JP2010002331A - Thermocouple sensor substrate and its method of manufacturing - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a thermocouple sensor substrate having a thinned substrate thickness of a measuring section and a thickened substrate thickness of a connection section to a measuring apparatus, and capable of being manufactured over manufacturing lines of conventional printed wiring boards, and provide its method of manufacturing. <P>SOLUTION: A copper wiring pattern 100 is formed on the surface side, and a nickel wiring pattern 101 is formed on the back surface side. One-side ends of these wiring patterns are provided with sensors 102 contacting with liquid and gas for measuring their temperatures, and edges of other ends are provided with connectors 103 connected to a measuring apparatus. The sensor 102 constitutes a thermocouple by the coupling of the copper wiring pattern 100 and the nickel wiring pattern 101 to form a junction and measures a temperature by the use of a thermoelectromotive force generated at the junction. The connector 103 has a prescribed thickness to enable connection to the measuring apparatus. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a thermocouple sensor substrate used for a temperature sensor and a method for manufacturing the same, and more particularly to a thermocouple sensor substrate that is easy to manufacture and a method for manufacturing the same.

  Known temperature sensors include platinum resistance thermometers, thermistors, thermocouples, and the like. Among them, thermocouples are widely used because they have advantages of high measurement accuracy and relatively low cost. Thermocouples use a phenomenon (Seebeck effect) in which a closed circuit is formed by joining two types of materials, and when the two junctions are exposed to different temperatures, a thermoelectromotive force is generated and current flows. .

  These thermocouples generally used linear conductors as thermocouple sensor elements, but in recent years, various thin thermocouples having a shape in which thin metal foils are stacked to form a thin film are known. ing. Since this thin thermocouple has a small heat capacity, it can measure without greatly disturbing the temperature distribution of the measurement object, and has an advantage such as excellent time response.

  In this thermocouple sensor element, a plastic such as polyimide, a composite material such as glass / epoxy, and various ceramics are used as an insulating substrate, and a large number of thermoelectric elements are formed on the substrate at intervals of, for example, 0.3 mm using a fine printed wiring technique. Pairs can be sequenced. This makes it possible to measure with high accuracy the temperature distribution in which a large temperature change exists within a small thickness range within the resin, such as inside the fluid resin in the injection molding nozzle or inside the mold. Can do.

Patent Document 1 proposes a temperature sensor using such a thermocouple sensor element.
According to the invention proposed in Patent Document 1, a thermocouple sensor in which thermocouple junctions are arrayed at the end of an elongated plate-like insulating substrate, and different conductors constituting the thermocouple are printed on the surface thereof. It is comprised from the element and the holding body holding this thermocouple sensor element. This thermocouple sensor element is integrated as a temperature sensor by being inserted into a slit provided in a holding body, and is characterized in that it can be easily attached to a measurement target device.
JP 2002-131144 A

  However, when measuring the temperature of the liquid or gas to be measured, if the temperature sensor element is thick, it will change the flow of the liquid or gas, and a subtle temperature change will occur near the temperature sensor element. Accurate temperature measurement is difficult. Moreover, although the temperature sensor proposed in Patent Document 1 includes a thermocouple sensor element having a thickness of 0.2 mm, a holding body for holding the thermocouple sensor element needs to be prepared as a dedicated device. In addition to lack of versatility, a dedicated production line is required, leading to an increase in cost.

  The present invention has been made in view of such a problem, and is a thermocouple sensor substrate in which a substrate thickness at a measurement site is reduced and a substrate thickness at a connection site with a measurement device is increased. It is an object of the present invention to provide a thermocouple sensor substrate that can be manufactured on a manufacturing line and can be connected to various measuring devices, and a manufacturing method thereof.

  In order to achieve the above object, a thermocouple sensor substrate according to the present invention includes at least a first thin film laminated on a lower layer of a first insulating substrate and a second thin film laminated on an upper layer of the first insulating substrate. A thermocouple sensor is configured to measure the temperature of the fluid at one end, comprising an insulating substrate and a second thin film made of a metal different from the first thin film laminated on the second insulating substrate. A thermocouple sensor substrate in which a connector portion for connecting to a measuring instrument is formed at the other end, wherein the first insulating substrate and the second insulating substrate of the connector portion are formed. A third insulating substrate is provided between the layers.

  The thermocouple sensor substrate of the present invention is characterized in that the third insulating substrate is disposed between the first insulating substrate and the second insulating substrate through an adhesive layer. To do.

