JP2009292699A - Method for cutting glass substrate, method for cutting substrate for display panel and method for manufacturing substrate for display panel - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for cutting a glass substrate by which the life of a cutting wheel can be prolonged. <P>SOLUTION: The method for cutting the glass substrate for a display panel, on the surface of which a wiring pattern is formed, includes: a step of linearly removing the wiring pattern 1031 by irradiating the wiring pattern 1031 (pattern of metal thin film) formed on the surface of the substrate 1 (glass substrate) for a display panel with a laser beam; and a step of forming a scribe line along the position where the wiring pattern 1031 is removed by the irradiation with the laser beam L by a cutting wheel 8 to cut the substrate. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for cutting a glass substrate, a method for cutting a substrate for a display panel, and a method for manufacturing a substrate for a display panel, and particularly preferably, cutting a glass substrate on which a predetermined pattern is formed. The present invention relates to a method for cutting a display panel substrate on which a predetermined wiring pattern or the like is formed on the surface, and a method for manufacturing a display panel substrate.

  As a method of cutting a glass substrate such as a glass substrate for a liquid crystal display panel, for example, a scribe line is formed on the glass substrate using a glass cutter and then an external force is applied to the glass substrate. A method of cutting a glass substrate along a line is widely used.

  As a glass cutter for forming a scribe line on a glass substrate, a substantially disc-shaped cutting wheel is widely used. The cutting wheel is brought into contact with the glass plate, and the cutting wheel and the glass substrate are moved relative to each other, thereby rolling the cutting wheel on the surface of the glass plate. A scribe line is formed on the trajectory where the cutting wheel comes into contact and rolls.

  By the way, in the manufacturing process of the liquid crystal display panel, a predetermined process is performed in the state of the mother glass until a predetermined process, for example, a wiring pattern of a plurality of liquid crystal panels is formed on a large mother glass. Then, after passing through a predetermined process, it is cut into individual liquid crystal display panels. In addition, after a predetermined inspection of the liquid crystal display panel, unnecessary portions (for example, a portion where inspection terminals are formed) are cut from the main body of the liquid crystal display panel. The cutting wheel may be used for cutting such a liquid crystal display panel (glass substrate for a liquid crystal display panel).

  In the process of cutting the glass substrate for the display panel, particularly in the process of cutting the portion where the inspection terminal is formed, a predetermined wiring pattern made of a metal thin film or the like is formed on the cutting line of the cutting wheel. There is. In such a case, it is necessary to bring a cutting wheel into contact with the glass substrate from above the wiring pattern made of a metal thin film or the like and form a scribe line on the glass substrate from above the wiring pattern.

  However, in the configuration in which the scribe line is formed on the glass substrate from above the wiring pattern, the following problem may occur. That is, in the configuration in which the scribe line is formed on the glass substrate from above the wiring pattern, the cutting wheel is greatly damaged by the wiring pattern, and the scribe line is formed on a simple glass substrate (a glass substrate on which a metal thin film or the like is not formed). The life of the cutting wheel may be shortened compared to the case of forming. For this reason, it is necessary to frequently replace the cutting wheel, leading to an increase in manufacturing cost of the liquid crystal display panel. Moreover, since the damage which a cutting wheel receives is large, the kind of cutting wheel which can be used may be limited. In particular, since only an expensive cutting wheel could be used, the manufacturing cost of the liquid crystal display panel was increased.

JP 63-155125 A

  In view of the above circumstances, the problem to be solved by the present invention is a glass substrate cutting method, a display panel substrate cutting method, and a display panel substrate manufacturing method capable of extending the life of a cutting wheel. It is to provide a method for cutting a glass substrate, a method for cutting a substrate for a display panel, and a method for manufacturing a substrate for a display panel that can provide or increase the types of cutting wheels that can be used.

  In order to solve the above problems, the present invention provides a method for cutting a glass substrate having a metal thin film formed on a surface thereof, wherein the metal thin film is formed by irradiating a laser on the metal thin film formed on the surface of the glass substrate. The gist of the present invention includes a step of removing, and a step of forming a scribe line with a cutting wheel along a position where the metal thin film is removed by laser irradiation and cutting.

  Here, the metal thin film is preferably a wiring pattern. The metal thin film preferably includes at least a layer made of aluminum.

  The present invention relates to a method for cutting a substrate for a display panel in which a thin film-like wiring is formed on the surface, and the thin film-like wiring formed on the surface of the display panel substrate is removed by irradiating a laser. And a step of forming and cutting a scribe line with a cutting wheel along the position where the thin film-like wiring is removed by irradiating the laser.

