JP2009230008A - Exposure apparatus and exposure method - Google Patents

Abstract

A direct line production rate of a substrate production line is improved.
SOLUTION: The arrangement position is corrected before loading into the exposure device 16 so that the positional relationship with the exposure device 16 becomes a positional relationship suitable for exposure with respect to a substrate P loaded next time. A correction amount before loading (ΔX _k , ΔY _k , Δθ _k ) is calculated for each substrate P loaded (136), and at least one calculated correction amount (ΔX _k , ΔY _k , Δθ _k ) before loading is calculated. Based on the above, the positional relationship between the exposure device 16 and the substrate P that is transferred into the exposure device 16 after the calculated substrate correction amount (ΔX _k , ΔY _k , Δθ _k ) is transferred into the exposure device 16. Correct before (106).
[Selection] Figure 7

Description

  The present invention relates to an exposure apparatus and an exposure method.

  Conventionally, a laser exposure apparatus is known as an image forming apparatus for forming a wiring pattern on a printed wiring board or the like. This laser exposure apparatus includes a stage on which a printed wiring board to be subjected to image exposure based on exposure data (image information) is placed, and before each printed wiring board is carried into the exposure device. In addition, each printed wiring board is arranged at a predetermined initial position on the stage, and the stage is moved along a predetermined conveyance path.

  In this laser exposure apparatus, the printed wiring board is placed on the upper surface of the stage, and is sucked and held on the stage by sucking air from a large number of holes provided on the upper surface of the stage. In a state where the printed wiring board is attracted and held on the stage, the stage is transported in the sub-scanning direction at a predetermined speed, and at a predetermined measurement position, an alignment hole (mark or An alignment mark) is imaged by a CCD camera or the like. Then, the alignment processing for the image information is executed by coordinate-transforming the drawing target in the drawing coordinate system in accordance with the position of the printed wiring board obtained from the captured image.

  A photosensitive coating film (photosensitive film) formed on the upper surface of the printed wiring board on the stage is scanned and exposed by a laser beam modulated based on image information at a predetermined exposure position after execution of the alignment process. . Thereby, an image latent image based on the image information is formed in a predetermined drawing area on the printed wiring board.

  The printed wiring board on which the image is formed is taken out from the stage after the stage returns to the initial position. The stage from which the printed wiring board has been removed is conveyed to a position where the next printed wiring board is exposed.

  At this time, if the mark position for detecting the exposure position on the substrate is deviated from the assumed position instructed to the apparatus, the mark is not recognized correctly, and the printed wiring board is lined out due to mark detection failure. For this reason, the direct rate of the production line (that is, the ratio of the number of substrates subjected to exposure processing in the shortest transport path without being lined out with respect to the number of all substrates subjected to exposure processing) deteriorates.

On the other hand, by switching the camera magnification or the camera itself, shooting at a low magnification for the first time and shooting at a high magnification for the second time, the amount of mark deviation is detected and the correction amount is calculated. A configuration has been proposed in which the detection means is moved by reflecting the movement amount designated by the next detection means (see, for example, Patent Document 1).
JP 2004-85664 A

  However, in the exposure apparatus described in Patent Document 1, when all the marks cannot be detected by the first low-magnification shooting, the printed wiring board is lined out due to a mark detection failure. It is conceivable that the straight line rate of this will deteriorate.

  In particular, if a plurality of substrates are loaded one by one from the stacked state and there are obstacles in the loading path, the positions of all the substrates will be shifted in the same way due to contact with the obstacles. As a result, the mark detection failure occurs on all the substrates, and the printed wiring board is lined out.

  In addition, when marks on each printed wiring board are formed for each same lot, the marks on each printed wiring board in the same lot are often formed at substantially the same position. If the position is shifted from the regular position, the mark positions of most printed wiring boards in the same lot are displaced from the regular position. In such a case, there is a problem that most printed wiring boards are lined out, and the orthogonality of the production line is significantly deteriorated. For example, in the mark formation process of a printed wiring board, as shown in FIG. 3, a predetermined number of printed wiring boards are penetrated by a drill in a state where a predetermined number of printed wiring boards are stacked, so that a predetermined area is formed in each of a plurality of reference positions on each board. A mark may be formed. In such a case, since marks are formed at substantially the same position in each printed wiring board, as described above, when the position of the formed mark is shifted from the normal position in the first place, The mark positions of most printed wiring boards in the same lot are shifted from the normal positions. When each printed wiring board on which the mark is formed in this way is carried in, there is a problem that the printed wiring board is frequently lined out and the direct rate of the production line is significantly deteriorated.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to provide an exposure apparatus and an exposure method that can improve the direct rate of the substrate production line.

  In order to achieve the above object, an exposure apparatus according to the present invention includes a photosensitive layer formed on a substrate having a predetermined area formed at each of a plurality of reference positions, and the substrate being loaded one by one. Based on the detection result of the detection means, exposure means for exposing the exposure means, detection means arranged in advance so as to detect a mark formed on the substrate, and a positional relationship with the exposure means being fixed. Calculating means for calculating a correction amount for correcting the positional relationship suitable for exposure when the positional relationship between the exposed substrate and the exposure means is not suitable for exposure, and among the substrates carried into the exposure means, The positional relationship between the exposure unit and the substrate to be carried in next time on the basis of each correction amount calculated by the calculation unit for each substrate whose positional relationship with the exposure unit is not suitable for exposure. But Correction amount calculation means for calculating a correction amount before loading for correcting the arrangement position before loading into the exposure unit so as to obtain a positional relationship suitable for light, and the correction amount Based on at least one pre-carrying correction amount calculated by the calculation unit, the positional relationship between the substrate and the exposure unit carried into the exposure unit after the substrate for which the pre-carrying correction amount has been calculated is transferred to the exposure unit. And correction means for correcting before carrying in.

  According to the exposure apparatus of the present invention, the arrangement position is corrected before loading into the exposure unit so that the positional relationship with the exposure unit becomes a positional relationship suitable for exposure with respect to the substrate loaded next time. A pre-carrying correction amount is calculated for each substrate that has been carried in, and based on the calculated at least one pre-carrying correction amount, it is carried into the exposure means after the substrate for which the pre-carrying correction amount has been computed. The positional relationship between the substrate to be exposed and the exposure means is corrected before being carried into the exposure means. As a result, the positional relationship between the substrate and the exposure unit to be carried into the exposure unit after the next time is corrected so that the positional relationship is suitable for exposure before being carried into the exposure unit. Occurrence can be prevented, and as a result, the straightness rate of the substrate production line can be improved.

  The correction means uses the correction amount before loading calculated by the correction amount calculation means for the substrate loaded into the exposure means one time before the substrate loaded into the exposure means at this time, You may make it correct | amend the positional relationship of the board | substrate currently carried in to an exposure means, and the said exposure means, before carrying in to the said exposure means.

