JP2009232159A - Solid-state imaging apparatus, camera, and method of manufacturing them - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To locate a solid-state imaging element for camera body with higher accuracy only by bringing a contact part on the side of a solid-state imaging apparatus into contact with a contact part on the side of camera body and also eliminate or reduce a cutting process of the contact part for positioning on the side of the solid-state imaging apparatus in accordance with the state of mounting individual solid-state imaging element. <P>SOLUTION: The solid-state imaging apparatus 10 is provided with a solid-state imaging element 11, a package accommodating the solid-state imaging element 11, and a plurality of contact portions for positioning 15a to 15c, 16a to 16c to position the solid-state imaging element 11 to camera body which are fixed to the body 1 of package and are respectively brought into contact with a plurality of contact portions of the camera body. At least one of the contact portions for positioning 15a to 15c, 16a to 16c is formed of a member different from a base material bonded to the base material with the package body 1 or the member 5 fixed to the package body 1 as the base material. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a solid-state imaging device, a camera using the same, and a manufacturing method thereof.

  Generally, a semiconductor device that is diced and divided into individual chips from a wafer is accommodated in a package and sealed.

  When packaging a solid-state imaging device (image sensor) in this way, the packaging is performed so that incident light is guided to the solid-state imaging device. That is, the solid-state imaging device is attached to a concave package body having an opening with the light incident side as the opening side. Then, processing such as wire bonding is performed. Next, a plate-shaped lid having translucency is overlaid on the opening of the package body, the periphery of the lid is bonded to the periphery of the opening in the package body with an adhesive, and the opening is sealed by the lid Thus, the solid-state imaging device is completed. In this way, since the accommodation space of the solid-state imaging device is hermetically sealed while the incident light is guided to the solid-state imaging device, the solid-state imaging device is not exposed to the outside air. Therefore, since the solid-state image sensor is not affected by moisture, oxygen, or the like, the durability of the solid-state image sensor is improved.

  By the way, when a solid-state image pickup device in which a solid-state image pickup device is packaged is incorporated in the body of the camera, the tilt of the image pickup surface (light receiving surface) of the solid-state image pickup device with respect to the optical axis of the camera body occurs. It is necessary to incorporate the solid-state imaging device so as not to be aligned.

  Therefore, in Patent Document 1 described below, a solid-state imaging device in which a solid-state imaging element is packaged is attached to a camera body via a holder (attachment member), and the following measures are taken. That is, in Patent Document 1, a plurality of attachment surfaces (contact portions) of a camera body incorporating a solid-state imaging device are preliminarily defined with reference to an imaging surface of an imaging lens or an attachment surface of the imaging lens (therefore, the camera's body). (Based on the optical axis of the body or the surface corresponding thereto). In addition, the solid-state imaging device is fixed to the holder in advance and the two are integrated. In the state where the solid-state imaging device is fixed to the holder and integrated with the holder, a signal from the solid-state imaging device or a microscope is used. Then, a plurality of attachment surfaces (each of which is in contact with a plurality of attachment surfaces (contacted portions) of the body of the camera with reference to the imaging surface (light receiving surface) of the solid-state imaging device in the package of the solid-state imaging device) A plurality of positioning contact portions for determining the position of the solid-state imaging device with respect to the camera body are cut into a holder. As described above, the positioning contact portion of the holder is formed by cutting the holder itself. Then, the integrated body of the holder and the solid-state imaging device, which has been subjected to the cutting of the mounting surface (positioning contact portion), makes the mounting surface of the holder the mounting surface (contacted portion) of the camera body. It is attached in the body of the camera in a contact state.

  According to the method for attaching a solid-state imaging device to a camera disclosed in Patent Document 1, as described above, the solid-state imaging device in which the solid-state imaging device is packaged is fixed to the holder, and both are integrated. In this state, the mounting surface is cut into a holder with reference to the imaging surface of the solid-state imaging device in the package of the solid-state imaging device. Therefore, when attaching the holder integrated with the solid-state imaging device in the body of the camera In addition, by simply bringing the mounting surface (contact portion) into contact with the mounted surface (contacted portion), the tilt of the solid-state imaging device can be accurately adjusted without any special angle adjustment for preventing tilt. Etc. can be suppressed.

Further, in Patent Document 1, positioning of the solid-state imaging device in the imaging surface direction with respect to the camera body (including positioning of the rotational position around the optical axis) is performed by a plurality of mounting protrusions (positioning contact portions) formed on the holder. ) Is brought into contact with each of a plurality of positioning surfaces (contacted portions) formed on the camera body.
JP 11-265026 A

  Although the attachment method disclosed in Patent Document 1 is very excellent as described above, the attachment surface (contact portion) must be cut on the holder in accordance with each solid-state imaging device. In order to prevent time-consuming and troublesome cutting work and to prevent the powder generated during the cutting process from being attached to the lid for introducing the incident light of the solid-state imaging device and affecting the imaging characteristics There is room for improvement in that the removal of the powder and the like must be performed with certainty. This applies not only to positioning for preventing tilt, but also to positioning in the imaging surface direction. That is, although not explicitly disclosed in Patent Document 1, in order to increase the positioning accuracy in the imaging surface direction, the solid-state imaging device is fixed to the holder and integrated with the holder, and the imaging surface of the solid-state imaging device is used as a reference. If a plurality of mounting protrusions (positioning contact portions) of the holder are cut, it takes time and labor to cut the powder, and it is necessary to remove powder and the like generated during the cutting.

