JP2009083465A - Gas barrier film and display element using the same - Google Patents

Abstract

Provided is a gas barrier film that can effectively prevent moisture from entering from a side where no gas barrier layer is provided, even if it is a gas barrier film provided with an organic-inorganic laminated gas barrier layer only on one side.
A base film 1 has a gas barrier layer 2 having at least one organic region and at least one inorganic region on one surface, and the other surface of the base film has barrier performance. The gas barrier film which has only the layer which has resin 3 which has barrier performance as a main component as a layer.
[Selection] Figure 1

Description

  The present invention relates to a gas barrier film, a method for producing the same, and a display element using the gas barrier film.

Conventionally, gas barrier films used for display elements such as organic EL elements have been studied. Patent Document 1 discloses a gas barrier film in which a gas barrier layer is provided on one surface of a base film and a resin layer having a glass transition temperature of 60 ° C. or higher is provided on the other surface. Patent Document 2 discloses a gas barrier film in which a gas barrier layer is provided on one surface of a base film and a solvent-resistant layer is provided on the other surface. However, such a gas barrier film has poor moisture shielding properties on the surface where no gas barrier layer is provided. Therefore, in the process of manufacturing an organic EL element or the like, it is affected by the intake of moisture and the like into the film and the release of the incorporated components.
On the other hand, Patent Document 3 discloses a gas barrier film having organic-inorganic laminated gas barrier layers on both surfaces of a base film. However, in patent document 3, since the organic-inorganic laminated type gas barrier layer is formed on both sides, its manufacture is difficult.

JP 2007-30451 A JP 9-254303 A JP 2006-35737 A

  The present invention aims to solve the above-mentioned problems, and even if it is a gas barrier film provided with an organic-inorganic laminated gas barrier layer only on one side, the intrusion of moisture from the side where the gas barrier layer is not provided. It aims at providing the gas barrier film which can prevent effectively.

As a result of intensive studies by the inventors under the above-mentioned problems, an organic-inorganic laminated gas barrier layer is provided on one side of the base film, and the other side has a resin having a barrier performance as a main component as a layer having a barrier performance. It has been found that the above-described problem can be solved by providing only a layer (hereinafter sometimes referred to as “barrier resin layer”). Specifically, it was achieved by the following means.
(1) It has a gas barrier layer having at least one organic region and at least one inorganic region on one surface of the substrate film, and the other surface of the substrate film has a barrier performance as a layer, A gas barrier film having only a layer mainly composed of a resin having barrier performance.
(2) The gas barrier film according to (1), wherein the gas barrier layer has at least one organic layer and at least one inorganic layer.
(3) The gas barrier film according to (1) or (2), wherein the resin of the layer mainly composed of a resin having barrier performance is polyvinyl alcohol.
(4) The gas barrier film according to (1) or (2), wherein the resin of the layer mainly composed of a resin having barrier performance is a polyfunctional acrylate.
(5) The gas barrier film according to any one of (2) to (4), wherein the organic layer is obtained by curing a composition containing at least one (meth) acrylate having a bisphenol skeleton.
(6) The gas barrier film according to any one of (1) to (5), wherein the main component of the organic layer and the layer mainly composed of a resin having barrier performance are the same.
(7) The gas barrier film according to any one of (1) to (6), wherein the layer mainly composed of a resin having barrier performance has a thickness of 0.5 to 30 μm.
(8) The gas barrier film according to any one of (1) to (7), wherein the thickness of the gas barrier film is 10 to 300 μm.
(9) The gas barrier film according to any one of (1) to (8), which is for a display element.
(10) The method for producing a gas barrier film according to any one of (1) to (9), wherein a gas barrier layer is provided on a base film, and then a resin having a barrier performance is a main component. A method for producing a gas barrier film, comprising providing a layer.
(11) A display device using the gas barrier film according to any one of (1) to (9).
(12) The display device according to (11), wherein the gas barrier film is used as a substrate of the display device.
(13) The display element according to (11), wherein the gas barrier film is used as a sealing film for the display element.
(14) The display element according to any one of (11) to (13), wherein the display element is provided such that a layer mainly composed of a resin having a barrier performance of a gas barrier film is on an outer side. .

 According to the present invention, even in an aspect in which an organic / inorganic laminated gas barrier layer is provided only on one side of a gas barrier film, it is possible to suppress the intake and release of moisture and gas into the base film. As a result, when manufacturing a display element such as an organic EL element, it is possible to reduce the deterioration of the display element, and to stably manufacture the display element.

  Hereinafter, the contents of the present invention will be described in detail. In the present specification, “to” is used to mean that the numerical values described before and after it are included as a lower limit value and an upper limit value. The organic EL element in the present invention refers to an organic electroluminescence element.

The gas barrier film of the present invention has a gas barrier layer having at least one organic region and at least one inorganic region on one surface of the base film (sometimes referred to as “organic-inorganic laminated gas barrier layer” in this specification). And the other surface has only a layer having a barrier performance as a main component (barrier resin layer) as a layer having a barrier performance.
Here, the barrier resin layer means that the first component constituting the layer is a resin having a barrier performance, and usually means that 80% by weight or more of a resin having a barrier performance is included. . Accordingly, it is not excluded that other components are included within the scope of the present invention. In addition, “as a layer having barrier performance” means that only the barrier resin layer is provided as a layer having barrier performance, and a layer having other functions may be provided. Means. That is, an aspect in which another gas barrier layer is provided is not included in the scope of the present invention, but an adhesive layer for bonding the barrier resin layer and the base film and other functional layers are provided. Embodiments are within the scope of the present invention.

Hereinafter, the case where the gas barrier film of this invention is used for the sealing film of an organic EL element is demonstrated as an example. It goes without saying that the present invention is not limited to these embodiments.
FIG. 1 shows a schematic view when a conventional gas barrier film and the gas barrier film of the present invention are used as a sealing film for an organic EL device, wherein (a) shows a conventional gas barrier film and (b) shows a conventional gas barrier film. Shows the gas barrier film of the present invention. Here, 1 is a base film, 2 is an organic / inorganic laminated gas barrier layer, and 3 is a barrier resin layer. Further, (c) is an organic EL element, and a laminate 5 such as a pair of electrodes, the electrodes, and an organic compound layer provided between the electrodes is provided on a substrate 4.
In the conventional gas barrier film (a), moisture enters from the base film 1 side, and the gas barrier film in a state where the moisture has entered enters the organic EL element, so that the element deteriorates due to moisture. was there. On the other hand, in the gas barrier film (b) of the present invention, moisture intrusion is sealed by the organic / inorganic laminated gas barrier layer 2 and the barrier resin layer 3.

