JP2009176824A - Module substrate and camera module - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a module structure which is independent from a lens unit and uses a flexible substrate, and is small in thickness and low in cost. <P>SOLUTION: The module substrate includes: a flexible substrate wherein a wiring pattern for mounting an imaging element is formed on main surface; a glass member arranged opposite to the main surface of the flexible substrate; and a sidewall made of rein which is extended nearly upward in the perpendicular direction on the main surface of the flexible substrate, so as to hold the glass member. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a module substrate having a flexible substrate on which a predetermined wiring pattern is formed and a camera module having the module substrate. More specifically, the module substrate is required to be thin, have high dimensional accuracy, and high heat resistance. It relates to a camera module.

  Conventionally, camera module substrates are required to be thin and light, and in particular, those used for mobile phones are required to be small.

  FIG. 1 is a configuration diagram illustrating an example of a camera module substrate. In the module substrate 10 shown in FIG. 1, an imaging element 12 is mounted on the bottom of a case member 11 having a MID (Molded Interconnect Device) structure made of, for example, a low thermal expansion coefficient epoxy resin, and protrudes from the upper surface of the imaging element 12. The wire 13 is electrically connected to the wiring film 14 formed on the inner wall surface of the case member 11, is placed on the upper end of the case member 11, and is exposed to the ultraviolet curable resin 16 outside the case member 11. The structure which is sealed with the transparent sealing plate 15 provided via is adopted. Thereby, the module substrate 10 in which the imaging element 12 is sealed by the case member 11 and the transparent sealing plate 15 is completed (see Patent Document 1).

  However, in the module substrate 10 as shown in FIG. 1, accuracy in the XY directions can be improved, but since the transparent sealing plate 15 is provided outside the case member 11, Thus, the height of the ultraviolet curable resin 16 and the transparent sealing plate 15 is increased.

  With the increase in the height of the module substrate described above, it has been proposed to use a flexible substrate having a thickness of about 0.3 to 0.4 mm on which a predetermined wiring pattern is formed instead of the case member described above (patent) Reference 2).

  FIG. 2 is a configuration diagram illustrating an example of a module structure using a flexible substrate. In the module structure 20 shown in FIG. 2, a flexible substrate 21 is prepared, a lens holder 24 to which a lens 23 is attached is prepared, and the lens holder 24 is placed in an opening 21 </ b> A formed at a substantially central portion of the flexible substrate 21. The projecting portion 24 </ b> A is fitted, and the flexible substrate 21 is supported by the lower surface of the lens holder 24.

  In this configuration, the imaging element 22 is flip-chip connected via the metal bumps 25 on the side of the flexible substrate 21 that faces the support surface of the lens holder 24, and is supported and fixed outside the flexible substrate 21. I have to.

  However, in the configuration as shown in FIG. 2, since the imaging element 22 is positioned outside the flexible substrate 21, the thickness of the entire module structure 20 is increased and the thickness is reduced by using the flexible substrate 21. The effect of will be offset. In such a module structure, the lens holder 24 needs to be made of a ceramic member in order to maintain the accuracy in the XY directions and maintain the heat resistance. However, the ceramic member has a problem that the material cost and the processing cost are high, and the cost of the module structure 20 is increased.

  Also, the module structure 20 as shown in FIG. 2 is prepared by separately preparing a module structure using only the flexible substrate 21 as a base material and a lens unit having a lens 23 and a lens holder 24, and then combining them. However, the lens unit 24 is used as a main component, and the flexible substrate 21 and the imaging element 22 are combined with the lens unit 24. Therefore, with respect to the fabrication of the module structure 20, a highly accurate fabrication technique is required for the combination of the flexible substrate 21 and the imaging element 22, and the manufacturing cost of the module structure 20 increases from this point of view. There was a problem.

  Furthermore, in the module structure 20 as shown in FIG. 2, before the flexible substrate 21 and the imaging element 22 are combined with the lens unit, the flexible substrate 21 and the imaging element 22 remain exposed to the surrounding environmental atmosphere. End up. As a result, before the above-described combination is performed, dust adheres to the flexible substrate 21 and the imaging element 22, which causes a decrease in the manufacturing yield of the module structure 20.

JP 11-31751 A JP 2003-230028

  It is an object of the present invention to provide a module structure that is independent of a lens unit and that uses a flexible substrate and is low-cost and thin.

