JP2009054524A - Image display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply an anode voltage, which is a high voltage, to an anode substrate with high reliability; and to improve its voltage-resistant characteristics in an FED (field emission display). <P>SOLUTION: A high voltage introduction terminal 60 for supplying high voltage from the outside is sealed to a cathode substrate 1. A contact spring 50 is connected with the high voltage introduction terminal 60, and high voltage is introduced to the anode substrate 2 by the contact spring 50. Sparks caused by the contact spring 50 is prevented as a corner R of a contact section 53 of the contact spring 50 is set up to be 0.2 mm or more and a surface roughness of a side of the contact section 53 is set up to be 0.6 μm or below. Further, conduction with an anode terminal 24 is stabilized as a surface roughness Rmax of a contact face between the contact section 23 and the anode terminal 24 is set up to be 0.6 μm or below. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a method for supplying an anode voltage in a flat display device in which the inside is evacuated, electron emission sources are arranged in a matrix on a rear substrate, and phosphors corresponding to the front substrate are arranged.

  Conventionally, a color cathode ray tube has been widely used as a display device excellent in high luminance and high definition. However, the demand for flat image display devices is increasing from the viewpoint of space saving and light weight. Liquid crystal display devices, plasma display devices, and the like are not so heavy even if they have a large screen of 30 inches or more, and therefore, the demand is expanding not only in small display devices but also in the field of large display devices such as TVs.

  On the other hand, a so-called field emission display (FED) has been developed in which the inside sandwiched between two glass substrates is evacuated, electron emission sources are arranged in a matrix on one substrate, and phosphors are arranged on the opposite substrate. Progressing. The FED forms an image when electrons from an electron emission source strike a phosphor and emits light. In the future, brightness, contrast, moving image characteristics, etc. can provide excellent performance similar to a cathode ray tube. It is expected as a TV display.

  However, in the FED, it is necessary to accelerate electrons to make the phosphor shine by applying a high voltage of about 10 KV to the anode. Supplying a high voltage of 10 KV to one substrate with sufficient reliability is a difficult problem, and various devices and inventions are disclosed. There are [Patent Literature 1], [Patent Literature 2], [Patent Literature 3], [Patent Literature 4], [Patent Literature 5] and the like as disclosures of such a high voltage supply method. These patent documents disclose the use of a coil spring, a leaf spring, etc. as a method for sealing the high voltage introduction terminal and a method for contacting the high voltage introduction terminal and the anode, but they have not yet been put into practical use.

JP 10-31433 A Japanese Patent Laid-Open No. 10-326581 JP 2000-31636 A JP 2003-115271 A Japanese Patent Laid-Open No. 5-114372

  In the above prior art, a high voltage introduction pin is installed on the opposite substrate of the anode substrate to which a high voltage is applied, that is, the cathode substrate side, and a high voltage is applied to the anode substrate through a coil spring or a leaf spring attached to the high voltage introduction pin. Supply. The coil spring has a problem in the reliability of the connection between the high voltage introduction pin or the contact between the coil spring and the anode. In addition, when a high voltage is supplied from the outside to the inside of the display device using a pin that penetrates the cathode substrate or the like, there may be a problem of vacuum tightness at a portion where the pin penetrates.

  On the other hand, when a leaf spring is used, contact between the tip of the leaf spring and the voltage supply terminal of the anode substrate becomes a problem. That is, since the leaf spring is in mechanical contact with the anode terminal with a certain pressure, if the anode terminal is a soft material, the anode terminal is scraped off and becomes a foreign substance in the tube. This foreign matter in the tube causes a spark between the anode substrate and the cathode substrate. The present invention overcomes the problems of the prior art as described above, and is to supply a high voltage to the anode substrate with high reliability.

  The present invention supplies a high voltage to the anode substrate by connecting a contact spring to a high voltage introduction terminal formed on the cathode substrate and bringing the contact spring into contact with an anode terminal formed on the anode substrate. Further, by setting the shape and surface roughness of the contact spring to a special value, deterioration of the withstand voltage due to the contact spring is prevented. The specific configuration is as follows.

  (1) A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source, The display device is internally maintained in a vacuum, wherein the cathode substrate is formed with a high voltage introduction terminal for supplying the anode voltage, and the high voltage introduction terminal is a contact for contacting the anode substrate A spring is connected, and the contact spring has an arm portion for applying a bending stress and a contact portion that contacts an anode terminal formed on the anode substrate, and the tip of the contact portion has a radius of curvature of 0.2 mm at a corner portion. A display device having the above-described radius of curvature (hereinafter referred to as a corner R).

