JP2009021472A - Semiconductor light emitting device - Google Patents

Abstract

A semiconductor light-emitting device capable of surface mounting with little displacement is provided.
A semiconductor light-emitting device A1 including a semiconductor light-emitting element and a resin package 3 having leads, 1A and 1B, and a lens 3a, wherein a part of the leads 1A and 1B exposed from the resin package 3 is The mounting portions 12A and 12B are elongated, and the mounting portions 12A and 12B are spaced apart from each other in the longitudinal direction and project in one direction in the short direction, and a pair of the projecting portions 12Aa and 12Ba. The projections 12Aa and 12Bb are sandwiched between the projections 12Aa and 12Ba and project to the other in the short direction.
[Selection] Figure 4

Description

  The present invention relates to a semiconductor light emitting device including a semiconductor light emitting element as a light source.

  FIG. 7 shows an example of a conventional semiconductor light emitting device (see, for example, Patent Document 1). The semiconductor light emitting device X shown in the figure includes leads 91A and 91B, an LED chip 92, and a resin package 93, and is configured as a so-called bullet-type LED lamp. An LED chip 92 is mounted on the lead 91A. The LED chip 92 is connected to the lead 91B by a wire. The resin package 93 is made of a material that transmits light from the LED chip 92, and covers the LED chip 92 and each of the leads 91A and 91B. A lens 93 a is formed on the resin package 93. The lens 93a plays a role of directing light from the LED chip 92 toward the optical axis L. Portions of the leads 91A and 91B exposed from the resin package 93 are terminals 91Aa and 91Ba. The semiconductor light emitting device X is mounted by solder S in a state where the terminals 91Aa and 91Ba are inserted through the substrate B. Thus, the semiconductor light emitting device X is used as a so-called top view type light source that emits light in a direction perpendicular to the direction in which the substrate B spreads.

  However, when various electronic components are mounted on a circuit board, surface mounting using, for example, a reflow furnace is widely performed. This method has an advantage that many electronic components can be mounted together. For this reason, unlike the semiconductor light emitting device X, the demand for a semiconductor light emitting device capable of surface mounting is increasing. In addition, when performing surface mounting, it is important to prevent the target electronic component from being unduly displaced with respect to the circuit board.

JP 2003-188418 A

  The present invention has been conceived under the circumstances described above, and an object thereof is to provide a semiconductor light emitting device capable of surface mounting with little positional deviation.

  A semiconductor light-emitting device provided by the present invention includes a semiconductor light-emitting element, a lead conducting to the semiconductor light-emitting element, a lens that covers the semiconductor light-emitting element and a part of the lead and is positioned in front of the semiconductor light-emitting element A part of the lead exposed from the resin package is an elongated mounting portion, and the mounting portion is spaced apart in the longitudinal direction. And a pair of first protrusions protruding in one short direction, and a second protrusion sandwiched between the pair of first protrusions and protruding in the other short direction. It is characterized by having.

  According to such a configuration, when the semiconductor light-emitting device is surface-mounted on, for example, a circuit board using the mounting part, the pair of the first protruding part and the second protruding part between the circuit board and A lot of molten solder stays. As a result, a so-called centering effect by the molten solder acts on the three portions of the mounting portion. Therefore, the position shift of the semiconductor light emitting device can be suppressed.

  In a preferred embodiment of the present invention, the mounting portion extends in one of an optical axis direction of the lens and a direction perpendicular to the optical axis direction, and the lead is in the optical axis direction of the lens. And an additional mounting portion extending in the other of the directions perpendicular to the optical axis direction. According to such a configuration, the semiconductor light emitting device can be used as both a so-called top view type and side view type light source.

  In a preferred embodiment of the present invention, the mounting portion extends in the optical axis direction. According to such a configuration, when the semiconductor light emitting device is used as a side-view type light source that lies on its side, it is suitable for suppressing the positional deviation of the semiconductor light emitting device.

  Other features and advantages of the present invention will become more apparent from the detailed description given below with reference to the accompanying drawings.

  Hereinafter, preferred embodiments of the present invention will be specifically described with reference to the drawings.

