JP2009081035A - Display device and manufacturing method thereof - Google Patents

Abstract

A display device with a uniform thickness of a charge transport layer and a method for manufacturing the same are provided.
A liquid repellent layer forming step of forming a liquid repellent layer on an insulating film formed on a surface of a substrate provided with an electrode; and the liquid repellent layer using a resist formed on the liquid repellent layer as a mask. Etching the layer and the insulating film to expose at least a part of the electrode and exposing the sidewall of the insulating film; and forming the insulating film sidewall to expose the liquid repellent layer by removing the resist A layer exposing step, and a charge transporting material-containing droplet lowering step of dropping a charge transporting material-containing solution containing a material that becomes a charge transporting layer in a region surrounded by the sidewall of the insulating film.
[Selection] Figure 3

Description

  The present invention relates to a display device having a light emitting element and a manufacturing method thereof, and more particularly to a display device having an organic EL (Electro Luminescence) element and a manufacturing method thereof.

As a method of forming a light emitting layer of an organic EL display device, a wet method is known in which a liquid containing a light emitting material of each color is applied to display pixels arranged on a substrate. In the wet method, display pixels are partitioned by partition walls, and each display pixel is surrounded by partition walls, whereby a liquid containing a light emitting material is dropped into the surrounded region to deposit various organic EL layers (for example, patents). Reference 1).
JP 2002-75640 A

  However, in such a configuration, if the partition is not formed sufficiently high with respect to the liquid level of the liquid containing the light-emitting material to be dropped, the liquid will spill over the adjacent display pixels beyond the partition. As a result, the film thickness of the charge transport layer formed for each display pixel may be non-uniform. In particular, since the containing liquid containing the light emitting material is dropped from a position higher than the dropping position on the substrate, there has been a problem that it is likely to be repelled outside from the region surrounded by the partition walls.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a display device having a uniform charge transport layer thickness and a method for manufacturing the same.

In order to achieve the above object, a manufacturing method of a display device according to the first aspect of the present invention includes:
A liquid repellent layer forming step of forming a liquid repellent layer on an insulating film formed on a surface of a substrate provided with an electrode;
Etching the liquid repellent layer and the insulating film using a resist formed on the liquid repellent layer as a mask to expose at least a part of the electrode and to expose a side wall of the insulating film;
Removing the resist to expose the liquid repellent layer;
A charge transport material-containing droplet lowering step of dropping a charge transport material-containing liquid containing a material to be a charge transport layer in a region surrounded by the sidewall of the insulating film;
Is provided.

  The resist may be a dry film resist.

  The film may include a compound having a functional group including at least one fluorine.

  It is also possible to provide a lyophilic process step of performing a lyophilic process on the exposed electrode and the sidewall of the insulating film before the process of the charge transport material-containing droplet lowering process.

  In the lyophilic treatment step, oxygen plasma treatment using oxygen as a processing gas or an ultraviolet irradiation treatment for irradiating ultraviolet rays can be performed in an air atmosphere.

  In the liquid repellent layer exposing step, the resist can be stripped by immersing the substrate in an organic alkaline stripper.

In order to achieve the above object, a display device according to the second aspect of the present invention provides:
The display device is manufactured by the manufacturing method.

  According to the present invention, the film thickness of the charge transport layer of the display pixel can be made uniform.

  A display device manufacturing method and a display device manufactured by the manufacturing method according to an embodiment of the present invention will be described below with reference to the drawings.

(Display device)
First, display device 100 manufactured by the method for manufacturing a display device according to the present embodiment will be described. The light emitting method of the display device 100 is a bottom emission type by an active matrix driving provided with an organic electroluminescence (hereinafter referred to as organic EL) layer. The organic EL layer includes a light emitting layer formed by applying an organic material as a light emitting element, a hole transport layer / electron transport layer formed by applying a material having a property of transporting carriers, and the like. As an example, the organic EL layer of the display device 100 according to the present embodiment has a two-layer structure of a hole transport layer and a light emitting layer.