  (2) The display device according to (1), wherein a corner R of 0.5 mm or more is formed at a tip of the contact portion.

  (3) The display device according to (1), wherein a corner R of 1.0 mm or more is formed at a tip of the contact portion.

  (4) a cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source; The display device is internally maintained in a vacuum, wherein the cathode substrate is formed with a high voltage introduction terminal for supplying the anode voltage, and the high voltage introduction terminal is a contact for contacting the anode substrate A spring is connected, and the contact spring has an arm portion that applies bending stress and a contact portion that contacts an anode terminal formed on the anode substrate, and a surface roughness Rmax of a surface of the contact portion that contacts the anode terminal. Is 0.6 μm or less, and the surface roughness Rmax of the side portion of the contact portion is 0.6 μm or less. Indicating device.

  (5) The display device according to (4), wherein the surface roughness Rmax of the side portion at the tip of the contact portion is 0.6 μm or less.

  (6) The display device according to (4), wherein the contact spring is electropolished.

(7) a cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, an anode voltage is applied, and a phosphor is formed at a location corresponding to the electron emission source; A display device in which the inside is maintained in a vacuum,
A high voltage introduction terminal for supplying the anode voltage is formed on the cathode substrate, and a contact spring for contacting the anode substrate is connected to the high voltage introduction terminal, and the contact spring gives a bending stress. It has a contact portion that contacts an arm portion and an anode terminal formed on the anode substrate, and a tip end of the contact portion is formed with a corner R of 0.2 mm or more, and is in contact with the anode terminal of the contact portion. The surface roughness Rmax of the surface to be touched is 0.6 μm or less, and the surface roughness Rmax of the side portion of the contact portion is 0.6 μm or less.

  (8) The display device according to (7), wherein a corner R of 0.5 mm or more is formed at a tip of the contact portion.

  (9) The display device according to (7), wherein a surface roughness Rmax of a side portion at a tip of the contact portion is 0.6 μm or less.

  (10) The display device according to (7), wherein the contact spring is electropolished.

  According to the present invention, since a high voltage is supplied to the anode substrate through the cathode substrate using the contact spring, a high voltage can be supplied to the metal back formed on the anode substrate with high reliability. .

  In the present invention, since the corner R is formed at a predetermined value at the tip of the contact portion of the contact spring, it is possible to prevent a spark generated from the contact spring.

  In addition, since Rmax indicating the surface roughness of the surface of the contact spring of the present invention that contacts the anode terminal formed on the anode substrate is 0.6 μm or less, the contact with the anode terminal can be stabilized, It is possible to prevent the anode terminal from being scraped by the contact spring.

  Further, since Rmax representing the surface roughness of the side portion of the contact portion where the contact spring of the present invention contacts the anode terminal formed on the anode substrate is set to 0.6 μm or less, generation of spark from the contact spring is prevented. I can do it.

  The best mode of the present invention will be described below in detail with reference to the drawings of the embodiments.

  FIG. 1 is a plan view showing a first embodiment of the present invention. In FIG. 1, an anode substrate 2 is installed on a cathode substrate 1 via a sealing portion 3. On the cathode substrate, scanning lines extend in the horizontal direction and data signals extend in the vertical direction. A signal is supplied to the scanning line and the data signal line from the outside via the terminal 5. An electron emission source is disposed near the intersection of the scanning line and the signal line. Therefore, a large number of electron emission sources are arranged in a matrix. Various electron emission sources such as the so-called MIM system, SID system, and Spindt system have been developed, and any electron emission source is applicable to the present invention.

  The inside of the sealing part 3 surrounding the cathode substrate 1 and the anode substrate 2 and the periphery is kept in a vacuum. Therefore, the anode substrate 2 and the cathode substrate 1 are bent by the atmospheric pressure, and the interval between the cathode substrate 1 and the anode substrate 2 cannot be secured. Alternatively, the cathode substrate 1 or the anode substrate 2 is destroyed. In order to avoid this, a spacer 4 is provided between the cathode substrate 1 and the anode substrate 2. The spacer 4 is made of ceramic or glass and is generally installed on the scanning line so as not to hinder image formation.

  On the anode substrate, red, green, and blue phosphors that emit light by the impact of an electron beam are formed corresponding to the electron emission source. A black matrix (BM) is formed around the phosphor to improve image contrast. A metal backing made of Al is formed covering the black matrix. A high voltage is applied to the metal back, and the electron beam emitted from the cathode is accelerated and projected onto the phosphor 21.