  In addition, the correction means includes a plurality of correction amounts before loading calculated by the correction amount calculation means for each of the plurality of substrates carried into the exposure means prior to the substrate carried into the exposure means at this time. Among them, the average value of the correction amount before carrying in a predetermined number or less than the predetermined number is used to correct the positional relationship between the substrate loaded in the exposure unit and the exposure unit before carrying in the exposure unit. You may make it do.

  In addition, the correction means includes a plurality of correction amounts before loading calculated by the correction amount calculation means for each of the plurality of substrates carried into the exposure means prior to the substrate carried into the exposure means at this time. The positional relationship between the exposure unit and the substrate that is currently loaded into the exposure unit is corrected before being carried into the exposure unit by using the median correction amount before loading of a predetermined number or less than the predetermined number. You may make it do.

  In order to achieve the above object, the exposure method of the present invention is formed on a substrate in which a photosensitive layer is formed, a mark of a predetermined region is formed at each of a plurality of reference positions, and one by one is carried in. The detected mark is detected by a detection means arranged in advance with a positional relationship with respect to the exposure means for exposing the photosensitive layer, and based on the detection result of the detection means, the loaded substrate and the exposure means When the positional relationship is not suitable for exposure, a correction amount for correcting the positional relationship suitable for exposure is calculated, and the positional relationship with the exposure unit among the substrates carried into the exposure unit is suitable for exposure. Based on the respective correction amounts calculated by the calculation means for each of the non-existing substrates, the positional relationship with the exposure means becomes a positional relationship suitable for exposure with respect to the substrate to be carried in next time or later. , A pre-carrying correction amount for correcting the arrangement position before carrying into the exposure means is calculated for each substrate carried in, and based on the calculated at least one pre-carrying correction amount, the pre-carrying correction amount The positional relationship between the substrate carried into the exposure unit and the exposure unit after the substrate having been calculated is corrected before being carried into the exposure unit.

  According to the exposure method of the present invention, the arrangement position is corrected before loading into the exposure unit so that the positional relationship with the exposure unit becomes a positional relationship suitable for exposure with respect to the substrate loaded next time or later. A pre-carrying correction amount is calculated for each substrate that has been carried in, and based on the calculated at least one pre-carrying correction amount, it is carried into the exposure means after the substrate for which the pre-carrying correction amount has been computed. The positional relationship between the substrate to be exposed and the exposure means is corrected before being carried into the exposure means. As a result, the positional relationship between the substrate and the exposure unit to be carried into the exposure unit after the next time is corrected so that the positional relationship is suitable for exposure before being carried into the exposure unit. Occurrence can be prevented, and as a result, the straightness rate of the substrate production line can be improved.

  As described above, according to the present invention, the effect that the direct rate of the production line of the substrate can be improved can be obtained.

  Hereinafter, an embodiment in which the present invention is applied to an exposure apparatus will be described with reference to the drawings.

  As shown in FIGS. 1 and 2, the exposure apparatus 10 includes a controller 11, a transport system 12, and an exposure system 14.

  The transport system 12 includes an IN conveyor (loading conveyor) 20A to which a substrate P, which is a workpiece to be exposed, is supplied, a detection sensor 19 disposed at a position where the substrate P on the IN conveyor 20A can be detected, and the substrate P as an exposure system 14. And an AC (Auto Carrier) hand 30 to be carried in, and an OUT conveyor (unloading conveyor) 20B from which the exposed substrate P is discharged. For example, an optical sensor is used as the detection sensor 19. In the present embodiment, in the mark forming process of the substrate P, for example, as shown in FIG. 3, a predetermined number of substrates P (N in the example of FIG. 3) are stacked by the drill 99 in a stacked state. Thus, a mark in a predetermined area is formed at each of the plurality of reference positions on each substrate P. Further, when the detection sensor 19 detects the substrate P, the detection sensor 19 outputs an ON state detection signal indicating that the substrate P has been detected. When the detection sensor 19 has not detected the substrate P, the detection sensor 19 outputs an OFF state detection signal. Output. The AC hand 30 corresponds to correction means.

  The exposure system 14 includes an exposure stage 40 to which the substrates P conveyed one by one from the IN conveyor 20A by the AC hand 30 are fixed, an exposure device 16 that performs scanning exposure on the substrate P on the exposure stage 40, and a rotary stage mechanism. 41 is provided. As shown in FIG. 1B, a photosensitive layer is formed on the substrate P in the present embodiment, and a circular mark 42a to a predetermined size is formed on each of a plurality of reference positions on the upper surface thereof. 42d is formed. In the present embodiment, for example, the substrate P is held by the AC hand 30 and placed on the exposure stage 40 and then fixed. The exposure stage 40 is provided with a driving device (not shown), and the driving stage moves the exposure stage 40 on the rail 15 in the scanning direction (Y direction in the figure), and a camera 18a fixed to the exposure unit 16 is provided. The position of the substrate P is detected by photographing the mark 42 provided on the substrate P in 18b. The interval between the mark 42a and the mark 42c (interval in the Y direction in the figure) and the interval between the mark 42b and the mark 42d is L1, and the interval between the mark 42a and the mark 42b (interval in the sub-scanning direction (X direction in the figure)). The interval between the mark 42c and the mark 42d is L2.

  The exposure machine 16 determines in advance the exposure head 13 so as to detect the exposure head 13 as an exposure means for exposing the photosensitive layer of the substrate P based on the exposure data and the mark 42 formed on the substrate P. Cameras 18a and 18b are provided as detection means that are fixedly arranged at the positions. Thereby, the position of the substrate P fixed on the exposure stage 40 in the X direction and the Y direction, and the tilt with respect to the X direction or the Y direction can be detected. The rotary stage mechanism 41 rotates the exposure stage 40.

  According to the obtained position data of the substrate P, the exposure head 13 performs scanning exposure on the substrate P after correcting at least one of the position and the inclination of the substrate P on the exposure stage 40 as necessary, as will be described later. The substrate P after the scanning exposure is gripped by the AC hand 30 and discharged to the OUT conveyor 20B.

  The controller 11 is connected to the exposure head 13, cameras 18 a and 18 b, detection sensor 19, IN conveyor 20 </ b> A, OUT conveyor 20, AC hand 30, exposure stage 40 drive device, and rotary stage mechanism 41. The controller 11 controls each of the exposure head 13, the cameras 18a and 18b, the detection sensor 19, the IN conveyor 20A, the OUT conveyor 20, the AC hand 30, the exposure stage 40 drive device, and the rotary stage mechanism 41. The controller 11 includes an I / O (input / output) port 11a, a ROM (Read Only Memory) 11b, an HDD (Hard Disk Drive) 11c, a CPU (Central Processing Unit) 11d, a RAM (Random Access Memory) 11e, and these I / Os. The bus 11f includes an O port 11a, a ROM 11b, an HDD 11c, a CPU 11d, and a RAM 11e.