  In addition, in FIG. 1, although used as a sealing film of an organic EL element, the gas barrier film of this invention may be used as a board | substrate of an organic EL element, and may be used for both. Moreover, you may be used for the other display element. Also in these cases, it is preferable to provide the barrier resin layer on the outside of the display element.

  The thickness of the gas barrier film of the present invention is preferably 10 to 300 μm, and more preferably 25 to 250 μm.

(Layer mainly composed of resin with barrier performance)
The resin having the barrier performance in the layer mainly composed of the resin having the barrier performance of the present invention (barrier resin layer) is, for example, diffusion of gas components such as oxygen and moisture that affect the material constituting the organic EL element. It means the material which suppresses. Specific examples include polyvinyl alcohol, polyvinylidene chloride copolymers, ethylene-vinyl alcohol copolymers, synthetic mica-containing resin layers, and polyfunctional acrylates used in organic layers of organic-inorganic laminated gas barrier layers. Alcohols and polyfunctional acrylates are preferred.
The barrier resin layer preferably has the same main component as the organic layer constituting the gas barrier layer. With such a configuration, there is an advantage that film formation is easy.
The barrier resin layer preferably has a water vapor permeability of 0.001 to 10 g / m ² day when the gas barrier property is measured under conditions of 25 ° C. and 50% relative humidity.
The thickness of the barrier resin layer is preferably 0.5 to 30 μm, and more preferably 1 to 20 μm.
The barrier resin layer is preferably provided by applying a resin composition on a substrate film, but means such as attaching the resin film with an adhesive or the like may be employed.

(Gas barrier layer)
The gas barrier layer in the present invention is a layer having a function of blocking oxygen and moisture in the atmosphere, and is an organic-inorganic laminated type in which an organic region and an inorganic region or an organic layer and an inorganic layer are laminated.
Organic regions and inorganic regions or organic layers and inorganic layers are usually laminated alternately. In the case of an organic region and an inorganic region, a so-called gradient material layer in which each region continuously changes in the film thickness direction may be used. Examples of the gradient materials include a paper by Kim et al. “Journal of Vacuum Science and Technology A Vol. 23 p971-977 (2005 American Vacuum Society) Journal of Vacuum Science and Technology A Vol. , American Vacuum Society) ”, or a continuous layer in which the organic layer and the inorganic layer do not have an interface as disclosed in US Published Patent Application No. 2004-46497. Hereinafter, for simplification, the organic layer and the organic region are described as “organic layer”, and the inorganic layer and the inorganic region are described as “inorganic layer”.
Although there is no restriction | limiting in particular regarding the number of layers which comprises a cas barrier layer, Typically 2-30 layers are preferable, and 3-20 layers are more preferable.
The thickness of the gas barrier layer is not particularly defined, but is, for example, 0.2 to 30 μm, and preferably 0.5 to 15 μm.

(Inorganic layer)
The inorganic layer is usually a thin film layer made of a metal compound. As a method for forming the inorganic layer, any method can be used as long as it can form a target thin film. For example, a coating method, a sputtering method, a vacuum deposition method, an ion plating method, a plasma CVD method, and the like are suitable, and specifically, Japanese Patent No. 3400324, Japanese Patent Application Laid-Open No. 2002-322561, and Japanese Patent Application Laid-Open No. 2002-361774. The described forming method can be employed.
The component contained in the inorganic layer is not particularly limited as long as it satisfies the above performance, but for example, one or more selected from Si, Al, In, Sn, Zn, Ti, Cu, Ce, Ta, or the like An oxide containing metal, nitride, carbide, oxynitride, oxycarbide, nitride carbide, oxynitride carbide, or the like can be used. Among these, a metal oxide, nitride, or oxynitride selected from Si, Al, In, Sn, Zn, and Ti is preferable, and a metal oxide, nitride, or oxynitride of Si or Al is particularly preferable. . These may contain other elements as secondary components.
Although it does not specifically limit regarding the thickness of the said inorganic layer, It is preferable to exist in the range of 5 nm-500 nm, More preferably, it is 10 nm-200 nm. Two or more inorganic layers may be laminated. In this case, each layer may have the same composition or a different composition. Further, as disclosed in US Patent Publication No. 2004-46497, a layer whose interface with the organic layer is not clear and whose composition continuously changes in the film thickness direction may be used.

(Organic layer)
In the present invention, the organic layer is preferably composed of a polymer of a radically polymerizable compound and / or a cationically polymerizable compound having an ether group as a functional group as a polymer.
(Polymerizable compound)
The polymerizable compound used in the present invention is a compound having an ethylenically unsaturated bond at the terminal or side chain and / or a compound having epoxy or oxetane at the terminal or side chain. Of these, compounds having an ethylenically unsaturated bond at the terminal or side chain are preferred. Examples of compounds having an ethylenically unsaturated bond at the terminal or side chain include (meth) acrylate compounds (acrylates and methacrylates are collectively referred to as (meth) acrylates), acrylamide compounds, styrene compounds, and anhydrous maleic compounds. An acid etc. are mentioned.

As the (meth) acrylate compound, (meth) acrylate, urethane (meth) acrylate, polyester (meth) acrylate, epoxy (meth) acrylate and the like are preferable.
As the styrene compound, styrene, α-methylstyrene, 4-methylstyrene, divinylbenzene, 4-hydroxystyrene, 4-carboxystyrene and the like are preferable.

Although the specific example of a (meth) acrylate type compound is shown below, this invention is not limited to these.

(Polymerization initiator)
The organic layer in the present invention is usually obtained by coating and curing a polymerizable composition, but the polymerizable composition may contain a polymerization initiator. When using a photoinitiator, it is preferable that the content is 0.1 mol% or more of the total amount of the polymerizable compounds, and more preferably 0.5 to 2 mol%. By setting it as such a composition, the polymerization reaction via an active component production | generation reaction can be controlled appropriately. Examples of the photopolymerization initiator include Irgacure series (for example, Irgacure 651, Irgacure 754, Irgacure 184, Irgacure 2959, Irgacure 907, Irgacure 369, Irgacure 379, Irgacure, commercially available from Ciba Specialty Chemicals. 819), Darocure series (eg, Darocur TPO, Darocur 1173, etc.), Quantacure PDO, Ezacure series (eg, Ezacure TZM, Ezacure TZT, commercially available from Sartomer). Etc.).