  In order to generate light from the phosphor by the electron beam, the electron beam must have a certain amount of energy, so that a high voltage of 8 KV to 10 KV is applied to the metal back of the anode substrate 2. In this embodiment, the external high voltage introduction terminal 60 is provided on the cathode substrate side, and a high voltage is supplied to the anode substrate 2 via the contact spring 50. In FIG. 1, an anode terminal 24 where the contact spring 50 and the anode substrate 2 are in contact is formed at a corner portion of the display device. Since the inside of the display device must be kept in a vacuum, exhaust holes 81 for exhaust are formed at the corners of the display device in FIG.

  FIG. 2 is a side view of FIG. 1 viewed from the C direction. In FIG. 2, the cathode substrate 1 and the anode substrate 2 face each other with a predetermined distance through the sealing portion 3. The cathode substrate 1 is formed larger as the terminals 5 and the like are installed. Under the cathode substrate 1, an exhaust substrate 6 for attaching the exhaust pipe 8 and the high voltage introduction terminal 60 is attached. The exhaust substrate 6 is attached to the cathode substrate 1 via an exhaust substrate sealing portion 7. In FIG. 2, an exhaust pipe 8 for evacuating the inside of the display device is drawn on the exhaust substrate 6 in a state where the chip is turned off. A high voltage introduction terminal 60 is attached near the exhaust pipe 8 of the exhaust substrate 6.

3 is a cross-sectional view taken along the line AA in FIG. In FIG. 3, the data signal line 12 extends in a direction perpendicular to the paper surface. In this embodiment, an electron emission source 13 is formed on the data signal line 12. The scanning line 11 is formed in a direction perpendicular to the data signal line 12 through the insulating film 14. In FIG. 3, the scanning line 11 extends outside the sealing portion 3. A spacer 4 for maintaining the distance between the cathode substrate 1 and the anode substrate 2 is provided on the scanning line 11. The spacer 4 is fixed to the scanning line on the cathode substrate side and to the metal back 23 on the anode substrate side by the fixing material 41. The spacer 4 is given a conductivity of about 10 ⁹ to 10 ¹¹ Ω, and the spacer 4 is prevented from being charged by passing a slight current between the cathode and the anode.

  On the anode substrate side, phosphors 21 such as red, green, and blue are arranged at locations corresponding to the electron emission sources 13, and the phosphors 21 emit light by being projected by an electron beam, thereby forming an image. Is done. The space between the phosphors 21 is filled with BM 22 and contributes to the improvement of the contrast of the image. For example, the BM 22 has a two-layer structure of chromium and chromium oxide. Chromium oxide is formed on the anode substrate 2 side, and chromium is formed thereon. A metal back 23 made of Al is formed so as to cover the phosphor 21 and the BM 22. A high voltage of about 8 KV to 10 KV is applied to the metal back 23 to accelerate the electron beam. The accelerated electron beam penetrates the metal back 23 and strikes the phosphor 21 to cause the phosphor 21 to emit light. Although a high voltage is applied to the metal back 23, it is an important subject of the present invention to supply this high voltage with reliability.

  In order to keep the inside of the display device in a vacuum, the cathode substrate 1 and the anode substrate 2 are sealed by the frame member 31 and the sealing material 32. The thickness of the cathode substrate 1 and the thickness of the anode substrate 2 are about 3 mm. The distance between the cathode substrate 1 and the anode substrate 2 is about 2.8 mm, and the inside of the display device has a high electric field.

  4 is a cross-sectional view taken along the line BB of FIG. In FIG. 4, a through hole 10 is formed in the cathode substrate 1, and the display device is exhausted or a high voltage is supplied through the through hole 10. An exhaust substrate 6 is installed through the exhaust substrate sealing portion 7 so as to cover the through hole 10 of the cathode substrate 1, and the inside of the display device is kept in vacuum. The exhaust substrate sealing portion 7 has the same basic configuration as the cathode substrate 1 and the anode substrate 2 sealing portion 3. That is, the exhaust substrate frame 71 is sealed to the cathode substrate 1 and the anode substrate 2 via the sealing material 32. In this embodiment, the frame 31 for sealing the anode substrate 2 and the cathode substrate 1 and the frame for sealing the cathode substrate 1 and the exhaust substrate 6 have the same thickness, but the thickness of the frame is as required. Can be set freely.

