JP2009176360A - Manufacturing method of magnetic recording medium - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a magnetic recording medium by which recessed parts of a recording layer of a recessed and projecting pattern are filled up with a filler, a surface can be satisfactorily flattened and satisfactory production efficiency is achieved. <P>SOLUTION: A first coating material 42 and a second coating material 43 are film-deposited on the filler 36 and the first coating material 42 is etched so that an upper part of a recording element 20A in the filler 36 is exposed and the first coating material 42 remains on each recessed part 34 while etching of the first coating material 42 on each recessed part 34 is prevented or suppressed by the second coating material 43 on each recessed part 34. The filler 36 is then removed until an upper surface of a partition film 21 on the recording element 20A (when the recording element has no partition film 21, an upper surface of the recording element 20A) is exposed by using a dry etching method by which an etching rate of the filler 36 is higher than an etching rate of the first coating material 42. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  Conventionally, a magnetic recording medium such as a hard disk has been remarkably improved in surface recording density by improving the fineness of magnetic particles constituting the recording layer, changing the material, miniaturizing the head processing, and the like. Although the improvement in surface recording density is expected, the recording limit of the magnetic head, the recording of incorrect information on the track adjacent to the recording target track due to the expansion of the recording magnetic field of the magnetic head, the crosstalk during playback, etc. However, the improvement of the surface recording density by the conventional improvement method has reached the limit.

On the other hand, as a candidate for a magnetic recording medium capable of further improving the surface recording density, a discrete track medium in which a recording layer is formed in a concavo-convex pattern and a convex portion of the concavo-convex pattern constitutes a recording element, or a patterned Media has been proposed. On the other hand, in a magnetic recording medium such as a hard disk, the flatness of the surface is important in order to stabilize the flying height of the head and obtain good recording / reproducing characteristics. Therefore, it is preferable to fill the recesses between the recording elements with the filler, and to remove the excess filler on the recording layer to flatten the upper surfaces of the recording elements and the filler. As the filler, it has been proposed to use SiO ₂ or DLC (Diamond Like Carbon) which is non-magnetic and has high hardness (see, for example, Patent Document 1). DLC is also used as a material for a protective film of a magnetic recording medium.

A sputtering method or the like can be used as a method for forming a SiO ₂ filler to fill the recesses. A CVD (Chemical Vapor Deposition) method or the like can be used as a method for forming a DLC filler and filling the recesses. CMP (Chemical Mechanical Polishing) or dry etching can be used as a method for planarizing the surface by removing excess filler (see, for example, Patent Document 2). Since DLC has high hardness and it is difficult to remove the DLC filler by CMP, when DLC is used as the filler, it is preferable to remove excess filler by dry etching. Even when the filler is a material other than DLC such as SiO ₂ , the excess filler can be removed by dry etching. The filler is formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer, but dry etching generally tends to etch the convex portion selectively faster than the concave portion.

JP 2003-109210 A JP 2000-195042 A

  However, depending on the material of the filler (for example, a material such as DLC), the effect of selectively etching the convex portion faster than the concave portion by dry etching is low. If the level difference is large, the surface may not be sufficiently flattened even if excess filler is removed by dry etching.

  Incidentally, the filler formed on the recording layer of the concavo-convex pattern has a tendency to gradually decrease the unevenness of the surface as the film thickness is increased. Although it is possible to reduce the unevenness of the filler filling film, it takes a long time to deposit the filler and remove the excess filler by depositing the filler thickly. Production efficiency decreases. Also, the amount of filler required is increased. As a result, there is a problem that the cost of the magnetic recording medium is increased.

  In addition, if a material such as DLC is to be formed thickly, the filler may be formed on a part of the workpiece, for example, the filler may be peeled off from the surface of the workpiece or hardly adhere to the surface of the workpiece. There is a problem that the film cannot be formed.

  Also, by forming a thick filler material, the amount of excess filler material deposited on the recording layer increases, so that the filler material removed from the workpiece and the filler material attached to the vacuum chamber can be removed. There is a problem that the burden of maintenance increases.

  The present invention has been made in view of the above problems, and provides a method for producing a magnetic recording medium with high production efficiency, in which the concave portions of the recording layer of the concave-convex pattern are filled with a filler, and the surface can be sufficiently flattened. The purpose is to provide.

  In the present invention, a filler is formed on a substrate and a workpiece having a recording layer formed on the substrate in a predetermined concavo-convex pattern, and the convex portions of the concavo-convex pattern constitute recording elements. The concave portion of the concave / convex pattern is filled with, a first covering material is formed on the filling material, a second covering material is formed on the first covering material, and a portion of the first covering material above the recording element And the second coating material is etched so that the second coating material remains on the concave portions of the concavo-convex pattern, the portion of the filler above the recording element is exposed, and the first coating material is The first coating material is etched so that it remains on the concave portions of the concave-convex pattern, and the filler is removed until the upper surface of the recording element is exposed by a dry etching method in which the etching rate of the filler is higher than the etching rate of the first coating material. Depending on the method of manufacturing the magnetic recording medium to be etched It is those that have achieved the serial purpose.

  The present invention also provides a substrate, a recording layer formed on the substrate in a predetermined concavo-convex pattern, the convex portion of the concavo-convex pattern constituting the recording element, and a diaphragm formed on at least the upper surface of the recording element in the recording layer. A filler is formed on the workpiece, the concave portions of the concave / convex pattern are filled with the filler, a first coating material is formed on the filler, and a second coating is formed on the first coating material. Forming a film, etching the second coating material so that the upper part of the recording element in the first coating material is exposed, and the second coating material remains on the concave portion of the concave-convex pattern; The first coating material is etched such that the upper part of the recording element is exposed and the first coating material remains on the concave portion of the concave / convex pattern, and the etching rate of the filler is higher than the etching rate of the first coating material. The high dry etching method ensures that the gap above the recording element The method for producing a magnetic recording medium in which the upper surface of etching the filling material until exposing is obtained by achieving the above object.

  In this way, by forming the second covering material on the first covering material and etching the second covering material, the unevenness level difference on the surface of the second covering material is made higher than the unevenness level difference on the surface of the first covering material. Can also be reduced. Accordingly, the second coating material on the concave portion of the concave / convex pattern prevents or suppresses the etching of the first coating material on the concave portion, and the portion of the filler on the recording element is exposed, and the first coating material The first covering material can be etched so that remains on the concave portions of the concave-convex pattern. Next, by removing the filler until the upper surface of the recording element (or the upper surface of the diaphragm above the recording element) is exposed by a dry etching method in which the etching rate of the filler is higher than the etching rate of the first covering material, Excess filler on the recording element can be removed while preventing or suppressing the etching of the filler filling the recess with the first coating material on the recess of the pattern. Thereby, the surface can be sufficiently planarized.

  That is, the above-described object can be achieved by the following present invention.

(1) A filler is formed on a substrate and a workpiece having a recording layer in which a convex portion of the concave-convex pattern forms a recording element, and the convex portion of the concave-convex pattern forms a recording element. Filler film forming step for filling concave portions of the concavo-convex pattern, first coating material film forming step for forming a first coating material on the filler, and a second coating material on the first coating material A second covering material film forming step for forming a film; and a portion of the first covering material on the recording element is exposed, and the second covering material remains on the concave portion of the uneven pattern. A second covering material etching step for etching the second covering material, and a portion of the filler above the recording element is exposed, and the first covering material remains on the concave portion of the concavo-convex pattern. A first covering material etching step for etching the first covering material; And a filler etching step of etching the filler until the upper surface of the recording element is exposed by a dry etching method in which the etching rate of the filler is higher than the etching rate of the first covering material. A method for manufacturing a recording medium.

(2) The method of manufacturing a magnetic recording medium according to (1), wherein a recording element upper surface portion removing step is provided after the filler etching step to remove the upper surface portion of the recording element by a dry etching method.

(3) A substrate, a recording layer formed on the substrate in a predetermined concavo-convex pattern, and a convex portion of the concavo-convex pattern constituting a recording element, and a covering formed on at least the upper surface of the recording element in the recording layer Filler film forming step of forming a filler material on the workpiece and filling the concave portions of the concave / convex pattern with the filler; and first coating material film forming step of forming a first coating material on the filler A second covering material film forming step for forming a second covering material on the first covering material, a portion of the first covering material above the recording element is exposed, and the second covering material is exposed. A second covering material etching step for etching the second covering material so that the covering material remains on the concave portion of the uneven pattern; and a portion of the filler on the recording element is exposed; 1 so that the covering material remains on the concave portion of the concave-convex pattern A first covering material etching step for etching the first covering material, and an upper surface of the diaphragm on the recording element is exposed by a dry etching method in which an etching rate of the filler is higher than an etching rate of the first covering material. And a filler etching step of etching the filler until it is completed.

(4) A method of manufacturing a magnetic recording medium according to (3), wherein a film removing step for removing a film formed on the upper surface of the recording element by a dry etching method is provided after the filler etching step. .

