと重合溶媒の混合液中に、重合開始剤を重合溶媒に溶解した溶液を滴下して重合する方法や、予め単量体、重合開始剤を重合溶媒に溶解させた溶液を、一定温度に保持した重合溶媒中に滴下して重合する方法(滴下重合法)などを採用できる。 The polymerization can be performed by a conventional method used for producing a styrene polymer or an acrylic polymer, such as solution polymerization, bulk polymerization, suspension polymerization, bulk-suspension polymerization, and emulsion polymerization. Among these, solution polymerization is preferable. The monomer and the polymerization initiator may be supplied all at once to the reaction system, or a part or all of them may be dropped into the reaction system. For example, a method in which a solution in which a polymerization initiator is dissolved in a polymerization solvent is dropped into a mixed solution of a monomer and a polymerization solvent kept at a constant temperature, or the monomer and the polymerization initiator are dissolved in the polymerization solvent in advance. A method in which the solution is dropped into a polymerization solvent maintained at a constant temperature for polymerization (drop polymerization method) can be employed.
重合溶媒は単量体組成等に応じて適宜選択できる。重合溶媒として、例えば、エーテル(ジエチルエーテル;エチレングリコールモノ又はジアルキルエーテル、ジエチレングリコールモノ又はジアルキルエーテル、プロピレングリコールモノ又はジアルキルエーテル、プロピレングリコールモノ又はジアリールエーテル、ジプロピレングリコールモノ又はジアルキルエーテル、トリプロピレングリコールモノ又はジアルキルエーテル、1,3−プロパンジオールモノ又はジアルキルエーテル、1,3−ブタンジオールモノ又はジアルキルエーテル、1,4−ブタンジオールモノ又はジアルキルエーテル、グリセリンモノ,ジ又はトリアルキルエーテル等のグリコールエーテル類などの鎖状エーテル;テトラヒドロフラン、ジオキサン等の環状エーテルなど)、エステル(酢酸メチル、酢酸エチル、酢酸ブチル、酢酸イソアミル、乳酸エチル、3−メトキシプロピオン酸メチル、3−エトキシプロピオン酸エチル、C5-6シクロアルカンジオールモノ又はジアセテート、C5-6シクロアルカンジメタノールモノ又はジアセテート等のカルボン酸エステル類;エチレングリコールモノアルキルエーテルアセテート、エチレングリコールモノ又はジアセテート、ジエチレングリコールモノアルキルエーテルアセテート、ジエチレングリコールモノ又はジアセテート、プロピレングリコールモノアルキルエーテルアセテート、プロピレングリコールモノ又はジアセテート、ジプロピレングリコールモノアルキルエーテルアセテート、ジプロピレングリコールモノ又はジアセテート、1,3−プロパンジオールモノアルキルエーテルアセテート、1,3−プロパンジオールモノ又はジアセテート、1,3−ブタンジオールモノアルキルエーテルアセテート、1,3−ブタンジオールモノ又はジアセテート、1,4−ブタンジオールモノアルキルエーテルアセテート、1,4−ブタンジオールモノ又はジアセテート、グリセリンモノ,ジ又はトリアセテート、グリセリンモノ又はジC1-4アルキルエーテルジ又はモノアセテート、トリプロピレングリコールモノアルキルエーテルアセテート、トリプロピレングリコールモノ又はジアセテート等のグリコールアセテート類又はグリコールエーテルアセテート類など)、ケトン(アセトン、メチルエチルケトン、メチルイソブチルケトン、シクロヘキサノン、3,5,5−トリメチル−2−シクロヘキセン−1−オンなど)、アミド(N,N−ジメチルアセトアミド、N,N−ジメチルホルムアミドなど)、スルホキシド(ジメチルスルホキシドなど)、アルコール(メタノール、エタノール、プロパノール、C5-6シクロアルカンジオール、C5-6シクロアルカンジメタノールなど)、炭化水素(ベンゼン、トルエン、キシレン等の芳香族炭化水素、ヘキサン等の脂肪族炭化水素、シクロヘキサン等の脂環式炭化水素など)、これらの混合溶媒などが挙げられる。重合温度は、例えば30〜150℃程度の範囲で適宜選択できる。 The polymerization solvent can be appropriately selected according to the monomer composition and the like. As a polymerization solvent, for example, ether (diethyl ether; ethylene glycol mono or dialkyl ether, diethylene glycol mono or dialkyl ether, propylene glycol mono or dialkyl ether, propylene glycol mono or diaryl ether, dipropylene glycol mono or dialkyl ether, tripropylene glycol mono Or glycol ethers such as dialkyl ether, 1,3-propanediol mono or dialkyl ether, 1,3-butanediol mono or dialkyl ether, 1,4-butanediol mono or dialkyl ether, glycerol mono, di or trialkyl ether Chain ethers such as tetrahydrofuran, cyclic ethers such as dioxane, etc.), esters (methyl acetate, ethyl acetate) , Butyl acetate, isoamyl acetate, ethyl lactate, methyl 3-methoxypropionate, ethyl 3-ethoxypropionate, C 5-6 cycloalkane diol mono- or diacetate, C 5-6, such as cycloalkane monovinyl or diacetate Carboxylic acid esters; ethylene glycol monoalkyl ether acetate, ethylene glycol mono or diacetate, diethylene glycol monoalkyl ether acetate, diethylene glycol mono or diacetate, propylene glycol monoalkyl ether acetate, propylene glycol mono or diacetate, dipropylene glycol monoalkyl Ether acetate, dipropylene glycol mono- or diacetate, 1,3-propanediol monoalkyl ether acetate, 1 , 3-propanediol mono or diacetate, 1,3-butanediol monoalkyl ether acetate, 1,3-butanediol mono or diacetate, 1,4-butanediol monoalkyl ether acetate, 1,4-butanediol mono or diacetate, glycerol mono-, di- or triacetate, glycerin mono- or di-C 1-4 alkyl ethers di- or mono-acetate, tripropylene glycol monoalkyl ether acetates, glycol acetates or glycol ether acetates, such as tripropylene glycol mono or diacetate ), Ketones (acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclohexanone, 3,5,5-trimethyl-2-cyclohexen-1-one, etc.), amides (N, N-di) Methylacetamide, N, N-dimethylformamide, etc.), sulfoxide (dimethylsulfoxide, etc.), alcohol (methanol, ethanol, propanol, C5-6 cycloalkanediol, C5-6 cycloalkanedimethanol, etc.), hydrocarbon (benzene) , Aromatic hydrocarbons such as toluene and xylene, aliphatic hydrocarbons such as hexane, alicyclic hydrocarbons such as cyclohexane, and the like, and mixed solvents thereof. The polymerization temperature can be appropriately selected within a range of about 30 to 150 ° C., for example.