  The high voltage introduction terminal 60 is fused to the exhaust substrate 6 and is kept airtight from the outside. An Fe—Ni alloy is used for the high voltage introduction terminal 60. The component ratio of the Fe—Ni alloy is selected so as to match the thermal expansion coefficient with the sealing material 32. In this embodiment, Fe is 52% and Ni is 48%. The external terminal 63 of the high voltage introduction terminal 60 is a terminal for applying a high voltage to the anode substrate 2 from the outside, and is connected to an external socket.

  A contact spring 50 is attached to the high voltage introduction terminal 60 by spot welding. The high voltage applied to the high voltage introduction terminal 60 by the contact spring 50 is introduced to the anode substrate side. The contact spring 50 comes into contact with the anode substrate 2 by the appropriate pressing of the contact portion 53 at the tip by the spring force.

  An anode terminal 24 for contacting the contact spring 50 is formed on the anode substrate 2. Since a relatively large current flows through the anode terminal 24, reliability is important. In this embodiment, the structure near the anode terminal 24 is as follows. A BM 22 of chromium and chromium oxide is formed on the anode substrate, and a metal back 23 made of Al is formed covering the BM 22. This is the same configuration as the effective surface of the screen. In this embodiment, a conductive film as the anode terminal 24 is formed on the metal back 23 with a thickness of 10 μm to 30 μm. In this embodiment, the conductive film is formed by applying a silver paste by printing and then baking. There is no need to provide a special process for firing the conductive film. For example, it may be performed simultaneously with the firing process for fixing the spacer 4.

  The silver paste is obtained by dispersing silver particles having a diameter of 1 μm to several μm in an organic solvent having a high viscosity. After firing, the silver particles are connected to each other to have conductivity. In some cases, the conductive film should have some resistance. In such a case, the resistance can be adjusted by further mixing a paste for frit glass with a normal silver paste. Note that the material of the conductive film is not limited to silver paste, and Ni paste in which Ni particles are dispersed, Al paste in which Al particles are dispersed, and the like can also be used. A graphite film bonded with a binder can also be used. The graphite in this case is preferably graphite. The resistance of the graphite film can be adjusted, for example, by mixing bengara (iron oxide) with graphite.

  By forming the conductive film as thick as 10 μm to 30 μm, the contact spring 50 and the conductive film can be stably contacted. That is, in the case of a metal film, the contact spring 50 and the metal film are in point contact, and there is a great risk that current concentrates on this point contact portion and the conductive film is destroyed. The conductive film and the contact spring 50 can have a large contact area as compared with the case of a metal film, become a state close to surface contact, and stabilize the contact. Further, in the case of the conductive film as in the present embodiment, since the resistance is larger than that of metal, it is possible to prevent a large current from flowing through the contact portion 53. Also from this point, the stability of conduction by contact can be improved.

  FIG. 5 is a perspective view showing a state where the high voltage introduction terminal 60 and the contact spring 50 are connected by spot welding. In FIG. 5, a high voltage introduction terminal 60 includes a flat portion 61 where the contact spring 50 is spot-welded, a flange 62 sealed to the exhaust board 6 by a sealing material 32, and an external terminal 63 connected to an external power source. It is composed of

  FIG. 6 shows the shape of the contact spring 50 in this embodiment. The contact spring 50 is made of Inconel, which can be easily spot welded with the Fe—Ni alloy. The contact spring 50 includes a base portion 51 that is connected to the high voltage introduction terminal 60, an arm portion 52 that applies a spring force, and a contact portion 53 that is connected to the anode terminal 24 of the anode substrate 2.

  The contact portion 53 of the contact spring 50 comes into contact with the anode terminal 24 formed on the anode substrate 2 by an appropriate force due to bending stress caused by the bending of the arm portion 52 of the contact spring 50. The contact pressure of the contact spring 50 in the present embodiment is about 10 g, but may be larger than 10 g due to component variations. The contact portion 53 of the contact spring 50 has an appropriate curved surface such as a spherical surface, and is formed so as to be in stable contact with the anode terminal 24.

  Inconel, which is a material of the contact spring 50, has an appropriate spring force and has heat resistance. In the FED, heat resistance is an important problem because it undergoes a heat process at 400 ° C. or higher in a frit glass sealing process, an exhaust process, and the like. The thickness of Inconel in this embodiment is 0.09 mm in order to give an appropriate spring force. The material of Inconel is 0.1 mm. As will be described later, the contact spring 50 is chemically polished to a thickness of 0.09 mm.

