JP2009119879A - High elastic modulus copper-clad laminate of thermosetting resin-impregnated glass fabric base material and drilling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a copper-clad laminate which has a high elastic modulus and is high in quality at through-holes and via holes by carbon dioxide laser drilling. <P>SOLUTION: In the high elastic modulus copper-clad laminate of a thermosetting resin-impregnated glass fabric base material for laser drilling and the method of drilling laminate holes of a diameter of ≤0.15 mm are formed by lasers through a copper-clad laminate having at least one copper foil layer which is laminated on a prepreg obtained by impregnating a thermosetting resin in a glass fabric base material of a thickness of 25-150 μm, the weight of 15-165 g/m<SP>2</SP>and an air permeability of 1-20 cm<SP>3</SP>/cm<SP>2</SP>/sec and drying the base material. The laminate allows the formation of through-holes and the via holes at a high speed. The obtained copper-clad laminate has holes with smooth walls and excellent reliability in connection between inner copper foil and front and back copper foil. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a glass cloth-based copper-clad laminate having a high elastic modulus and a drilling method. In addition, the present invention relates to a high-density glass cloth-based copper-clad laminate suitable for forming a very small diameter through hole and / or via hole by irradiating a high-power carbon dioxide laser instead of a mechanical drill, and a drilling method . A printed wiring board using this copper-clad laminate is suitable for use as a semiconductor plastic package such as a thin and small chip scale package (CSP).

Conventionally, as a substrate used for a thin chip scale package (CSP) or the like, a thin plate such as a glass epoxy material, a polyimide film material, or a ceramic material is mainly used. The solder ball interval of these packages is generally 0.8 mm or less. However, in recent years, in printed wiring boards that are becoming thinner, smaller, and lighter, the solder ball pitch is becoming increasingly narrower, and as a result, the line / space is also becoming narrower. For this reason, there is a demand for a copper-clad laminate with good surface smoothness that is suitable for forming thin-line circuits. Furthermore, the through hole for the through hole and the via hole have a small diameter, and the hole diameter is 0.15 mmφ or less. When drilling such a small diameter hole, if the drill diameter is small, the drill may be bent at the time of drilling, bend, or have a slow processing speed, which causes problems in productivity, reliability, and the like. In addition, if negative holes are used in the upper and lower copper foils in advance and holes of the same size are made in a predetermined manner, and a through-hole that penetrates the upper and lower sides with a carbon dioxide gas laser is formed, the positions of the upper and lower holes are There were drawbacks such as the occurrence of displacement and the difficulty of forming lands.
In addition, when making a via hole in the thermosetting resin copper clad laminate of a glass cloth substrate, the copper foil on the surface is removed by etching in advance, and a via hole is formed by irradiating low-power carbon dioxide laser energy. However, there were problems such as leaving marks on the via hole walls. In addition, the workability was poor because a step of etching and removing the copper foil in advance was involved. In addition, when holes are drilled with high-power carbon dioxide laser energy, the processing speed of the resin layer and the glass layer on the hole wall is different, resulting in a problem that the unevenness of the hole wall increases and the hole quality deteriorates. It was.

  An object of the present invention is to provide a copper-clad laminate and a drilling method capable of forming a hole wall having a small diameter at high speed and with high reliability by using a high-power carbon dioxide laser that solves the above problems. To do.

The present invention provides at least one or more copper foil layers formed by lamination using a prepreg impregnated with a thermosetting resin composition on a glass cloth substrate particularly suitable for making a thin, small, and lightweight printed wiring board. The present invention relates to a high elastic modulus glass cloth base thermosetting resin copper-clad laminate for laser drilling and a drilling method. Copper having at least one copper foil layer using a glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g / m ² , and an air permeability of 1 to 20 cm ³ / cm ² / sec. By using a stretched laminate, a uniform hole wall in the laminate can be obtained when drilling small diameters with a carbon dioxide gas laser with excellent surface smoothness, high elastic modulus, and high energy. I found out.
Furthermore, by adding an insulating inorganic filler to the thermosetting resin composition, it is possible to further improve the elastic modulus and the quality of the small-diameter hole wall by the carbon dioxide laser. In addition, by using a polyfunctional cyanate ester as a thermosetting resin and the cyanate ester prepolymer as essential components, the resulting copper-clad laminate has electrical insulation, migration resistance and heat resistance after moisture absorption. It was found that an excellent product can be obtained. Further, the perforation can be carried out not only on the double-sided copper-clad laminate but also on a multilayer board obtained using the same resin composition. These copper-clad plates can be suitably used even when directly drilling with a YAG (UV) laser.

