JP2009284602A - Electrical junction box - Google Patents

Abstract

The present invention provides an electrical junction box with reduced manufacturing costs.
SOLUTION: A case 11, a circuit board 13 accommodated in the case 11, a bus bar connection land 15 formed on the surface of the circuit board 13 by a printed wiring technique, and a first soldered to the bus bar connection land 15. The bus bar 16 and the second bus bar 17 and the semiconductor relay 18 connected to the first bus bar 16 and the second bus bar 17 are provided. As a result, an expensive press machine is not required, and the manufacturing cost can be reduced.
[Selection] Figure 5

Description

  The present invention relates to an electrical junction box in which a circuit board including a bus bar is accommodated in a case.

Conventionally, a case, a circuit board housed in the case and mounted with electronic components on one side, and a bus bar bonded to the other side of the circuit board via an adhesive layer are provided. An electrical junction box is known (see Patent Document 1). The electrical junction box is disposed between the power source of the vehicle and the in-vehicle electrical component, and performs energization and disconnection of the in-vehicle electrical component.
JP 2003-164039 A

  According to said structure, the circuit board and the bus bar are adhere | attached via the adhesive bond layer. For this reason, in the process of bonding the bus bar and the circuit board, a pressing process is necessary to securely bond the bus bar and the circuit board. In this pressing process, for example, a considerable pressure is required to suppress air from remaining between the bus bar and the circuit board. For this reason, in order to obtain a required pressure, since the comparatively expensive press machine is needed, there existed a problem that manufacturing cost raised.

  The present invention has been completed based on the above circumstances, and an object thereof is to provide an electrical junction box with reduced manufacturing costs.

  The present invention is an electrical connection box, a case, a circuit board accommodated in the case, a bus bar connection land formed on one surface of the circuit board by a printed wiring technique, and the bus bar connection land. A soldered bus bar and an electronic component connected to the bus bar.

  According to the present invention, since the bus bar is fixed to the circuit board by soldering, a pressing step is not necessary. This eliminates the need for an expensive press and can reduce manufacturing costs. Also, according to soldering, air easily moves in the melted solder, so that it is difficult for air to remain between the bus bar and the circuit board as compared with the case where an adhesive is used.

The following configuration is preferable as an embodiment of the present invention.
On the other surface of the circuit board, a conductive path may be formed by a printed wiring technique at a position corresponding to the bus bar disposed on the one surface of the circuit board.

  According to the above configuration, the wiring density can be improved. As a result, the electrical junction box can be reduced in size.

  The case is formed with a connector housing that can be mated with a mating connector. The connector housing accommodates a connector terminal formed separately from the bus bar, and the connector terminal is a metal wire. It may be connected to the bus bar via wire bonding.

  When the mating connector is fitted into the connector housing, a force is applied to the connector terminal along with the mating connector. If the connector terminal and the bus bar are integrally formed as in the prior art, there is a concern that the force applied to the connector terminal is transmitted to the bus bar and the bus bar and the circuit board are peeled off.

  According to said structure, a connector terminal and a bus bar are formed in the different body, and are connected by wire bonding. For this reason, even if force is applied to the connector terminal, the force is not transmitted to the bus bar. The above configuration is particularly effective in a configuration in which the bus bar and the circuit board are connected by soldering.

  According to the present invention, the manufacturing cost of the electrical junction box can be reduced.

<Embodiment 1>
A first embodiment in which the present invention is applied to an electrical junction box 10 mounted on a vehicle (not shown) will be described with reference to FIGS. The electrical junction box 10 according to the present embodiment is configured by housing a circuit structure 12 in a case 11. The electrical junction box 10 is disposed between an in-vehicle power source (not shown) and an in-vehicle electrical component (not shown) such as a lamp and a horn, and is used to energize and disconnect the in-vehicle electrical component. Execute. In the following description, the upper side in FIG. 1 is the front side, the lower side is the back side, the right side in FIG. 1 is the upper side, the left side is the lower side, the right side in FIG. 6 is the right side, and the left side is the left side. Left side.

