JP2009259596A - Surface mounted connector, and method of manufacturing the same - Google Patents

Abstract

It is an object of the present invention to provide a surface mount connector that suppresses the occurrence of soldering defects due to a terminal being lifted by thermal expansion in a reflow process, and a method for manufacturing the surface mount connector.
When mounted on a substrate T, the present invention holds the plurality of terminals 12, 12,... Arranged in a specific direction along the substrate T. The surface mount connector 10 includes a housing 20 having a wall portion 22, and the housing 20 is injected into the injection mold 50 from a portion where one end in the longitudinal direction of the housing 20 is molded, and injection molding is performed. In the part corresponding to the wall part 22 in the mold 50, the flow direction is determined by the part 12c held by the wall part 22 of the plurality of terminals 12, 12, ... and the plurality of pins provided in the injection mold 50. It is characterized by being molded by flowing a molding resin so as to be dispersed.
[Selection] Figure 2

Description

  The present invention relates to a method for manufacturing a surface mount connector to be mounted on a substrate and a surface mount connector manufactured by the manufacturing method.

  In recent years, surface mount connectors have been put into practical use in that they can be mounted on a substrate automatically and in a short time, and are excellent in mass productivity and economy.

  As shown in Patent Document 1, the surface mount connector includes a housing made of an insulating material such as resin and a held portion held by the housing, and a plurality of pieces made of a conductive material. Terminal. 7A and 7B, the housing is erected with respect to the substrate t when mounted on the substrate t, and the plurality of terminals 102, 102,. It has a back wall 104 that holds the held portion 102a of each terminal 102 in a state of being arranged in a specific terminal arrangement direction along t.

  The surface mounting connector 100 configured as described above is mounted on the substrate t by soldering a mounting end portion 102b which is one end portion of the terminal 102. Generally, a reflow soldering process (hereinafter also simply referred to as “reflow process”) is performed for soldering. This reflow process is performed through the following processes, for example.

A solder paste h is printed at a place where the mounting end portion 102b of the substrate (circuit board) t is soldered. The surface mount connector 100 is mounted on the substrate t so that the mounting end portion 102b is mounted on the solder paste h. In this state, the substrate t is conveyed by a conveyor or the like, and heat is applied from above in the reflow furnace to melt the solder paste h, whereby the mounting ends 102b of the terminals 102 are soldered to the substrate t.
Japanese Patent Laid-Open No. 08-45582

  As described above, when the surface mount connector 100 is subjected to the reflow process, the mounting end portion 102b of the terminal 102 may be separated from the substrate t, and a solder failure may occur. This is due to the thermal expansion of the housing, in particular, the thermal expansion in a direction to stand up with respect to the substrate t.

  Therefore, in view of the above problems, the present invention has an object to provide a surface mount connector that suppresses the occurrence of soldering failure due to a terminal being lifted by thermal expansion in a reflow process, and a method for manufacturing the surface mount connector. To do.

  As a result of diligent research, the present inventors have determined that the mounting end portion 102b of the terminal 102 is separated from the substrate t due to thermal expansion in a direction (vertical direction) upright with respect to the substrate t of the housing. It was found out that the resin has a large anisotropy. This anisotropy of the resin is caused by the flow of the resin when the housing is molded. Therefore, the present inventors paid attention to a method for manufacturing the surface mount connector 100.

  The surface mount connector 100 is usually manufactured by injection molding. In this injection molding, a surface mount connector 100 having a shape corresponding to the cavity is molded by injecting (filling) molding resin into a space formed inside the injection mold, that is, a so-called cavity.

  Specifically, for example, a plurality of terminals 102, 102,... Are arranged in the injection mold so as to be arranged in the terminal arrangement direction, and the molding resin is injected into the cavity. At this time, the molding resin is injected into the cavity from a gate provided at a position corresponding to one side wall 106 of the surface mount connector 100 in the injection mold, and the inside of the cavity is injected from a portion corresponding to the one side wall 106. It flows toward the part corresponding to the other side wall 108. At this time, the molding resin flows along the terminal arrangement direction at a portion corresponding to the back wall portion 104 of the cavity. Thus, after the cavity is filled with the molding resin and cured, the surface mount connector 100 is formed by taking out from the injection mold.