According to the present invention, a woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g / m ² , and an air permeability of 120 cm ³ / cm ² / sec. A glass cloth base thermosetting resin copper-clad laminate using the prepared prepreg is provided. According to the present invention, the surface of the copper clad laminate is smooth, the plate has a high elastic modulus, warps when used as an extremely thin printed wiring board, and a thermosetting resin copper clad laminate having a slight twist is provided. The
According to the present invention, the polyfunctional cyanate ester composition is further used as a thermosetting resin, and is obtained by blending an insulating inorganic filler, per glass cloth base thermosetting resin layer. A copper-clad laminate and a multilayer board having a high elastic modulus with an insulating layer thickness of 30 to 150 μm are provided. This copper clad laminate can form through holes and via holes by directly irradiating a high-power carbon dioxide laser, and the resulting hole wall has few irregularities and is uniform, and the electric power after moisture absorption of the through holes and via holes is achieved. A printed wiring board having excellent reliability such as insulation and migration resistance and excellent heat resistance was obtained. A semiconductor plastic package using this has a small warp and a good connection to the mother board.

As a glass cloth base material, a glass woven cloth having a thickness of 25 to 150 μm, a weight of 15 to 165 g / m ² and an air permeability of 1 to 20 cm ³ / cm ² / sec. The thermosetting resin composition, suitably the insulating inorganic filler, is blended so as to be 10 to 80% by weight, preferably 20 to 70% by weight, and mixed uniformly. Furthermore, by using a polyfunctional cyanate ester and the cyanate ester prepolymer as essential components as a thermosetting resin, the elastic modulus of the copper-clad laminate itself is improved, especially for thin printed wiring boards. When used, the generation of warp is suppressed. Furthermore, in the drilling with a carbon dioxide laser, through holes for via holes and / or via holes with a uniform small diameter on the hole wall can be formed, and those having excellent heat resistance, electrical insulation after moisture absorption, migration resistance, etc. Created.

  The double-sided copper-clad laminate and copper-clad multilayer board obtained in the present invention are based on a glass woven fabric, and preferably 10 to 80% by weight, more preferably an inorganic insulating filler in the thermosetting resin composition. Is a double-sided copper-clad plate having a homogeneous structure mixed with 20 to 70% by weight.

As the substrate, generally known glass fiber woven fabrics can be used. Specifically, examples of the glass fiber include generally known ones such as E, S, D, N, and T quartz. Moreover, although a well-known thing can be used for a weaving method, a plain weave, a nanako weave, a twill weave etc. are used suitably, and what opened this is used suitably. A glass woven fabric having a thickness of 25 to 150 μm, a weight of 15 to 165 g / cm ² , and an air permeability of 1 to 20 cm ³ / cm ² / sec. Is used.

  As the resin of the thermosetting resin composition used in the present invention, generally known thermosetting resins are used. Specific examples include epoxy resins, polyfunctional cyanate ester resins, polyfunctional maleimide-cyanate ester resins, polyfunctional maleimide resins, unsaturated group-containing polyphenylene ether resins, and the like. Are used in combination. From the viewpoint of through-hole shape in processing by high-power carbon dioxide laser irradiation, a thermosetting resin composition with a glass transition temperature of 150 ° C. or higher is preferable, moisture resistance, migration resistance, electrical characteristics after moisture absorption, etc. From this point, a polyfunctional cyanate ester resin composition is preferred.

