JP2009242647A - Active energy ray-curable resin composition, coating agent composition, coating agent for deposition anchor layer and cured coating - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an active energy ray-curable resin composition capable of forming a cured coating excellent in wear resistant and heat resistance. <P>SOLUTION: The active energy ray-curable resin composition comprises 10 to 60 pts.wt. of a reaction product (B) prepared by reacting a radically polymerizable vinyl monomer (b) with a carboxyl group with a copolymer (A) having an epoxy equivalent of 200 to 1,000 g/eq and also a weight-average molecular weight of 5,000 to 100,000 prepared by polymerizing a monomer component (a) containing a radically polymerizable vinyl monomer (a1) with an epoxy group and a vinyl monomer (a2) with the glass transition temperature of a homopolymer of 60°C or higher, 10 to 30 pts.wt. of a compound (C) having a cyclic structure and two radically polymerizable vinyl monomers, 10 to 30 pts.wt. of a compound (D) having at least three radically polymerizable vinyl groups, and 20 to 60 pts.wt. of a silica microparticles (E) of having an average primary particle size of 20 to 80 nm. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

The present invention relates to an active energy ray-curable resin composition that is cured by active energy rays such as ultraviolet rays and electron beams, a coating agent composition containing the active energy ray-curable resin composition, a coating agent for a deposition anchor layer, The present invention relates to a cured film obtained by curing an active energy ray-curable resin composition.

  Plastic materials are excellent in various properties such as light weight, impact resistance, and workability in addition to transparency, and are therefore used in large quantities in various fields such as the home appliance industry, the electrical / electronic industry, and the automobile industry. However, films, sheets, molded articles, and the like made of plastic materials have a drawback that they are easily damaged because of their low surface hardness, and in particular, transparency and appearance are easily impaired in transparent resins.

  Therefore, in order to solve the above-mentioned problem, the active energy ray-curable resin is protected to protect the surfaces of various molded products. However, the surface hardness of conventional active energy ray curable resins cannot be said to be sufficient, and further higher hardness is required.

  In general, when using an active energy ray-curable resin designed with polyfunctional (meth) acrylic monomers or polyfunctional (meth) acrylic oligomers, increase the crosslink density to increase the surface hardness. Is the simplest method, but in this case, the adhesiveness deteriorates due to the increase in the internal stress remaining in the film after curing, and the heat resistance deteriorates (warping occurs during heating). Occurs.

Therefore, various compositions have been studied in order to solve these drawbacks. For example, a composition comprising a partial condensate of an alkoxysilane having a radical polymerizable vinyl group, colloidal silica and non-silyl acrylate (see Patent Document 1), and particles and acrylates obtained by treating the colloidal silica surface with a photocurable curing agent. And a composition (see Patent Document 2). The present applicant has also proposed a composition comprising silica particles and acrylates obtained by condensing an alkoxysilane having a radical polymerizable vinyl group (see Patent Document 3). However, none of the methods satisfies the wear resistance and heat resistance.

Japanese National Patent Publication No.57-500984 JP-T 58-500251 Japanese Patent No. 3915886

  An object of this invention is to provide the active energy ray-curable resin composition which can form the cured film excellent in abrasion resistance and heat resistance.

  The present inventor has intensively studied to solve the above-mentioned problems, and is excellent in wear resistance and heat resistance by using a composition containing silica fine particles and a specific radical polymerizable vinyl group-containing compound in a specific ratio. It was found that an active energy ray-curable resin composition was obtained, and the present invention was completed.

That is, the present invention relates to a vinyl monomer having an epoxy group-containing radical polymerizable vinyl monomer (a1) and a homopolymer having a glass transition temperature of 60 ° C. or more and copolymerizable with the component (a1). A radical having a carboxyl group in the copolymer (A) having an epoxy equivalent of 200 to 1000 g / eq and a weight average molecular weight of 5000 to 100,000 obtained by polymerizing the monomer component (a) containing (a2). 10 to 60 parts by weight of a reaction product (B) obtained by reacting the polymerizable vinyl monomer (b), a compound (C) having a cyclic structure and two radical polymerizable vinyl groups, 10 to 30 weights 10 to 30 parts by weight of a compound (D) having at least three radical polymerizable vinyl groups and 20 to 60 parts by weight of silica fine particles (E) having an average primary particle diameter of 20 to 80 nm. An active energy ray-curable resin composition; a coating agent composition containing the active energy ray-curable resin composition; a coating agent for a deposition anchor layer containing the active energy ray-curable resin composition; The present invention relates to a cured film obtained by curing a curable resin composition.

