JP2009194098A - Housing structure of module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a housing structure of a module capable of reducing EMI by enhancing the contactability between a base member and a cover. <P>SOLUTION: In the housing structure 100 of the module, a cover 2 composed of a flexible material is attached over a base member 1 housing a wiring board 3. Claws 10 and spring members 13 are provided on side plates 2B to 2D of the cover 2. Slits 11 for claws engaged with the claws 10 and slits 14 for spring member for allowing the spring member 13 to pass through and pressing a bottom plate 1A of the base member 1 to the spring member 13, are formed on side plates 1B to 1D of the base member 1 contacted with or positioned adjacent to the side plates 2B to 2D of the cover 2. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a module used for wiring of an electronic circuit of an automobile, an airplane, etc., and a module housing capable of improving the contact between a base member and a cover and reducing EMI (radio wave interference). Concerning structure.

Conventionally, the module housing | casing shown by patent document 1 is known. This module housing is configured such that a wiring board on which electronic components are mounted is housed in a metal base member, and a metal cover is fitted on the base member. Further, a cantilever tongue piece made of an elastic material having a convex portion at the tip is formed on the cover side plate of the module housing. On the other hand, an opening is formed in the side plate of the base member, and when the cover is attached, a tongue piece convex portion on the cover side is engaged with the opening.
Japanese Utility Model Publication No. 7-27189

  By the way, in the module housing as described above, when the cover is placed on the base member, the cover is usually designed to be slightly larger than the base member in consideration of tolerances. In this case, when the cover is attached, the cover is in a floating state with insufficient contact with the base member. For this reason, due to the poor contact between the base member and the cover, the cover cannot be sufficiently grounded, resulting in a problem of hindering EMI reduction.

  The present invention has been made in view of the above-described circumstances, and an object thereof is to provide a module housing structure capable of improving the contact between a base member and a cover and reducing EMI.

  In order to solve the above problems, the present invention proposes the following means. That is, the present invention provides a module housing structure in which a cover made of an elastic material is attached to an upper side of a base member in which an electronic board is accommodated, and a claw portion and a spring member are provided on the side plate of the cover, For a spring member that causes the side plate of the base member that is in contact with or close to the side plate of the cover to pass through the slit for the claw portion engaged with the claw portion and the spring member to press the surface of the base member against the spring member. A slit is formed.

  According to the above configuration, when the cover is attached to the base member, the claw portion of the cover side plate is engaged with the claw portion slit, thereby preventing the cover from coming off from the base member. Further, when the cover is attached to the base member, the spring member of the cover side plate presses the surface of the base member via the spring member slit simultaneously with the engagement of the claw portion with the claw slit. To do. Further, the pressing of the base member by such a spring member prevents the cover from rattling with respect to the base member, and improves the contact between the cover and the base member. As a result, it is possible to reduce EMI caused by insufficient contact between the cover and the base member.

  Further, in the case structure of the module of the present invention, when the cover is attached to the base member, the bottom plate surface of the base member is directed downward via the spring member slit of the base member. It is made to push toward.

  According to the above configuration, when the cover is attached to the base member, the spring member presses the bottom plate surface of the base member downward through the spring member slit of the base member, and the reaction force Thus, a force is applied to the cover in a direction away from the base member. However, since the cover is engaged with the base member at the claw portion, the cover does not come off from the base member, and the force applied to the cover in a direction away from the base member. This prevents the cover from rattling with respect to the base member and improves the contact between the cover and the base member. And the above-mentioned EMI reduction effect is show | played by the contact improvement of such a cover and a base member.

  In the module housing structure of the present invention, the engaging means including the claw portion and the claw portion slit are provided on the cover and the side plate of the base member facing each other with the storage portion of the electronic board interposed therebetween. It is characterized by.

  According to the above configuration, the engagement means including the claw portion and the claw portion slit is provided on the side plate of the cover and the base member facing each other with the storage portion of the electronic board interposed therebetween, so that the base member of the cover Engagement can be performed stably.

  Further, in the module housing structure of the present invention, the pressing means including the spring member and the slit for the spring member are provided on the cover and the side plate of the base member facing each other with the storage portion of the electronic board interposed therebetween. Features.

  According to the said structure, the press means which makes the spring member and the slit for spring members a group is each provided in the side plate of the cover and base member which oppose on both sides of the accommodating part of an electronic substrate, and presses with respect to the base member of a cover Can be performed stably.

  According to the housing structure of the module shown in the present invention, the contact between the cover and the base member is improved by the pressing of the base member by the spring member, and the cover is prevented from rattling with respect to the base member. It is possible to reduce the EMI generated due to insufficient contact between the cover and the base member.