(5) In any one of (1) to (4), in the filler etching step, a portion remaining on the concave portion of the concave / convex pattern in the first covering material is removed to flatten the surface of the workpiece. A method for manufacturing a magnetic recording medium, comprising:

(6) In any one of (1) to (4), in the filler film forming step, the concave portion of the concave / convex pattern is partially filled with the filler, and the first covering material film forming step performs the first process. The concave portion of the concave / convex pattern is further filled with a coating material, and the filler is etched so that the first coating material remains on the concave portion of the concave / convex pattern in the filler etching step. A method for manufacturing a magnetic recording medium, characterized in that:

(7) In any one of (1) to (4), in the filler etching step, the filler is etched so that the first coating material remains on the concave portion of the concave / convex pattern, and the filler etching is performed. After the step, a first covering material removing step of flattening a surface of the workpiece by removing a portion remaining on the concave portion of the uneven pattern in the first covering material by a dry etching method is provided. A method of manufacturing a magnetic recording medium.

(8) In any one of (1) to (7), in the first coating material etching step, the etching rate of the first coating material is equal to or higher than the etching rate of the second coating material. A method of manufacturing a magnetic recording medium, characterized by using a method.

(9) In any one of (1) to (8), in the first coating material etching step, the first coating material is etched so that the second coating material remains on the concave portion of the concave / convex pattern. A method of manufacturing a magnetic recording medium.

(10) In any one of (1) to (9), the filler is DLC, and a processing gas containing either oxygen or nitrogen is used in the filler etching step. Manufacturing method.

(11) The magnetic recording medium according to any one of (1) to (10), wherein the second coating material is DLC, and a processing gas containing a rare gas is used in the first coating material etching step. Manufacturing method.

(12) The method for manufacturing a magnetic recording medium according to any one of (1) to (11), wherein the first coating material etching step also serves as the second coating material etching step.

  In the present application, the “recording layer formed in the concavo-convex pattern” means a recording layer in which the continuous recording layer is divided into a predetermined pattern and the convex portions constituting the recording element are completely separated from each other, and in the data region. A recording layer in which convex portions separated from each other are continuous in the vicinity of the boundary between the data area and the servo area, or continuously on a part of the substrate, for example, a spiral spiral recording layer. The recording layer to be formed, formed separately on the top surface of the convex portion and the bottom surface of the concave portion of the layer under the concave / convex pattern, and the portion formed on the top surface of the convex portion constitutes the recording element, the concave portion is thick A recording layer formed halfway in the vertical direction and continuous at the bottom, and a continuous recording layer formed in a concavo-convex pattern following the layer below the concavo-convex pattern are also used to include the recording layer.

  Further, in this application, “filling the concave / convex pattern with the filler” means that the concave / convex pattern of the recording layer is completely filled with the filler, and the concave / convex pattern with the filler is partially filled. It shall be used with the meaning including filling.

In this application, the term “DLC” is used to mean a material having carbon as a main component and having a carbon bond of SP ³ hybrid orbital. The “carbon-based material” means a material in which the ratio of the number of carbon atoms to the total number of atoms constituting the material is 50% or more.

  In addition, the term “magnetic recording medium” in the present application is not limited to a hard disk, a floppy (registered trademark) disk, a magnetic tape, or the like that uses only magnetism for recording and reading information, and MO (Magneto) using both magnetism and light. It is used in the meaning including a magneto-optical recording medium such as Optical) and a heat-assisted recording medium using both magnetism and heat.

  According to the present invention, it is possible to realize a method for manufacturing a magnetic recording medium with high production efficiency, in which the concave portion of the recording layer of the concavo-convex pattern is filled with the filler, and the surface can be sufficiently flattened.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

  In the first embodiment of the present invention, the starting body of the workpiece 10 shown in FIG. 1 is subjected to processing such as dry etching, and a predetermined line and space pattern (data track pattern) as shown in FIGS. And a method of manufacturing a magnetic recording medium in which a continuous recording layer is processed into a servo pattern (not shown), and a technique for flattening a surface by forming a concave portion of a concave-convex pattern recording layer with a filler. It has the characteristics. Other technologies will not be described as appropriate because they are not considered particularly important for understanding the first embodiment.

  As shown in FIG. 1, the starting body of the workpiece 10 is a substrate 12, a soft magnetic layer 16, an alignment layer 18, a continuous recording layer 20, a diaphragm 21, a first mask layer 22, and a second mask layer 24. And these layers are formed on the substrate 12 in this order.

The substrate 12 has a substantially disk shape. As a material of the substrate 12, glass, Al, Al ₂ O ₃ or the like can be used.

  The soft magnetic layer 16 has a thickness of 50 to 300 nm. As the material of the soft magnetic layer 16, an Fe alloy, a Co alloy, or the like can be used.

  The alignment layer 18 has a thickness of 2 to 40 nm. As the material of the alignment layer 18, a nonmagnetic CoCr alloy, Ti, Ru, a laminate of Ru and Ta, MgO, or the like can be used.

The recording layer 20 has a thickness of 5 to 30 nm. As a material of the recording layer 20, a CoCr alloy such as a CoCrPt alloy, an FePt alloy, a laminate thereof, a material in which ferromagnetic particles such as CoPt are included in a matrix in an oxide material such as SiO ₂ , etc. Can be used.

The diaphragm 21 has a thickness of 1 to 5 nm. _SiO 2 as the material of the diaphragm 21, MgO, ITO (indium tin oxide), can be used _{TaSi, Ti, TiN, TiO 2} , SiC, a DLC or the like. Moreover, Si, Ge, C (carbon), Mn, Ta, Nb, Mo, Zr, W, Al, Ni, Cu, Cr, Co, or the like or a compound thereof may be used as the material of the diaphragm 21.

  The first mask layer 22 has a thickness of 3 to 50 nm, for example. As a material of the first mask layer 22, for example, C (carbon) such as DLC can be used.

The second mask layer 24 has a thickness of 2 to 30 nm, for example. As the material of the second mask layer 24, for example, Ni, Cu, Cr, Al, Al ₂ O ₃ , Ta, or the like can be used.

  The magnetic recording medium 30 is a disk-shaped perpendicular recording type discrete track medium. The recording layer 20 has a concavo-convex pattern shape in which the continuous recording layer 20 is divided into a number of concentric arc-shaped recording elements 20A at fine intervals in the radial direction in the data region, and FIGS. 2 and 3 show this. ing. The recording layer 20 is divided into a large number of recording elements in a servo area with a predetermined servo pattern (not shown). The recesses 34 between the recording elements 20A are filled with a filler 36, and a protective layer 38 and a lubricating layer 40 are formed on the recording elements 20A and the filler 36 in this order.

Examples of the filler 36 include C (carbon) such as DLC, Si, SiO ₂ , SiC, TaSi, TiN, TiO ₂ , metals such as Ta, Ti, Al, Ge, Nb, Mo, Zr, and W, or the like A metal alloy or the like can be used. DLC includes, for example, tetrahedral amorphous carbon that does not contain hydrogen, amorphous carbon that contains hydrogen, a mixture of these, and those that have a structure such as polyethylene or polyacetylene partially or locally. The filler 36 is different from the material of the diaphragm 21.

The protective layer 38 has a thickness of 1 to 5 nm. As a material of the protective layer 38, DLC can be used. When the filler 36 is DLC, the DLC constituting the protective layer 38 and the DLC constituting the filler 36 may be the same type or different types. For example, DLCs having different carbon bond ratios in the SP ³ hybrid orbital may be used.

  The lubricating layer 40 has a thickness of 1 to 2 nm. As the material of the lubricating layer 40, PFPE (perfluoropolyether) can be used.

  Next, a method for manufacturing the magnetic recording medium 30 will be described with reference to the flowchart shown in FIG.

  First, a processing starting body of the workpiece 10 shown in FIG. 1 is prepared (S102). A processing starting body of the workpiece 10 is a soft magnetic layer 16, an orientation layer 18, a recording layer 20 (a continuous film before being processed into a concavo-convex pattern), a diaphragm 21, a first mask layer 22, on a substrate 12. The second mask layer 24 is obtained by forming the second mask layer 24 in this order by a sputtering method or the like.

  Next, a resin material is applied on the second mask layer 24 of the workpiece 10 by a spin coating method, and a recording layer 20 is formed on the resin material by an imprint method using a stamper (not shown) as shown in FIG. The concavo-convex pattern corresponding to the concavo-convex pattern is transferred to form the resin layer 26 having the concavo-convex pattern (S104). The resin layer 26 at the bottom of the recess is removed by ashing. As the imprinting method, optical imprinting using ultraviolet rays, thermal imprinting, or the like can be used. In the case of optical imprinting, an ultraviolet curable resin or the like can be used as the material of the resin layer 26. In the case of thermal imprinting, a thermoplastic resin or the like can be used as the material of the resin layer 26. The thickness of the resin layer 26 (thickness of the convex portion) is, for example, 30 to 300 nm. Note that a photosensitive resist or electron beam resist may be used as the resin material, and the concavo-convex pattern resin layer 26 corresponding to the concavo-convex pattern of the recording layer 20 may be formed by a photolithography or electron beam lithography technique.

