JP2008283128A - Method for mounting components and surface mounting equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of mounting components and a surface mounting equipment capable of efficiently performing a test operation without affecting production of a substrate. <P>SOLUTION: A surface mounting equipment has a mounting head, and drives and controls the mounting head depending on a substrate data to mount components on a substrate. The surface mounting equipment has a mode selector such as an inputting apparatus 36 or the like capable of selecting any one of a production mode in which a substrate is produced and a test mode in which components are mounted as a test, a data storage 33 storing a production information for mounting the components on mounted positions of the substrate and a test information for mounting the components on a specified position selected from the mounted positions, and a calculating processor 31 driving and controlling the mounting head depending on the production information of the substrate data when the production mode is selected or depending on the test information when the test mode is selected. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a surface mounter configured to take out a component from a component supply unit and mount it on the substrate by a mounting head movable relative to the mounted substrate such as a printed circuit board (PWB). The present invention relates to a component mounting method and the like.

  2. Description of the Related Art Conventionally, a surface mounting machine (hereinafter referred to as “mounting machine”) is known in which a chip-like component such as an IC is sucked from a component supply unit and mounted on a substrate by a movable mounting head (for example, a patent) Reference 1). In this type of mounting machine, board data including a mounting position (coordinates) on the board is stored in advance, and the mounting head is driven and controlled according to the board data so that the component is mounted on the board. It is configured.

The board data is generally created by editing the design data (CAD data) of the board to be mounted. Usually, the components are actually mounted based on the created board data before the first production. The substrate data is evaluated (referred to as “trial hit”), and the data is corrected as necessary.
JP 05-267896 A

  When performing trial placement, it is not always necessary to mount all the components at the mounting location, and it is sufficient to mount the components only at some coordinates (mounting locations) that are important for accuracy confirmation.

  For this reason, usually, the board data (master data) created based on the CAD data is temporarily edited for trial placement, and after performing trial placement work, the original data is re-edited to shift to the production of the board. Things have been done.

  However, since the master data is used, if an editing mistake occurs, a mounting failure may occur during production. Therefore, accurate and careful editing work is required. In addition, when trial placement is performed according to a plurality of different conditions, it is necessary to edit the substrate data repeatedly and then re-edit the original data before production, which is inefficient for trial placement including data editing. It is complicated. Therefore, there is still room for improvement in this respect.

  The present invention has been made in view of the above-described circumstances, and an object of the present invention is to enable a trial-striking operation to be performed efficiently without affecting the production of a substrate.

  In order to solve the above-described problems, a component mounting method according to the present invention is a method for mounting a component on a substrate using a movable mounting head that is driven and controlled according to substrate data including information on a mounting location on the substrate. And a board production process for mounting the component at the mounted location, and a trial placement process for trial mounting the component at a predetermined location selected from the mounted locations based on the trial placement conditions. In the component mounting method, the board data includes production information for specifying the mounted part and trial placement information for specifying the predetermined part in advance, and the board production process includes the board. The component is mounted on the board with reference to the production information in the data, and the component is mounted on the board with reference to the trial driving information in the trial hitting process. .

  As described above, according to the method of including production information and trial placement information in advance in the board data and mounting the parts according to the information corresponding to each process, it is necessary to edit the board data during the trial placement work. Disappears.

  In this method, a plurality of types of information based on different trial hitting conditions are included in the substrate data in advance as the trial hitting information, and the trial hitting step is selected from the plurality of types of information. Alternatively, a component may be mounted on the substrate with reference to a plurality of types of information (claim 2).

  According to this method, it is not necessary to re-edit the board data each time even when trial placement is performed by changing the conditions.

  On the other hand, the surface mounting machine of the present invention has a movable mounting head, and this mounting head is driven and controlled according to the board data including information on the mounting location on the board, so that the component supply unit can In a surface mounter configured to take out components and mount them on the board, any mode can be selected from the production mode for producing the component mounting board and the trial driving mode for trial mounting the part on the board. A mode selection means for storing, and a storage means for storing the substrate data including production information for specifying the mounted location and trial placement information for specifying a target location for trial placement among the mounted locations; When the production mode is selected, the mounting head is driven and controlled with reference to the production information, while the trial placement mode is selected when the trial placement mode is selected. In which it comprises a control means for driving and controlling the mounting head with reference to the distribution, a (claim 3).