  As shown in FIG. 4, a high voltage of 8 KV to 10 KV is applied to the contact spring 50. The distance between the cathode substrate 1 and the anode substrate 2 is about 2.8 mm, and the display device has a strong electric field. Further, the contact spring 50 is in contact with the anode substrate 2 through the through hole 10 formed in the cathode substrate 1. Further, the tip portion 531 of the contact portion 53 of the contact spring 50 is closer to the cathode substrate 1 than the metal back or the like formed on the anode substrate 2. Thus, the contact spring 50, particularly the contact portion 53, is exposed to severe conditions in terms of withstand voltage.

  As described above, since a large electric field is applied to the contact spring 50, the shape of the contact spring 50 is important. In spite of the fact that the contact spring 50 is on the high voltage side, it has been observed that when a sharp edge is present in the contact spring 50, particularly the contact portion 53, sparks are generated from this portion. As shown in FIG. 6, the present invention prevents sparks by forming R at the corner portion of the tip of the contact spring 50, particularly in the contact portion 53.

  FIG. 7 is a detailed view of the contact spring 50 in this embodiment. 7A is a plan view of the contact spring 50, FIG. 7B is a front view, FIG. 7C is a back view, and FIG. 7D is a side view. In FIG. 7A, by forming R at the tip of the contact portion 53, sharp edges can be prevented and the withstand voltage characteristics can be improved. The width B of the contact portion 53 in FIG. 7A is 2 mm. The withstand voltage characteristic is greatly improved by setting the curvature radius R of the tip of the contact portion 53 in FIG. 7A to 0.2 mm or more, preferably 0.5 mm or more. By setting the curvature radius R of the tip to 1.0 mm or more, a more preferable result with respect to the withstand voltage can be obtained.

  The withstand voltage can be improved by providing the tip of the base 51 shown in FIG. The radius of curvature RB of the corner portion of the base portion 51 is about 1.2 mm. The width BB of the base portion 51 of the contact spring 50 is slightly larger than the width B of the arm portion 52 and is 2.35 mm. By forming the RB in the base portion 51, it is possible to prevent the tip portion 531 from being deformed, which is also advantageous in terms of withstand voltage.

  In FIG.7 (b), the front-end | tip of the contact part 53 of the contact spring 50 is a spherical surface, and the curvature radius RC is 2 mm. The radius of curvature RC of the contact portion 53 is set in consideration of the contact area with the anode terminal 24, the contact pressure with the anode terminal 24 due to the spring force of the arm portion 52 of the contact spring 50, and the like. The contact portion 53 has a horizontal diameter D of 3.4 mm. When the contact spring 50 comes into contact with the anode terminal 24, the arm portion 52 is bent, and D shown in FIG. The plate thickness t of the material of the contact spring 50 is 0.1 mm, but finally becomes 0.09 mm by chemical polishing.

  In FIG.7 (c), the diameter DB of the horizontal direction of the base part 51 is 3.1 mm. The curvature radii at the tips of the base portion 51 and the contact portion 53 are as described with reference to FIG.

  In FIG.7 (d), the height of the contact spring 50 is 14 mm. When the contact spring 50 is inserted into the FED, the arm portion 52 of the contact spring 50 is bent, and L1 becomes small. The reason why the arm portion 52 is divided into two is to increase the reliability of contact. The arm portion 52 has a width B of 2 mm and a length L2 of 11 mm. The spring force is determined by the length L2 and the width B of the arm portion 52.

  FIG. 8 is an enlarged view of the contact portion 53 of the contact spring 50. As described above, a large electric field exists around the contact spring 50. If there is a sharp protrusion on the contact spring 50, this portion causes a spark. Before the contact spring 50 is bent, an Inconel material having a thickness of 1 mm is punched out by press molding. If a burr or the like is generated on the side portion 533 by press molding, this portion causes a spark.

  On the other hand, the contact surface 532 of the contact portion 53 of the contact spring 50 is in contact with the anode terminal 24. If there is a protrusion on the contact surface 532, the contact with the anode terminal 24 becomes a point contact, and the contact is not stable. Further, if the contact is point contact, the current concentrates on the portion, and the contact portion is excessively heated, resulting in a reliability problem.

  Further, if there is a protrusion on the contact portion 53, when the anode terminal 24 comes into contact with the anode terminal 24, the anode terminal 24 is scraped by the protrusion, and scraped particles are generated in the FED. This particle causes a serious problem withstand voltage. Therefore, the contact surface 532 of the contact portion 53 must be a flat surface without protrusions or the like. Not only the protrusions but also scratches and the like cause the same problem in terms of making sharp edges.