(Formation method of organic layer)
A method for forming the organic layer is not particularly defined, but for example, it can be formed by a solution coating method or a vacuum film forming method. Examples of the solution coating method include a dip coating method, an air knife coating method, a curtain coating method, a roller coating method, a wire bar coating method, a gravure coating method, a slide coating method, or a method described in US Pat. No. 2,681,294. It can apply | coat by the extrusion coat method which uses a hopper. Although there is no restriction | limiting in particular as a vacuum film-forming method, Film-forming methods, such as vapor deposition and plasma CVD, are preferable. In the present invention, a polymer may be applied by solution, or a hybrid coating method containing an inorganic substance as disclosed in Japanese Patent Application Laid-Open Nos. 2000-323273 and 2004-25732 may be used.

(Crosslinking method of polymerizable compound)
In the present invention, the polymerizable compound is irradiated with heat or various energy rays to polymerize and crosslink, thereby forming an organic layer mainly composed of a polymer. Examples of energy rays include ultraviolet rays, visible rays, infrared rays, electron beams, X-rays, and gamma rays. At this time, a thermal polymerization initiator is used for polymerization with heat, a photopolymerization initiator is used for polymerization with ultraviolet light, and a photopolymerization initiator and a sensitizer are used for polymerization with visible light. In the above, it is preferable to superpose | polymerize and bridge | crosslink the polymeric compound containing a photoinitiator with an ultraviolet-ray.

In the present invention, a composition containing a polymerizable compound is usually cured by irradiation with light, but the irradiation light is usually ultraviolet light from a high-pressure mercury lamp or a low-pressure mercury lamp. The irradiation energy is preferably 0.5 J / cm ² or more, and more preferably ² J / cm ² or more. In the case of a (meth) acrylate-based compound, since polymerization is inhibited by oxygen in the air, it is preferable to reduce the oxygen concentration or oxygen partial pressure during polymerization. When the oxygen concentration during polymerization is lowered by the nitrogen substitution method, the oxygen concentration is preferably 2% or less, and more preferably 0.5% or less. When the oxygen partial pressure during polymerization is reduced by the decompression method, the total pressure is preferably 1000 Pa or less, and more preferably 100 Pa or less. Further, it is particularly preferable to perform ultraviolet polymerization by irradiating energy of ² J / cm ² or more under a reduced pressure condition of 100 Pa or less.

 The organic layer in the present invention is preferably smooth and has high film hardness. The smoothness of the organic layer is preferably less than 1 nm as average roughness (Ra value) of 1 μm square, and more preferably less than 0.5 nm. The polymerization rate of the monomer is preferably 85% or more, more preferably 88% or more, further preferably 90% or more, and particularly preferably 92% or more. The polymerization rate here means the ratio of the reacted polymerizable groups among all the polymerizable groups (acryloyl group and methacryloyl group) in the monomer mixture. The polymerization rate can be quantified by an infrared absorption method.

The film thickness of the organic layer is not particularly limited, but if it is too thin, it is difficult to obtain film thickness uniformity, and if it is too thick, cracks are generated due to external force and the barrier property is lowered. From this viewpoint, the thickness of the organic layer is preferably 50 nm to 2000 nm, and more preferably 200 nm to 1500 nm.
The organic layer is preferably smooth as described above. The smoothness of the organic layer is preferably less than 1 nm and more preferably less than 0.5 nm as an average roughness (Ra value) of 1 μm square. The surface of the organic layer is required to be free of foreign matters such as particles and protrusions. For this reason, it is preferable that the organic layer is formed in a clean room. The degree of cleanness is preferably class 10000 or less, more preferably class 1000 or less.
It is preferable that the organic layer has a high hardness. It has been found that when the hardness of the organic layer is high, the inorganic layer is formed smoothly and as a result, the barrier ability is improved. The hardness of the organic layer can be expressed as a microhardness based on the nanoindentation method. The microhardness of the organic layer is preferably 150 N / mm or more, more preferably 180 N / mm or more, and particularly preferably 200 N / mm or more.
It is preferable to laminate two or more organic layers. In this case, at least one layer may be the above organic layer, and the other organic layer may be the above organic layer or an organic layer derived from another composition. In addition, as one layer of the organic layer, as disclosed in US 2004-46497, the interface with the inorganic layer is not clear and the composition changes continuously in the film thickness direction. Also good.

(Base film)
The gas barrier film in the present invention usually uses a plastic film as the base film. The plastic film to be used is not particularly limited in material, thickness and the like as long as it can hold a laminate such as an organic layer and an inorganic layer, and can be appropriately selected according to the purpose of use. Specific examples of the plastic film include a metal support (aluminum, copper, stainless steel, etc.), polyester resin, methacrylic resin, methacrylic acid-maleic acid copolymer, polystyrene resin, transparent fluororesin, polyimide, and fluorinated polyimide. Resin, polyamide resin, polyamideimide resin, polyetherimide resin, cellulose acylate resin, polyurethane resin, polyether ether ketone resin, polycarbonate resin, alicyclic polyolefin resin, polyarylate resin, polyethersulfone resin, polysulfone resin, cyclohexane Examples thereof include thermoplastic resins such as olefin filler copolymer, fluorene ring-modified polycarbonate resin, alicyclic ring-modified polycarbonate resin, fluorene ring-modified polyester resin, and acryloyl compound. Of these, polyester resins (for example, polyethylene terephthalate (PET) and polyethylene naphthalate (PEN)) are preferable.

  When the gas barrier film of the present invention is used as a substrate for a device such as an organic EL element described later, the plastic film is preferably made of a material having heat resistance. Specifically, it is preferable that the glass transition temperature (Tg) is 100 ° C. or higher and / or the linear thermal expansion coefficient is 40 ppm / ° C. or lower and is made of a transparent material having high heat resistance. Tg and a linear expansion coefficient can be adjusted with an additive. As such a thermoplastic resin, for example, polyethylene naphthalate (PEN: 120 ° C.), polycarbonate (PC: 140 ° C.), alicyclic polyolefin (for example, ZEONOR 1600: 160 ° C. manufactured by Nippon Zeon Co., Ltd.), polyarylate ( PAr: 210 ° C., polyethersulfone (PES: 220 ° C.), polysulfone (PSF: 190 ° C.), cycloolefin copolymer (COC: Japanese Patent Application Laid-Open No. 2001-150584 compound: 162 ° C.), polyimide (for example, Mitsubishi Gas Chemical) Neoprim: 260 ° C.), fluorene ring-modified polycarbonate (BCF-PC: compound of JP 2000-227603 A: 225 ° C.), alicyclic modified polycarbonate (IP-PC: compound of JP 2000-227603 A) : 205 ° C), acryloyl compound (Compound described in JP-A 2002-80616: 300 ° C. or more) (the parenthesized data are Tg). In particular, when transparency is required, it is preferable to use an alicyclic polyolefin or the like.

