JP2008277764A - Substrate processing apparatus and semiconductor device manufacturing method - Google Patents

Abstract

A load port for carrying in and out a storage container inside and outside a housing enables a cover body to be attached to and removed from the load port, thereby simplifying the structure.
A substrate processing apparatus includes a storage container 2 in which a plurality of substrates are stored and a substrate loading / unloading port is closed by a lid, a load port on which the storage container is placed, and a lid for the substrate loading / unloading port at the load port. The first mounting unit is provided separately from the mounting / demounting device for mounting / demounting the body, the first mounting unit 18A for mounting the storage container at the load port and performing the perspective operation in the opposite direction to the mounting / demounting device. And a second placement unit 18B that places the storage container at the load port and moves up and down with respect to the attachment / detachment device.
[Selection] Figure 16

Description

The present invention relates to a substrate processing apparatus and a semiconductor device manufacturing method.
For example, a batch type vertical diffusion type in which a CVD film such as an insulating film or a metal film is formed on a semiconductor wafer (hereinafter referred to as a wafer) as a substrate on which a semiconductor integrated circuit including a semiconductor element is built, or impurities are diffused. The present invention relates to what is effective when used in a CVD apparatus.

In a batch type vertical diffusion / CVD apparatus (hereinafter referred to as a batch type CVD apparatus) which is an example of a substrate processing apparatus, a plurality of wafers are handled in a state of being stored in a storage container.
Conventional storage containers include an open cassette and a FOUP (front opening unified pod).
The open cassette is formed in a substantially cubic box shape, and a pair of opposed surfaces are opened.
The pod is formed in a substantially cubic box shape, and one surface is opened, and a door (lid) is detachably attached to the opening surface.
When a pod is used as a wafer storage container, the wafer is transported in a sealed state. For this reason, even if particles or the like are present in the surrounding atmosphere, the cleanliness of the wafer can be maintained. Therefore, since it is not necessary to set the cleanliness in the clean room where the batch type CVD apparatus is installed, the cost required for the clean room can be reduced.
Therefore, in a recent batch type CVD apparatus, a pod is adopted as a storage container.

A batch type CVD apparatus using a pod includes a pod opening / closing device (hereinafter referred to as a pod opener) and a mapping device in a load port where a wafer is carried into and out of the pod (referred to as a pod opener hereinafter). For example, see Patent Document 1).
A pod opener is an apparatus that closes or opens a pod wafer loading / unloading port by attaching a door to or removing a door from the wafer loading / unloading port.
The mapping device is a device that detects the wafer in the pod and detects whether or not the wafer is held in each of the wafer holding grooves (slots) in the pod.
Japanese Patent Laid-Open No. 2003-7801

In a conventional batch type CVD apparatus, a pod door is attached to and detached from a load port for carrying a pod into or out of the case from the outside of the apparatus (outside the case). I can't.
In order to attach or remove the pod door at the load port, a configuration in which a pod opener that can be retracted at the load port is provided can be considered. That is, when a pod is carried into the case from outside the case, or when a pod is taken out from the case outside the case, the pod opener is retracted from the load port so that the pod is carried in or out. Secure a passage.
However, in this configuration, since the pod opener is retracted from the load port, there is a problem that the batch type CVD apparatus becomes complicated.

  An object of the present invention is to provide a substrate processing apparatus capable of mounting and removing a lid of a storage container in a load port for carrying in and out of the storage container inside and outside the housing, and simplifying the structure. An object of the present invention is to provide a method for manufacturing a semiconductor device.

Typical means for solving the above-described problems are as follows.
A storage container in which a plurality of substrates are stored and a substrate outlet is closed by a lid;
A load port for carrying in and out of the storage container between the inside and outside of the housing;
An attachment / detachment device for attaching / detaching the lid to / from the substrate loading / unloading port at the load port;
A first placement unit that places the storage container at the load port and performs a perspective operation in a direction opposite to the attachment / detachment device;
A second mounting unit that is provided separately from the first mounting unit, mounts the storage container at the load port, and moves up and down relative to the detachable device;
A substrate processing apparatus comprising:

  According to the above-described means, the lid of the storage container can be attached to or removed from the load port that carries the storage container in and out of the housing, and the structure can be simplified.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

In the present embodiment, the substrate processing apparatus according to the present invention is configured as a batch type CVD apparatus, that is, a batch type vertical diffusion / CVD apparatus, as shown in FIGS.
In the following description, the operation of each part constituting the batch type vertical diffusion / CVD apparatus is controlled by the controller 77.