  The present invention is a method for manufacturing a substrate for a display panel, the step of removing the wiring pattern by irradiating the wiring pattern formed on the surface of the substrate for the display panel with a laser, and the wiring pattern And a step of cutting a substrate for the display panel by forming a scribe line with a cutting wheel along the removed position.

  The present invention is a method for manufacturing a substrate for a display panel, and irradiates a laser at a boundary between a portion where a display area formed on the substrate for a display panel is formed and a portion where a terminal for lighting inspection is formed And removing the metal thin film formed on the boundary, and forming a scribe line with a cutting wheel at the boundary where the metal thin film is removed to form a portion where the terminal for lighting inspection is formed A method for manufacturing a substrate for a display panel, comprising:

  Here, the metal thin film is preferably a wiring pattern.

  According to the present invention, a metal thin film or the like on a cutting line (a line on which the cutting wheel is to come into contact) is previously removed with a laser, and then the cutting wheel is brought into contact with the position where the metal thin film or the like has been removed, thereby providing a scribe line. Form. For this reason, the damage which a cutting wheel receives can be reduced compared with the structure which abuts a cutting wheel on metal thin films etc. and forms a scribe line. Therefore, the life of the cutting wheel can be extended.

  Moreover, since the damage which a cutting wheel receives can be reduced, the restriction | limiting of the kind of cutting wheel which can be used decreases. Therefore, since various cutting wheels can be applied, an increase in manufacturing cost can be suppressed by applying an inexpensive cutting wheel.

  Embodiments of the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is an external perspective view schematically showing the configuration of the liquid crystal display panel 3 before cutting a portion where a lighting inspection terminal or the like is provided. As shown in FIG. 1, the liquid crystal display panel 3 includes a pair of substrates 1 and 51, and the pair of substrates 1 and 51 are arranged to face each other at a predetermined minute interval. The liquid crystal is filled between the pair of substrates 1 and 51. One of the pair of substrates has a portion 103 where a lighting inspection terminal or the like is provided. The lighting inspection is to inspect whether there is a display defect or the like by actually displaying a predetermined image or the like on the liquid crystal display panel 3.

  On the surface of the portion 103, a terminal for inputting a signal for performing a lighting test of the liquid crystal display panel 3 and a predetermined signal for transmitting the input signal for the lighting test to the main body of the liquid crystal display panel 3 are provided. A wiring is formed. The predetermined wiring is a thin film pattern made of a metal thin film, and is made of, for example, aluminum.

  The portion 103 where the lighting inspection terminal and the like are provided is cut and separated from the main body after the predetermined lighting inspection of the liquid crystal display panel 3 is completed. Therefore, the manufacturing process of the liquid crystal display panel 3 includes a step of cutting a portion where a predetermined wiring pattern 1031 (that is, a metal thin film pattern) is formed on the surface.

  FIG. 2 is a cross-sectional view schematically showing a cutting process of the portion 103 where the lighting inspection terminals and the like are provided.

  As shown in FIG. 2A, the surface of the display panel substrate 1 includes a predetermined wiring pattern 1031 (metal thin film pattern) including a portion 103 provided with lighting inspection terminals and the like. For example, aluminum). Therefore, in order to form a scribe line by pressing the cutting wheel on the wiring pattern 1031 (metal thin film pattern), the metal thin film must also be cut by the cutting wheel. For this reason, the damage which a cutting wheel receives is large, and the lifetime of the cutting wheel was shortened. Moreover, since the damage which a cutting wheel receives is large, the kind of cutting wheel which can be used was limited.

  Therefore, as shown in FIG. 2B, the laser pattern L is irradiated onto the wiring pattern 1031 (metal thin film pattern) on the planned cutting line of the display panel substrate 1. Here, the planned cutting line is a boundary between the portion 103 where the terminal for lighting inspection and the like are formed and the main body (region 101 where the display region is formed). The laser L is strong enough to remove the wiring pattern 1031 on the planned cutting line, and does not affect the display panel substrate 1 (glass substrate) (for example, cracks due to heat). It does not occur). For example, a YAG laser of about 2 to 16 W can be applied.

  The spot diameter of the laser L is not particularly limited. In short, when the scribe line is formed by bringing the cutting wheel into contact with the display panel substrate 1 in a later step, the wiring pattern 1031 (the metal thin film of the metal thin film) remains on the surface of the display panel substrate 1. The diameter should not be in contact with the (pattern).

  When the wiring pattern 1031 (metal thin film pattern) on the planned cutting line is irradiated with the laser L, the wiring pattern 1031 (metal thin film pattern) on the planned cutting line is removed as shown in FIG. As a result, the display panel substrate 1 (ie, the glass substrate) is exposed on the planned cutting line.