  The display device 100 includes a panel substrate 110, a pixel electrode 120, an interlayer insulating film 130, a liquid repellent layer 140, a charge, as shown in a plan view in FIG. 1 and a cross section taken along line AA in FIG. A hole transport layer 150 that is a transport layer, a light emitting layer 160 that is a charge transport layer, a counter electrode 170, a sealing resin layer 180, and a sealing substrate 190 are provided. In the plan view shown in FIG. 1, the display of the sealing resin layer 180 and the like provided on each display pixel (color pixel) is omitted, and the pixel electrode 120 and an interlayer that defines the formation area of each display pixel are omitted. Only the insulating film 130 is shown. In addition, in order to clarify the arrangement of the pixel electrode 120 and the interlayer insulating film 130, hatching is shown for convenience.

  With these configurations, color pixels including three colors of red (R), green (G), and blue (B) are formed on one surface of the panel substrate 110. As shown in FIG. 1, a plurality of color pixels are sequentially arranged in the vertical direction of the drawing, and a plurality of color pixels of the same color are arranged in the horizontal direction of the drawing. Here, one display pixel is formed by combining adjacent three color pixels of RGB. Each display pixel is defined by an interlayer insulating film 130 continuously arranged with a planar pattern of a fence shape or a lattice shape. A pixel driving circuit composed of a plurality of transistors (not shown) is formed on the edge of the panel substrate 110, and the pixel driving circuit is covered with the interlayer insulating film 130 and connected to the pixel electrode 120. ing. Each color pixel constitutes, together with the pixel drive circuit, an organic EL element that emits light when supplied with a light emission drive current controlled by the pixel drive circuit.

  Next, a specific configuration will be described with reference to FIG. The panel substrate 110 is made of an insulating substrate such as glass. On each pixel formation region of the panel substrate 110, tin-doped indium oxide (ITO), zinc-doped indium oxide (Indium Zinc Oxide), tungsten-doped indium oxide (Indium Tungsten Oxide), tungsten-zinc-doped oxide. A pixel electrode 120 made of a transparent conductive material such as indium (Indium Tungsten Zinc Oxide) is provided. In addition, a pixel driving circuit connected to the pixel electrode 120 is provided around the pixel electrode 120. Further, an interlayer insulating film 130 is provided between the pixel formation regions of the panel substrate 110 so as to cover the periphery of the pixel driving circuit and the pixel electrode 120 and to open the central portion of the pixel electrode 120. The interlayer insulating film 130 is an insulating film having a thickness of 50 nm to 200 nm formed from an insulating material such as a silicon compound such as silicon nitride or silicon oxide, and electrically insulates adjacent pixel electrodes 120 from each other. A liquid repellent layer 140 having liquid repellency is provided on the interlayer insulating film 130. Note that the liquid repellent layer 140 is not coated on the opened side wall of the interlayer insulating film 130. On the pixel electrode 120 in the opening surrounded by the interlayer insulating film 130, the hole transport layer 150, the light emitting layer 160, and the counter electrode 170 are stacked in this order. Further, a sealing substrate 190 is bonded on the counter electrode 170 via a sealing resin layer 180.

  The liquid repellent layer 140 is formed on the interlayer insulating film 130 and is a general fluorine coating agent having liquid repellency (for example, a silazane oligomer having a fluoroalkyl chain as shown in Chemical Formula 1, a fluoroalkylsilane cup). Ring agent, fluorinated alkylsilane compound). Note that the silazane oligomer represented by Chemical Formula 1 may be a monomer having a dimer or higher structure.

  The hole transport layer 150 and the light emitting layer 160 are formed on the pixel electrode 120 by an organic EL material (organic EL material) by a nozzle printing method in which a continuous liquid is poured into a predetermined position or an ink jet method in which individually separated droplets are dropped at a predetermined position. In addition to the light emitting material, a material containing a property of transporting carriers (a hole injection material, an electron injection material, etc.) is included. It is formed. For example, as shown in Chemical Formula 2, the hole transport material is composed of polyethylene dioxythiophene, which is a conductive polymer, and ink containing water in which polystyrene sulfonic acid is dispersed in an aqueous solvent as a main component. The light emitting material is composed of a conjugated double bond polymer such as polyphenylene vinylene. The contained liquid is composed of, for example, a water-soluble or lipophilic solvent (water, ethanol, ethylene glycol, toluene, xylene, etc.). In addition, the light emitting layer 160 is added with a phosphor or a pigment that colors emitted light.

  As shown in FIG. 2, the counter electrode 170 is formed as a single electrode layer facing each pixel electrode 120 arranged on the panel substrate 110. The counter electrode 170 is a thin film having a low work function such as magnesium, calcium, barium, lithium, or indium having a thickness of 1 nm to 10 nm, and a high work including an aluminum, chromium, silver, palladium silver-based alloy having a thickness of 100 nm or more. It is a light reflective electrode having a laminated structure with a thin film of function.

