JP2009216369A - Heat exchanging structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat exchanging structure suitable for an instantaneous electric boiler capable of instantly obtaining desired warm water or hot water by efficiently heating water while having a simple constitution. <P>SOLUTION: A constitution is adopted in which a water flow passage is provided on one side face of a heat exchanging plate having electric insulation property and a semiconductor heat generating function material is disposed on the other side face, for heating water distributed through the water flow passage via the heat exchanging plate by energizing the semiconductor heat generating function material. According to this heat exchanging structure, city water direct-pressure flowing water can be efficiently heated in a short period of time, so that the heat exchanging structure is suitable as a downsized lightweight instantaneous electric boiler in place of a gas water heater. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat exchange structure, and more particularly to a heat exchange structure suitably used as a heat exchange means for an electric water heater.

  In general, energy used at home is about 40% for household appliances including lighting, about 26% for air conditioning and heating, and the remaining 30% is consumed for hot water supply for baths and kitchens. The efficiency of the part greatly affects energy saving.

By the way, as a means of obtaining hot water or hot water at home, the “instant type” gas water heater (water heater) that heats the water in the thin pipe with the combustion heat of gas is the most widely used, but incomplete The danger of carbon monoxide generated during combustion has always been pointed out.
Recently, a high-efficiency water heater (product name; Eco-Jozu) called a latent heat recovery type has been put into practice, which increases the efficiency by using the exhaust heat of the gas after boiling water again for heating. Replacing type water heaters with general gas water heaters will lead to energy savings in any household and is also effective in reducing carbon dioxide CO2, but for the purpose of reducing CO2, gas (fire) is used. It is most desirable to switch to a method that does not

  In addition, a cogeneration water heater for home use that boils hot water while generating electricity has been proposed. The energy efficiency of this cogeneration water heater combined with electricity and heat is 85%, but not only is the operation time limited, but it is a gas water heater, so it is not a case where a lot of hot water is used. And there are few merits and the price is quite expensive.

On the other hand, electric energy is about 40% of the original fuel (primary energy) due to loss during power generation and transmission, and when this electricity is used as a heating means, further loss occurs and energy efficiency is low. turn into.
In addition, since the power that can be used for home use is limited, water cannot be heated as quickly as a gas water heater, but in the case of electricity, low-cost late-night power can be used, and all electrification is possible. Then, because it was further preferentially discounted, it was possible to reduce the utility cost, but on the other hand, the “twisting phenomenon” occurred that did not lead to energy saving as a whole.

Therefore, a heat pump type high-efficiency water heater (trade name: EcoCute) has been developed that takes in heat from the air and uses it for boiling water on the same principle as an air conditioner or refrigerator. This eco-cute boasts a heating efficiency that is more than three times the power consumption, and even if it assumes loss during power generation and transmission, its efficiency is equal to or higher than that of a gas water heater.
However, since this heat pump type high-efficiency water heater is also preliminarily heated to store a certain amount of water and stored as hot water, and this is heated to obtain necessary hot water or hot water, Since a large capacity storage tank is required, the apparatus becomes large, and there are problems that it is difficult not only to install in a housing complex where space is limited, but also difficult to retrofit.

  In order to solve such a problem, for example, power is charged in a capacitor or a power storage device (electric double layer capacitor, storage battery, secondary battery, etc.), and when the water is heated, the charged power is supplied to a heater to perform heat exchange. An electric water heater (Patent Document 1 and Patent Document 2) that can eliminate the hot water tank by using hot water, or a planar heating element mainly composed of tungsten or the like is closely arranged, and this surface Various proposals have been made such as an electric water heater (see Patent Document 3) in which a hot water tank is eliminated by flowing water between the heating elements to increase heat exchange efficiency.