  As described above, the molding resin cured by flowing in one direction in the cavity has anisotropy depending on the orientation state of the fibers and molecules of the molding resin. That is, in the surface mount connector 100, the direction (the back surface) is orthogonal to the flow direction rather than the thermal expansion in the flow direction of the molding resin (the direction along the substrate t in the back wall 104). In the wall portion 104, thermal expansion in the vertical direction with respect to the substrate t becomes larger.

  Therefore, when the surface mount connector 100 manufactured by the injection molding is subjected to the reflow process, the thermal expansion in the vertical direction with respect to the substrate t increases in the back wall 104 due to the anisotropy. Due to the deformation due to the thermal expansion, the terminal 102 held by the back wall 104 is lifted upward with respect to the substrate t. As a result, the mounting end portion 102b of the terminal 102 is also lifted upward with respect to the substrate t and separated from the substrate t, causing a soldering defect.

  Therefore, in order to solve the above problems, a surface mount connector according to the present invention includes a plurality of terminals connected to a substrate, and when mounted on the substrate, the surface mount connector is erected with respect to the substrate and includes the plurality of terminals. A housing having a wall portion held in a state of being arranged in a specific terminal arrangement direction along the substrate, and the housing is disposed in an injection mold having an internal space for molding the housing. Molding resin is injected from a part where one end of the direction is molded, and the part held by the wall part of the plurality of terminals and the injection mold in the part corresponding to the wall part in the injection mold The molding resin is molded by flowing such that the flow direction is dispersed by a plurality of pins provided inside.

  In such a configuration, the molding resin is flowed so that the flow direction is dispersed at a portion corresponding to the wall portion in the injection mold, and the molding resin is cured to form the wall portion of the housing. ing. Therefore, fiber orientation and molecular orientation of the molded resin are less likely to occur in the wall portion, and as a result, anisotropy is less likely to occur.

  Therefore, even if the housing of the surface mount connector is heated by the reflow process, the wall portion is suppressed from being greatly expanded and deformed in the vertical direction. By suppressing the deformation of the wall portion in this manner, the surface mount connector is prevented from being lifted upward due to thermal expansion of the wall portion in a reflow process. Therefore, it is suppressed that the edge part soldered to the board | substrate of the said terminal leaves | separates from the said board | substrate, and the soldering defect by a reflow process is suppressed.

  Further, in order to solve the above problems, the method for manufacturing a surface mount connector according to the present invention is a specific terminal arrangement in which a plurality of terminals are erected with respect to the board and mounted on the board when the board is mounted on the board. A method of manufacturing a surface mount connector having a wall portion that is held in a state of being arranged in a direction, wherein the plurality of terminals are arranged in the terminal arrangement direction in an injection mold having an internal space for molding the wall portion. After being disposed, the method includes a step of injecting molding resin into the injection mold, and in this step, a portion corresponding to the wall portion of the injection mold extends in the thickness direction of the wall portion. A plurality of pins are provided, and the plurality of pins are arranged from one side to the other side in the terminal arrangement direction in a state where the plurality of pins are arranged in the terminal arrangement direction at intervals below the arranged terminals. In the injection mold Wherein the shape resin is injected.

  According to this configuration, when the molding resin is injected into the injection mold, the molding resin is held in the wall portion of each terminal by the plurality of pins in the injection mold. The flow is disturbed. That is, since a plurality of portions where the terminals are held and a plurality of pins below the pins are provided in the terminal arrangement direction, when the molding resin flows through the wall cavity space, these held portions And the flow direction is dispersed by colliding with the pins.

  In this way, the flow of the molding resin is disturbed, so that in the molding resin (the wall portion) cured in the injection molding die, fiber orientation and molecules in the area where the terminals are held and around the plurality of pins. Orientation hardly occurs and anisotropy hardly occurs. For this reason, the wall portion formed by the manufacturing method is less likely to be greatly deformed due to thermal expansion in the vertical direction with respect to the substrate. At this time, since the plurality of pins are arranged on the lower side of the plurality of terminals, the turbulence of the flow is further generated in the periphery of the plurality of terminals and on the lower side thereof in the injection mold. Therefore, large deformation due to thermal expansion in the vertical direction is less likely to occur at the portion of the molded wall portion.

  Therefore, in the vicinity of the plurality of terminals in the wall portion and the portion below the plurality of terminals, large thermal expansion in the vertical direction is suppressed even when heated by the reflow process. Therefore, in the surface mount connector manufactured by the manufacturing method, the terminal is lifted upward by the thermal expansion of the wall portion in the reflow process, and the end portion soldered to the substrate of the terminal is separated from the substrate. This suppresses soldering defects in the reflow process.