  According to this configuration, the mounting head is driven and controlled by the control means based on the board data stored in the storage means, so that the component is mounted on the board. At that time, when the production mode is selected by the mode selection means, the mounting head is driven and controlled in accordance with the production information included in the board data. On the other hand, when the trial driving mode is selected, the board is The mounting head is driven and controlled according to the trial placement information included in the data. Therefore, it is possible to perform the work without editing the substrate data at the time of trial driving work. That is, components can be mounted based on the method of claim 1.

  In this surface mounter, the mode setting means can select a plurality of modes having different trial hit conditions as the trial hit mode, and the storage means can select the plurality of modes as the trial hit information. It is preferable to store the substrate data including information corresponding to each of the above (claim 4).

  According to this configuration, it is possible to select a specific mode from a plurality of types of trial hit modes and perform trial hits.

  In this case, various modes are conceivable as the trial hitting mode, but it is preferable that at least one of them specifies the type of the mounted component (claim 5).

  According to this configuration, it is possible to select only a specific product type from among the mounted parts and perform trial placement.

  Further, in the case where a component is mounted on a multi-sided board including a plurality of areas each having the same circuit as the board, the trial placement information is information for specifying an area to be trial placement among the plurality of areas. (Claim 6).

  According to this configuration, trial placement is performed only in an area specified by trial placement information among a plurality of areas.

  In the above configuration, the board data includes information that can identify mounted parts corresponding to the mounted positions as the trial placement information, and the storage means is separate from the board data. Storing component data that is information related to the mounted component and includes information on necessity of trial placement, and the control means performs trial placement based on the board data and the component data when the trial placement mode is selected. A necessary mounting location and component may be specified, and the mounting head may be driven and controlled to mount the component (Claim 7).

  According to this configuration, when the trial placement mode is selected, the part targeted for trial placement is identified based on the board data (trial placement information) and the part data, but only the part targeted for trial placement is the board. Implemented above.

  According to the component mounting method and the surface mounting machine according to the present invention, it is not necessary to edit the board data one by one at the time of trial hitting. Thus, like the conventional method (apparatus) for editing the board data at the time of trial hitting, A trouble that production is performed based on the substrate data in which an editing error has occurred can be avoided in advance, and the trial placement work can be performed efficiently as the editing of the substrate data becomes unnecessary. Accordingly, it is possible to efficiently perform the trial driving work without affecting the production of the substrate.

  A preferred embodiment of the present invention will be described with reference to the drawings.

  1 and 2 schematically show a surface mounter according to the present invention (a surface mounter in which the component mounting method according to the present invention is used), FIG. 1 is a perspective view, and FIG. 2 is a front view. Each shows a surface mounter.

  In these drawings, a substrate transporting conveyor 2 is disposed on a base 1 of a surface mounting machine (hereinafter abbreviated as “mounting machine”), and a printed circuit board P (hereinafter “ Substrate P ”) is transported and stopped at a predetermined mounting operation position, and is positioned by a positioning mechanism (not shown). In the following description, the direction of the conveyor 2 is assumed to be the X-axis direction, the direction orthogonal to this on the horizontal plane is assumed to be the Y-axis direction, and the direction perpendicular to the X-axis and Y-axis is assumed to be the Z-axis direction.

  On both sides of the conveyor 2, component supply units 4 and 5 for supplying mounted components are provided. Of these component supply units 4 and 5, a plurality of tape feeders 4 a are arranged in the X-axis direction in the component supply unit 4 located on the front side of the apparatus. In each tape feeder 4a, a tape holding and holding small chip components such as an IC, a transistor, and a capacitor is wound around and mounted on a reel. The tape is picked up by the head unit 6 described later while intermittently feeding the tape from the reel to the component take-out portion at the tip of the feeder.