  The present invention has been made in view of such circumstances. When the solid-state imaging device is incorporated into the camera body, the contact portion on the solid-state imaging device side is brought into contact with the contacted portion on the body side of the camera. Therefore, the solid-state imaging device can be accurately positioned with respect to the camera body without any special adjustment, and the solid-state imaging device-side positioning abutment unit that matches the mounting state of each solid-state imaging device. It is an object of the present invention to provide a method for manufacturing a camera that can eliminate the need for the cutting process or reduce the number of parts that require the cutting process. Moreover, an object of this invention is to provide the camera which can be manufactured with such a manufacturing method of a camera. Furthermore, an object of the present invention is to provide a solid-state imaging device and a method for manufacturing the same that can be used in the method for manufacturing a camera as described above.

  In order to solve the above problems, a solid-state imaging device according to the first aspect of the present invention includes a solid-state imaging device, a package containing the solid-state imaging device, a fixed body with respect to the main body of the package, A plurality of positioning contact portions that respectively contact a plurality of contact portions of a body of a camera to be incorporated to determine the position of the solid-state imaging device with respect to the body, and of the plurality of positioning contact portions The at least one positioning contact portion is made of a member different from the base material bonded to the base material with the main body or a member fixed to the main body as a base material.

  The solid-state imaging device according to a second aspect of the present invention is the solid-state imaging device according to the first aspect, wherein the at least one positioning contact portion is for positioning in the optical axis direction for determining the position of the solid-state imaging element in the optical axis direction. The contact portion for positioning in the optical axis direction includes a contact portion, and is adhered to the base material in a state of being inserted through an insertion hole formed in the base material.

  In the solid-state imaging device according to the third aspect of the present invention, in the first or second aspect, the at least one positioning contact portion is an imaging surface for determining a position in the imaging surface direction of the solid-state imaging device. The imaging surface direction positioning contact portion includes a direction positioning contact portion, and is bonded to the base material while being engaged with a groove formed in the base material.

  A solid-state imaging device according to a fourth aspect of the present invention includes the solid-state imaging device according to any one of the first to third aspects, and the solid-state imaging device is incorporated in the body.

  A method for manufacturing a solid-state imaging device according to a fifth aspect of the present invention is a manufacturing method for manufacturing a solid-state imaging device according to any one of the first to third aspects, and the solid-state imaging device housed in the package. Adjusting the position of the at least one positioning contact portion with respect to the base material on the basis of the imaging surface of the substrate, and bonding the at least one positioning contact portion to the base material. is there.

  A camera manufacturing method according to a sixth aspect of the present invention is a manufacturing method for manufacturing the camera according to the fourth aspect, wherein the base material is based on the imaging surface of the solid-state imaging device housed in the package. Adjusting the position of the at least one positioning contact portion with respect to the substrate, and bonding the at least one positioning contact portion to the base; and Attaching the solid-state imaging device to the body of the camera by contacting each of the contact portions.

  According to the present invention, when the solid-state imaging device is incorporated into the camera body, a special adjustment or the like is performed only by bringing the abutting portion on the solid-state imaging device side into contact with the abutted portion on the camera body side. Without being able to position the solid-state imaging device with respect to the camera body with high accuracy and cutting the contact portion for positioning on the solid-state imaging device side according to the mounting state of each solid-state imaging device, Or the manufacturing method of a camera which can reduce the location which requires the cutting process can be provided. In addition, according to the present invention, a camera that can be manufactured by such a camera manufacturing method can be provided. Furthermore, according to the present invention, it is possible to provide a solid-state imaging device and a method for manufacturing the same that can be used in the method for manufacturing a camera as described above.

  Hereinafter, a solid-state imaging device according to the present invention, a camera using the same, and a manufacturing method thereof will be described with reference to the drawings.