  In the method for manufacturing a surface mount connector according to the present invention, in the injection mold, the plurality of pins are further aligned in the terminal arrangement direction at intervals above the plurality of terminals arranged. Thus, a configuration in which the molding resin is injected is preferable.

  According to this configuration, the plurality of pins are arranged in the terminal arrangement direction on the upper side and the lower side with the plurality of terminals sandwiched in the injection mold. Therefore, the flow of the molding resin is more disturbed around the portion where the terminal is held, and the anisotropy is less likely to occur. Therefore, in the surface mount connector manufactured by the manufacturing method, large deformation in the vertical direction due to thermal expansion around the plurality of terminals in the wall portion is less likely to occur, and solder defects in the reflow process are further suppressed. Is done.

  Further, in the injection mold, the pins are provided at positions where the pins of the plurality of terminals arranged in the vertical direction, or at positions between the adjacent terminals and the vertical direction, respectively. Thus, a configuration in which the molding resin is injected is preferable.

  According to such a configuration, the same or substantially the same number of the pins as the plurality of terminals are arranged in the terminal arrangement direction on the upper side or the lower side with the plurality of terminals sandwiched in the injection mold. When the molding resin is injected into the injection mold, the flow of the molding resin is more disturbed by the portions where the terminals are held and the pins. Therefore, the anisotropy is less likely to occur. Therefore, in the surface mount connector manufactured by the manufacturing method, large deformation in the vertical direction due to thermal expansion at the wall portion is less likely to occur, and solder failure in the reflow process is further suppressed.

  Further, the surface mount connector manufactured by the manufacturing method includes a bottom wall portion that is positioned at the lower end of the wall portion and is in parallel with the substrate when mounted on the substrate. In order to manufacture a connector, the space further includes an internal space for forming the bottom wall portion, and a plurality of pins extending in the thickness direction of the bottom wall portion are further provided at portions corresponding to the bottom wall portion. A configuration in which an injection mold is used and the molding resin is injected into the injection mold is preferable.

  According to this configuration, the flow of the molding resin is disturbed by the plurality of bottom wall pins when the molding resin is injected even at a portion corresponding to the bottom wall portion in the injection mold. As a result, in the surface actual measurement connector manufactured by the manufacturing method, a large deformation in a specific direction due to thermal expansion hardly occurs in the bottom wall portion.

  Further, in the injection mold, in a state where the plurality of pins having such a length that the portions corresponding to the plurality of pins of the surface mount connector manufactured by the manufacturing method become through holes, are provided. A configuration in which the molding resin is injected is preferable.

  According to such a configuration, since the pin crosses the internal space of the injection mold in the thickness direction, the flow of the molding resin is larger than that of the pin that extends only halfway in the thickness direction. More disturbed. As a result, in the surface mount connector manufactured by the manufacturing method, a large deformation in a specific direction due to thermal expansion in the reflow process is less likely to occur.

  Further, the surface mount connector manufactured by the manufacturing method includes a top wall portion that is positioned at the upper end of the wall portion and is parallel to the substrate when mounted on the substrate. In order to manufacture the ceiling wall portion, an internal space for forming the ceiling wall portion is also provided. The space corresponding to the ceiling wall portion extends in the thickness direction of the ceiling wall portion and is smaller than the thickness of the ceiling wall portion. The injection mold in which a plurality of pins having a length are further provided may be used, and the molding resin may be injected into the injection mold.

  According to such a configuration, the flow of the molding resin is disturbed by the plurality of pins when the molding resin is injected even at a portion corresponding to the top wall portion in the injection mold. As a result, in the surface mount connector manufactured by the manufacturing method, a large deformation in a specific direction due to thermal expansion hardly occurs in the top wall portion.

  Further, since the plurality of pins have a length smaller than the thickness of the top wall portion, a concave portion corresponding to the pin is formed in the molded top wall portion. Thus, by setting it as a recessed part instead of a through-hole, the quantity which the heat | fever irradiated from upper direction passes through the said top wall part in a reflow process is suppressed, and it originates in the said heat | fever being directly irradiated to these terminals. It is possible to prevent the terminal from being damaged. That is, in the top wall portion of the surface mount connector manufactured by the manufacturing method, it is difficult for large deformation in a specific direction due to thermal expansion to occur, and damage to the terminal due to heat in the reflow process can be prevented.