ADVANTAGE OF THE INVENTION According to this invention, the active energy ray-curable resin composition which can form the cured film excellent in abrasion resistance and heat resistance is obtained. The active energy ray-curable resin composition can be applied to various uses such as various plastic films and molded articles, glass overcoat agents, wood paints, etc., and can also be used in printing inks. In particular, the active energy ray-curable resin composition of the present invention is useful as a coating agent (particularly a hard coating agent or a coating agent for a vapor deposition anchor layer) for various plastic films and molded articles that require heat resistance.

The active energy ray-curable resin composition of the present invention has an epoxy group-containing radical polymerizable vinyl monomer (a1) (hereinafter referred to as the component (a1)) and a homopolymer having a glass transition temperature of 60 ° C. or higher. And a monomer component (a) (hereinafter referred to as component (a)) containing a vinyl monomer (a2) (hereinafter referred to as component (a2)) that can be copolymerized with the component (a1). A radically polymerizable vinyl monomer having a carboxyl group (hereinafter referred to as “component (A)”) with a copolymer (A) (hereinafter referred to as “component (A)”) having an epoxy equivalent of 200 to 1000 g / eq and a weight average molecular weight of 5,000 to 100,000. b) A reaction product (B) obtained by reacting (hereinafter referred to as component (b)) (B) (hereinafter referred to as component (B)) 10 to 60 parts by weight, having a cyclic structure, and containing 2 radical polymerizable vinyl groups Possession 10-30 parts by weight of product (C) (hereinafter referred to as component (C)), 10-30 parts by weight of compound (D) (hereinafter referred to as component (D)) having at least three radical polymerizable vinyl groups and primary It contains 20 to 60 parts by weight of silica fine particles (E) (hereinafter referred to as component (E)) having a particle size of 20 to 80 nm.

The component (a1) used in the present invention is not particularly limited as long as it is a radical polymerizable vinyl monomer and has one epoxy group and one vinyl group, and known ones can be used. Examples of the component (a1) include glycidyl (meth) acrylate and 4-hydroxybutyl (meth) acrylate glycidyl ether. These may be used alone or in combination of two or more. The component (a1) is preferable from the viewpoint of hard coat properties of a cured film from which glycidyl (meth) acrylate is obtained.

As the component (a2) used in the present invention, vinyl which does not have a functional group that reacts with an epoxy group, has a glass transition temperature of a homopolymer of 60 ° C. or higher, and can be copolymerized with the component (a1). If it is a monomer, it will not specifically limit, A well-known thing can be used. Examples of the component (a2) include (meth) acrylates having a chain alkyl group such as methyl methacrylate and ethyl methacrylate, and alicyclic (meth) acrylates such as isobornyl (meth) acrylate. And (meth) acrylic acid esters containing heteroatoms such as acryloylmorpholine, and aromatic vinyl compounds such as styrene, α-methylstyrene and vinyltoluene. Among these, methyl methacrylate and ethyl methacrylate are preferable from the viewpoint of heat resistance.

The component (a) contains at least the component (a1) and the component (a2), but further contains a radical polymerizable vinyl monomer (a3) other than the components (a1) and (a2) (hereinafter referred to as the component (a3) May be contained). The component (a3) is not particularly limited as long as it does not have a functional group that reacts with an epoxy group and can be radically copolymerized with the component (a1) and / or the component (a2). be able to. Examples of the component (a3) include vinyl acetate, vinyl propionate, (meth) acrylonitrile, (meth) acrylamide, α-olefins and the like.

The composition of the component (a) is not particularly limited, but the use resistance (weight ratio) of the component (a1) and the component (a2) is about 7/3 to 1/9. And 5/5 to 3/7 are particularly preferable since the balance between heat resistance and heat resistance is balanced. When the component (a3) is used, the amount of the component (a3) used may be about 1 to 20 parts by weight with respect to 100 parts by weight of the total amount of the components (a1) and (a2). It is preferable because the balance between the wear resistance and the heat resistance of the resulting cured film is good.