  JP-A-11-281155

  JP 2004-53098 A

  JP 2000-74484 A

However, in the electric water heater that uses electricity as a means for heating water instead of gas in this way, the type equipped with a hot water tank is larger in size, while the hot water tank is omitted. It has been pointed out that the electric water heater of this type has a complicated structure in order to improve thermal efficiency, and that it is not as compact and simple as a conventional gas water heater.
Therefore, an object of the present invention is to realize a heat exchange structure suitable for an instantaneous electric water heater that can efficiently obtain desired hot water or hot water by heating water efficiently with a simple configuration. Is.

  By the way, the inventor added a lead mixture and a reducing agent dissolved in an organic solvent to a tin mixture to which a metal oxide was added and heated, and further added a thickener and a reducing agent to the heated mixture and heated again, and a binder. In addition, we are developing a semiconductor heat generating functional material that is formed into a tape shape.

  And this semiconductor heat generating functional material adopts a mechanism that causes electrons to collide by energizing a semiconductor combined with metal oxide and stably generate heat, so it can quickly obtain high temperature heat with low power and fire resistance In addition to excellent heat resistance, it does not ignite even when exposed to explosives or flammable gases when heated to a high temperature of 150 ° C. or higher, and the heat conversion rate is 93%, which provides a very efficient power saving effect. In addition, since there is no polarity, both AC and DC can be used as a power source, a heat generation upper limit temperature can be set in advance, and various effects such as being able to clear the RoHS regulation have been confirmed.

  Therefore, in the present invention, a water passage is provided on one side surface of the heat exchange plate having electrical insulation, and a semiconductor heat generating functional material is disposed on the other side surface, and the semiconductor heat generating functional material is energized through the heat exchange plate. The present invention provides a heat exchange structure that employs a configuration for heating water flowing through a water passage.

  In this case, as the heat exchange plate, it is preferable to use a metal plate having an electrically insulating coating on the outer surface and excellent thermal conductivity, and more specifically, by coating the outer surface with an electrically insulating ceramic. It is preferable to use an aluminum alloy plate having sufficient strength.

  As the heat exchange plate, for example, a glass plate such as soda glass or tempered glass can be suitably used instead of a metal plate having electrical insulation.

  Moreover, as a semiconductor heat generating functional material, a metal oxide is added to and mixed with tin oxide as a main material dissolved in an organic solvent, and this tin mixture is mixed with lead oxide and lead chloride dissolved in an organic solvent and reduced. Add the agent and heat to 150 ° C to 250 ° C. Add the thickener and reducing agent to the resulting heated mixed precipitate and heat it to about 200 ° C. A sheet-like semiconductor heat generating functional material is used which is formed by forming a base material, further attaching electrodes to the tape-like heat generating base material, and heat-resistant and waterproofing.

  In this case, if the sheet-like semiconductor heat generating functional material is used in an overlapping manner, the heat generation temperature can be increased without changing the power consumption, so that further power saving can be achieved.

  Further, as a semiconductor heat generating functional material, a metal oxide is added to and mixed with tin oxide as a main material dissolved in an organic solvent, and a lead mixture of lead oxide and lead chloride dissolved in an organic solvent and a reducing agent are mixed with this tin mixture. After heating to 150 ° C to 250 ° C with a part added, a heating base obtained by reheating a part of the heating mixture obtained and a dissolved mixture of tin oxide and zinc oxide is deposited on one side of the heat exchange plate Thus, a vapor deposition type semiconductor heat generating functional material constituted by attaching electrodes can also be suitably used.

  Since the heat exchange structure configured in this way can obtain hot water or hot water instantaneously with a small electric power, it can be suitably configured as an instantaneous electric water heater.

According to the heat exchange structure according to the present invention and the electric instantaneous water heater using this heat exchange structure;
(1) Since the structure is simple, it can be miniaturized and the installation location is not limited, so that it can be suitably replaced with a gas water heater.
(2) Since flowing water can be heat exchanged (heated) efficiently in a short time, it can be used at a direct water pressure.
(3) High-temperature heat can be obtained quickly with low electric power, and since the heat conversion efficiency is high, the amount of electric power used can be greatly reduced, and the running cost is below the same level as the gas hot water supply type. Is extremely effective in reducing carbon dioxide CO2.
It has excellent effects such as.