In order to achieve the above object, the present invention provides:
On the main surface, a flexible substrate on which a wiring pattern for mounting an imaging element is formed;
A glass member arranged to face the main surface of the flexible substrate;
A side wall made of resin that extends substantially vertically above the main surface of the flexible substrate and supports the glass member;
It is related with the module board | substrate characterized by comprising.

  According to the present invention, the wiring pattern for mounting the imaging element is formed on the main surface of the flexible substrate, and the glass member supported by the resin side wall portion is opposed to the main surface. I try to let them. Therefore, since the imaging element is disposed in a space formed by the flexible substrate and the glass substrate, the module substrate should be sufficiently thinned using the thinness of the flexible substrate. Can do.

  In addition, when manufacturing a camera module, it can be realized simply by preparing a lens unit separately and connecting the lens unit to the module substrate obtained as described above, so the manufacturing process is greatly simplified. be able to. Therefore, the cost for manufacturing the camera module can be reduced.

  Furthermore, since the above-described module substrate does not use a ceramic member, it is possible to suppress high costs due to material costs and processing costs. Therefore, the cost of the module substrate can be reduced.

  In the present invention, the main surface of the flexible substrate on which the wiring pattern is formed and the imaging element formed thereon are the glass member and the side wall portion before the module substrate and the lens unit are combined. Protected by Therefore, the main surface of the flexible substrate on which the wiring pattern is formed and the imaging element are not exposed to the surrounding environmental atmosphere. As a result, before the combination described above is performed, dust does not adhere to the main surface of the flexible substrate and the imaging element, and a reduction in manufacturing yield of the module substrate can be suppressed.

In one aspect of the present invention, the side wall portion can be composed of a thermosetting resin, preferably,
(A) Heat having, as essential components, a polyfunctional epoxy resin having a structural formula represented by Chemical Formula 1, (B) a phenol resin curing agent, (C) a curing accelerator, and (D) silica powder having a weight average particle size of 10-30 μm. A curable resin composition comprising:
The (D) silica powder is contained in the resin composition in a proportion of 80-90% by mass, and the thermosetting such that the proportion of the fused silica powder in the (D) silica powder is 80-100% by mass. It can comprise from a functional resin composition.

  Thermosetting resins such as epoxy resin compositions using a novolac epoxy resin such as a phenol novolac epoxy resin or a cresol novolac epoxy resin as a main agent and a phenol resin as a curing agent are inexpensive and have moldability, Since it is excellent also in moisture resistance etc., it can use preferably as a constituent material of the side wall part of the said module substrate.

  However, the above-described epoxy resin composition and the like are inexpensive and excellent in formability and moisture resistance, but have disadvantages such as a low glass transition point and a low elastic modulus, and a high heat shrinkage rate. Therefore, when forming the above-mentioned side wall portion, the dimensional accuracy is deteriorated due to the above-described thermal shrinkage rate, and the heat resistance and mechanical strength during subsequent use are reduced. Problems such as looseness may occur.

  On the other hand, since the thermosetting resin composition that satisfies the above-described requirements has a high glass transition point and a high elastic modulus and a small heat shrinkage rate, the above disadvantages can be sufficiently eliminated.

これによって、上記モジュール基板を構成する側壁部のガラス転移点及び弾性率をより向上させることができるとともに、熱収縮率を減少させることができ、上述したカメラモジュールを作製する際の不利益を解消することができる。 In another embodiment of the present invention, the (B) phenol resin curing agent is a polyfunctional phenol represented by Chemical Formula 2.

As a result, the glass transition point and elastic modulus of the side wall portion constituting the module substrate can be further improved, the thermal shrinkage rate can be reduced, and the disadvantages in manufacturing the camera module described above are eliminated. can do.

  For example, a cured product obtained by heating the thermosetting resin composition at a temperature of 200 ° C. for 1 hour has a glass transition point by the DMA method of 200 ° C. or more and an elastic modulus at 150 ° C. of 10 GPa · The molding shrinkage rate can be 0.05% or less from S or more.

  As described above, according to the present invention, it is possible to provide a module structure that is independent of the lens unit and that uses a flexible substrate and is low in cost and thin.

  Hereinafter, specific examples of the present invention will be described with reference to the drawings.

  FIG. 3 is a block diagram showing an example of the module substrate of the present invention. A module substrate 30 shown in FIG. 3 includes a flexible substrate 31 and a transparent glass member 35 disposed so as to face the flexible substrate 31. The glass member 35 is supported by a resin side wall 34 extending substantially vertically upward on the main surface 31 </ b> A of the flexible substrate 31. Specifically, a groove is provided on the upper surface of the side wall 34 and is supported and fixed so that the end of the glass member 35 and the groove are fitted. In addition, it can also be made to connect mutually using an adhesive instead of making it fit as mentioned above.