  As shown in FIG. 5, the circuit structure 12 includes a circuit board 13 including a circuit and an electronic component 14 mounted on the circuit board 13. Conductive paths are formed on both the front surface (upper surface in FIG. 5) and the back surface (lower surface in FIG. 5) of the circuit board 13 by a printed wiring technique. In the figure, detailed patterns of conductive paths are omitted. A plurality of electronic components 14 are mounted on the conductive paths formed on the front and back surfaces of the circuit board 13 by soldering.

  As shown in FIG. 6, the circuit board 13 has a slightly elongated rectangular shape in the left-right direction (left-right direction in FIG. 6). A plurality of bus bar connection lands 15 having a rectangular shape are formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper surface in FIG. 6) by a printed wiring technique. The bus bar connection land 15 is provided with a first bus bar 16 and a second bus bar 17. In FIG. 6, the first bus bar 16 is disposed on the left side, and the second bus bar 17 is disposed on the right side. The first bus bar 16 and the second bus bar 17 are soldered to the bus bar connection land 15.

  The first bus bar 16 is formed by pressing a metal plate material. The first bus bar 16 includes a portion extending in the left-right direction (left-right direction in FIG. 6) and a portion extending upward from the left end of the portion extending in the left-right direction. The drain terminals formed on the back surfaces of a plurality (four in this embodiment) of semiconductor relays 18 (corresponding to the electronic component of the present invention) are soldered to the portions extending in the left-right direction of the first bus bar 16. ing.

  The second bus bar 17 includes a pair of portions that are formed side by side and that extend in the left-right direction (the left-right direction in FIG. 6), a portion that connects the pair of portions that extend in the left-right direction vertically, and a portion that extends in the left-right direction. And a portion extending upward from the right end portion of the one located on the upper side. A portion of the second bus bar 17 positioned on the upper side and extending in the left-right direction is arranged so as to be substantially aligned with a portion of the first bus bar 16 extending in the left-right direction in the left-right direction. A plurality of (in this embodiment, two) semiconductor relays 18 (corresponding to electronic components of the present invention) are soldered to the portion of the second bus bar 17 located on the upper side and extending in the left-right direction. ing. A plurality of (four in the present embodiment) drain terminals of the semiconductor relays 18 are soldered to portions of the second bus bar 17 that are located on the lower side and extend in the left-right direction.

  On the back surface (the lower surface in FIG. 5) of the circuit board 13, a conductive path is formed by a printed wiring technique at a position corresponding to the second bus bar 17 disposed on the front surface of the circuit board 13. An electronic component 14 is mounted.

  A plurality (seven in this embodiment) of lead portions 19 are formed to protrude upward (upward in FIG. 6) from the upper edge of each semiconductor relay 18. In the present embodiment, the fourth from the right end of the lead portion 19 is a gate terminal, and is soldered to a conductive path formed on the circuit board 13.

  In the present embodiment, the third from the left end of the lead portions 19 of each semiconductor relay 18 is a source terminal. As shown in FIGS. 7 and 8, the source terminal of the semiconductor relay 18 is soldered to the left side in FIG. 8 of the surface (upper surface in FIG. 8) of the relay member 20 having a substantially rectangular shape made of a metal plate material. Has been. As shown in FIG. 8, the back surface (lower surface in FIG. 8) of the relay member 20 is soldered to a relay land 21 formed on the surface (upper surface in FIG. 8) of the circuit board 13 by a printed wiring technique.

  In addition, one end of the metal wire 22 is connected to the right portion in FIG. 8 of the surface of the relay member 20 (upper surface in FIG. 8) by known wire bonding.