  [First Embodiment]

  FIG. 1 is a schematic plan view showing a solid-state imaging device 10 according to the first embodiment of the present invention. FIG. 2 is a schematic sectional view taken along line X1-X1 'in FIG. FIG. 3 is a schematic enlarged sectional view taken along line Y1-Y1 'in FIG. In order to facilitate understanding, only the optical axis direction positioning contact portion 15a and the adhesive 26 are hatched in FIG. FIG. 4 is a schematic enlarged sectional view taken along line Y2-Y2 'in FIG. FIG. 5 is a schematic sectional view taken along the line Z1-Z1 'in FIG. FIG. 6 is a schematic cross-sectional view showing a camera 100 configured using the solid-state imaging device 10 shown in FIGS. 1 to 5. FIG. 7 is a schematic view of contacted portions 125 a, 125 b, 125 c, 126 a, 126 b, and 126 c of the body 101 of the camera 100 as viewed from the back of the camera 100. FIG. 8 is a schematic view of the state in which the solid-state imaging device 10 is attached to the body 101 of the camera 100 as viewed from the back of the camera 100, and corresponds to FIG.

  A solid-state imaging device 10 according to the present embodiment includes a package including a package body 1 and a lid 13, a solid-state imaging device 11 accommodated in the package, and three optical axis direction positioning contact portions 15a, 15b, 15c and three imaging surface direction positioning contact portions 16a, 16b, and 16c.

  The package body 1 includes a bottom plate 2 having a rectangular shape in plan view, a frame plate 3, an embedded member 4 embedded in the bottom plate 2, a mounting plate 5, and a lead frame 6 made of a conductive material.

  The bottom plate 2, the frame plate 3, and the lead frame 6 are bonded to each other with an adhesive (not shown). The bottom plate 2 and the frame plate 3 are members that form a part that defines a recess 1 a that is a housing space for the solid-state imaging device 11. An upper surface 2 a of the bottom plate 2 is an attachment surface for attaching the solid-state imaging element 11. The lead frame 6 is led out from the inside of the recess 1a to the outside of the side. As the material of the bottom plate 2 and the frame plate 3, for example, ceramic or resin is used, respectively. When ceramic is used, the bottom plate 2 and the frame plate 3 can be formed of a ceramic plate. Moreover, when using resin, the baseplate 2 and the frame board 3 can be comprised as an integral molding member by resin. In the present embodiment, the embedding member 4 is embedded in the bottom plate 2 from the lower side in the vicinity immediately below the attachment surface 2a, and is bonded to the bottom plate 2 with an adhesive, for example. A material having higher thermal conductivity than the material of the bottom plate 2 is used as the material of the embedded member 4. As the material of the embedded member 4, it is preferable to use a material having high thermal conductivity such as copper, aluminum, CuW, and stainless steel.

  The mounting plate 5 is bonded to the bottom surface of the bottom plate 2 and the embedded member 4 with an adhesive and protrudes on both sides of the bottom plate 2 and the frame plate 3 in a plan view as shown in FIG. Thus, the mounting plate 5 is integrated with the package body 1 according to the present embodiment. In the present embodiment, the attachment plate 5 is a base material to which the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are attached. In the present embodiment, the positioning contact portions 15a, 15b, 15c, 16a, 16b, 16c are configured as members different from the mounting plate 5, respectively, and the positioning contact portions 15a, 15b, 15c, 16a, 16 b and 16 c are bonded to the mounting plate 5 and fixed to the package body 1. The base material to which the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are attached may be the package body 1 itself as in the present embodiment, or may be a member fixed to the package body 1.

  In the present embodiment, as the material of the mounting plate 5, a material having a higher thermal conductivity than the material of the bottom plate 2 is used similarly to the material of the embedded member 4. As the material of the embedded member 4, for example, it is preferable to use a material having high thermal conductivity such as copper, aluminum, CuW, and stainless steel. As described above, the attachment plate 5 is joined to the lower surface of the embedded member 4, whereby the attachment plate 5 and the embedded member 4 are thermally coupled.

  The positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are the contacted portions 125a, 125b, 125c, 126a, 126b, and 126c of the body 101 of the camera 100 that incorporates the solid-state imaging device 10 and thus the solid-state imaging device 11. The position of the solid-state imaging device 11 with respect to the body 101 of the camera 100 is determined.

  Of these positioning contact portions, three optical axis direction positioning contact portions 15 a, 15 b, and 15 c determine the position of the solid-state imaging device 11 in the optical axis direction with respect to the body 101 of the camera 100. In this embodiment, as shown in FIG. 3, the optical axis direction positioning contact portion 15a is composed of a cylindrical member 25 having a flange portion 25a at the lower end, and is formed on the mounting plate 5 before the cylindrical member 25 is bonded. In the state inserted in the insertion hole 5a guided in the up-down direction in FIG. As the adhesive 26, an adhesive made of a resin such as a UV curable resin may be used. Instead of bonding with the adhesive 26, for example, bonding with solder may be employed. The cylindrical member 25 is not necessarily formed with the flange portion 25a. An upper end surface 25 b of the cylindrical member 25 is a contact surface that contacts the contacted portion 125 a of the body 101 of the camera 100. A screw 103 to be described later is inserted into the inner hole 25c of the cylindrical member 25. The same applies to the optical axis direction positioning contact portions 15b and 15c.