  The thermocouple sensor substrate of the present invention is characterized in that an insulating layer is formed on each of the outermost layer on the first thin film side and the outermost layer on the second thin film side.

  The thermocouple sensor substrate according to the present invention is characterized in that the first thin film and the second thin film are exposed at an end portion of the connector portion.

  The thermocouple sensor substrate of the present invention is characterized in that the first thin film is nickel and the second thin film is copper.

  In the thermocouple sensor substrate of the present invention, the metal used for the first thin film and the second thin film is a combination of copper and nickel-copper alloy, or a combination of nickel-copper alloy and nickel-copper alloy. It is characterized by being.

  In the method for manufacturing a thermocouple sensor substrate according to the present invention, a first thin film is laminated on a lower layer of a first insulating substrate, the second insulating substrate is formed on an upper layer of the first insulating substrate, and the second A second thin film made of a metal different from the first thin film is laminated on the upper layer of the insulating substrate, and a sensor portion in which a thermocouple sensor is configured to measure the temperature of the fluid is formed at one end, and the other end A thermocouple sensor substrate manufacturing method for forming a connector portion for connecting to a measuring instrument on a substrate, wherein a release film is sandwiched between substrates at the other end of the first insulating substrate and the second insulating substrate. , Applying heat and pressure to the laminated thin film and the insulating substrate, pressure-bonding the first insulating substrate and the second insulating substrate other than the portion where the release film is sandwiched, and The release film sandwiched between the substrates is removed, and the third portion is removed at the removed location. Characterized by disposing the insulating substrate.

  The method for manufacturing a thermocouple sensor substrate of the present invention is characterized in that an insulating layer is further laminated on the first thin film, and the first thin film at a position where the electrical connection is performed is exposed.

  In the method of manufacturing a thermocouple sensor substrate of the present invention, the position where the third insulating substrate is disposed has a thickness greater than the position where the first thin film and the second thin film are electrically connected. It is characterized by that.

  Further, the method of manufacturing a thermocouple sensor substrate of the present invention prevents a partial decrease in adhesion when the first insulating layer and the second insulating layer are laminated on the release film. A plurality of holes or slits for suppressing a change in substrate thickness or / and a gap are processed.

  According to the present invention, since one end of the substrate can be made thin and the substrate thickness at the other end can be made thick, a substrate thickness corresponding to the measuring instrument to be connected can be formed. A substrate can be manufactured. In addition, since it can be produced on the production line of the printed wiring board, no new equipment is required, and since it is easy to produce, it can be produced at a low cost in a short time.

Next, a thermocouple sensor substrate and a method for manufacturing a thermocouple sensor substrate according to an embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a diagram showing a configuration of a thermocouple sensor substrate manufactured by the method of manufacturing a thermocouple sensor substrate according to the present embodiment, and FIG. 1A is a diagram showing a surface of the thermocouple sensor substrate. FIG. 1B is a view showing the back surface of the thermocouple sensor substrate.

  As shown in FIG. 1, a wiring pattern is formed on the thermocouple sensor substrate 10, and a copper wiring pattern 100 is formed on the surface side shown in FIG. 1 (a), as shown in FIG. 1 (b). A nickel wiring pattern 101 is formed on the back side. One end of these wiring patterns is provided with a sensor part 102 for contacting the liquid, gas or solid and measuring the temperature thereof, and the other end edge part is provided with a connector part 103 for connecting to a measuring instrument. Is provided.

  The sensor unit 102 forms a thermocouple by bonding the copper wiring pattern 100 and the nickel wiring pattern 101 and forming a junction point, and measures the temperature using the thermoelectromotive force generated at the junction point. . Moreover, the connector part 103 enables connection with a measuring device by having a predetermined thickness.

FIG. 2 is a view showing a cross section AA shown in FIG.
As shown in FIG. 2, the thermocouple sensor substrate 10 is configured by laminating a plurality of members, and the connector portion 103 has a structure that is thicker than the sensor portion 102 side.

  The thermocouple sensor substrate 10 includes an insulating layer 200, a nickel foil surface pattern layer 201, an insulating layer 202, an insulating layer 203, a copper foil layer 204, a copper plating layer 205, and an insulating layer 206 in order from the lowest layer. The reinforcing plate 207 provided with adhesive layers 208 and 209 above and below between the insulating layer 202 and the insulating layer 203 is sandwiched between the insulating layer 202 and the insulating layer 203 only on the connector portion 103 side, so that the thickness is greater than that of the other layers. It has a structure.

