JP2009064887A - Printed wiring board - Google Patents
Printed wiring board Download PDFInfo
- Publication number
- JP2009064887A JP2009064887A JP2007230219A JP2007230219A JP2009064887A JP 2009064887 A JP2009064887 A JP 2009064887A JP 2007230219 A JP2007230219 A JP 2007230219A JP 2007230219 A JP2007230219 A JP 2007230219A JP 2009064887 A JP2009064887 A JP 2009064887A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- layer
- metal
- heat conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims abstract description 34
- 239000002184 metal Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000011347 resin Substances 0.000 claims abstract description 15
- 239000012212 insulator Substances 0.000 claims description 15
- 239000010410 layer Substances 0.000 abstract description 38
- 239000011229 interlayer Substances 0.000 abstract description 11
- 230000017525 heat dissipation Effects 0.000 abstract description 9
- 229910052782 aluminium Inorganic materials 0.000 description 10
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 8
- 239000011889 copper foil Substances 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
本発明は放熱性に優れたプリント配線板に係り、メタルベース型プリント配線板の改良に関する。 The present invention relates to a printed wiring board excellent in heat dissipation, and relates to an improvement of a metal base type printed wiring board.
プリント配線板の放熱性の付与による回路装置の動作安定化を目的としたプリント配線板の構成において、ベース基板として金属薄板を使用したプリント配線板が開発されている。図３は、このようなメタルベース型プリント配線板の要部構成を断面的に示したものである。図３において、１はメタルベース板、２は絶縁体層、３は導体（配線）パターンである。ここで、メタルベース板１は、支持・補強体であり放熱体として機能する。 2. Description of the Related Art A printed wiring board that uses a thin metal plate as a base substrate has been developed in the configuration of a printed wiring board for the purpose of stabilizing the operation of a circuit device by imparting heat dissipation to the printed wiring board. FIG. 3 shows a cross-sectional view of the main configuration of such a metal-based printed wiring board. In FIG. 3, 1 is a metal base plate, 2 is an insulator layer, and 3 is a conductor (wiring) pattern. Here, the metal base plate 1 is a support / reinforcing body and functions as a heat radiating body.
メタルベース型プリント配線板の放熱性を改良する目的で、特許文献１には、導電性金属薄板と、前記導電性金属薄板面に絶縁体層を介して配置された配線パターン層と、前記配線パターン層および導電性金属薄板を絶縁体層を貫挿して接続する層間接続部とを具備して成るプリント配線板において、前記層間接続部が導電性金属薄板面、配線パターン層面の少なくともいずれか一方の面に形設され、かつ加圧一体化の段階で絶縁体層を貫挿し、対向する導電性金属薄板面側もしくは配線パターン層面側に塑性変形して接続していることを特徴とするプリント配線板が提案されている。
しかしながら、前記プリント配線板においては、層間接続部に熱伝導性の低い有機高分子を用いた導電性ペーストを利用しているため、放熱性が充分ではなかった。 However, since the printed wiring board uses a conductive paste using an organic polymer having low thermal conductivity for the interlayer connection portion, heat dissipation is not sufficient.
本発明は上記事情に対処してなされたもので、メタルベース基板型プリント配線板において、金属バンプを層間接続体として配置することにより、放熱性の向上を図ったプリント配線板の提供を目的とする。 The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a printed wiring board that improves heat dissipation by disposing metal bumps as an interlayer connection in a metal base substrate type printed wiring board. To do.
本発明に係るプリント配線板は、熱伝導性金属薄板の少なくとも一方の面に形成された熱伝導性樹脂層上に絶縁体層を介して配置されたプリント配線層と、前記熱伝導性樹脂層とが、熱伝導性樹脂層上に形成され絶縁体層に貫挿された金属バンプにより接続されていることを特徴とする。 The printed wiring board according to the present invention includes a printed wiring layer disposed on a heat conductive resin layer formed on at least one surface of a heat conductive metal thin plate via an insulator layer, and the heat conductive resin layer. Are connected by metal bumps formed on the heat conductive resin layer and inserted through the insulator layer.
上記のごとく、本発明に係るプリント配線板においては、配線パターン層間の電気的な接続、配線パターンと接地層や放熱層などを成す熱伝導性金属薄板と熱的な接続が、予め所定箇所に配置してある熱伝導性にすぐれた金属バンプを、絶縁体層に貫挿させ、対向する熱伝導性樹脂層と配線パターン層面側とを接続することにより達成される。このように、熱伝導性にすぐれた金属バンプを利用することにより、放熱性の向上が図られ、これによって、実装領域面や配線面を容易に確保し得るとともに、プリント配線板として信頼性の高い機能を、常時保持・発揮する。 As described above, in the printed wiring board according to the present invention, the electrical connection between the wiring pattern layers, the thermal connection with the heat conductive thin metal plate forming the wiring pattern and the ground layer, the heat dissipation layer, etc. This is achieved by inserting the metal bumps having excellent thermal conductivity into the insulator layer and connecting the opposing thermal conductive resin layer and the wiring pattern layer surface side. In this way, by using metal bumps with excellent thermal conductivity, heat dissipation can be improved, so that the mounting area surface and the wiring surface can be easily secured, and the printed wiring board is reliable. Maintains and demonstrates high functionality at all times.