上記方法により重合体A、共重合体Bがそれぞれ生成する。 Polymer A and copolymer B are produced by the above method.
上記方法で得られた重合体Aを含む重合液、共重合体Bを含む重合液は、それぞれ、必要に応じて固形分濃度を調整したり、溶媒交換したり、濾過処理を施した後、適宜の割合で混合し、さらに必要に応じて、硬化触媒[熱酸発生剤(熱硬化触媒、熱カチオン重合開始剤)、光酸発生剤(光硬化触媒、光カチオン重合開始剤)]、硬化剤、硬化促進剤、添加剤(充填剤、消泡剤、難燃剤、酸化防止剤、紫外線吸収剤、低応力化剤、可とう性付与剤、ワックス類、樹脂、架橋剤、ハロゲントラップ剤、レベリング剤、濡れ改良剤など)を配合することにより、硬化性樹脂組成物を得ることができる。また、重合により生成したポリマーを沈殿又は再沈殿等により精製し、この精製したポリマーを適宜な溶媒に溶解した溶液を硬化性樹脂組成物の調製に用いることもできる。 The polymer solution containing the polymer A obtained by the above method and the polymer solution containing the copolymer B are each adjusted for solids concentration as necessary, solvent exchange, or after filtration treatment, Mix at an appropriate ratio, and if necessary, curing catalyst [thermal acid generator (thermal curing catalyst, thermal cationic polymerization initiator), photoacid generator (photocuring catalyst, photocationic polymerization initiator)], curing Agent, curing accelerator, additive (filler, antifoaming agent, flame retardant, antioxidant, UV absorber, stress reducing agent, flexibility imparting agent, wax, resin, crosslinking agent, halogen trapping agent, A curable resin composition can be obtained by blending a leveling agent, a wetting improver, and the like. Moreover, the polymer produced | generated by superposition | polymerization can be refine | purified by precipitation or reprecipitation etc., and the solution which melt | dissolved this refined polymer in a suitable solvent can also be used for preparation of curable resin composition.
本発明の硬化性樹脂組成物において、重合体Aと共重合体Bとの含有比率(前者:後者)は広い範囲で選択できるが、一般には、重量比で、5:95〜95:5、好ましくは25:75〜75:25、さらに好ましくは30:70〜70:30である。このような条件を満足することにより、硬化性樹脂組成物を硬化させて得られる硬化物の耐薬品性、耐溶剤性、耐アルカリ性を優れたものとし、且つ基材に対する密着性を特に優れたものとすることができる。 In the curable resin composition of the present invention, the content ratio of the polymer A and the copolymer B (the former: the latter) can be selected in a wide range, but in general, the weight ratio is 5:95 to 95: 5, Preferably it is 25: 75-75: 25, More preferably, it is 30: 70-70: 30. By satisfying such conditions, the cured product obtained by curing the curable resin composition has excellent chemical resistance, solvent resistance, and alkali resistance, and particularly excellent adhesion to the substrate. Can be.
前記硬化触媒のうち、熱酸発生剤としては、例えば、サンエイドSI−45、同左SI−47、同左SI−60、同左SI−60L、同左SI−80、同左SI−80L、同左SI−100、同左SI−100L、同左SI−145、同左SI−150、同左SI−160、同左SI−110L、同左SI−180L(以上、三新化学工業社製品、商品名)、CI−2921、CI−2920、CI−2946、CI−3128、CI−2624、CI−2639、CI−2064(以上、日本曹達(株)社製品、商品名)、CP−66、CP−77(旭電化工業社製品、商品名)、FC−520(3M社製品、商品名)などに代表されるジアゾニウム塩、ヨードニウム塩、スルホニウム塩、ホスホニウム塩、セレニウム塩、オキソニウム塩、アンモニウム塩等を使用できる。 Among the curing catalysts, as the thermal acid generator, for example, Sun-Aid SI-45, Same as left SI-47, Same as left SI-60, Same as left SI-60L, Same as left SI-80, Same as left SI-80L, Same as left SI-100, Same as SI-100L, Same as left SI-145, Same as left SI-150, Same as left SI-160, Same as left SI-110L, Same as left SI-180L (above, Sanshin Chemical Co., Ltd., product name), CI-2921, CI-2920 CI-2946, CI-3128, CI-2624, CI-2638, CI-2064 (product of Nippon Soda Co., Ltd., product name), CP-66, CP-77 (product of Asahi Denka Kogyo Co., Ltd., product) Name), FC-520 (product of 3M, product name), diazonium salt, iodonium salt, sulfonium salt, phosphonium salt, selenium salt, oxonium salt Ammonium salts, and the like can be used.