  The polyfunctional cyanate ester compound which is the thermosetting resin component of the present invention is a compound having two or more cyanato groups in the molecule. Specific examples include 1,3- or 1,4-dicyanatobenzene, 1,3,5-tricyanatobenzene, 1,3-, 1,4-, 1,6-, 1,8-, 2 , 6- or 2,7-dicyanatonaphthalene, 1,3,6-tricyanatonaphthalene, 4,4-dicyanatobiphenyl, bis (4-dicyanatophenyl) methane, 2,2-bis (4-cyanato Phenyl) propane, 2,2-bis (3,5-dibromo-4-cyanatophenyl) propane, bis (4-cyanatophenyl) ether, bis (4-cyanatophenyl) thioether, bis (4-cyanatophenyl) ) Sulfone, tris (4-cyanatophenyl) phosphite, tris (4-cyanatophenyl) phosphate, and cyanates obtained by reaction of novolac with cyanogen halide.

In addition to these, the multifunctionality described in JP-B-41-1928, 43-18468, 44-4791, 45-11712, 46-41112, 47-26853 and JP-A-51-63149 Cyanate ester compounds may also be used. Further, a prepolymer having a molecular weight of 400 to 6,000 having a triazine ring formed by trimerization of cyanate groups of these polyfunctional cyanate ester compounds is used. This prepolymer polymerizes the above-mentioned polyfunctional cyanate ester monomers using, for example, acids such as mineral acids and Lewis acids; bases such as sodium alcoholates and tertiary amines; salts such as sodium carbonate and the like as catalysts. Can be obtained. This prepolymer also includes a partially unreacted monomer, which is in the form of a mixture of the monomer and the prepolymer, and such a raw material is suitably used for the application of the present invention. Generally, it is used after being dissolved in a soluble organic solvent.
As the epoxy resin, generally known epoxy resins can be used. Specifically, liquid or solid bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cresol novolac type epoxy resin, alicyclic epoxy resin; butadiene, pentadiene, vinylcyclohexene, dicyclopentyl ether, etc. And polyglycidyl compounds obtained by reaction of polyols, hydroxyl group-containing silicon resins and epohalohydrin, and the like. These may be used alone or in combination of two or more.

  As the polyimide resin, generally known resins can be used. Specific examples include reaction products of polyfunctional maleimides and polyamines and terminal triple bond polyimides described in JP-B-57-005406.

  These thermosetting resins can be used alone, but are preferably used in combination as appropriate in consideration of the balance of characteristics.

In the thermosetting resin composition of the present invention, various additives can be blended as desired within a range where the original properties of the composition are not impaired. These additives include polymerizable double bond-containing monomers such as unsaturated polyesters and prepolymers thereof; polybutadiene, epoxidized butadiene, maleated butadiene, butadiene-acrylonitrile copolymer, polychloroprene, butadiene-styrene copolymer. Low molecular weight liquid to high molecular weight elastic rubbers such as polymers, polyisoprene, butyl rubber, fluoro rubber, natural rubber; polyethylene, polypropylene, polybutene, poly-4-methylpentene, polystyrene, AS resin, ABS resin, MBS resin Styrene-isoprene rubber, polyethylene-propylene copolymer, 4-fluoroethylene-6-fluoroethylene copolymers; high molecular weight prepolymers such as polycarbonate, polyphenylene ether, polysulfone, polyester, polyphenylene sulfide, or Goma; polyurethane, etc. are exemplified, are appropriately used. In addition, other known organic fillers, dyes, pigments, thickeners, lubricants, antifoaming agents, dispersants, leveling agents, photosensitizers, flame retardants, brighteners, polymerization inhibitors, thixotropic agents Various additives such as are used in appropriate combination as desired. If necessary, the compound having a reactive group is appropriately mixed with a curing agent and a catalyst.
The thermosetting resin composition used in the present invention is cured by heating, but has a slow curing speed and is inferior in workability, economy, etc., so that it is a known thermosetting catalyst for the thermosetting resin used. Can be used. The amount used is 0.005 to 10 parts by weight, preferably 0.01 to 5 parts by weight with respect to 100 parts by weight of the thermosetting resin.

  As the inorganic insulating filler, generally known ones can be used. Specifically, silicas such as natural silica, calcined silica, amorphous silica; white carbon, titanium white, aerosil, clay, talc, wollastonite, natural mica, synthetic mica, kaolin, magnesia, alumina, perlite, hydroxylated Aluminum, magnesium hydroxide, etc. are mentioned. The addition amount is 10 to 80% by weight, preferably 20 to 70% by weight. The average particle size is preferably 1 μm or less.

