JP2009303271A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2009303271A5 JP2009303271A5 JP2009224161A JP2009224161A JP2009303271A5 JP 2009303271 A5 JP2009303271 A5 JP 2009303271A5 JP 2009224161 A JP2009224161 A JP 2009224161A JP 2009224161 A JP2009224161 A JP 2009224161A JP 2009303271 A5 JP2009303271 A5 JP 2009303271A5
- Authority
- JP
- Japan
- Prior art keywords
- pair
- electrode
- adhesive
- electrode pad
- package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Claims (2)
前記前工程に続く後工程として、
前記パッケージの前記一対の電極パッドに導電性接着剤を塗布する接着剤塗布工程と、
前記一対の引出し電極のうち、前記圧電振動片の前記内側底面と対向する面において、当該対向面に形成された励振電極と接続されていない方の引出し電極が、前記パッケージの内側底面に形成された前記一対の電極パッドのうちの一方の電極パッドと、当該対向面に形成された励振電極と接続されている方の引出し電極が、前記一対の電極パッドのうちの他方の電極パッドと、それぞれ接続されるように、前記接着剤が塗布された前記一対の電極パッド上に、前記圧電振動片を載置して前記導電性接着剤を硬化させる接合工程と、
前記パッケージを蓋体により気密に封止する封止工程と
を含んでおり、
前記接着剤塗布工程においては、前記一方の電極パッドへの接着剤塗布量を、前記他方の電極パッドへの接着剤塗布量よりも少なくする
ことを特徴とする圧電デバイスの製造方法。 An accommodation container as a package having at least a pair of electrode pads formed on the inner bottom surface, a plate shape having a rectangular or square outer shape made of a piezoelectric material, excitation electrodes respectively formed on both front and back surfaces, and one end of the plate-like body A pre-process for forming piezoelectric vibrating reeds each including a pair of lead electrodes formed separately from each other and one of which is connected to one of the front and back excitation electrodes;
As a subsequent process following the previous process,
An adhesive application step of applying a conductive adhesive to the pair of electrode pads of the package;
Of the pair of extraction electrodes, the extraction electrode that is not connected to the excitation electrode formed on the opposing surface is formed on the inner bottom surface of the package on the surface facing the inner bottom surface of the piezoelectric vibrating piece. In addition, one electrode pad of the pair of electrode pads and a lead electrode connected to the excitation electrode formed on the facing surface are respectively connected to the other electrode pad of the pair of electrode pads, A bonding step of placing the piezoelectric vibrating piece and curing the conductive adhesive on the pair of electrode pads coated with the adhesive so as to be connected;
A sealing step of hermetically sealing the package with a lid,
In the adhesive application step, the amount of adhesive applied to the one electrode pad is made smaller than the amount of adhesive applied to the other electrode pad.
該ニードル治具の一対のノズルのうち、前記一方の電極パッドの接着剤を塗布する一方のノズルが、前記他方の電極パッドへ接着剤を塗布する他方のノズルよりもノズル径が小さくされていることを特徴とする請求項１に記載の圧電デバイスの製造方法。 In the adhesive application step, a needle jig having a pair of nozzles corresponding to each electrode pad of the pair of electrode pads is used,
Of the pair of nozzles of the needle jig, one nozzle that applies the adhesive of the one electrode pad has a smaller nozzle diameter than the other nozzle that applies the adhesive to the other electrode pad. The method for manufacturing a piezoelectric device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009224161A JP5018852B2 (en) | 2009-09-29 | 2009-09-29 | Method for manufacturing piezoelectric device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009224161A JP5018852B2 (en) | 2009-09-29 | 2009-09-29 | Method for manufacturing piezoelectric device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007120553A Division JP4935490B2 (en) | 2007-05-01 | 2007-05-01 | Piezoelectric device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2009303271A JP2009303271A (en) | 2009-12-24 |
| JP2009303271A5 true JP2009303271A5 (en) | 2010-06-17 |
| JP5018852B2 JP5018852B2 (en) | 2012-09-05 |
Family
ID=41549592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009224161A Expired - Fee Related JP5018852B2 (en) | 2009-09-29 | 2009-09-29 | Method for manufacturing piezoelectric device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP5018852B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5787350B2 (en) | 2010-04-27 | 2015-09-30 | ユニタイト株式会社 | Fastening structure, reaction force washer used therefor, and fastening socket |
| US9278849B2 (en) * | 2012-06-15 | 2016-03-08 | The Boeing Company | Micro-sensor package and associated method of assembling the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11284483A (en) * | 1998-03-30 | 1999-10-15 | Kyocera Corp | Crystal oscillator |
| JP2003032068A (en) * | 2001-07-11 | 2003-01-31 | Nippon Dempa Kogyo Co Ltd | Crystal units for surface mounting |
| JP4042150B2 (en) * | 2003-05-19 | 2008-02-06 | 株式会社大真空 | Piezoelectric vibration device |
| JP2005318330A (en) * | 2004-04-28 | 2005-11-10 | Kyocera Kinseki Corp | Piezoelectric vibrator |
-
2009
- 2009-09-29 JP JP2009224161A patent/JP5018852B2/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2009206482A5 (en) | Manufacturing method of semiconductor device | |
| JP2013144576A5 (en) | ||
| JP2010147153A5 (en) | ||
| JP2012024564A5 (en) | ||
| CN106510692B (en) | A stretchable flexible electrode and its preparation method | |
| JP2008293000A5 (en) | ||
| JP2016012604A5 (en) | ||
| WO2011139602A3 (en) | Methods for forming a connection with a micromachined ultrasonic transducer, and associated apparatuses | |
| JP2010124467A5 (en) | ||
| JP2010287710A5 (en) | Semiconductor device manufacturing method | |
| EP2363374A3 (en) | Manufacturing Method of MEMS Package, and Oscillator | |
| JP2016044978A5 (en) | ||
| JP2018087335A5 (en) | ||
| JP2014013795A5 (en) | ||
| JP5704231B2 (en) | Electronic component and method for manufacturing electronic component | |
| TWI456017B (en) | Method of manufacturing bonded member and bonded member manufacturing apparatus | |
| JP2009303271A5 (en) | ||
| TWM505698U (en) | Pre molded can package | |
| JP2009188374A5 (en) | ||
| JP2008518807A5 (en) | ||
| JP2012209764A5 (en) | ||
| TWI689114B (en) | Piezoelectric ceramic apparatus and forming method thereof | |
| JP2014138083A5 (en) | ||
| JP2008278286A5 (en) | ||
| CN107449455A (en) | A kind of ultrasonic sensor |