光酸発生剤としては、例えば、サイラキュアUVI−6970、サイラキュアUVI−6974、サイラキュアUVI−6990、サイラキュアUVI−950(以上、米国ユニオンカーバイド社製、商品名)、イルガキュア261(チバ・スペシャルティ・ケミカルズ社製、商品名)、SP−150、SP−151、SP−170、オプトマーSP−171(以上、旭電化工業株式会社製、商品名)、CG−24−61(チバ・スペシャルティ・ケミカルズ社製、商品名)、DAICATII(ダイセル化学工業社製、商品名)、UVAC1591(ダイセル・サイテック(株)社製、商品名)、CI−2064、CI−2639、CI−2624、CI−2481、CI−2734、CI−2855、CI−2823、CI−2758(以上、日本曹達社製品、商品名)、PI−2074(ローヌプーラン社製、商品名、ペンタフルオロフェニルボレートトルイルクミルヨードニウム塩)、FFC509(3M社製品、商品名)、BBI−102、BBI−101、BBI−103、MPI−103、TPS−103、MDS−103、DTS−103、NAT−103、NDS−103(ミドリ化学社製、商品名)、CD−1012(米国、Sartomer社製、商品名)などに代表されるジアゾニウム塩、ヨードニウム塩、スルホニウム塩、ホスホニウム塩、セレニウム塩、オキソニウム塩、アンモニウム塩等を使用できる。 Examples of the photoacid generator include Cyracure UVI-6970, Cyracure UVI-6974, Cyracure UVI-6990, Cyracure UVI-950 (above, trade name of Union Carbide, USA), Irgacure 261 (Ciba Specialty Chemicals) Product name), SP-150, SP-151, SP-170, Optomer SP-171 (above, manufactured by Asahi Denka Kogyo Co., Ltd., product name), CG-24-61 (manufactured by Ciba Specialty Chemicals, Product name), DAICATII (manufactured by Daicel Chemical Industries, Ltd., product name), UVAC1591 (manufactured by Daicel-Cytec Co., Ltd., product name), CI-2064, CI-2639, CI-2624, CI-2481, CI-2734 , CI-2855, CI-2823, CI-2758 , Nippon Soda Co., Ltd., trade name), PI-2074 (Rhone-Poulenc, trade name, pentafluorophenyl borate toluylcumyl iodonium salt), FFC509 (3M product, trade name), BBI-102, BBI-101 , BBI-103, MPI-103, TPS-103, MDS-103, DTS-103, NAT-103, NDS-103 (trade name, manufactured by Midori Chemical Co., Ltd.), CD-1012 (trade name, manufactured by Sartomer, USA) ) And the like, and diazonium salts, iodonium salts, sulfonium salts, phosphonium salts, selenium salts, oxonium salts, ammonium salts, and the like can be used.
硬化触媒の添加量は、硬化性樹脂組成物中の前記重合体及び共重合体の総量(樹脂分)に対して、例えば0.05〜10重量%、好ましくは0.5〜5重量%である。硬化触媒は単独で又は2種以上を組み合わせて使用できる。 The addition amount of the curing catalyst is, for example, 0.05 to 10% by weight, preferably 0.5 to 5% by weight, based on the total amount (resin content) of the polymer and copolymer in the curable resin composition. is there. A curing catalyst can be used individually or in combination of 2 or more types.
硬化剤としては、例えば、エポキシ樹脂、フェノール樹脂、酸無水物などが挙げられる。 As a hardening | curing agent, an epoxy resin, a phenol resin, an acid anhydride etc. are mentioned, for example.
エポキシ樹脂としては、1分子中に2個以上のエポキシ基を有するもの(多官能のエポキシ樹脂)であれば特に限定されず、例えば、ビスフェノールA型エポキシ樹脂、ビスフェノールF型エポキシ樹脂、ビスフェノールS型エポキシ樹脂、フェノールノボラック型エポキシ樹脂、クレゾールノボラック型エポキシ樹脂、ブロム化ビスフェノールA等のグリシジルエーテル型エポキシ樹脂、ダイマー酸ジグリシジルエステル、フタル酸ジグリシジルエステル等が挙げられる。また、エポキシ樹脂として、多官能の脂環式エポキシ樹脂[例えば、 (3,4-エポキシシクロヘキシル)メチル−3,4−エポキシシクロヘキシルカルボキシレート(ダイセル化学工業株式会社製、商品名「セロキサイド2021」)など]を用いることもできる。エポキシ樹脂は単独で又は2種以上を組み合わせて使用できる。エポキシ樹脂の配合量は、本発明の共重合体100重量部に対して、例えば0〜50重量部(例えば5〜50重量部程度)の範囲で適宜選択できる。 The epoxy resin is not particularly limited as long as it has two or more epoxy groups in one molecule (polyfunctional epoxy resin). For example, bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol S type Examples thereof include epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, glycidyl ether type epoxy resins such as brominated bisphenol A, dimer acid diglycidyl esters, and phthalic acid diglycidyl esters. In addition, as an epoxy resin, a polyfunctional alicyclic epoxy resin [for example, (3,4-epoxycyclohexyl) methyl-3,4-epoxycyclohexylcarboxylate (trade name “Celoxide 2021” manufactured by Daicel Chemical Industries, Ltd.) Etc.] can also be used. An epoxy resin can be used individually or in combination of 2 or more types. The compounding quantity of an epoxy resin can be suitably selected in the range of 0-50 weight part (for example, about 5-50 weight part) with respect to 100 weight part of copolymers of this invention, for example.
