JP2009049325A - Electronic component module, and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component module capable of sufficiently reducing both mounting area and height. <P>SOLUTION: The electronic component module EM is provided with a coil component, a film 3, and a circuit pattern 5. The coil component is provided with a core structure as a component body, and terminal electrodes. In the coil structure, a flat coil as an internal circuit element is arranged, and both ends of the flat coil are electrically connected to the terminal electrodes. The film 3 is arranged on the outer surface of the core structure by adhesion, and formed of a resin having an electric insulation property. The circuit pattern 5 is formed on the film 3, and electrically connected to the flat coil through conductor films 9 and the terminal electrodes. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electronic component module and a manufacturing method thereof.

As an electronic component module, one having a plurality of electronic components and a circuit board on which the plurality of electronic components are mounted is known (for example, see Patent Document 1). In the electronic component module disclosed in Patent Document 1, a plurality of electronic components are electrically connected through a wiring pattern formed on a circuit board, and are arranged on the same plane of the circuit board.
JP 2003-124600 A

  However, the electronic component module described in Patent Document 1 has the following problems. That is, in the electronic component module disclosed in Patent Document 1, since a plurality of electronic components are arranged in a plane direction parallel to the circuit board, an area for mounting the plurality of electronic components on the circuit board. Is required, which increases the mounting area of the electronic component module.

  By the way, in recent years, downsizing of electronic devices and the like has become more and more remarkable, and electronic component modules mounted on such electronic devices and the like have not only a small mounting area as described above but also a thickness thereof. There is an increasing demand for reducing the size of the direction, that is, reducing the height. In order to reduce the mounting area of the electronic component module, it is conceivable to arrange a plurality of electronic components in a direction perpendicular to the circuit board to reduce the area of the circuit board. However, when a plurality of electronic components are arranged in a direction perpendicular to the circuit board, the height in the direction perpendicular to the circuit board is increased, which may hinder a reduction in the height of the electronic component module. is there.

  Therefore, the present invention has been made in view of such circumstances, and an object thereof is to provide an electronic component module capable of sufficiently achieving both a small mounting area and a low profile.

  An electronic component module according to the present invention includes an electronic component having a component main body and an internal circuit element disposed inside the component main body, and a resin having an electrical insulation property disposed on the outer surface of the component main body by bonding. And a circuit pattern disposed on the film and electrically connected to the internal circuit element.

  In the electronic component module according to the present invention, a film made of an electrically insulating resin and having a circuit pattern disposed thereon is adhered to the outer surface of the component main body, so that a new electronic component is configured with the circuit pattern. Alternatively, a new electronic component can be mounted on the film, and the mounting area of the electronic component module can be reduced even when the electronic component module includes a plurality of electronic components. Further, since the circuit pattern is arranged on the film, the height of the electronic component module can be reduced.

  Preferably, the component body has, as outer surfaces, first and second main surfaces facing each other and at least one side surface extending so as to connect the first and second main surfaces, and the film is The circuit pattern is disposed so as to extend over at least the first main surface and the side surface. In this case, it is possible to easily mount the electronic component module using a portion of the circuit pattern arranged on the side surface of the component main body.

  Preferably, the film is disposed so as to further extend over the second main surface, and the second main surface constitutes a mounting surface for other components. In this case, since the film is positioned between the component main body and the other components in the mounted state, it is possible to suppress the mechanical shock from acting on the component main body.

  Preferably, the circuit pattern is arranged so as to extend over the first main surface, the side surface, and the second main surface. In this case, since the electronic component module can be mounted by further using the portion of the circuit pattern arranged on the second main surface of the component main body, the mounting strength of the electronic component module can be increased.

  Preferably, the electronic component further includes a terminal electrode disposed on the outer surface of the component body and electrically connected to the internal circuit element, and the internal circuit element is electrically connected to the circuit pattern through the terminal electrode. Has been.

  Preferably, the electronic component further includes a plurality of terminal electrodes electrically connected to the internal circuit element, and the component main body has a rectangular parallelepiped shape and rectangular first and second main surfaces facing each other. A first and second side surface extending in a direction connecting the first and second main surfaces and facing each other in a direction orthogonal to the opposing direction of the first and second main surfaces; A third side surface and a fourth side surface that extend so as to connect the main surfaces of the first and second main surfaces and face each other in a direction orthogonal to the opposing direction of the first and second main surfaces and the opposing direction of the first and second side surfaces The plurality of terminal electrodes are arranged at the end portions of the component main body in the opposing direction of the first and second side surfaces, and the film extends over at least the first main surface and the third side surface. The circuit pattern extends over at least the first main surface and the third side surface. It is arranged, and the plurality of terminal electrodes and the circuit patterns are electrically connected. In this case, the electronic component module can be easily mounted using the portion of the circuit pattern that is disposed on the third side surface of the component main body.