  In each pixel formation region, a portion where the pixel electrode 120, the hole transport layer 150, the light emitting layer 160, and the counter electrode 170 are stacked forms each color pixel. Each color pixel is classified into one of RGB depending on the emission color determined by the fluorescent agent or the like included in the light emitting layer 160. Since the hole transport layer 150 and the light emitting layer 160 have a thickness of 80 nm to 170 nm, the upper surface of the light emitting layer 160 is lower than the upper surface of the interlayer insulating film 130.

  The panel substrate 110 on which the display pixels are arranged is bonded to the sealing substrate 190 via the sealing resin layer 180. The sealing resin layer 180 is made of, for example, an epoxy-based ultraviolet curable resin, and the sealing substrate 190 is made of, for example, a silicon oxide film or a silicon nitride film.

(Manufacturing method of display device)
Next, a method for manufacturing the display device 100 described above will be described with reference to FIG. In the following description, a method for forming a display portion of the display device 100, that is, a region where display pixels are formed on the panel substrate 110 will be mainly described. The manufacturing method of the drive control element (thin film transistor) for supplying the drive current to the hole transport layer 150 and the light emitting layer 160 is the same as the conventional method. In addition, the transistors and the wiring layers constituting the pixel driving circuit are formed for each pixel set on one surface of the panel substrate 110.

  First, an insulating panel substrate 110 is prepared. Subsequently, a transparent conductive layer is formed on one surface of the panel substrate 110 by depositing tin-doped indium oxide (ITO), zinc oxide (ZnO), or the like by sputtering or vapor deposition, for example. Next, by patterning the transparent conductive layer by an etching process (wet etching process or dry etching process) or the like, as shown in FIG. 3A, a pixel electrode is formed for each pixel formation region arranged in a matrix. 120 is formed.

  Next, by applying an insulating material on the panel substrate 110 on which the pixel electrode 120 is formed, an interlayer such as silicon nitride or silicon oxide is provided so as to cover the pixel electrode 120 as shown in FIG. An insulating film 130 is formed. The distance between the upper surface of the interlayer insulating film 130 and the upper surface of the pixel electrode 120 is set to 200 nm to 400 nm. The interlayer insulating film 130 is also formed in a region that isolates each pixel electrode 120 and covers the peripheral edge of the pixel electrode 120 to prevent a short circuit between adjacent pixel electrodes 120.

  Next, the panel substrate 110 on which the interlayer insulating film 130 is formed is cleaned by reduced-pressure oxygen plasma treatment or UV ozone treatment. The panel substrate 110 is washed with pure water and then dried with an air blower. The interlayer insulating film 130 on the panel substrate 110 is immersed in a 3% solution of silazane oligomer having a fluoroalkyl chain (manufactured by Shin-Etsu Chemical Co., Ltd .: KP-801M) in m-xylene hexafluoride. The panel substrate 110 is taken out and left in an atmosphere of moderate humidity for about 10 to 30 minutes. During this time, as shown in Chemical Formula 3, the hydrolysis / condensation reaction between the silazane oligomer and the interlayer insulating film 130 proceeds to form a film layer. Finally, by rinsing the panel substrate 110 with a solvent (m-xylene hexafluoride), excess molecules that are not chemically bonded at this stage are washed away from the interlayer insulating film 130, as shown in FIG. Then, a liquid repellent layer 140 having a functional group containing fluorine is formed on the upper surface of the interlayer insulating film 130. Since the liquid repellent layer 140 has liquid repellency, the charge transport material containing liquid 151 containing polyethylenedioxythiophene and polystyrene sulfonic acid to be applied as a hole transport layer material to be applied, and polyphenylene vinylene-based or polyfluorene to be used as a light emitting layer. The fluidity of the charge transport material-containing liquid 161 or the like in which a light emitting material containing a conjugated double bond polymer such as a system is dissolved in an organic solvent such as water or xylene can be suppressed. Note that the time for which the panel substrate 110 immersed in a predetermined solution is left in the atmosphere may be 10 minutes or less.