  When the gas barrier film of the present invention is used in combination with a polarizing plate, it is preferable that the barrier laminate of the gas barrier film faces the inside of the cell and is arranged on the innermost side (adjacent to the element). At this time, since the gas barrier film is disposed inside the cell from the polarizing plate, the retardation value of the gas barrier film is important. The usage form of the gas barrier film in such an embodiment includes a gas barrier film using a base film having a retardation value of 10 nm or less and a circularly polarizing plate (1/4 wavelength plate + (1/2 wavelength plate) + linearly polarizing plate. ) Or a linear barrier plate combined with a gas barrier film using a base film having a retardation value of 100 nm to 180 nm, which can be used as a quarter wavelength plate.

As a base film having a retardation of 10 nm or less, cellulose triacetate (Fuji Film Co., Ltd .: Fuji Tac), polycarbonate (Teijin Chemicals Co., Ltd .: Pure Ace, Kaneka: Elmec Co., Ltd.), cycloolefin polymer (JSR Co., Ltd.) ): Arton, Nippon Zeon Co., Ltd .: Zeonoa), cycloolefin copolymer (Mitsui Chemicals Co., Ltd .: Appel (pellet), Polyplastic Co., Ltd .: Topas (pellet)) Polyarylate (Unitika Co., Ltd.): U100 (pellet) )), Transparent polyimide (Mitsubishi Gas Chemical Co., Ltd .: Neoprim) and the like.
Moreover, as a quarter wavelength plate, the film adjusted to the desired retardation value by extending | stretching said film suitably can be used.

Since the gas barrier film of the present invention is used as a device such as an organic EL element, the plastic film is transparent, that is, the light transmittance is usually 80% or more, preferably 85% or more, more preferably 90% or more. It is. The light transmittance is calculated by measuring the total light transmittance and the amount of scattered light using the method described in JIS-K7105, that is, an integrating sphere light transmittance measuring device, and subtracting the diffuse transmittance from the total light transmittance. be able to.
Even when the gas barrier film of the present invention is used for display, transparency is not necessarily required when it is not installed on the observation side. Therefore, in such a case, an opaque material can be used as the plastic film. Examples of the opaque material include polyimide, polyacrylonitrile, and known liquid crystal polymers.
The thickness of the plastic film used for the gas barrier film of the present invention is appropriately selected depending on the application and is not particularly limited, but is typically 1 to 800 μm, preferably 10 to 200 μm. These plastic films may have functional layers such as a transparent conductive layer and a primer layer. The functional layer is described in detail in paragraph numbers 0036 to 0038 of JP-A-2006-289627. Examples of functional layers other than these include matting agent layers, protective layers, antistatic layers, smoothing layers, adhesion improving layers, light shielding layers, antireflection layers, hard coat layers, stress relaxation layers, antifogging layers, and antifouling layers. , Printing layer, easy adhesion layer and the like.

(Display element)
Examples of the display element in the present invention include a liquid crystal display element, a touch panel, an organic EL element, a thin film transistor (TFT) image display element, and electronic paper.

Liquid crystal display element A reflective liquid crystal display device has a configuration comprising, in order from the bottom, a lower substrate, a reflective electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, a transparent electrode, an upper substrate, a λ / 4 plate, and a polarizing film. . In the case of color display, it is preferable to further provide a color filter layer between the reflective electrode and the lower alignment film, or between the upper alignment film and the transparent electrode.
The transmissive liquid crystal display device includes, in order from the bottom, a backlight, a polarizing plate, a λ / 4 plate, a lower transparent electrode, a lower alignment film, a liquid crystal layer, an upper alignment film, an upper transparent electrode, an upper substrate, a λ / 4 plate, and a polarization It has the structure which consists of a film | membrane. In the case of color display, it is preferable to further provide a color filter layer between the lower transparent electrode and the lower alignment film, or between the upper alignment film and the transparent electrode.
The type of the liquid crystal cell is not particularly limited, but more preferably TN (Twisted Nematic) type, STN (Super Twisted Nematic) type, HAN (Hybrid Aligned Nematic) type, VA (Vertically Alignment) type, ECB type (Electrically Controlled Birefringence) OCB type (Optically Compensated Bend), IPS type (In-Plane Switching), and CPA type (Continuous Pinwheel Alignment) are preferable.

Touch Panel The touch panel can be applied to those described in JP-A-5-127822, JP-A-2002-48913, and the like.

Organic EL element An organic EL element means an organic electroluminescence element. The organic EL element has a cathode and an anode on a substrate, and an organic compound layer including a light emitting layer between both electrodes. Due to the nature of the light emitting element, at least one of the anode and the cathode is transparent.

 As an aspect of lamination of the organic compound layer in the present invention, an aspect in which a hole transport layer, a light emitting layer, and an electron transport layer are laminated in this order from the anode side is preferable. Furthermore, a charge blocking layer or the like may be provided between the hole transport layer and the light-emitting layer, or between the light-emitting layer and the electron transport layer. A hole injection layer may be provided between the anode and the hole transport layer, and an electron injection layer may be provided between the cathode and the electron transport layer. Further, the light emitting layer may be a single layer, or the light emitting layer may be divided into a first light emitting layer, a second light emitting layer, a third light emitting layer, and the like. Furthermore, each layer may be divided into a plurality of secondary layers.

Next, each element which comprises an organic EL element is demonstrated in detail.
Substrate The substrate used for the organic EL device in the present invention may be the gas barrier film of the present invention or a substrate used for a known organic EL device. When employing a known substrate, it may be a resin film or a gas barrier film. In the case of a gas barrier film, the gas barrier films described in JP-A No. 2004-136466, JP-A No. 2004-148766, JP-A No. 2005-246716, JP-A No. 2005-262529, and the like can also be preferably used.