  An embodiment of the present invention will be described with reference to FIGS. FIG. 1 shows a module housing 100 according to the present invention, which is composed of a base member 1 and a cover 2 attached to the upper portion of the base member 1. The base member 1 is composed of a bottom plate 1A and four side plates 1B to 1E arranged so as to surround the bottom plate 1A, and the whole is made of stainless steel, steel, aluminum alloy, brass, phosphor bronze, etc. It is made of metal. The thickness of the base member 1 is set to about 0.4 to 2.0 mm. In the following description, the side plate 1B is referred to as a front side plate 1B, the side plate 1C is referred to as a rear side plate 1C, the side plate 1D is referred to as a side plate 1D, and the side plate 1E is referred to as a side plate 1E.

  On the bottom plate 1A, there is provided a substrate storage portion 4 for storing a wiring substrate 3 which is an electronic substrate, as shown by a one-dot chain line, and the bottom substrate 1A of the base member 1 is attached to the attached wiring substrate. A substrate locking portion 5 for locking 3 is provided. Further, the front plate 1A of the base member 1 is provided with an arcuate receiving portion 6 for receiving a connector portion (not shown) of an optical component connected to the wiring board 3.

  On the other hand, as shown in FIG. 2, the cover 2 is composed of an upper plate 2A and four side plates 2B to 2E arranged so as to surround the upper plate 2A. It is made of an elastic material such as a metal such as stainless steel and spring phosphor bronze, or a plastic such as polyether ether ketone, polyphenylene sulfide, polycarbonate, and polyacetal. The thickness of the cover 2 is set to 0.2 to 2.0 mm (the plate thickness varies depending on the size and material of the housing). In the following description, the side plate 2B is represented as a front side plate 2B, the side plate 2C is represented as a rear side plate 2C, the side plate 2D is represented as a side plate 2D, and the side plate 2E is represented as a side plate 2E.

  The dimensions of the side plates 2B to 2E of the cover 2 are slightly larger than the dimensions of the side plates 1B to 1E of the base member 1, so that the cover 2 covers the base member 1 from above. Can be attached to. When the cover 2 is attached to the base member 1, the side plates 2 </ b> B to 2 </ b> E of the cover 2 are arranged close to each other with a slight gap in contact with the corresponding side plates 1 </ b> B to 1 </ b> E of the base member 1. It has become. Further, the front plate 2A of the cover 2 is provided with an arcuate receiving portion 7 for receiving a connector portion (not shown) of an optical component connected to the wiring board 3 together with the receiving portion 6 of the front plate 2A. ing.

  The base member 1 and the cover 2 described above are provided with a total of four sets of engaging means 12 including a claw portion 10 and a claw portion slit 11 for engaging the cover 2 with the base member 1. The claw portions 10 are respectively provided at the lower portions of the rear side plate 2C and the side side plates 2D and 2E of the cover 2, and are formed integrally with the side plates 2C to 2E, and each protrudes inward. It is formed to do. Further, as shown in FIGS. 2 and 3A and 3B, each claw portion 10 is formed so as to gradually protrude inward from the lower side to the upper side, and below the claw portions 10. An inclined surface (indicated by reference numeral 10A) is formed on the side.

  Further, the claw part slit 11 is formed in the lower part of the base member side plates 1C to 1E corresponding to the claw part 10 of the cover side plates 2C to 2E, and when the cover 2 is attached to the base member 1. The claw portions 10 described above are engaged with each other. In such engagement means 12, when the cover 2 is attached to the base member 1, the cover 2 is engaged with the claw portion slit 11 on the cover 2 side, so that the cover 2 is attached to the base member 1. It comes to be kept from falling out. When the cover 2 is attached to the base member 1, as shown by a one-dot chain line in FIG. 3B, after the side plates 2C to 2E of the cover 2 are elastically deformed outward, the inclined surface 10A of the claw portion 10 is By sliding with the edge of the claw part slit 11, the claw part 10 is guided into the claw part slit 11 and fitted into and engaged with the claw part slit 11. .

  The base member 1 and the cover 2 described above are provided with a total of three sets of pressing means 15 including a spring member 13 and a spring member slit 14 for improving the contact of the cover 2 with the base member 1. The spring member 13 is provided at the lower part of the front side plate 2B and the rear side plate 2C of the cover 2, and is formed integrally with the side plates 2B and 2C, and each of them is bent inward. Is formed. The spring member slit 14 is formed in the lower part of the base member side plates 1B and 1C corresponding to the spring members 13 of the cover side plates 2B and 2C, and when the cover 2 is attached to the base member 1. 4A and 4B, the spring member 13 presses the bottom plate 1A of the base member 1 downward through the spring member slit 14 of the base member 1. As shown in FIG.