The component (A) used in the present invention can be obtained by, for example, radical polymerization of the component (a). The radical polymerization can be performed by a known method. For example, it can be obtained by heating the component (a) in the presence of a radical polymerization initiator. It does not specifically limit as a radical polymerization initiator, A well-known thing can be used. Specifically, for example, inorganic peroxides such as hydrogen peroxide, ammonium persulfate and potassium persulfate, organic peroxides such as benzoyl peroxide, dicumyl peroxide and lauryl peroxide, 2,2′-azobis And azo compounds such as isobutyronitrile and dimethyl-2,2′-azobisisobutyrate. These may be used alone or in combination of two or more. In addition, it is preferable that the usage-amount of a radical polymerization initiator shall be about 0.01-8 weight part with respect to 100 weight part of (a) component. In addition, you may use a chain transfer agent etc. as needed. Examples of the chain transfer agent include lauryl mercaptan, dodecyl mercaptan, 2-mercaptobenzothiazole, bromotrichloromethane, and the like. These may be used alone or in combination of two or more. The amount of chain transfer agent used is preferably about 0.01 to 5 parts by weight per 100 parts by weight of component (a).

The component (A) thus obtained may have a weight average molecular weight (polystyrene conversion value by gel permeation chromatography) of about 5,000 to 100,000 and an epoxy equivalent of about 200 to 1000 g / eq. preferable.

The component (B) of the present invention can be obtained by reacting the component (A) with the component (b). The component (b) is not particularly limited as long as it is a radical polymerizable vinyl monomer having a carboxyl group in the molecule, and a known one can be used. For example, (meth) acrylic acid, crotonic acid, etc. are mentioned. Among these, acrylic acid is preferably used from the viewpoint of photocurability of the reaction product. Although the usage-amount of (b) component is not specifically limited, Since acrylic acid does not remain | survive after reaction, it is preferable at the point of the hard-coat property of the hardened | cured material obtained after reaction.

The reaction between the component (A) and the component (b) is an epoxy ring-opening reaction, and known reaction conditions can be employed. For example, it can be obtained by heating in the presence of a catalyst. Examples of the catalyst include phosphines such as triphenylphosphine and tricyclohexylphosphine; quaternary ammonium salts such as tetramethylammonium chloride, trimethylbenzylammonium chloride and tetramethylammonium bromide, trimethylamine, triethylamine, benzylmethylamine, tributylamine and the like. Amines; imidazoles such as 2-methylimidazole; and lauric acid esters such as dibutyltin laurate. Although the usage-amount of a catalyst is not specifically limited, Usually, it is preferable to set it as about 0.01-5 weight part with respect to 100 weight part of total weight of (A) component and (b) component. In addition, you may use an organic solvent and a polymerization inhibitor as needed. As an organic solvent, if it does not react with (A) component and (b) component, it will not specifically limit and a well-known thing can be used. Specific examples include alcohols such as ethyl alcohol and propanol; lower ketones such as acetone and methyl ethyl ketone; aromatic hydrocarbons such as toluene and benzene; butyl acetate, ethyl acetate, chloroform and dimethylformamide. These may be used individually by 1 type, and may mix and use 2 or more types. Examples of the polymerization inhibitor include methoquinone, hydroquinone, trimethylhydroquinone, N-nitrosophenylhydroxylamine and the like. In addition, although the usage-amount of a polymerization inhibitor is not specifically limited, Since the polymerizability of the coating agent obtained may deteriorate, normally with respect to 100 weight part of total weight of (A) component and (b) component, The amount is preferably about 1 part by weight or less. In order to prevent polymerization, air may be blown into the reaction system.

The component (B) thus obtained has a weight average molecular weight (polystyrene conversion value by gel permeation chromatography) of about 7,000 to 140,000, an acrylic equivalent of about 250 to 1200 g / eq, and an acid value. It is preferable to set it to about 5 mgKOH / g or less from the point of the hard-coat characteristic of the cured film obtained. In addition, the usage-amount of (B) component needs to be about 10-60 weight part of the total amount of (B)-(E) component, and it is preferable to set it as 10-40 weight part. When the amount of the component (E) used is less than 10 parts by weight, the flexibility of the resin is impaired and the heat resistance is remarkably lowered, and when it exceeds 60 parts by weight, the wear resistance is lowered. Therefore, it is not preferable. In addition, when using the solution and dispersion of (B) component, the said usage-amount means the solid content amount as (B) component.