  A basic program such as an OS is stored in the ROM 11b as a storage medium.

  The HDD 11c as a storage medium stores a program for executing a processing routine for exposure processing, which will be described in detail below, and a program for executing a processing routine for substrate placement position correction processing.

  The HDD 11c stores an initial arrangement position (initial position) (Xs, θs) where the substrate P is first arranged by the AC hand 30.

  The HDD 11c stores image data of the mark detection template image 50 as shown in FIG. The mark detection template image 50 is used when the mark 42 is detected from an image photographed by the camera 18 in image processing by the template matching method.

  Further, in the HDD 11c, as shown in FIG. 5, the data indicating the positions of the reference center points a to d and the positions of the reference lines e to k (for example, the positions of the end points of the reference lines) are represented. Each data is registered. For example, by using image data obtained by photographing each of the reference marks 42a to 42d, whose positions are accurately formed on the substrate P, with at least one of the camera 18a and the camera 18b in advance, the mark Data indicating the position of the reference center point a can be obtained by determining the positions of the centers of 42a and 42c and setting this position as the reference center point a. Moreover, each data representing the position of each of the reference center points b to e can be obtained by the same method. Further, for example, using image data obtained by photographing each of the reference marks 42a to 42d whose positions are accurately formed on the substrate P in advance with at least one of the cameras 18a and 18b, By calculating the position of the end point of the straight line connecting the center of gravity of the mark 42a and the center of gravity of the mark 42c and setting the position of the end point of the straight line as the position of the reference line e, data representing the position of the reference line e can be determined. . Moreover, each data showing the position of each of the reference lines f to k can be obtained by the same method.

  Further, the HDD 11c stores a carry-in correction amount registration table whose details will be described below.

  The CPU 11d reads out and executes the program from the ROM 11b and the HDD 11c, and various data are temporarily stored in the RAM 11e.

  Next, with reference to FIGS. 6A and 6B, the position of the detectable mark 42 with respect to the field of view (imaging area) 54 of the cameras 18a and 18b of the exposure device 16 according to the present embodiment, and detection. The position of the mark 42 that cannot be described will be described.

  In the present embodiment, as will be described later, an image representing the mark 42 is detected by image processing using a template matching method from images captured by the cameras 18a and 18b. In this image processing, as shown in FIG. 6A, the area of one mark 42 in the imaging area 54 is an area larger than a predetermined area (minimum area), for example, 50 of the total area of the mark 42. If a region having an area of% or more is photographed, it is determined that the mark 42 has been detected. On the other hand, as shown in FIG. 6B, when the area of the mark 42 in the imaging region 54 is not larger than the minimum area (in the example of FIG. 6B, the mark 42 in the imaging region 54 When the area of the area is 25% of the total area of the mark 42), it is determined that the mark 42 is not detected.

  Next, a processing routine of exposure processing executed by the CPU 11d of the controller 11 will be described with reference to FIG. In the present embodiment, an instruction input device such as a keyboard (not shown) is connected to the controller 11 in this embodiment, and exposure processing is performed when an instruction to perform exposure processing is input from this instruction input device, for example, by an operator or the like. Executed.

  First, in step 100, initialization is performed by setting the value of the variable K to 0. Note that the value of the variable K represents the order of loading into the exposure device 16, that is, the number of substrates P to be loaded.

  In the next step 102, it is determined whether or not the substrate P to be exposed exists by determining whether or not the detection signal from the detection sensor 19 is in the ON state.

  If it is determined in step 102 that the detection signal from the detection sensor 19 is in the ON state, the value of the variable N is set to 0 in the next step 104.

  In the next step 106, a substrate arrangement position correction process is executed. Here, the details of the processing routine of the substrate arrangement position correction processing in step 106 will be described with reference to FIG.

  First, in step 200, the value of the variable K is incremented by 1, and in the next step 202, it is determined whether or not the value of the variable K is 1. Thereby, it is possible to determine whether or not the substrate P that is carried into the exposure device 16 this time is the first substrate P that is carried in (first substrate P).

  If it is determined in step 202 that the value of the variable K is 1, it is determined that the current substrate P is the substrate P that is first loaded into the exposure device 16, and the process proceeds to the next step 204. In the next step 204, the initial position (Xs, θs) stored in the HDD 11c is read to obtain the initial position (Xs, θs).

  In the next step 206, the AC hand 30 is controlled so that the substrate P is placed on the exposure stage 40 so that the position in the X direction becomes Xs acquired in step 204, and the vertical direction of the substrate P (see FIG. The rotary stage mechanism 41 is controlled so as to rotate the exposure stage 40 on which the substrate P is arranged so that the angle from the normal direction about the center Z direction) is θs. Thereby, the board | substrate P is arrange | positioned in the initial position (Xs, (theta) s). Then, the substrate placement position correction process is terminated.

  On the other hand, if it is determined in step 202 that the value of the variable K is not 1, the current substrate P is determined to be the substrate P to be carried into the exposure device 16 for the second time or later, and the next step 208 is performed. Proceed to In step 208, it is determined whether or not the value of the variable K is greater than a predetermined value L, for example, 6. Here, the value of the predetermined value L represents the maximum number of correction amounts when the average of the correction amounts is calculated later, and the case where the value of the predetermined value L is 6 will be described below. Specifically, a moving average with the number L is calculated.

If it is determined in step 208 that the value of the variable K is a predetermined value L, for example, 6 or less, the process proceeds to the next step 210. In step 210, all pre-carrying correction amounts (from the first substrate P to the (K-1) th substrate P) registered in the pre-carrying correction amount history table 70 (see FIG. 13), which will be described in detail below. The correction amount before carry-in) is read from the HDD 11c. In the correction amount history table 70 before loading, the loading order K and the correction amounts before loading (ΔX _k , ΔY _k , Δθ _k ) are associated and registered for each substrate P loaded. Yes. At the time of reading in step 210, the pre-carrying correction amount history table 70 has a pre-carrying correction amount (ΔX, ΔY, Δθ) corresponding to each of the first to (K-1) th substrates P. ) Is registered.

In the next step 212, as shown in the following formulas (1), (2), and (3), all of the read pre-load correction amounts ((K−1) pre-load correction amounts (ΔX) , ΔY, Δθ)) are averaged ΔX _k , ΔY _k and Δθ _k .