  Preferably, the circuit pattern is disposed so as to extend over the first main surface, the third side surface, and the second main surface. In this case, since the electronic component module can be mounted by further using the portion of the circuit pattern arranged on the second main surface of the component main body, the mounting strength of the electronic component module can be increased.

  Preferably, the plurality of terminal electrodes are electrically connected to a portion disposed with respect to the first main surface in the circuit pattern.

  An electronic component module manufacturing method according to the present invention provides an electronic component having a component main body and an internal circuit element disposed inside the component main body, and is made of an electrically insulating resin and has a circuit pattern. The film is formed, and the film is bonded to the outer surface of the component main body to electrically connect the circuit pattern and the internal circuit element.

  In the method for manufacturing an electronic component module according to the present invention, a film made of a resin having a circuit pattern arranged electrically connected to an internal circuit element and having an electrical insulating property, and a component main body having the film bonded to the outer surface An electronic component module comprising: The obtained electronic component module can constitute a new electronic component by a circuit pattern, or can mount a new electronic component on a film, even when the electronic component module includes a plurality of electronic components. The mounting area of the electronic component module can be reduced. Further, since the circuit pattern is arranged on the film, the height of the electronic component module can be reduced.

  According to the present invention, it is possible to provide an electronic component module capable of sufficiently reducing both the mounting area and the height.

  Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  1 and 2 are perspective views showing an electronic component module according to the present embodiment. As shown in FIGS. 1 and 2, the electronic component module EM includes a coil component 1 as an electronic component, a film 3, and a circuit pattern 5.

  First, the configuration of the coil component 1 will be described with reference to FIGS. FIG. 3 is a perspective view showing an appearance of the coil component. FIG. 4 is an exploded perspective view showing the core structure. FIG. 5 is a perspective view of the coil component with the terminal electrode removed from the state of FIG. FIG. 6 is a plan view of the coil substrate. 7 is a cross-sectional view (vertical cross-sectional view) taken along the line VII-VII of the coil component shown in FIG.

  As shown in FIG. 3, the coil component 1 includes a core structure 10 as a component main body and a terminal electrode 20. The core structure 10 is mainly composed of a flat lower ferrite core 12 and a mainly flat upper ferrite core 11, and the upper ferrite core 11 and the lower ferrite core 12 are combined to form a substantially rectangular parallelepiped as a whole. It has a shape (in this embodiment, a flat plate shape with a reduced thickness).

  As shown in FIG. 4, the upper ferrite core 11 includes a rectangular flat plate portion (base portion) 11 a and a pair of outer leg portions (projections) 11 b erected perpendicular to the flat plate portion 11 a. have. One outer leg portion 11b extends in the same direction from one side of the flat plate portion 11a, and the other outer leg portion 11b extends from a side parallel to the one side. Therefore, when the upper ferrite core 11 is arranged on the lower ferrite core 12 so that the longitudinal direction of the outer leg portion 11b is along two opposite sides of the lower ferrite core 12, the flat plate portion 11a and the lower ferrite core 12 of the upper ferrite core 11 are disposed. A gap is formed between the two.

  As shown in FIG. 4, the lower ferrite core 12 has a rectangular flat plate portion (base portion) 12a and a middle leg portion (protrusion portion) 12b protruding from the central portion of the flat plate portion 12a. The middle leg portion 12b is a convex portion having a substantially prismatic shape, and has a cylindrical surface curved inward along an axis parallel to each side of the flat plate portion 12a.

  When the core structure 10 is configured by abutting the front end surface of the outer leg portion 11b of the upper ferrite core 11 on the flat plate portion 12a of the lower ferrite core 12, an outer shell portion that is substantially a closed magnetic path is formed. . At this time, the middle leg portion 12b is disposed inside the outer shell portion.