以下、図１〜図２を参照して本発明の実施例を説明する。 Embodiments of the present invention will be described below with reference to FIGS.
図１は、本発明に係るプリント配線板の構成例の要部を断面的に示したもので、11はメタルベース基板を成す熱伝導性金属薄板、12は前記熱伝導性金属薄板11面に形成された熱伝導性樹脂層、13は前記熱伝導性樹脂層12面に形成された絶縁体層、14は前記絶縁体層13面に形成された配線パターンである。15は層間接続部であって前記配線パターン14および熱伝導性樹脂層13とを絶縁体層13を貫挿して接続している。そして、本発明はこのようなプリント配線板の構成において、前記層間接続部15が熱伝導性に優れた金属からなるバンプを形成している点をもって特徴付けられる。 FIG. 1 is a cross-sectional view of a main part of a configuration example of a printed wiring board according to the present invention. The formed heat conductive resin layer, 13 is an insulator layer formed on the surface of the heat conductive resin layer 12, and 14 is a wiring pattern formed on the surface of the insulator layer 13. Reference numeral 15 denotes an interlayer connection portion, which connects the wiring pattern 14 and the heat conductive resin layer 13 through the insulator layer 13. The present invention is characterized in that in the configuration of such a printed wiring board, the interlayer connection portion 15 forms bumps made of metal having excellent thermal conductivity.
そして、本発明に係るプリント配線板は、一般的に次のような手段で製造し得る。先ず、熱伝導性金属薄板 11として、例えば厚み1.5ｍｍのアルミ板を用意する。この表面に高熱伝導性のエポキシ樹脂系接着剤(例えば菱電化成株式会社製R116-00)をスクリーン印刷法により塗工して、厚み15μｍの接着層を形成する。次にこの接着層に厚み50μｍのアルミ箔を積層し、熱圧着することにより、アルミ板とアルミ箔とが接着層を介して一体化されたアルミベースの金属板を製造する。次に、アルミ箔に対し、常套的なフォトエッチング処理を施すことにより、熱伝導性の接着層上に2.5ｍｍのピッチで直径0.3ｍｍ、高さ50μｍのアルミからなるバンプを形成する。 The printed wiring board according to the present invention can be generally manufactured by the following means. First, as the heat conductive thin metal plate 11, for example, an aluminum plate having a thickness of 1.5 mm is prepared. A high thermal conductivity epoxy resin adhesive (for example, R116-00 manufactured by Ryoden Kasei Co., Ltd.) is applied to the surface by a screen printing method to form an adhesive layer having a thickness of 15 μm. Next, an aluminum foil having a thickness of 50 μm is laminated on the adhesive layer, and thermocompression bonded, thereby manufacturing an aluminum-based metal plate in which the aluminum plate and the aluminum foil are integrated via the adhesive layer. Next, by subjecting the aluminum foil to a conventional photoetching process, bumps made of aluminum having a diameter of 0.3 mm and a height of 50 μm are formed on the thermally conductive adhesive layer at a pitch of 2.5 mm.
次に、絶縁体として、例えば厚さ70μｍのエポキシ樹脂からなる絶縁性樹脂フイルム（商品名ABF-70SH、味の素ファインテクノ株式会社製）をバンプ上に積層し熱プレスにより圧着することにより一体化する。次に、積層された絶縁層を研磨することによりアルミバンプを表面に露出させる。次に、この表面に常套的な銅無電解メッキに続く電解メッキを行うことにより、アルミバンプが表面に露出したエポキシ樹脂層上に12μｍの銅層を形成することにより、所要の層間接続部15を備えた銅箔16付きメタルベース基板を製造する（図２）。次に、前記銅箔付きメタルベース基板の銅箔16に、所要の配線パターン化（14）することにより、図１に示すような層間接続部15を備えたプリント配線板が得られる。 Next, as an insulator, for example, an insulating resin film (trade name: ABF-70SH, manufactured by Ajinomoto Fine-Techno Co., Ltd.) made of an epoxy resin having a thickness of 70 μm is laminated on the bump and integrated by hot pressing. . Next, the aluminum bump is exposed to the surface by polishing the laminated insulating layer. Next, by performing electrolytic plating subsequent to conventional copper electroless plating on this surface, a 12 μm copper layer is formed on the epoxy resin layer with the aluminum bumps exposed on the surface, so that the required interlayer connection 15 A metal base substrate with a copper foil 16 provided with is manufactured (FIG. 2). Next, a required wiring pattern (14) is formed on the copper foil 16 of the metal base substrate with copper foil, thereby obtaining a printed wiring board having an interlayer connection portion 15 as shown in FIG.