  As shown in FIG. 6, the other end of the metal wire 22 is connected to a plurality of connector terminals 23 arranged side by side in the left-right direction on the upper edge of the circuit board 13 by known wire bonding. The connector terminal 23 is separate from the first bus bar 16 and the second bus bar 17 described above, and is formed by pressing a metal plate material. Each connector terminal 23 has a substantially rectangular shape elongated in the vertical direction (vertical direction in FIG. 6). The lower end portion of the connector terminal 23 is a connection portion 24 connected to the metal wire 22.

  Among the connector terminals 23, the connector terminal 23 located at the left end in FIG. 6 is connected to the upper end of the first bus bar 16 by a plurality (four in this embodiment) of metal wires 22. The connector terminal 23 located at the left end is connected to the alternator via a wire harness (not shown).

  Moreover, the connector terminal 23 located in the right end part in FIG. 6 among the connector terminals 23 is connected to the upper end part of the second bus bar 17 by a plurality (three in this embodiment) of metal wires 22. The connector terminal 23 located at the right end is connected to an in-vehicle power source via a wire harness (not shown).

  As described above, a portion where a relatively large current flows, such as an alternator or an in-vehicle power source, can be dealt with by increasing the number of the metal wires 22.

  Among the connector terminals 23, the connector terminal 23 positioned second from the left end in FIG. 6 is connected to a total of four metal wires 22 extending from the two relay members 20. Each connector terminal 23 located near the center in the left-right direction is connected to two metal wires 22 extending from each relay member 20.

  As shown in FIG. 5, the connector terminal 23 is held by a holding member 25 attached to the upper end portion of the circuit board 13. The holding member 25 is made of a synthetic resin material. The holding member 25 includes a contact portion 26 that extends in the axial direction of the connector terminal 23 (left and right direction in FIG. 5) and contacts the connector terminal 23 from the front and back direction (up and down direction in FIG. 5). The contact portions 26 are formed in a plurality of stages (two stages in this embodiment) in a direction intersecting the plate surface of the circuit board 13 (up and down direction in FIG. 5).

  A flange portion 27 is formed at the upper end edge (right end edge in FIG. 5) of the contact portion 26 so as to protrude in a direction intersecting with the axial direction of the connector terminal 23 (vertical direction in FIG. 5). A first through hole 28 is formed in the flange portion 27 so as to penetrate the connector terminal 23 in the axial direction (left-right direction in FIG. 5). The connector terminals 23 are inserted into the first through holes 28, respectively. Accordingly, the connector terminals 23 are held by the holding member 25 in an arrayed state.

  As shown in FIG. 6, a plurality of leg portions 29 that hang downward (downward in FIG. 6) are formed from the lower end edge (lower end edge in FIG. 6) of the contact portion 26. As shown in FIG. 5, from the leg part 29, the pin 30 which protrudes in the back surface side (downward in FIG. 5) is formed. The holding member 25 is attached to the circuit board 13 by inserting the pin 30 into the second through hole 31 formed at a position corresponding to the pin 30 in the circuit board 13.

  As shown in FIG. 5, of the connector terminals 23 arranged in two stages in the direction intersecting the plate surface of the circuit board 13, the length dimension of the connector terminal 23 located on the side closer to the circuit board 13 is from the circuit board 13. It is set longer than the connector terminal 23 at a distant position. As a result, the connection portion 24 of the connector terminal 23 located on the side closer to the circuit board 13 while being held by the holding member 25 is connected to the connection portion 24 of the connector terminal 23 located away from the circuit board 13. The connector terminal 23 is displaced in a protruding state in the axial direction (specifically, the left side in FIG. 5).

  The circuit structure 12 is covered with a synthetic resin portion 32 formed by molding the circuit structure 12. A metal wire 22 is embedded in the synthetic resin portion 32. Further, the semiconductor relay 18, the first bus bar 16, and the second bus bar 17 are also embedded in the synthetic resin portion 32.