  The remaining three imaging surface direction positioning contact portions 16a, 16b, and 16c among the positioning contact portions described above are positions in the imaging surface direction of the solid-state imaging device 11 with respect to the body 101 of the camera 100 (around the optical axis). (Including the rotational position of). In this embodiment, as shown in FIGS. 4 and 5, the imaging surface direction positioning contact portion 16 a is configured by a rectangular parallelepiped member 27 and is formed on the attachment plate 5 before attaching the rectangular parallelepiped member 27 to the attachment plate 5. It is bonded to the inner surface of the groove 5b with an adhesive 28 while being engaged with the groove 5b that linearly guides to the side of the groove 5b. As the adhesive 28, an adhesive made of a resin such as a UV curable resin may be used. Instead of bonding with the adhesive 28, for example, bonding with solder may be employed. The protruding side end surface 27 a of the rectangular parallelepiped member 27 is a contact surface that contacts the contacted portion 126 a of the body 101 of the camera 100. The same applies to the imaging surface direction positioning contact portions 16b and 16c. However, as can be understood from FIG. 1, the projecting direction differs by 90 degrees between the imaging surface direction positioning contact portions 16 a and 16 b and the imaging surface direction positioning contact portion 16 c.

  The lid 13 is composed of a plate-like member having a predetermined light transmission characteristic (for example, a glass plate, an optical low-pass filter made of a single crystal plate such as crystal or lithium niobate). The solid-state imaging device 11 is accommodated in the recess 1a with the light incident side as the opening side of the recess 1a, and is bonded to the mounting surface 2a of the bottom plate 2 with an adhesive (not shown). The solid-state imaging device 11 and the lead frame 6 are electrically connected by a wire 12, and the solid-state imaging device 11 is electrically connected to the outside via the wire 12 and the lead frame 6. The lid body 13 is attached to the package body 1 by bonding the peripheral portion of the lid body 13 to the upper surface of the frame plate 3 with an adhesive (not shown), and the concave portion 1a (the housing space for the solid-state imaging device 11) is formed. It is sealed. An inert gas is sealed in the sealed recess 1a.

  Here, as a solid-state imaging device manufacturing method according to an embodiment of the present invention, an example of a manufacturing method of the solid-state imaging device 10 shown in FIGS. 1 to 5 will be described. First, the package body 1 is prepared. Next, the solid-state imaging device 11 is attached to the attachment surface 2a of the bottom plate 2 of the package body 1 with an adhesive. Next, wire bonding is performed, and the solid-state imaging device 11 and the lead frame 6 are connected by the wire 12. Subsequently, the lid 13 is attached to the package body 1 by adhering the peripheral portion of the lid 13 to the upper surface of the frame plate 3 with an adhesive (not shown), and the inert gas is sealed in the recess 1a. In this state, the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are not yet attached to the mounting plate 5.

  Thereafter, the imaging surface 11a of the solid-state imaging device 11 accommodated in the package composed of the package main body 1 and the lid 13 is used by using a signal from the solid-state imaging device 11 or using a microscope or a laser length measuring device. As a reference, the positions of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c with respect to the mounting plate 5 (in the case of the optical axis direction positioning contact portions 15a, 15b, and 15c, orthogonal to the paper surface in FIG. In the case of the imaging surface direction positioning contact portions 16a, 16b, and 16c, the positioning contact portions 15a, 15b, 15c, 16a, 16b and 16c are bonded to the mounting plate 5 with adhesives 26 and 28, respectively. At this time, position adjustment of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c with respect to the mounting plate 5 is performed by incorporating the solid-state imaging device 10 into the body 101 of the camera 100 and positioning positioning portions 15a and 15b. , 15c, 16a, 16b, and 16c are brought into contact with the contacted portions 125a, 125b, 125c, 126a, 126b, and 126c, respectively, the orientation of the imaging surface 11a of the solid-state imaging device 11, the position in the optical axis direction, The rotation position around the optical axis is performed in a desired state with the required accuracy. As described above, the solid-state imaging device 10 shown in FIGS. 1 to 5 is completed.

  A solid-state imaging device 10 shown in FIGS. 1 to 5 is incorporated in the body 101 of the camera 100 shown in FIG. The camera 100 shown in FIG. 6 is configured as a single-lens reflex type electronic still camera, but the solid-state imaging device 10 shown in FIGS. 1 to 5 is a variety of electronic cameras such as other electronic still cameras and video cameras. It may be incorporated into.

  In the camera 100 shown in FIG. 6, a lens mount 112 is provided on the body 101, and an interchangeable photographing lens 113 is attached to the lens mount 112. The subject light that has passed through the photographing lens 113 is reflected upward by the quick return mirror 114 and forms an image on the screen 115. The subject image formed on the screen 115 is observed from the finder observation window 118 through the eyepiece lens 117 from the penta roof prism 116. When the release button (not shown) is fully pressed, the quick return mirror 114 jumps upward, and the subject image from the photographing lens 113 enters the solid-state imaging device 10 described above.

