JP2009545686A - Tile unit, tile bonding sheet and tile construction method - Google Patents

Abstract

  The tile adhesion sheet 5 including a heat-activatable adhesive resin layer and a plurality of tiles 7 are adhered to the front surface of the tile by the heat-activatable adhesive resin layer. A tile unit 10 is provided. Further, there is provided a tile adhering sheet comprising a heat-activatable adhesive resin layer, wherein the surface of the tile adhering sheet is partially heat-activatable and adhering to the tile. Furthermore, a tile mortar or adhesive is applied to the tile construction surface; the tile unit is applied to the tile construction surface to which the tile adhesion mortar or adhesive is applied, and the tile adhesion mortar or adhesion is applied. There is provided a tile application method comprising at least partially curing the agent; peeling the tile bonding sheet from the tile.

Description

  The present disclosure relates to a tile unit for collectively shipping and constructing on an outer wall of a structure, a tile adhering sheet for forming a tile unit, and a tile construction method.

  In general, tiles constructed on the outer wall of a structure such as a detached house, a condominium, or an office building are shipped and constructed as tile units including a plurality of individual tiles. For example, tiles constructed on the outer wall of a detached house are generally shipped as one tile unit of about 30 cm square. The tile unit is formed by pasting kraft paper on the front surface of several individual tiles with starch glue. At the construction site, mortar or adhesive for bonding tiles is applied to the wall, and tile units connected with kraft paper are pasted before curing. Before the adhesive is fully cured, the kraft paper is moistened with water, and when the starch paste is fully swollen, the kraft paper is peeled off. At this time, the starch paste remaining on the tile is thoroughly washed with water or dilute hydrochloric acid.

  According to such a method, several tiles can be pasted at equal intervals at a time, and the quality and work efficiency are improved compared to pasting one by one. Moreover, as for the outer wall of a high-rise building or the like, it is common to construct a wall construction unit called precast concrete that has been pre-manufactured in a factory in advance and is attached to the wall surface. In that case, precast concrete is manufactured by pouring concrete by arranging tiles fixed in advance in a mold into which concrete is poured.

  In recent years, with the diversification of housing designs, the design of the front surface of tiles has diversified. For this reason, tiles having a rough surface (for example, tiles having a brick-like surface texture) that have not been conventionally produced have been commercialized. In the case of rough tiles, the starch paste after the kraft paper is peeled off cannot be sufficiently washed away and remains on the tile surface. If it is left as it is, the tile surface will be discolored and wrinkles will grow, deteriorating the aesthetics of the tile.

  In order to solve such a problem, for example, JP 2006-169785 A and JP 2003-328536 A use adhesive tape instead of bonding a plurality of tiles to kraft paper with starch glue, A tile unit that connects a plurality of tiles is disclosed. However, in such a tile unit, it is necessary to arrange a spacer so that the adhesive tape does not adhere to the side surface of the tile at the joint interval portion between the plurality of tiles arranged in alignment. Moreover, although the adhesive of an adhesive tape has some form followability with respect to the unevenness | corrugation of a rough surface tile, it is difficult to adhere | attach and adhere | attach the whole tile surface. Moreover, when the adhesive tape is completely adhered to the unevenness of the tile and adhered, the adhesive tends to remain after peeling.

  On the other hand, for the construction of rough tiles, there has also been proposed a method in which the back surfaces of the tiles are connected with a resin, and the connecting portions of the resin are fixed at the time of the construction (refer to JP-A-2002-106148). However, this method requires dedicated equipment, and the construction cost is high.

  The present disclosure includes a tile adhering sheet including a heat-activatable adhesive resin layer and a plurality of tiles, and the tile adhering sheet is thermally activated on the front surface of the tile by the heat-activatable adhesive resin layer. A tile unit is provided which is glued together.

  In another aspect of the present disclosure, a tile adhering sheet comprising a heat-activatable adhesive resin layer, the tile adhering sheet having a surface that partially heat-activates and adheres the tile. Provide a sheet for tile bonding.

In yet another aspect of the disclosure,
Apply tile adhesive mortar or adhesive to the tile construction surface;
Applying the tile unit to the tile application surface to which the tile adhering mortar or adhesive is applied, and at least partially curing the tile adhering mortar or adhesive;
Provided is a tile construction method including peeling a tile bonding sheet from a tile.

It is a perspective view of an example of a tile unit of this indication. It is a perspective view of an example of the sheet for tile adhesion of this indication which formed the heat activation adhesive resin layer which has an opening on a substrate. It is sectional drawing of an example of the sheet | seat for tile adhesion of this indication which provided the surface uneven | corrugated shape on the tile adhesion surface of a heat activation adhesive resin layer. It is a top view of an example of the sheet | seat for tile adhesion | attachment of this indication which formed the heat-activatable adhesive resin layer by pattern-coating the heat-activatable adhesive resin to a base material. It is a top view of an example of the sheet | seat for tile adhesion | attachment of this indication which part-coated the heat activation adhesive resin to the base material, and formed the heat activation adhesive resin layer. It is sectional drawing of an example of the sheet | seat for tile adhesion | attachment of this indication by which the base material was embossed and the heat activation adhesive resin layer was provided in the recessed part. FIG. 3 is a plan view of another example of the tile adhering sheet of the present disclosure further including an at least partially open film laminated on the tile adhering surface of the heat-activatable adhesive resin layer. FIG. 6 is a perspective view of another example of the tile adhering sheet of the present disclosure further including an at least partially open film laminated on the tile adhering surface of the heat-activatable adhesive resin layer. FIG. 6 is a plan view of another aspect of the presently disclosed tile adhering sheet further comprising an at least partially open film laminated on the tile adhering surface of the heat-activatable adhesive resin layer. FIG. 6 is a perspective view of another aspect of the presently disclosed tile adhering sheet further comprising an at least partially open film laminated on the tile adhering surface of the heat activated adhesive resin layer. It is a top view of an example of the sheet | seat for tile adhesion of this indication which applied the coating which reduces an adhesive force at least partially on the tile adhesion surface of a heat-activatable adhesive resin layer. It is the schematic of an example of the manufacturing apparatus of a tile unit. It is sectional drawing of the tile under construction in an example of the tile construction method using the tile unit of this indication, and a tile unit. Photograph taken to confirm the adhesion area before water spraying of the sheet for tile adhesion, which has a sheet of cross-laminated layers of high-density polyethylene drawn tape yarns on the tile adhesion surface of the heat-activated adhesive resin layer It is. Photograph taken to confirm the adhesion area after spraying of the tile adhesive sheet having a sheet of high-density polyethylene stretch tape yarns orthogonally stacked in a lattice pattern on the tile adhesive surface of the heat-activated adhesive resin layer It is. It is the photograph image | photographed in order to confirm the adhesion area before water spraying of the sheet | seat for tile adhesion | attachment in which the tile adhesion surface of the heat-activatable adhesive resin layer is not covered. It is the photograph image | photographed in order to confirm the adhesion area after water spraying of the sheet | seat for tile adhesion | attachment in which the tile adhesion surface of the heat-activatable adhesive resin layer is not covered.

(Definition)
In the present disclosure, “thermally activated adhesive (thermally activated adhesive, thermally activated adhesive is possible)” means that it does not have adhesiveness (adhesiveness) at room temperature, but is heated and activated. Adhesion is performed by contact with the kimono (tile), and after cooling, the adhesion that has already been heat-activated is maintained, but loses tackiness (adhesiveness) again. The heat-activated adhesiveness can be realized by a thermoplastic resin, a thermosetting resin, or a mixture thereof. In the present disclosure, a resin having heat activated adhesiveness is referred to as a heat activated adhesive resin. Typically, when a thermoplastic resin sheet or layer is used, when at least the surface of the thermoplastic resin sheet or layer is heated to near the melting point, the resin becomes tacky, and the adherend (tile) ), And after cooling, the sheet is adhered to the tile, but the sheet returned to room temperature does not exhibit tackiness. In this case, the heat-activatable adhesive resin containing a thermoplastic resin or the like is preferably one that develops tackiness by being heated and softened without melting if the basic shape of the tile adhering sheet is maintained. . However, if the basic shape of the tile bonding sheet is maintained, the heat-activatable adhesive resin may be partially melted or completely melted.