フェノール樹脂としては、例えば、フェノール又はクレゾールをホルムアルデヒドを用いて重合させた樹脂を使用できる。この樹脂は、ジシクロペンタジエン、ナフタレン、ビフェニルなどの脂環式化合物又は芳香族化合物を共重合させたものであってもよい。フェノール樹脂の添加量は、硬化性樹脂組成物中の樹脂分総量100重量部に対して、例えば0〜200重量部(例えば5〜200重量部程度)の範囲で適宜選択できる。 As the phenol resin, for example, a resin obtained by polymerizing phenol or cresol using formaldehyde can be used. This resin may be a copolymer of an alicyclic compound or aromatic compound such as dicyclopentadiene, naphthalene, or biphenyl. The addition amount of a phenol resin can be suitably selected, for example in the range of 0-200 weight part (for example, about 5-200 weight part) with respect to 100 weight part of resin total amount in curable resin composition.
酸無水物としては、多塩基酸無水物が挙げられ、具体的には、無水フタル酸、無水トリメリット酸、無水ピロメリット酸、ベンゾフェノンテトラカルボン酸無水物、Δ4−テトラヒドロ無水フタル酸、4−メチル−Δ4−テトラヒドロ無水フタル酸、3−メチル−Δ4−テトラヒドロ無水フタル酸、無水ナジック酸、無水メチルナジック酸、水素化メチルナジック酸無水物、4−(4−メチル−3−ペンテニル)テトラヒドロ無水フタル酸、無水コハク酸、無水アジピン酸、無水マレイン酸、無水セバシン酸、無水ドデカン二酸、メチルシクロヘキセンテトラカルボン酸無水物、ドデセニル無水コハク酸、ヘキサヒドロ無水フタル酸、4−メチルヘキサヒドロ無水フタル酸、3−メチルヘキサヒドロ無水フタル酸、ビニルエーテル−無水マレイン酸共重合体、アルキルスチレン無水マレイン酸共重合体等が挙げられる。酸無水物の配合量は、硬化性樹脂組成物中の樹脂分総量100重量部に対して、例えば0〜160重量部(例えば20〜160重量部程度)の範囲で適宜選択できる。 Examples of the acid anhydride include polybasic acid anhydrides. Specifically, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, Δ 4 -tetrahydrophthalic anhydride, 4 -Methyl-Δ 4 -tetrahydrophthalic anhydride, 3-methyl-Δ 4 -tetrahydrophthalic anhydride, nadic anhydride, methyl nadic anhydride, hydrogenated methyl nadic anhydride, 4- (4-methyl-3-pentenyl) ) Tetrahydrophthalic anhydride, succinic anhydride, adipic anhydride, maleic anhydride, sebacic anhydride, dodecanedioic anhydride, methylcyclohexene tetracarboxylic anhydride, dodecenyl succinic anhydride, hexahydrophthalic anhydride, 4-methylhexahydro Phthalic anhydride, 3-methylhexahydrophthalic anhydride, vinyl ether-maleic anhydride Acid copolymers, alkyl styrene-maleic anhydride copolymer and the like. The compounding quantity of an acid anhydride can be suitably selected, for example in the range of 0-160 weight part (for example, about 20-160 weight part) with respect to 100 weight part of resin total amount in curable resin composition.
硬化剤としてフェノール樹脂や酸無水物を用いた場合には、硬化促進剤を共に用いることが好ましい。硬化促進剤としては、一般に使用されるものであれば特に制限されないが、ジアザビシクロウンデセン系硬化促進剤(ジアザビシクロアルケン類)、リン酸エステル、ホスフィン類などのリン系硬化促進剤や、3級アミンもしくは4級アンモニウム塩などのアミン系硬化促進剤が挙げられる。ジアザビシクロウンデセン系硬化促進剤としては、例えば、1,8−ジアザビシクロ[5.4.0]ウンデセン−7(DBU)及びその塩を挙げることができるが、特に、1,8−ジアザビシクロ[5.4.0]ウンデセン−7のオクチル酸塩、スルホン酸塩、オルソフタル酸塩、石炭酸塩等の有機酸塩が好ましい。上記の他の硬化促進剤としては、具体的には、例えば、ベンジルジメチルアミン、2,4,6−トリス(ジメチルアミノメチル)フェノール等の3級アミン、2−エチル−4−メチルイミダゾール、1−シアノエチル−2−エチル−4−メチルイミダゾール等のイミダゾール類、テトラ−n−ブチルホスホニウム−O,O−ジエチルホスホロジチオエートなどの芳香族を含まないリン化合物(ホスホニウム塩等)、3級アミン塩、4級アンモニウム塩、オクチル酸スズ等の金属塩等の公知の化合物を挙げることができる。さらに、上記ジアザビシクロアルケン類の有機酸塩とともに、金属有機酸塩を併用することができる。金属有機酸塩としては、例えば、オクチル酸スズ、オクチル酸亜鉛、ナフテン酸スズ、ナフテン酸亜鉛などが挙げられる。硬化促進剤の使用量は、硬化性樹脂組成物中の樹脂分総量100重量部に対して、例えば0〜3重量部(例えば0.05〜3重量部程度)の範囲で適宜選択できる。 When a phenol resin or acid anhydride is used as the curing agent, it is preferable to use a curing accelerator together. The curing accelerator is not particularly limited as long as it is generally used. However, phosphorus curing accelerators such as diazabicycloundecene curing accelerators (diazabicycloalkenes), phosphate esters, phosphines, Examples include amine-based curing accelerators such as tertiary amines and quaternary ammonium salts. Examples of the diazabicycloundecene-based curing accelerator include 1,8-diazabicyclo [5.4.0] undecene-7 (DBU) and salts thereof. In particular, 1,8-diazabicyclo [ 5.4.0] Organic salts of undecene-7 such as octylate, sulfonate, orthophthalate, and coalate are preferred. Specific examples of the other curing accelerator include tertiary amines such as benzyldimethylamine and 2,4,6-tris (dimethylaminomethyl) phenol, 2-ethyl-4-methylimidazole, 1 -Phosphorus compounds (phosphonium salts, etc.) that do not contain aromatics, such as imidazoles such as cyanoethyl-2-ethyl-4-methylimidazole, tetra-n-butylphosphonium-O, O-diethyl phosphorodithioate, and tertiary amines Known compounds such as salts, metal salts such as quaternary ammonium salts and tin octylate can be exemplified. Furthermore, a metal organic acid salt can be used in combination with the organic acid salt of the diazabicycloalkenes. Examples of the metal organic acid salt include tin octylate, zinc octylate, tin naphthenate, and zinc naphthenate. The usage-amount of a hardening accelerator can be suitably selected, for example in the range of 0-3 weight part (for example, about 0.05-3 weight part) with respect to 100 weight part of resin total amount in curable resin composition.