As the outermost copper foil, generally known copper foils can be used. An electrolytic copper foil having a thickness of 3 to 12 μm is preferably used. The inner layer copper foil is preferably an electrolytic copper foil of 9 to 18 μm.
The glass cloth base copper-clad laminate is prepared by first impregnating the glass cloth base material with a thermosetting resin composition and drying it to form a B stage, preferably a prepreg so that the glass content is 25 to 70% by weight. Create Next, a predetermined number of the prepregs are used, copper foils are arranged on the upper and lower sides, and are laminated by heating and pressurizing to form a double-sided copper clad laminate. In the cross section of the copper clad laminate, the resin other than glass and the inorganic filler are uniformly dispersed, and the holes are evenly formed when laser drilling is performed. In addition, since the glass is uniformly distributed, there is little unevenness of the hole wall due to the processing of the resin, and it is uniform. The same applies to a copper-clad multilayer board obtained by forming a circuit on this double-sided copper-clad laminate, subjecting it to a copper foil surface treatment if necessary, and laminating using the same prepreg.

  This glass cloth base copper clad laminate is subjected to metal oxide treatment or chemical treatment on the surface of the copper foil at the position where the carbon dioxide laser is irradiated, or one of metal compound powder, carbon powder and metal powder. Or the coating film or sheet | seat which consists of a resin composition containing 2 or more types is arrange | positioned, and the copper foil of a surface or the copper foil of a back surface is drilled by irradiating the carbon dioxide laser narrowed down to the target diameter directly. As the backup sheet, it is preferable to use a sheet having a resin layer on a metal plate having a glossy surface in order to prevent deformation of the back surface hole due to reflection of the penetrating carbon dioxide laser.

  When a carbon dioxide laser is selected with an energy of preferably 20 to 60 mJ / pulse and irradiated with several pulses to form through holes and via holes, burrs are generated around the holes. Therefore, after irradiating the carbon dioxide laser, both surfaces of the copper foil were planarly etched, and part of the thickness of the original metal foil was removed by etching, so that the burrs were also etched away and obtained. The copper foil is suitable for forming a fine pattern, and a through-hole plating through-hole in which copper foil on both sides around the hole suitable for a high-density printed wiring board remains is formed.

  In the present invention, a known treatment can be generally used as the metal oxide treatment for treating the surface of the copper foil to be perforated by direct irradiation with a carbon dioxide laser. Specifically, black copper oxide treatment, MM treatment (MacDarmid) and the like are preferably used. For the chemical treatment, generally known ones are used. For example, CZ treatment (MEC) and the like can be mentioned. Further, metal compound powder, carbon powder or metal powder is disposed on the surface of the copper foil and used for directly drilling the copper foil of the carbon dioxide laser. As the metal oxide powder, a metal compound powder having a melting point of 900 ° C. or higher and a binding energy of 300 kJ / mol or higher is used. Specifically, the oxide includes titania such as titanium oxide; magnesia such as magnesium oxide; iron oxide such as iron oxide; nickel oxide such as nickel oxide; zinc oxide such as zinc oxide. And tin oxides such as silicon dioxide, manganese dioxide, aluminum oxide, rare earth oxide, and tin oxide; tungsten oxides such as tungsten oxide; Examples of the non-oxide include generally known materials such as silicon carbide, tungsten carbide, boron nitride, silicon nitride, titanium nitride, aluminum nitride, and barium sulfate. In addition, carbons can also be used. Further, simple substances such as silver, aluminum, bismuth, cobalt, copper, iron, manganese, molybdenum, nickel, tin, itane and zinc, or alloys thereof are used. These are used alone or in combination of two or more. The average particle size is not particularly limited, but is preferably 1 μm or less. Although the usage-amount is not specifically limited, 3 to 97 vol% is used. These are used by being blended with organic substances, particularly resin compositions. The resin composition is preferably a water-soluble resin from the standpoint of removing residues after laser processing. Although there is no restriction | limiting in particular as water-soluble resin, When knead | mixing and apply | coating and drying on the copper foil surface, or making it into a sheet form, what does not have a missing peeling is selected and used. For example, generally known materials such as polyvinyl alcohol, polyester, polyether, starch and the like can be mentioned.