  As shown in FIGS. 6 and 8, the solid-state imaging device 10 uses the positioning contact portions 15 a, 15 b, 15 c, 16 a, 16 b, and 16 c as contacted portions 125 a, 125 b, 125 c, and 126 a of the body 101 of the camera 100. , 126b, 126c in a state of being in contact with each other, screws inserted into the screw holes 130 (see FIG. 7) of the body 101 through the insertion holes of the optical axis direction positioning contact portions 15a, 15b, 15c. It is attached to the body 101 of the camera 100 by being screwed with 103.

  As shown in FIGS. 7 and 8, the contacted portions 125a, 125b, 125c, 126a, 126b, and 126c of the body 101 of the camera 100 are the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c. Each is formed with a predetermined accuracy so as to contact each other. As shown in FIG. 7, an opening 131 is formed in the body 101 of the camera 100 so that the subject luminous flux incident from the photographing lens 113 enters the solid-state image sensor 11. The abutted portions 125a, 125b, 125c, 126a, 126b, and 126c are disposed in the vicinity of the opening 131. In the present embodiment, the abutted surfaces of the abutted portions 125a, 125b, and 125c are formed to be orthogonal to the optical axis of the photographic lens 113 attached to the lens mount 112 with a predetermined accuracy. . In addition, the abutted surfaces of the abutted portions 126a, 126b, and 126c are formed to be parallel to the optical axis of the photographing lens 113 attached to the lens mount 112 with a predetermined accuracy. The abutted surfaces 126a and 126b and the abutted surface of the abutted portion 126c are orthogonal to each other with a predetermined accuracy.

  Here, as a camera manufacturing method according to an embodiment of the present invention, an example of a manufacturing method of the camera 100 shown in FIG. 7 will be described. This manufacturing method includes a step of preparing the solid-state imaging device 10 shown in FIGS. 1 to 5 manufactured by the above-described solid-state imaging device manufacturing method, and positioning contact portions 15a, 15b, 15c, 16a, and the like of the solid-state imaging device 10. With the screws 16b and 16c in contact with the contact portions 125a, 125b, 125c, 126a, 126b, and 126c of the body 101 of the camera 100, the screw 103 is fixed to the optical axis direction positioning contact portions 15a, 15b, and 15c. Attaching the solid-state imaging device 10 to the body 101 of the camera 100 by inserting the insertion hole and screwing the screw hole 130 into the screw hole 130 (see FIG. 7) of the body 101.

  In the solid-state imaging device manufacturing method described above, the positions of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c with respect to the mounting plate 5 are adjusted with reference to the imaging surface 11a of the solid-state imaging device 11 accommodated in the package. Then, since the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are bonded to the mounting plate 5 with the adhesives 26 and 28, the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c. Is directly aligned with the imaging surface 11 a of the solid-state imaging device 11. Therefore, in this case as well, as in the prior art disclosed in Patent Document 1 described above, when the solid-state imaging device 10 is incorporated into the body 101 of the camera 100, the positioning contact portions 15a on the solid-state imaging device 10 side, The camera 15b, 15c, 16a, 16b, and 16c can be brought into contact with the abutted portions 125a, 125b, 125c, 126a, 126b, and 126c on the body 101 side of the camera 100 without any special adjustment. Positioning of the solid-state imaging device 11 with respect to the body 101 of 100 can be performed with high accuracy.

  In the solid-state imaging device manufacturing method described above, the positions of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c with respect to the mounting plate 5 with reference to the imaging surface 11a of the solid-state imaging device 11 accommodated in the package. The positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are adhered to the mounting plate 5 with adhesives 26 and 28, so that unlike the conventional technique disclosed in Patent Document 1 described above, It is not necessary to perform the cutting of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c on the solid-state imaging device 10 side in accordance with the individual solid-state imaging device attached state. Accordingly, it is possible to save time and labor for such cutting, and it is not necessary to remove the powder without generating powder or the like generated during such cutting. Therefore, according to the present embodiment, the manufacturing cost of the camera 100 can be reduced, and the cost of the camera 100 itself can also be reduced.

  Further, in the package main body 1 of the solid-state imaging device 10 shown in FIGS. 1 to 3, the embedded member 4 made of a material having a relatively high thermal conductivity is embedded in the bottom plate 2 in the vicinity immediately below the mounting surface 2 a of the solid-state imaging element 11. The mounting plate 5 is also made of a material having a relatively high thermal conductivity, and the embedded member 4 and the mounting plate 5 are thermally coupled. Therefore, in the solid-state imaging device 10 using the package body 1, heat from the solid-state imaging element 11 is easily transmitted to the mounting plate 5 through the embedded member 4. For this reason, according to this solid-state imaging device 10, since the mounting plate 5 has a function of radiating heat from the solid-state imaging element 11, the heat radiation effect of the solid-state imaging element 11 is enhanced, and the characteristics of the solid-state imaging element 11 are deteriorated due to heat generation. Can be suppressed.