Next, the rare gas using IBE (Ion Beam Etching) or RIE (Reactive Ion Etching) or the like, such as Ar, removing the second mask layer 24 of the concave bottom, further, _{O 2} gas, _{N 2} gas or NH The first mask layer 22 at the bottom of the recess is removed by IBE or RIE using _three gases, and the diaphragm 21 and the recording layer 20 at the bottom of the recess are removed by IBE or RIE using a rare gas such as Ar ( S106). In this application, even when a gas that does not chemically react with an object to be etched such as a rare gas is used, the term RIE is used when etching is performed using an RIE apparatus. Thereby, as shown in FIG. 6, the recording layer 20 having the concavo-convex pattern divided into a large number of recording elements 20A is formed. The diaphragm 21 remains on the recording element 20A. That is, the workpiece 10 having the diaphragm 21 formed on the upper surface of the recording element 20A is obtained. Since the first mask layer 22 may remain on the diaphragm 21, the first mask remaining on the diaphragm 21 by IBE or RIE using O ₂ gas, N ₂ gas, or NH ₃ gas. Layer 22 is completely removed.

Next, as shown in FIG. 7, a filler 36 is formed on the workpiece 10 and the recess 34 is filled with the filler 36 (S <b> 108). When the filler 36 is DLC, the filler 36 is formed on the workpiece 10 by the CVD method while applying a bias voltage to the workpiece 10. As a raw material gas for CVD, methane, ethylene, toluene or the like can be used. When the filler 36 is a material other than DLC such as SiO _{2, the} filler 36 may be formed on the workpiece 10 by another film forming method such as a sputtering method or a bias sputtering method. The filler 36 is formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20. In this step (S108), the recess 34 may be completely filled with the filler 36, or the recess 34 may be partially filled with the filler 36. The height of the upper surface of the filling material 36 filling the recess 34 is preferably −4 to +10 nm with respect to the height of the upper surface of the diaphragm 21 above the recording element 20A. More preferably, the height of the upper surface substantially coincides with the height of the upper surface of the diaphragm 21 above the recording element 20A. The “height of the upper surface of the filler 36” is the position of the upper surface of the filler 36 in the thickness direction of the substrate 12. The same applies to “the height of the upper surface of the diaphragm 21 above the recording element 20A”. Further, “-” means that the upper surface of the filler 36 filling the recess 34 is closer to the substrate 12 than the upper surface of the diaphragm 21 on the recording element 20A. Further, “+” means that the upper surface of the filler 36 filling the concave portion 34 is farther from the substrate 12 than the upper surface of the diaphragm 21 on the recording element 20A. Further, “the height of the upper surface of the filler 36 is substantially the same as the height of the upper surface of the diaphragm 21 above the recording element 20A” means that the difference in height between the upper surfaces of the both is within a range of ± 4 nm. Means that.

Next, as shown in FIG. 8, the first covering material 42 is formed on the filler 36 of the workpiece 10 by sputtering or the like (S110). The first covering material 42 is formed in a concavo-convex pattern following the concavo-convex pattern of the filler 36 formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20. When the concave portion 34 is partially filled with the filler 36 in the filler film forming step (S108), the concave portion 34 is further filled with the first covering material 42 in this step (S110). The thickness of the first covering material 42 to be formed is 0.1 to 10 nm. The first coating material _{42, Si, SiO 2, SiC} , Ta, TaSi, Ti, TiN, TiO 2, Nb, Mo, Zr, W, Al, Mn, Ni, Cu, Cr, Co, C ( carbon) Etc. can be used. The first covering material 42 is different from the filler 36.

Next, as shown in FIG. 9, a second covering material 43 is formed on the first covering material 42 of the workpiece 10 (S112). The second covering material 43 is formed in a concavo-convex pattern following the concavo-convex pattern of the first covering material 42 formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20 and the concavo-convex pattern of the filler 36. In the present application, “the second covering material 43 is formed following the uneven pattern of the recording layer 20” means that the second covering material 43 has an uneven pattern with the same contour as the contour of the uneven pattern of the recording layer 20. It is not limited to the case where the film is formed, and the second covering material 43 is formed in a contoured concave / convex pattern in which the width of the convex or concave portion or the level difference of the concave / convex is reduced or enlarged with respect to the contour of the concave / convex pattern of the recording layer. It will be used for the purpose of including The same applies to “the filler 36 is formed following the uneven pattern of the recording layer 20” and “the first covering material 42 is formed following the uneven pattern of the recording layer 20”. The thickness of the second covering material 43 to be formed is 20 to 130 nm. As the second covering material 43, the same material as the filler 36 can be used. Specifically, C (carbon) such as DLC, Si, SiO ₂ , SiC, TaSi, TiN, TiO ₂ , metals such as Ta, Ti, Ge, Nb, Mo, Zr, W, or such metals A material such as an alloy can be used. Further, a material such as Al, Mn, Ni, Cu, Cr, or Co may be used as the second covering material 43, but a material different from the first covering material 42 is selected. When the second covering material 43 is DLC, the second covering material 43 is formed on the workpiece 10 by the CVD method. When the second covering material 43 is a material other than DLC such as SiO ₂ , the second covering material 43 is formed on the workpiece 10 by another film forming method such as a sputtering method or a bias sputtering method. May be. When both the filler 36 and the second covering material 43 are DLC, the second covering material 43 and the filling material 36 may be the same type of DLC or different types of DLC. The second covering material 43 is also formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20. Thus, it becomes smaller than the uneven step on the upper surface of the first covering material 42. In order to suppress the uneven step on the upper surface of the second covering material 43 to be small, it is preferable to form the second covering material 43 while applying a bias voltage to the workpiece 10, and to fill the second covering material 43. It is preferable to form a film thicker than the material 36.

Next, the second covering material 43 is etched so that a portion of the first covering material 42 above the recording element 20A is exposed and the second covering material 43 remains on the concave portion 34 of the uneven pattern (the first covering material 42). 2 covering material etching step), and a dry etching method in which the etching rate of the first covering material 42 is the same as or higher than the etching rate of the second covering material 43, as shown in FIG. The first covering material 42 is etched so that the upper portion of 20A is exposed and the first covering material 42 remains on the concave portion 34 of the uneven pattern (first covering material etching step) (S114). Note that “the first covering material 42 remains on the concave portion 34 of the concavo-convex pattern” means that part or all of the first covering material 42 is in the concave portion 34 (from the level of the upper surface of the recording element 20A in the concave portion 34). Also includes a case where it remains in the portion near the substrate 12). In this step, it is preferable to etch the second covering material 43 and the first covering material 42 until the filler 36 on the recording element 20A is substantially completely exposed. Since the uneven step on the top surface of the second covering material 43 is smaller than the uneven step on the top surface of the first covering material 42 at the end of the second covering material film forming step (S112), While the second coating material 43 prevents or suppresses the etching of the first coating material 42 on the concave portion 34, a portion of the first coating material 42 above the recording element 20 </ b> A is exposed, and the second coating material 43. The second covering material 43 is etched such that the second covering material 43 remains on the concave / convex pattern 34, the portion of the filler 36 above the recording element 20 </ b> A is exposed, and the first covering material 42 has the concave / convex pattern. The first covering material 42 can be etched so as to remain on the surface 34. In this way, even if the first covering material 42 is thin, the portion of the first covering material 42 above the recording element 20A can be removed so that the first covering material 42 remains on the concave portion 34 of the uneven pattern. . In order to prevent or suppress the etching of the first covering material 42 on the concave portion 34, as shown in FIG. 10, the second covering material at the end of this step (at the end of the first covering material etching step). 43 preferably remains on the concave portion 34 of the concave-convex pattern of the recording layer 20. As the dry etching method, for example, as a processing gas, a rare gas such as Ar, Kr, or Xe, a mixed gas of O ₂ gas, N ₂ gas, or NH ₃ gas and a rare gas, CH ₄ , C ₂ F ₆ , C _{4 is used.} F (fluorine) -based gas such as F ₈ , SF ₆ , CHF ₃ , mixed gas of rare gas and F-based gas, mixed gas of O ₂ gas, N ₂ gas or NH ₃ gas and F-based gas was used. IBE or RIE can be used. C (carbon) such as DLC has a remarkably high etching rate for dry etching using O ₂ gas, N ₂ gas or NH ₃ gas, and a low etching rate for dry etching using rare gas. On the other hand, Si, W, Ta, Mo, Nb, Zr, etc. have a remarkably low etching rate for dry etching using O ₂ gas, N ₂ gas or NH ₃ gas, and the etching rate for dry etching using rare gas is Higher than DLC. Therefore, when the second coating material 43 is C (carbon) such as DLC and the first coating material 42 is Si, W, Ta, Mo, Nb, Zr, or the like, O ₂ gas, N _{2 is} used as a processing gas. The etching rate with respect to the first coating material 42 and the second coating material 43 can be adjusted by using a gas or a mixed gas of NH ₃ gas and a rare gas and adjusting the mixing ratio thereof. In addition, the second coating material 43 is first etched with only O ₂ gas, N ₂ gas, or NH ₃ gas until the portion of the first coating material 42 above the recording element 20A is exposed, and then the filling material with only the rare gas. The first covering material 42 may be etched until a portion of the recording element 20A at 36 is exposed. The incident angle of the processing gas is set to 90 ° with respect to the surface of the workpiece 10, for example. In the present application, the “incident angle of the processing gas” is used to mean an angle formed between the main traveling direction of the processing gas and the surface of the workpiece. For example, when the main traveling direction of the processing gas is parallel to the surface of the workpiece, the incident angle is 0 °. The arrows in FIG. 10 schematically show the incident direction of the processing gas. Thus, by setting the angle of incidence of the processing gas to be large, the etching rate is increased, which contributes to the improvement of production efficiency. In addition, RIE has lower straightness of the processing gas than IBE, and even if the incident angle of the processing gas is set to 90 ° perpendicular to the surface of the workpiece 10, some of the particles are processed. The workpiece 10 is irradiated in a direction inclined with respect to the surface 10. As a result, the convex portion is easily etched faster than the concave portion, and the filler 36 on the recording element 20 </ b> A is easily exposed from the first covering material 42 and the second covering material 43. Also, in the case of IBE, by setting the conditions so that the divergence angle of the processing gas is 5 ° or more, similarly, the convex portions are easily etched faster than the concave portions, and the filler 36 on the recording element 20A is formed. The first covering material 42 and the second covering material 43 are easily exposed. In addition, the uneven | corrugated level | step difference of the surface of the 2nd coating | covering material 43 or the 1st coating | covering material 42 reduces with progress of an etching.