  As shown in FIG. 5, the core structure 10 has a rectangular first and second main surfaces 10 a and 10 b facing each other, and a first and second side surfaces 10 c and 10 d facing each other, and facing each other. And the third and fourth side surfaces 10e and 10f. The first and second side surfaces 10c and 10d extend in a direction perpendicular to the opposing direction of the first and second main surfaces 10a and 10b and extend so as to connect the first and second main surfaces 10a and 10b. Opposite. The third and fourth side surfaces 10e and 10f extend so as to connect the first and second main surfaces 10a and 10b, and are opposed to the first and second main surfaces 10a and 10b, and the first and second main surfaces 10a and 10b. The two side surfaces 10c and 10d face each other in a direction orthogonal to the facing direction.

  A coil substrate 30 is housed in a gap portion between the upper ferrite core 11 and the lower ferrite core 12 constituting the core structure 10.

  The coil substrate 30 is covered with a protective resin layer 33. An adhesive resin material 40 is provided around the protective resin layer 33. Therefore, the protective resin layer 33 and the adhesive resin material 40 are interposed between the coil substrate 30 and the core structure 10. The adhesive resin material 40 fixes the coil substrate 30 covered with the protective resin layer 33 to the core structure 10. The protective resin layer 33 easily enters between the windings of the planar coil, and the adhesive strength between the upper ferrite core 11 and the lower ferrite core 12, the protective resin layer 33, the resin material 40, and the coil is ensured.

  One end surface of the coil substrate 30 constitutes one end surface of the core structure 10 and is exposed to the outside. At the one end surface, the side surfaces of the insulating plate 31, the lead-out end electrode 32, and the protective resin layer 33 are exposed. The insulating plate 31 is a substrate that becomes a core portion constituting the coil substrate 30. The lead-out end electrode 32 is electrically connected to a coil, which will be described later, and is a portion that is also electrically connected to the terminal electrode 20 shown in FIG.

  As shown in FIG. 6, a circular opening 35 is formed in the central portion of the coil substrate 30. The planar coil 34 formed of a conductive material is disposed so as to surround the circular opening 35. The planar coils 34 are formed on both surfaces of the coil substrate 30 and are electrically connected to the lead-out end electrodes 32, respectively. Each coil 34 spirally extends from the vicinity of the circular opening 35 toward the outside. The middle leg portion 12 b of the lower ferrite core 12 is inserted into the circular opening 35 of the coil substrate 30. The planar coil 34 constitutes an internal circuit element.

  When viewed from the direction facing the coil exposed surface, the planar coil 34 on one side forms a left-handed spiral along the direction toward the outer side, and the planar coil 34 on the other side also looks from the direction facing the coil exposed surface. As seen, when a left-handed spiral is formed along the outward direction, these central portions are electrically connected and overlapped, and when current flows in one direction, the rotational direction in which the current flows is the same Is set to That is, the magnetic fluxes generated by the two planar coils 34 are superimposed and strengthened.

  The lead-out end electrode 32 connected to the planar coil 34 formed on one surface of the coil substrate 30 and the lead-out end electrode 32 connected to the planar coil 34 formed on the other surface are respectively coil substrates. It is provided on 30 opposite sides. The planar coils 34 provided on both surfaces of the coil substrate 30 are electrically connected to each other by front and back contact portions 36 formed at the peripheral edge of the circular opening 35. The front and back contact portions 36 penetrate the insulating plate 31 in the thickness direction.

  Therefore, when a voltage is applied between the lead-out end electrode 32 provided on one side of the coil substrate 30 and the lead-out end electrode 32 provided on the other side, it is formed on one surface of the coil substrate 30. A current flows from the coil 34 that is formed to the coil 34 that is formed on the other surface.

  As shown in FIG. 7, the middle leg portion 12 b of the lower ferrite core 12 is inserted into the hole 35 of the coil substrate 30. The middle leg portion 12b of the lower ferrite core 12 is slightly shorter than the outer leg portion 11b of the upper ferrite core 11. Accordingly, a gap is generated between the tip of the middle leg portion 12 b and the upper ferrite core 11, and the minute gap 41 can be formed.

  The magnetic flux generated by the coil current passes through the upper ferrite core 11 and the lower ferrite core 12, but the minute gap 41 interposed in the magnetic circuit suppresses magnetic saturation. Since the core structure 10 has an ultra-compact shape with a side of several millimeters or less, the dimensions of the minute gaps 41 and 42 (the distance between the tip of the middle leg portion 12b and the upper ferrite core 11, the outer leg The distance between the tip of the part 11b and the lower ferrite core 12) is preferably set to 0.1 to 100 μm, more preferably 0.1 to 50 μm.