  An imaging element 32 is mounted on the main surface 31A of the flexible substrate 31 and is electrically connected by a wire 33 and a wiring pattern (not shown) formed on the main surface 31A of the flexible substrate 31. A bump may be used instead of the wire 33. That is, the imaging element 32 is arranged in a space formed by the flexible substrate 31 and the glass member 35.

  However, the module substrate in the present embodiment is characterized by a configuration including the flexible substrate 31, the side wall portion 34, and the glass member 35, and the imaging element 32 is not an essential component in the present embodiment. However, since it becomes an essential component when configuring a camera module as shown below, it does not necessarily have to be deleted from the component.

  As apparent from the configuration shown in FIG. 3, in the present embodiment, the imaging element 32 is disposed in a space formed by the flexible substrate 31 and the glass member 35 disposed to face the flexible substrate 31. Compared to the conventional module structure in which the imaging element is formed outside the flexible substrate, the module substrate 30 can be sufficiently thinned by making the best use of the characteristics of the thin flexible substrate 31.

  Further, when producing a camera module described below, it can be realized by preparing a lens unit separately and connecting the lens unit to the module substrate 30 obtained as described above. Can be greatly simplified. Therefore, the cost for manufacturing the camera module can be reduced.

  Further, since the module substrate 30 includes the side wall portion 34 made of resin and does not use a ceramic member, it is possible to suppress high costs due to the material cost and processing cost. Therefore, the cost of the module substrate 30 can be reduced.

  In addition, the main surface 31A of the flexible substrate 31 on which a wiring pattern (not shown) is formed and the image pickup element 32 formed thereon are the glass member 35 and the side wall portion before the module substrate 30 and the lens unit are combined. 34 is protected. Therefore, the main surface 31A on which the wiring pattern of the flexible substrate 31 is formed and the imaging element 32 are not exposed to the surrounding environmental atmosphere. As a result, before the above-described combination is performed, dust does not adhere to the main surface 31A of the flexible substrate 31 and the imaging element 32, and a reduction in manufacturing yield of the module substrate 30 can be suppressed.

In this embodiment, the side wall part 34 can be comprised from a thermosetting resin, Preferably, (A) The polyfunctional epoxy resin of the structural formula shown by Chemical formula 1, (B) A phenol resin hardening | curing agent, (C) hardening A thermosetting resin composition comprising an accelerator and (D) silica powder having a weight average particle size of 10-30 μm as essential components,
The (D) silica powder is contained in the resin composition in a proportion of 80-90% by mass, and the thermosetting such that the proportion of the fused silica powder in the (D) silica powder is 80-100% by mass. It can comprise from a functional resin composition.

  Thermosetting resins such as epoxy resin compositions using a novolac epoxy resin such as a phenol novolac epoxy resin or a cresol novolac epoxy resin as a main agent and a phenol resin as a curing agent are inexpensive and have moldability, Since it is excellent also in moisture resistance etc., it can use preferably as a constituent material of the side wall part of the said module substrate.

  However, the above-described epoxy resin composition and the like are inexpensive and excellent in formability and moisture resistance, but have disadvantages such as a low glass transition point and a low elastic modulus, and a high heat shrinkage rate. Therefore, when forming the above-mentioned side wall portion, the dimensional accuracy is deteriorated due to the above-described thermal shrinkage rate, and the heat resistance and mechanical strength during subsequent use are reduced. It may cause problems such as looseness.

  On the other hand, since the thermosetting resin composition that satisfies the above-described requirements has a high glass transition point and a high elastic modulus and a small heat shrinkage rate, the above disadvantages can be sufficiently eliminated.

  As polyfunctional epoxy resin (A), O-cresol novolac type, biphenyl type epoxy resin, phenol aralkyl type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin, heterocyclic type epoxy resin, bisphenol A type An epoxy resin, a bisphenol F-type epoxy resin, a stilbene-type epoxy resin, a condensed ring aromatic hydrocarbon-modified epoxy resin, an alicyclic epoxy resin, and the like, and other generally known epoxy resins can be used in combination.