Further, the lowermost insulating layer 200 and the uppermost insulating layer 206 are not laminated near the end of the connector portion 103, and the nickel foil surface pattern layer 201 and the copper plating layer 205 are exposed. Further, in the lowermost insulating layer 200, the insulating layer 200 is not laminated in order to expose the nickel foil surface pattern layer 201 below the sensor portion 102, and a void 104 is formed.
In this embodiment, the combination of metals constituting the thermocouple is copper and nickel, but for example, a combination of nickel-copper alloy and copper, nickel-copper alloy and nickel-copper alloy may be used.

Next, a manufacturing method of the thermocouple sensor substrate 10 will be described with reference to FIGS. 3 (a) to 3 (d) are views showing the formation and lamination process of the dissimilar metal-clad laminate.
4 is a diagram showing the configuration of the release film, FIG. 5 is a diagram showing the state of the substrate and the release film laminated on the lamination jig, and FIGS. FIGS. 7A to 7C are diagrams illustrating a copper plating process and a wiring pattern forming process, and FIGS. 8A to 8D are protective layers. FIG. 9A to FIG. 9C are diagrams illustrating a reinforcing plate disposing process.

<Formation process of dissimilar metal laminated laminate>
First, the nickel foil surface layer 201 and the insulating layer 202 are stacked on the first stacking jig 400 (FIG. 3A). At this time, the nickel foil surface pattern layer 201 and the insulating layer 202 are provided with a reference hole (not shown) for preventing misalignment during lamination, and the first lamination treatment is provided in the reference hole. The nickel foil surface pattern layer 201 and the insulating layer 202 are laminated through the pins 401 erected on the tool 400.

Next, the release film 300, the insulating layer 203, and the copper foil layer 204 are laminated on the insulating layer 202 (FIG. 3B). As shown in FIG. 4, the release film 300 includes a substantially rectangular laminated portion 301 provided with laminated portions for laminating members in parallel to form the thermocouple sensor substrate 10, and the laminated portion 301. It is comprised from the arm parts 302 and 303 connected to both ends. The laminated portion 301 and the arm portions 302 and 303 are used to improve the adhesion when laminating each member on the release film 300, to suppress the change in the plate thickness, to reduce the gap, and to reduce the residue of the etching solution. A plurality of holes (or slits) 304 are provided, and a fixing hole 305 for fixing to the stacking jig 400 is provided only in the arm portions 302 and 303.
The release film 300 shown in the present embodiment does not have to have the shape shown in FIG. 4, and may have any shape as long as it can be fixed to the lamination jig 400.

Next, as in FIG. 3A, a reference hole (not shown) is formed in the release film 300, the insulating layer 203, and the copper foil layer 204, and the pin 401 is laminated through the reference hole. As shown in FIG. 5, the release film 300 is fixed to fixing pins 403 provided on the periphery of the stacking jig 400, and the insulating layer 203 and the copper foil layer 204 are stacked thereon. Next, a second lamination jig 402 is laminated on the upper surface of the copper foil layer 204 (FIG. 3C), and heat and pressure are applied by a press lamination method to form a laminate (FIG. 3D). ).
Thereby, the nickel foil surface pattern layer 201 is laminated on the insulating layer 202, and the copper foil layer 204 is laminated on the insulating layer 203. Further, the insulating layer 202 and the insulating layer 203 are bonded at a portion other than the portion where the release film 300 is sandwiched.

<Etching process>
First, the laminate formed in the above process is removed from the first lamination jig 400 and the second lamination jig 402 (FIG. 6A). Next, in order to form the sensor part 102, a part of the copper foil layer 204 is etched to expose the insulating layer 203 (FIG. 6B). Then, the insulating layer 203 exposed from the copper foil layer 204 and the lower insulating layer 202 are removed by a laser device (not shown) to form a hole 210 in which the nickel foil surface pattern layer 201 is exposed (FIG. 6 (c)).

<Copper plating process>
Next, copper plating is performed on the upper surface of the copper foil layer 204 and the hole 210.
First, a tape (Nitto Denko Corporation: ELEP Masking N-380) 211 for preventing the copper plating from adhering to the surface of the nickel foil surface pattern layer 201 is attached (FIG. 7B). This tape 211 is used for masking when performing metal plating, and is a surface protective material using a polyvinyl chloride film as a support.