The component (C) is not particularly limited as long as it is a compound containing two radical polymerizable vinyl groups in one molecule other than the component (B), and a known component can be used. Examples of the radical polymerizable vinyl group include a (meth) acryloyl group and an allyl group. Specific examples of the component (C) include diacrylates having an alicyclic structure such as dimethylol tricyclodecane diacrylate, and isocyanuric rings such as bis (2-acryloxyethyl) -hydroxyethyl-isocyanurate. Examples include diacrylates having a structure, ethylene oxide (EO) -modified diacrylate of bisphenol A, EO-modified diacrylate of bisphenol F, and the like. Among these, it is preferable to use diacrylates having an alicyclic structure such as dimethylol tricyclodecane diacrylate from the viewpoint of wear resistance and light stability. Component (C) must be used in an amount of about 10 to 30 parts by weight, preferably 10 to 25 parts by weight, based on the total amount of components (B) to (E). When the amount of the component (E) used is less than 10 parts by weight, the heat resistance is remarkably lowered, which is not preferred. When it exceeds 30 parts by weight, the wear resistance is lowered, which is not preferred. In addition, it is preferable to set the weight ratio of the component (C) / (D) to 0.25 to 10.0 because heat resistance is improved while maintaining wear resistance.

The component (D) is not particularly limited as long as it is a compound having three or more radical polymerizable vinyl groups in one molecule other than the component (B). (Meth) acryloyl group, allyl group, etc. are mentioned. Specifically, for example, dipentaerythritol hexaacrylate, dipentaerythritol pentaacrylate, pentaerythritol tetraacrylate, pentaerythritol triacrylate, trimethylolpropane triacrylate, ditrimethylolpropane tetraacrylate, etc., dipentaerythritol pentaacrylate, Polyfunctional urethane (meth) acrylate obtained by reacting a polyfunctional (meth) acrylate oligomer having a hydroxyl group such as pentaerythritol triacrylate with a compound having two or more isocyanate groups in one molecule, polyester poly (meta ) Acrylate, epoxy (meth) acrylate, polyether (meth) acrylate, oligo (meth) acrylate, polyol ( Data) acrylate, and oligomers such as a silicone (meth) acrylate. These may be used alone or in combination of two or more. Among these, it is preferable to use pentaerythritol triacrylate from the viewpoint of compatibility with other components and hardness. Component (D) must be used in an amount of about 10 to 30 parts by weight, preferably 10 to 25 parts by weight of the total amount of components (B) to (E). When the amount of the component (D) used is less than 10 parts by weight, the crosslinking density is lowered and the wear resistance is lowered, which is not preferable. When it exceeds 30 parts by weight, the crosslinking density is too high and heat resistance is reduced. This is not preferable because the properties are lowered.

The component (E) is not particularly limited as long as it is a silica fine particle having an average primary particle diameter of 20 to 80 nm, and a known one can be used. The average primary particle diameter is a value determined by a dynamic light scattering method. In addition, (E) component can use a well-known thing as it is. Specifically, for example, Snowtex (manufactured by Nissan Chemical Industries, Ltd.), Quartron (manufactured by Fuso Chemical Industries, Ltd.), Aerosil (manufactured by Nippon Aerosil Co., Ltd.), Sildex (manufactured by Asahi Glass Co., Ltd.), And Silysia 470 (manufactured by Fuji Silysia Chemical Co., Ltd.). In addition, it is preferable to use an organosilica sol dispersed in an organic solvent in advance for simplification of production. For example, IPA-ST-MS (an isopropanol dispersion manufactured by Nissan Chemical Industries, Ltd.), MA-ST-M (Nissan Chemical) Methanol dispersion manufactured by Kogyo Co., Ltd.), Quattron PL-2-IPA (isopropanol dispersion manufactured by Fuso Chemical Co., Ltd.), and the like. (E) The usage-amount of a component needs to be about 20-60 weight part of the total amount of (B)-(E) component, and it is preferable to set it as 40-60 weight part. When the amount of the component (E) used is less than 20 parts by weight, it is not preferable because sufficient wear resistance cannot be obtained. When it exceeds 60 parts by weight, cracking occurs when cured by active energy rays. Or transparency is unfavorable. In addition, when (E) component is a dispersion, the said usage-amount means the amount of solid content as (E) component.

The active energy ray-curable resin composition of the present invention contains the components (B) to (E), and further includes various photosensitizers, antioxidants, light stabilizers, leveling agents, pigments and the like. Known additives and photopolymerization initiators may be contained.