  [Second Embodiment]

  FIG. 9 is a schematic plan view showing a solid-state imaging device 30 according to the second embodiment of the present invention. FIG. 10 is a schematic sectional view taken along line Y3-Y3 'in FIG. 9 and 10, elements that are the same as or correspond to those in FIGS. 1 to 5 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The solid-state imaging device 30 according to the present embodiment is different from the solid-state imaging device 10 according to the first embodiment. In the first embodiment, the imaging surface direction positioning contact portions 16a, 16b, and 16c are provided. In the present embodiment, the rectangular parallelepiped member 27 is bonded to the inner surface of the groove 5b with the adhesive 28 while being engaged with the groove 5b formed on the mounting plate 5. The only difference is that the imaging surface direction positioning contact portions 16 a, 16 b, and 16 c are configured as protrusions made of a part of the mounting plate 5 without forming the groove 5 b.

  As a method for manufacturing the solid-state imaging device according to one embodiment of the present embodiment, an example of a method for manufacturing the solid-state imaging device 30 shown in FIGS. 9 and 10 will be described. In the manufacturing method of the solid-state imaging device 30, the mounting plate 5 is based on the imaging surface 11 a of the solid-state imaging device 11 housed in the package including the package body 1 and the lid body 13 in the manufacturing method of the solid-state imaging device 10 described above. Instead of adhering the imaging surface direction positioning contact portions 16a, 16b and 16c to the mounting plate 5 with an adhesive 28, the position of the imaging surface direction positioning contact portions 16a, 16b and 16c with respect to the package body is adjusted. The abutting surfaces of the imaging surface direction positioning abutting portions 16a, 16b, and 16c are cut with reference to the imaging surface 11a of the solid-state imaging device 11 housed in a package including the lid 1 and the lid 13.

  For example, in the camera 100 shown in FIG. 6, the solid-state imaging device 30 illustrated in FIGS. 9 and 10 is incorporated into the body 101 in the same manner as the solid-state imaging device 10 instead of the solid-state imaging device 10. The manufacturing method of the camera using the solid-state imaging device 30 is the same as the manufacturing method of the camera of the solid-state imaging device 10 described above.

  In the manufacturing method of the solid-state imaging device 30 described here, the position adjustment / adhesion of the optical axis direction positioning contact portions 15a, 15b, and 15c with reference to the imaging surface 11a of the solid-state imaging device 11 accommodated in the package, and Since the imaging surface direction positioning contact portions 16a, 16b, and 16c are cut, when the solid-state imaging device 10 is incorporated into the body 101 of the camera 100, as in the manufacturing method of the solid-state imaging device 10 described above, The positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c on the solid-state imaging device 10 side are brought into contact with the contacted portions 125a, 125b, 125c, 126a, 126b, and 126c on the body 101 side of the camera 100, respectively. The positioning of the solid-state imaging device 11 with respect to the body 101 of the camera 100 is highly accurate without any special adjustment. It can be carried out.

  In the manufacturing method of the solid-state imaging device 30 described here, the imaging surface direction positioning contact portions 16a, 16b, and 16c need to be cut. However, as in the manufacturing method of the solid-state imaging device 10 described above, the optical axis Since the position adjustment / adhesion of the direction positioning contact portions 15a, 15b, and 15c is performed, cutting is performed as compared with the case where all the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are required to be cut. Locations that require machining can be reduced, and the time and labor for cutting can be reduced.

  [Third Embodiment]

  FIG. 11 is a schematic plan view showing a solid-state imaging device 40 according to the third embodiment of the present invention. FIG. 12 is a schematic cross-sectional view along the line Y4-Y4 'in FIG. 11 and 12, elements that are the same as or correspond to those in FIGS. 1 to 5 are given the same reference numerals, and redundant descriptions thereof are omitted.

  The solid-state imaging device 40 according to the present embodiment is different from the solid-state imaging device 10 according to the first embodiment. In the first embodiment, the contact portions 15a, 15b, 15c for positioning in the optical axis direction are provided. In this embodiment, the cylindrical member 25 is bonded to the inner peripheral portion of the insertion hole 5a while being inserted into the insertion hole 5a formed in the mounting plate 5. The only difference is that the axial positioning contact portions 15 a, 15 b, and 15 c are configured as a cylindrical portion 5 c that is continuously and integrally formed of the same material with respect to the mounting plate 5. An upper end surface 5 d of the cylindrical portion 5 c is a contact surface that comes into contact with the contact portions 125 a, 125 b, 125 c of the body 101 of the camera 100. The aforementioned screw 103 is inserted into the inner hole 5e of the cylindrical portion 5c.