硬化性樹脂組成物には、ガラス微粒子、金属酸化物微粒子、ゴム微粒子、セラミック微粒子等の微粒子を配合してもよい。これらは単独で又は2種以上を組み合わせて使用できる。 The curable resin composition may contain fine particles such as glass fine particles, metal oxide fine particles, rubber fine particles, and ceramic fine particles. These can be used alone or in combination of two or more.
こうして得られる硬化性樹脂組成物は、硬化により基材や基板に対して高い密着性を有するとともに、耐溶剤性や耐アルカリ性等の耐薬品性に優れた硬化物(硬化皮膜等)を得ることができる。そのため、塗料、コーティング剤、粘接着剤等として有用であり、特に電子材料分野(保護膜、封止材料、ナノインプリント用材料など)で好適に使用できる。 The curable resin composition thus obtained has a high adhesion to a substrate or a substrate by curing, and obtains a cured product (cured film, etc.) excellent in chemical resistance such as solvent resistance and alkali resistance. Can do. Therefore, it is useful as a paint, a coating agent, an adhesive, and the like, and can be suitably used particularly in the field of electronic materials (protective film, sealing material, nanoimprint material, etc.).
上記硬化性樹脂組成物を硬化させることにより諸物性に優れた硬化物が得られる。例えば、上記硬化性樹脂組成物を、スピンコーター、スリットコーターなどの方式によって、各種基材又は基板へ塗工して塗膜を形成した後、該塗膜を硬化させることにより硬化物を得ることができる。基材又は基板としては、ガラス、セラミック、シリコンウエハ、金属、プラスチックなどが挙げられる。スピンコーターやスリットコーター等による塗工は公知の方法により行うことができる。 By curing the curable resin composition, a cured product having excellent physical properties can be obtained. For example, the curable resin composition is applied to various substrates or substrates by a method such as a spin coater or a slit coater to form a coating film, and then a cured product is obtained by curing the coating film. Can do. Examples of the base material or substrate include glass, ceramic, silicon wafer, metal, and plastic. Coating with a spin coater, slit coater, or the like can be performed by a known method.
塗膜の硬化は加熱すること、あるいは活性エネルギー線を照射し露光すること、又は露光後に加熱することにより行われる。上記硬化性樹脂組成物を熱により硬化させる場合、加熱温度は50℃から260℃の範囲、好ましくは80℃から240℃の範囲である。また、上記硬化性樹脂組成物を光により硬化させる場合、露光には種々の波長の光線、例えば、紫外線、X線、g線、i線、エキシマレーザーなどが使用される。硬化後の塗膜の厚みは、用途によって適宜選択できるが、一般には0.1〜40μm、好ましくは0.3〜20μm、より好ましくは0.5〜10μm程度である。 Curing of the coating film is performed by heating, irradiating and irradiating active energy rays, or heating after exposure. When the curable resin composition is cured by heat, the heating temperature is in the range of 50 ° C to 260 ° C, preferably in the range of 80 ° C to 240 ° C. When the curable resin composition is cured by light, light of various wavelengths, for example, ultraviolet rays, X-rays, g-rays, i-rays, excimer lasers, etc. are used for exposure. Although the thickness of the coating film after hardening can be suitably selected according to a use, generally it is 0.1-40 micrometers, Preferably it is 0.3-20 micrometers, More preferably, it is about 0.5-10 micrometers.
以下に、実施例に基づいて本発明をより詳細に説明するが、本発明はこれらの実施例により限定されるものではない。なお、生成した重合体、共重合体の重量平均分子量(ポリスチレン換算)及び分散度(重量平均分子量Mw/数平均分子量Mn)は、以下の条件にて測定した。
装置:検出器:RID-10A(島津製作所)
ポンプ:LC-10ADVP(島津製作所)
システムコントローラー:SCL-10AVP(島津製作所)
デガッサー:DGU-14A(島津製作所)
オートインジェクター:SIL-10AF(島津製作所)
カラム:Waters Styragel HR3, Styragel HR4, Styragel HR5 計3本
移動相:THF
流量:1mL/min
温度:オーブン(40℃)、RI(40℃)
検出器:RI POLARITY(+)
注入量:50μL
Hereinafter, the present invention will be described in more detail based on examples, but the present invention is not limited to these examples. In addition, the weight average molecular weight (polystyrene conversion) and dispersion degree (weight average molecular weight Mw / number average molecular weight Mn) of the produced | generated polymer and a copolymer were measured on condition of the following.