前記プリント配線板について、配線パターン14と熱伝導性金属薄板 11との間の接続信頼性を見るために、ホットオイルテストを行った。260℃のオイル中15秒，25℃で15秒冷却を１サイクルとして 500サイクル行った後でも、接続不良の発生は認められなかった。 The printed wiring board was subjected to a hot oil test in order to check the connection reliability between the wiring pattern 14 and the heat conductive thin metal plate 11. Even after 500 cycles of cooling in 260 ° C oil for 15 seconds and 25 ° C for 15 seconds, no connection failure was observed.
また、本発明のプリント配線板の放熱特性は、導電性ペーストでバンプを形成した従来のプリント配線板と比較して格段に優れていた。 Moreover, the heat dissipation characteristics of the printed wiring board of the present invention were much better than the conventional printed wiring board in which bumps were formed with a conductive paste.
１・・・熱伝導性金属薄板
２・・・絶縁体層
３・・・配線パターン
１２・・熱伝導性樹脂層
１５・・層間接続部
１６・・銅箔
DESCRIPTION OF SYMBOLS 1 ... Thermal conductive metal thin plate 2 ... Insulator layer 3 ... Wiring pattern 12 ... Thermal conductive resin layer 15 ... Interlayer connection part 16 ... Copper foil
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007230219A JP2009064887A (en) | 2007-09-05 | 2007-09-05 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007230219A JP2009064887A (en) | 2007-09-05 | 2007-09-05 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2009064887A true JP2009064887A (en) | 2009-03-26 |
Family
ID=40559235
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2007230219A Pending JP2009064887A (en) | 2007-09-05 | 2007-09-05 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2009064887A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003179316A (en) * | 2001-12-13 | 2003-06-27 | Fuji Kiko Denshi Kk | Printed wiring board structure with excellent heat dissipation |
| JP2004095757A (en) * | 2002-08-30 | 2004-03-25 | Fuji Kiko Denshi Kk | Metal plate laminated wiring board and method of manufacturing the same |
| JP2004153123A (en) * | 2002-10-31 | 2004-05-27 | North:Kk | Wiring board and its manufacturing method |
-
2007
- 2007-09-05 JP JP2007230219A patent/JP2009064887A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003179316A (en) * | 2001-12-13 | 2003-06-27 | Fuji Kiko Denshi Kk | Printed wiring board structure with excellent heat dissipation |
| JP2004095757A (en) * | 2002-08-30 | 2004-03-25 | Fuji Kiko Denshi Kk | Metal plate laminated wiring board and method of manufacturing the same |
| JP2004153123A (en) * | 2002-10-31 | 2004-05-27 | North:Kk | Wiring board and its manufacturing method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI437949B (en) | Wiring wiring provided with an electronic component, and a heat dissipation method of a wiring board provided with an electronic component | |
| JP5788854B2 (en) | Circuit board | |
| TWI294757B (en) | Circuit board with a through hole wire, and forming method thereof | |
| KR101181105B1 (en) | The radiant heat circuit board and the method for manufacturing the same | |
| JP2011515862A5 (en) | ||
| JP2010263003A (en) | Heat-conducting structure of printed board | |
| US20220346218A1 (en) | Circuit board and method of manufacturing the same | |
| JP4693861B2 (en) | Heat dissipation printed circuit board and manufacturing method thereof | |
| JP2006165299A (en) | Method of manufacturing printed circuit board | |
| JP5589979B2 (en) | Circuit board | |
| CN111148353B (en) | Preparation method of circuit board with copper-based heat sink | |
| KR100962369B1 (en) | Printed circuit board and manufacturing method thereof | |
| JP4992310B2 (en) | Manufacturing method of laminated substrate | |
| CN111132476A (en) | Preparation method of double-sided circuit heat dissipation substrate | |
| JP2010062199A (en) | Circuit board | |
| JP2008124247A (en) | Component built-in substrate and manufacturing method thereof | |
| JP2010129915A (en) | Shell type led mounted substrate | |
| JP5176500B2 (en) | Component built-in wiring board, method of manufacturing component built-in wiring board | |
| CN111093320A (en) | Preparation method of metal heat dissipation double-sided circuit board | |
| JP3862454B2 (en) | Metal-based multilayer circuit board | |
| JP2019140321A (en) | Electronic component mounting substrate and electronic device | |
| JP2009064887A (en) | Printed wiring board | |
| JP5623364B2 (en) | Wiring board, mounting structure, and electronic device | |
| US20120043121A1 (en) | Printed circuit board and method of manufacturing the same | |
| JP2005093582A (en) | Heat dissipation substrate and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100830 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20111213 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20111220 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120215 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120306 |