  The case 11 is molded on the outside of the synthetic resin portion 32. As shown in FIG. 5, the outer surface of the synthetic resin portion 32 and the inner surface of the case 11 are in close contact. The synthetic resin portion 32 is formed of a material having a smaller elastic modulus than the synthetic resin material forming the case 11.

  As shown in FIG. 5, at the upper end of the case 11 (right end in FIG. 5), there is a connector housing 33 that opens upward (to the right in FIG. 5) and can be fitted with a mating connector (not shown). It is formed integrally with the case 11. Inside the connector housing 33, the connector terminals 23 are accommodated through the inner wall of the connector housing 33. The connector terminal 23 can be connected to a mating connector terminal 23 (not shown) accommodated in the mating connector. The holding member 25 is embedded in the inner wall of the connector housing 33.

  Then, an example of the manufacturing process of this embodiment is demonstrated. As shown in FIG. 1, conductive paths, bus bar connection lands 15, and relay lands 21 are formed on both front and back surfaces of the circuit board 13 by a printed wiring technique. After applying cream solder to the conductive path formed on the back surface (the lower surface in FIG. 1) of the circuit board 13, the electronic component 14 is mounted by reflow soldering.

  Subsequently, cream solder is applied to the surfaces of the conductive paths, bus bar connection lands 15, and relay lands 21 formed on the surface of the circuit board 13 (upper surface in FIG. 1). Thereafter, the electronic component 14 is placed on the conductive path, the first bus bar 16 and the second bus bar 17 are placed on the bus bar connection land 15, and the relay member 20 is placed on the relay land 21. Subsequently, the electronic component 14, the first bus bar 16, the second bus bar 17, and the relay member 20 are soldered to the conductive path and each land by heating in a reflow furnace at a predetermined temperature for a predetermined time.

  Subsequently, after applying cream solder to the surfaces of the first bus bar 16 and the second bus bar 17 (upper surface in FIG. 1), the drain terminal of the semiconductor relay 18 is placed, and the source of the semiconductor relay 18 is placed on the surface of the relay member 20. The terminal is placed, and the gate terminal of the semiconductor relay 18 is placed on the conductive path of the circuit board 13. Subsequently, each terminal of the semiconductor relay 18 is soldered to the first bus bar 16, the second bus bar 17, the relay member 20, and the conductive path by reflow soldering.

  Subsequently, the connector terminal 23 is inserted into the first through hole 28 of the holding member 25. Thereafter, the pin 30 of the holding member 25 into which the connector terminal 23 is inserted is inserted into the second through hole 31 formed in the circuit board 13 from the front surface side (upper side in FIG. 2) of the circuit board 13.

  Subsequently, as illustrated in FIG. 3, the relay member 20 disposed on the circuit board 13 and the connection portion 24 of the connector terminal 23 are connected by a metal wire 22 by wire bonding. A known method can be used for wire bonding, and ball bonding, wire bonding, or the like can be used. As the metal wire 22, any metal can be used as necessary, and for example, an aluminum wire, a gold wire, or the like can be used. In the in-vehicle electrical junction box 10 as in the present embodiment, a relatively large current flows, so an aluminum wire is preferable.

  Further, as shown in FIG. 6, in the same manner as described above, the connection portion 24 of the connector terminal 23 is connected to the first bus bar 16 and the second bus bar 17 by a metal wire 22 by wire bonding.

  Subsequently, as shown in FIG. 4, the synthetic resin portion 32 is formed by molding the circuit component 12. The circuit structure 12 is almost buried by the synthetic resin portion 32. In the circuit component 12, the upper end portion of the connector terminal 23 and the upper end portion of the holding member 25 protrude from the upper end of the synthetic resin portion 32.

  Subsequently, as shown in FIG. 5, the case 11 is formed by further molding the circuit structure 12 on which the synthetic resin portion 32 is formed. A connector housing 33 is formed integrally with the upper end of the case 11. A connector terminal 23 is disposed in the connector housing 33. Thereby, the electrical junction box 10 is completed.