Device: Detector: RID-10A (Shimadzu Corporation)
Pump: LC-10ADVP (Shimadzu Corporation)
System controller: SCL-10AVP (Shimadzu Corporation)
Degasser: DGU-14A (Shimadzu Corporation)
Autoinjector: SIL-10AF (Shimadzu Corporation)
Column: Waters Styragel HR3, Styragel HR4, Styragel HR5, 3 in total Mobile phase: THF
Flow rate: 1mL / min
Temperature: Oven (40 ° C), RI (40 ° C)
Detector: RI POLARITY (+)
Injection volume: 50μL
合成例1 <重合体溶液A−1>
還流冷却器、滴下ロート及び撹拌機を備えた1Lのフラスコ内に窒素を適量流して窒素雰囲気とし、プロピレングリコールモノメチルエーテルアセテート100重量部を入れ、撹拌しながら90℃まで加熱した。次いで、該フラスコ内にγ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)100重量部をプロピレングリコールモノメチルエーテルアセテート30重量部に溶解した溶液を滴下ポンプを用いて約4時間かけて滴下した。一方、重合開始剤2,2′−アゾビス(イソ酪酸)ジメチル15重量部をプロピレングリコールモノメチルエーテルアセテート80重量部に溶解した溶液を別の滴下ポンプを用いて約4時間かけて滴下した。重合開始剤の滴下が終了した後、約4時間同温度に保持し、その後室温まで冷却して、固形分33.5重量%の重合体溶液A−1を得た。生成した重合体の重量平均分子量Mwは4000、分散度は1.85であった。
Synthesis Example 1 <Polymer Solution A-1>
An appropriate amount of nitrogen was flowed into a 1 L flask equipped with a reflux condenser, a dropping funnel and a stirrer to form a nitrogen atmosphere, and 100 parts by weight of propylene glycol monomethyl ether acetate was added and heated to 90 ° C. with stirring. Next, a solution prepared by dissolving 100 parts by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Toray Dow Corning) in 30 parts by weight of propylene glycol monomethyl ether acetate was dropped into the flask over about 4 hours using a dropping pump. did. On the other hand, a solution obtained by dissolving 15 parts by weight of a polymerization initiator 2,2′-azobis (isobutyric acid) dimethyl in 80 parts by weight of propylene glycol monomethyl ether acetate was added dropwise over about 4 hours using another dropping pump. After completion of dropping of the polymerization initiator, the temperature was maintained at the same temperature for about 4 hours, and then cooled to room temperature to obtain a polymer solution A-1 having a solid content of 33.5% by weight. The produced polymer had a weight average molecular weight Mw of 4000 and a dispersity of 1.85.
合成例2 <重合体溶液A−2>
単量体組成を、γ−メタクリロキシプロピルトリエトキシシラン(東レ・ダウコーニング社製)100重量部に変更する以外は、合成例1と同様の操作を行い、固形分33.6重量%の重合体溶液A−2を得た。生成した重合体の重量平均分子量Mwは4300、分散度は1.86であった。
Synthesis Example 2 <Polymer solution A-2>
The same procedure as in Synthesis Example 1 was performed except that the monomer composition was changed to 100 parts by weight of γ-methacryloxypropyltriethoxysilane (manufactured by Dow Corning Toray), and a solid content of 33.6% by weight was obtained. A combined solution A-2 was obtained. The produced polymer had a weight average molecular weight Mw of 4300 and a dispersity of 1.86.
合成例3 <重合体溶液B−1>
単量体組成を、γ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)75重量部、メタクリル酸グリシジル(GMA)23重量部、2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(商品名「プラクセルFA−3」、ダイセル化学工業株式会社製)2重量部に変更する以外は、合成例1と同様の操作を行い、固形分34.0重量%の重合体溶液B−1を得た。生成した重合体の重量平均分子量Mwは3900、分散度は1.82であった。
Synthesis Example 3 <Polymer solution B-1>
The monomer composition was 75 parts by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Dow Corning Toray), 23 parts by weight of glycidyl methacrylate (GMA), 6-hexanolide addition polymer of 2-hydroxyethyl acrylate (average) Degree of polymerization 3) (trade name “Placcel FA-3”, manufactured by Daicel Chemical Industries, Ltd.) A polymer having a solid content of 34.0% by weight was subjected to the same operation as in Synthesis Example 1 except that the amount was changed to 2 parts by weight. Solution B-1 was obtained. The produced polymer had a weight average molecular weight Mw of 3900 and a dispersity of 1.82.
合成例4 <重合体溶液B−2>
単量体組成を、γ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)50重量部、メタクリル酸グリシジル(GMA)46重量部、2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(商品名「プラクセルFA−3」、ダイセル化学工業株式会社製)4重量部に変更する以外は、合成例1と同様の操作を行い、固形分33.0重量%の共重合体溶液B−2を得た。生成した共重合体の重量平均分子量Mwは4000、分散度は1.75であった。
Synthesis Example 4 <Polymer solution B-2>
The monomer composition was composed of 50 parts by weight of γ-methacryloxypropyltrimethoxysilane (Toray Dow Corning), 46 parts by weight of glycidyl methacrylate (GMA), 6-hexanolide addition polymer of 2-hydroxyethyl acrylate (average) Degree of polymerization 3) (trade name “Placcel FA-3”, manufactured by Daicel Chemical Industries, Ltd.) A combined solution B-2 was obtained. The produced copolymer had a weight average molecular weight Mw of 4000 and a dispersity of 1.75.
合成例5 <重合体溶液B−3>
単量体組成を、γ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)70重量部、メタクリル酸3,4−エポキシシクロヘキシルメチル(商品名「サイクロマーM100」、ダイセル化学工業株式会社製)25重量部、2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(商品名「プラクセルFA−3」、ダイセル化学工業株式会社製)5重量部に変更する以外は、合成例1と同様の操作を行い、固形分33.0重量%の共重合体溶液B−3を得た。生成した共重合体の重量平均分子量Mwは4000、分散度1.75であった。
Synthesis Example 5 <Polymer solution B-3>
The monomer composition is 70 parts by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Dow Corning Toray), 3,4-epoxycyclohexylmethyl methacrylate (trade name “Cyclomer M100”, manufactured by Daicel Chemical Industries, Ltd.) ) 25 parts by weight, 6-hexanolide addition polymer of 2-hydroxyethyl acrylate (average polymerization degree 3) (trade name “Placcel FA-3”, manufactured by Daicel Chemical Industries, Ltd.) The same operation as in Example 1 was performed to obtain a copolymer solution B-3 having a solid content of 33.0% by weight. The produced copolymer had a weight average molecular weight Mw of 4000 and a dispersity of 1.75.