  However, inconel, which is the material of the contact spring 50, has many opportunities for scratches and the like even at the material stage. Further, there are many occasions where scratches, protrusions, etc. occur at the stage of press molding or bending the Inconel material.

  The present invention solves the above problem by flattening the surface of the contact spring 50 by performing chemical polishing after the contact spring 50 is processed and molded. Chemical polishing has an effect of flattening the surface after polishing, in particular, because many protrusions and the like are polished by a local battery action. In the present embodiment, the surface roughness Rmax of the contact spring 50 after chemical polishing, particularly the side portion 533 in the contact portion 53 is set to 0.6 μm or less. Of the side portions 533, the side portion 5331 of the tip portion 533 of the contact portion 53 has a particularly large influence on the withstand voltage. Therefore, when Rmax indicating the surface roughness of the entire side portion 533 cannot be reduced to 0.6 μm or less, the effect can be improved by setting Rmax to 0.6 μm or less only at the tip portion 5331.

  Further, the flatness of the contact surface 532 of the contact portion 53 of the contact spring 50 is set to 0.6 μm or less in terms of the surface roughness Rmax. Here, unlike the arm portion 52, the contact surface 532 has a curvature in the contact portion 53. The arm portion 52 also bends and has a curvature when the contact spring 50 is mounted in the display device, but is clearly different from the curvature of the contact portion 53. When the contact spring 50 is attached to the display device by setting the surface roughness of the contact surface 532 to 0.6 μm or less, the anode terminal 24 can be prevented from being scraped, and sparks caused by shavings can be prevented. I can do it.

  Here, Rmax 0.6 mm or less is defined as follows. In other words, the contact portion 53 of the contact spring 50 is arbitrarily designated with a length of 0.25 mm. The range is measured with a surface roughness meter, and surface irregularities are measured. The difference between the highest convex portion and the lowest concave portion with respect to the average value of the surface irregularities is defined as Rmax. Although there is Rz or the like as a method for evaluating roughness, evaluation by Rmax is most suitable for the purpose of the present invention.

  By adopting the configuration as described above according to the present invention, the spark generated from the contact spring 50 can be greatly reduced, and the generation of foreign matter in the display device can be suppressed. Can be improved.

  FIG. 9 is a cross-sectional view showing a second embodiment of the present invention. In FIG. 9, the arrangement of the cathode substrate 1, the anode substrate 2, the exhaust substrate 6 and the like is the same as that of FIG. The difference from the first embodiment is the shape of the contact spring 50. FIG. 10 is a perspective view showing a state in which the contact spring 50 is connected to the high voltage introduction terminal 60 by spot welding.

  In FIG. 9, the contact spring 50 slides on the anode terminal after contacting the anode terminal 24 to obtain a predetermined contact pressure at a predetermined position. In the present embodiment, the amount that the contact spring 50 slides on the anode terminal is larger than that in the first and second embodiments, so the shape of the contact portion 53 of the contact spring 50 is larger than that in the other embodiments. More important. In this case, as shown in FIG. 9, the shape of the contact portion 53 of the contact spring 50 makes the contact spring 50 safer when the radius of curvature R1 of the tip portion 531 is smaller than the radius of curvature R2 at the connection portion with the arm portion 52. The anode terminal 24 can be contacted.

  The material of the contact spring 50 is Inconel having a thickness of 0.1 mm, and the plate thickness becomes 0.09 mm by electropolishing this. As shown in FIG. 10, the arm part 52 of the contact spring 50 is divided into two parts. This makes it possible to make contact with the anode terminal 24 more safely. The shape of the high voltage introduction terminal 60 to which the contact spring 50 is spot-welded is the same as that described in the first embodiment.

  The contact pressure in this embodiment is determined by the bending stress of the arm portion 52 of the contact spring 50. The bending stress is proportional to the width of the contact spring 50, proportional to the amount of bending, inversely proportional to the length of the contact spring 50, and proportional to the cube of the plate thickness of the contact spring 50. Is easier. The shape of the arm portion 52 close to the base portion 51 with respect to the bending stress of the contact spring 50 is dominant.

  In the present embodiment, the shape of the contact portion 53 of the contact spring 50 is set to 0.2 mm or more, preferably 0.5 mm or more, more preferably 1.0 mm or more, as in FIG. 7 of the first embodiment. Can suppress sparks.