  “The sheet for tile bonding comprises a heat-activatable adhesive resin layer” means that the tile-adhesion sheet may be composed of only the heat-activatable adhesive resin layer, or is thermally activated on the substrate. It means that a tile adhering sheet on which an adhesive resin layer is formed may be used. In the present disclosure, a non-adhesive material layer or an adhesive force reducing material layer can be partially formed on the surface of the heat-activatable adhesive resin layer with or without a base material. In the case where the tile adhering sheet is composed of only the heat-activatable adhesive resin layer, the heat-activatable adhesive resin layer can also be referred to as a heat-activatable adhesive resin sheet.

  According to the present disclosure, a tile adhering sheet comprising a heat-activatable adhesive resin layer and a plurality of tiles, the tile adhering sheet being attached to the front surface of the tile by the heat-activatable adhesive resin layer. A tile unit is provided that is heat activated bonded.

  FIG. 1 illustrates an example of the tile unit 10 of the present disclosure. The tile unit 10 is arranged such that a plurality of tiles 1 are adhered on a tile adhering sheet 5 including a heat-activatable adhesive resin layer, and the front surface of the tile is in contact with the sheet. . The upper surface of the tile 1 in FIG. 1 is a surface that adheres to the back surface, that is, the tile construction surface (for example, the outer surface of a structural building).

  According to this tile unit, instead of the conventional sheet containing kraft paper and starch paste, a sheet including a heat-activated adhesive resin layer is used as a tile bonding sheet. Since the heat-activatable adhesive resin of the activated adhesive resin layer is softened and the tile adhesive surface is adhered and adhered to the unevenness of the rough surface of the tile, the adhesive strength can be sufficiently maintained. In addition, the heat-activated adhesive resin has a higher self-cohesive force at room temperature than the pressure-sensitive adhesive, so the heat-activated adhesive resin layer can be removed from the tile surface with less resin remaining on the tile surface. It can be peeled off, and after construction it can be removed neatly by simply peeling off the sheet.

  As described above, since the heat-activatable adhesive resin layer is not sticky at room temperature (for example, about 25 ° C.), the heat-activatable adhesive resin layer in the joint portion of the tile adheres to the side surface of the tile. The glue surfaces do not adhere to each other and the joint interval does not narrow, or contamination such as dust does not occur during storage, transportation or construction.

  Sheets containing heat-activatable adhesive resin layers can have sufficient strength compared to sheets made of kraft paper and starch paste, so they are easy to handle and can maintain tile spacing during construction. This sheet is water resistant, so it will not break even when exposed to moisture such as rain, or it will absorb water and will not expand or dry to shrink, so it has excellent dimensional stability. ing.

  In addition, the tile unit bonded with a sheet containing a heat-activatable adhesive resin layer can support the placement of tiles with a small area of attachment, such as heavy tiles and stepping joints, and is precast concrete. Larger units can be constructed at one time, such as those used during manufacturing.

  The tile may be any tile applied to a surface such as a wall surface. The surface shape of the tile, the type of glaze, etc. may vary depending on the application.

  A tile adhering sheet for use in the tile unit includes a heat-activatable adhesive resin layer.

  As shown in the above definition, the tile adhering sheet may be composed of only the heat-activatable adhesive resin layer, or the tile adhering layer having the heat-activatable adhesive resin layer formed on the substrate. A sheet may be used. Moreover, the sheet | seat for tile adhesion can have a non-adhesive material layer or an adhesive force reduction material layer at least partially on the surface of a heat-activatable adhesive resin layer.

  Depending on the embodiment, the tile adhering sheet preferably has an elongation of about 1% or less at the time of adhering to the tile and at the time of transportation regardless of the presence or absence of the base material. Considering the temperature rising during tile bonding and transport, in some embodiments, the elongation of a sheet in one direction at 60 ° C. or 80 ° C. is based on the length of the sheet in the same direction at room temperature (eg, 25 ° C.). About 1% or less. If this elongation of the tile adhering sheet is large, the tile adhering sheet may be deformed and the position of the tile may be shifted by the time of construction.

  In some embodiments, the tensile stress at the yield point or the breaking point of the tile bonding sheet from the viewpoints of handleability during tile adhesion, transportation and construction, and flexibility and followability of the sheet when adhered to the tile. Is preferably about 10 to about 25 N / 10 mm.

  In some embodiments, the tile adhering sheet can be transparent or translucent. In these cases, the tile is passed through the sheet at the time of tile application as compared to the conventional tile adhering sheet using kraft paper and starch paste. This is advantageous because the position can be visually confirmed.

  By using a sheet comprising a heat-activatable adhesive resin layer for tile adhesion, the heat-activatable adhesive resin can be brought into close contact with the rough surface of the tile during heat activation by heating to maintain the adhesive strength. At the same time, it becomes easy to peel off the sheet after construction. In some embodiments, unlike using a pressure-sensitive adhesive, the side surfaces of the tile do not adhere to the joint spacing portions and / or the glue surfaces do not adhere to each other and the joint spacing is not reduced and / or stored. There is little or no contamination during transportation, transportation or construction. Moreover, in a certain aspect, since a sheet | seat has sufficient intensity | strength, the handling is easy and it can hold | maintain a tile space | interval at the time of construction. In some embodiments, the sheet is water resistant, so it will not break even when exposed to moisture such as rain, or it will not absorb water and expand or dry and shrink. Are better.

  The size of the tile bonding sheet may vary depending on the shape and size of the tile, the construction surface, the construction method, and the like, and is not limited. In some embodiments, the tile adhering sheet can be rectangular or square, for example, each side of about 100 mm to about 500 mm, preferably about 150 mm to about 350 mm, more preferably about 200 mm to about 300 mm.

  The heat-activatable adhesive resin layer can be formed using a heat-activatable adhesive resin. As explained above, the heat-activated adhesive resin can exhibit adhesiveness (adhesiveness) when heated and maintain the adhesive strength already obtained when cooled, but no longer exhibits adhesiveness (adhesiveness). That's fine.

  As this heat-activatable adhesive resin, a thermoplastic resin can be typically used, but a thermosetting resin having the above-described properties or a blend of a thermoplastic resin and a thermosetting resin can also be used.

  Examples of resins that can be used as the heat-activatable adhesive resin include known materials used in so-called hot melt adhesives. Hot melt adhesives are generally used after being melted (melted), whereas for the purpose of obtaining adhesion as a heat-activatable adhesive resin, this resin is generally used in a softened state. As a material of the heat-activatable adhesive resin, a material used for a hot melt adhesive can be used. In this case, the hot melt adhesive material (thermally activated adhesive resin) is preferably substantially non-sticky at room temperature (eg, 25 ° C.) so that adhesion to the tile side and adhesion of contaminants do not occur. . In some embodiments, the heat-activatable adhesive resin useful in the present disclosure is generally based on, for example, a thermoplastic resin (base polymer), and optionally includes wax and other components.

  Typical examples of thermoplastic resins used for hot melt adhesives and useful for heat-activated adhesive resins are olefin-vinyl acetate copolymers, olefin- (meth) acrylic acid copolymers, olefin- (meta ) Acrylic ester copolymers, polyolefins, polyamides, polyesters, polylactic acids, etc., but these resins can also be suitably used as the heat-activatable adhesive resin of the present disclosure.

  As the heat-activatable adhesive resin, a copolymer of an olefin monomer such as ethylene and a comonomer such as (meth) acrylic acid (or an ester thereof) or vinyl acetate (VA) is useful. For example, ethylene-vinyl acetate ( EVA) copolymer, ethylene- (meth) acrylic acid copolymer, and ethylene- (meth) acrylic acid ester copolymer.

  In the present disclosure, it is preferable to use a copolymer of ethylene and (meth) acrylic acid (or an ester thereof) as the base polymer of the heat-activatable adhesive resin of the present disclosure. For example, ethylene-ethyl acrylate (EEA) copolymers, ethylene-methyl methacrylate (EMMA) copolymers, and ethylene-acrylic acid (EAA) copolymers, ethylene-acrylic having excellent flexibility at temperatures typically encountered during transportation Ethyl acid (EEA) copolymers are preferred.

  Specific examples of the ethylene-acrylic acid copolymer include Sumix Seikasen (trade name) manufactured by Sumitomo Seika, Lexpearl EAA (trade name) manufactured by Nippon Polyethylene, Everflex-EEA (trade name) manufactured by Mitsui DuPont Polychemical, and manufactured by Nippon Polyethylene. Examples of Lexpearl EEA (trade name) and ethylene-methacrylic acid copolymer include Nucleel (trade name) manufactured by Mitsui DuPont Polychemicals. The ratio of the olefin monomer to the comonomer may be variously changed depending on the required adhesive strength, the temperature at the time of bonding processing (that is, the bonding temperature at the time of manufacturing the tile unit), the highest temperature expected at the time of transportation, and the like. For example, in the case of an EEA copolymer, the weight percent (EA%) of EA is from about 10 to about 50% by weight, preferably from about 15 to about 40% by weight, particularly preferably about It is 20-35 mass%.