As a photoinitiator, it does not specifically limit and can use a well-known thing. Specifically, for example, 1-hydroxy-cyclohexyl-phenyl ketone, 2,2-dimethoxy-1,2-diphenylethane-1-one, 1-cyclohexyl phenyl ketone, 2-hydroxy-2-methyl-1-phenyl -Propan-1-one, 1- [4- (2-hydroxyethoxy) -phenyl] -2-hydroxy-2-methyl-1-propan-1-one, 2-methyl-1- [4- (methylthio) Phenyl] -2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) -butanone-1, bis (2,4,6-trimethylbenzoyl) -phenylphos Examples include fin oxide, 2,4,6-trimethylbenzoyl-diphenyl-phosphine oxide, 4-methylbenzophenone, etc. . These may be used alone or in combination of two or more. In addition, although a photoinitiator is used when performing ultraviolet curing, it is not necessarily required when performing electron beam curing. Although the usage-amount in the case of using a photoinitiator is not specifically limited, Usually, it is preferable to set it as about 1-10 weight part with respect to 100 weight part of total amounts of (B)-(E) component.

The active energy ray-curable resin composition of the present invention can be cured using active energy rays such as ultraviolet rays and electron beams. The cured film obtained by curing the active energy ray-curable resin composition has adhesion and transparency, and has higher wear resistance and heat resistance than conventional active energy ray-curable resin compositions. It is good.

Hereinafter, the present invention will be specifically described with reference to production examples, examples, and comparative examples. However, the present invention is not limited to such examples. In each example, parts and% are based on weight.

In this example, the weight average molecular weight is determined by gel permeation chromatography (trade name “HLC-8220” manufactured by Tosoh Corporation, column: manufactured by Tosoh Corporation, trade names “TSKgel superHZ2000”, “TSKgel superHZM”. -M "indicates the value measured.

Production Example 1 (Production of copolymer having epoxy group (component (A1)))
In a reaction vessel equipped with a stirrer, a cooling tube, a dropping funnel and a nitrogen introducing tube, 125 parts of glycidyl methacrylate (hereinafter referred to as GMA), 125 parts of methyl methacrylate (hereinafter referred to as MMA), 2,2′-azobisiso After charging 7.5 parts of butyronitrile (hereinafter referred to as AIBN) and 1000 parts of butyl acetate, the temperature was raised to about 90 ° C. over about 1 hour under a nitrogen stream and kept for 1 hour. . Next, from a dropping funnel previously charged with a mixed solution consisting of 375 parts of GMA, 375 parts of MMA, and 22.5 parts of AIBN, the mixed solution was dropped into the system in about 2 hours under a nitrogen stream and kept at the same temperature for 3 hours. After the heat insulation, 10 parts of AIBN was charged and kept warm for 1 hour. Then, it heated up at 120 degreeC and heat-retained for 2 hours. Thereafter, the reaction system was cooled to obtain a solution of a copolymer (A1) having an epoxy group (hereinafter referred to as component (A1)). This product had a weight average molecular weight (polystyrene equivalent) of 12,000 and an epoxy equivalent of 301.

Production Example 2 (Production of reactive polymer (component (B1)))
After the step of Production Example 1, the nitrogen inlet tube of the reaction vessel was replaced with an air inlet tube, and after charging and mixing 253 parts of acrylic acid (hereinafter referred to as AA), 2.3 parts of methoquinone and 6.0 parts of triphenylphosphine The temperature was raised to 110 ° C. under air bubbling. Next, after keeping at the same temperature for 8 hours, 1.6 parts of methoquinone was charged, cooled, ethyl acetate was added so that the nonvolatile content was 50%, and an acrylic copolymer (B1) (hereinafter referred to as (B1) Solution).

Production Example 3 (Production of copolymer having epoxy group (component (A2)))
After charging 250 parts of GMA, 7.5 parts of AIBN, and 1000 parts of butyl acetate in a reaction vessel equipped with a stirrer, a cooling pipe, a dropping funnel and a nitrogen introduction pipe, the system temperature was about 1 hour under a nitrogen stream. The temperature was raised to 90 ° C. and kept for 1 hour. Next, from a dropping funnel previously charged with a mixed solution consisting of 750 parts of GMA and 22.5 parts of AIBN, the mixed liquid was dropped into the system in about 2 hours under a nitrogen stream, and kept at the same temperature for 3 hours. Parts were charged and kept warm for 1 hour. Then, it heated up at 120 degreeC and heat-retained for 2 hours. Thereafter, the reaction system was cooled to obtain a solution of a copolymer (A2) having an epoxy group (hereinafter referred to as component (A2)). The weight average molecular weight (polystyrene conversion) of this thing was 16000, and the epoxy equivalent was 151.