  Moreover, in order to eliminate the said subject, the surface mount connector which concerns on this invention may be manufactured by the manufacturing method of one of the said surface mount connectors.

  As described above, according to the present invention, it is possible to provide a surface mount connector that suppresses the occurrence of soldering failure due to a terminal being lifted by thermal expansion in a reflow process, and a method for manufacturing the surface mount connector.

  Hereinafter, an embodiment of the present invention will be described with reference to the accompanying drawings.

  As shown in FIGS. 1 to 5, a surface mount connector (hereinafter also simply referred to as “connector”) 10 according to this embodiment includes a terminal 12 made of a conductive member, and an insulating synthetic resin ( Hereinafter, it is also referred to as “resin”). The connector 10 is soldered by a reflow process via a solder paste printed on the substrate T, and fixed on the substrate T, that is, mounted.

  The housing 20 has a substantially rectangular parallelepiped shape that is long in the width direction, and includes a back wall 22 that holds the terminals 12 and a connector connecting portion 23. The connector connecting portion 23 is provided on one side of the back wall 22, and includes a bottom wall 24, a top wall 26, and a pair of side walls 28 and 28. The connector connecting portion 23 is open on the front side and is detachable from the mating connector. In the present embodiment, the direction in which the connector connecting portion 23 is provided with respect to the back wall 22 is the front.

  A plurality of terminals 12, 12,... Are held on the back wall 22 in an arrayed state. Specifically, when the connector 10 is mounted on the board T, the back wall 22 is erected with respect to the board T, and a plurality of terminals 12, 12,... 1 in the horizontal direction). In the present embodiment, 29 terminals 12 are arranged in a row at a constant pitch in the width direction (terminal arrangement direction) of the housing 20, and the rows (terminal rows) 13 of the terminals 12 are arranged in two upper and lower stages. Are arranged as follows. Thus, the site | part (terminal holding | maintenance part) 22a holding the terminal of the back wall 22 holding the terminal 12 is thick compared with the other site | part of the back wall 22 (refer FIG. 2). In addition, a rectangular through hole 22b is formed in the upper part of the center of the rear wall 22 in the width direction.

  The back wall 22 is further formed with a plurality of through holes (back wall through holes) 30, 30,. The back wall through-hole 30 has a plurality of pins (referred to as “mold” hereinafter) 50 (see FIG. 6) provided when the connector 10 is injection-molded as will be described later. It is a hole formed by a back pin. The rear wall through-hole 30 is a hole that penetrates in the thickness direction of the rear wall 22 (the front-rear direction of the connector 10), and is located above the upper terminal row 13, between the upper and lower terminal rows 13, 13, and between the lower row. Are provided on the lower side of the terminal row 13. And in each height position of the back wall 22, several back wall through-holes 30, 30, ... are located in a line in the terminal arrangement direction at intervals. That is, the plurality of back wall through holes 30, 30,... Are arranged along each terminal row 13.

  The plurality of back wall through holes 30, 30,... Are provided in the back wall 22 so as to be aligned with the terminals 12 in the vertical direction at the respective height positions. That is, at each of the height positions, the plurality of back wall through holes 30, 30,... Arranged in the terminal arrangement direction have the same number of back walls as the terminals 12 constituting the upper or lower terminal row 13 arranged in the same direction. 22 is formed. In the present embodiment, 29 back wall through holes 30, 30,... Are arranged in the same direction at the same pitch as the pitch between the terminals in the terminal row 13 at each height position.

  The bottom wall 24 is located at the lower end of the back wall 22 when the connector 10 is mounted on the substrate T, and is in contact with the substrate T in parallel. The bottom wall 24 is also formed with a plurality of through holes (bottom wall through holes) 32, 32,. The plurality of bottom wall through holes 32, 32,... Are holes formed by a plurality of pins (bottom wall pins) provided in the mold 50 when the connector 10 is injection-molded. It is arranged throughout. The bottom wall through holes 32 are holes that penetrate in the thickness direction of the bottom wall 24 (the height direction of the connector 10), and are arranged with a predetermined pitch in the width direction of the connector 10, and the bottom wall in the width direction. The rows of through holes 32 are arranged at equal intervals in the front-rear direction of the connector 10.