  Polyolefin materials are also useful as heat-activatable adhesive resins. Examples of the thermoplastic polyolefin or thermoplastic olefin elastomer that can be used as the base polymer of the heat-activatable adhesive resin include amorphous polyolefin, amorphous poly-α-olefin (propylene homopolymer, ethylene-propylene copolymer, 1- Butene-propylene copolymer), ethylene-propylene copolymer (EPM), ethylene-propylene-diene (EPDM) copolymer and the like. These polymers may be partially grafted with functional groups. Also, a mixture of two or more types of thermoplastic polyolefins or thermoplastic olefin elastomers can be used as the base polymer.

  In addition, as specific examples of thermoplastic polyolefin or thermoplastic olefin elastomer, Eastflex manufactured by Eastman Chemical Co. (amorphous polyolefin system), Ubetak manufactured by Ube Industries, Ltd. (amorphous poly-α-olefin system), Best Plast (Amorphous Poly-α-Olefin) from Huls, Thermorun (EPM / EPDM) from Mitsubishi Chemical, Idemitsu TPO (EPM / EPDM) from Idemitsu Petrochemical, Mitsui Chemicals Admer (modified polyolefin type) and the like.

  In addition to the thermoplastic resin as the base polymer, the heat-activatable adhesive resin is effective for lowering the melt viscosity of the adhesive to improve its coatability and other physical properties of the adhesive (eg, In addition, it is also possible to contain a wax which is effective for adjusting the hardness, softening point, hot tackiness, etc.

  In general, any known wax that can be used for a hot melt adhesive can be used as the wax. Examples of the wax that can be used include low molecular weight polyethylene, low molecular weight polypropylene, Fischer-Tropsch wax, microcrystalline wax, and paraffin wax. Of these, Fischer-Tropsch wax is preferably used because of its good compatibility with thermoplastic polyolefins or thermoplastic olefin elastomers and easy adjustment of the adhesive melt viscosity. A typical example of Fischer-Tropsch wax is that of the Sazole H series manufactured by Sazol. It is also possible to use a mixture of two or more waxes.

  The heat-activatable adhesive resin can contain, for example, a wax in the range of 0 to about 40% by mass. When the wax content exceeds about 40% by mass, there is a possibility that the original adhesiveness of the heat-activatable adhesive resin (for example, hot melt adhesive composition) may be impaired.

  In the present disclosure, the heat-activatable adhesive resin may contain an antioxidant, a stabilizer, a plasticizer, a filler, a thermoplastic resin, a thermoplastic elastomer, or the like as an additive. In general, the amount of these additives and any other optional additives is selected so as to achieve a desired effect within a practical range that does not impair the performance of the adhesive in the end use.

  The heat-activatable adhesive resin can also be a thermosetting resin or a blend of a thermoplastic resin and a thermosetting resin. As an example of such a thermosetting resin, there is no adhesiveness in a semi-cured state at room temperature, it expresses fluidity by melting at a predetermined temperature higher than that, and is cured when held for a certain time at that temperature or higher, What is generally called a B-stage adhesive is mentioned. Such adhesives include, for example, glycidyl ethers of bisphenol A, alicyclic epoxy compounds, novolak epoxy resins, epoxy resins such as urethane-modified epoxy resins, curing agents such as imidazole derivatives and alkylurea derivatives, and if necessary In addition, a curing accelerator and, if necessary, a filler may be contained. Further, a thermoplastic resin such as a copolymer containing (meth) acrylic acid ester may be blended and further contained in the adhesive. In addition, if necessary, a release layer (release paper, release film, etc.) is provided on the tile adhesive surface of the heat-activatable adhesive resin layer, and the adhesive layer is used by removing the release layer when manufacturing the tile unit. May be.

  Heat-activatable adhesive resins generally have no tackiness (adhesiveness) at room temperature, and are heated and softened to show tackiness (adhesiveness), that is, the resin softening temperature is room temperature. It needs to be higher. In addition, after the tile adhesive sheet is bonded to the tile, it shows stickiness during storage and transportation so that adhesion and contaminants do not adhere to the side of the tile, or the tile adhesive sheet is attached to the tile during storage and transportation. It is preferable that the heat-activatable adhesive resin has a high softening temperature and melting point in consideration of a temperature that may increase during storage, transportation, or construction so as to maintain the adhesion. Therefore, in one embodiment, the melting point of the heat-activatable adhesive resin is not limited, but is preferably about 60 ° C. or higher, when measured according to JIS K7121 (1987 version), about 80 ° C. or higher. It is more preferable that On the other hand, in some embodiments, the melting point is preferably about 150 ° C. or lower, more preferably about 110 ° C. or lower. The higher the melting point of the resin is, the more stable the temperature is in the storage environment. However, a very high melting point is not necessary and is not economical because it reduces the efficiency of the bonding operation to the tile.

  The thickness of the heat-activatable adhesive resin layer is not particularly limited. However, in the absence of a substrate, the thickness of the heat-activatable adhesive resin layer is not necessarily limited in order to ensure sufficient strength of the tile unit and maintain good handleability, but usually , About 50 micrometers (μm) to about 5 millimeters (mm). On the other hand, when there is a substrate, the thickness of the heat-activatable adhesive resin layer may be any thickness that can follow the unevenness of the tile surface, and is not limited, for example, about 10 μm to about 1 mm, preferably Can be from about 20 μm to about 100 μm.

  If the heat-activatable adhesive resin layer has a sufficiently high strength by itself or if the weight of the tile is small, a substrate is not necessary, and there are a plurality of heat-activatable adhesive resin layers in the form of independent sheets. The tiles may be carried.

  However, in some embodiments, it may be necessary or desirable to increase the strength of the tile-adhering sheet, so that the heat-activated adhesive resin layer is preferably supported on a substrate. In addition, when the heat-activatable adhesive resin layer is discontinuous, it may be necessary to carry the heat-activatable adhesive resin layer on the base material.

As a base material, in a certain aspect, a suitable plastic sheet such as a polyolefin-based polymer sheet such as polyethylene, polypropylene or a copolymer or blend thereof, a polyester sheet such as polyethylene terephthalate, or a polyamide sheet is used. Among these, high density polyethylene is preferable, and fillers such as CaCO ₃ or talc may be mixed to further increase the strength.

  In order to suppress the elongation of the tile bonding sheet at the time of tile bonding and transportation to about 1% or less, the elongation of the base material of the tile bonding sheet is preferably about 1% or less at the time of tile bonding and transportation. More specifically, considering the maximum temperature during tile bonding and transportation, the elongation of the tile bonding sheet in a certain direction at 60 ° C. or even 80 ° C. is the same direction at normal temperature (for example, 25 ° C.). Based on the length of the sheet, it is preferably 1% or less.

  The tensile stress at the yield point or the breaking point of the base material is not limited, but is preferably 5 to 40 N / 10 mm at room temperature (25 ° C.), more preferably about 10 to about 25 N / 10 mm. preferable.

  In addition, the thickness of the base material is usually, in one aspect, so as to maintain the flexibility to obtain good workability while ensuring sufficient strength to hold the tiles at a predetermined interval. The thickness is about 20 μm to about 5 mm, preferably about 30 μm to about 150 μm.

  The shape and dimensions of the substrate are useful for defining the shape and dimensions of the tile-adhering sheet, and as described above, in certain embodiments, the substrate may be, for example, about 100 mm to about 500 mm on each side, preferably Can be rectangular or square, from about 150 mm to about 350 mm, more preferably from about 200 mm to about 300 mm.

  The method for forming the heat-activatable adhesive resin layer on the substrate is not particularly limited. After forming the substrate and the heat-activatable adhesive resin layer separately, they may be laminated, or the heat-activatable adhesive resin layer may be formed on the substrate by a method such as extrusion molding or coating, Furthermore, the base material and the heat-activatable adhesive resin layer may be formed by a two-layer coextrusion method or the like. When the heat-activatable adhesive resin layer is made of a thermoplastic resin, melt extrusion is simple.

  A tile unit forming method and a tile construction method using a tile adhering sheet comprising a heat-activatable adhesive resin layer with or without a substrate will be described later.