Next, as shown in FIG. 11, the top of the recording element 20A is formed by a dry etching method in which the etching rate of the filler 36 is higher than the etching rate of the first covering material 42 and higher than the etching rate of the diaphragm 21. The filler 36 is etched so that the upper surface of the diaphragm 21 is exposed (S116). Examples of the dry etching method include a gas containing oxygen such as O ₂ gas as a processing gas, a gas containing nitrogen such as N ₂ gas or NH ₃ gas, CH ₄ , C ₂ F ₆ , C ₄ F ₈ , SF _6. F-type gas such as CHF ₃ , oxygen-containing gas such as O ₂ , N ₂ gas or mixed gas of nitrogen-containing gas such as NH ₃ gas and F-type gas, and rare gas such as Ar, Kr, and Xe The IBE or RIE used can be used. When the filler 36 is C (carbon) such as DLC and the first coating material 42 is Si, a gas containing oxygen such as O ₂ gas, nitrogen such as N ₂ gas or NH ₃ gas is used as a processing gas. The etching rate with respect to the filler 36, the first covering material 42, and the second covering material 43 can be adjusted by using a mixed gas of the gas and the rare gas and adjusting the mixing ratio thereof. The incident angle of the processing gas is set to 90 ° perpendicular to the surface of the workpiece 10, for example. The arrows in FIG. 11 schematically indicate the incident direction of the processing gas.

  In addition, when the 2nd coating material 43 remains on the recessed part 34 of an uneven | corrugated pattern at the completion | finish of a covering material etching process (S114), the 2nd coating material 43 on the recessed part 34 is in this process (S116). Completely removed. Further, the first covering material 42 on the recess 34 may be completely removed together with the filler 36 on the recording element 20A as shown in FIG. 11, or the first covering material 42 on the recess 34 may be removed. May remain. Note that “the first covering material 42 remains on the concave portion 34 of the concave / convex pattern of the recording layer 20” means that a part or all of the first covering material 42 is in the concave portion 34 (the recording element 20 </ b> A in the concave portion 34. It also includes the case where it remains in the portion closer to the substrate 12 than the level of the upper surface.

  When the first covering material 42 on the recess 34 is completely removed in this step (S116), it is preferable to immediately stop the etching when the first covering material 42 on the recess 34 is completely removed. . The etching rate of the filler 36 in this step (S116) is preferably 10 times or less than the etching rate of the first covering material 42.

  In the filler film forming step (S108), when the filler material 36 is formed on the concave portion 34 up to the level of the upper surface of the diaphragm 21 or above, the upper portion of the concave portion 34 at the end of this step (S116). It is preferable that the height of the upper surface of the filler 36 substantially coincides with the height of the upper surface of the diaphragm 21 above the recording element 20A. Note that “the height of the upper surface of the filler 36 is substantially equal to the height of the upper surface of the diaphragm 21” means that the difference in height between the upper surfaces of the fillers is within a range of ± 4 nm.

  On the other hand, when the filler 36 is deposited on the recess 34 only below the level of the upper surface of the diaphragm 21 in the filler deposition step (S108), the first covering material 42 is formed in this step (S116). The filler 36 is etched so as to remain on the recess 34, and at the end of this step (S116), the height of the upper surface of the first covering material 42 on the recess 34 and the upper surface of the diaphragm 21 on the recording element 20A. It is preferable that the heights of these are substantially the same. Note that “the height of the upper surface of the first covering material 42 substantially coincides with the height of the upper surface of the diaphragm 21” means that the difference in height between the upper surfaces of the first covering material 42 is within a range of ± 4 nm. By adjusting the etching rate for the filler 36, the first covering material 42, and the second covering material 43 as described above, the upper surface of the filling material 36 on the recessed portion 34 or the first covering material 42 on the recessed portion 34 is adjusted. The height of the upper surface and the height of the upper surface of the diaphragm 21 above the recording element 20A can be made substantially coincident.

  When the first covering material 42 remains on the concave portion 34 of the concave / convex pattern of the recording layer 20, the excess filler 36 on the recording element 20 </ b> A can be removed without etching the filler 36 in the concave portion 34. The first covering material 42 may remain so as to completely cover the upper portion of the concave portion 34, or may remain so as to partially cover the upper portion of the concave portion 34.

  Next, as shown in FIG. 12, the diaphragm 21 on the recording element 20A and the filler 36 on the recess 34 are etched by dry etching to remove the diaphragm 21 on the recording element 20A (S118). . When the first covering material 42 remains on the upper portion of the recess 34 at the end of the filler etching step (S116), the first covering material 21 on the recording element 20A and the first covering material on the recess 34 are formed by dry etching. 42 is etched. That is, when the first covering material 42 remains on the upper portion of the recess 34 at the end of the filling material etching step (S116), this step (S118) removes the diaphragm 21 on the recording element 20A and the first covering material. It also serves as a first covering material removing step of removing the portion remaining on the concave portion 34 in 42 to flatten the surface of the workpiece 10. When the surface of the workpiece 10 is sufficiently flattened at the end of the filler etching step (S116), the etching rate of the filler 36 or the first covering material 42 and the etching rate of the diaphragm 21 are substantially equal. A dry etching method may be used. On the other hand, at the end of the filler etching step (S114), the height of the upper surface of the filler 36 or the first covering material 42 of the concave portion 34 of the concave-convex pattern of the recording layer 20 and the height of the upper surface of the diaphragm 21 above the recording element 20A. If there is a step between the etching rate of the filler 36 or the first covering material 42 and the etching rate of the diaphragm 21, a dry etching method in which the step is eliminated or sufficiently reduced is used. Use it. As the dry etching method, for example, IBE or RIE using a rare gas such as Ar, Kr, or Xe or a mixed gas in which a rare gas and a reactive gas are mixed as a processing gas can be used. In addition, the incident angle of the processing gas is set to 90 ° perpendicular to the surface of the workpiece 10, for example. The arrows in FIG. 12 schematically show the incident direction of the processing gas. As a result, the upper surface of the recording element 20A and the upper surface of the filler 36 filling the concave portion 34 are exposed, and their heights are substantially equal. That is, the surface of the workpiece 10 is sufficiently flattened.

  Next, the protective layer 38 is formed on the recording element 20A and the filler 36 by the CVD method (S120). Further, the lubricating layer 40 is applied on the protective layer 38 by dipping (S122). As a result, the magnetic recording medium 30 shown in FIGS. 2 and 3 is completed.

  In this way, the second coating material 43 is formed on the first coating material 42, and the second coating material 43 is etched to reduce the unevenness on the surface of the second coating material 43. It can be made smaller than the uneven step on the surface of 42. Thereby, while preventing or suppressing the etching of the first coating material 42 on the concave portion 34 by the second coating material 43 on the concave portion 34 of the concave / convex pattern, the portion of the filler 36 above the recording element 20A is exposed, In addition, the first covering material 42 can be etched so that the first covering material 42 remains on the concave portion 34 of the uneven pattern (S114). Further, the filling material 36 is removed by a dry etching method in which the etching rate of the filling material 36 is higher than the etching rate of the first covering material 42 until the upper surface of the diaphragm 21 on the recording element 20A is exposed. The excess filler 36 on the recording element 20 </ b> A can be removed while preventing or suppressing the etching of the filler 36 that fills the recess 34 with the first covering material 42 on 34. Thereby, the surface can be sufficiently planarized.