  The phenol resin curing agent (B) is not particularly limited as long as it has two or more phenolic hydroxyl groups in the molecule that can react with the epoxy group of the epoxy resin component. Specifically, novolak-type phenol resins obtained by reacting phenols such as phenol and alkylphenol with formaldehyde or paraformaldehyde, such as phenol novolak resins and cresol novolak resins, these modified resins such as epoxidized or butylated. Novolak-type phenol resins, dicyclopentadiene-modified phenol resins, para-xylene-modified phenol resins, condensates of phenols with benzaldehyde, naphthyl aldehyde, etc., such as phenol aralkyl resins, naphthol aralkyl resins, triphenol methane compounds, polyfunctional type A phenol resin etc. are mentioned. These may be used individually by 1 type, and 2 or more types may be mixed and used for them.

Among the phenol resin curing agents described above, a polyfunctional phenol represented by the following chemical formula 2 is preferable because high heat resistance and high dimensional accuracy can be obtained.

  The blending amount of the (B) component phenolic resin curing agent is the ratio of the epoxy group number (a) of the epoxy resin (A) to the phenolic hydroxyl group number (b) of the (B) component phenolic resin curing agent (a ) / (B) is preferably in the range of 0.5 to 1.5, more preferably in the range of 0.8 to 1.2. When (a) / (b) is less than 0.5, the moisture resistance reliability of the side wall part 34, which is a cured product, decreases, and when it exceeds 1.5, the strength of the cured product decreases.

  (C) As a hardening accelerator of a component, what is generally used for molded articles can be used. Examples include imidazoles, 1,8-diazabicyclo (5,4,0) undecene-7, triphenylphosphine, tetraphenylphosphonium / tetraphenylborate, urea-based curing accelerators, etc., of which N, N- ( Urea compounds such as 4-methyl-1,3-phenylene)-(N ′, N′-dimethylurea) and N, N-phenylene-bis (N ′, N′-dimethylurea) are more preferred.

  (D) The silica powder of a component can use a thing with a weight average particle diameter of 10-30 micrometers. When the average particle size is less than 10 μm, the fluidity is lowered and the moldability is impaired. On the other hand, when the average particle diameter exceeds 30 μm, the warpage and the step accuracy are lowered.

  Moreover, the thing of the ratio of the fused silica powder in a silica powder 80-100 mass% is used. If it is 80% by mass or less, fluidity and moldability are deteriorated. In addition to the fused silica powder, crystalline silica can be used.

  Furthermore, the compounding quantity in the whole resin composition of a silica powder shall be 80-90 mass%. When the blending amount of the silica powder is less than 80% by mass of the entire composition, the dimensional accuracy, warpage, moisture resistance, mechanical strength, etc. of the molded product are lowered. On the other hand, if it exceeds 90% by mass, the fluidity of the composition is lowered, the moldability becomes poor and practical use becomes difficult.

  Further, the maximum particle size of the fused silica powder contained in the silica powder is 105 μm or less, and the frequency value of the particle size distribution measured with a laser diffraction particle size distribution measuring device is a ratio of less than 6 μm of 15-30% by mass, The ratio of 6 to 20 μm is 25 to 35 mass%, the ratio of more than 20 μm is 40 to 50 mass%, and the weight-converted average particle diameter (d1) and the number-converted average particle diameter ( It is preferable that the ratio of d2) satisfies the relationship of 5.0 ≦ d1 / d2 ≦ 9.0. Thereby, the fluidity | liquidity of the resin composition at the time of hardening can fully be ensured, and a high moldability can be hold | maintained. As a result, the resin composition, that is, the side wall portion 34 can be kept sufficiently high in high dimensional accuracy, low warpage, low thermal expansion and high heat resistance.

  In addition, in the above-described thermosetting resin composition, within the range that does not inhibit the above-described effects, in addition to the above-described silica powder, alumina, zircon, calcium silicate talc, calcium carbonate, titanium white, bengara, silicon carbide, Powders such as boron nitride, beryllia, zirconia, beads obtained by spheroidizing these, single crystal fibers such as potassium titanate, silicon carbide, silicon nitride, alumina, and glass fibers can be used in combination. In addition, zinc tartrate having a flame retardant effect can also be used. These inorganic fillers can be used alone or in combination of two or more.

  Furthermore, in the above-described thermosetting resin composition, antimony trioxide and brominated epoxy resin that are generally blended in this type of composition within a range not inhibiting the above-described effects in addition to the above-described components. Flame retardants such as phosphorus compounds and metal hydroxides, coupling agents, synthetic waxes, natural waxes, release agents such as higher fatty acids and metal salts of higher fatty acids, colorants such as carbon black and cobalt blue, silicone oils, silicones Modifiers such as rubber, hydrotalcites, antimony-bismuth-based ion scavengers, and the like can be blended.