  1 to 5 show a first embodiment of a semiconductor light emitting device according to the present invention. The semiconductor light emitting device A1 according to the present embodiment includes leads 1A and 1B, an LED chip 2, and a resin package 3, and is configured as a bullet-type LED lamp.

  The leads 1A and 1B are used for mounting the semiconductor light emitting device A1 on a circuit board and supplying power to the LED chip 2, and are made of, for example, a Cu alloy. The leads 1A and 1B are partially covered with the resin package 3. As shown in FIGS. 1 and 2, a bonding cup 10 is formed on the lead 1A. The bonding cup 10 is a cone-shaped part having a bottom surface, and the LED chip 2 is mounted on the bottom surface.

  Of the leads 1A and 1B, portions exposed from the resin package 3 are mounting portions 11A, 11B, 12A, and 12B, and connecting portions 13A and 13B. For convenience of understanding, the mounting portions 11A and 11B are colored in gray in FIG. 3, and 12A and 12B are colored gray in FIG. The mounting portions 11A and 11B are substantially band-shaped portions extending in the direction x and are parallel to each other. The mounting portions 12A and 12B are substantially band-shaped portions extending in the direction z and are parallel to each other. The connecting portions 13A and 13B are portions that connect the mounting portions 11A and 12A and the mounting portions 11B and 12B, respectively, and have a key shape having portions extending in the direction x and the direction z as shown in FIG. .

  As shown in FIG. 4, the mounting portions 12A and 12B have a pair of protrusions 12Aa and 12Ba and a pair of protrusions 12Ab and 12Bb. The pair of projecting portions 12Aa and 12Ba are spaced apart from each other in the direction z that is the longitudinal direction of the mounting portions 12A and 12B. Further, the pair of protruding portions 12Aa and 12Ba protrudes inward in the direction y which is the short direction of the mounting portions 11A and 12B. The protrusions 12Ab and 12Bb are sandwiched between the pair of protrusions 12Aa and 12Ba in the direction z. Further, the protrusions 12Ab and 12Bb protrude outward in the direction y. In the present embodiment, each of the projecting portions 12Ab and 12Bb is configured by two relatively thin strip-like elements extending in the direction y, and is connected to the connecting portions 13A and 13B.

  The LED chip 2 is a light source of the semiconductor light emitting device A1, and is a semiconductor light emitting element having, for example, an n-type semiconductor layer and a p-type semiconductor layer, and an active layer sandwiched between them. As electrons and holes recombine in the active layer, the LED chip 2 emits light having a wavelength determined by the material. The LED chip 2 is bonded to the bottom surface of the bonding cup 10. The upper surface of the LED chip 2 is electrically connected to the lead 1 </ b> B through the wire 4. Light emitted from the LED chip 2 in the direction x or the direction y travels in the direction z by being reflected by the side surface of the bonding cup 10.

  The resin package 3 covers the LED chip 2 and a part of each of the leads 1A and 1B, and is made of, for example, an epoxy resin or a silicone resin that can transmit light from the LED chip 2. A lens 3 a is formed on the resin package 3. The lens 3a is located in front of the LED chip 2, and its optical axis L extends along the direction z. The lens 3 a is for increasing the directivity of light from the LED chip 2.

  Next, the operation of the semiconductor light emitting device A1 will be described.

  According to the present embodiment, the semiconductor light emitting device A1 can be surface-mounted on the circuit board. When mounting using the mounting portions 11A and 11B, the semiconductor light emitting device A1 is used as a top view type light source that emits light in a direction in which the circuit board faces. On the other hand, when mounting using the mounting parts 12A and 12B, the semiconductor light emitting device A1 is used as a side-view type light source that emits light in the direction in which the circuit board spreads.