  Also in this embodiment, the withstand voltage can be improved by setting the surface roughness of the side portion 533 of the contact portion 53 of the contact spring 50 and the surface in contact with the anode terminal 24 to a certain value or less. That is, the surface roughness Rmax of the contact portion 532 where the contact portion 53 of the contact spring 50 contacts the anode terminal 24 is set to 0.6 μm or less. Furthermore, the surface roughness Rmax of the side portion 533 of the contact portion 53 is set to 0.6 μm or less. In addition, when it is difficult to set the Rmax of the entire side portion 533 of the contact portion 53 to 0.6 μm or less, the withstand voltage characteristics can be reduced by setting the Rmax of the side portion 5331 of the tip portion of the contact portion 53 to 0.6 μm or less. Can be improved. In the present embodiment, since the contact portion 53 of the contact spring 50 slides a large amount on the surface of the anode terminal 24, it is particularly important to make the surface roughness Rmax of the side portion 5331 at the tip of the contact portion below a certain value. is there.

  The definition of Rmax is the same as that described in the first embodiment. Such a surface can be obtained by electropolishing the contact spring 50. According to the contact spring 50 of the present embodiment, it is possible to obtain a high voltage introduction system that accurately controls the contact pressure and has excellent withstand voltage characteristics.

  FIG. 11 shows a third embodiment of the present invention. 11 is the same as the first embodiment shown in FIG. 4 except for the contact spring 50. In FIG. 11, the contact spring 50 includes a base portion 51 connected to the high voltage introduction button 60 by spot welding, an arm portion 52 that applies an appropriate contact pressure to the contact spring 50, and a contact portion 53 that contacts the anode terminal 24. is doing. The configuration of the anode terminal 24 is the same as that of the first embodiment.

  Unlike the first embodiment, the arm portion 52 that applies an appropriate contact pressure to the contact spring 50 has a Z shape. By compressing the Z-shaped portion in the vertical direction, an appropriate contact pressure is applied to the contact portion 53 of the contact spring 50. The feature of the second embodiment is that the contact spring 50 bends in a substantially right angle direction with respect to the metal back 23, so that the contact portion 53 of the contact spring 50 hardly slides on the anode terminal or is slightly slid even if it slides. is there. Since the contact spring 50 does not slide on the anode terminal, the risk of the metal spring 23 being scraped by the contact spring 50 or being caught when the contact spring 50 slides on the metal back 23 is small.

  FIG. 12 is a perspective view of a contact spring 50 used in this embodiment. The contact portion 53 of the contact spring 50 in this embodiment is also divided into two, and the bending stress at the Z portion is evenly distributed. In FIG. 14, the contact spring 50 is formed of Inconel having a thickness of 0.1 mm, as in the first embodiment. Thereafter, the surface roughness is reduced by electropolishing and the plate thickness is reduced to 0.09 mm.

  The width of the contact spring 50 is 5 mm, the width of each bifurcated arm portion 52 is 2 mm, and the distance between the bifurcated arm portion and the arm portion is 1 mm. The high voltage introduction button 60 is made of an FeNi alloy as in the first embodiment. In FIG. 12, the shape of the contact portion 53 of the contact spring 50 is a curved surface having a small radius of curvature unlike the other portions.

  The contact pressure of the contact spring 50 of this embodiment is mainly determined by the arm portion 52 bent in a Z shape. Since the arm portion 52 is Z-shaped, the amount by which the contact portion 53 of the contact spring 50 slides on the surface of the anode terminal can be reduced, so that the risk of generation of shavings on the anode terminal 24 can be further reduced. Further, since the arm portion 52 is Z-shaped, it becomes easier to control the contact pressure.

  In the present embodiment, the shape of the contact portion 53 of the contact spring 50 is set to 0.2 mm or more, preferably 0.5 mm or more, more preferably 1.0 mm or more, as in FIG. 7 of the first embodiment. Can suppress sparks.

  Also in this embodiment, the withstand voltage can be improved by setting the surface roughness of the side portion 533 of the contact portion 53 of the contact spring 50 and the surface in contact with the anode terminal 24 to a certain value or less. That is, the surface roughness Rmax of the contact portion 532 where the contact portion 53 of the contact spring 50 contacts the anode terminal 24 is set to 0.6 μm or less. Furthermore, the surface roughness Rmax of the side portion 533 of the contact portion 53 is set to 0.6 μm or less.

  Further, when it is difficult to make the Rmax of the entire side portion 533 of the contact portion 53 0.6 μm or less, the Rmax of the side portion 5331 of the tip portion of the contact portion 53 is made 0.6 μm or less to withstand voltage characteristics. Can be improved. The definition of Rmax is the same as that described in the first embodiment. Such a surface can be obtained by electropolishing the contact spring 50.