  Next, a resist film (mask) 141 formed in a predetermined shape is formed as shown in FIG. 3D by attaching a dry film on the liquid repellent layer 140 and performing exposure and development. The resist 141 is made of, for example, an acrylic resin. Using the resist 141 remaining in the region other than the pixel electrode 120 on the panel substrate 110, that is, the peripheral region of the pixel electrode 120 as a mask, the central portion of the pixel electrode 120 is exposed by an etching process described later. When a liquid resist is used in this step, the surface of the liquid repellent layer 140 having liquid repellency repels the liquid resist, which may cause a defective resist pattern. Therefore, by using a dry film, the resist 141 can be formed without a pattern defect.

Next, in order to expose the pixel electrode 120, the interlayer insulating film 130 and the liquid repellent layer 140 are etched using the resist 141 as a mask. When SiN or SiO ₂ is used for the interlayer insulating film 130, as shown in FIG. 1 and FIG. 3 (e), by dry etching using a fluorocarbon gas or wet etching using a hydrofluoric acid-based etchant, An opening surrounded by the interlayer insulating film 130 is provided on the pixel electrode 120 to form a matrix-like interlayer insulating film 130. At this time, the liquid repellent layer 140 is not formed on the side surface of the interlayer insulating film 130 exposed by etching.

  After the pixel electrode 120 is exposed by the etching process, a process of making the surface of the pixel electrode 120 that is the opening and the side surface of the interlayer insulating film 130 lyophilic is performed by an oxygen plasma process or a UV ozone process. By performing the lyophilic treatment, in the step of applying a predetermined contained liquid described later, the contained liquid spreads uniformly and the film thickness of the light emitting layer 160 and the like becomes uniform. Note that the resist 141 is processed so as not to be completely removed by the lyophilic process. Thus, since the resist 141 covers the lyophobic layer 140 during the lyophilic treatment, the lyophobic layer 140 does not significantly impair the lyophobic property due to the lyophilic treatment.

  Next, after the exposed surface of the pixel electrode 120 is lyophilic, the resist 141 is stripped using, for example, an organic alkaline stripper. The panel substrate 110 is immersed in a stripping solution, the resist 141 is removed, and the liquid repellent layer 140 on the upper surface of the interlayer insulating film 130 is exposed as shown in FIG. A general fluorine coating is hardly affected by an alkaline solvent. For this reason, since the functional group containing fluorine included in the liquid repellent layer 140 does not change by using the organic alkaline stripping solution, the liquid repellent layer 140 can maintain liquid repellency.

  Next, after removing the resist 141, as shown in FIG. 3G, a charge transport material-containing liquid 151 containing polyethylene dioxythiophene and polystyrene sulfonic acid, which becomes a hole transport layer material, is printed by a printing method such as inkjet. It is applied to a region surrounded by the side surface of the interlayer insulating film 130 on the pixel electrode 120. At this time, since the solubility of the charge transport material in the solvent is low, the volume of the charge transport material-containing liquid 151 is several tens to one hundred times larger than the volume of the hole transport layer 150, and thus the exposed width of the pixel electrode 120 is 50 μm. When set, the top of the charge transport material-containing liquid 151 is positioned about 16 μm to 23 μm above the upper surface of the interlayer insulating film 130. Since the surface of the pixel electrode 120 and the side surface of the interlayer insulating film 130 are lyophilic, the applied charge transport material-containing liquid 151 spreads uniformly on the pixel electrode 120 and is in contact with the side surface of the interlayer insulating film 130. The transport material-containing liquid 151 is sucked up by capillary action. For this reason, in the process in which the charge transport material-containing liquid 151 is dried and the hole transport layer 150 is deposited, the charge transport material-containing liquid 151 continues to adhere to the side surface of the interlayer insulating film 130. 151 does not aggregate at the center of the pixel electrode 120. Accordingly, drying proceeds in such a manner that the charge transport material-containing liquid 151 is pulled on the side surface of the opening of the interlayer insulating film 130, and the film thickness of the hole transport layer 150 becomes uniform. The upper surface of the interlayer insulating film 130 on which the liquid repellent layer 140 is formed has liquid repellency. Therefore, even when the charge transport material-containing liquid 151 adheres to the liquid repellent layer 140, the fluidity of the charge transport material-containing liquid 151 is suppressed, and the charge transport material-containing liquid 151 overflows to the adjacent pixel electrode 120. Can be prevented. After application of the charge transport material-containing liquid 151, a hole transport layer 150 having a relatively uniform film thickness is formed by heating and drying at a temperature of 100 ° C. or higher as shown in FIG. .