  In general, tiles have various surface shapes, and those made of various materials (glaze etc.) are available. Therefore, the degree of adhesion between the tile and the tile bonding sheet may vary depending on the tile. Therefore, even when a tile adhering sheet having the same heat-activatable adhesive resin layer is used, there may be a difference in the force for peeling the tile adhering sheet after tile construction depending on the type of tile. The tile adhesive sheet is peeled off before the substance that fixes the tile to the building (for example, the adhesive) is completely cured. If the peel force is too large, the tile after construction is applied to the construction surface. It may peel off from the agent, which may lead to poor construction. When trying to control the adhesive force by changing the thickness of the tile adhesive sheet, it is difficult to achieve a good balance between the adhesive force and the peel force when using a tile with a surface material that has large surface irregularities but is easy to adhere.

  According to a preferred aspect of the present disclosure, the adhesive force of the tile bonding sheet is variously adjusted according to the surface shape of the tile to be used, the outermost surface material (glaze, surface coating, etc.), and / or the tile construction method. can do. Specifically, the adhesion area between the heat-activatable adhesive resin layer and the tile surface is changed according to the type of tile and / or the method of applying the tile. Change the adhesive area of the heat-activatable adhesive resin layer in the tile adhesive sheet and adjust the sheet peeling force of the entire tile unit, (sheet peeling force) <(adhesive strength to fix the tile to the building exterior) If the relationship is established, it is possible to prevent tile displacement and detachment during construction. Here, the sheet peeling force corresponds to the force required to peel the tile bonding sheet from the front surface of the tile (that is, the bonding surface with the sheet). In the present disclosure, the thermal activity of the tile bonding sheet It essentially refers to the force required for interfacial peeling between the adhesive resin layer and the front surface of the tile. The adhesive strength that secures the tile to the building exterior corresponds to the adhesion between the back of the tile and the tile construction surface (such as the exterior of the building) (generally the adhesive between the tile and the exterior of the building is completely Not hardened), interfacial peeling at the interface between the tile and the adhesive for tile construction, cohesive failure inside the adhesive for tile construction, and interfacial peeling at the interface between the adhesive for tile construction and the tile construction surface It refers to the smallest force required. The adhesive force between the tile and the tiled surface is typically about 50 gf because the adhesive between the tile and the tiled surface is not fully cured so that the tile can be repositioned. / Cm (49 N / m). As described above, even when the adhesive force between the tile and the tile construction surface is low, it is desirable to prevent the displacement and detachment of the tile when peeling the tile adhering sheet.

  By adjusting the adhesive area of the heat-activatable adhesive resin layer of the tile adhesive sheet, the adhesive strength of the sheet can be easily adjusted according to various usage forms, and tiles with various surface shapes and outermost surface materials can be adjusted. While holding sufficiently during transportation, it is possible to prevent problems such as displacement and detachment of tiles when the tile adhering sheet is peeled off after the tile is applied.

  As described above, the tile bonding sheet of the present disclosure adheres relatively strongly to the tile, and keeps the unit while transporting the tile unit, but peels off the tile. In this case, since the cohesive force of the resin is higher than that of the pressure-sensitive adhesive, the heat-activatable adhesive resin layer is less likely to cohesively break at room temperature, and a part of the resin does not remain on the tile surface. Therefore, the tile adhering sheet of the present disclosure has excellent properties as an adhesive sheet for forming a tile unit and constructing a tile. In the present disclosure, the peeling force from the tile of the tile bonding sheet depends on the type of tile and the type of adhesive that bonds the tile to the wall surface, and is not limited. It is preferably adjusted to about 20 to 150 gf / cm (20 to 147 N / m).

  In one aspect, the adjustment of the adhesion area between the heat-activatable adhesive resin layer and the tile in the tile adhering sheet includes a heat-activatable adhesive resin layer and has a surface that partially heat-activates and adheres to the tile. This is achieved by using a tile bonding sheet. For example, the present disclosure is not limited to the following, but the surface of the heat-activatable adhesive resin layer is imparted with a surface uneven shape, or the heat-activatable adhesive resin layer is only partially formed on the surface of the substrate, The heat-activated adhesive resin layer formed on the sheet is partially covered with a layer of a non-adhesive material or an adhesion-reducing material so that the heat-activated adhesive resin layer is only partially exposed. Adjustment is achieved. Such a method will be specifically described below.

  Adjustment of the adhesion area in the heat-activatable adhesive resin layer of the tile adhering sheet is achieved, for example, by deforming the heat-activatable adhesive resin layer itself.

  For example, when the tile adhering sheet consists only of a heat-activatable adhesive resin layer, and when the tile adhering sheet has a heat-activatable adhesive resin layer on a substrate, the heat having an opening is similarly applied. The adhesion area can be adjusted by a method such as forming an activated adhesive resin layer or forming an uneven surface on the surface of the thermally activated adhesive resin layer.

  FIG. 2 shows an example of a heat-activated adhesive resin layer having an opening. An opening 9 is formed in the heat-activatable adhesive resin layer 4. In the tile bonding sheet of FIG. 2, the heat-activatable adhesive resin layer 4 is formed on the substrate 8, but the substrate may not be provided. Further, the opening may penetrate from the heat-activatable adhesive resin layer 4 to the base material 8.

  In order to form an opening in the sheet-like heat-activatable adhesive resin layer, the sheet-like heat-activatable adhesive resin layer is punched into a certain shape with a punching blade, or a cutter or a laser is used. By cutting and removing the shape, a partially activated heat-activatable adhesive resin layer can be produced. If possible, the opening may be formed in advance when the sheet-like heat-activatable adhesive resin layer is formed.

  The sheet-like heat-activatable adhesive resin layer in which the opening is formed can be used as a tile-adhering sheet as it is or by being laminated on a base material.

  The shape and dimensions of the opening are not particularly limited, and may be determined according to the adhesive strength of the heat-activatable adhesive resin layer and the type of tile, and may be, for example, a circle, an ellipse, a triangle, a rectangle, or a square. It's okay.

  The opening ratio of the heat-activatable adhesive resin layer having these openings can be about 20 to about 90% with respect to the area of the entire bonding surface of the tile bonding sheet, depending on the application, and about 30 ~ 80% is preferred. By selecting an appropriate aperture ratio within the above range, it is possible to obtain an optimum sheet peeling force when peeling the tile adhesive sheet after tile construction, while preventing tile displacement and dropout during transportation. it can.

  It is also possible to make the surface of the heat-activatable adhesive resin layer have an uneven surface shape so that only the top surface of the convex portion comes into contact with the tile and exhibits heat-activatable adhesiveness. As an example, FIG. 3 shows a cross-sectional view of a tile adhering sheet 5 having a surface uneven shape on the tile adhering surface of the heat-activatable adhesive resin layer 4 formed on the substrate 8. In FIG. 3, the tile adhering sheet has a base material, but the base material may not be provided. By adopting such a surface shape for the tile adhesion surface, only the convex part and its vicinity become a substantial adhesion part, so the adhesion area between the heat-activated adhesive resin layer and the tile surface can be changed. Become.

  The uneven surface shape imparted to the tile adhesion surface of the heat-activatable adhesive resin layer may be any shape and size, for example, truncated cone, truncated pyramid, rectangular parallelepiped, cylinder, hemispherical, etc. These shapes may be reversed to form concave portions (in this case, the convex portions are portions other than those provided with these shapes). Further, the arrangement of the irregularities may be regular or irregular. The shape, size, and arrangement of such surface irregularities depend on the type of tile, the melting characteristics of the heat-activatable adhesive resin, and the manufacturing conditions of the tile sheet. What is necessary is just to select so that it may become about 20 to about 90% with respect to the area of the whole sheet | seat, Preferably it is about 30 to about 80%. The depth of the recess is preferably about 10 μm to about 1 mm, more preferably about 20 μm to about 100 μm, depending on the desired adhesive strength of the heat-activatable adhesive resin layer.

  The surface uneven shape is obtained by heating the heat-activatable adhesive resin to the vicinity of the melting point or higher and pressing a mold having a desired surface shape or performing general embossing, thereby forming the heat-activatable adhesive resin layer. It can be applied to the tile adhesive surface.

  When the tile bonding sheet has a heat-activatable adhesive resin layer on the base material, as described above, the heat-activatable adhesive resin layer (film or sheet) having an opening or a surface irregular shape on the base material. May be laminated to form a tile adhering sheet. In addition, when the heat-activatable adhesive resin layer is formed on the base material, the heat-activatable adhesive resin layer may be partially formed on the base material and formed so as to have a surface uneven shape. Alternatively, after the heat-activatable adhesive resin layer is formed on the substrate, a part of the heat-activatable adhesive resin layer may be removed.