  As described above, according to the contact spring 50 of this embodiment, it is possible to more reliably prevent the risk of scraping of the anode terminal 24, to easily control the contact pressure, and to have excellent withstand voltage characteristics. A high voltage introduction system can be obtained.

It is a top view which shows Example 1 of this invention. It is a side view of FIG. It is AA sectional drawing of FIG. 2 is a cross-sectional view taken along the line BB of Example 1. FIG. It is a perspective view of a high voltage introduction terminal and a contact spring. It is a perspective view of a contact spring. It is detail drawing of a contact spring. It is an enlarged view of the front-end | tip part of a contact spring. 6 is a cross-sectional view of Example 2. FIG. It is a perspective view of the high voltage introduction terminal and contact spring of Example 2. 6 is a cross-sectional view of Example 3. FIG. 6 is a perspective view of a contact spring of Example 3. FIG.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Cathode substrate, 2 ... Anode substrate, 3 ... Sealing part, 4 ... Spacer, 5 ... Terminal, 6 ... Exhaust board, 7 ... Exhaust board sealing part 8 ... exhaust pipe, 11 ... scanning line, 12 ... data signal line, 13 ... electron emission source, 14 ... insulating film, 21 ... phosphor, 22 ... black Matrix, 23 ... Metal back (anode electrode), 24 ... Anode terminal, 50 ... Contact spring, 51 ... Base part of contact spring, 52 ... Arm part of contact spring, 53 ... Contact portion of contact spring, 60 ... high voltage introduction terminal, 61 ... flat portion of high voltage introduction terminal, 62 ... flange portion of high voltage introduction terminal, 63 ... outside of high voltage introduction terminal Terminal, 81 ... exhaust hole. 531: Contact spring tip, 532: Contact surface of the contact spring contact, 533: Contact spring contact side, 5331: Contact spring tip side.

Claims (10)

A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, to which an anode voltage is applied, and a phosphor formed in a location corresponding to the electron emission source, and a vacuum inside A display device held by
A high voltage introduction terminal for supplying the anode voltage is formed on the cathode substrate, and a contact spring for contacting the anode substrate is connected to the high voltage introduction terminal, and the contact spring gives a bending stress. A display device comprising a contact portion that contacts an arm portion and an anode terminal formed on the anode substrate, and a corner R of 0.2 mm or more is formed at a tip of the contact portion.   The display device according to claim 1, wherein a corner R of 0.5 mm or more is formed at a tip of the contact portion.   The display device according to claim 1, wherein a corner R of 1.0 mm or more is formed at a tip of the contact portion. A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, to which an anode voltage is applied, and a phosphor formed in a location corresponding to the electron emission source, and a vacuum inside A display device held by
A high voltage introduction terminal for supplying the anode voltage is formed on the cathode substrate, and a contact spring for contacting the anode substrate is connected to the high voltage introduction terminal, and the contact spring gives a bending stress. A contact portion that contacts the arm portion and the anode terminal formed on the anode substrate, and a surface roughness Rmax of a surface of the contact portion that contacts the anode terminal is 0.6 μm or less; The surface roughness Rmax of the part is 0.6 μm or less.   The display device according to claim 4, wherein the surface roughness Rmax of the side portion at the tip of the contact portion is 0.6 μm or less.   The display device according to claim 4, wherein the contact spring is electropolished. A cathode substrate in which an electron emission source is formed in a matrix, an anode substrate facing the cathode substrate, to which an anode voltage is applied, and a phosphor formed in a location corresponding to the electron emission source, and a vacuum inside A display device held by
A high voltage introduction terminal for supplying the anode voltage is formed on the cathode substrate, and a contact spring for contacting the anode substrate is connected to the high voltage introduction terminal, and the contact spring gives a bending stress. A contact portion that contacts an arm portion and an anode terminal formed on the anode substrate, and a tip end of the contact portion is formed with a corner R of 0.2 mm or more;
The surface roughness Rmax of the surface that contacts the anode terminal of the contact portion is 0.6 μm or less, and the surface roughness Rmax of the side portion of the contact portion is 0.6 μm or less.   8. The display device according to claim 7, wherein a corner R of 0.5 mm or more is formed at a tip of the contact portion.   The display device according to claim 7, wherein the surface roughness Rmax of the side portion at the tip of the contact portion is 0.6 μm or less.   The display device according to claim 7, wherein the contact spring is electropolished.

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