  Then, the effect | action and effect of this embodiment are demonstrated. According to the present embodiment, the first bus bar 16 and the second bus bar 17 are fixed to the circuit board 13 by soldering, so that a pressing step is not necessary. This eliminates the need for an expensive press and can reduce manufacturing costs. Also, according to soldering, air easily moves in the melted solder, so that air remains between the first bus bar 16 and the second bus bar 17 and the circuit board 13 as compared with the case where an adhesive is used. Hard to do.

  Further, according to the present embodiment, the conductive path is formed on the back surface of the circuit board 13 at a position corresponding to the second bus bar 17 disposed on the front surface of the circuit board 13 by a printed wiring technique. Thereby, the wiring density of the circuit board 13 can be improved. Thereby, size reduction of the electrical junction box 10 can be achieved.

  When the mating connector is fitted into the connector housing 33, a force is applied to the connector terminal 23 along with the mating connector. If the connector terminal 23 and the bus bar are integrally formed as in the prior art, there is a concern that the force applied to the connector terminal 23 is transmitted to the bus bar and the bus bar and the circuit board 13 are peeled off.

  In view of the above points, in the present embodiment, in the present embodiment, the case 11 is formed with a connector housing 33 that can be fitted to the mating connector, and the connector housing 33 includes the first bus bar 16 and A connector terminal 23 formed separately from the second bus bar 17 is accommodated. The connector terminal 23 is connected to both bus bars 16 and 17 via a metal wire 22 by wire bonding.

  According to said structure, the connector terminal 23 and both the bus bars 16 and 17 are formed separately, and are connected by wire bonding. For this reason, even if a force is applied to the connector terminal 23, the force is not transmitted to both bus bars 16 and 17. The above configuration is particularly effective in a configuration in which both bus bars 16 and 17 and the circuit board 13 are connected by soldering.

<Embodiment 2>
Next, a second embodiment of the present invention will be described with reference to FIGS. As shown in FIG. 15, the circuit board 13 has a slightly elongated rectangular shape in the left-right direction (left-right direction in FIG. 15). A plurality of bus bar connection lands 55 having a substantially circular shape are formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper in FIG. 15) by a printed wiring technique. A third bus bar 56 is soldered to the bus bar connection land 55. The semiconductor relays 58 (corresponding to the electronic components of the present invention) are arranged on the surface of the third bus bar 56 in two stages in the vertical direction (vertical direction in FIG. 15), and five in the horizontal direction. .

  The third bus bar 56 is formed by pressing a metal plate material, and has a substantially rectangular shape elongated in the left-right direction. Drain terminals formed on the back surface of a plurality (ten in this embodiment) of semiconductor relays 58 are soldered to the surface of the third bus bar 56. The semiconductor relay 58 is a semiconductor chip and is a so-called bare chip.

  Although not shown in detail, a source terminal and a gate terminal are formed on the surface of the semiconductor relay 58 (the surface on the near side in the direction passing through the paper surface in FIG. 15).

  One end of the metal wire 22 is connected to the gate terminal of the semiconductor relay 58 by known wire bonding. The other end of the metal wire 22 is connected to the relay member 60 by wire bonding. The relay member 60 is soldered to a conductive path formed on the surface of the circuit board 13 (the surface on the near side in the direction passing through the paper surface in FIG. 15). Five relay members 60 are disposed above the third bus bar 56 at positions corresponding to the semiconductor relays 58, and five relay members 60 are disposed below the third bus bar 58 at positions corresponding to the semiconductor relays 58. A relay member 60 is provided.

  One end of a plurality of (two in this embodiment) metal wires 22 is connected to the source terminal of each semiconductor relay 58 by known wire bonding.