  As a method for partially forming the heat-activatable adhesive resin layer on the substrate, for example, a pattern coating method, a part coating method, or the like can be used. The pattern coat refers to coating a heat-activated adhesive resin layer in a predetermined pattern such as a dot shape or a lattice shape, and the part coat is a stripe-shaped, partially heat-activated adhesive resin layer. Refers to coating. As an example, FIGS. 4 and 5 are plan views showing a tile adhering sheet 5 obtained by pattern-coating and part-coating the heat-activatable adhesive resin layer 4 on a base material 8, respectively.

  The pattern shape or stripe shape, arrangement, and spacing of the pattern coat or part coat may vary depending on the application. In addition, the area of the heat-activatable adhesive resin layer that has been pattern-coated or part-coated is about 20 to about 90%, preferably about 30 to about 80%, with respect to the area of the entire tile bonding sheet. Further, since the tile adhering sheet includes a base material, the heat-activatable adhesive resin layer may be continuous or discontinuous.

  For the pattern coat or part coat, the die shape on the side of the heat-activatable adhesive resin layer is selected so as to have a desired pattern or stripe, and the heat-activatable adhesive resin layer is extrusion-laminated to the substrate in two layers, These layers can be done by coextrusion through a die.

  Further, as described above, a surface irregularity shape can be imparted to the tile adhesion surface of the heat-activatable adhesive resin layer formed on the substrate, or the heat-activatable adhesive resin layer can be embossed.

  In addition, by using an embossed sheet with surface irregularities as a base material and coating a heat-activatable adhesive resin layer thereon, the heat-activatable adhesive resin layer is formed only in the recesses of the embossed base material. The convex portion of the embossed base material may be a non-adhesive portion, or the thickness of the heat-activatable adhesive resin layer is different in the surface, so that the convex portion of the embossed base material is substantially non-adhesive portion. You may make it become. As an example, FIG. 6 illustrates a cross-sectional view of a tile adhering sheet 5 in which the heat-activatable adhesive resin layer 4 is formed only in the recesses of the embossed base material 8.

  The surface uneven shape of the embossed sheet used as the base material of the tile bonding sheet may be any shape and size, and examples thereof include a truncated cone, a truncated pyramid, a rectangular parallelepiped, a cylinder, and a hemisphere. It is done. Further, the arrangement of the irregularities may be regular or irregular. In this aspect of the present disclosure, a substantial heat-activatable adhesive resin layer is formed in a concave portion having a surface irregularity shape to form a tile adhesion surface of a tile adhesion sheet. The area of the concave-convex surface-concave shape is about 20 to about 90%, preferably about 30 to about 80% with respect to the entire area of the tile bonding sheet on the surface on which the heat-activatable adhesive resin layer is formed. . Further, the depth of the recess is preferably about 10 μm to about 1 mm, more preferably about 20 μm to about 100 μm, depending on the thickness of the substrate and the desired adhesive strength of the heat-activatable adhesive resin layer. Moreover, in this aspect, the heat-activatable adhesive resin layer may partially or entirely cover the convex portions having a surface irregular shape. Even when the heat-activatable adhesive resin layer covers the convex portion in this way, the thickness of the heat-activatable adhesive resin layer of the convex portion is different from that of the concave portion, so the adhesive force differs in the plane. Can occur, and the adhesion area between the heat-activatable adhesive resin layer and the tile surface can be substantially changed. Further, since the tile adhering sheet includes a base material, the heat-activatable adhesive resin layer may be continuous or discontinuous.

  The tile adhering sheet of this aspect is prepared by providing an embossed sheet having a surface irregularity shape, that is, a base material, by heating to a temperature near or higher than the melting point of the sheet used for the base material and performing general embossing. The heat-activatable adhesive resin layer can be produced by extruding and laminating two layers on this substrate.

  When the tile adhesive sheet comprising the heat-activatable adhesive resin layer formed as described above is adhered to a plurality of tiles, at least the adhesive surface of the heat-activatable adhesive resin layer is not the entire surface of the tile adhesive sheet. Therefore, the tile bonding sheet is partially bonded to the tile. Therefore, the adhesive force with the tile can be easily adjusted by changing the adhesion area without changing the type and thickness of the heat-activatable adhesive resin layer. As a result, while holding tiles with various surface shapes and outermost surface materials sufficiently during transportation, it prevents the occurrence of problems such as tile displacement and detachment when the tile bonding sheet is peeled off after the tile is applied. can do.

  In another aspect, the adjustment of the adhesion area of the heat-activatable adhesive resin layer is achieved by providing a layer of a non-adhesive material or an adhesion reducing material on the heat-activatable adhesive resin layer. In this case, even when not specifically described below, the heat-activatable adhesive resin layer can be formed on the substrate.

  For example, a partially opened film or sheet of non-adhesive material can be laminated on the heat-activatable adhesive resin layer.

  As a partially opened film or sheet, use is made of a sheet (laminated cloth) having an opening surrounded by the side of the tape yarn, in which the tape yarns are orthogonally or obliquely laminated in a lattice pattern and the intersection is fixed can do. As an example, FIG. 7A and FIG. 7B illustrate a tile adhering sheet 5 in which a sheet 11 having an opening is laminated on the tile adhering surface of the heat-activatable adhesive resin layer 4. FIG. 7A is a plan view. Although the base material 8 is under the heat-activatable adhesive resin layer 4 in the perspective view of FIG. 7B, this base material may be omitted. The tape yarn used for this sheet may be a stretch of a commonly used industrial film such as polyethylene or polypropylene, and a high-density polyethylene stretch tape yarn is preferred from the standpoint of strength and the like.

  The thickness of the tape yarn may be, for example, about 5 μm to about 100 μm, preferably about 10 μm to about 50 μm, depending on the thickness of the heat-activated adhesive resin layer used. The width of the tape yarn may vary depending on the size of the tile, the opening area, etc., and may be, for example, about 0.5 mm to about 10 mm, preferably about 1 to about 5 mm.

  These tape yarns are arranged in a certain direction in a length direction and arranged at a predetermined interval, and are arranged in a length direction in another direction orthogonal or oblique to the direction and arranged in a plurality of intervals at a predetermined interval. The sheet can be produced by heating or pressure bonding with an adhesive. Moreover, it is good also as a film opened partially by laminating | stacking the tape yarn in which the length direction was oriented in more than two directions (for example, 3 directions).

  Moreover, the film which provided the opening part partially by punching etc. can also be used as a film partially opened. As an example, FIGS. 8A and 8B show a tile adhering sheet 5 in which such a film 12 is laminated on the tile adhering surface of the heat-activatable adhesive resin layer 4 as a plan view and a perspective view. In FIG. 8B, although the base material 8 exists under the heat-activatable adhesive resin layer 4, this base material is not necessary. The shape of the opening provided by the punching process may be various, and may be, for example, a circle, an ellipse, a triangle, a rectangle, or a square.

  In addition, as a material for this film, polyester such as polyethylene, polypropylene, polyethylene terephthalate, polystyrene, nylon, and blends thereof can be used. The thickness of the film is not limited, but may be about 5 μm to about 100 μm, preferably about 10 μm to about 50 μm, depending on the thickness of the heat-activated adhesive resin layer used.

  For example, a partially opened film or sheet can be produced by punching such a film into a certain shape with a punching blade, or cutting and removing a certain shape using a cutter or a laser.

  The aperture ratio of these partially open films or sheets can be from about 20 to about 90%, from about 30 to about 80, based on the total area of the adhesive surface of the tile bonding sheet, depending on the application. % Is preferred. By selecting the aperture ratio within the above range, it is possible to obtain an optimum sheet peeling force when peeling the tile bonding sheet after the tile construction, while preventing the tile from shifting or dropping off during transportation.

  Such a partially opened film or sheet can be laminated on the tile-bonding surface of the heat-activatable adhesive resin layer to form a tile-bonding sheet. Specifically, a heat-activatable adhesive resin film or sheet is prepared. For example, a tile-adhesive sheet is produced by heat laminating the partially opened film or sheet to the heat-activatable adhesive resin. it can. The temperature of the heat laminate is preferably, for example, the melting point of the heat-activatable adhesive resin + about 30 ° C. or less so that the heat-activatable adhesive resin does not flow excessively and covers the entire partially opened film. It is more preferable that the melting point of the heat-activatable adhesive resin + about 20 ° C. or less. Specifically, the heat lamination temperature is not limited, but is preferably about 60 ° C to about 150 ° C.