  Next, as the best mode for carrying out the present invention, an electric water heater incorporating the heat exchange structure according to the present invention will be exemplified, and will be described in detail below with reference to the accompanying drawings.

  1 and 2, in the electric water heater 10, a water supply port 14 of a heat exchange structure 12 disposed inside is directly connected with a water pipe 16 such as a water supply via a valve (not shown). A hot water supply pipe 20 is connected to the discharge port 18 of the heat exchange structure 12.

  The heat exchange structure 12 is provided with a water passage 24 formed in a spelled shape on the opposite side surfaces of the two heat exchange plates 22, 22 having electrical insulation, and a sheet on the outer surface of each heat exchange plate 22, 22. The sheet-like semiconductor heat generating functional material 26 is disposed, and the sheet-like semiconductor heat generating functional material 26 is energized to heat the heat exchanging plate 22 to exchange heat with water flowing through the spiral water passage 24. It is configured to obtain hot water.

  In this case, if the aluminum alloy plate 22a that has not only excellent thermal conductivity but also good workability is used as the material of the heat exchange plate 22, the spelled water passage 24 can be easily formed and processed. In addition, the outer surface of the aluminum alloy plate 22a is coated with ceramic 28 to ensure electrical insulation and to have a strength sufficient to withstand rapid thermal deformation.

On the other hand, the sheet-like semiconductor heat generating functional material 26 is mixed with tin oxide as a main material dissolved in an organic solvent, for example, by adding a metal oxide such as alumina or antimony, and then dissolving the tin mixture in an organic solvent. A lead mixture of lead and lead chloride and a reducing agent are added at a predetermined ratio and heated to 150 ° C. to 250 ° C., and a thickener and a reducing agent are added to the resulting heated mixed precipitate and heated again to about 200 ° C. After that, for example, a tape-like heat generating base material is formed by adding and spreading a binder such as a fluororesin, and an electrode is attached to the tape-like heat generating base material. For example, a synthetic resin sheet such as polyimide is used. It is formed by heat-resistant waterproof coating. The sheet-like semiconductor heat generating functional material 26 is stuck along the spelled water passage 24 using a heat-resistant adhesive.
In this case, it is preferable that the sheet-like semiconductor heat generating functional material 26 is used by being overlapped or stacked. This is because the sheet-like semiconductor heat generating functional material 26 (A) is radiated from the heat-generating base material when used in, for example, two-fold (A / 2), three-fold (A / 3), or four-fold (A / 4). This is because electromagnetic waves such as infrared rays can be amplified, so that the heat generation temperature can be increased 1.5 to 2.1 times or more without changing the power consumption (see Table 1).

That is, a sheet-like semiconductor heat generating functional material 26 (A) set to a width of 10 mm × length of 280 mm and an internal resistance of 992Ω is stretched in the air 15 cm from the desktop and energized (AC 100 V) to consume power and generate the sheet-like semiconductor heat. The surface temperature of the functional material 26 (A) is measured with a thermocouple over time, and the surface is folded in two (A / 2), three (A / 3), and four (A / 4) under the same conditions. The temperature was also measured over time.
And when the average temperature (degreeC) of the surface for 5 minutes-10 minutes of electricity supply and the temperature increase rate were calculated | required, the following results were obtained.

In the drawings, reference numeral 30 denotes a heat reflecting material arranged outside each heat exchange plate 22, and a heat insulating material 32 is arranged outside the heat reflecting material 30 so that the semiconductor heat generating functional material is energized. 26 is configured to prevent a reduction in heat exchange rate between the heat generated in the water 26 and the water flowing through the water passage 26 as much as possible.
Reference numeral 34 denotes a controller that controls energization of the semiconductor heat generating functional material 26 based on detection signals from the water supply sensor 36, the plate temperature sensor 38, and the hot water supply sensor 40. The controller 34 includes a hot water temperature adjuster. 42 is attached.