  Next, as shown in FIG. 3 (i), after forming the hole transport layer 150, a conjugated double bond polymer such as polyphenylene vinylene or polyfluorene that becomes a light emitting layer emitting red, green, and blue is used. A charge transport material-containing liquid 161 in which the light emitting material is dissolved in an organic solvent such as water or xylene is formed on the hole transport layer 150 by a printing method such as inkjet. At this time, the top of the charge transport material-containing liquid 161 is positioned about 16 μm to 23 μm above the upper surface of the interlayer insulating film 130. Since the liquid repellent layer 140 is formed on the upper surface of the interlayer insulating film 130 formed between the pixel electrodes 120 and has liquid repellency, the luminescent material applied to each pixel electrode 120 is adjacent to the adjacent pixel. Color mixing due to mixing into the electrode 120 is prevented, and red, green, and blue can be separately applied. After the light emitting material is formed, the light emitting layer 160 is formed as shown in FIG. 3J by performing heat drying in a nitrogen atmosphere or drying in a vacuum to remove the residual solvent. Here, since the side surface of the interlayer insulating film 130 is lyophilic, the charge transport material-containing liquid 161 is dried while being pulled by the side surface of the interlayer insulating film 130, so that the light emitting layer 160 is the same as the hole transport layer 150. In addition, it is formed flat. Note that the characteristics of the luminescent material may change when it comes into contact with oxygen, water vapor, or the like. Therefore, the application is preferably performed in a nitrogen gas atmosphere.

  Thereafter, the counter electrode 170 is formed not only as a region facing the pixel electrode 120 but also as a single conductive layer extending over the interlayer insulating film 130 and the liquid repellent layer 140. The counter electrode 170 is a thin film having a low work function such as magnesium, calcium, barium, lithium, or indium having a thickness of 1 nm to 10 nm, and a high work including an aluminum, chromium, silver, palladium silver-based alloy having a thickness of 100 nm or more. It has a laminated structure with a thin film of function. The counter electrode 170 is formed using, for example, a vacuum deposition method, a sputtering method, or the like.

  Finally, a sealing resin layer 180 is provided on the counter electrode 170, and a sealing substrate 190 is formed on the sealing resin layer 180. A sealing resin that is cured by ultraviolet irradiation is applied to one surface side of the sealing substrate 190. Then, the surface of the sealing substrate 190 to which the sealing resin is applied is bonded to the surface on which the counter electrode 170 is disposed, and the sealing resin is cured by irradiating ultraviolet rays. Thereby, the sealing resin becomes the sealing resin layer 160, and the display device 100 shown in FIG. 2 is formed.

  As described above, according to the method for manufacturing the display device according to the present embodiment, the exposed surface of the pixel electrode 120 and the side surface of the interlayer insulating film 130 are lyophilic, and further, the liquid repellent layer 140 having liquid repellency. Is selectively formed on the upper surface of the interlayer insulating film 130, so that the organic EL layers such as the hole transport layer 150 and the light emitting layer 160 are uniformly formed. Moreover, it can prevent that a predetermined containing liquid mixes colors. Therefore, the display device 100 according to the present embodiment has high uniformity in the thickness of the light emitting layer 160 and the like, has less unevenness in light emission, and is excellent in color development.

  In addition, this invention is not limited to the said embodiment, A various deformation | transformation and application are possible.

  In the display device 100, as shown in FIG. 4, a partition wall 200 can be provided on the interlayer insulating film 130. By forming the partition wall 200 having insulating properties, leakage current from the pixel driving circuit is reduced, and the reliability of light emission driving is improved. As a method for forming the partition wall 200, any of ink jet printing, nozzle print printing, dispenser printing, flexographic printing, and the like may be used. The step of forming the partition wall 200 can be performed either before or after the step of forming the hole transport layer 150 and the light emitting layer 160. Since the liquid repellent layer 140 having liquid repellency is formed on the interlayer insulating film 130 and the surface of the pixel electrode 120 has lyophilicity, the height of the partition wall 200 can be reduced.

  The liquid repellent layer 140 can be formed from not only a general fluorine coating agent but also a compound having a functional group containing at least one fluorine. Further, any material can be used for forming the liquid repellent layer 140 as long as it has liquid repellency and applicability.