  In addition, by partially applying a coating of an adhesive strength reducing material (also called paste-killing coating) on the tile adhesion surface of the heat-activatable adhesive resin layer, the heat-activatable adhesive resin layer and the tile surface It is also possible to change the bonding area.

  As an example, FIG. 9 illustrates a tile adhering sheet 5 in which such a coating 13 is applied on the tile adhering surface of the heat-activatable adhesive resin layer 4. The coating that reduces the adhesive strength refers to a coating that uses a material that does not exhibit adhesiveness at the temperature at which the tile is bonded when the tile unit is manufactured, and a non-adhesive portion is formed on the tile adhesive surface of the heat-activatable adhesive resin layer. To form.

  Examples of the material that does not exhibit adhesiveness at a temperature (for example, about 80 ° C.) at which the tile is bonded during the production of the tile unit include a composition containing a (meth) acrylate polymer such as polymethyl methacrylate (PMMA). In this case, for example, a photo-initiator, a sensitizer, other reactive and non-reactive monomers and oligomers may be added to methyl methacrylate (MMA) monomer to form a UV curable composition. In addition, other materials can be used regardless of whether or not they are UV curable as long as they do not exhibit adhesiveness at the above bonding temperature, and examples of other materials include general printing ink.

  The coverage of the adhesion-reducing material coating is from about 10 to about 80% (ie, the exposed area of the tile adhesive surface is from about 20 to about 90%), preferably from about 20 to about 70% (ie, tile), depending on the application. The exposed area of the adhesive surface is about 30 to about 80%). Further, the thickness of the coating can be appropriately selected according to the thickness of the heat-activatable adhesive resin layer, the viscosity characteristics of the coating composition to be used, the application method of the coating composition, etc. May be from about 0.1 μm to about 100 μm.

  For example, when the UV curable composition is used for coating an adhesive strength reducing material, the UV curable composition is thermally activated and bonded using a general printing technique such as a screen printing machine or an offset gravure printing machine. Printed on the tile adhesion surface of the conductive resin layer with a pattern such as stripe, dot or lattice so as to achieve the above-mentioned coverage, and then purge the irradiation atmosphere with nitrogen if necessary, mercury lamp, metal halide By irradiating with ultraviolet rays using a lamp or the like, a non-adhesive portion can be formed on the tile adhesive surface of the heat-activatable adhesive resin layer.

  When a tile bonding sheet formed by the above-described method, in which a heat-activatable adhesive resin layer is partially covered with a layer of a non-adhesive material or an adhesion-reducing material, is bonded to a plurality of tiles, Since the heat-activatable adhesive region of the curable adhesive resin layer is partially present rather than the entire surface of the tile adhesive sheet, the tile adhesive sheet is partially adhered to the tile. Therefore, without changing the kind and thickness of the heat-activatable adhesive resin layer, the adhesive force with the tile can be easily adjusted by changing the adhesion area. As a result, while holding tiles with various surface shapes and outermost surface materials sufficiently during transportation, it prevents the occurrence of problems such as tile displacement and detachment when the tile bonding sheet is peeled off after the tile is applied. can do.

  The tile unit of the present disclosure includes a step of heat-bonding a tile-adhesive sheet having heat-activated adhesiveness to a plurality of tiles in a state where the front surfaces of the plurality of tiles are in contact with the tile-adhesive sheet. Can be manufactured.

  More specifically, the tile unit prepares a tile adhering sheet comprising a step of arranging a plurality of tiles so as to correspond to an expected arrangement of tiles after construction; and a heat-activatable adhesive resin layer. Arranging a plurality of arranged tiles and a sheet for adhering tiles such that the front surfaces of the plurality of tiles are in contact with the heat-activatable adhesive resin layer; and It can be manufactured by a method including a step of heating and pressing to bond the heat-activatable adhesive resin layer to a plurality of tiles.

  Also, in the bonding process, depending on the configuration of the tile bonding sheet, in general, the contact surface of the heat-activatable adhesive resin layer with the tile is softened, but the adhesive layer is not melted and pressurized to be thermally activated. It is preferable that the adhesive resin layer is in close contact with the tile (thermocompression bonding). To prevent tile peeling and misalignment due to a decrease in tile holding power during storage and transportation of the tile unit, the heat bonding temperature should be higher than expected when storing and transporting the tile unit. It is desirable. Specifically, the heat bonding temperature is not limited, but is preferably 60 ° C. or higher, and more preferably 80 ° C. or higher.

  In a preferred embodiment, a plurality of tiles can be preheated before the bonding step, and bonding can be performed using the heated tiles.

  Of course, as the tile adhering sheet of the present disclosure, the tile adhering sheets of any form of the present disclosure described above can be used.

  A tile knit manufacturing method will be described using an example of a tile unit manufacturing apparatus shown in FIG.

  First, a plurality of tiles 1 are arranged on the belt conveyor 2 in a desired arrangement with the front surface of the tiles facing up. Next, if necessary, the tile 1 is passed through a heating furnace 3 set to a temperature at which the heat-activatable adhesive resin softens, for example, a temperature lower than the melting point (for example, 80 to 110 ° C.). Preheat. On the other hand, a tile adhering sheet 5 having the heat-activatable adhesive resin layer 4 (the substrate 8 may or may not be included. The heat-activatable adhesive resin layer 4 may be a partially formed layer). The sheet 5 for tile bonding is unwound from the sheet roll 6 wound with the heat, and the heat-activatable adhesive resin layer 4 is in contact with the front surface of the tile 1 on the tile 1 preheated as necessary. Deploy. And the sheet | seat 5 is crimped | bonded with the roller 7 in a heating atmosphere as needed, and it cut | disconnects to each unit, and the tile unit 10 of this indication is formed. Moreover, you may heat the roller 7 in order to accelerate | stimulate adhesion | attachment as needed.

  The tile unit of the present disclosure includes a step of applying a tile bonding mortar or an adhesive to a tile installation surface; and the tile unit of the present disclosure is applied to the tile installation surface to which the tile bonding mortar or the adhesive is applied. Applying and partially curing the tile bonding mortar or adhesive; and peeling the tile bonding sheet from the tile.

  An example of the tile construction method of the present disclosure will be described in more detail with reference to FIG. After the tile unit 10 of the present disclosure is manufactured by the above-described method, the tile unit is transported to a construction site, and a known tile bonding mortar or modified silicone bonding is performed on the tile construction surface such as the outer surface of the building structure 15 at the construction site. An adhesive 14 such as an agent is applied, leveled as necessary, and the tile unit 10 is attached to the surface to which the adhesive 14 is applied. Then, by leaving for a predetermined time (about 1 to about 3 hours), when the tile mortar or the modified silicone adhesive is somewhat cured and fixed at least so that the tile does not move by its own weight, the tile 1 is bonded to the tile. The sheet 5 for use is peeled off. FIG. 10 shows a tile adhering sheet 5 that is peeled off from the top at the interface between the tile 1 and the heat-activatable adhesive resin layer 4.

  At this time, when the tile adhesive sheet of the present disclosure is used, even if the tile adhesive mortar or the modified silicone adhesive is in a semi-cured state, the tile adhesive sheet is not left behind and the tile adhesive sheet is not left off. Can be peeled off and the tile position can be finely adjusted. In particular, when the preferred tile bonding sheet of the present disclosure in which the adhesive force is appropriately adjusted is used, the tile bonding sheet has a sufficient holding power during transportation for various tiles, while the tile bonding sheet is used during tile construction. It is possible to easily adjust the necessary adhesive force and the desired peeling force so that the adhesive can be peeled without any adhesive residue and the tiles are not displaced or detached.

  Further, in the step of peeling the tile bonding sheet from the tile, before and / or during peeling, for example, water is sprayed so as to enter between the tile bonding sheet 5 and the tile 1 (indicated by arrows in FIG. 10). The peeling force of the tile adhering sheet can be advantageously reduced.