  As a method for manufacturing the solid-state imaging device according to one embodiment of the present embodiment, an example of a method for manufacturing the solid-state imaging device 40 shown in FIGS. 11 and 12 will be described. In the manufacturing method of the solid-state imaging device 40, the mounting plate 5 is based on the imaging surface 11a of the solid-state imaging device 11 housed in the package including the package body 1 and the lid 13 in the manufacturing method of the solid-state imaging device 10 described above. Instead of adhering the optical axis direction positioning contact portions 15a, 15b, 15c to the mounting plate 5 with the adhesive 26, the position of the optical axis direction positioning contact portions 15a, 15b, 15c is adjusted. The contact surfaces of the contact portions 15a, 15b, 15c for positioning in the optical axis direction are cut with reference to the imaging surface 11a of the solid-state imaging device 11 housed in a package including the lid 1 and the lid 13.

  For example, in the camera 100 shown in FIG. 6, the solid-state imaging device 40 illustrated in FIGS. 11 and 12 is incorporated into the body 101 in the same manner as the solid-state imaging device 10 instead of the solid-state imaging device 10. The manufacturing method of the camera using the solid-state imaging device 40 is the same as the manufacturing method of the camera of the solid-state imaging device 10 described above.

  In the manufacturing method of the solid-state imaging device 40 described here, the cutting and imaging surfaces of the contact portions 15a, 15b, and 15c for positioning in the optical axis direction with reference to the imaging surface 11a of the solid-state imaging device 11 accommodated in the package. Since the position adjustment contact portions 16a, 16b, and 16c are adjusted and bonded, the solid-state imaging device 10 is assembled into the body 101 of the camera 100 in the same manner as the manufacturing method of the solid-state imaging device 10 described above. The positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c on the solid-state imaging device 10 side are brought into contact with the contacted portions 125a, 125b, 125c, 126a, 126b, and 126c on the body 101 side of the camera 100, respectively. The positioning of the solid-state imaging device 11 with respect to the body 101 of the camera 100 is highly accurate without any special adjustment. It can be carried out.

  In the manufacturing method of the solid-state imaging device 40 described here, the optical axis direction positioning contact portions 15a, 15b, and 15c are required to be cut, but the imaging surface is similar to the manufacturing method of the solid-state imaging device 10 described above. Since the position adjustment / adhesion of the direction positioning contact portions 16a, 16b, and 16c is performed, cutting is performed as compared with the case where all the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c are required to be cut. Locations that require machining can be reduced, and the time and labor for cutting can be reduced.

  [Fourth Embodiment]

  FIG. 13 is a schematic plan view showing a solid-state imaging device 50 according to the fourth embodiment of the present invention. FIG. 14 is a schematic sectional view taken along line X5-X5 'in FIG. FIG. 15 is a schematic sectional view taken along line Y5-Y5 'in FIG. 13 to 15, the same or corresponding elements as those in FIGS. 1 to 5 are denoted by the same reference numerals, and redundant description thereof is omitted.

  The solid-state imaging device 50 according to the present embodiment differs from the solid-state imaging device 10 according to the first embodiment in that the bottom plate 2 slightly protrudes on both sides of the frame plate 3 in plan view, and the bottom plate 2 is in the protruding portion. The mounting plate 5 is screwed with a screw 51, and the bottom plate 2 and the mounting plate 5 are not joined by an adhesive, and the embedded member 4 is not embedded. That is, in the present embodiment, the mounting plate 5 is integrated with the package body 1 by adopting screwing with screws 51 instead of bonding with an adhesive. In the present embodiment, a notch through which the screw 51 is inserted is formed in the bottom plate 2, while a screw hole into which the screw 51 is screwed is formed in the mounting plate 5. An insertion hole through which the screw 51 is inserted may be formed in the mounting plate 5, while a screw hole into which the screw 51 is screwed may be formed in the bottom plate 2.

  The method for manufacturing the solid-state imaging device 50 shown in FIGS. 13 to 15 as the method for manufacturing the solid-state imaging device according to the embodiment of the present invention is the same as the method for manufacturing the solid-state imaging device 10 shown in FIGS. It is the same.

  For example, in the camera 100 shown in FIG. 6, the solid-state imaging device 50 illustrated in FIGS. 13 to 15 is incorporated into the body 101 in the same manner as the solid-state imaging device 10 instead of the solid-state imaging device 10. The manufacturing method of the camera using the solid-state imaging device 50 is the same as the manufacturing method of the camera of the solid-state imaging device 10 described above.

  Except for the heat dissipation of the solid-state imaging device 11, the present embodiment can provide the same advantages as those of the first embodiment.

  In each solid-state imaging device manufacturing method described above, as a method for recognizing the position of the imaging surface 11a of the solid-state imaging device 11, the imaging surface 11a is read by a three-dimensional image reading device, and each positioning contact portion 15a, 15b, The arrangement positions of 15c, 16a, 16b, and 16c (except for those to be machined) may be designated and bonded and fixed at the positions.