A method of preparing a composition comprising metal compound powder, carbon powder or metal powder and a resin is not particularly limited, but is a method of kneading at high temperature without solvent with a kneader or the like, and extruding and adhering to a thermoplastic film in a sheet form Then, dissolve the water-soluble resin in water, add the above powder to this, and stir and mix it uniformly, then apply it to a thermoplastic film as a paint and dry it to form a coating film, or directly on the copper foil A method of applying and drying to form a coating film is used. The thickness is not particularly limited, but is preferably a sheet having a total thickness of 30 to 200 μm when it is attached to the film and retained, preferably with a coating thickness of 30 to 100 μm. In the case of a sheet, it is preferable that the resin layer is preferably disposed on the copper foil side and laminated under heating and pressure.
The backup sheet is preferably formed by placing the water-soluble resin layer on the back surface of the copper-clad plate and placing a metal plate on the outside thereof. The water-soluble resin is preferably used after being adhered to a copper foil.

  The method for etching and removing the copper burrs generated in the hole of the present invention is not particularly limited, but for example, JP-A Nos. 02-22887, 02-22896, 02-25089, 02-25090, and 02- 59337, 02-60189, 02-166789, 03-25995, 03-60183, 03-94491, 04-199592, 04-263488, a method for dissolving and removing metal surfaces with chemicals (Referred to as the SUEP method). The etching rate is 0.02 to 1.0 μm / sec.

A carbon dioxide laser generally has a wavelength of 9.3 to 10.6 μm in the infrared wavelength region. The copper-clad plate of the present invention can also be used for processing with a UV laser. In general, a wavelength of 200 to 400 nm is suitably used for the UV laser.
Moreover, the method of forming the hole by processing is not particularly limited. Specifically, when forming a through hole for a through hole, a mechanical drill, a laser, or the like is used. When forming a hole for a via hole, a sand blast method, a router, a laser, or the like can be used.

The present invention will be specifically described below with reference to examples and comparative examples. Unless otherwise specified, “parts” represents parts by weight.

Example 1
900 parts of 2,2-bis (4-cyanatophenyl) propane and 100 parts of bis (4-maleimidophenyl) methane were melted at 150 ° C. and reacted for 4 hours with stirring to obtain a prepolymer. This was dissolved in a mixed solvent of methyl ethyl ketone and dimethylformamide. 400 parts of bisphenol A type epoxy resin (trade name: Epicoat 1001, manufactured by Yuka Shell Epoxy Co., Ltd.) and 600 parts of cresol novolac type epoxy resin (trade name: ESCN-220F, manufactured by Sumitomo Chemical Co., Ltd.) In addition, it was uniformly dissolved and mixed. Further, 0.4 parts of zinc octylate as a catalyst was added and dissolved and mixed. To this, 500 parts of inorganic insulating filler (trade name: calcined talc, average particle size 0.4 μm, manufactured by Nippon Talc Co., Ltd.) and 8 parts of black pigment were added. Was added and stirred uniformly to obtain varnish A. This varnish A was impregnated into a twilled glass woven fabric having a thickness of 40 μm, a weight of 27 g / m ² , and an air permeability of 19 cm ³ / cm ² / sec. And dried at 150 ° C. for gelation time (At 170 ° C.) 120 Second, a prepreg (prepreg B) having a glass cloth content of 40% by weight was prepared. Electrolytic copper foil with a thickness of 12μm is placed above and below the above three prepregs B and laminated for 2 hours under a vacuum of 200 ° C, 20kgf / cm ² , 30mmHg or less, and a double-sided copper-clad laminate with an insulation layer thickness of 136μm B was obtained.