  In the case of the present embodiment, an adhesive resin material 40 is applied along the surface on which the middle leg portion 12b of the lower ferrite core 12 is formed. The coil substrate 30 is fixed via a resin material 40 so as to be sandwiched between the upper and lower cores 12 and 11. The minute gap 41 is filled with a resin material 40 for bonding.

  A Cu treatment layer 34 a is uniformly formed on the surfaces of the coil 34 and the front and back contact portions 36. Therefore, the protective resin layer 33 disposed around the coil substrate 30 uniformly enters between the windings of the coil 34. As a result, it is difficult to form a minute cavity between the coil 34 and the protective resin layer 33, and the adhesion between the coil 34 and the protective resin layer 33 is further improved.

  Again referring to FIG. 1 and FIG. The film 3 is disposed on the outer surface of the core structure 10 of the coil component 1 by adhesion. Specifically, the film 3 covers the first main surface 10a and extends from the first main surface 10a through the third and fourth side surfaces 10e and 10f to the second main surface 10b. Has been placed.

  The film 3 is made of an electrically insulating resin (for example, a polyimide resin, an aramid resin, or a polyethylene resin), and has flexibility and cushioning properties. The thickness of the film 3 is, for example, about 3 to 9 μm.

  The circuit pattern 5 is disposed on the film 3. The circuit pattern 5 is made of a metal such as Cu or Au. The circuit pattern 5 is disposed so as to cover the first main surface 10a, the third and fourth side surfaces 10e, 10f, and the second main surface 10b. A portion of the circuit pattern 5 that is disposed so as to extend to the third and fourth side surfaces 10e and 10f and the second main surface 10b functions as a terminal electrode of the electronic component module EM, and is used as an external substrate or other Mounted on electronic components. Although the metal material which comprises the circuit pattern 5 is not restricted to what was mentioned above, the metal which has ductility is preferable.

  An insulating film 7 is disposed on a portion of the film 3 corresponding to the first main surface 10a so as to cover the portion. In the insulating film 7, an opening 7a and a notch 7b are formed at predetermined positions so that a part of the circuit pattern 5 is exposed. In the present embodiment, eight openings 7a are located in the central portion of the insulating film 7, and the notches 7b are located in the central portion of the edge of the insulating film 7 on the first and second side surfaces 10c, 10d side. Yes. The insulating film 7 can be formed of a resist material, for example.

  In the electronic component module EM, the conductor film 9 is disposed so as to cover the terminal electrode 20 of the coil component 1 and the edges of the film 3 and the insulating film 7 on the first and second side surfaces 10c, 10d side. The conductor film 9 is in contact with the circuit pattern 5 through the notch 7 b and is electrically connected to the circuit pattern 5. The conductor film 9 is in contact with the terminal electrode 20 and is electrically connected to the terminal electrode 20. As a result, the circuit pattern 5 is electrically connected to the planar coil 34 through the conductor film 9 and the terminal electrode 20.

  Then, with reference to FIGS. 8-11, the manufacturing method of the electronic component module EM of the structure mentioned above is demonstrated. FIG. 8 is a process diagram showing the procedure of the method of manufacturing the electronic component module according to this embodiment. 9 to 11 are schematic views showing the procedure of the method for manufacturing the electronic component module according to the present embodiment. The manufacturing method of the coil component 1 is known from Japanese Patent Application Laid-Open No. 2004-349468, Japanese Patent Application Laid-Open No. 2006-66830, Japanese Patent Application Laid-Open No. 2006-278909, and the like by the applicant of the present application, and thus description thereof is omitted. .

  First, as shown in FIG. 9A, a film base material 50 on which a metal film 51 is formed is prepared (S101). The film base material 50 is made of an electrically insulating resin (for example, a polyimide resin, an aramid resin, or a polyethylene resin), and has flexibility and cushioning properties. The thickness of the film base material 50 is about 3 to 9 μm. The metal film 51 is made of a metal such as Cu or Au, and is formed on the film base material 50 by a sputtering method or the like.

  Next, a dry film (DFR) is laminated on the metal film 51 formed on the film base material 50 (S103), and then exposure and development are performed (S105) to form the circuit pattern 5 described above. Further, after performing unnecessary etching to remove unnecessary portions (S107), the dry film is removed (S109). As a result, as shown in FIG. 9B, a film base material 50 on which the circuit pattern 5 is arranged is obtained.