In the next step 214, X-direction of the position before loading to the exposure unit 16 of the K-th of the substrate P, the initial position Xs corrected by the average value [Delta] X _k calculated in step 212 the position (Xs + [Delta] X _k And the AC hand 30 is controlled so that the substrate P is transported from the IN conveyor 20A and placed on the exposure stage 40, and before the K-th substrate P is carried into the exposure device 16. So that the angle from the normal direction of the rotation direction about the vertical direction (Z direction in the figure) becomes an angle (θs + Δθ _k ) _obtained by correcting the initial position θs by Δθ _k calculated in step 212 above. The rotary stage mechanism 41 is controlled to rotate the exposure stage 40 on which P is arranged. As a result, the substrate P is disposed at the corrected position (corrected position) ((Xs + ΔX _k ), (θs + Δθ _k )). Then, the substrate placement position correction process is terminated.

On the other hand, if it is determined in step 208 that the value of the variable K is greater than a predetermined value L, for example, 6, the process proceeds to the next step 216. In step 216, the correction amount history table 70 before loading is read from the HDD 11c, and the correction amount before loading (ΔX _k−L , ΔY _k−L , Δθ _k−L ) of the (K−L) th substrate P is ( K-1) L (before the carry-in) correction amounts (ΔX _k−1 , ΔY _k−1 , Δθ _k−1 ) correction amounts before loading of the substrate P up to the first substrate, for example, six correction amounts before loading get. At the time of reading in step 216, the pre-carrying correction amount history table 70 has a pre-carrying correction amount corresponding to each of the first to (K-1) th substrates P in the same manner as described above. (ΔX, ΔY, Δθ) are registered.

In the next step 218, the average values ΔX _k , Δθ _k , and ΔY _k of the six read-in correction amounts before loading are calculated as shown in the following equations (4), (5), and (6). Calculate.

Then, the process proceeds to step 214. Thus, the substrate P is disposed at the corrected position ((Xs + ΔX _k ), (θs + Δθ _k )). Then, the substrate placement position correction process is terminated.

  As described above, a plurality of pre-carrying correction amounts for each of the plurality of substrates P carried into the exposure device 16 before the substrate P that is carried into the exposure device 16 by the substrate placement position correction process. Among these, the position of the substrate P and the exposure device 16 that are currently loaded into the exposure device 16 using the average value of the correction amount before loading of a predetermined number or less than a predetermined number (L or less than L). The relationship can be corrected before being brought into the exposure unit 16. As described above, the average value of the correction amount before carrying in a predetermined number or less than a predetermined number (L or less than L) is calculated between the substrate P and the exposure device 16 that are currently loaded into the exposure device 16. Correcting the positional relationship before carrying it into the exposure device 16 is particularly a state where a predetermined number of substrates P (N in the example of FIG. 14A) are stacked as shown in FIG. When a mark 42 in a predetermined area is formed at each of a plurality of reference positions of each substrate P by penetrating with a drill 99, the cutting edge of the drill 99 escapes (tilts from the vertical direction), and each of the plurality of substrates P This is effective when the position of the mark from the edge of the lens gradually shifts and the alignment position changes.

In at least one of step 212 and step 218, ΔX _k , Δθ _k , and ΔY _k are calculated as shown in the following equations (7), (8), and (9). Also good.

  As a result, the substrate P to be carried into the exposure device 16 this time using the pre-load correction amount calculated for the substrate carried into the exposure device 16 immediately before the substrate P carried into the exposure device 16 this time. And the exposure unit 16 can be corrected before being carried into the exposure unit 16. As described above, the substrate loaded into the exposure device 16 this time using the correction amount before loading calculated for the substrate loaded into the exposure device 16 immediately before the substrate P loaded into the exposure device 16 this time. The correction of the positional relationship between P and the exposure device 16 before carrying it into the exposure device 16 is particularly performed by stacking a predetermined number of substrates P (N in the example of FIG. 3) as shown in FIG. In addition, it is effective when a mark 42 in a predetermined region is formed at each of a plurality of reference positions of each substrate P by penetrating perpendicularly to the surface with a drill 99 with both ends of each substrate P aligned.

  In the next step 108, the exposure stage 40 moves to the upstream side (exposure unit 16 side) so that the mark 42a can be photographed by the camera 18a of the exposure unit 16 and the mark 42b can be photographed by the camera 18b. 40 drive devices are controlled. As a result, the substrate P moves together with the exposure stage 40 to the upstream side, and the substrates P are carried into the exposure unit 16 one by one.

  In the next step 110, as shown in FIG. 9, the camera 18a is controlled so as to photograph the predetermined area A1 on the upper surface of the substrate P that has been moved, and the camera 18b is controlled so as to photograph the predetermined area A2. . Here, when the mark 42a is accurately formed on the upper surface of the substrate P, the predetermined area A1 is an area including the entire mark 42a. Similarly, the predetermined area A2 is an area that includes the entire mark 42b when the mark 42b is accurately formed on the upper surface of the substrate P. These predetermined areas A1 and A2 can be obtained in advance.

  In the next step 112, the exposure stage 40 is further moved to the upstream side (the exposure device 16 side) by L1 so that the mark 42c can be photographed by the camera 18a of the exposure device 16 and the mark 42d can be photographed by the camera 18b. In addition, the driving device of the exposure stage 40 is controlled. As a result, the substrate P moves together with the exposure stage 40 further to the upstream side by L1.

  In the next step 114, as shown in FIG. 9, the camera 18a is controlled to photograph the predetermined area A3 on the upper surface of the moved substrate P, and the camera 18b is controlled to photograph the predetermined area A4. . Here, when the mark 42c is accurately formed on the upper surface of the substrate P, the predetermined area A3 is an area that includes the entire mark 42c. Similarly, the predetermined area A4 is an area including the entire mark 42d when the mark 42d is accurately formed on the upper surface of the substrate P. These predetermined areas A3 and A4 can be obtained in advance.

  In the next step 116, the image data of the images photographed by the cameras 18a and 18b in the above steps 110 and 114 are captured.

  In the next step 118, the image data of the mark detection template image 50 stored in the HDD 11c is read from the HDD 11c, and image processing by the template matching method using the image data of the mark detection template image 50 is performed. All the marks 42a to 42d are detected from the images photographed by 18a and 18b. Specifically, as described above, for each of the marks 42a to 42d, as a result of this image processing, as shown in FIG. If a region having a minimum area or more, for example, a region having an area of 50% or more of the entire area of the mark 42 is photographed, it is determined that the mark 42 has been detected. On the other hand, as shown in FIG. 6B, when the area of the mark 42 in the imaging region 54 is not larger than the minimum area (in the example of FIG. 6B, the mark 42 in the imaging region 54 When the area of the area is 25% of the entire area of the mark 42), it is determined that the mark 42 is not detected. Step 118 corresponds to detection means.