  On the other hand, 800 parts of black copper oxide powder having an average particle size of 0.86 μm was added to a varnish in which polyvinyl alcohol powder was dissolved in water, and uniformly stirred and mixed (varnish C). This was coated on the double-sided copper-clad laminate with a thickness of 30 μm and dried at 110 ° C. for 30 minutes to form a film with a metal oxide content of 50 wt%. Also, on the lower side, a backup sheet in which 100 μm of water-soluble polyester resin is coated on a 100 μm surface glossy aluminum foil is placed, and from this upper side, 900 holes with a hole diameter of 100 μm are directly output with a carbon dioxide laser, output 35 mJ / Through-holes for through-holes were formed by applying 3 pulses (shots). The copper foil burrs around the holes were dissolved and removed by the SUEP method, and at the same time, the copper foil on the surface was dissolved to 4 μm. This plate was plated with copper by 15 μm (total thickness: 19 μm) by a known method. A circuit (line / space = 50/50 μm) is formed on this surface by a known method, solder ball lands, etc. are formed on the back surface, and portions other than the semiconductor chip mounting portion are covered with a resist for sand blasting, and glass is formed by sand blasting. The base material and the thermosetting resin composition were removed by cutting to expose the copper foil on the back surface serving as the semiconductor chip mounting portion. After that, the resist for sandblasting is dissolved and removed, and after soft etching, it is covered with a plating resist except for the semiconductor chip mounting part, bonding pad part, and solder ball pad part. Created. A 4 mm square semiconductor chip was bonded with a silver paste to the semiconductor mounting portion of this printed wiring board, wire bonded, and sealed with resin to obtain a semiconductor plastic. The evaluation results are shown in Tables 1 and 2.

Example 2
Dissolve 1400 parts of epoxy resin (trade name: Epicoat 5045), 600 parts of epoxy resin (trade name: ESCN220F), 70 parts of dicyandiamide, and 2 parts of 2-ethyl-4-methylimidazole in a mixed solvent of methyl ethyl ketone and dimethylformamide, and varnish D was obtained. This was impregnated into a twilled glass woven fabric having a thickness of 130 μm, a weight of 136 g / m ² , and an air permeability of 3 cm ³ / cm ² / sec., Dried, a prepreg having a gel time of 120 seconds and a glass cloth content of 50 wt%. (Prepreg E) and a prepreg F having a gel time of 136 seconds and a glass cloth content of 45 wt% were prepared. One prepreg E was used, an electrolytic copper foil of 70 μm was placed on one side, and laminate molding was performed for 2 hours under a vacuum of 190 ° C., 20 kgf / cm ² , 30 mmHg or less to prepare a single-sided copper-clad laminate. The thickness of the insulating layer was 140 μm. After forming a circuit on this copper foil surface and performing copper oxide treatment, each of the above prepregs F is placed thereon, a release film is disposed on the outside thereof, and a single layer is formed on the inner layer in the same manner. A plate having a copper foil was prepared.

  This ball pad part on the back side was drilled with 2 pulses (shot) at a carbon dioxide laser output of 17 mJ / pulse, and the surface was bonded to the inner layer copper foil by the sandblasting method as in Example 1. Drilling and desmearing were performed, and then a 25 mm square printed wiring board was prepared in the same manner as in Example 1. A 15 mm square semiconductor chip was bonded to this with a silver paste, connected by wire bonding, and the whole was resin-sealed with an epoxy compound. The evaluation results are shown in Tables 1 and 2.

Comparative Example 1
In Example 1, varnish A was applied to a twill-woven glass cloth having a thickness of 50 μm, a weight of 48 g / m ² , and an air permeability of 180 cm ³ / cm ² / sec. Without using an inorganic insulating filler. Impregnation so as to have a glass cloth content of 40 wt%, dry to create a prepreg with a gel time of 122 seconds, use two sheets to place an electrolytic copper foil of 12 μm above and below, laminate in the same way, A double-sided copper-clad laminate with an insulating layer thickness of 129 μm was prepared. After that, a carbon dioxide laser was irradiated in the same manner to open a through hole for a through hole, and a printed wiring board was prepared without performing the SUEP treatment. Similarly, a semiconductor plastic package was obtained. The evaluation results are shown in Tables 1 and 2.