  When the tile adhering sheet is peeled off while spraying water so as to enter between the tile adhering sheet and the tile, the tile adhering sheet can be peeled off more easily. Although not bound by any theory, it is thought that this phenomenon can be explained as follows. The front surface of the tile generally has a relatively high affinity with water due to the glaze, hydrophilic surface coating or surface shape thereof, while the adhesive surface of the tile bonding sheet of the present disclosure is Since the heat-activatable adhesive resin is generally hydrophobic, the adhesive surface of the tile adhering sheet has a relatively low affinity with water. Therefore, when the tile bonding sheet is peeled off, if water is sprayed between the tile bonding sheet and the tile, the water will become familiar with the front surface of the tile, and the hydrophobic tile bonding sheet will be removed. The adhesive surface is easily separated from the front surface of the tile. In the preferable tile bonding sheet of the present disclosure, when at least part of the surface unevenness shape remains on the bonding surface of the tile bonding sheet after tile bonding, or a partially opened film or sheet is provided on the bonding surface. This effect is particularly noticeable because water tends to enter through voids or gaps in the adhesive surface or through discontinuities in the adhesive surface structure (eg, the boundary between the partially opened film and the adhesive layer). It is. In addition, the water spraying effect in the conventional tile bonding sheet using kraft paper and starch paste promotes cohesive failure of starch paste and assists the peeling of the bonding sheet. Is quite heterogeneous.

  Moreover, the tile unit of the present disclosure can be directly applied to a tile construction surface such as a building structure surface. Alternatively, the tile unit of the present disclosure can be applied to a precast board at a factory, and then the precast board can be applied to a building structure as is conventional.

  Hereinafter, this indication is explained using an example. Unless otherwise specified, percentages, parts and ratios are based on mass.

Tile unit evaluation method 1 (Example 1 to Example 5)
Hold the end of the tile unit, hang it in the vertical direction, and shake it back and forth to see if the tile is missing. In addition, a tile bonding mortar is applied to the wall, the tile unit is attached to the wall, the mortar is cured, and then the sheet is peeled off from the tile. Observe the tile surface to see if any residue remains.

Tile unit evaluation method 2 (Examples 6 to 16)
Hold the end of the tile unit, hang it in the vertical direction, and shake it back and forth to make sure that the tile does not fall or peel off. Further, a modified silicone adhesive is applied to the base of the building outer wall, and a comb is put on the adhesive surface to acclimate it flatly. Then, another tile unit similarly manufactured is attached to the adhesive surface. After 2 hours, the tile bonding sheet is peeled off. Observe the tile surface to see if any residue remains. Also, check for tile displacement and detachment from the outer wall.

Example 1
The base material is a blend of polypropylene and polyethylene (6: 4) with a thickness of 80 μm, and on top of that is applied Seixen (trade name) manufactured by Sumitomo Seika which is an ethylene-acrylic acid copolymer (EAA) emulsion. And dried to form a heat-activatable adhesive resin layer having a thickness of 15 μm. The melting point of this thermally activated adhesive resin layer was 90 ° C. by DSC (differential scanning calorimetry).

  The tiles were arranged at even intervals with the front side facing up and heated to 80 ° C. in an oven. The above sheet cut to a size of 200 mm × 280 mm was placed so that the heat-activatable adhesive resin layer was in contact with the front surface of the tile, and pressure was applied. As a result, the heat-activatable adhesive resin softened and adhered to the tile. After the tiles had cooled sufficiently, a tile unit was formed with multiple tiles adhered to the sheet.

  The results of evaluating the tile unit according to the tile unit evaluation method 1 are shown in Table 1 below.

Example 2
Using the same sheet as Example 1 as a base material, an ethylene-methacrylic acid copolymer N0908 (product number) made by Mitsui DuPont Polychemical Co., Ltd. was extruded and laminated using a T-die at a thickness of 80 μm. An activated adhesive resin layer was formed. The melting point of this heat-activated adhesive resin layer was 99 ° C. by DSC (differential scanning calorimetry). The tile unit was produced and evaluated in the same manner as in Example 1, and the obtained results are shown in Table 1 below.

Example 3
Using the same sheet as Example 1 as a base material, an ethylene-acrylic acid copolymer A210K (trade name) manufactured by Nippon Polyethylene was extruded and laminated with a T-die at a thickness of 80 μm, and thermal activation was performed. An adhesive resin layer was formed. The melting point of the thermally activated adhesive resin layer was 98 ° C. by DSC (differential scanning calorimetry). Production and evaluation of the tile unit were performed in the same manner as in Example 1, and the obtained results are shown in Table 1 below.

Example 4 (comparison)
The tiles were arranged at regular intervals with the front side facing upward, and a sheet of kraft paper having a size of 200 mm × 280 mm was coated with starch paste over the surface. It was sufficiently dried at 100 ° C. for about 10 minutes. After the tiles had cooled sufficiently, a tile unit was formed with multiple tiles adhered to the sheet. Evaluation of the tile unit was performed in the same manner as in Example 1, and the obtained results are shown in Table 1 below.

Example 5 (comparison)
The same sheet as in Example 1 was used as a base material, and an adhesive in which 100 parts by mass of a petroleum tackifier was added to 100 parts by mass of a styrene-isoprene copolymer was laminated to a thickness of 30 μm. A tile unit was formed in the same manner as in Example 1 except that the adhesive layer was adhered to the tile. Evaluation of the tile unit was performed in the same manner as in Example 1, and the obtained results are shown in Table 1 below.

Example 6
A high-density polyethylene sheet having a thickness of 90 μm with talc added is used as a base material, and an ethylene-ethyl acrylate (EEA) copolymer of 25% ethyl acrylate (EA) is formed thereon with a thickness of 60 μm. Extrusion lamination was performed using a T-die, and a heat-activated adhesive resin layer was formed on the entire sheet surface. Next, a sheet (tape yarn thickness 30 μm, tape yarn width 2 mm, opening rate 58%) in which high-density polyethylene stretched tape yarns are orthogonally laminated in a lattice pattern and the intersections are fixed is thermally activated adhesive resin. The laminate was heat laminated at about 80 ° C. in contact with the layer to form a tile bonding sheet. The melting point of this heat-activated adhesive resin layer was 91 ° C. by DSC (differential scanning calorimetry).

  Next, 12 tiles (width 45 mm × length 145 mm × thickness 5 mm) were arranged in a pallet with the front surface of the tile facing upward and the joint spacing being about 5 mm. The tile is preheated to 80 ° C., and the tile bonding sheet cut to a size of 200 mm × 280 mm is arranged so that the heat-activated adhesive resin layer is in contact with the front surface of the tile, and the pressure is applied at 80 ° C. added. As a result, the heat-activatable adhesive resin softened and adhered to the tile. After the tiles had cooled sufficiently, a tile unit was formed with multiple tiles adhered to the sheet.

  The results of evaluation according to the tile unit evaluation method 2 are shown in Table 2 below.

  Moreover, according to the method similar to the evaluation method 2 of a tile unit, two tile units were attached to the building outer wall base | substrate, and were left for 2 hours. For one tile unit, after visually confirming that the sheet is totally bonded to the ground (shown in FIG. 12), peel off the tile bonding sheet while measuring the sheet peeling force with a push-pull gauge. It was. For the other tile unit, a part of the tile adhering sheet is peeled off, and then water is sprayed around the tile adhering sheet and left for 5 minutes, and then the adhering area (indicated by a white line in FIG. 13) is provided. After checking visually, the sheet | seat for tile adhesion was peeled off, measuring peeling force with a push pull gauge. The results of comparing the presence or absence of water spraying are shown in Table 3 below.

Example 7
The same sheet as in Example 6 and ethylene-ethyl acrylate (EEA) copolymer were used as a substrate and a heat-activated adhesive resin, respectively, and this heat-activated adhesive resin was used at a thickness of 60 μm using a T-die. Extrusion lamination was carried out, and a heat-activatable adhesive resin layer was formed on the entire surface of one sheet to form a tile bonding sheet. The tile unit was produced and evaluated in the same manner as in Example 6, and the obtained results are shown in Tables 2 and 3 below. Moreover, the comparison before water spraying and 5 minutes after water spraying is shown in FIG. 14 (the sheet is entirely bonded to the ground) and 15 (the adhesive region is surrounded by a white line), respectively.

Example 8
The same sheet as in Example 6 was used as a base material, and an ethylene-methyl methacrylate (EMMA) copolymer having a methyl methacrylate (MMA) content of 9% was extrusion laminated using a T-die at a thickness of 80 μm. Then, a heat-activatable adhesive resin layer was formed on the entire surface of the sheet to form a tile bonding sheet. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 2 below.

Example 9
Using the same sheet as Example 6 as a base material, an ethylene-acrylic acid (EAA) copolymer of 7% acrylic acid (AA) was extruded and laminated with a T-die at a thickness of 80 μm, A heat-activatable adhesive resin layer was formed on the entire sheet surface to form a tile bonding sheet. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 2 below.