  When a known substrate is employed, the thickness is not particularly limited, but is preferably 30 μm to 700 μm, more preferably 40 μm to 200 μm, and still more preferably 50 μm to 150 μm. Further, in any case, the haze is preferably 3% or less, more preferably 2% or less, further preferably 1% or less, and the total light transmittance is preferably 70% or more, more preferably 80% or more, and further preferably 90%. That's it.

Anode The anode usually has a function as an electrode for supplying holes to the organic compound layer, and there is no particular limitation on the shape, structure, size, etc., depending on the use and purpose of the light-emitting element. Thus, it can be appropriately selected from known electrode materials. As described above, the anode is usually provided as a transparent anode. The transparent anode is described in detail in Yutaka Sawada's “New Development of Transparent Electrode Film” published by CMC (1999). When using a plastic substrate with low heat resistance as the substrate, ITO or IZO is used, and a transparent anode formed at a low temperature of 150 ° C. or lower is preferable.

Cathode The cathode usually has a function as an electrode for injecting electrons into the organic compound layer, and there is no particular limitation on the shape, structure, size, etc., depending on the use and purpose of the light-emitting element. , Can be appropriately selected from known electrode materials.

 Examples of the material constituting the cathode include metals, alloys, metal oxides, electrically conductive compounds, and mixtures thereof. Specific examples include Group 2 metals (eg, Mg, Ca, etc.), gold, silver, lead, aluminum, lithium-aluminum alloys, magnesium-silver alloys, rare earth metals such as indium, ytterbium, and the like. These may be used alone, but two or more can be suitably used in combination from the viewpoint of achieving both stability and electron injection.

Among these, as a material constituting the cathode, a material mainly composed of aluminum is preferable.
The material mainly composed of aluminum refers to aluminum alone or an alloy of aluminum and 0.01 to 10% by mass of an alkali metal or a Group 2 metal (for example, lithium-aluminum alloy, magnesium-aluminum alloy, etc.). The cathode material is described in detail in JP-A-2-15595 and JP-A-5-121172. Further, a dielectric layer made of a fluoride or oxide of an alkali metal or a Group 2 metal may be inserted between the cathode and the organic compound layer with a thickness of 0.1 to 5 nm. This dielectric layer can also be regarded as a kind of electron injection layer.

The thickness of the cathode can be appropriately selected depending on the material constituting the cathode and cannot be generally defined, but is usually about 10 nm to 5 μm, and preferably 50 nm to 1 μm.
Further, the cathode may be transparent or opaque. The transparent cathode can be formed by depositing a thin cathode material to a thickness of 1 to 10 nm and further laminating a transparent conductive material such as ITO or IZO.

Light-Emitting Layer The organic EL element has at least one organic compound layer including a light-emitting layer, and as the organic compound layer other than the organic light-emitting layer, as described above, a hole transport layer, an electron transport layer, a charge Examples of the layer include a block layer, a hole injection layer, and an electron injection layer.

-Organic light emitting layer-
The organic light-emitting layer receives holes from the anode, the hole injection layer, or the hole transport layer when an electric field is applied, and receives electrons from the cathode, the electron injection layer, or the electron transport layer, and recombines the holes and electrons. It is a layer having a function of providing light and emitting light. The light emitting layer may be composed of only the light emitting material, or may be a mixed layer of the host material and the light emitting material. The light emitting material may be a fluorescent light emitting material or a phosphorescent light emitting material, and the dopant may be one type or two or more types. The host material is preferably a charge transport material. The host material may be one kind or two or more kinds, and examples thereof include a configuration in which an electron transporting host material and a hole transporting host material are mixed. Furthermore, the light emitting layer may include a material that does not have charge transporting properties and does not emit light. Further, the light emitting layer may be a single layer or two or more layers, and each layer may emit light in different emission colors.

  Examples of the fluorescent light-emitting material include, for example, benzoxazole derivatives, benzimidazole derivatives, benzothiazole derivatives, styrylbenzene derivatives, polyphenyl derivatives, diphenylbutadiene derivatives, tetraphenylbutadiene derivatives, naphthalimide derivatives, coumarin derivatives, condensed aromatics. Compound, perinone derivative, oxadiazole derivative, oxazine derivative, aldazine derivative, pyralidine derivative, cyclopentadiene derivative, bisstyrylanthracene derivative, quinacridone derivative, pyrrolopyridine derivative, thiadiazolopyridine derivative, cyclopentadiene derivative, styrylamine derivative, di Typical examples include ketopyrrolopyrrole derivatives, aromatic dimethylidin compounds, metal complexes of 8-quinolinol derivatives and metal complexes of pyromethene derivatives. Various metal complexes are, polythiophene, polyphenylene, polyphenylene vinylene polymer compounds include compounds such as organic silane derivatives.

Examples of the phosphorescent material include a complex containing a transition metal atom or a lanthanoid atom.
Although it does not specifically limit as said transition metal atom, Preferably, ruthenium, rhodium, palladium, tungsten, rhenium, osmium, iridium, and platinum are mentioned, More preferably, they are rhenium, iridium, and platinum.
Examples of the lanthanoid atom include lanthanum, cerium, praseodymium, neodymium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium. Among these lanthanoid atoms, neodymium, europium, and gadolinium are preferable.

  Examples of the ligand of the complex include G. Wilkinson et al., Comprehensive Coordination Chemistry, Pergamon Press, 1987, H. Yersin, “Photochemistry and Photophysics of Coordination Compounds,” Springer-Verlag, 1987, Akio Yamamoto. Examples of the ligands described in the book “Organic Metal Chemistry-Fundamentals and Applications-” published in 1982 by Hankabosha.

  Examples of the host material contained in the light emitting layer include those having a carbazole skeleton, those having a diarylamine skeleton, those having a pyridine skeleton, those having a pyrazine skeleton, those having a triazine skeleton, and those having an arylsilane skeleton. And materials exemplified in the sections of a hole injection layer, a hole transport layer, an electron injection layer, and an electron transport layer described later.