  A plurality of connector terminals 23 are arranged on the upper edge of the circuit board 13 in the left-right direction. Of the connector terminals 23, a plurality (five in the present embodiment) of connector terminals 23 disposed at positions near the left end in FIG. 13 have lower ends (lower ends in FIG. 15) on the back side (in FIG. 15). It is bent toward the back side in the direction penetrating the paper surface, and is connected to the conductive path of the circuit board 13 by, for example, soldering or the like while penetrating the circuit board 13 (see FIG. 10).

  Among the connector terminals 23, a plurality (five in this embodiment) of connector terminals 23 arranged near the center in the left-right direction in FIG. 13 are held by the holding member 25. A metal wire 22 connected to the source terminal of the semiconductor relay 58 is connected to the connection portion 24 of these connector terminals 23 by known wire bonding.

  Among the connector terminals 23, a plurality (three in this embodiment) of metal wires 22 are connected to the lower end portion (lower end portion in FIG. 15) of the connector terminal 23 located at the right end portion in FIG. 13 by known wire bonding. Has been. The other end of the metal wire 22 is connected to the right end of the upper end edge of the third bus bar 56 by known wire bonding. The connector terminal 23 located at the right end is connected to an in-vehicle power source via a wire harness (not shown).

  The connector terminal 23 located at the right end in FIG. 13 is not held by the holding member 25, but is held on the back wall of the connector housing 33 with the case 11 molded as shown in FIG. It has become so.

  Since the configuration other than the above is substantially the same as that of the first embodiment, the same members are denoted by the same reference numerals, and redundant description is omitted.

  Then, an example of the manufacturing process of this embodiment is demonstrated. As shown in FIG. 9, conductive paths and bus bar connection lands 55 are formed on the front and back surfaces of the circuit board 13 by a printed wiring technique. After applying cream solder to the conductive path formed on the back surface (the lower surface in FIG. 9) of the circuit board 13, the electronic component 14 is mounted by reflow soldering.

  Subsequently, after applying cream solder to the conductive path formed on the surface of the circuit board 13 (upper surface in FIG. 9), the electronic component 14 is placed. Further, after applying cream solder to the bus bar connection land 55 formed on the surface of the circuit board 13, the third bus bar 56 is placed and the relay member 60 is placed on the conductive path. Subsequently, the electronic component 14, the third bus bar 56, and the relay member 60 are soldered to the conductive path and each land by reflow soldering that is heated at a predetermined temperature for a predetermined time in a reflow furnace.

  Subsequently, cream solder is applied to the surface of the third bus bar 56 (the upper surface in FIG. 9), and then the drain terminal of the semiconductor relay 58 is placed. Subsequently, the drain terminal of the semiconductor relay 58 is soldered to the third bus bar 56 by reflow soldering.

  Subsequently, as shown in FIG. 10, after the connector terminal 23 is bent at a substantially right angle, one end portion is passed through the circuit board 13, and reflow soldering is performed on the conductive path formed in the circuit board 13, for example. Connect with.

  Subsequently, the connector terminal 23 is inserted into the first through hole 28 of the holding member 25. Thereafter, the pin 30 of the holding member 25 into which the connector terminal 23 has been inserted is inserted into the second through hole 31 formed in the circuit board 13 from the surface side of the circuit board 13 (upper side in FIG. 11).

  Then, as shown in FIG. 12, the gate terminal of the semiconductor relay 58 and the relay member 60 are connected by the metal wire 22 by wire bonding. Further, the connector terminal 23 at the right end in FIG. 15 and the third bus bar 56 are connected by the metal wire 22 by wire bonding. A known method can be used for wire bonding, and ball bonding, wire bonding, or the like can be used. As the metal wire 22, any metal can be used as necessary, and for example, an aluminum wire, a gold wire, or the like can be used. In the in-vehicle electrical junction box 10 as in the present embodiment, a relatively large current flows, so an aluminum wire is preferable.

  Subsequently, the source terminal of the semiconductor relay 58 and the connection portion 24 of the connector terminal 23 held by the holding member 25 are connected by the metal wire 22 by wire bonding.