  The application method of the containing liquid which forms the positive hole transport layer 150 and the light emitting layer 160 is not limited to nozzle print printing, You may use any methods, such as inkjet printing, screen printing, dispenser printing, and flexographic printing.

  The resist 141 is not limited to a dry resist, and can be formed using a liquid resist with little liquid repellency.

  The organic EL layer formed on the pixel electrode 120 may have a three-layer structure including a hole transport layer 150, a light emitting layer 160, and an electron transport layer, or a two-layer structure including the light emitting layer 160 and the electron transport layer. A structure may be sufficient, and the single layer structure which consists of the light emitting layer 160 may be sufficient. The hole transport layer 150 as the charge transport layer, and the combination of the electron transport layer and the light emitting layer 160 can be arbitrarily set. Further, in these layer structures, a laminated structure in which an intermediate layer that restricts charge transport of other charge transport layers is interposed may be used, or another laminated structure may be used.

  The release agent for removing the resist 141 is not limited to the organic alkaline release solution as long as the liquid repellency of the liquid repellent layer 140 is not impaired, and any release agent such as an aqueous release solution or an inorganic release solution may be used. It may be used. Further, the resist 141 can be ashed and removed by oxygen plasma treatment.

  The lyophilic treatment step is not limited to oxygen plasma treatment or the like, and any treatment such as laser light irradiation treatment may be used.

  The display device 100 is a bottom emission type, but may be a top emission type. In this case, the pixel electrode 120 is formed on the reflective layer having a light reflection characteristic made of a metal material such as silver (Ag) or aluminum (Al), or an alloy material containing any of them, and It becomes a light reflective electrode such as a laminated structure with a transparent conductive layer such as tin-doped indium oxide, zinc-doped indium oxide, tungsten-doped indium oxide, or tungsten-zinc-doped indium oxide. The counter electrode 170 is formed on a light-transmitting electron injection metal layer having a very thin film thickness of about 1 nm made of a low work function such as magnesium or barium, and tin-doped indium oxide or zinc. It becomes a light-transmitting electrode such as a laminated structure with a transparent conductive layer such as doped indium oxide, tungsten-doped indium oxide, or tungsten-zinc-doped indium oxide.

It is a schematic plan view which shows an example of the pixel arrangement state of the display apparatus which concerns on embodiment of this invention. It is sectional drawing in the AA of FIG. It is sectional drawing which shows the manufacturing process of a display apparatus. It is a figure which shows the modification of a display apparatus.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Display apparatus, 110 ... Panel substrate, 120 ... Pixel electrode, 130 ... Interlayer insulation film, 140 ... Liquid repellent layer, 141 ... Resist, 150 ... Hole transport layer, 151 ... Charge transport material containing liquid, 160 ... Light emitting layer 161 ... Liquid containing charge transport material, 170 ... Counter electrode, 180 ... Sealing resin layer, 190 ... Sealing substrate, 200 ... Partition wall

Claims (7)

A liquid repellent layer forming step of forming a liquid repellent layer on an insulating film formed on a surface of a substrate provided with an electrode;
Etching the liquid repellent layer and the insulating film using a resist formed on the liquid repellent layer as a mask to expose at least a part of the electrode and to expose a side wall of the insulating film;
Removing the resist to expose the liquid repellent layer;
A charge transport material-containing droplet lowering step of dropping a charge transport material-containing liquid containing a material to be a charge transport layer in a region surrounded by the sidewall of the insulating film;
A method for manufacturing a display device, comprising:   The method for manufacturing a display device according to claim 1, wherein the resist is a dry film resist.   The method for manufacturing a display device according to claim 1, wherein the liquid repellent layer includes a compound having a functional group including at least one fluorine. A lyophilic treatment step of performing a lyophilic treatment on the exposed electrode and the side wall of the insulating film before the treatment of the charge transport material-containing droplet lowering step;
The method for manufacturing a display device according to claim 1, further comprising:   5. The method for manufacturing a display device according to claim 4, wherein the lyophilic treatment step performs an oxygen plasma treatment using oxygen as a treatment gas or an ultraviolet irradiation treatment for irradiating ultraviolet rays in an air atmosphere.   6. The display device manufacturing method according to claim 1, wherein in the liquid repellent layer exposing step, the resist is removed by immersing the substrate in an organic alkaline release agent. Method.   A display device manufactured by the method for manufacturing a display device according to claim 1.

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