  In the next step 120, it is determined whether or not all the marks 42a to 42d have been detected by determining whether or not all the marks 42a to 42d have been detected in step 118. .

  If it is determined in step 120 that all marks have not been detected, the process proceeds to the next step 122. In step 122, it is determined whether or not two or more marks 42 have been detected by determining whether or not two or more marks 42 have been detected in step 118.

  If it is determined in step 122 that two or more marks 42 have not been detected, it is determined that one mark 42 has been detected or that none of the marks 42 have been detected, and the position of the substrate P Since it is difficult to correct the error, etc., error processing is performed in the next step 124. In this error processing, for example, an alarm device (not shown) is controlled so as to notify an alarm, and the exposure stage 40, the AC hand 30, and the carry-out stage 20B are controlled so as to eject the substrate P. Thereby, an alarm is notified and the substrate P is lined out. Then, the exposure process ends.

  On the other hand, if it is determined in step 122 that two or more marks have been detected, it is determined that it is easy to correct the position of the substrate P, and the process proceeds to the next step 126.

  In step 126, the value of variable N is incremented by 1. In the next step 128, it is determined whether or not the value of variable N is greater than a predetermined value, for example, 1. In the present embodiment, the maximum value of the number of times that the retry process described in detail below can be performed on one substrate P is set as the predetermined value.

  If it is determined in step 128 that it is greater than a predetermined value, for example, 1, it is determined that the number of retry processes has reached the maximum value, and error processing is performed in the next step 130. In this error processing, for example, an alarm device (not shown) is controlled so as to notify an alarm, and the exposure stage 40, the AC hand 30, and the carry-out stage 20B are controlled so as to eject the substrate P. Thereby, an alarm is notified and the substrate P is lined out. Then, the exposure process ends.

  On the other hand, if it is determined in step 128 that the value is a predetermined value, for example, 1 or less, it is determined that the number of retry processes has not reached the maximum value, and the process proceeds to the next step 132.

  In step 132, using the reference center point corresponding to the mark 42 detected in step 118 and the corresponding reference line, the shift amount of the substrate P in the X direction from the normal position (transfer direction shift amount by the transport system 12). The amount of displacement of the substrate P in the Y direction from the normal position (the amount of displacement in the movement direction during exposure by the exposure system 14), and the direction of rotation about the vertical direction (Z direction in the figure) of the substrate P from the normal angle. The amount of deviation of the angle (the amount of deviation of the rotation about the Z axis) is calculated as each correction amount (the amount of correction in the X direction, the amount of correction in the Y direction, and the amount of correction of the angle in the rotation direction about the Z axis).

  For example, as shown in FIG. 10A, when the mark 42a and the mark 42c are detected and the mark 42b and the mark 42d are not detected (in the example of FIG. 10A, the black mark 42 can be detected). In other words, the white mark 42 cannot be detected), the data representing the position of the corresponding reference center point a and the data representing the position of the corresponding reference line f are read from the HDD 11c. . Further, the center position of the detected mark 42a and the mark 42c is obtained using the image data captured in the step 116, and the detected mark center point 56, which is the center point of the detected mark, is obtained. As a result, data representing the position of the detection mark center point 56 is obtained. Also, the position of the end point of the straight line connecting the center of gravity of the mark 42a and the center of gravity of the mark 42c is obtained using the image data captured in step 116, and the position of the end point of the straight line is determined as the detected mark and mark. The data representing the position of the detection mark line 58 is obtained by setting the position of the detection mark line 58 that is a straight line connecting the two. Based on the read data representing the position of the reference center point a and the data representing the position of the reference line f, the data representing the position of the detection mark center point 56, and the data representing the position of the detection mark line 58, Using the technology, the amount of deviation of the substrate P in the X direction, the amount of deviation of the substrate P in the Y direction, and the amount of deviation of the angle in the rotation direction about the Z direction are expressed as correction amounts (correction amounts in the X direction, The correction amount in the Y direction and the correction amount in the rotation direction around the Z axis) are calculated. Thereby, based on the detected position of the mark 42, a correction amount for correcting the positional relationship between the substrate P and the camera 18 so that a region having a minimum area or more is detected for each of all the marks 42a to 42d. Is calculated. That is, based on the detection result of the mark 42, when the positional relationship between the substrate P and the exposure device 16 is not suitable for exposure, a correction amount for correcting the positional relationship suitable for exposure is calculated.

  In the next step 134, retry processing is executed. Details of the retry processing routine in step 134 will be described with reference to FIG.

  First, in step 300, the driving device for the exposure stage 40 is controlled so as to move downstream. As a result, the substrate P moves together with the exposure stage 40 to the downstream side.

  In the next step 302, the position of the substrate P on the exposure stage 40 is moved in the X direction according to the correction amount in the X direction calculated in step 132 so that the position of the substrate P becomes a normal position. In this manner, the AC hand 30 is controlled, and the rotation stage mechanism 41 is controlled so as to rotate the substrate P around the Z axis according to the correction amount of the rotation direction angle around the Z axis calculated in step 132. . As a result, the position of the substrate P in the X direction and the angle in the rotational direction around the Z axis are corrected based on the correction amount. That is, by correcting the posture of the substrate P based on the correction amount, the positional relationship between the substrate P and the camera 18 is corrected so that all the marks 42a to 42d are detected. In this embodiment, since the positional relationship between the camera 18 and the exposure head 13 is fixed in advance, the positional relationship between the substrate P and the exposure unit 16 is corrected by correcting the positional relationship between the substrate P and the camera 18. The relationship can be corrected.

  In the next step 304, the driving device of the exposure stage 40 is controlled so that the exposure stage 40 is moved upstream so that the mark 42a can be photographed by the camera 18a of the exposure device 16 and the mark 42b can be photographed by the camera 18b. Then, with respect to the moved substrate P, the shooting timing of the mark 42 by the camera 18 is changed (advanced / delayed) according to the correction amount in the Y direction calculated in step 132, and the mark 42a is shot. Thus, the camera 18b is controlled so that the mark 42b is photographed.

  In the next step 306, the exposure stage 40 is further moved to the upstream side (the exposure device 16 side) by L1 so that the mark 42c can be photographed by the camera 18a of the exposure device 16 and the mark 42d can be photographed by the camera 18b. The drive device of the exposure stage 40 is controlled. Thereby, the substrate P together with the exposure stage 40 moves L1 further upstream.

  In the next step 308, the camera 18a is controlled so as to photograph the mark 42c and the camera 18b is controlled so as to photograph the mark 42d with respect to the moved substrate P.

  Through the processing in the above steps 300 to 308, for example, as shown in FIG. 10B, an image including all the marks 42a to 42d can be taken. Then, the retry process is terminated, and the process proceeds to step 116. If the process proceeds to step 116 after executing the retry process, the image data of the images taken by the cameras 18a and 18b in the retry process is captured in step 116. Then, the subsequent processing described above is performed again.