  Next, a second embodiment of the present invention will be described. In the first embodiment, when the starting body of the workpiece 10 is manufactured, the diaphragm 21 is formed between the recording layer 20 (the continuous film before being processed into the concavo-convex pattern) and the first mask layer 22, The diaphragm 21 does not remain in the magnetic recording medium 30, whereas the starting body of the workpiece 50 according to the second embodiment is between the recording layer 20 and the first mask layer 22 as shown in FIG. No diaphragm is formed. As shown in FIGS. 14 and 15, the magnetic recording medium 60 according to the second embodiment has a diaphragm 62 formed on the bottom and side surfaces of the concave portion 34 of the concave / convex pattern of the recording layer 20.

  A method for manufacturing the magnetic recording medium 60 will be described with reference to the flowchart of FIG. Since the manufacturing method of the magnetic recording medium 60 has many points in common with the manufacturing method of the magnetic recording medium 30 according to the first embodiment, common points will be described using the same reference numerals as those in FIGS. Is omitted as appropriate.

  By performing the resin layer forming step (S104) and the recording layer processing step (S106) on the processing starting body of the workpiece 50 as in the first embodiment, a large number of recordings as shown in FIG. 17 are performed. A workpiece 50 having a recording layer 20 with a concavo-convex pattern divided into elements 20A and having no diaphragm on the recording element 20A is obtained.

  Next, as shown in FIG. 18, a separation film 62 is formed on the recording layer 20 having a concavo-convex pattern by sputtering or the like (S202). The thickness and material of the diaphragm 62 may be the same as those of the diaphragm 21. The diaphragm 62 is formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20. Thereby, the to-be-processed body 50 which has the diaphragm 62 formed in the upper surface of 20 A of recording elements is obtained. The diaphragm 62 is also formed on the bottom and side surfaces of the concave portion 34 of the concave / convex pattern of the recording layer 20.

  A filler film forming step (S108) is performed on the workpiece 50 as shown in FIG. 19, a first coating material film forming step (S110) is performed as shown in FIG. As shown in FIG. 21, the second covering material film forming step (S112) is performed.

  Next, a covering material etching step (second covering material etching step and first covering material etching step) (S114) is performed as shown in FIG. 22, and further a filling material etching step (S116) as shown in FIG. ). Thereby, the diaphragm 62 on the recording element 20A is exposed. At the end of the filler etching step (S116), the height of the upper surface of the filler 36 or the first covering material 42 above the recess 34 and the height of the upper surface of the diaphragm 62 above the recording element 20A substantially coincide with each other. Preferably it is.

  Next, as shown in FIG. 24, the filler 36 or the first covering material 42 on the recess 34 and the diaphragm 62 on the recording element 20A are etched to remove the diaphragm 62 on the recording element 20A (see FIG. 24). S118). Thereby, the upper surface of the recording element 20A is exposed, and the height of the upper surface of the recording element 20A and the upper surface of the filler 36 filling the concave portion 34 are substantially equal. That is, the surface of the workpiece 50 is sufficiently flattened.

  Further, the magnetic recording medium 60 shown in FIGS. 14 and 15 is obtained by executing the protective layer film forming step (S120) and the lubricating layer film forming step (S122).

  Next, a third embodiment of the present invention will be described. In the first and second embodiments, the diaphragms 21 and 62 are formed on the recording layer 20 to manufacture the magnetic recording media 30 and 60, whereas in the third embodiment, the recording layer 20 is formed on the recording layer 20. The magnetic recording medium 10 having the same configuration as that of the first embodiment is manufactured without forming a diaphragm. Since the manufacturing method of the third embodiment has many points in common with the manufacturing methods of the first and second embodiments, the same reference numerals as those in FIGS. Omitted.

  First, by performing the resin layer forming step (S104) and the recording layer processing step (S106) on the processing starting body of the workpiece 50 as in the second embodiment, the recording layer processing step (S106) is performed as in the first embodiment. As shown in FIG. 17, a workpiece 50 having a recording layer 20 with a concavo-convex pattern divided into a large number of recording elements 20A and having no diaphragm on the recording elements 20A is obtained.

  A filler film forming step (S108) is performed on the workpiece 50 as shown in FIG. In this step (S <b> 108), the recess 34 may be completely filled with the filler 36, or the recess 34 may be partially filled with the filler 36. The height of the upper surface of the filler 36 filling the concave portion 34 of the concave / convex pattern of the recording layer 20 is preferably −4 to +10 nm with respect to the height of the upper surface of the recording element 20A. More preferably, the upper surface of the filler 36 filling the recess 34 is coincident with the upper surface of the recording element 20A. Next, a first covering material film forming step (S110) is performed as shown in FIG. 26, and a second covering material film forming step (S112) is further executed as shown in FIG. In addition, when the recessed part 34 is partially filled with the filler 36 in the filler film forming process (S108), the recessed part 34 is further filled with the first covering material 42 in the first covering material film forming process (S110).

  Next, as shown in FIG. 28, a covering material etching step (first covering material etching step and second covering material etching step) (S114) is performed. As shown in FIG. 28, it is preferable that the second covering material 43 remains on the concave portion 34 of the concave-convex pattern of the recording layer 20 at the end of this step.

  Next, as shown in FIG. 29, a filler etching step (S116) is performed. If the second coating material 43 remains on the recess 34 at the end of the coating material etching step (S114), the second coating material 43 on the recess 34 is completely removed in this step (S116). . Further, the first covering material 42 on the concave portion 34 may be completely removed together with the filler 36 on the recording element 20A as shown in FIG. 29, or the concave portion 34 of the concave / convex pattern of the recording layer 20 may be removed. The first covering material 42 may remain on the top.

  When the first covering material 42 on the recess 34 is completely removed in this step (S116), it is preferable to immediately stop the etching when the first covering material 42 on the recess 34 is completely removed. . The etching rate of the filler 36 in this step (S116) is preferably 10 times or less than the etching rate of the first covering material 42.

  In the filler film forming step (S108), when the filler 36 is formed on the concave portion 34 up to the level of the upper surface of the recording element 20A or above, the first coating on the concave portion 34 in this step (S116). The material 42 is completely removed, and it is preferable that the height of the upper surface of the filler 36 filling the concave portion 34 and the height of the upper surface of the recording element 20A substantially coincide with each other at the end of this step (S116). “The height of the upper surface of the filler 36 substantially coincides with the height of the upper surface of the recording element 20 </ b> A” means that the difference in height between the upper surfaces of the both is within a range of ± 4 nm.

  In this step (S116), when the first covering material 42 on the concave portion 34 is completely removed, the protective layer film forming step (S120) and the lubricating layer film forming step (S122) are further performed, thereby The magnetic recording medium 30 shown in FIGS. 2 and 3 is obtained. Note that the upper surface portion of the recording element 20A may be removed by dry etching using a processing gas such as a rare gas between the filler etching step (S116) and the protective layer deposition step (S120) (recording element). Top surface removal step). In this case, the upper surface portion of the filler 36 filling the recess 34 is also removed. In the third embodiment, since no diaphragm is formed on the recording layer 20, there is a possibility that the vicinity of the upper surface of the recording element 20 </ b> A may be altered by processing for removing the first mask layer 22 on the recording layer 20. Even if such alteration occurs, deterioration of the magnetic characteristics can be prevented by removing the altered portion near the upper surface of the recording element 20A. Further, when there is a step between the upper surface of the recording element 20A and the upper surface of the filler 36 filling the recess 34 at the end of the filler etching step (S116), there is a difference between the etching rates of the two so as to reduce this step. By removing the upper surface portion of the recording element 20A and the upper surface portion of the filler 36 using dry etching, planarization can be promoted.

  On the other hand, in the filler film forming step (S108), when the filler material 36 is deposited on the recess 34 only below the level of the upper surface of the recording element 20A, in this step (S116), the first covering material 42 is formed. The filler 36 is etched so as to remain on the recess 34. As described above, when the first covering material 42 remains on the concave portion 34 of the concave-convex pattern of the recording layer 20, the excessive filler 36 on the recording element 20A is protected while protecting the filler 36 in the concave portion 34 from etching. Can be removed. The first covering material 42 may remain so as to completely cover the upper portion of the concave portion 34, or may remain so as to partially cover the upper portion of the concave portion 34. When the first covering material 42 remains above the recess 34, the height of the upper surface of the first covering material 42 above the recess 34 and the height of the upper surface of the recording element 20A are substantially equal at the end of this step (S116). It is preferable to do it. “The height of the upper surface of the first covering material 42 substantially coincides with the height of the upper surface of the recording element 20 </ b> A” means that the difference in height between the upper surfaces of the first covering material 42 is within a range of ± 4 nm. As described above, by adjusting the etching rate for the filler 36, the first covering material 42, and the second covering material 43, the upper surface of the filling material 36 that fills the recess 34 or the first covering material 42 on the recess 34. It is possible to make the height of the upper surface substantially coincide with the height of the upper surface of the recording element 20A.