  As the coupling agent, an epoxy silane, amino silane, ureido silane, vinyl silane, alkyl silane, organic titanate, aluminum alcoholate, or the like is used. These can be used alone or in admixture of two or more. From the viewpoints of flame retardancy and curability, aminosilane coupling agents are preferable, and γ-aminopropyltrimethoxysilane, γ-aminopropyltriethoxysilane, γ-aminopropylmethyldimethoxysilane, γ- Aminopropylmethyl jetoxysila is preferred.

  In addition, generally known hardening accelerators can also be used in combination with the thermosetting resin composition.

The above-described thermosetting resin composition satisfies the above-described requirements, for example, a condition of a temperature of 175 ° C. and a shear stress of 1.23 × 10 ⁵ Pa in measurement using a Koka flow measuring device. The minimum melt viscosity (η1) at 5 is 100 Pa · S, and the resin composition has such a characteristic that the curing time at 175 ° C. is 30-60 seconds. That is, in the vicinity of the melting temperature when forming the side wall portion 34 using the resin composition, high fluidity and curing in a short time are possible, so that the dimensional accuracy of the side wall portion 34 can be improved. it can.

  Further, the cured product obtained by heating at a temperature of 200 ° C. for 1 hour has a glass transition point by the DMA method of 200 ° C. or higher, an elastic modulus at 150 ° C. of 10 GPa · S or higher, and a molding shrinkage rate of 0. .05% or less.

  In preparing the thermosetting resin composition, the above-described (A) polyfunctional epoxy resin, (B) phenol resin curing agent, (C) curing accelerator, (D) weight average particle size 10-30 μm. After mixing the silica powder and various components blended as necessary with a mixer or the like, the mixture is heated, melted and mixed with a hot roll, a gluer, etc., and then cooled and solidified. It can be crushed into a size to form a molding material.

  In addition, the flexible substrate 31 and the glass member 35 can be comprised from a general purpose thing.

  FIG. 4 is a block diagram showing an example of the camera module of the present invention. In the camera module 50 shown in FIG. 4, the lens unit 40 is connected on the module substrate 30 shown in FIG. The lens unit 40 is attached to the lens holder 44 so that the lens 43 faces the glass member 35 of the module substrate 30.

  Further, a step 44A is formed in the lens holder 40, and a pin or screw 45 is hit so as to penetrate from the step 44A to the side wall 34 of the module substrate 30, and the module substrate 30 and the lens holder 40 are connected. It is connected.

  The camera module 50 shown in FIG. 4 can be sufficiently thinned based on the characteristics of the module substrate 30 shown in FIG.

  Further, the module substrate 30 and the lens unit 40 are connected by penetrating the step 44A of the lens holder 44 and hitting the pin or screw so as to reach the side wall portion 34 of the module substrate 30. The process can be greatly simplified. Therefore, the cost for manufacturing the camera module can be reduced.

  Further, since the module substrate 30 includes the side wall portion 34 made of resin and does not use a ceramic member, it is possible to suppress high costs due to the material cost and processing cost. Therefore, the cost reduction of the camera module 50 can be realized with the cost reduction of the module substrate 30.

  In addition, since a decrease in the manufacturing yield of the module substrate 30 due to dust adhesion can be suppressed, a decrease in the manufacturing yield of the camera module 50 can also be suppressed at the same time.

  The module substrate 30 uses a thermosetting resin composition as described above, and the cured product obtained by heating at 200 ° C. for 1 hour has a glass transition point by the DMA method of 200 ° C. or higher. When satisfying the requirements that the elastic modulus at 150 ° C. is 10 GPa · S or more and the molding shrinkage is 0.05% or less, the parallelism is within 20 μm, the flatness is within 10 μm, and the dimensional accuracy is 20 μm. A camera module that is within the range can be manufactured.

  EXAMPLES Next, although an Example demonstrates this invention further in detail, this invention is not limited to these Examples at all. In the following description, “parts” means “parts by weight” unless otherwise specified.

  In this example, a module substrate as shown in FIG. 3 was produced. Note that a polyimide substrate having a thickness of 0.3 mm was used as the flexible substrate, and a transparent glass member having a thickness of 0.5 mm was used as the glass member. A wiring pattern made of 18 μm thick copper foil was formed on the main surface of the polyimide substrate.