  On the other hand, if it is determined in step 120 that all marks have been detected, the process proceeds to the next step 136. In step 136, a correction amount calculation registration process before carry-in is executed. Here, the details of the processing routine of the correction amount calculation registration processing before carry-in in step 136 will be described with reference to FIG.

  First, in step 400, it is determined whether or not the value of the variable K is greater than one.

  If it is determined in step 400 that the value of the variable K is 1 (not greater than 1), the substrate P that has been carried into the exposure device 16 this time is the substrate P that was first carried into the exposure device 16. It is determined that there is, and the process proceeds to the next step 402.

  In step 402, it is determined whether or not there is a case where it is determined in step 120 that all the marks have not been detected for the substrate P loaded this time (that is, the first substrate P).

  If it is determined in step 402 that there is a case where it is determined in step 120 that all the marks have not been detected for the substrate P loaded this time (that is, the first substrate P), Proceed to the next step 404.

In step 404, the correction amount history table 70 as shown in FIG. 13 stored in the HDD 11c is calculated in step 132 for each correction amount calculated this time, that is, the first substrate P. In addition, each correction amount (correction amount in the X direction (x _{k (= 1)} ), correction amount in the Y direction (y _{k (= 1)} ), correction amount of the angle in the rotation direction around the Z axis (θ _{k (= 1) In} order to correct the position of the (K + 1) th substrate P to be carried into the exposure unit 16 (K + 1 (in this case, K + 1 = 2)) before being carried into the exposure unit 16. Are calculated as correction amounts before loading (ΔX _{k (= 1)} , ΔY _{k (= 1)} , Δθ _{k (= 1)} ), and the calculated correction amounts before loading (ΔX ₁ , ΔY ₁ , Δθ _1). ) Is registered in association with the value of the variable K (in this case, K = 1).

Here, the correction amount history table 70 before carry-in will be described. In the pre-carrying correction amount history table 70, a record 70a is registered for each substrate P carried into the exposure device 16. The record 70a includes a field 70b in which a value of a variable K indicating the number (ie, what number) of substrates P carried into the exposure device 16 is registered, and a substrate correction amount (ΔX _k before loading). , ΔY _k , Δθ _k ) are registered. As a result, one record 70a is added to the correction amount history table 70 before carry-in, and the value of the variable K (K = 1 in this case) is registered in the field 70b of the added record 70a. As described above, by registering the pre-delivery correction amount (ΔX _{k (= 1)} , ΔY _{k (= 1)} , Δθ _{k (= 1)} ) in the field 70c corresponding to the field 70b in which the value of is registered. Then, the pre-load correction amounts (ΔX _{k (= 1)} , ΔY _{k (= 1)} , Δθ _{k (= 1)} ) calculated this time are sent to the exposure unit 16 (K + 1 (in this case, K + 1 = 2)). As a substrate correction amount (X _k , Y _k , θ _k ) before loading, which is a correction amount for correcting the position of the (K + 1) th substrate P to be loaded before it is loaded into the exposure device 16, a variable Can be registered in association with the value of K (in this case, K = 1) And the correction amount calculation registration process before carrying-in is complete | finished.

  On the other hand, when it is determined in step 402 that all the marks have not been detected in step 120 with respect to the substrate P loaded this time (that is, the first substrate P). Advances to the next step 406.

In step 406, one record 70a is added to the pre-import correction amount history table 70 stored in the HDD 11c, and the value of the variable K (K = 1 in this case) is added to the field 70b of the added record 70a. At the same time as registration, the value (0, 0, 0) is (K + 1 (in this case, K + 1 = 2))-th carried into the exposure unit 16 and the (K + 1) th substrate P is loaded into the exposure unit 16. Is calculated as a pre-loading correction amount (ΔX _{k (= 1)} , ΔY _{k (= 1)} , Δθ _{k (= 1)} ), which is a correction amount for correcting the position before the correction, and the calculated pre-loading correction The quantities (ΔX ₁ , ΔY ₁ , Δθ ₁ ) are registered in the field 70c corresponding to the field 70b in which the value of the variable K is registered. And the correction amount calculation registration process before carrying-in is complete | finished.

  On the other hand, if it is determined in step 400 that the value of the variable K is greater than 1, the substrate P that is carried into the exposure unit 16 this time is the second and subsequent sheets that are carried into the exposure unit 16 after the second. It is determined that the substrate P, and the process proceeds to the next step 408.

  In step 408, it is determined whether or not there is a case where it is determined in step 120 that all the marks have not been detected for the substrate P loaded this time (that is, the Kth substrate P).

  If it is determined in step 408 that there is a case where it is determined in step 120 that all the marks have not been detected for the substrate P loaded this time (that is, the Kth substrate P), Proceed to the next step 410.

In step 410, the correction amount history table 70 before loading stored in the HDD 11c is read, and each correction amount calculated this time, that is, each correction amount calculated in step 132 for the Kth substrate P is calculated. (X-direction correction amount (x _k ), Y-direction correction amount (y _k ), rotation-direction angle correction amount (θ _k ) around the Z axis), and pre _- arrival correction amounts (ΔX _k−1 , ΔY _k−1 , Δθ _k−1 ) to correct the position of the (K + 1) -th substrate P loaded into the exposure device 16 before the (K + 1) -th substrate P is loaded into the exposure device 16. Is calculated as a correction amount before loading (ΔX _k , ΔY _k , Δθ _k ), and the calculated correction amount before loading (ΔX _k , ΔY _k , Δθ _k ) is associated with the value of the variable K and registered. To do. Specifically, one record 70a is added to the pre-import correction amount history table 70, the value of the variable K is registered in the field 70b of the added record 70a, and the field in which the value of the variable K is registered. The correction amount before loading (ΔX _k , ΔY _k , Δθ _k ) is registered in the field 70c corresponding to 70b. And the correction amount calculation registration process before carrying-in is complete | finished.

  On the other hand, when it is determined in step 408 that it is not determined in step 120 that all the marks have been detected for the substrate P loaded this time (that is, the Kth substrate P). Advances to the next Step 412.

In step 412, correction amounts before loading (ΔX _k−1 , ΔY _k−1 , Δθ _k− corresponding to the (K−1) th substrate P registered in the correction amount history table 70 before loading stored in the HDD 11c. ₁ ), and the correction amounts before loading (ΔX _k−1 , ΔY _k−1 , Δθ _k−1 ) corresponding to the (K−1) th substrate P are converted into the correction amounts before loading (X _k , Y _k , θ _k ), and the calculated pre-carrying correction amount (X _k , Y _k , θ _k ) is registered in association with the value of the variable K. Specifically, one record 70a is added to the pre-import correction amount history table 70, the value of the variable K is registered in the field 70b of the added record 70a, and the field in which the value of the variable K is registered. The correction amount before loading (ΔX _k , ΔY _k , Δθ _k ) is registered in the field 70c corresponding to 70b. And the correction amount calculation registration process before carrying-in is complete | finished.