  As described above, when the first covering material 42 remains on the upper portion of the recess 34 at the end of the filling material etching step (S116), the first covering material 42 and the recording are recorded by the dry etching method after the filling material etching step (S116). The element 20A is etched to remove the first covering material 42 remaining on the concave portion 34 of the uneven pattern of the recording layer 20 and the portion near the upper surface of the recording element 20A (first covering material removing step). As described above, since the diaphragm is not formed on the recording layer 20 in the third embodiment, the vicinity of the upper surface of the recording element 20A can be altered by processing for removing the first mask layer 22 on the recording layer 20 or the like. However, even if such a change occurs, the deteriorated portion in the vicinity of the upper surface of the recording element 20A is removed in this step, so that the deterioration of the magnetic characteristics can be prevented. Further, if there is a step between the upper surface of the recording element 20A and the upper surface of the first covering material 42 above the recess 34 at the end of the filler etching step (S116), the difference between the etching rates of the two is reduced so as to reduce this step. The planarization can be promoted by removing the upper surface portion of the recording element 20 </ b> A and the first covering material 42 using some dry etching. Further, the magnetic recording medium 30 shown in FIGS. 2 and 3 is obtained by executing the protective layer film forming step (S118) and the lubricating layer film forming step (S120).

  In the first to third embodiments, in the one-step covering material etching step (S114), the second covering material 43 is etched until a portion of the first covering material 42 above the recording element 20A is exposed, Further, the first covering material 42 is etched until the portion of the filler 36 above the recording element 20A is exposed. First, as in the fourth embodiment of the present invention shown in the flowchart of FIG. In the covering material etching step (S114A), the second covering material 43 is etched until a portion of the first covering material 42 above the recording element 20A is exposed. Next, in the first covering material etching step (S114B), the filler 36 is etched. The first covering material 42 may be etched until the portion above the recording element 20A is exposed. Since the manufacturing method of the fourth embodiment has many points in common with the manufacturing methods of the first to third embodiments, the same reference numerals as those in FIGS. Omitted. In the second coating material etching step (S114A), the same dry etching method as the dry etching method in the first coating material etching step (S114B) may be used, or a dry etching method different from the dry etching method in the first coating material etching step (S114B). Although an etching method may be used, in the second coating material etching step (S114A), a dry etching method in which the etching rate of the second coating material 43 is higher than that in the first coating material etching step (S114B) is used. preferable. In the first covering material etching step (S114B), it is preferable to use a dry etching method in which the etching rate of the first covering material 42 is the same as or higher than the etching rate of the second covering material 43.

In the first to fourth embodiments, as an example of the dry etching method used in the coating material etching step (S114), the second coating material etching step (S114A), and the first coating material etching step (S114B) As gas, rare gas such as Ar, Kr, Xe, etc., mixed gas of O ₂ gas, N ₂ gas or NH ₃ gas and rare gas, CH ₄ , C ₂ F ₆ , C ₄ F ₈ , SF ₆ , CHF _3, etc. IBE or RIE using F (fluorine) gas, mixed gas of rare gas and F gas, O ₂ gas, N ₂ gas, or mixed gas of NH ₃ gas and F gas is shown. While the second coating material 43 above the recess 34 prevents or suppresses the etching of the first coating material 42 above the recess 34, the portion of the filler 36 above the recording element 20A is exposed, and the first Covering material 42 is uneven pattern Any other dry etching method may be used as long as it is a dry etching method capable of etching the first covering material 42 so as to remain on the concave portion 34 of the metal.

  A preferable combination of the filler 36, the first covering material 42, the material of the second covering material 43, and the dry etching processing gas in the second covering material etching step (S114A) and the first covering material etching step (S114B) is shown. It is shown in 1. In the first coating material etching step (S114) as in the first to third embodiments, the second coating material 43 is etched until a portion of the first coating material 42 above the recording element 20A is exposed. Further, when the first covering material 42 is etched until the portion of the filler 36 above the recording element 20A is exposed, the processing gas shown in Table 1 as the gas for the first covering material etching step (S114B) is used. Use

  In the first to third embodiments, the etching rate of the first coating material 42 is the same as or higher than the etching rate of the second coating material 43 in the coating material etching step (S114) including the first coating material etching step. However, if etching can be performed so that the portion of the filler 36 above the recording element 20A is exposed and the first covering material 42 remains on the concave portion 34 of the concavo-convex pattern, A dry etching method in which the etching rate of the first covering material 42 is lower than the etching rate of the second covering material 43 may be used.

In the first to third embodiments, as an example of the dry etching method used in the filler etching step (S116), a gas containing oxygen such as O ₂ gas, N ₂ gas, NH ₃ gas, etc. as a processing gas Nitrogen-containing gas, CH ₄ , C ₂ F ₆ , C ₄ F ₈ , SF ₆ , CHF _{3 and} other F-based gas, O ₂ gas and other oxygen-containing gas and F-based gas, Ar, Although IBE or RIE using a rare gas such as Kr or Xe is shown, other dry etching methods can be used as long as the etching rate of the filler 36 is higher than the etching rate of the first covering material 42. It may be used. The same applies to the fourth embodiment. Table 2 shows preferable combinations of the filler 36, the first covering material 42, the diaphragm 21 (62), and the dry etching processing gas in the filler etching step (S116).

  In the first to third embodiments, the incident angle of the processing gas in the covering material etching step (S114), the filler etching step (S116), and the diaphragm removing step (S118) is the surface of the workpiece 10. However, the angle of incidence of the processing gas may be set to a small angle of about 2 ° with respect to the surface of the workpiece 10, for example. Thus, the tendency for a convex part to be etched faster than a recessed part becomes high by setting the incident angle of processing gas small. The same applies to the fourth embodiment.

  In the first to third embodiments, the first covering material 42 remaining on the diaphragm 21 (62) and the recess 34 on the recording element 20A in the diaphragm removing step (S118) and the first covering material removing step. However, if there is no practical problem even if the diaphragm 21 (62) on the recording element 20A and the first covering material 42 on the recess 34 remain in the final product, the diaphragm is removed. The step (S118) and the first covering material removal step may be omitted. In addition, the diaphragm removing step (S118) and the first covering material removing step are executed, and there is no practical problem even if they remain in the final product at the end of the diaphragm removing step (S118) and the first covering material removing step. The diaphragm 21 (62) on the recording element 20A and the first covering material 42 on the recess 34 may remain. The same applies to the fourth embodiment.

  In the first to third embodiments, the uneven step on the upper surface of the second covering material 43 is more uneven than the uneven step on the upper surface of the first covering material 42 at the end of the second covering material film forming step (S112). This is because the second covering material 43 on the concave portion 34 prevents or suppresses the etching of the first covering material 42 on the concave portion 34, while the recording element 20 </ b> A in the first covering material 42 is The second covering material 43 is etched so that the upper portion is exposed and the second covering material 43 remains on the concave portion 34 of the concavo-convex pattern, and the portion of the filler 36 above the recording element 20A is further etched. It contributes to etching the first covering material 42 so that it is exposed and the first covering material 42 remains on the concave portion 34 of the concavo-convex pattern, but in the second covering material film forming step (S112). The top surface of the second covering material 43 at the end Even if the uneven step is not smaller than the uneven step on the upper surface of the first covering material 42, the top surface of the recording element 20 </ b> A in the first covering member 42 is obtained by the action of dry etching that etches the protruding portion faster than the recessed portion. And the second covering material 43 is etched so that the second covering material 43 remains on the concave portion 34 of the uneven pattern, and further, the portion of the filler 36 above the recording element 20A is exposed. In addition, it is possible to etch the first covering material 42 so that the first covering material 42 remains on the concave portion 34 of the uneven pattern. The same applies to the fourth embodiment.

  In the first to third embodiments, the first mask layer 22, the second mask layer 24, and the resin layer 26 are formed on the continuous recording layer 20, and the recording layer 20 is formed by dry etching in three stages. Although it is divided into the concavo-convex pattern, the material of the mask layer, the resin layer, the number of layers, the thickness, the type of dry etching, and the like are not particularly limited as long as the recording layer 20 can be processed into a desired concavo-convex pattern with high accuracy. The same applies to the fourth embodiment.

In the first to third embodiments, the filler 36 is formed after the first mask layer 22 remaining on the recording element 20A is completely removed. And the filler 36 may be the same material or a similar material, the filler 36 may be formed with the first mask layer 22 remaining on the recording element 20A. Examples of similar materials include DLC having different carbon bond ratios in the SP ³ hybrid orbital and C (carbon) that is not DLC and DLC. The same applies to the fourth embodiment.

  In the first to third embodiments, the soft magnetic layer 16 and the orientation layer 18 are formed under the recording layer 20, but the configuration of the layers under the recording layer 20 depends on the type of magnetic recording medium. What is necessary is just to change suitably according to it. For example, an underlayer or an antiferromagnetic layer may be formed between the soft magnetic layer 16 and the substrate 12. One or both of the soft magnetic layer 16 and the alignment layer 18 may be omitted. Further, the recording layer may be directly formed on the substrate. The same applies to the fourth embodiment.