  Next, a film made of a photosensitive insulating resin is formed on the film base material 50 on which the circuit pattern 5 is formed (S111). Here, a film made of a photosensitive insulating resin can be formed by printing a photosensitive insulating resin or laminating a photosensitive insulating resin film. Thereafter, exposure, development, and curing are performed (S113), and an insulating film 7 is formed as shown in FIG. 9C.

  Next, as shown in FIG. 10A, an adhesive layer 53 is formed on the back surface of the film base material 50, that is, the surface on which the metal film 51 is not formed (S115). Here, the adhesive layer 53 can be formed by applying an adhesive or attaching an adhesive sheet to the back surface of the film base material 50. If necessary, the adhesive may be temporarily cured.

  Next, the film base material 50 is cut (S117) and divided into one film 3 at a time. At this time, the circuit pattern 5 and the insulating film 7 are formed on the film 3.

  Next, the film 3 on which the circuit pattern 5 and the insulating film 7 are formed is attached to the separately prepared coil component 1, and the adhesive is cured (S119). At this time, as shown in FIG. 10B, FIG. 10C, and FIG. 11A, the film 3 includes the first main surface 10a, the third and fourth side surfaces 10e, 10f, and the second main surface 10a. The film 3 is pasted so as to be wound around the coil component 1 so as to extend over the main surface 10b.

  Next, as shown in FIG. 11B, the conductor film 9 is formed at predetermined positions of the coil component 1 and the film 3 (S121). Thereby, the circuit pattern 5 and the planar coil 34 are electrically connected. Here, the terminal electrode 20 of the coil component 1 and the edges of the film 3 and the insulating film 7 on the first and second side surfaces 10c and 10d are covered by applying a conductive adhesive or plating (sputtering). In addition, the conductor film 9 can be formed.

  Next, as the electrode surface treatment, an oxidation prevention treatment (plating treatment using Ni, Au, or the like) is performed on the exposed portion of the circuit pattern 5 and the outer surface of the conductor film 9 (S123). Thus, the electronic component module EM is obtained.

  As described above, according to the present embodiment, the film 3 made of an electrically insulating resin and having the circuit pattern 5 disposed thereon is bonded to the outer surface of the core structure 10 of the coil component 1. It becomes possible to configure a new electronic component (for example, an inductor or the like) by the pattern 5 or to mount a new electronic component on the film 3, and the electronic component module EM is provided with a plurality of electronic components. The mounting area of the electronic component module EM can be reduced. Moreover, since the circuit pattern 5 is arrange | positioned at the film 3, the height reduction of the electronic component module EM can also be achieved.

  FIG. 12 shows an example in which the IC chip 60 is mounted on the electronic component module EM. The IC chip 60 has an external terminal electrically and physically connected to a portion of the circuit pattern 5 exposed through the opening 7a by solder or a conductive adhesive.

  In the present embodiment, the film 3 and the circuit pattern 5 are arranged so as to extend over the first main surface 10a and the third and fourth side surfaces 10e and 10f. Thereby, the electronic component module EM can be easily mounted using the portions of the circuit pattern 5 that are disposed on the third and fourth side surfaces 10e and 10f of the core structure 10.

  In the present embodiment, the film 3 is arranged so as to further extend over the second main surface 10b, and the second main surface 10b constitutes a mounting surface for other components (circuit board, electronic component, etc.). is doing. Thereby, in the mounted state, since the film 3 is located between the core structure 10 (coil component 1) and other components, a mechanical impact acts on the core structure 10 (coil component 1). Can be suppressed. As a result, the reliability of the coil component 1 can be improved.

  In the present embodiment, the circuit pattern 5 is further arranged so as to extend over the second main surface 10b. As a result, the electronic component module EM can be mounted by further using the portion of the circuit pattern 5 disposed on the second main surface 10b of the core structure 10, so that the mounting strength of the electronic component module EM can be increased. Can be increased.

  The preferred embodiments of the present invention have been described above. However, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention.

  In the present embodiment, the film 3 and the circuit pattern 5 are disposed so as to extend over the second main surface 10b. However, the present invention is not limited to this, and the film 3 and the circuit pattern 5 may not be disposed on the second main surface 10b side. Good. Moreover, although the film 3 and the circuit pattern 5 are arrange | positioned so that 3rd and 4th side surface 10e, 10f may be covered, it is not restricted to this, either 3rd and 4th side surface 10e, 10f It is not necessary to arrange on one side.