As described above, according to the correction amount calculation / registration process before carry-in, each substrate P carried into the exposure device 16 has a positional relationship with the exposure device 16 that is not suitable for exposure. Based on the correction amount calculated in step 132 (correction amount in the X direction (x _k ), correction amount in the Y direction (y _k ), and correction amount in the rotational direction around the Z axis (θ _k )) Thereafter, the substrate P to be carried into the exposure device 16 is carried in to correct the arrangement position before carrying into the exposure device 16 so that the positional relationship with the exposure device 16 is suitable for exposure. The time correction amount is calculated for each substrate P that has been loaded, and is registered in the correction amount history table 70 before loading.

  In step 138, similarly to the processing in step 200, the drive device for the exposure stage 40 is controlled so that the exposure stage 40 moves downstream. As a result, the substrate P moves together with the exposure stage 40 to the downstream side.

In the next step 140, the driving device of the exposure stage 40 is controlled so that the exposure stage 40 moves upstream, and the correction amount in the Y direction is calculated for the Kth substrate P in step 132. In this case, the exposure timing is changed (advanced / delayed) in accordance with the correction amount in the Y direction with respect to the moved substrate P, and the exposure head 13 is adjusted so as to perform exposure based on the exposure data. If the correction amount in the Y direction is not calculated in step 132 for the Kth substrate P, the substrate P that has been moved is registered in the correction amount history table 70 before loading. depending on loading before correction amount [Delta] Y _k in the Y direction in which, by changing the exposure timing (advance / retard), controls the exposure head 13 to perform the exposure based on the exposure data. That is, the exposure head 13 is controlled so that the photosensitive layer of the substrate P is exposed at a predetermined timing. As a result, the photosensitive layer of the Kth substrate P is exposed.

  In the next step 142, the substrate P is arranged on the OUT conveyor 20B, and the AC hand 30 and the OUT conveyor 20B are controlled so that the arranged substrate P is carried out. As a result, the Kth substrate P is discharged. Then, the exposure process ends.

As described above, the exposure apparatus 10 according to the present embodiment has the substrate on which the photosensitive layer is formed and the marks 42a to 42d in the predetermined areas are formed at each of the plurality of reference positions, and each is loaded one by one. An exposure unit 16 as an exposure unit that exposes the P photosensitive layer, and a camera as a detection unit that is arranged with a positional relationship with respect to the exposure unit 16 fixed in advance so as to detect the marks 42a to 42d formed on the substrate P. 18a and 18b, and based on the detection result, when the positional relationship between the loaded substrate P and the exposure device 16 is not suitable for exposure, a correction amount for correcting the positional relationship suitable for exposure is calculated. Based on the correction amounts calculated in step 132 for each of the substrates P that are not suitable for exposure among the substrates P that are loaded into the exposure device 16, the substrate P is loaded next time. Substrate Respect, as the positional relationship between the exposure unit 16 is a position relation suitable for the exposure, before carrying for correcting the position in front loading into the exposure unit 16 correction amounts (ΔX _k, ΔY _k, Δθ _k ) is calculated for each loaded substrate P, and based on the calculated at least one pre-load correction amount (ΔX _k , ΔY _k , Δθ _k ), the pre-load correction amount (ΔX _k , ΔY _k , The positional relationship between the substrate P carried into the exposure device 16 after the substrate P for which Δθ _k ) has been calculated and the exposure device 16 is corrected before being carried into the exposure device 16.

According to the exposure apparatus 10 according to the present embodiment, loading into the exposure device 16 is performed so that the positional relationship between the exposure device 16 and the substrate P to be loaded next time becomes a positional relationship suitable for exposure. A pre-carrying correction amount (ΔX _k , ΔY _k , Δθ _k ) for correcting the arrangement position before is calculated for each loaded substrate P, and at least one calculated pre-carrying correction amount (ΔX _k , Based on ΔY _k , Δθ _k ), the positional relationship between the exposure device 16 and the substrate P that is carried into the exposure device 16 after the substrate P for which the correction amount (ΔX _k , ΔY _k , Δθ _k ) before carrying in is calculated. Corrections are made before being carried into the exposure unit 16. As a result, the positional relationship between the substrate P and the exposure device 16 to be carried into the exposure device 16 after the next time is corrected so as to be a positional relationship suitable for exposure before being loaded into the exposure device 16, so that the line It is possible to prevent the occurrence of frequent outs, and as a result, the direct rate of the production line for the substrate P can be improved.

In the process of step 212, ΔX _k , Δθ _k , and ΔY _k may be calculated as shown in the following equations (10), (11), and (12).

Similarly, in the process of step 218, ΔX _k , Δθ _k , and ΔY _k may be calculated as shown in the following equations (13), (14), and (15).

  As a result, for each of the plurality of substrates P carried into the exposure device 16 before the substrate P that is carried into the exposure device 16 this time, a predetermined number or less than a predetermined number of the plurality of correction amounts before loading. Using the median correction amount before loading (L or less than L), the positional relationship between the substrate P loaded into the exposure device 16 and the exposure device 16 is corrected before loading into the exposure device 16. can do. In this way, using the median correction amount before loading a predetermined number or less than a predetermined number (L or less than L), the substrate P and the exposure device 16 that are currently loaded into the exposure device 16 are used. Correcting the positional relationship before carrying it into the exposure device 16 is particularly a state where a predetermined number of substrates P (N in the example of FIG. 14B) are stacked as shown in FIG. In the case where all of the substrates P are not aligned, the drill 99 penetrates the upper surface of the substrate P vertically to form the marks 42 in a predetermined area at each of the plurality of reference positions of each substrate P. In addition, for example, it is effective when each substrate P is set with the right end reference when the mark is aligned as the left end reference but the mark is not aligned as the right end reference.

  In the present embodiment, the example in which the shape of the mark 42 is circular has been described. However, the shape of the mark formed on the substrate P may be any shape. For example, the shape of a mark can be defined by the amount of deviation of the substrate P in the X direction from the normal position, the amount of deviation of the substrate P in the Y direction from the normal position, and the vertical direction of the substrate P from the normal direction with only one mark. It is possible to calculate the shift amount of the angle in the rotation direction about the axis as each correction amount (correction amount in the X direction, correction amount in the Y direction, correction amount of the angle in the rotation direction around the Z axis). The mark may be in the shape of a mark. In this case, in the above exposure process, for example, the processes of step 128 and step 130 can be omitted.