  In addition, the side wall part which supports a glass member was comprised from the thermosetting resin composition which satisfies the said Chemical formula 1 by the method as shown below.

  72% by mass of spherical silica powder having an average particle size of 15 μm (trade name MRS-2212 manufactured by Tatsumori Co., Ltd.), 10% by mass of crystalline silica powder having an average particle size of 20 μm (trade name MCC-4 manufactured by Tatsumori Co., Ltd.), epoxy resin (Japan) 8.7% by mass, trade name EOCN-502H, manufactured by Kayaku Co., Ltd., 2.9% by mass, phenol-borac resin (trade name YDB-400, manufactured by Meiwa Kasei Co., Ltd.), urea-based curing accelerator N, N- (4-methyl- 1.3-phenylene) -bis (N ′, N′-dimethylurea) (trade name UD-34, manufactured by San Apro Co., Ltd., melting point 181 ° C., nitrogen content 21% by weight) 0.1% by mass, tetrabromobinphenol A type epoxy Resin (trade name YDB-400, manufactured by Toto Kasei Co., Ltd.) 1.3 mass%, carnauba wax 0.2 mass%, carbon black (trade name MA-600, manufactured by Mitsubishi Chemical Corporation) 0.15 mass%, antimony trioxide 0% by mass, and γ-anili It was mixed with 0.1 wt% silane at ambient temperature, then heated and kneaded at 90-950 ℃. After cooling, it was pulverized to obtain a thermosetting resin composition.

  Next, the thermosetting resin composition is subjected to a mold temperature of 175 ° C., a molding pressure of 6.9 MPa, a curing time of 2 minutes by a transfer molding machine, and then post-cured at 175 ° C. for 4 hours. It was set as the said side wall part. The side wall portion thus obtained had a glass transition point of 232 degrees, an elastic modulus at 150 ° C. of 20 GPa, and a molding shrinkage of 0.01%. Moreover, these values were obtained by preparing a stick-like sample from a cured product that was thermoformed at 200 ° C. for 1 hour, and measuring the temperature with DMA at a temperature increase of 10 ° C./min.

  While the present invention has been described in detail based on the above specific examples, the present invention is not limited to the above specific examples, and various modifications and changes can be made without departing from the scope of the present invention.

It is a block diagram which shows an example of the conventional module board for cameras. It is a block diagram which shows the other example of the conventional camera module board | substrate. It is a block diagram which shows an example of the module board of this invention. It is a block diagram which shows an example of the camera module of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 30 Module substrate 31 Flexible substrate 32 Imaging element 33 Wire 34 Side wall part 35 Glass member 40 Camera module 43 Lens 44 Lens holder 45 Pin or screw

Claims (8)

On the main surface, a flexible substrate on which a wiring pattern for mounting an imaging element is formed;
A glass member arranged to face the main surface of the flexible substrate;
A side wall made of resin that extends substantially vertically above the main surface of the flexible substrate and supports the glass member;
A module substrate comprising:   The module substrate according to claim 1, wherein the side wall portion is made of a thermosetting resin. The thermosetting resin is
(A) Heat having, as essential components, a polyfunctional epoxy resin having a structural formula represented by Chemical Formula 1, (B) a phenol resin curing agent, (C) a curing accelerator, and (D) silica powder having a weight average particle size of 10-30 μm. A curable resin composition comprising:
The (D) silica powder is contained in the thermosetting resin composition in a proportion of 80 to 90% by mass, and the proportion of the fused silica powder in the (D) silica powder is 80 to 100% by mass. The module substrate according to claim 2, wherein:

The module substrate according to claim 3, wherein the (B) phenol resin curing agent is a polyfunctional phenol represented by Chemical Formula 2.

  The cured product obtained by heating the thermosetting resin composition at a temperature of 200 ° C. for 1 hour has a glass transition point in the DMA method of 200 ° C. or higher and an elastic modulus at 150 ° C. of 10 GPa · S or higher. The module substrate according to any one of claims 2 to 4, wherein a molding shrinkage ratio is 0.05% or less. The module substrate according to any one of claims 1 to 5,
A lens unit connected to the module substrate;
A camera module characterized by comprising:   The camera module according to claim 6, wherein the module substrate and the lens unit are connected by pins or screws. 8. The camera module according to claim 6, wherein the parallelism is within 20 [mu] m, the flatness is within 10 [mu] m, and the dimensional accuracy is within 20 [mu] m.

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