  In the first to third embodiments, the magnetic recording medium 30 (or 60) is a perpendicular recording type discrete track medium in which the recording layer 20 is divided at fine intervals in the track radial direction. Patterned media divided at fine intervals in both the radial and circumferential directions, a magnetic disk having a spiral recording layer, and formed separately on the top surface of the convex portion and the bottom surface of the concave portion under the concave and convex pattern The magnetic disk having a recording layer in which the portion formed on the upper surface of the convex portion is a recording element, the magnetic disk having the concave portion formed halfway in the thickness direction and having a continuous recording layer at the bottom, and the layer under the concave-convex pattern Of course, the present invention can also be applied to a magnetic disk having a recording layer with a concavo-convex pattern of a continuous film formed in accordance with the concavo-convex pattern. The present invention can also be applied to magneto-optical disks such as MO, heat-assisted magnetic disks that use both magnetism and heat, and magnetic recording media having a recording layer with other concavo-convex patterns other than the disk shape, such as magnetic tapes. It is. The same applies to the fourth embodiment.

  As in the first embodiment, ten samples of the magnetic recording medium 30 were produced. Specifically, first, the recording layer 20 was processed into the next uneven pattern (S106).

Pitch in the radial direction of the recording element 20A: 200 nm
Width in the radial direction of the upper surface of the recording element 20A: 100 nm
Recess depth (depth from the top surface of the diaphragm to the bottom surface of the recess): 26 nm

  The recording layer 20 had a thickness of 20 nm. The material of the recording layer 20 was a CoCr alloy. Moreover, the thickness of the diaphragm 21 was 2 nm. The material of the diaphragm 21 was Ta.

  Next, the filler 36 was formed on the concavo-convex pattern by the ECR plasma CVD method under the following film formation conditions, and the recess 34 was filled with the filler 36 (S108).

Filler material 36: DLC
Film thickness of filler 36: 28 nm
Source gas: CH ₄ (methane)
Source gas flow rate: 200 sccm
Chamber pressure: 1.33Pa
Microwave power: 200W
RF power: 300W
Vdc (DC voltage effectively applied to the workpiece): -460V

  The filler 36 was also formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20. The uneven step on the surface of the filler 36 was 26 nm, the same as the uneven step on the surface of the workpiece 10 before the film formation of the filler 36. Further, the height of the upper surface of the filler 36 above the concave portion 34 was higher than the height of the upper surface of the diaphragm 21 above the recording element 20A.

  Next, the first coating material 42 was deposited on the filler 36 under the following deposition conditions by sputtering (S110).

Material of the first covering material 42: Si
Deposition thickness of the first covering material 42: 1 nm
Source power (power applied to the target): 500W
Chamber pressure: 0.3Pa
Distance between target and workpiece 10: 300 mm

  The first covering material 42 was also formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20.

  Next, the second coating material 43 was formed on the first coating material 42 by the ECR plasma CVD method under the following film formation conditions (S112).

Material of second covering material 43: DLC
Deposition thickness of second covering material 43: 98 nm
Source gas: CH ₄ (methane)
Source gas flow rate: 200 sccm
Chamber pressure: 1.33Pa
Microwave power: 200W
RF power: 300W
Vdc (DC voltage effectively applied to the workpiece): -460V

  The second covering material 43 was also formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20, but the uneven step on the surface of the second covering material 43 was smaller than the uneven step on the top surface of the filler 36. . Specifically, the uneven step on the surface of the second covering material 43 was 8 nm. The film thickness (98 nm) is the thickness above the recess.

Next, the second coating material 43 is etched by IBE using a mixed gas of Ar gas and O ₂ gas as a processing gas until the portion above the recording element 20A in the first coating material 42 is exposed under the following conditions. Further, the first covering material 42 was etched until a portion of the filler 36 above the recording element 20A was exposed (S114).

Ar gas flow rate: 8 sccm
O ₂ gas flow rate: 30 sccm
Chamber pressure: 0.08Pa
Processing gas incident angle: 90 °
Beam voltage: 500V
Beam current: 400mA
Suppressor voltage: -400V

  The etching was stopped when the etching was performed for 1 minute 50 seconds. The first dressing 42 on the recording element 20A was completely removed. On the other hand, the second coating material 43 and the first coating material 42 remained on the recess 34. At this time, the uneven step on the surface of the workpiece 10 was 5 nm. Note that the etching rates of the second covering material 43, the first covering material 42, and the filler 36 under these conditions are as follows.

Second covering material 43 (DLC): 0.87 nm / sec
First covering material 42 (Si): 0.90 nm / sec
Filler 36 (DLC): 0.87 nm / sec

  These etching rates are etching rates when a flat film is etched, and are substantially equal to the etching rates in the recesses. Further, the etching rate at the convex portion is higher than these etching rates. The same applies to other etching rates described later.

Next, excess filler 36 on the recording element 20 </ _b > A was removed under the following conditions by using a mixed gas of Ar gas and O ₂ gas as a processing gas by IBE (S 116).

Ar gas flow rate: 3 sccm
O ₂ gas flow rate: 50 sccm
Chamber pressure: 0.08Pa
Processing gas incident angle: 90 °
Beam voltage: 500V
Beam current: 400mA
Suppressor voltage: -400V

  The etching was stopped when the etching was performed for 15 seconds. The filler material 36 above the recording element 20A was completely removed. Further, the second covering material 43 and the first covering material 42 on the concave portion 34 were also completely removed. At this time, the unevenness on the surface of the workpiece 10 was 1.4 nm. Note that the etching rates of the second covering material 43, the first covering material 42, the filler 36, and the diaphragm 21 under these conditions are as follows.

Second covering material 43 (DLC): 1.26 nm / sec
First covering material 42 (Si): 0.10 nm / sec
Filler 36 (DLC): 1.26 nm / sec
Diaphragm 21 (Ta): 0.10 nm / sec

  Next, by using Ar gas as a processing gas by IBE, the diaphragm 21 on the recording element 20A and the filler 36 on the recess 34 are etched under the following conditions to remove the diaphragm 21 on the recording element 20A. (S118).

Ar gas flow rate: 16 sccm
Chamber pressure: 0.04 Pa
Processing gas incident angle: 90 °
Beam voltage: 500V
Beam current: 500 mA
Suppressor voltage: 400V

  The etching was stopped when the etching was performed for 4 seconds. The diaphragm 21 above the recording element 20A was completely removed. Note that the etching rates of the diaphragm 21 and the filler 36 under these conditions are as follows.

Diaphragm 21 (Ta): 0.35 nm / sec
Filler 36 (DLC): 0.08 nm / sec

  In the four portions of each sample thus obtained, the upper portion of the radial center of the recording element 20A on the surface of the workpiece 10 and the radial center of the concave portion 34 adjacent thereto are provided. The level difference from the upper part was measured using an AFM (Atomic Force Microscope). The arithmetic average value of the steps of the 10 samples was 0.3 nm. That is, it was confirmed that the surface was sufficiently flattened.

[Comparative example]
10 magnetic recording medium samples were manufactured by changing the manufacturing conditions with respect to the above example. Specifically, the first coating material 42 and the second coating material 43 were not formed. In the filler film forming step (S108), the filler 36 was formed to a thickness of 127 nm. This thickness (127 nm) is the thickness in the recess, and is equal to the total thickness of the filler 36, the first covering material 42, and the second covering material 43 of the above-described embodiment. The filler 36 was formed in a concavo-convex pattern following the concavo-convex pattern of the recording layer 20, but the uneven step on the surface of the filler 36 was uneven on the surface of the workpiece 10 before the filler 36 was formed. Decreased than the level difference. Specifically, the uneven step on the surface of the filler 36 was 8 nm.

Next, the excess filler 36 on the recording element 20A was removed under the following conditions using a mixed gas of Ar gas and O ₂ gas as processing gas by IBE.

Ar gas flow rate: 8 sccm
O ₂ gas flow rate: 30 sccm
Chamber pressure: 0.08Pa
Processing gas incident angle: 90 °
Beam voltage: 500V
Beam current: 400mA
Suppressor voltage: 400V

  The etching was stopped when the etching was performed for 2 minutes and 2 seconds. The upper surface of the diaphragm 21 was exposed. Further, the height of the upper surface of the portion of the filler 36 on the concave / convex pattern of the recording layer 20 above the concave portion 34 was lower than the height of the upper surface of the diaphragm 21. That is, the upper surface of the portion of the filler 36 above the recess 34 is recessed closer to the substrate 12 than the upper surface of the diaphragm 21 above the recording element 20A. At this time, the uneven step on the surface of the workpiece 10 was 4.5 nm. Note that the etching rates of the filler 36 and the diaphragm 21 under these conditions are as follows.

Filler 36 (DLC): 0.87 nm / sec
Diaphragm 21 (Ta): 0.86 nm / sec

  Next, by using Ar gas as a processing gas by IBE, the diaphragm 21 on the recording element 20A and the filler 36 on the recess 34 are etched under the following conditions to remove the diaphragm 21 on the recording element 20A. .

Ar gas flow rate: 16 sccm
Chamber pressure: 0.04 Pa
Processing gas incident angle: 90 °
Beam voltage: 500V
Beam current: 500 mA
Suppressor voltage: 400V

  The etching was stopped when the etching was performed for 4 seconds. The diaphragm 21 above the recording element 20A was completely removed. Note that the etching rates of the diaphragm 21 and the filler 36 under these conditions are as follows.