  In the present embodiment, an example in which the correction in the Y direction is performed by changing the photographing timing of the mark 42 by the camera 18 according to the correction amount in the Y direction, and the exposure timing of the exposure head 13 is changed. Although an example in which the correction in the Y direction is performed has been described, the substrate on the exposure stage 40 is used in accordance with the correction amount in the Y direction using the exposure stage in which the substrate P can move in the Y direction in the same manner as the correction in the X direction. Correction in the Y direction may be performed by controlling the AC hand 30 to move the position of P in the Y direction. As described above, by correcting the posture of the substrate P and correcting the positional relationship between the substrate P and the cameras 18a and 18b, the complicated control that changes the photographing timing and the exposure timing according to the correction amount. The positional relationship between the substrate P and the cameras 18a and 18b or the positional relationship between the substrate P and the exposure head 13 can be corrected efficiently.

  In this embodiment, an example in which 1 is used as the predetermined value in step 134 has been described. However, the predetermined value is not limited to 1, and may be an integer of 2 or more.

  In this embodiment, the exposure stage 40 on which the substrate P is mounted is movably arranged, the exposure unit 16 is fixedly arranged, and the exposure stage 40 is moved to correct the posture of the substrate P. As described above, the posture of the exposure device 16 is configured to be changeable, and the posture of the exposure device 16 is controlled, or the postures of both the exposure stage 40 and the exposure device 16 are controlled to perform correction. Good.

It is the schematic which shows the exposure apparatus which concerns on this Embodiment. It is a block diagram which shows the structure of the exposure apparatus which concerns on this Embodiment. It is a figure for demonstrating the mark formation process of the board | substrate concerning this Embodiment. It is a figure which shows the template image for a mark detection which concerns on this Embodiment. It is a figure which shows the reference center point and reference line which concern on this Embodiment. It is a figure for demonstrating the position of the mark which can be detected with respect to the visual field (imaging area | region) of the camera of the exposure apparatus which concerns on this embodiment, and the position of the mark which cannot be detected. It is a figure which shows the flowchart of the process routine of the exposure process which the exposure apparatus which concerns on this Embodiment performs. It is a figure which shows the flowchart of the process routine of the board | substrate arrangement position correction process which the exposure apparatus which concerns on this Embodiment performs. It is a figure for demonstrating predetermined area | region A1-A4 which concerns on this Embodiment. It is a figure for demonstrating the exposure process and retry process which concern on this Embodiment. It is a figure which shows the flowchart of the process routine of the retry process which the exposure apparatus which concerns on this Embodiment performs. It is a figure which shows the flowchart of the process routine of the correction amount calculation registration process before carrying-in which the exposure apparatus which concerns on this Embodiment performs. It is the schematic of the correction amount log | history table before carrying-in which concerns on this Embodiment. It is a figure for demonstrating an example of the effect of the exposure apparatus which concerns on this Embodiment.

Explanation of symbols

10 Exposure Device 11 Controller 11c HDD
11d CPU
DESCRIPTION OF SYMBOLS 12 Conveyance system 13 Exposure head 14 Exposure system 15 Rail 16 Exposure machine 18 Camera 19 Detection sensor 20A IN conveyor 20B OUT conveyor 30 AC hand 40 Exposure stage 41 Rotary stage mechanism

Claims (5)

An exposure means for exposing the photosensitive layer of the substrate that is formed one by one with a mark formed in a predetermined region at each of a plurality of reference positions and a photosensitive layer is formed;
A detecting unit arranged in advance so that a positional relationship with respect to the exposure unit is fixed so as to detect a mark formed on the substrate;
A calculation means for calculating a correction amount for correcting the positional relationship suitable for exposure when the positional relationship between the carried-in substrate and the exposure means is not suitable for exposure based on the detection result of the detection means; ,
Based on the respective correction amounts calculated by the calculation means for each of the substrates that are carried into the exposure means and whose positional relationship with the exposure means is not suitable for exposure, it is carried in next time. Each loaded substrate has a pre-carrying correction amount for correcting the arrangement position before loading into the exposure unit so that the positional relationship with the exposure unit becomes a positional relationship suitable for exposure with respect to the substrate. Correction amount calculation means for calculating each time,
Based on at least one pre-carrying correction amount calculated by the correction amount calculating unit, the positional relationship between the substrate and the exposure unit carried into the exposure unit after the substrate for which the pre-carrying correction amount has been calculated Correction means for correcting before carrying into the exposure means;
Exposure apparatus.   The correction unit uses the correction amount before loading calculated by the correction amount calculation unit with respect to the substrate loaded into the exposure unit immediately before the substrate loaded into the exposure unit at this time. 2. The exposure apparatus according to claim 1, wherein the positional relationship between the substrate carried in this time and the exposure means is corrected before being carried into the exposure means.   The correction means includes a plurality of correction amounts before loading calculated by the correction amount calculation means for each of the plurality of substrates loaded into the exposure means before the substrate loaded into the exposure means at this time. Claims wherein the positional relationship between the substrate and the exposure means that are currently carried into the exposure means is corrected before being carried into the exposure means, using an average value of a predetermined number or a pre-delivery correction amount that is less than the predetermined number. Item 2. The exposure apparatus according to Item 1.   The correction means includes a plurality of correction amounts before loading calculated by the correction amount calculation means for each of the plurality of substrates loaded into the exposure means before the substrate loaded into the exposure means at this time. Claims: Correcting the positional relationship between the exposure unit and the substrate that is currently loaded into the exposure unit before loading into the exposure unit, using a median of pre-load correction amounts of a predetermined number or less than the predetermined number. Item 2. The exposure apparatus according to Item 1. A photosensitive layer is formed and a mark in a predetermined area is formed at each of a plurality of reference positions, and the mark formed on the substrate carried in one by one has a positional relationship with respect to the exposure means for exposing the photosensitive layer in advance. Detected by a fixed and arranged detection means,
Based on the detection result of the detection means, when a positional relationship between the loaded substrate and the exposure means is not suitable for exposure, a correction amount for correcting the positional relation suitable for exposure is calculated,
Based on the respective correction amounts calculated by the calculation means for each of the substrates that are carried into the exposure means and whose positional relationship with the exposure means is not suitable for exposure, it is carried in next time. Each loaded substrate has a pre-carrying correction amount for correcting the arrangement position before loading into the exposure unit so that the positional relationship with the exposure unit becomes a positional relationship suitable for exposure with respect to the substrate. Calculate every time,
Based on the calculated at least one pre-carrying correction amount, the positional relationship between the substrate carried into the exposure unit after the substrate for which the pre-carrying correction amount has been computed and the exposure unit before being carried into the exposure unit. Correct the exposure method.

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