  On the other hand, a tray feeder 5a is disposed in the component supply unit 5 located on the rear side of the apparatus. In the tray feeder 5a, a plurality of trays T that accommodate packaged electronic components such as QFP and BGA, or large components such as mounted connectors are accommodated in a plurality of stages. Then, the components stored in the tray T are picked up by the head unit 6 while the tray T is pulled out to the side of the conveyor 2.

  Above the base 1, a component mounting head unit 6 is further provided.

  The head unit 6 is movable in the X-axis direction and the Y-axis direction within a certain region so that the components can be sucked from the component supply units 4 and 5 and mounted on the substrate P. That is, the support member 11 of the head unit 6 is movably disposed on the rail 7 in the Y-axis direction on the base 1, and the head unit 6 is mounted on the support member 11 and the guide member 14 in the X-axis direction. It is supported so that it can move along. A support member 11 is screwed and attached to a ball screw 8 driven by a Y-axis servo motor 9, whereby the support member 11 is moved in the Y-axis direction, while a ball driven by an X-axis servo motor 15. The head unit 6 is attached to the screw 13 so that the head unit 6 is moved in the X-axis direction.

  The head unit 6 is mounted with a plurality of mounting heads 20 for picking up components and mounting them on the substrate P. In this embodiment, six heads for mounting 20 are arranged in the X-axis direction. It is mounted in a line in a row.

  Although not shown, these mounting heads 20 are connected to an elevating mechanism using a Z-axis servomotor as a drive source and connected to a rotating mechanism using an R-axis servomotor as a drive source. The mechanism is driven in the vertical direction (Z-axis direction) and around the central axis (R-axis direction) with respect to the head unit 6.

  In addition, a component suction nozzle 21 is attached to the tip of each mounting head 20. Each nozzle 21 is connected to a negative pressure supply means via a valve or the like not shown in the drawing, and when taking out the parts from each of the feeders 4a and 5a, the negative pressure is supplied to the tip of the nozzle 21 to thereby remove the parts. Adsorption is performed.

  On the other hand, on the base 1, a component recognition camera 17 for recognizing components sucked by each mounting head 20 of the head unit 6 is provided. The component recognition camera 17 includes a camera body having a CCD linear sensor and the like, and an illumination device, and picks up the suction component by each mounting head 21 from below.

  FIG. 3 is a block diagram showing the configuration of the controller that controls the mounting machine.

  The controller 30 includes a CPU that executes logical operations, a ROM that stores various programs that control the CPU, a RAM that temporarily stores various data during operation, an HDD, and the like. The configuration includes arithmetic processing means 31, mounting program storage means 32, data storage means 33, motor control means 34, and the like. The controller 30 is connected to a display device 35 such as an LCD or CRT and an input device 36 such as a keyboard or a mouse. For the sake of convenience of explanation, only the functional configuration particularly related to the present invention is shown in FIG.

  The arithmetic processing unit 31 performs a series of mounting operations according to the mounting program stored in the mounting program storage unit 32, i.e., a series of operations from loading to unloading of the substrate P into the mounting machine. In addition to comprehensively controlling the drive, it performs various operations associated with the work. For example, in this mounting machine, either the “production mode” or the “trial driving mode” can be selected by operating the input device 36, and the arithmetic processing unit 31 is based on the selected operation mode and is described later. The head unit 6 and the like are driven and controlled so as to proceed with the mounting operation according to the data. Here, the “production mode” is a mode for actually producing a component mounting board by mounting components on the board S, and the “trial driving mode” is a mounting program or board data described later before the start of production. In order to evaluate the above, a mode in which components are mounted on some of the mounting locations of the substrate S on a trial basis. The mode is selected by the operator operating the input device 36 in accordance with a mode selection screen displayed on the display device 35 based on the mounting program. That is, in this embodiment, the display device 35, the input device 36, and the like correspond to the mode selection unit according to the present invention.