-Hole injection layer, hole transport layer-
The hole injection layer and the hole transport layer are layers having a function of receiving holes from the anode or the anode side and transporting them to the cathode side. Specifically, the hole injection layer and the hole transport layer are carbazole derivatives, triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, polyarylalkane derivatives, pyrazoline derivatives, pyrazolone derivatives, phenylenediamine derivatives, arylamines. Derivatives, amino-substituted chalcone derivatives, styrylanthracene derivatives, fluorenone derivatives, hydrazone derivatives, stilbene derivatives, silazane derivatives, aromatic tertiary amine compounds, styrylamine compounds, aromatic dimethylidin compounds, porphyrin compounds, organosilane derivatives, carbon , Etc. are preferable.

-Electron injection layer, electron transport layer-
The electron injection layer and the electron transport layer are layers having a function of receiving electrons from the cathode or the cathode side and transporting them to the anode side. Specifically, the electron injection layer and the electron transport layer are triazole derivatives, oxazole derivatives, oxadiazole derivatives, imidazole derivatives, fluorenone derivatives, anthraquinodimethane derivatives, anthrone derivatives, diphenylquinone derivatives, thiopyran dioxide derivatives, Carbodiimide derivatives, fluorenylidenemethane derivatives, distyrylpyrazine derivatives, aromatic tetracarboxylic anhydrides such as naphthalene and perylene, phthalocyanine derivatives, metal complexes of 8-quinolinol derivatives, metal phthalocyanines, benzoxazoles and benzothiazoles as ligands It is preferably a layer containing various metal complexes typified by metal complexes, organosilane derivatives, and the like.

-Hole blocking layer-
The hole blocking layer is a layer having a function of preventing holes transported from the anode side to the light emitting layer from passing through to the cathode side. In the present invention, a hole blocking layer can be provided as an organic compound layer adjacent to the light emitting layer on the cathode side. In addition, the electron transport layer / electron injection layer may also function as a hole blocking layer.
Examples of the organic compound constituting the hole blocking layer include aluminum complexes such as BAlq, triazole derivatives, phenanthroline derivatives such as BCP, and the like.
In addition, a layer having a function of preventing electrons transported from the cathode side to the light emitting layer from passing through to the anode side can be provided at a position adjacent to the light emitting layer on the anode side. The hole transport layer / hole injection layer may also serve this function.

  The present invention will be described more specifically with reference to the following examples. The materials, amounts used, ratios, processing details, processing procedures, and the like shown in the following examples can be changed as appropriate without departing from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below.

[Example 1] Production and evaluation of gas barrier film (1)
A gas barrier film (sample Nos. 101 to 115) in which an inorganic layer and an organic layer were provided on a base film was produced according to the following procedure. Details of the structure of each gas barrier film are as shown in Table 1. Polyethylene naphthalate (PEN, thickness 100 μm, manufactured by Teijin DuPont Co., Ltd., Q65A) film was used as the base film.

[1] Formation of inorganic layer (X) An inorganic layer of aluminum oxide was formed using a reactive sputtering apparatus. Specific film forming conditions are shown below.
The vacuum chamber of the reactive sputtering apparatus was evacuated to an ultimate pressure 5 × 10 ^-4 Pa by an oil rotary pump and a turbo molecular pump. Next, argon was introduced as a plasma gas, and power of 2000 W was applied from a plasma power source. A high-purity oxygen gas was introduced into the chamber, the film formation pressure was adjusted to 0.3 Pa, and the film was formed for a certain period of time to form an aluminum oxide inorganic layer. The obtained aluminum oxide film had a thickness of 40 nm and a film density of 3.01 g / cm ³ .

[2] Formation of organic layer (Y, W, Z, V, U) The organic layer is formed by a film formation method (organic layer Y, W, V, U) by solvent coating under normal pressure and flash deposition under reduced pressure. The four film forming methods (organic layer Z) were used. Specific film formation contents are shown below.
[2-1] Formation of Organic Layer (Y) by Solvent Application at Normal Pressure 9 g of tripropylene glycol diacrylate (TPGDA, manufactured by Daicel Cytec) as a photopolymerizable acrylate, and a photopolymerization initiator (Ciba Specialty) 0.1 g of Irgacure 907 manufactured by Chemicals was dissolved in 190 g of methyl ethyl ketone to prepare a coating solution. This coating solution is applied to a base film using a wire bar, and an irradiance is applied using an air-cooled metal halide lamp (manufactured by Eye Graphics Co., Ltd.) of 160 W / cm under a nitrogen purge with an oxygen concentration of 0.1% or less. An organic layer (Y) was formed by irradiating ultraviolet rays at 350 mW / cm ² and an irradiation amount of 500 mJ / cm ² . The film thickness was about 500 nm.
[2-2] Formation of Organic Layer (W) by Solvent Application under Normal Pressure Instead of tripropylene glycol diacrylate (TPGDA) as a photopolymerizable acrylate, dipentaerythritol hexaacrylate (DPHA: manufactured by Shin-Nakamura Chemical Co., Ltd.) ) Was followed except that the organic layer Y was formed. The film thickness was about 500 nm.

[2-3] Deposition of organic layer (Z) by flash vapor deposition under reduced pressure 9.7 g of butylethylpropanediol diacrylate (BEPGA, manufactured by Kyoeisha Chemical Co., Ltd.) as a photopolymerizable acrylate, and a photopolymerization initiator (Lamberti spa) Manufactured by EZACURE-TZT) was mixed to obtain a vapor deposition solution. This vapor deposition solution was vapor-deposited on the substrate by a flash vapor deposition method under the condition that the internal pressure of the vacuum chamber was 3 Pa. Then the conditions of the same degree of vacuum, thereby forming an organic layer Z and an irradiation dose of 2J / cm ^2. The film thickness was about 1200 nm. The organic layer Z was formed using an organic / inorganic laminated film forming apparatus Guardian 200 (manufactured by Vytex Systems).

[2-4] Film Formation of Organic Layer (V) by Solvent Application under Normal Pressure 9 g of bisphenol A type epoxy acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK Oligo EA-1020) and photopolymerization initiator ( 0.1 g of Irgacure 907, manufactured by Ciba Specialty Chemicals, was dissolved in 190 g of methyl ethyl ketone to obtain a coating solution. This coating solution is applied to a base film using a wire bar, and an irradiance is applied using an air-cooled metal halide lamp (manufactured by Eye Graphics Co., Ltd.) of 160 W / cm under a nitrogen purge with an oxygen concentration of 0.1% or less. An organic layer (Y) was formed by irradiating ultraviolet rays at 350 mW / cm ² and an irradiation amount of 500 mJ / cm ² . The film thickness was about 500 nm.