  Then, as shown in FIG. 2D, the cutting wheel 8 is brought into contact with the planned cutting line, and the display panel substrate 1 and the cutting wheel 8 are relatively moved in this state. FIG. 3 is an external perspective view schematically showing a process of moving the display panel substrate 1 and the cutting wheel 8 relative to each other by bringing the cutting wheel 8 into contact with the display panel substrate 1. It is. When the cutting wheel 8 is brought into contact with the display panel substrate 1 and the display panel substrate 1 and the cutting wheel 8 are moved relative to each other as shown in FIGS. A scribe line (crack) S is formed on the locus of contact while rotating 8.

  Next, as shown in FIG. 2E, an external force is applied to the portion 103 where the lighting inspection terminal and the like are formed, and the scribe formed in the previous step is grown. As a result, the scribe reaches the surface on the opposite side of the display panel substrate 1 (the surface opposite to the side on which the cutting wheel 8 is in contact), and the portion 103 where the lighting inspection terminals and the like are formed is a main body portion. Disconnect from and separate.

  In the embodiment of the present invention, since the wiring pattern 1031 on the planned cutting line is removed, the cutting wheel 8 is in direct contact with the display panel substrate 1 (glass substrate). That is, it is not necessary for the cutting wheel 8 to cut the wiring pattern 1031 (metal thin film pattern). For this reason, the damage which the cutting wheel 8 receives can be made small, and the lifetime of the cutting wheel 8 can be extended. Moreover, since the damage which the cutting wheel 8 receives is small, the kind of applicable cutting wheel 8 also increases. Therefore, by applying an inexpensive cutting wheel 8, the manufacturing cost can be reduced or the rise can be suppressed.

  As mentioned above, although embodiment of this invention was described in detail, this invention is not limited to the said embodiment at all. That is, various modifications can be made without departing from the spirit of the present invention.

It is the external appearance perspective view which showed typically schematic structure of the display panel provided with the board | substrate for display panels before the area | region where the terminal for lighting inspection etc. is formed is cut and separated. It is sectional drawing which showed typically the cutting method of the board | substrate (glass substrate) for display panels concerning embodiment of this invention, (a) is before the area | region in which the terminal for lighting inspection etc. is formed is cut and separated. (B) shows the state of irradiating the wiring pattern (metal thin film pattern) on the planned cutting line with laser, and (c) shows that the wiring pattern (metal thin film pattern) on the planned cutting line is removed. (D) shows a process of forming a scribe by a cutting wheel, and (e) shows a state where a portion where a lighting inspection terminal or the like is formed is cut and separated. It is the external appearance perspective view which showed typically the process of making the cutting wheel contact | abut to the board | substrate for display panels, and moving the board | substrate for display panels, and a cutting wheel relatively.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate for display panel 101 Display area 103 Portion where inspection terminal etc. are provided 1031 Wiring pattern 3 Display panel 8 Cutting wheel L Laser S Scribe line

Claims (7)

  A method of cutting a glass substrate having a metal thin film formed on a surface thereof, the step of irradiating the metal thin film formed on the surface of the glass substrate with a laser to remove the metal thin film on a cutting line, and a laser And cutting the glass substrate by forming a scribe line with a cutting wheel along the position where the metal thin film is removed.   The glass substrate cutting method according to claim 1, wherein the metal thin film is a wiring pattern.   The method for manufacturing a glass substrate according to claim 1, wherein the metal thin film includes a layer made of at least aluminum.   A method of cutting a substrate for a display panel in which a thin film-like wiring is formed on the surface, the step of removing the thin film-like wiring formed on the surface of the display panel substrate by irradiating a laser, Forming a scribe line with a cutting wheel along a position where the thin film-like wiring is removed by irradiating the laser, and cutting the substrate for a display panel.   A method for manufacturing a substrate for a display panel, the step of removing the wiring pattern by irradiating the wiring pattern formed on the surface of the substrate for the display panel with a laser, and the position where the wiring pattern is removed Forming a scribe line with a cutting wheel along the cutting line and cutting the display panel substrate.   A method for manufacturing a substrate for a display panel, wherein the boundary is formed by irradiating a laser at a boundary between a portion where a display area formed on the substrate for a display panel is formed and a portion where a terminal for lighting inspection is formed. Removing the metal thin film formed on the substrate, and forming a scribe line on the boundary from which the metal thin film has been removed by forming a scribe line from the portion where the display area is formed. A method for producing a substrate for a display panel, comprising:   The method for manufacturing a substrate for a display panel according to claim 6, wherein the metal thin film is a wiring pattern.

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