  The top wall 26 is positioned at the upper end of the back wall 22 when the connector 10 is mounted on the substrate T, and is parallel to the substrate T. A plurality of concave portions (top wall concave portions) 34, 34,... Are formed on the top wall 26. The plurality of top wall recesses 34, 34,... Are recesses (recesses) formed by a plurality of pins (top wall pins) provided in the mold 50 when the connector 10 is injection molded. The ceiling wall recess 34 is a recess that is recessed from the upper surface to the lower surface of the ceiling wall 26, and has a hexagonal shape when viewed from the height direction of the connector 10. The plurality of ceiling wall recesses 34, 34,... Are provided on the entire top surface of the ceiling wall 26 in a honeycomb shape.

  In addition, two protrusions 26 a and 26 a are provided on the lower surface of the top wall 26, that is, on the inner side of the connector connecting portion 23. The protrusions 26 a are protrusions extending in the front-rear direction of the connector 10, and are respectively provided at approximately one third of the width from both ends in the width direction of the connector 10. Further, a projection 26b that hangs downward is also provided at the center of the lower surface of the top wall 26.

  The terminal 12 is a metal linear member, and has a connection end 12a at one end and a mounting end 12b at the other end. The connection end 12a and the mounting end 12b are connected to each other. A held portion 12c is provided therebetween.

  The connection end portion 12a projects forward from the back wall 22 into the connector connection portion 23 in parallel with the substrate T. When the mating connector is inserted into the connector connecting portion 23 of the housing 20, the connecting end 12a is inserted into the mating female terminal, and the connector 10 and the mating connector are electrically connected.

  The mounting end 12b protrudes from the rear side of the back wall 22 in parallel with the substrate T, bends at a right angle from the position toward the substrate T and extends in the height direction, and is substantially the same as the surface (upper surface) of the substrate T. It is bent so as to be substantially parallel to the substrate T at a height. That is, the mounting end 12b of the terminal 12 has a substantially crank shape when viewed from the width direction of the connector 10 (see FIG. 2).

  The held portion 12c is located in the terminal holding portion 22a of the back wall 22, and is bent into a substantially crank shape when viewed from the height direction of the connector 10 in the terminal holding portion 22a. By bending in this way, the axial center of the connection end 12 a and the axial center of the mounting end 12 b near the back wall 22 are slightly shifted in the width direction of the connector 10. The substantially crank-shaped held portion 12c is bent so that the axial misalignment is opposite between the terminal 12 of the upper terminal row 13 and the terminal 12 of the lower terminal row 13 (in FIG. 4). (Refer to the partial enlarged view). As described above, since the shift of the shaft center is opposite between the upper stage and the lower stage, the mounting end parts 12b of the terminals 12 arranged in two upper and lower stages do not come into contact with each other, and the tip parts thereof are on the same plane (substrate T) are arranged in a row on top.

  As a feature of the connector 10, the resin material constituting the housing 20 has an extremely low anisotropy compared to the housing of the conventional connector, and this effectively improves the thermal expansion of the housing 20 in the vertical direction (height direction). To suppress.

  This property is obtained by injection molding as described below. This injection molding is performed by an injection molding apparatus 40 as shown in FIG. The injection molding apparatus 40 includes an injection unit 42 and a mold 50. The injection part 42 is a part for heat-fluidizing the resin filled inside and injecting the resin into the mold 50.

  The mold 50 includes an internal space (hereinafter also referred to as “cavity”) 52 having a shape corresponding to the shape (outer shape) of the housing 20 shown in FIGS. 1 to 5, and the cavity 52 is filled with resin. (Injection) and the resin is cured to form the housing 20. The mold 50 is provided with a gate 54 for injecting resin into the cavity 52 at a portion corresponding to the side wall 28 on one side in the longitudinal direction (width direction) of the housing 20, and corresponds to the side wall 28 on the other side. A gate 56 for discharging excess resin from the inside of the cavity 52 to the outside is provided at the site to be operated.

  Further, as a feature of this method, pins for disturbing the flow of the resin are inserted in the mold 50 in advance. Specifically, a plurality of back pins (not shown) are provided at portions corresponding to the back wall 22 of the housing 20. The back pins are provided in the mold 50 at positions corresponding to the back through holes 30 of the back wall 22 of the housing 20 shown in FIGS. 1 to 5. That is, the back pins are arranged in the mold 50 at positions corresponding to the rows of the back through holes 30 arranged along the terminal rows 13 of the back wall 22 of the housing 20.