  The mounting program storage means 32 stores a mounting program related to a series of mounting operations as described above.

  The data storage means 33 stores various data necessary for the mounting work. For example, the component data such as the type and shape of the mounted component, the mounting location (coordinates) of the board P, the type of component at each mounting location, etc. It stores various data such as substrate data.

  FIG. 5 shows an example of the substrate data stored in the data storage means 33. As shown in the figure, the board data includes a number (referred to as “mounting No”) for specifying a mounting location of the board S, coordinate (X, Y, R) information of each mounting No, and components of each mounting No. Information (not shown) regarding the product type, mounting necessity information specifying whether or not to mount a component on each mounting number, and the like are included. The mounting necessity information includes “for production” and “for trial placement” as shown in FIG. Here, “for production” is information used when the “production mode” is selected (hereinafter referred to as “production information”), while “for trial placement” is the above “trial placement”. This is information used when “mode” is selected (hereinafter referred to as “trial placement information”). It should be noted that the mounting necessity information can be input by the operator operating the input device 36 according to the input screen displayed on the display device 35 based on the mounting program, as in the mode selection described above.

  The motor control means 34 drives and controls the servo motors 9 and 15 for the X axis and the Y axis so as to move the head unit 6 two-dimensionally on the XY coordinate plane. The R-axis and Z-axis servomotors are driven and controlled so as to operate the head 20. Although not shown, each of the motors 9 and 15 has a rotational position detection means such as an encoder, and the motor control means 34 determines each motor based on the detection information from the rotational position detection means. Control.

  Next, an example of mounting operation control by the controller 30 will be described with reference to the flowchart of FIG.

  When this flowchart is started, the arithmetic processing unit 31 switches the mounting program to the program for the corresponding substrate S and reads various data such as the substrate data necessary for the mounting work as preparation for mounting (steps S1 and S3).

  When the mounting preparation is completed, the arithmetic processing means 31 determines whether or not there has been an operation mode selection input (step S5), and when it is determined NO, it controls the head unit 6 and the like to a standby state. On the other hand, if YES is determined in the step S5, the arithmetic processing unit 31 further determines whether or not the selected operation mode is the “trial driving mode” (step S7). If YES is determined here, the arithmetic processing unit 31 refers to the trial placement information in the information included in the board data, and sends a control signal to the motor control unit 34 to mount the component according to the information. Is output. As a result, the component is mounted only at the mounting No. coordinate position specified in the “trial placement information” (step S9). In the example of FIG. 5, components are mounted only at the coordinate positions (mounting numbers “1”, “4”...) Corresponding to “Yes” in the “trial placement information” of the board data.

  On the other hand, if NO is determined in step S7, the arithmetic processing unit 31 outputs a control signal to the motor control unit 34 so as to mount the component in accordance with the production information among the information included in the board data. To do. Thereby, the component is mounted at the coordinate position of the mounting number specified in the “production information” (step S15). In the example of FIG. 5, components are mounted only at the coordinate positions (mounting numbers “1”, “2”, “3”, “4”...) Corresponding to “Yes” in the “production information” of the board data. . In production, parts are usually mounted at all mounting locations.

  When it is determined that the mounting of the component on the board S is completed (YES in step S11), the arithmetic processing unit 31 outputs a control signal to the motor control unit 34 to stop the mounting operation (step S13). This completes a series of mounting operations.

  As described above, the mounting machine of the above embodiment includes, as board data, the production information that specifies the place to be mounted at the time of production among the mounted positions (coordinates) of the board P, and the place to be mounted at the time of trial hitting. Substrate data including the specified trial placement information is stored in advance, and if “production mode” is selected according to the selected operation mode, refer to “production information” for the part. When “trial driving mode” is selected, it is configured to mount parts with reference to “trial driving information”. It is possible to perform trial placement of parts, and after trial placement, it is possible to promptly switch to production of the substrate S. Accordingly, it is not necessary to edit the substrate data (master data) once for trial hitting and re-edit the data at the time of production as in the prior art. It is possible to avoid the occurrence of troubles such as production of defective substrates by using the substrate data in which an editing error has occurred as it is for production. Further, there is an advantage that the trial placement work can be performed efficiently because the work of editing the substrate data is unnecessary.