Diaphragm 21 (Ta): 0.35 nm / sec
Filler 36 (DLC): 0.08 nm / sec

  In the four portions of each sample obtained in this way, the upper portion of the center in the radial direction above the recording element 20A on the surface of the workpiece 10 and the concave portion 34 adjacent to the same in the same manner as in the previous embodiment. The step with respect to the upper part in the center in the radial direction was measured using an AFM (atomic force microscope). The arithmetic average value of the steps of the 10 samples was 3.4 nm.

  In a magnetic recording medium having a high surface recording density such as a discrete track medium or a patterned medium, a head flying height of several nanometers to several tens of nanometers is assumed. As described above, in the comparative example in which the filler 36 was etched without forming the first covering material 42 and the second covering material 43, the estimated head flying height and the surface step were similar. On the other hand, the first covering material 42 and the second covering material 43 are formed on the filling material 36 and then the second covering material 43, the first covering material 42, and the filling material 36 are sequentially etched under predetermined etching conditions. In the example, the step on the surface was suppressed to be significantly smaller than the assumed head flying height. That is, the first coating material and the second coating material are formed on the filler, and then the second coating material, the first coating material, and the filler are sequentially etched under the etching conditions described in the above embodiments. It was confirmed that the surface can be sufficiently flattened.

  The present invention can be used for manufacturing a magnetic recording medium having a recording layer with a concavo-convex pattern such as a discrete track medium and a patterned medium.

Sectional drawing which shows typically the structure of the starting body of the to-be-processed body in the manufacturing process of the magnetic-recording medium which concerns on 1st Embodiment of this invention. Sectional drawing along the radial direction schematically showing the structure of a magnetic recording medium obtained by processing the workpiece Sectional drawing along the radial direction which expands and shows the structure around the recording layer of the magnetic recording medium Flow chart showing an outline of the manufacturing process of the magnetic recording medium Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body in which the resin layer of the uneven | corrugated pattern was formed Sectional drawing which follows the radial direction which shows typically the shape of the to-be-processed body by which the recording layer and the diaphragm were processed into the uneven | corrugated pattern Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the filler was formed on the recording layer and the diaphragm Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 1st coating material was formed into a film on the filler Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 2nd coating material was formed into a film on the 1st coating material Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body which the 2nd coating material and the 1st coating material were etched, and the filler on the recording element was exposed Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body in which the filler on the same recording element was etched Sectional drawing which follows the radial direction which shows typically the shape of the to-be-processed body from which the diaphragm on the recording element was removed Sectional drawing which shows typically the structure of the starting body of the to-be-processed object in the manufacturing process of the magnetic-recording medium based on 2nd Embodiment of this invention. Sectional drawing along the radial direction schematically showing the structure of a magnetic recording medium obtained by processing the workpiece Sectional drawing along the radial direction which expands and shows the structure around the recording layer of the magnetic recording medium Flow chart showing an outline of the manufacturing process of the magnetic recording medium Sectional drawing along the radial direction which shows typically the shape of the said to-be-processed body by which the recording layer was processed into the uneven | corrugated pattern Sectional drawing along the radial direction schematically showing the shape of the workpiece in which a diaphragm is formed on the recording layer Sectional drawing along the radial direction which shows typically the shape of the to-be-processed object in which the filler was formed on the diaphragm Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 1st coating material was formed into a film on the filler Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 2nd coating material was formed into a film on the 1st coating material Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body which the 2nd coating material and the 1st coating material were etched, and the filler on the recording element was exposed Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body in which the filler on the same recording element was etched Sectional drawing which follows the radial direction which shows typically the shape of the to-be-processed body from which the diaphragm on the recording element was removed Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body in which the filler was formed into a film on the recording layer in the manufacturing process of the magnetic-recording medium based on 3rd Embodiment of this invention. Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 1st coating material was formed into a film on the filler Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body by which the 2nd coating material was formed into a film on the 1st coating material Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body which the 2nd coating material and the 1st coating material were etched, and the filler on the recording element was exposed Sectional drawing along the radial direction which shows typically the shape of the to-be-processed body in which the filler on the same recording element was etched The flowchart which shows the outline | summary of the manufacturing process of the magnetic-recording medium based on 4th Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10, 50 ... Workpiece | work 12 ... Substrate 16 ... Soft magnetic layer 18 ... Orientation layer 20 ... Recording layer 20A ... Recording element 21, 62 ... Separator 22 ... 1st mask layer 24 ... 2nd mask layer 26 ... Resin layer 30, DESCRIPTION OF SYMBOLS 60 ... Magnetic recording medium 34 ... Concave 36 ... Filler 38 ... Protective layer 40 ... Lubricating layer 42 ... 1st coating | covering material 43 ... 2nd coating | covering material S102 ... Process starting body preparation process of a to-be-processed body S104 ... Resin layer formation process S106 ... Recording layer processing step S108 ... Filler film forming step S110 ... First covering material film forming step S112 ... Second covering material film forming step S114 ... Covering material etching step S114A ... Second covering material etching step S114B ... First covering material Etching process S116 ... Filler etching process S118 ... Separator removal process S120 ... Protective layer film forming process S122 ... Lubricating layer film forming process S202 ... Diaphragm film forming process

Claims (12)

  A filler is formed on a substrate and a workpiece having a recording layer in which the projection of the projection / depression pattern forms a recording element, and the projection / depression pattern of the projection / depression pattern is formed on the substrate. Filler film forming step for filling the recess, first covering material film forming step for forming the first covering material on the filling material, and forming a second covering material on the first covering material The second coating material film forming step, and the second coating material so that a portion of the first coating material on the recording element is exposed and the second coating material remains on the concave portion of the concavo-convex pattern. A second covering material etching step for etching the material, and a portion of the filler on the recording element is exposed, and the first covering material remains on the concave portion of the concavo-convex pattern. A first covering material etching step for etching the covering material, and the filling And a filler etching step of etching the filler until the upper surface of the recording element is exposed by a dry etching method in which the etching rate of the first coating material is higher than the etching rate of the first coating material. Manufacturing method. In claim 1,
A method of manufacturing a magnetic recording medium, comprising: a recording element upper surface portion removing step of removing the upper surface portion of the recording element by a dry etching method after the filler etching step.   A substrate, a recording layer formed on the substrate in a predetermined concavo-convex pattern, and a convex portion of the concavo-convex pattern constituting a recording element, and a workpiece having a diaphragm formed on at least the upper surface of the recording element in the recording layer Forming a filler on the filler and filling the concave portion of the concavo-convex pattern with the filler; and a first coating film forming step of forming a first coating on the filler; A second covering material film forming step of forming a second covering material on the first covering material; a portion of the first covering material on the recording element is exposed; and the second covering material is A second coating material etching step of etching the second coating material so as to remain on the concave portion of the concave-convex pattern; and a portion of the filler on the recording element is exposed; and the first coating material To remain on the concave portion of the concave-convex pattern A first covering material etching step for etching one covering material, and a dry etching method in which an etching rate of the filler is higher than an etching rate of the first covering material until the upper surface of the diaphragm on the recording element is exposed. A method of manufacturing a magnetic recording medium, comprising: a filler etching step of etching the filler. In claim 3,
A method of manufacturing a magnetic recording medium, comprising a film removing step of removing a film formed on the upper surface of the recording element by a dry etching method after the filler etching step. In any one of Claims 1 thru | or 4,
A method of manufacturing a magnetic recording medium, wherein a portion of the first covering material remaining on the concave portion of the concave / convex pattern is removed in the filler etching step to flatten the surface of the workpiece. In any one of Claims 1 thru | or 4,
In the filler film forming step, the concave portion of the concave / convex pattern is partially filled with the filler, and in the first coating material film forming step, the concave portion of the concave / convex pattern is further filled with the first coating material. A method of manufacturing a magnetic recording medium, comprising: etching the filler so that the first covering material remains on the concave portion of the concavo-convex pattern in the material etching step to flatten the surface of the workpiece . In any one of Claims 1 thru | or 4,
In the filler etching step, the filler is etched so that the first coating material remains on the concave portions of the concave / convex pattern, and the concave / convex portions in the first coating material are dry-etched after the filler etching step. A method of manufacturing a magnetic recording medium, comprising: a first covering material removing step of removing a portion remaining on a concave portion of a pattern to flatten a surface of the workpiece. In any one of Claims 1 thru | or 7,
In the first covering material etching step, a dry etching method in which an etching rate of the first covering material is the same as or higher than an etching rate of the second covering material is used. In any one of Claims 1 thru | or 8.
In the first covering material etching step, the first covering material is etched so that the second covering material remains on the concave portion of the concavo-convex pattern. In any one of Claims 1 thru | or 9,
The method of manufacturing a magnetic recording medium, wherein the filler is DLC, and a processing gas containing either oxygen or nitrogen is used in the filler etching step. In any one of Claims 1 thru | or 10.
The method of manufacturing a magnetic recording medium, wherein the second covering material is DLC, and a processing gas containing a rare gas is used in the first covering material etching step. In any one of Claims 1 thru | or 11,
The method for manufacturing a magnetic recording medium, wherein the first covering material etching step also serves as the second covering material etching step.

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