  Alternatively, a probe is applied to the output terminal of the solid-state image pickup device 11 to capture an image signal from the solid-state image pickup device 11, and the positional deviation of the image pickup surface 11a is read with a defocus amount with respect to a preset optical system. In accordance with the defocus amount, the positioning positions of the positioning contact portions 15a, 15b, 15c, 16a, 16b, and 16c (excluding those to be machined) are designated, and are fixed by bonding at the positions. Also good.

  Furthermore, the imaging surface 11a of the solid-state imaging device 11, the Z reference plane (reference plane perpendicular to the optical axis) of the mounting plate 5, and the X and Y reference planes (reference plane in the imaging plane direction) are positioned. The imaging surface 11a surface and the jig are positioned and fixed, and the positioning reference portions 15a, 15b, 15c, 16a of the Z reference plane and the X and Y reference planes of the mounting plate 5 are fixed to the jig. A method of mechanically positioning the imaging surface 11a and the X, Y, and Z reference planes by pressing and adhering 16b and 16c may be employed.

  Although the embodiments of the present invention have been described above, the present invention is not limited to these embodiments.

  For example, the present invention can also be applied to those using various types of packages such as DIP (Dual Inline Package) and BGA (Ball grid array).

1 is a schematic plan view showing a solid-state imaging device according to a first embodiment of the present invention. FIG. 2 is a schematic sectional view taken along line X1-X1 'in FIG. It is a general | schematic expanded sectional view along the Y1-Y1 'line | wire in FIG. It is a general | schematic expanded sectional view along the Y2-Y2 'line | wire in FIG. FIG. 5 is a schematic cross-sectional view taken along line Z1-Z1 ′ in FIG. 4. It is a schematic sectional drawing which shows the camera comprised using the solid-state imaging device shown in FIG. 1 thru | or FIG. It is the schematic which looked at the to-be-contacted part of the body of the camera shown in FIG. 6 from the back surface of the camera. It is the schematic which looked at the state which attached the solid-state imaging device to the body of the camera shown in FIG. 6 from the back surface of the camera. It is a schematic plan view which shows the solid-state imaging device by the 2nd Embodiment of this invention. FIG. 10 is a schematic cross-sectional view taken along line Y3-Y3 ′ in FIG. 9. It is a schematic plan view which shows the solid-state imaging device by the 3rd Embodiment of this invention. FIG. 12 is a schematic cross-sectional view taken along line Y4-Y4 ′ in FIG. 11. It is a schematic plan view which shows the solid-state imaging device by the 4th Embodiment of this invention. It is a schematic sectional drawing in alignment with the X5-X5 'line | wire in FIG. It is a schematic sectional drawing in alignment with the Y5-Y5 'line | wire in FIG.

Explanation of symbols

1 Package body 5 Mounting plate (base material)
DESCRIPTION OF SYMBOLS 10, 30, 40, 50 Solid-state imaging device 11 Solid-state image sensor 13 Cover body 15a, 15b, 15c Optical axis direction positioning contact part 16a, 16b, 16c Imaging surface direction positioning contact part 100 Camera 101 Body 125a, 125b , 125c, 126a, 126b, 126c

Claims (6)

A solid-state image sensor;
A package containing the solid-state imaging device;
A plurality of positioning contact portions fixed to the body of the package and respectively contacting a plurality of contact portions of a body of a camera incorporating the solid-state image sensor to determine the position of the solid-state image sensor with respect to the body; ,
With
At least one positioning contact portion of the plurality of positioning contact portions is bonded to the base material using the main body or a member fixed to the main body as a base material. A solid-state imaging device comprising a different member. The at least one positioning contact portion includes an optical axis positioning contact portion for determining a position of the solid-state imaging device in the optical axis direction,
The solid-state imaging device according to claim 1, wherein the contact portion for positioning in the optical axis direction is bonded to the base material in a state of being inserted through an insertion hole formed in the base material. The at least one positioning contact portion includes an imaging surface direction positioning contact portion for determining a position in the imaging surface direction of the solid-state imaging device,
3. The solid-state imaging device according to claim 1, wherein the imaging surface direction positioning contact portion is adhered to the base material while being engaged with a groove formed in the base material.   A camera comprising the solid-state imaging device according to claim 1, wherein the solid-state imaging device is incorporated in the body.   4. The manufacturing method for manufacturing the solid-state imaging device according to claim 1, wherein the at least one positioning device is positioned with respect to the base material with reference to an imaging surface of the solid-state imaging device housed in the package. A method of manufacturing a solid-state imaging device, comprising: adjusting a position of a contact portion and bonding the at least one positioning contact portion to the base material. A manufacturing method for manufacturing the camera according to claim 4,
The position of the at least one positioning contact portion with respect to the base material is adjusted with reference to the imaging surface of the solid-state imaging device housed in the package, and the at least one positioning contact portion is set to the base material. Adhering to, and
Attaching the solid-state imaging device to the body of the camera by bringing the plurality of positioning contact portions into contact with the plurality of contacted portions, respectively;
A method of manufacturing a camera, comprising:

Images