  Moreover, in this mounting machine, “production information” and “trial placement information” are included in the data as one of the board data information, and the information to be referred to is changed according to the operation mode. Basically, all the operation modes are configured to use common substrate data (that is, master data). Therefore, there is an advantage that an increase in data amount can be suppressed. That is, data including mounting coordinate (X, Y, R) information and component information is individually stored as production board data and trial board data, and board data corresponding to the operation mode is used. However, in this case, since both pieces of data have overlapping information on the mounting coordinate (X, Y, R) information and the component information, an increase in the data amount is promoted. In this regard, according to the above-described embodiment, there is no duplication of information regarding the mounting coordinate (X, Y, R) information and the like, and it is possible to effectively suppress an increase in the data amount.

  The mounting machine described above is an example of a preferred embodiment of a surface mounting machine according to the present invention (a surface mounting machine in which the component mounting method according to the present invention is used), and its specific configuration (component mounting). The method can be appropriately changed without departing from the scope of the present invention. For example, the following configuration (method) can also be employed.

  (1) As in the embodiment, in addition to specifying the mounting location and performing trial placement, a configuration in which the type of component is specified and trial placement is performed may be employed. In this case, instead of the board data including the trial hit information as shown in FIG. 5 in which the necessity of trial hit is determined for each mounting coordinate (X, Y, R), for example, as shown in FIG. The board data including information (component No.) for specifying the mounted component is applied, and information on the component specified by the component No, that is, whether or not trial placement is necessary is registered in the component data (FIG. 7 (a) to (c)). When the “production mode” is selected, the arithmetic processing unit 31 mounts all the components on the board S according to the “mounting No” of the board data, while the “trial driving mode” is selected. In this configuration, the arithmetic processing unit 31 is configured to sequentially determine whether or not trial placement of the part is necessary while referring to the part data specified by the part No, and to perform trial placement only on the part to be trial-placed. According to such a configuration, trial placement can be performed based on the type of component.

  (2) It is good also as a structure which can select the some mode from which trial hit conditions differ as "trial hit mode."

  For example, as the “trial hitting mode”, a plurality of modes having different trial hitting (mounting) locations may be selectable. Specifically, as shown in FIG. 8, substrate data provided with a plurality of pieces of trial placement information (three pieces of information in the illustrated example) respectively corresponding to the above modes is applied in the mounting necessity information. When any one of the “trial hit modes” is selected, the trial hit may be executed based on the trial hit information corresponding to the mode.

  In addition, as a plurality of modes having different trial hitting conditions, a mode for specifying a part type may be provided. In this case, for example, as shown in FIG. 9, the board data provided with trial placement information corresponding to the type of each component is applied in the mounting necessity information, and when any type is selected, What is necessary is just to comprise so that trial strike may be performed based on the information for trial strike corresponding to the said kind. In this case, in the substrate data of FIG. 9, three types of information are individually provided as trial placement information, but of course, one trial placement information is provided with a plurality of types as one group. Also good. That is, by selecting the group, a plurality of types of parts belonging to the group may be trial-struck.

  The configuration using the board data in FIG. 9 is useful when it is required to arbitrarily select the type of parts to be trial-tested as required. On the other hand, the board data in FIG. The configuration to be used is useful when the type of part to be trial-tested among the mounted parts is determined in advance.