Production Example 4 (Production of reactive polymer (component (B2)))
After the step of Production Example 3, the nitrogen introduction tube was replaced with an air introduction tube, AA 506 parts, methoquinone 2.3 parts and triphenylphosphine 6.0 parts were charged and mixed, and then heated to 110 ° C. under air bubbling. Warm up. Next, after keeping at the same temperature for 8 hours, 1.6 parts of methoquinone was charged, cooled, ethyl acetate was added so that the nonvolatile content was 50%, and an acrylic copolymer (B2) (hereinafter referred to as (B2)) Solution).

Example 1 (Preparation of active energy ray-curable resin composition)
30 parts (solid conversion: 15 parts) of the copolymer obtained in Production Example 1 as the component (B), and dimethylol tricyclodecane diacrylate (trade name: Light acrylate DCP-A Kyoeisha Chemical Co., Ltd.) as the component (C) 10 parts) (hereinafter referred to as DCP-A), 15 parts of pentaerythritol triacrylate (trade name: Aronix M-305, manufactured by Toagosei Co., Ltd., hereinafter referred to as PE3A) as component (D), and isopropanol dispersion as component (E) Colloidal silica (SiO2 non-volatile content: 30%, trade name: IPA-ST-MS, manufactured by Nissan Chemical Industries, Ltd.), 200 parts, and 1-hydroxy-cyclohexyl-phenylketone (trade name: Irgacure 184, Ciba 5 parts from Japan Co., Ltd. and BYK which is a silicone surface conditioner as a surface conditioner 0.75 parts of -310 (manufactured by Big Chemie) was added, and diluted with propylene glycol monomethyl ether (hereinafter referred to as PM) so that the nonvolatile content was 30% to prepare an active energy ray-curable resin composition.

Comparative Examples 1-4
In Example 1, except that the type or amount of component (B) or the amount of component (C) and component (D) used, and the primary particle size or amount of component (E) were changed as shown in Table 1. An active energy ray-curable resin composition was prepared in the same manner as in Example 1.

Preparation of test substrate The active energy ray-curable resin composition obtained in Example 1 was applied onto a polycarbonate plate having a thickness of 2 mm using a bar coater # 30 and dried at 80 ° C for 1 minute. Next, the obtained coated film is passed under high-pressure mercury lamp (ultraviolet ray irradiation amount: 400 mJ / cm ² ) in the atmosphere (conveying speed: 10 m / min) to cure the coated surface, whereby the test substrate is obtained. Obtained. The test base material was obtained similarly about each resin composition of Comparative Examples 1-4.

(1) About the abrasion resistance test substrate, the coating film was worn under the conditions of wear wheel CS-10F, load 250 g, wear frequency 600 cycles in accordance with ASTM-D-1044, and then the haze meter was used to determine the haze value. The amount of change was measured. The abrasion resistance is indicated by (the haze value after the wear test−the haze value before the wear test).

(2-1) Adhesion test JIS per substrate surface
A cross cellophane tape peeling test was performed by the method described in K5400.

(3-1) Evaluation of heat resistance: The appearance test substrate was left in a 140 ° C. hot air circulation dryer for 200 hours and then taken out, cooled to room temperature, and then visually evaluated for the surface condition.
○: No change.
Δ: There are fine cracks.
X: There is a large crack.

(3-2) Evaluation of heat resistance: Adhesion (after heat test)
After the above heat resistance test was performed on a test substrate with a notch in the grid, adhesion was evaluated in the same manner as before the heat test.

Claims (5)

The radically polymerizable vinyl monomer (a1) having an epoxy group and the homopolymer have a glass transition temperature of 60 ° C. or higher and contain a vinyl monomer (a2) that can be copolymerized with the component (a1). A radical polymerizable vinyl monomer having a carboxyl group in a copolymer (A) having an epoxy equivalent of 200 to 1000 g / eq and a weight average molecular weight of 5,000 to 100,000 obtained by polymerizing the monomer component (a). 10 to 60 parts by weight of the reaction product (B) obtained by reacting (b), compound (C) having a cyclic structure and two radically polymerizable vinyl groups, 10 to 30 parts by weight, and radically polymerizable vinyl Active energy containing 10 to 30 parts by weight of compound (D) having at least three groups and 20 to 60 parts by weight of silica fine particles (E) having an average primary particle diameter of 20 to 80 nm Line curable resin composition. The active energy ray-curable resin composition according to claim 1, wherein a weight ratio of the component (C) to the component (D) (component (C) / component (D)) is 0.25 to 10.0. The coating agent composition containing the active energy ray curable resin composition of Claim 1 or 2. The coating agent for vapor deposition anchor layers containing the active energy ray curable resin composition of Claim 1 or 2. A cured film obtained by curing the active energy ray-curable resin composition according to claim 1.