  Next, copper plating is performed on the copper foil layer 204 and the hole 210 by performing an electroless copper plating process and an electrolytic copper plating process to form a copper plating layer 205. First, in the electroless copper plating treatment, the substrate manufactured through the above steps is immersed in an electroless copper plating bath containing a plating solution, and copper is deposited in the copper foil layer 204 and the hole 210. Next, in order to obtain a satisfactory copper plating thickness, an electrolytic copper plating process is performed. In the electrolytic copper plating treatment, copper is deposited on the substrate by passing an electric current through the substrate after the electroless copper plating treatment immersed in the plating solution. Thereby, the copper plating layer 205 of sufficient thickness can be laminated | stacked on the copper foil layer 204 and a hole (FIG.7 (b)). When the copper plating step is completed, the tape 211 is peeled off (FIG. 7C).

<Wiring pattern formation process>
Next, the copper wiring pattern 100 is formed on the copper plating layer 205 and the nickel wiring pattern 101 is formed on the nickel foil surface layer 201 on the laminated substrate shown in FIG. The wiring pattern is formed by performing exposure processing, development processing, and etching processing on the nickel foil surface pattern layer 201 and the copper plating layer 205 using a known technique of photoresist.

<Protective layer formation process>
Next, insulating layers 200 and 206 are formed below the nickel foil surface pattern layer 201 and above the copper plating layer 205. The insulating layers 200 and 206 can electrically insulate the nickel foil surface pattern layer 201 and the copper plating layer 205 from the outside, and can also serve to prevent dust and moisture and prevent oxidation of the metal surface.
First, the formation of the insulating layer 206 will be described. An insulating layer film, which is an ultraviolet curable resin, is applied to the entire upper surface of the copper plating layer 205, and the presence or absence of the insulating layer film is selectively formed by ultraviolet exposure (FIG. 8A). ). That is, it is necessary to expose the copper plating layer 205 at a portion that becomes the connector portion 103 of the copper plating layer 205. Therefore, when ultraviolet light exposure is performed, ultraviolet light exposure to a portion that becomes the connector portion 103 is shielded. The insulating layer film is cured at the portion exposed to the ultraviolet rays, and the portion where the exposure is shielded is not cured, but is dissolved and removed by the development process. Thereby, in the connector part 103, the insulating layer 206 from which the copper plating layer 205 is exposed can be formed (FIG. 8B).

  Next, the insulating layer 200 is formed under the nickel foil surface pattern layer 201. First, an insulating layer film, which is the same ultraviolet curable resin as described above, is applied to the entire surface of the nickel foil surface pattern layer 201, and the presence or absence of the insulating layer film is selectively formed by ultraviolet exposure (FIG. 8C). That is, since it is necessary to expose the nickel foil surface pattern layer 201 at the lower part of the sensor part 102 and the connector part 103, ultraviolet light exposure is shielded at the lower part of the sensor part 102 and the part that becomes the connector part 103. As a result, the insulating layer film is cured at the portion exposed to the ultraviolet rays, and the portion shielded from the ultraviolet rays is not cured, but is soluble and removed by the development process. As a result, the gap 104 is formed in the lower part of the sensor unit 102, and the connector layer 103 can form the insulating layer 200 from which the nickel foil surface pattern layer 201 is exposed.

<Distribution of reinforcing plate>
Next, the reinforcing plate 207 is provided between the insulating layer 202 and the insulating layer 203.
First, the release film 300 is removed from the substrate formed through the above steps (FIG. 9A). Next, the reinforcing plate 207 is inserted into the place where the release film 300 is removed (FIG. 9B). The reinforcing plate 207 is an insulator having a predetermined thickness and formed of glass / epoxy resin. In addition, when the reinforcing plate 207 is inserted, the reinforcing plate 207 is adhered between the insulating layer 202 and the insulating layer 203 by bonding with an adhesive that becomes the adhesive layers 208 and 209 (FIG. 9C). .
As a result, the connector portion 103 is thicker than the sensor portion 102 and can be connected to a measuring instrument. Note that, by changing the thickness of the reinforcing plate 207, the board thickness of the connector portion 103 can be changed as appropriate.