合成例6 <重合体溶液C−1>
単量体組成を、メタクリル酸グリシジル(GMA)95重量部、2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(商品名「プラクセルFA−3」、ダイセル化学工業株式会社製)5重量に変更する以外は、実施例1と同じ操作を行い、固形分33.5重量%の共重合体溶液C−1を得た。生成した共重合体の重量平均分子量Mwは3800、分散度は1.65であった。
Synthesis Example 6 <Polymer solution C-1>
The monomer composition is 95 parts by weight of glycidyl methacrylate (GMA), 6-hexanolide addition polymer of 2-hydroxyethyl acrylate (average polymerization degree 3) (trade name “Placcel FA-3”, manufactured by Daicel Chemical Industries, Ltd. ) The same operation as Example 1 was performed except changing to 5 weight, and the copolymer solution C-1 of 33.5 weight% of solid content was obtained. The produced copolymer had a weight average molecular weight Mw of 3800 and a dispersity of 1.65.
合成例7 <重合体溶液C−2>
単量体組成を、γ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)95重量部、2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(商品名「プラクセルFA−3」、ダイセル化学工業株式会社製)5重量部に変更する以外は、実施例1と同じ操作を行い、固形分33.8重量%の共重合体溶液C−2を得た。生成した共重合体の重量平均分子量Mwは3900、分散度1.85であった。
Synthesis Example 7 <Polymer solution C-2>
The monomer composition is 95 parts by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Dow Corning Toray), 6-hexanolide addition polymer of 2-hydroxyethyl acrylate (average polymerization degree 3) (trade name “Placcel FA” -3 ", manufactured by Daicel Chemical Industries, Ltd.) Except for changing to 5 parts by weight, the same operation as in Example 1 was performed to obtain a copolymer solution C-2 having a solid content of 33.8% by weight. The resulting copolymer had a weight average molecular weight Mw of 3900 and a dispersity of 1.85.
合成例8 <重合体溶液C−3>
単量体組成を、γ−メタクリロキシプロピルトリメトキシシラン(東レ・ダウコーニング社製)70重量部、メタクリル酸グリシジル(GMA)30重量に変更する以外は、実施例1と同じ操作を行い、固形分32.8重量%の共重合体溶液C−3を得た。生成した共重合体の重量平均分子量Mwは3800、分散度は1.82であった。
Synthesis Example 8 <Polymer solution C-3>
The same procedure as in Example 1 was performed except that the monomer composition was changed to 70 parts by weight of γ-methacryloxypropyltrimethoxysilane (manufactured by Dow Corning Toray) and 30 parts by weight of glycidyl methacrylate (GMA). A copolymer solution C-3 having a content of 32.8% by weight was obtained. The produced copolymer had a weight average molecular weight Mw of 3800 and a dispersity of 1.82.
合成例1〜8での重合体の合成(重合体溶液の調製)に用いた材料の種類、使用量(合成例1〜8で合成した重合体の組成)を表1にまとめて示した。なお、表中、GMAはメタクリル酸グリシジルのことを示し、サイクロマーM100はメタクリル酸3,4−エポキシシクロヘキシルメチル(ダイセル化学社製)のことを示し、プラクセルFA−3は2−ヒドロキシエチルアクリレートの6−ヘキサノリド付加重合物(平均重合度3)(ダイセル化学社製)のことを示す。 Table 1 summarizes the types of materials used for the synthesis of the polymers in Synthesis Examples 1 to 8 (preparation of polymer solutions) and the amounts used (compositions of the polymers synthesized in Synthesis Examples 1 to 8). In the table, GMA represents glycidyl methacrylate, Cyclomer M100 represents 3,4-epoxycyclohexylmethyl methacrylate (manufactured by Daicel Chemical Industries), and Plaxel FA-3 represents 2-hydroxyethyl acrylate. It shows 6-hexanolide addition polymer (average degree of polymerization 3) (manufactured by Daicel Chemical Industries).
<硬化性樹脂組成物の調製>
実施例1
重合体溶液A−1:50重量部に、重合体溶液B−1:50重量部を加えて混合することにより硬化性樹脂組成物を得た。
<Preparation of curable resin composition>
Example 1
A curable resin composition was obtained by adding 50 parts by weight of polymer solution A-1 to 50 parts by weight of polymer solution B-1 and mixing.
実施例2〜6
重合体溶液の種類、使用量を変更した以外は実施例1と同様にして硬化性樹脂組成物を調製した。
Examples 2-6
A curable resin composition was prepared in the same manner as in Example 1 except that the type and amount of the polymer solution were changed.
比較例1〜5
重合体溶液の種類、使用量を変更した以外は実施例1と同様にして硬化性樹脂組成物を調製した。
Comparative Examples 1-5
A curable resin composition was prepared in the same manner as in Example 1 except that the type and amount of the polymer solution were changed.
各実施例及び比較例の硬化性樹脂組成物を調製するのに用いた材料の使用量、各硬化性樹脂組成物の構成を表2にまとめて示した。 Table 2 summarizes the amounts of materials used to prepare the curable resin compositions of Examples and Comparative Examples and the configuration of each curable resin composition.
評価試験
(1)評価用試験片の作製
基材に、各実施例及び比較例で得られた硬化性樹脂組成物をスピンコーターで塗布したのち、80℃のホットプレートで10分間加熱後、230℃のオーブン中で1時間加熱することで各評価用試験片を作製した。基材として、ガラス板とステンレス板を用いた。
Evaluation test (1) Preparation of test piece for evaluation The curable resin composition obtained in each Example and Comparative Example was applied to a substrate with a spin coater, and then heated on an 80 ° C. hot plate for 10 minutes, and then 230 Each evaluation test piece was produced by heating in an oven at 0 ° C. for 1 hour. A glass plate and a stainless steel plate were used as the base material.