Example 10 (comparison)
Twelve tiles (width 45 mm × length 145 mm × thickness 5 mm) were arranged in a pallet with the front surface of the tile facing upward and the joint spacing being about 5 mm. On top of that, a sheet having a surface of a kraft paper having a size of 200 mm × 280 mm coated with starch paste was attached. It was sufficiently dried at 100 ° C. for about 10 minutes. After the tiles had cooled sufficiently, a tile unit was formed with multiple tiles adhered to the sheet. The results of evaluation according to the tile unit evaluation method 2 are shown in Table 2 below.

Example 11
The same sheet as in Example 6 and ethylene-ethyl acrylate (EEA) copolymer were used as a substrate and a heat-activated adhesive resin, respectively, and this heat-activated adhesive resin was used at a thickness of 60 μm using a T-die. Extrusion lamination was carried out to form a heat-activatable adhesive resin layer on one side of the sheet. Next, a high-density polyethylene film (thickness 50 μm, hole diameter 6 mm, opening ratio 58%) provided with a large number of circular holes is brought into contact with the heat-activated adhesive resin layer and heat laminated at about 80 ° C. A tile bonding sheet was formed. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

Example 12
The same sheet as in Example 6 and ethylene-ethyl acrylate (EEA) copolymer were used as a substrate and a heat-activated adhesive resin, respectively, and this heat-activated adhesive resin was used at a thickness of 60 μm using a T-die. Extrusion lamination was carried out to form a heat-activatable adhesive resin layer on one side of the sheet. Next, a grid-like pattern having a line width of 2 mm is printed on the adhesive layer using a screen printer so that the non-printing portion is 58% using a UV curable composition containing methyl methacrylate monomer, and a metal halide lamp is used. The printed grid pattern was cured by irradiating with ultraviolet rays to form a tile bonding sheet. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

Example 13
The same sheet as in Example 6 and ethylene-ethyl acrylate (EEA) copolymer were used as a substrate and a heat-activated adhesive resin, respectively, and this heat-activated adhesive resin was used at a thickness of 60 μm using a T-die. Extrusion lamination was carried out to form a heat-activatable adhesive resin layer on one side of the sheet. Next, a truncated quadrangular pyramid recess (5 mm on each side of the top of the truncated quadrangular pyramid, 7 mm on each side of the bottom, 50 μm in height, 50% area ratio of the apex of the truncated quadrangular pyramid to the entire sheet processing surface) The mold was heated to 80 ° C. and pressed against the adhesive layer for 2 seconds to transfer the shape of the mold to the adhesive layer to form a tile bonding sheet. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

Example 14
The substrate used in Example 6 is embossed, and a rectangular recess is formed on the surface on which the heat-activatable adhesive resin layer is formed (each side is 5 mm, each bottom is 7 mm, height is 50 μm, recess area ratio is 50%). Formed. On the surface on which the heat-activatable adhesive resin layer is formed, the ethylene-ethyl acrylate (EEA) copolymer used in Example 6 is extruded and laminated with a T-die at a thickness of 60 μm. A tile adhering sheet in which the heat-activatable adhesive resin layer was applied to the recesses was formed. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

Example 15
The ethylene-ethyl acrylate (EEA) copolymer used in Example 6 was extruded and laminated on the base material used in Example 6 with a specially shaped die having a thickness of 60 μm, and 5 mm on a side and 60 μm in thickness. A tile bonding sheet in which an adhesive layer having a square pattern with an area ratio of 58% was applied to the substrate was formed. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

Example 16
The substrate used in Example 6 was extruded and laminated with the ethylene-ethyl acrylate (EEA) copolymer used in Example 6 at a thickness of 60 μm using a slit-shaped die, 5 mm in width, 60 μm in thickness, and coating area. A tile bonding sheet in which a stripe-shaped adhesive layer having a ratio of 56% was applied to the substrate was formed. The tile unit was produced in the same manner as in Example 6, and the results of evaluation according to the tile unit evaluation method 2 are shown in Table 4 below.

  According to the tile adhering sheet and tile unit of the present disclosure, not only the conventional kraft paper tile adhering sheet and the tile unit using the same, but also the dimensional stability is good, there is no adhesive residue, and the appearance is excellent. It is excellent in workability and can be installed at low cost. Also, by adjusting the area of the heat-activated adhesive resin layer of the tile adhesive sheet, it can be peeled off while maintaining the adhesive strength according to various tiles. The industrial utility is clear.

Claims (19)

  A tile adhering sheet comprising a heat-activatable adhesive resin layer and a plurality of tiles, wherein the tile adhering sheet is thermally activated on the front surface of the tile by the heat-activatable adhesive resin layer Tile unit that is bonded.   The tile unit according to claim 1, wherein the tile bonding sheet is composed of only a heat-activatable adhesive resin layer.   The tile unit according to claim 1, wherein the tile bonding sheet includes a base material and a heat-activatable adhesive resin layer formed on the base material.   The heat-activatable adhesive resin layer has an opening or an uneven surface shape, and the tile-adhesive sheet is partially heat-activated and adhered to the front surface of the tile. The tile unit described.   The heat-activatable adhesive resin layer is partially formed on the substrate or has an uneven surface shape, and the tile-adhesive sheet is placed on the tile surface by the heat-activatable adhesive resin layer. The tile unit according to claim 3, wherein the tile unit is partially heat-activated bonded to the surface.   The tile bonding sheet includes a heat-activatable adhesive resin layer, and a non-adhesive material layer or an adhesion-reducing material layer partially formed on the heat-activatable adhesive resin layer, and the tile adhesion The tile unit according to claim 1, wherein the sheet is partially thermally activated and adhered to the front surface of the tile by the thermally activated adhesive resin layer.   The tile bonding sheet includes a base material, a heat-activatable adhesive resin layer formed on the base material, and a non-adhesive material layer partially formed on the heat-activatable adhesive resin layer, or 2. The tile according to claim 1, further comprising an adhesive strength reducing material layer, wherein the tile adhering sheet is partially thermally activated bonded to a front surface of the tile by the heat activated adhesive resin layer. unit.   A tile adhering sheet comprising a heat-activatable adhesive resin layer, wherein the tile adhering sheet has a surface that partially heat-activates and adheres to a tile.   The tile bonding sheet according to claim 8, wherein the tile bonding sheet is composed only of a heat-activatable adhesive resin layer having an opening or a surface uneven shape.   The tile bonding sheet according to claim 8, wherein the tile bonding sheet includes a base material and a heat-activatable adhesive resin layer partially formed on the base material or having a surface uneven shape. .   The tile bonding sheet includes a heat-activatable adhesive resin layer and a non-adhesive material layer or an adhesion-reducing material layer partially formed on the heat-activatable adhesive resin layer. The sheet | seat for tile adhesion as described in.   The tile bonding sheet comprises a base material, a heat-activatable adhesive resin layer formed on the base material, and a non-adhesive material layer partially formed on the heat-activatable adhesive resin layer, or The sheet | seat for tile adhesion | attachment of Claim 8 containing an adhesive force reduction material layer.   The sheet | seat for tile adhesion | attachment of any one of Claims 8-12 in which the said heat-activatable adhesive resin layer comprises a thermoplastic resin.   The thermally activated adhesive resin layer is made of olefin-vinyl acetate copolymer, olefin- (meth) acrylic acid copolymer, olefin- (meth) acrylic acid ester copolymer, polyolefin, polyamide, polyester, polylactic acid. The sheet | seat for tile adhesion | attachment of any one of Claims 8-12 containing resin chosen from consisting of.   The sheet | seat for tile adhesion | attachment of any one of Claims 8-12 in which the said heat-activatable adhesive resin layer contains resin which has melting | fusing point of about 60 degreeC or more.   The tile bonding sheet according to any one of claims 8 to 12, wherein an elongation of the tile bonding sheet in a certain direction at 60 ° C is 1% or less based on a sheet length in the same direction at 25 ° C. Sheet.   The tile bonding sheet according to claim 8, wherein the tile bonding sheet is transparent or translucent. Apply tile adhesive mortar or adhesive to the tile construction surface;
The tile unit according to any one of claims 1 to 7 is applied to a tile construction surface to which a tile bonding mortar or an adhesive is applied, and the tile bonding mortar or the adhesive is at least partially. Curing;
A tile construction method including peeling the tile bonding sheet from the tile.   The tile construction method according to claim 18, wherein the peeling includes spraying water on the tile unit before and / or when peeling the tile bonding sheet from the tile.

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