  The electric water heater 10 configured as described above is used by being connected to a commercial power supply (AC 100 V). However, since the semiconductor heating functional material 26 serving as a heating means has no polarity, it can be used with a DC power supply. Needless to say.

  When specifically connected to a commercial power source, the valve of the water pipe 16 such as a water supply is loosened to flow water through the water passage 24 of the heat exchange structure 12, and a switch (not shown) is turned on. By supplying electric power to the heat generating functional material 26, the semiconductor heat generating functional material 26 is heated to, for example, about 150 ° C., and the water flowing through the water passage 24 through the aluminum alloy plates (heat exchange plates) 22a and 22a. Heat with heat exchange.

  In this case, if it is a normal aluminum alloy plate, it is thermally deformed due to a rapid temperature rise of the semiconductor heat generating functional material 26. In this embodiment, the surfaces of the aluminum alloy plates (heat exchange plates) 22a and 22a are ceramic. Such inconvenience can be avoided as much as possible by covering with 28 to suppress the thermal deformation to a very small extent and to enhance it.

Moreover, since the aluminum alloy plates (heat exchange plates) 22a and 22a are materials having excellent heat conductivity, the temperature rise flows through the water passage 24 without waste due to a synergistic complementary action with the heat reflecting material 30 and the heat insulating material 32. Since it will be used to warm water, it becomes possible to make running water into hot water with high efficiency in a short time. Therefore, by adjusting the amount of water from the water supply pipe 16, the temperature of hot water and hot water flowing from the hot water supply pipe 20 can be adjusted over a wide range.
Further, by controlling the power supply voltage in accordance with the amount of water flowing through the water passage 24, it is possible to easily keep the temperature of the hot water or hot water from the hot water supply pipe 20 constant. Accordingly, it is possible to prevent inconveniences such as cold water flowing when the valve is loosened and water begins to flow through the water passage 24 of the heat exchange structure 12, or hot water flows out at a high temperature when the valve is closed.

On the other hand, FIG. 3 shows another example in which a semiconductor heat generating functional material 46 is formed by depositing a heat generating base material 44 on the outer surface of an aluminum alloy plate 22a coated with a ceramic 28 and imparting electrical insulation to form a thin film. It is an embodiment.
As in this embodiment, by using the vapor deposition type semiconductor heat generating functional material 46 in place of the sheet-shaped semiconductor heat generating functional material 26, it becomes possible to achieve mass production by facilitating manufacturing, and reduce the manufacturing cost. Easy maintenance can also be achieved.

In addition, the heat generating base material 44 is prepared by adding a metal oxide to a tin oxide as a main material dissolved in an organic solvent and mixing it, and mixing and reducing a lead mixture of lead oxide and lead chloride dissolved in an organic solvent into the tin mixture. It is prepared by reheating a part of the heating mixture obtained after adding the agent and heating to 150 ° C. to 250 ° C. and the dissolved mixture of tin oxide and zinc oxide, and setting the exothermic temperature to about 450 ° C. be able to.
The heat generating base 44 is provided with a means such as a vacuum deposition method on a desired portion of the aluminum alloy plate 22a (heat exchange plate), that is, on the outer surface corresponding to the spelled water passage 24 formed on the aluminum alloy plate 22a. It is constituted as a heating means by attaching an electrode to its end after depositing it into a thin film. In this case, by appropriately adjusting the thickness dimension of the heat generating base material 44 deposited in a thin film shape, the heat generation temperature is not changed without changing the power consumption in the same manner as when the above-mentioned sheet-like semiconductor heat generating functional material is used in an overlapping manner. It goes without saying that can be raised.