[2-5] Formation of Organic Layer (U) by Solvent Application under Normal Pressure Instead of bisphenol A type epoxy acrylate (manufactured by Shin-Nakamura Chemical Co., Ltd., NK Oligo EA-1020) as photopolymerizable acrylate, epoxy acrylate (Daicel) -The film-forming conditions of the organic layer V were followed except having used CY3702 by Cytec. The film thickness was about 500 nm.

[3] Formation of Barrier Resin Layer (P) The barrier resin layer was formed using the following 6 types. Specific film formation contents are shown below.
[3-1] Formation of Barrier Resin Layer (P-1) Polyvinyl alcohol (PVA117H, manufactured by Kuraray Co., Ltd.) was dissolved in pure water at 2% by weight to obtain a coating solution. This coating solution was applied to a base film using a wire bar and dried at 80 ° C. to form a barrier resin layer (P-1). The film thickness was about 700 nm.
[3-2] Film Formation of Barrier Resin Layer (P-2) 15% by weight of vinylidene chloride copolymer (Saran Resin F216, manufactured by Asahi Kasei Kogyo) in a mixed solvent of toluene / tetrahydrofuran = 1/2 (weight ratio) It dissolved so that it might become, and it was set as the coating liquid. This coating solution was applied to a base film using a wire bar and dried at 105 ° C. to form a barrier resin layer (P-2). The film thickness was about 2.5 μm.
[3-3] Film Formation of Barrier Resin Layer (P-3) Ethylene-vinyl alcohol copolymer (Soarnol 30L, manufactured by Nippon Synthetic Chemical Industry) was mixed in pure water / isopropanol = 1/1 (weight ratio). It was dissolved in a solvent so as to be 12% by weight to obtain a coating solution. Was prepared. This coating solution was applied to a base film using a wire bar and dried at 110 ° C. to form a barrier resin layer (P-3). The film thickness was about 2 μm.
[3-4] Film Formation of Barrier Resin Layer (P-4) Synthetic mica (tetrasilica mica (Na-Ts), manufactured by Topy Industries) was dispersed in pure water so as to be 0.65% by weight. A dispersion (1) and a solution (2) obtained by dissolving polyvinyl alcohol (PVA210, manufactured by Kuraray Co., Ltd.) in pure water so as to be 0.325% by weight, a dispersion (1) and a solution (2) are solid components. The coating solution was mixed so that the ratio (volume ratio) was (1) / (2) = 3/7. This coating liquid was apply | coated to the base film using the wire bar, and the barrier resin layer (P-4) was formed. The film thickness was about 1 μm.
[3-5] Film Formation of Barrier Resin Layer (P-5) Barrier resin layer (P-) except that hydroxyethyl cellulose (manufactured by Wako Pure Chemical Industries, Ltd.) was used instead of polyvinyl alcohol in the solution (2). The film-forming conditions of 4) were followed. The film thickness was about 1 μm.
[3-6] Film Formation of Barrier Resin Layer (P-6) 9 g of dipentaerythritol hexaacrylate (DPHA, manufactured by Shin-Nakamura Chemical Co., Ltd.) as a photopolymerizable acrylate, and a photopolymerization initiator (manufactured by Ciba Specialty Chemicals) , Irgacure 907) 0.1 g was dissolved in 190 g of methyl ethyl ketone to prepare a coating solution. This coating solution is applied to a base film using a wire bar, and an irradiance is applied using an air-cooled metal halide lamp (manufactured by Eye Graphics Co., Ltd.) of 160 W / cm under a nitrogen purge with an oxygen concentration of 0.1% or less. A barrier resin layer (P-6) was formed by irradiating with ultraviolet rays of 350 mW / cm ² and an irradiation amount of 1 J / cm ² . The film thickness was about 1 μm.

[4] Production of Gas Barrier Film A gas barrier film was produced by sequentially forming the inorganic layer and the organic layer on the base film according to the configuration of each sample described in Table 1. The production method was performed in the following three ways.
[4-1] Method of repeating organic layer formation by solvent coating and inorganic layer formation under reduced pressure (Lamination A)
Organic layers and inorganic layers were alternately laminated on the substrate. When stacking the inorganic layer on the organic layer is placed in a vacuum chamber after forming the organic layer by solution coating under reduced pressure, the inorganic layer was held constant time following the state vacuum of 10 ^-3 Pa Was deposited. When the organic layer was laminated on the inorganic layer, the organic layer was formed by solvent coating immediately after the inorganic layer was formed.
[4-2] Method for consistently forming an organic layer and an inorganic layer under reduced pressure (Lamination B)
The organic layer and the inorganic layer were laminated | stacked using the above-mentioned organic-inorganic laminated film-forming apparatus Guardian200. In this apparatus, both the organic layer and the inorganic layer are formed in a reduced pressure environment, and the organic and inorganic layer forming chambers are connected. Therefore, it is possible to continuously form the film in a reduced pressure environment. Therefore, it is not released to the atmosphere until the barrier layer is completed.
[4-3] Method of depositing an organic layer by solvent coating only on the first layer, and forming a remaining layer under reduced pressure (laminate C)
A first organic layer was formed on the substrate by a solvent coating method. Subsequently, the substrate having the first organic layer was placed in a vacuum chamber and depressurized, and after maintaining for a certain period of time in a state where the degree of vacuum was 10 ⁻³ Pa or less, inorganic layers and organic layers were alternately formed.

[5] Physical property evaluation of gas barrier film Various physical properties of the gas barrier film were evaluated using the following apparatus.
[Layer structure (film thickness)]
The ultra-thin section of the film sample was observed and measured with a scanning electron microscope “S-900 type” manufactured by Hitachi, Ltd.

[Water vapor transmission rate (g / m ² / day)]
It was measured using “PERMATRAN-W3 / 31” (condition: 40 ° C., relative humidity 90%) manufactured by MOCON. Moreover, the value below 0.01 g / m < ² > / day which is the measurement limit of the said MOCON apparatus was supplemented using the following method. First, metal Ca was vapor-deposited directly on the gas barrier film, and the measurement sample was produced by sealing the film and the glass substrate with a commercially available organic EL encapsulant so that the vapor-deposited Ca was inside. Next, the measurement sample was kept under the above temperature and humidity conditions, and the water vapor transmission rate was determined from the change in optical density of the metal Ca on the gas barrier film (the metal gloss decreased due to hydroxylation or oxidation). Details were measured with reference to the methods described in the following references.
<References>
G.NISATO, PCPBOUTEN, PJSLIKKERVEER et al. SID Conference Record of the International Display Research Conference 1435-1438

[Measurement of X-ray reflectivity (film density of inorganic layer)]
Measurement was performed using an ATX-G manufactured by Rigaku Corporation using an evaluation sample in which an inorganic layer was formed on a Si wafer. The film density of the inorganic layer thin film was calculated from the measurement results.