(2)耐溶剤性
実施例及び比較例において、ガラス板で作製した評価用試験片を、イソプロピルアルコール(IPA)、γ−ブチロラクトン(γ−BL)、N―メチルピロリドン(NMP)へ浸漬させ、10分間放置した。その後水洗し、塗膜が全く変化していなかったら◎、僅かに変色しているのみであれば○、塗膜が全面的に変色しているようであれば△、全面的に変色し、一部が溶解しているようであれば×とした。なお、ステンレス板で作製した評価用試験片を用いた場合も同様の結果が得られた。
(2) Solvent resistance In the examples and comparative examples, the test specimens prepared with glass plates were immersed in isopropyl alcohol (IPA), γ-butyrolactone (γ-BL), N-methylpyrrolidone (NMP), Left for 10 minutes. After washing with water, ◎ if the coating film has not changed at all, ◯ if it is only slightly discolored, △ if the coating film is completely discolored, completely discolored, one If the part was dissolved, it was marked as x. Similar results were obtained when using test specimens made of stainless steel.
(3)密着性
実施例及び比較例において、耐溶剤性試験後の評価用試験片について、JIS K−5600−5−6に準拠し、基材からの剥離により密着性を測定した。また、JIS K5600−5−6 8.3 表1 試験結果の分類で規定された分類に従って下記基準に基づいて評価した。
◎・・・試験結果の分類の「0」であった。
○・・・試験結果の分類の「1」であった。
△・・・試験結果の分類の「2」であった。
×・・・試験結果の分類の「3」「4」であった。
(3) Adhesiveness In the examples and comparative examples, the adhesiveness of the test pieces for evaluation after the solvent resistance test was measured by peeling from the base material in accordance with JIS K-5600-5-6. Moreover, it evaluated based on the following reference | standard in accordance with the classification | category prescribed | regulated by the classification | category of JIS K5600-5-6 8.3 Table 1 test result classification.
A: The test result classification was “0”.
○: It was “1” in the classification of the test results.
Δ: “2” in the classification of test results.
X: “3” and “4” in the classification of the test results.
(4)耐アルカリ性
実施例及び比較例において、ガラス板で作製した評価用試験片へ、1重量%NaOH水溶液を1滴ずつ滴下し、10分間放置した。その後水洗し、1重量%NaOH水溶液を滴下した箇所が全く変化していなかったら◎、僅かに滴下した跡が残るが、拭き取れば消えるようであれば○、滴下した跡が残り、拭き取っても消えないようであれば△、全面的に変色していたら×とした。
(4) Alkali resistance In Examples and Comparative Examples, a 1 wt% NaOH aqueous solution was dropped dropwise onto an evaluation test piece made of a glass plate and allowed to stand for 10 minutes. After washing with water, if the location where the 1 wt% NaOH aqueous solution was dripped was not changed at all, ◎, a trace of dripping remains, but if it disappears if wiped off, ○, the trace of dripping remains and disappears even if wiped off If it was not, Δ, and if it was completely discolored, x.
評価試験の結果を表3に示す。 The results of the evaluation test are shown in Table 3.
Claims (3)
で表される一種又は複数種のアルコキシシリル基含有ビニル単量体aのみをモノマー成分とする重合体Aと、前記式(1)で表される一種又は複数種のアルコキシシリル基含有ビニル単量体a、3〜5員の環状エーテル基を有する一種又は複数種のビニル単量体b、及び側鎖にε−カプロラクトン開環重合鎖部を有する一種又は複数種のヒドロキシル基含有ビニル単量体cをモノマー成分として含有してなる共重合体Bとを含むことを特徴とする硬化性樹脂組成物。 Following formula (1)
A polymer A containing only one or a plurality of alkoxysilyl group-containing vinyl monomers a represented by the formula (1), and one or a plurality of alkoxysilyl group-containing vinyl monomers represented by the formula (1) Body a, one or more kinds of vinyl monomers b having 3 to 5 membered cyclic ether groups, and one or more kinds of hydroxyl group-containing vinyl monomers having an ε-caprolactone ring-opening polymer chain moiety in the side chain A curable resin composition comprising a copolymer B containing c as a monomer component.
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH08188701A (en) * | 1995-01-10 | 1996-07-23 | Daicel Chem Ind Ltd | Thermosetting resin composition |
JPH10130581A (en) * | 1996-10-25 | 1998-05-19 | Nippon Paint Co Ltd | Coated membrane for outside plate, coating material composition, formation of coating membrane and coated material |
JP2001261918A (en) * | 2000-03-16 | 2001-09-26 | Kansai Paint Co Ltd | Curing composition and method for forming membrane of it |
JP2002167491A (en) * | 2000-11-30 | 2002-06-11 | Daicel Chem Ind Ltd | Thermosetting resin composition and topcoat clear paint |
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Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH08188701A (en) * | 1995-01-10 | 1996-07-23 | Daicel Chem Ind Ltd | Thermosetting resin composition |
JPH10130581A (en) * | 1996-10-25 | 1998-05-19 | Nippon Paint Co Ltd | Coated membrane for outside plate, coating material composition, formation of coating membrane and coated material |
JP2001261918A (en) * | 2000-03-16 | 2001-09-26 | Kansai Paint Co Ltd | Curing composition and method for forming membrane of it |
JP2002167491A (en) * | 2000-11-30 | 2002-06-11 | Daicel Chem Ind Ltd | Thermosetting resin composition and topcoat clear paint |
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