From the above description, according to the present embodiment, the thermocouple sensor substrate can be connected to the measuring instrument by reducing the substrate thickness on the sensor unit side and increasing the substrate thickness on the connector unit side. In addition, in a part of a substrate in which a pair of dissimilar metals are laminated on both sides, a dissimilar metal joint can be formed by exposing the other metal surface from one metal surface and performing plating on the other metal surface. Therefore, a thermocouple can be easily configured.
Furthermore, since it can be manufactured by a conventional printed wiring technology manufacturing line, it is possible to realize low-cost manufacturing without requiring a dedicated manufacturing line for the thermocouple sensor substrate.

It is the top view which showed the structure of the thermocouple sensor board | substrate which concerns on embodiment of this invention. It is sectional drawing which showed the AA cross section shown in FIG. FIGS. 3A to 3D are views showing the formation and lamination process of the dissimilar metal-clad laminate. It is the figure which showed the structure of the release film. It is the figure which showed the state of the board | substrate and release film which were laminated | stacked on the lamination jig | tool. 6A to 6C are diagrams showing the etching process. 7A to 7C are views showing a copper plating step and a wiring pattern forming step. 8A to 8D are diagrams showing a protective layer forming process. FIGS. 9A to 9C are views showing a reinforcing plate disposing process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Thermocouple sensor board | substrate 100 Copper wiring pattern 101 Nickel wiring pattern 102 Sensor part 103 Connector part 104 Space | gap 200 Insulating layer 201 Nickel foil surface pattern layer 202 Insulating layer 203 Insulating layer 204 Copper foil layer 205 Copper plating layer 206 Insulating layer 207 Reinforcing plate 208, 209 Adhesive layer 210 Hole 211 Tape 300 Release film 301 Laminating part 302, 303 Arm part 304 Discharge hole 305 Fixing hole 400 First stacking jig 401 Pin 402 Second stacking jig 403 Fixing pin

Claims (10)

A first thin film stacked at least on a lower layer of the first insulating substrate; a second insulating substrate stacked on an upper layer of the first insulating substrate; and the second thin film stacked on an upper layer of the second insulating substrate. A second thin film made of a metal different from the first thin film, and a sensor unit in which a thermocouple sensor is configured to measure the temperature of the fluid is formed at one end and connected to a measuring device at the other end A thermocouple sensor substrate on which a connector part of
A thermocouple sensor substrate, wherein a third insulating substrate is disposed between the first insulating substrate and the second insulating substrate of the connector portion.   The thermocouple sensor substrate according to claim 1, wherein the third insulating substrate is disposed between the first insulating substrate and the second insulating substrate via an adhesive layer.   3. The thermocouple sensor substrate according to claim 1, wherein an insulating layer is formed on each of the outermost layer on the first thin film side and the outermost layer on the second thin film side.   4. The thermocouple sensor substrate according to claim 1, wherein the first thin film and the second thin film are exposed at an end portion of the connector portion. 5.   The thermocouple sensor substrate according to any one of claims 1 to 4, wherein the first thin film is nickel and the second thin film is copper.   The metal used for the first thin film and the second thin film is a combination of copper and a nickel-copper alloy, or a combination of a nickel-copper alloy and a nickel-copper alloy. The thermocouple sensor substrate according to any one of 5. A first thin film is stacked below the first insulating substrate, the second insulating substrate is formed on the first insulating substrate, and a metal different from the first thin film is formed on the second insulating substrate. A thermoelectric sensor that forms a sensor part having a thermocouple sensor for measuring the temperature of the fluid at one end and a connector part for connecting to a measuring device at the other end. A method for manufacturing a sensor substrate,
Sandwiching a release film between the substrates at the other ends of the first insulating substrate and the second insulating substrate;
Applying heat and pressure to the laminated thin film and the insulating substrate,
The first insulating substrate and the second insulating substrate other than the portion where the release film is sandwiched are pressure-bonded,
Remove the release film sandwiched between the substrates at the other end,
A method of manufacturing a thermocouple sensor substrate, comprising disposing the third insulating substrate at the removed position.   8. The method of manufacturing a thermocouple sensor substrate according to claim 7, wherein an insulating layer is further laminated on the first thin film to expose the first thin film at a position where the electrical connection is performed.   9. The thermocouple according to claim 7, wherein the position where the third insulating substrate is disposed has a thickness greater than the position where the first thin film and the second thin film are electrically connected. A method for manufacturing a sensor substrate.   In the release film, a decrease in partial adhesion when the first insulating layer and the second insulating layer are laminated is prevented, and a change in substrate thickness or / and a void are suppressed. The method for manufacturing a thermocouple sensor substrate according to any one of claims 7 to 9, wherein a plurality of holes or slits are processed.

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