  As mentioned above, although the embodiment in the case of applying the heat exchange structure of the present invention to an instantaneous electric water heater has been described, the present invention is not limited to this embodiment, for example, a heat exchange plate Use a glass plate made of soda glass or tempered glass as the material, or further improve the heat exchange efficiency by arranging the zigzag water passages in the thickness direction, and further In addition, a configuration that can cope with hot water supply of large capacity in combination with a hot water storage tank belongs to the category of design change.

  As described above, the heat exchange structure according to the present invention can heat a fluid such as a liquid with a simple configuration efficiently and with low power, so that not only a water heater but also a fluid ( It can be used in a wide range of industrial fields, including applications such as heating (liquid), heating in a closed atmosphere, and heat retention.

It is a schematic explanatory drawing of the state which abbreviate | omitted the heat reflection material and the heat insulating material in the instantaneous type electric water heater using the heat exchange structure which concerns on this invention. FIG. 2 is a schematic partial cross-sectional explanatory view of a main part of the instantaneous electric water heater shown in FIG. 1. It is a principal part schematic explanatory perspective view of another heat exchange structure (instantaneous type electric water heater) concerning the present invention constituted using another semiconductor exothermic functional material.

Explanation of symbols

10 .... Electric water heater 12 .... Heat exchange structure 14 .... Water supply port 16 .... Water pipe 18 .... Discharge port 20 .... Hot water supply pipe 22 .... Heat exchange plate (22a ... Aluminum alloy plate)
24 .. Spiral water passage 26 .. Sheet-like semiconductor heat generating functional material 28 .. Ceramic coating 30 .. Heat reflecting material 32 .. Heat insulation material 34 .... Controller 36 .... Water supply sensor 38 .... Plate temperature sensor 40.・ Hot water supply sensor 42 ・ ・ Hot water temperature controller 44 ・ ・ Heat generating base material 46 ・ ・ Vapor deposition type semiconductor heat generating functional material

Claims (9)

A water passage is provided on one side surface of the heat exchange plate having electrical insulation, a semiconductor heat generating functional material is disposed on the other side surface, and the semiconductor heat generating functional material is energized to flow through the water passage through the heat exchange plate. A heat exchange structure characterized by heating water. The heat exchange structure according to claim 1, wherein a metal plate having an outer surface coated with an electrical insulating coating is used as the heat exchange plate. The heat exchange structure according to claim 2, wherein an aluminum alloy plate whose outer surface is coated with an electrically insulating ceramic is used as the metal plate. The heat exchange structure according to claim 1, wherein a glass plate is used as the heat exchange plate. The semiconductor heat generating functional material is mixed with tin oxide as a main material dissolved in an organic solvent, mixed with a metal oxide, and a lead mixture of lead oxide and lead chloride dissolved in an organic solvent and a reducing agent are added to the tin mixture. Heating to 150 ° C to 250 ° C, adding a thickener and a reducing agent to the resulting heated mixed precipitate, heating again to about 200 ° C, adding a binder, and then spreading the tape-shaped heat generating substrate. The heat exchange structure according to any one of claims 1 to 4, wherein the heat exchange structure is formed and further provided with an electrode on the tape-like heat-generating substrate and heat-resistant and waterproof. The heat exchange structure according to any one of claims 1 to 4, wherein the heat generating functional material is used in a superimposed manner. The semiconductor heat generating functional material is mixed with tin oxide as a main material dissolved in an organic solvent, mixed with a metal oxide, and a lead mixture of lead oxide and lead chloride dissolved in an organic solvent and a reducing agent are added to the tin mixture. A heating substrate obtained by reheating a part of the heating mixture obtained after heating to 150 ° C. to 250 ° C. and a dissolved mixture of tin oxide and zinc oxide, and heating the heating substrate to a heat exchange plate The heat exchange structure according to any one of claims 1 to 4, wherein the heat exchange structure is formed by vapor deposition on one side surface and attaching an electrode. The heat exchange structure according to any one of claims 1 to 7, wherein a heat reflecting material and a heat insulating material are disposed outside the heat exchange plate. An electric instantaneous water heater using the heat exchange structure according to any one of claims 1 to 8.

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