  The back pin extends in the thickness direction of the back wall 22 and crosses the cavity 52, and prevents the resin flowing through the cavity 52 from passing through the position where the back pin is provided. Moreover, this back surface pin has the outer peripheral surface of the same shape as the internal peripheral surface which prescribes | regulates the back surface through-hole 30 of the back wall 22 of the housing 20 shown in FIG. 1 thru | or FIG.

  In this way, the resin is injected by the injection unit 42 into the mold 50 in which a large number of back pins are arranged in the cavity 52. At this time, the terminals 12 are arranged in the terminal arrangement direction in the mold 50, and the held portions 12 c of the terminals 12 are also located in the cavity 52.

  In this state, resin is injected into the mold 50, that is, into the cavity 52 from a gate 54 provided at a portion corresponding to one side wall 28 in the longitudinal direction (width direction) of the housing 20. This resin flows in the cavity 52 from a portion corresponding to one side wall 28 to a portion corresponding to the other side wall 28 via a portion corresponding to the back wall 22.

  At this time, the resin flowing into the part corresponding to the back wall 22 of the cavity 52 tends to flow along the longitudinal direction of the housing 20 toward the part corresponding to the other side wall 28. However, in this portion of the cavity 52, the held portions 12c and the back pins of the terminals 12 are arranged in a large number in the terminal arrangement direction, so that the resin collides with the held portions 12c and the back pins, and the flow direction thereof is Distributed. At this time, since the rows of back pins arranged in the terminal arrangement direction are arranged so as to sandwich each terminal row 13 from above and below, the resin flow is sufficiently disturbed around the held portion 12 c of the terminal 12.

  In this way, the flow of resin in the mold 50, that is, in the cavity 52 is disturbed, so that the held portion 12 c of the terminal 12 and the plurality of back surfaces are formed on the back wall 22 of the housing 20 molded by the mold 50. Fiber orientation and molecular orientation are less likely to occur at the site corresponding to the periphery of the pin, and anisotropy is less likely to occur. Therefore, in the back wall 22 formed by the injection molding, the anisotropy of the thermal expansion is also reduced, and the thermal expansion biased in the direction to stand up with respect to the substrate T hardly occurs.

  Specifically, in the present embodiment, at the time of injection molding, a plurality of terminals 12, 12,... And a plurality of back pins are arranged in a portion corresponding to the lower half of the back wall 22 in the mold 50. Therefore, in the lower half of the back wall 22 of the housing 20, even if heated by the reflow process, the thermal expansion is greatly suppressed in the vertical direction.

  Here, in the back wall 22 of the connector 10, all the terminals 12 are arranged below the half. Therefore, if the lower half of the back wall 22 is restrained from thermal expansion in the vertical direction and greatly deforming, the terminal 12 is lifted upward by the thermal expansion of the back wall 22 in the reflow process, and the terminal 12 is mounted. The end 12b is prevented from separating from the substrate T, and a solder failure in the reflow process is preferably suppressed.

  In the present embodiment, the mold 50 is also provided with a plurality of bottom wall pins (not shown) in advance at a portion corresponding to the bottom wall 24 of the housing 20. The bottom wall pins are respectively provided at positions corresponding to the bottom wall through holes 32 of the bottom wall 24 of the housing 20 shown in FIGS. 1 to 5 in the mold 50.

  The bottom wall pin extends in the thickness direction of the bottom wall 24 and traverses the inside of the cavity 52, and prevents passage of resin flowing in the cavity 52 at the position where the bottom wall pin is provided. Further, the bottom wall pin has an outer peripheral surface having the same shape as the inner peripheral surface defining the bottom wall through hole 32 of the bottom wall 24 of the housing 20 shown in FIGS. 1 to 5.

  Therefore, when the resin is injected into the cavity 52, the resin that has flowed from the part corresponding to the one side wall 28 of the cavity 52 to the part corresponding to the bottom wall 24 is the part corresponding to the back wall 22. Similarly, it collides with the bottom wall pin and its flow direction is dispersed.

  As a result, even the bottom wall 24 of the housing 20 molded with the mold 50 is less likely to be anisotropic.