Comparative Example 2
In Example 2, 2000 parts of Epicoat 5045 alone was used as an epoxy resin, and varnish G was prepared without using inorganic filling. A prepreg G having a thickness of 100 μm, a weight of 105 g / cm ² and an air permeability of 28 cm ³ / cm ² / sec. It was created. Others were laminated in the same manner as in Example 1 to produce a double-sided copper-clad laminate with an insulating layer thickness of 115 μm. Thereafter, a printed wiring board and a semiconductor plastic package were produced in the same manner as in Example 2 without performing the SUEP process.
The evaluation results are shown in Tables 1 and 2.

<Measurement method>
1) Hole wall shape and drilling time Within a work size of 250 mm square, 70 holes were created with a hole diameter of 100 μm at 300 μm intervals and a total of 900 holes / block (63,000 holes total). The shape and cross section from the surface of the hole were observed, and the unevenness of the wall was observed.
2) Circuit pattern cuts and shorts In the examples and comparative examples, a board without holes was created in the same way, and a comb-shaped pattern with line / space = 50/50 μm was created, and then 200 patterns after etching with a magnifying glass. Was visually observed, and the total of the pattern cut and shorted patterns was shown in the molecule.
3) Glass transition temperature and elastic modulus Measured by DMA method.
4) Through hole and via hole / heat cycle test Land diameter 200μm is created in each through hole, 900 holes are connected alternately, and one cycle is 200 cycles at 260 ℃, solder, immersion 30 seconds → room temperature, 5 minutes The maximum value of the change rate of the resistance value was shown.
5) Insulation resistance value after pressure cooker processing Create a comb pattern between terminals (line / space = 50 / 50μm), and after chemical treatment, stack one layer of each prepreg on top of each other. After being treated at 121 ° C./203 kPA for a predetermined time, it was post-treated at 25 ° C./60% RH for 2 hours, and the insulation resistance value between terminals was measured 60 seconds after applying 500 VDC.
6) Migration resistance The test piece of 5) above was applied at 85 ° C, 85% RH, 50VDC, and the insulation resistance between the terminals was measured.
7) Rigidity One prepreg is used, the copper foil is removed by etching after lamination molding, this is cut into 40x20mm, this end is fixed, and a weight of 2g is attached to the other tip, I measured the distance.
8) Warpage A plate with a workpiece size of 250x250mm was placed on the surface plate, and the maximum value of warpage was measured.
9) Surface unevenness The maximum value when the vertical direction was measured with a surface unevenness meter was moistened.

Claims (7)

Obtained by impregnating and drying a thermosetting resin composition on a glass cloth substrate made of a glass woven cloth having a thickness of 25 to 150 μm, a weight of 15 to 165 g / m ² , and an air permeability of 1 to 20 cm ³ / cm ² / sec. A high elastic modulus glass cloth for laser drilling, characterized in that a hole having a hole diameter of 0.15 mm or less is formed in a copper clad laminate having at least one copper foil layer in which copper foil is laminated on a prepreg to be formed Base material thermosetting resin copper clad laminate. 2. The high elastic modulus glass cloth for laser drilling according to claim 1, wherein the thermosetting resin composition of the copper clad laminate contains 10 to 80% by weight of an insulating inorganic filler based on the resin composition. Base material thermosetting resin copper clad laminate. The high-modulus glass cloth substrate thermosetting resin copper-clad laminate for laser drilling according to claim 1, wherein the glass woven fabric has a thickness of 25 to 40 µm and a weight of 15 to 27 g / m ² . The laser hole according to claim 1, 2 or 3, wherein the thermosetting resin composition uses a resin composition comprising a polyfunctional cyanate ester or a polyfunctional cyanate ester prepolymer as an essential component. High elastic modulus glass cloth base thermosetting resin copper clad laminate for punching. Drilling of a copper-clad laminate, wherein a hole having a hole diameter of 0.15 mm or less is drilled in the high-modulus glass cloth base thermosetting resin copper-clad laminate for laser drilling according to claim 1. Method. 6. The method for drilling a copper-clad laminate according to claim 5, wherein the drilling is performed with a carbon dioxide laser at an output of 20 to 60 mJ / pulse. The high-modulus glass cloth base thermosetting resin copper-clad laminate for laser drilling according to claim 1 is subjected to drilling with a hole diameter of 0.15 mm or less by a carbon dioxide gas laser. High elastic modulus glass cloth base thermosetting resin copper clad laminate.