  Subsequently, as shown in FIG. 13, the synthetic resin portion 32 is formed by molding the circuit component 12. The circuit structure 12 is almost buried by the synthetic resin portion 32. In the circuit component 12, the upper end portion of the connector terminal 23 and the upper end portion of the holding member 25 protrude from the upper end of the synthetic resin portion 32.

  Subsequently, as illustrated in FIG. 14, the case 11 is formed by further molding the circuit configuration body 12 in which the synthetic resin portion 32 is formed. A connector housing 33 is formed integrally with the upper end of the case 11. A connector terminal 23 is disposed in the connector housing 33. Thereby, the electrical junction box 10 is completed.

  In the present embodiment, a bare chip is used as the semiconductor relay 58. Thereby, compared with the case where a discrete component is used, the circuit structure 12 can be reduced in size as a whole.

<Other embodiments>
The present invention is not limited to the embodiments described with reference to the above description and drawings. For example, the following embodiments are also included in the technical scope of the present invention.
(1) The bus bar connection land may be formed in a shape substantially the same as the shape of the bus bar, may be formed slightly larger than the shape of the bus bar, and has an arbitrary shape as necessary. be able to.
(2) In the present embodiment, the bus bar connection lands 15 and 55 are formed on the surface of the circuit board 13 and the bus bars 16, 17 and 56 are soldered to the surface of the circuit board 13. Alternatively, the bus bar connection land may be formed on the back surface of the circuit board 13 and the bus bar on the back surface of the circuit board 13 may be connected. It is good also as a structure by which a bus bar is connected to 13 front and back both surfaces.
(3) In the present embodiment, the bus bars 16, 17, 56 and the connector terminal 23 are formed separately and connected via the metal wire 22 by wire bonding. However, the bus bar and the connector terminal may be formed integrally, or the bus bar and the connector terminal may be formed separately and connected by any method as necessary, such as soldering or welding. Also good.

Side sectional view which shows the manufacturing process of the electrical junction box which concerns on Embodiment 1 of this invention Cross-sectional side view showing the electrical junction box manufacturing process Side sectional view showing the circuit structure Side sectional view showing a state where a synthetic resin portion is formed on a circuit structure Side sectional view showing the electrical junction box Front view showing the circuit structure The principal part enlarged front view which shows the connection structure of a semiconductor relay and a relay member Main part enlarged side sectional view showing a connection structure between a semiconductor relay and a relay member Side sectional view which shows the manufacturing process of the electrical junction box which concerns on Embodiment 2 of this invention. Cross-sectional side view showing the electrical junction box manufacturing process Cross-sectional side view showing the electrical junction box manufacturing process Side sectional view showing the circuit structure Side sectional view showing a state where a synthetic resin portion is formed on a circuit structure Side sectional view showing the electrical junction box Front view showing the circuit structure

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Electric junction box 11 ... Case 13 ... Circuit board 15,55 ... Bus-bar connection land 16 ... 1st bus bar 17 ... 2nd bus-bar 18, 58 ... Semiconductor relay (electronic component)
22 ... Metal wire 23 ... Connector terminal 33 ... Connector housing 55 ... Third bus bar

Claims (3)

A case, a circuit board housed in the case, a bus bar connection land formed on one surface of the circuit board by a printed wiring technique, a bus bar soldered to the bus bar connection land, and a connection to the bus bar And an electronic junction box. The electrical junction box according to claim 1, wherein a conductive path is formed on the other surface of the circuit board at a position corresponding to the bus bar disposed on the one surface of the circuit board by a printed wiring technique. . The case is formed with a connector housing that can be mated with a mating connector. The connector housing accommodates a connector terminal formed separately from the bus bar, and the connector terminal is a metal wire. The electrical connection box according to claim 1, wherein the electrical connection box is connected to the bus bar via wire bonding.

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