  Further, in the present embodiment, the mold 50 is provided with a plurality of ceiling wall pins (not shown) in advance in a portion corresponding to the ceiling wall 26 of the housing 20. The ceiling wall pins are respectively provided at positions corresponding to the ceiling wall recesses 34 of the ceiling wall 26 of the housing 20 shown in FIGS. 1 to 5 in the mold 50.

  The ceiling wall pin is a pin that extends from the upper surface of the ceiling wall 26 toward the lower surface and projects into the cavity 52 from a portion corresponding to the upper surface of the ceiling wall 26 in the mold 50, and the position where the ceiling wall pin is provided. The passage of the resin flowing in the cavity 52 is partially hindered. The top wall pin has a shape corresponding to the top wall recess 34 of the top wall 26 of the housing 20 shown in FIGS.

  Therefore, when the resin is injected into the cavity 52, the resin that has flowed from the part corresponding to the one side wall 28 of the cavity 52 to the part corresponding to the top wall 26 enters the back wall 22 and the bottom wall 24. Like the corresponding part, it collides with the top wall pin and its flow direction is dispersed. At this time, since the top wall pin does not cross the cavity 52, the flow direction of the resin cannot be dispersed as much as the back pin or the bottom wall pin, but the resin flows without the pin being arranged in the cavity 52. Compared to molding, the top wall 26 of the housing 20 molded with the mold 50 is less likely to be anisotropic. In addition, it is possible to avoid the formation of a through hole in the ceiling wall 26.

  That is, by forming a recess instead of a through hole in the ceiling wall 26 of the housing 20 molded by the mold 50, the amount of heat radiated from above through the ceiling wall 26 in the reflow process is suppressed. . Therefore, it is possible to prevent the heat from being directly applied to the connection end portion 12a of the terminal 12, and it is possible to prevent the terminal 12 from being damaged due to the heat irradiation. That is, the ceiling wall 26 of the connector 10 manufactured by the manufacturing method is less likely to be greatly deformed in a specific direction due to thermal expansion, and damage to the terminals 12 due to heat in the reflow process can be prevented.

  The surface-mount connector and the method for manufacturing the surface-mount connector of the present invention are not limited to the above-described embodiment, and it is needless to say that various changes can be made without departing from the scope of the present invention.

  For example, in the present embodiment, the resin is injected into the mold 50 in a state where the back pins are provided at positions corresponding to the respective terminals 12 in the vertical direction at a portion corresponding to the back wall 22 of the mold 50. ing. However, the present invention is not limited to this, and the molding resin is injected into the mold 50 in a state where the back pins are respectively provided at the intermediate position between the terminals 12 and 12 adjacent to each other and the position aligned in the vertical direction. Also good. Even if the back pin is provided in this way, the flow of the resin is disturbed by the held portion 12c and the back pin, and anisotropy is less likely to occur at a corresponding portion of the molded housing 20.

  Further, in the present embodiment, the back pins are arranged on the upper side or the lower side along the terminal rows 13, and the same number as the terminals 12 constituting the terminal row 13 is provided in each row. However, it is not necessary to be limited to this, and when injection molding is performed, if the flow direction is sufficiently dispersed without flowing the resin flowing through the corresponding part in the mold 50 in one direction, the back pin is connected to the terminal 12. It may be more or less than the number. Moreover, it is not necessary to line up at a fixed pitch.

  In the present embodiment, the back pins are arranged in the mold 50 so as to sandwich the terminal rows 13 vertically, but the present invention is not limited to this, and at least on the lower side of the uppermost terminal row 13. It only has to be arranged in the terminal arrangement direction. Therefore, on the lower side of the terminal row 13, a row in which a plurality of back pins are arranged in the terminal arrangement direction may be arranged in the vertical direction.

  In the back wall 22 of the housing 20 molded with such a mold 50, anisotropy is suppressed at a portion below the portion where the terminal 12 is held. Therefore, in the reflow process, the terminal 12 (held portion 12c) is lifted and the mounting end portion 12b is prevented from separating from the substrate T, and thus soldering defects are suppressed.

  Further, the lengths of the back pin and the bottom wall pin may be such that corresponding portions of the back wall 22 and the bottom wall 24 of the molded housing 20 are not through holes but are recessed portions. Even in such a length, a large number of pins are arranged in the cavity 52, and the resin flows in the cavity 52 in this state, so that the flow of the resin is disturbed, and a difference due to fiber orientation or molecular orientation occurs. It becomes difficult to produce a directivity.