  (3) In the embodiment, the “production information” and “trial placement information” have a board data structure that specifies whether or not mounting is required for each mounting location. However, as shown in FIG. 10, in the case of a so-called multi-sided substrate P including a plurality of areas E1 to E12 in which the same circuit is formed, as “trial placement information”, as shown in FIG. Information specifying whether or not mounting is required for each of the areas E1 to E12 may be included in the board data, and in the trial placement mode, components may be mounted (trial placement) only in a specific area. At this time, if it is desired to mount a component only at a specific mounting location in a specific area, the board data including mounting necessity information for each block as shown in FIG. 11 and the mounting as shown in FIG. In combination with the board data including the mounting necessity information for each location, and in the trial placement mode, the arithmetic processing means 31 is configured to mount the components while referring to the trial placement information of both the board data. Good. Note that the coordinate (X, Y) information included in the board data shown in FIG. 11 indicates the origin positions of the areas E1 to E12, and does not indicate the mounting positions of the components.

1 is a perspective view showing a surface mounter according to the present invention (a surface mounter to which a component mounting method according to the present invention is applied). It is a front view of the surface mounter showing the configuration around the head unit. It is a block diagram which shows the structure of the controller of a surface mounter. It is a flowchart which shows an example of mounting operation control by a controller. It is a figure explaining an example of substrate data. It is a figure explaining the other example of board | substrate data. (A)-(c) is a figure explaining the example of component data. It is a figure explaining the other example of board | substrate data. It is a figure explaining the other example of board | substrate data. It is a top view which shows an example of a multi-sided board | substrate. It is a figure explaining an example of the board | substrate data when making a multi-sided board | substrate into a to-be-mounted board | substrate.

Explanation of symbols

4,5 Component supply unit 6 Head unit 20 Mounting head 30 Controller 31 Arithmetic processing means 32 Mounting program storage means 33 Data storage means 34 Motor control means 35 Display device 36 Input device P Substrate

Claims (7)

A method of mounting a component on a substrate using a movable mounting head that is driven and controlled in accordance with substrate data including information on the mounting location on the substrate, and mounting the component on the mounting location In a component mounting method including a process and a trial placement step of trially mounting a component at a predetermined location selected from the mounted locations based on trial placement conditions,
The board data includes production information for specifying the mounting location and trial placement information for specifying the predetermined location in advance, and the production of the board data is performed in the board production process. A component mounting method characterized in that a component is mounted on a substrate by referring to the information for use, and the component is mounted on the substrate by referring to the test placement information in the trial hitting step. In the component mounting method according to claim 1,
As the trial placement information, a plurality of types of information based on different trial placement conditions are included in the substrate data in advance, and in the trial placement step, one to a plurality of types of information selected from the plurality of types of information. A component mounting method comprising mounting a component on a substrate with reference to FIG. It has a movable mounting head, and this mounting head is driven and controlled according to the board data including information on the mounting location on the board, so that the part is taken out from the part supply unit and mounted on the board. In the surface mount machine configured in
A mode selection means for selecting an arbitrary mode among a production mode for producing a component mounting board and a trial driving mode for mounting a component on a board on a trial basis;
Storage means for storing the board data including production information for identifying the mounted location and trial placement information for identifying a target location for trial placement among the mounted locations;
When the production mode is selected, the mounting head is driven and controlled with reference to the production information, while the mounting head is referred to with the trial placement information when the trial placement mode is selected. And a control means for controlling the driving of the surface mounting machine. In the surface mounting machine according to claim 3,
The mode setting means is capable of selecting a plurality of modes having different trial hit conditions as the trial hit mode, and the storage means stores information corresponding to the plurality of modes as the trial hit information, respectively. A surface mounter for storing the board data. In the surface mounting machine according to claim 4,
At least one of the plurality of modes is for specifying the type of component to be mounted. In the surface mounting machine according to claim 3,
The component is mounted on a multi-sided board including a plurality of areas each having the same circuit as the board, and the trial placement information is information for specifying an area to be trial placement among the plurality of areas. A surface mounting machine characterized by being. In the surface mounting machine according to claim 3,
The board data includes information that can identify mounted components corresponding to mounted positions as the trial placement information,
In addition to the board data, the storage means stores component data that is information on a mounted component and includes information on necessity of trial placement,
When the trial hitting mode is selected, the control means identifies a mounting location and a part that require trial hitting based on the board data and component data, and drives the mounting head to mount the part. A surface mounter characterized by controlling.

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