  As electronic components constituting the electronic component module EM, instead of the coil component 1 described above, passive components such as multilayer electronic components (such as multilayer inductors, multilayer capacitors, or multilayer filters), and active components such as ICs May be adopted. The electric component mounted on the electronic component module EM is not limited to the above-described IC chip, and may be an electronic component such as an active component or a passive component.

It is a perspective view which shows the electronic component module which concerns on this embodiment. It is a perspective view which shows the electronic component module which concerns on this embodiment. It is a perspective view which shows the external appearance of a coil component. It is a disassembled perspective view which shows a core structure. FIG. 4 is a perspective view of a coil component in a state where terminal electrodes are removed from the state of FIG. 3. It is a top view of a coil substrate. FIG. 4 is a cross-sectional view taken along arrow VII-VII of the coil component shown in FIG. 3. It is process drawing which shows the procedure of the manufacturing method of the electronic component module which concerns on this embodiment. It is a schematic diagram which shows the procedure of the manufacturing method of the electronic component module which concerns on this embodiment. It is a schematic diagram which shows the procedure of the manufacturing method of the electronic component module which concerns on this embodiment. It is a schematic diagram which shows the procedure of the manufacturing method of the electronic component module which concerns on this embodiment. It is a perspective view which shows the state which mounted the IC chip in the electronic component module which concerns on this embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Coil component, 3 ... Film, 5 ... Circuit pattern, 7 ... Insulating film, 9 ... Conductor film, 10 ... Core structure, 10a ... 1st main surface, 10b ... 2nd main surface, 10c, 10d ... 1st and 2nd side surface 10e, 10f ... 3rd and 4th side surface, 20 ... Terminal electrode, 34 ... Planar coil, 50 ... Film base material, 51 ... Metal film, 53 ... Adhesive layer, 60 ... IC chip , EM ... Electronic component module.

Claims (10)

An electronic component having a component body and an internal circuit element disposed inside the component body;
A film made of a resin that is disposed on the outer surface of the component body by adhesion and has electrical insulation,
An electronic component module comprising: a circuit pattern disposed on the film and electrically connected to the internal circuit element. The component main body has, as the outer surface, first and second main surfaces facing each other and at least one side surface extending so as to connect the first and second main surfaces.
The film is disposed so as to span at least the first main surface and the side surface,
2. The electronic component module according to claim 1, wherein the circuit pattern is disposed so as to extend over at least the first main surface and the side surface. The film is arranged so as to further extend over the second main surface,
The electronic component module according to claim 2, wherein the second main surface constitutes a mounting surface for another component.   The electronic component module according to claim 3, wherein the circuit pattern is disposed so as to extend over the first main surface, the side surface, and the second main surface. The electronic component further includes a terminal electrode disposed on the outer surface of the component main body and electrically connected to the internal circuit element,
The electronic component module according to claim 1, wherein the internal circuit element is electrically connected to the circuit pattern through the terminal electrode. The electronic component further includes a plurality of terminal electrodes electrically connected to the internal circuit element,
The component main body has a rectangular parallelepiped shape, extends so as to connect the first and second main surfaces having a rectangular shape facing each other, and the first and second main surfaces, and the first and second main surfaces. The first and second side surfaces facing each other in a direction orthogonal to the opposing direction of the main surface, and the first and second main surfaces are extended so as to connect the first and second main surfaces. And a third side surface and a fourth side surface facing each other in a direction orthogonal to the direction and the opposing direction of the first and second side surfaces,
The plurality of terminal electrodes are disposed at ends of the component main body in the facing direction of the first and second side surfaces,
The film is disposed so as to span at least the first main surface and the third side surface,
The circuit pattern is disposed so as to span at least the first main surface and the third side surface,
The electronic component module according to claim 1, wherein the plurality of terminal electrodes and the circuit pattern are electrically connected. The film is arranged so as to further extend over the second main surface,
The electronic component module according to claim 6, wherein the second main surface constitutes a mounting surface for another component.   The electronic component module according to claim 7, wherein the circuit pattern is disposed so as to extend over the first main surface, the third side surface, and the second main surface.   9. The plurality of terminal electrodes are electrically connected to a portion disposed with respect to the first main surface in the circuit pattern, according to claim 6. Electronic component module. Preparing an electronic component having a component body and an internal circuit element disposed inside the component body;
A film having a circuit pattern formed with a resin having electrical insulation properties,
Adhering the film to the outer surface of the component body,
A method of manufacturing an electronic component module, wherein the circuit pattern and the internal circuit element are electrically connected.

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