  In the case of surface mounting using solder, the centering function is exhibited in which the solder melted in the mounting process tries to draw the solder contacting the solder to the center by surface tension. When mounting using the mounting portions 12A and 12B, a lot of solder stays between the protruding portions 12Aa, 12Ab, 12Ba, and 12Bb and the circuit board. Each portion where a lot of solder stays exhibits the centering effect described above. That is, for example, with respect to the mounting portion 12A, by having a pair of mounting portions 12Aa and mounting portions 12Ab, a centering effect is generated at three locations constituting the triangle. The same applies to the mounting unit 12B. Thereby, the strong centering effect acts on each of mounting part 12A, 12B with sufficient balance. Therefore, it is possible to prevent the semiconductor light emitting device A1 from being displaced with respect to the circuit board.

  In particular, when the mounting portions 12A and 12B are used for mounting, the semiconductor light emitting device A1 is in a lying position. This posture is relatively unstable, in which the lens 3a greatly overhangs from the mounting portions 12A and 12B. In such mounting, applying a strong centering effect to the mounting portions 12A and 12B is suitable for preventing the misalignment of the semiconductor light emitting device A1.

  FIG. 6 shows a second embodiment of the present invention. In this figure, the same or similar elements as those in the above embodiment are given the same reference numerals as those in the above embodiment. The semiconductor light emitting device A2 of the present embodiment is different from the above-described embodiments in the shapes of the mounting portions 12A and 12B. In the present embodiment, the mounting portions 12A and 12B are further provided with a pair of protruding portions 12Aa 'and 12Ba'. Each pair of protrusions 12Aa 'and 12Ba' has a position in the direction z substantially the same as that of the pair of protrusions 12Aa and 12Ba, and protrudes in the opposite direction in the direction y.

  According to such an embodiment, the mounting portions 12A and 12B can be expected to exhibit centering effects at five locations. Thereby, position shift of semiconductor light-emitting device A2 can further be suppressed.

  The semiconductor light emitting device according to the present invention is not limited to the above-described embodiment. The specific configuration of each part of the semiconductor light emitting device according to the present invention can be varied in design in various ways.

  It is good also as a structure which provided the 1st protrusion part and 2nd protrusion part which are said by this invention in mounting part 11A, 11B in embodiment mentioned above. In this case, even when the semiconductor light emitting device according to the present invention is used as a top view type light source, it is possible to suppress the positional deviation of the semiconductor light emitting device.

1 is a front view showing a first embodiment of a semiconductor light emitting device according to the present invention. It is sectional drawing which follows the II-II line | wire of FIG. It is a rear view of the semiconductor light-emitting device shown in FIG. It is a bottom view of the semiconductor light-emitting device shown in FIG. It is a right view of the semiconductor light-emitting device shown in FIG. It is a bottom view which shows 2nd Embodiment of the semiconductor light-emitting device based on this invention. It is sectional drawing which shows an example of the conventional semiconductor light-emitting device.

Explanation of symbols

A1, A2 Semiconductor light emitting device B Substrate L Optical axis S Solder 1A, 1B Lead 2 LED chip (semiconductor light emitting element)
3 Resin Package 3a Lens 4 Wire 10 Bonding Cups 11A, 11B (Additional) Mounting Part 12A, 12B Mounting Part 12Aa, 12Ba (First) Protrusion Part 12Ab, 12Bb (Second) Protrusion Part 13A, 13B Connecting Part

Claims (3)

A semiconductor light emitting device;
A lead conducting to the semiconductor light emitting element;
A resin package that covers the semiconductor light emitting element and a part of the lead and has a lens positioned in front of the semiconductor light emitting element;
A semiconductor light emitting device comprising:
A part of the lead exposed from the resin package is an elongated mounting portion.
The mounting portion is spaced apart in the longitudinal direction and is sandwiched between a pair of first protrusions protruding in one short direction, and the pair of first protrusions, and in the other short direction. A semiconductor light emitting device comprising: a projecting second projecting portion. The mounting portion extends in one of an optical axis direction of the lens and a direction perpendicular to the optical axis direction,
2. The semiconductor light emitting device according to claim 1, wherein the lead further includes an additional mounting portion extending in one of an optical axis direction of the lens and a direction perpendicular to the optical axis direction.   The semiconductor light emitting device according to claim 1, wherein the mounting portion extends in the optical axis direction.