  And in the module housing | casing 100 comprised as mentioned above, when the cover 2 is attached to the base member 1, the nail | claw part 10 of this cover 2 side plate is engaged with the slit 11 for nail | claw parts, Thereby, cover 2 is covered. Is secured to the base member 1 (see FIG. 3). When the cover 2 is attached to the base member 1, the spring member 13 presses the bottom plate 1A of the base member 1 downward via the spring member slit 14 of the base member 1 (FIG. 4 ( B) is shown in the direction of arrow A), and the reaction force applies a force to the cover 2 in a direction away from the base member 1 (shown in the direction of arrow B in FIG. 4B). However, since the cover 2 is engaged with the base member 1 by the claw portion 10, the cover 2 is not detached from the base member 1, and the base member 1 applied to such a cover 2 is used. The contact force between the cover 2 and the base member 1 is improved by the force in the direction away from the cover (shown in the direction of arrow B in FIG. 4B), and the cover 2 is rattled against the base member 1. Is prevented. And the improvement of the contact property of such a cover 2 and the base member 1 is expected to reduce the EMI as described above.

  Further, in the module housing 100 configured as described above, the contact between the cover 2 and the base member 1 can be improved, so that the cover 2 can be sufficiently grounded, and can be externally connected. Electromagnetic waves are prevented from entering the substrate storage unit 4 covered with the cover 2 and the base member 1, and electromagnetic waves in the substrate storage unit 4 are prevented from leaking to the outside.

  Further, in the module housing 100 configured as described above, the engaging member 12 including the claw portion 10 and the claw portion slit 11 as a set is opposed to the base member 1 facing the substrate housing portion 4 of the wiring substrate 3. In addition, the cover 2 can be stably engaged with the base member 1 by being provided on the side plates 1D, 2D / 1E, and 2E of the cover 2, respectively. Further, the pressing means 15 including the spring member 13 and the spring member slit 14 is set on the cover 2 and the side plates 1B, 2B / 1C, and 2C of the base member 1 that are opposed to each other with the board housing portion 4 of the wiring board 3 interposed therebetween. By being provided, the cover 2 can be stably pressed against the base member 1.

  In the above embodiment, four sets of engaging means 12 including the claw portion 10 and the claw slit 11 are provided, and three sets of pressing means 15 including the spring member 13 and the spring member slit 14 are provided. The number of these sets is not limited. In consideration of stability, the base member 1 and the side plates 1B to 1E and 2B to 2E of the cover 2 that are opposed to each other with the board housing part 4 of the wiring board 3 interposed therebetween are provided with three sets of these engaging means 12 and pressing means 15. It is preferable to provide them one by one.

  Moreover, in the said embodiment, although the spring member 13 of the press means 15 was made to press 1 A of bottom plates of the base member 1 below (arrow A direction), it is not limited to this, With respect to this spring member 13 The base plate 1A of the base member 1 is pressed in the horizontal direction, and the base member 1 is pressed against any one of the side plates 1B to 1E of the cover 2 so that the contact between the base member 1 and the cover 2 is achieved. May be improved.

  As mentioned above, although embodiment of this invention was explained in full detail with reference to drawings, the concrete structure is not restricted to this embodiment, The design change etc. of the range which does not deviate from the summary of this invention are included.

The perspective view which shows arrangement | positioning of the base member 1 concerning this invention, the wiring board 3 attached to this base member 1, and the cover 2 The perspective view which shows the cover 2 concerning this invention It is sectional drawing which follows the III-III line | wire of FIG. 1 for demonstrating the effect | action of the slit 11 for nail | claw parts, Comprising: (A) is before attaching the cover 2 to the base member 1, (B) is the cover 2 to the base member. 1 is shown after being attached. FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. 1 for explaining the action of the spring member 13, wherein (A) is before the cover 2 is attached to the base member 1, and (B) is the cover 2 to the base member 1. Each is shown after installation.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base member 1A Bottom plate 1B-1E Side plate 2 Cover 2B-2E Side plate 3 Wiring board (electronic substrate)
DESCRIPTION OF SYMBOLS 4 Board | substrate storage part 10 Claw part 11 Claw part slit 12 Engagement means 13 Spring member 14 Spring member slit 15 Press means 100 Module housing

Claims (4)

A module housing structure in which a cover made of an elastic material is attached to an upper side of a base member in which an electronic substrate is stored,
A claw portion and a spring member are provided on the side plate of the cover,
The side plate of the base member that is in contact with or close to the side plate of the cover has a claw portion slit engaged with the claw portion, and a spring that allows the spring member to pass through and press the bottom plate of the base member. A module housing structure, wherein a member slit is formed.   2. The spring member according to claim 1, wherein when the cover is attached to the base member, the bottom plate surface of the base member is pressed downward through the spring member slit of the base member. The module housing structure described.   The engaging means including the claw portion and the claw portion slit as a set is provided on each of the cover and the side plate of the base member facing each other with the storage portion of the electronic substrate interposed therebetween. Item 3. The module housing structure according to any one of Items 2 to 3.   4. The pressing means comprising the spring member and the spring member slit as a set is provided on each of the cover and the side plate of the base member facing each other with the storage portion of the electronic board interposed therebetween. The module housing structure according to any one of the preceding claims.

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