It is a front view of the surface mount connector which concerns on this embodiment. It is a center longitudinal cross-sectional view of the substrate mounting state of the surface mount connector which concerns on the same embodiment. It is a bottom view of the surface mount connector which concerns on the same embodiment. It is the top view which notched some top walls of the surface mount connector which concerns on the embodiment. It is a perspective view of the surface mount connector which concerns on the same embodiment. It is a conceptual diagram of the injection molding apparatus which manufactures the surface mount connector which concerns on the same embodiment. It is the conventional surface mount connector, (a) is a schematic perspective view, (b) is a longitudinal cross-sectional view of the state mounted in the board | substrate.

Explanation of symbols

10 Connector (Surface mount connector)
12 Terminal 12c Holding part (part held by the wall)
20 Housing 22 Back wall (wall)
50 mold (injection mold)
T substrate

Claims (8)

A housing having a plurality of terminals and a wall portion that is erected with respect to the substrate and that holds the plurality of terminals arranged in a specific terminal arrangement direction along the substrate when mounted on the substrate; Prepared,
In the housing, a molding resin is injected from a portion where one end in the longitudinal direction of the housing is molded into an injection mold having an internal space for molding the housing, and the wall portion in the injection mold The molding resin is caused to flow such that the flow direction is dispersed by the portions held by the wall portions of the plurality of terminals and the plurality of pins provided in the injection mold. A surface-mount connector characterized by being molded. A method of manufacturing a surface mount connector comprising a wall portion that is erected with respect to a board and that holds a plurality of terminals arranged in a specific terminal arrangement direction along the board when mounted on the board. And
A step of injecting a molding resin into the injection mold after the plurality of terminals are arranged in the terminal arrangement direction in an injection mold having an internal space for molding the wall,
In this step, a plurality of pins extending in the thickness direction of the wall portion are provided in a portion corresponding to the wall portion of the injection mold, and the plurality of pins are below the plurality of terminals arranged. The surface mount connector, wherein the molding resin is injected into the injection mold from one side of the terminal arrangement direction to the other side in a state of being arranged in the terminal arrangement direction at intervals. Manufacturing method. In the manufacturing method of the surface mount connector according to claim 2,
In the injection mold, the molding resin is injected in a state in which the plurality of pins are further aligned in the terminal arrangement direction at intervals above the plurality of arranged terminals. Method for manufacturing a surface mount connector. In the manufacturing method of the surface mount connector according to claim 2 or 3,
In the injection mold, the pin is provided in a position aligned with the terminals of the plurality of terminals arranged in the vertical direction, or in a position aligned in the vertical direction with an intermediate position between adjacent terminals, A method for manufacturing a surface mount connector, wherein the molding resin is injected. In the manufacturing method of the surface mount connector according to any one of claims 2 to 4,
The surface-mount connector manufactured by the manufacturing method includes a bottom wall portion that is positioned at the lower end of the wall portion when mounted on the substrate and is in parallel with the substrate,
In order to manufacture this surface-mount connector, an internal space for forming the bottom wall portion is also provided, and a plurality of pins extending in the thickness direction of the bottom wall portion are further provided at portions corresponding to the bottom wall portion. A method for manufacturing a surface mount connector, wherein the injection mold is used, and the molding resin is injected into the injection mold. In the manufacturing method of the surface mount connector according to any one of claims 2 to 5,
In the injection mold, the molding is performed in a state in which the plurality of pins having such a length that portions corresponding to the plurality of pins of the surface mount connector manufactured by the manufacturing method become through holes are provided. A method of manufacturing a surface mount connector, wherein a resin is injected. In the manufacturing method of the surface mount connector according to any one of claims 2 to 6,
The surface mount connector manufactured by the manufacturing method is located at the upper end of the wall when mounted on the substrate, and includes a top wall parallel to the substrate,
In order to manufacture this surface mount connector, it also has an internal space for forming the top wall portion, extends in the thickness direction of the top wall portion at a portion corresponding to the top wall portion, and A method of manufacturing a surface mount connector, wherein the injection mold further provided with a plurality of pins having a length smaller than the thickness is used, and the molding resin is injected into the injection mold. .   A surface mount connector manufactured by the method for manufacturing a surface mount connector according to claim 2.

Images