[Example 2] Production and evaluation of gas barrier film (2)
A gas barrier film (Sample Nos. 201 to 208) was produced according to Table 2 in the same manner as in Example 1 except that polyethylene terephthalate (PET, thickness 100 μm, Toray Industries, Inc., Lumirror T60) was used as the base film. .

[Example 3] Preparation and evaluation of organic EL element (1)
[1] Production of Organic EL Element Substrate A conductive glass substrate having an ITO film (surface resistance value 10Ω / □) was washed with 2-propanol, and then subjected to UV-ozone treatment for 10 minutes. The following organic compound layers were sequentially deposited on this substrate (anode) by vacuum deposition.
(First hole transport layer)
Copper phthalocyanine: film thickness 10nm
(Second hole transport layer)
N, N′-diphenyl-N, N′-dinaphthylbenzidine: film thickness 40 nm
(Light emitting layer and electron transport layer)
Tris (8-hydroxyquinolinato) aluminum: film thickness 60nm
Finally, 1 nm of lithium fluoride and 100 nm of metal aluminum were sequentially deposited to form a cathode, and a 3 μm thick silicon nitride film was formed thereon by a parallel plate CVD method to produce an organic EL device.

[2] Installation of gas barrier layer on organic EL element Using a thermosetting adhesive (Epotec 310, Daizonitomoly Co., Ltd.), the barrier film and the organic EL element substrate prepared in Example 1 above Bonding was performed so that the barrier layer was on the organic EL element side, and the adhesive was cured by heating at 65 ° C. for 3 hours. 20 organic EL elements (Sample Nos. 301 to 315) sealed in this way were produced.

[3] Evaluation of organic EL element light emitting surface (1)
The organic EL element (sample Nos. 301 to 315) immediately after fabrication was made to emit light by applying a voltage of 7 V using a source measure unit (SMU2400 type, manufactured by Keithley). When the surface of the light emitting surface was observed using a microscope, it was confirmed that all the elements gave uniform light emission without dark spots.
Next, each element was allowed to stand in a dark room at 60 ° C. and 90% relative humidity for 24 hours, and then the light emitting surface state was observed. The ratio of elements in which dark spots larger than 300 μm in diameter were observed was defined as the failure rate. Table 3 shows the failure rate of each element.

[Example 4] Preparation and evaluation of organic EL element (2)
Using the gas barrier film produced in Example 2 as a sealing film, the sealed organic EL element (sample No. 401-408) was produced. When installing a gas barrier layer on an organic EL element, inside a glove box substituted with argon gas using an ultraviolet curable adhesive (XNR5516HV, manufactured by Nagase Ciba) instead of a thermosetting adhesive And cured by irradiating with ultraviolet rays. In the same manner as in Example 3, each element was evaluated for failure rate after standing at 60 ° C., relative humidity 90%, 24 hours. The results are shown in Table 4.

[Example 5] Production of organic EL device using gas barrier film as substrate (1)
The gas barrier film produced in Example 1 was introduced into a vacuum chamber, and a transparent electrode made of an ITO thin film having a thickness of 0.2 μm was formed by DC magnetron sputtering using an ITO target. A gas barrier film having an ITO film was placed in a cleaning container, subjected to ultrasonic cleaning in 2-propanol, and then subjected to UV-ozone treatment for 30 minutes. Using this substrate, organic EL elements (sample Nos. 501 to 508) were produced in the same manner as in Example 3. This element was flexible because both the substrate and the sealing film were mainly made of resin. In the same manner as in Example 3, each element was evaluated for failure rate after standing at 60 ° C., relative humidity 90%, 24 hours. The results are shown in Table 5.

 From the results of Tables 3 to 5, it was found that the barrier film having the barrier resin layer of the present invention has a lower failure rate of the organic EL element and is superior to the barrier film not having the barrier resin layer. Further, it was found that the barrier film of the present invention is effective both as a sealing film and as a substrate for an organic EL device.

The schematic at the time of using the conventional gas barrier film and the gas barrier film of this invention for the sealing film of an organic EL element is shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Base film 2 Organic / inorganic laminated gas barrier layer 3 Barrier resin layer 4 Substrate 5 Laminate

Claims (14)

One side of the base film has a gas barrier layer having at least one organic region and at least one inorganic region, and the other side of the base film has a barrier performance as a layer having a barrier performance. The gas barrier film which has only the layer which has the resin which has it as a main component. The gas barrier film according to claim 1, wherein the gas barrier layer has at least one organic layer and at least one inorganic layer. The gas barrier film according to claim 1 or 2, wherein the resin of the layer mainly composed of a resin having barrier performance is polyvinyl alcohol. The gas barrier film according to claim 1 or 2, wherein the resin of the layer mainly composed of a resin having barrier performance is a polyfunctional acrylate. The gas barrier film according to any one of claims 2 to 4, wherein the organic layer is obtained by curing a composition containing at least one (meth) acrylate having a bisphenol skeleton. The gas barrier film according to any one of claims 1 to 5, wherein the main component of the organic layer and the layer mainly composed of a resin having barrier performance are the same. The gas barrier film according to any one of claims 1 to 6, wherein the thickness of a layer mainly composed of a resin having barrier performance is 0.5 to 30 µm. The gas barrier film according to any one of claims 1 to 7, wherein the gas barrier film has a thickness of 10 to 300 µm. The gas barrier film according to any one of claims 1 to 8, which is used for a display element. It is a manufacturing method of the gas barrier film of any one of Claims 1-9, Comprising: After providing a gas barrier layer on a base film, providing the layer which has resin which has barrier performance as a main component. A method for producing a gas barrier film. The display element using the gas barrier film of any one of Claims 1-9. The display element according to claim 11, wherein the gas barrier film is used as a substrate of the display element. The display element according to claim 11, wherein the gas barrier film is used as a sealing film of the display element. The display element of any one of Claims 11-13 provided in the display element so that the layer which has resin which has the barrier performance of a gas barrier film as a main component may become an outer side.

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