In this embodiment, a pod 2 is used as a carrier (storage container) that stores a wafer 1 as a substrate to be processed.
As shown in FIGS. 3 and 8, the pod 2 is formed in a substantially cubic box shape, and a wafer loading / unloading port 3 is opened on one side wall of the cube. The wafer loading / unloading port 3 is mounted so that a door 4 as a lid for closing it can be mounted and removed.

As shown in FIG. 8B, three positioning holes 5, 5, and 5 are arranged on the lower surface of the pod 2 in a rotationally symmetrical manner with a phase difference of 120 degrees. That is, the first positioning hole 5 is arranged on the center line extending in the front-rear direction on the lower surface of the pod 2, and the second positioning hole 5 and the third positioning hole 5 are located in front of the first positioning hole 5. Are arranged symmetrically with respect to the center line.
The three positioning holes 5, 5, 5 are each formed in a V-groove shape that is rectangular in plan view, and are all disposed so that the groove bottom of the V-groove faces the center of rotational symmetry.
These three positioning holes 5, 5 and 5 are defined in SEMI E57-0600. Primary pins (PRIMARYPIN, pins supporting the bottom peripheral edge of the pod) and secondary pins (specified in SEMI E57-0600) It is arranged so as to correspond to SECONDARYPIN, a pin that supports the bottom center side of the pod.

As shown in FIGS. 1, 2, and 3, the batch type CVD apparatus 10 according to the present embodiment includes a main housing 11.
The front wall 11 a of the main housing 11 constitutes a partition wall that partitions the inside and outside of the main housing 11. At an intermediate height of the front wall 11a, a pod loading / unloading port (hereinafter referred to as a pod loading / unloading port) 12 that connects the inside and the outside of the main housing 11 is provided. The pod carry-in port 12 carries in the pod 2 or carries out the pod 2. The front shutter 13 closes and opens the pod carry-in port 12.
The front port (partition wall) 11a of the main housing 11 is provided with a load port 14 on the outside. The load port 14 is located substantially directly below the pod carry-in port 12. The load port 14 constitutes a loading / unloading unit. The load port 14 aligns the placed pod 2 with the pod carry-in port 12. Two load ports 14 are provided in parallel.
The pod 2 is loaded onto the load port 14 by an in-process transfer apparatus (also referred to as an inter-process transfer apparatus) outside the batch type CVD apparatus (outside the casing), and is also unloaded from the load port 14.
As the in-process transfer device, there are a floor traveling type indoor transportation vehicle (hereinafter referred to as AGV) 9 and an overhead traveling type indoor transportation device (OHT) shown in FIG. 1, and any of them can be applied. it can.

A box 14A as a front housing is provided on the front side of the front wall 11a. The box 14A is formed so as to surround the load port 14 and the upper space. A ceiling opening 14 </ b> B is opened in the ceiling wall of the box 14 </ b> A, and a front opening 14 </ b> C is opened in the front wall of the box 14. In other words, the load port 14 can receive the pod 2 via the front opening 14C and can also receive the pod 2 via the ceiling opening 14B.
The box 14A and the main casing 11 constitute a casing of a batch type CVD apparatus.
As shown in FIG. 1, a controller 77 described later is installed in the box 14A.

A pod elevator 15 is installed in the load port 14, and the pod elevator 15 moves the pod 2 up and down between the height of the load port 14 and the height of the pod carry-in port 12. In other words, the pod elevator 15 constitutes a storage container placing part lifting mechanism part.
The pod elevator 15 includes an elevating drive device 16, a shaft 17 that is moved up and down by the elevating drive device 16, a holding base (storage container mounting portion) 18 that is horizontally installed on the upper end of the shaft 17, and an upper surface of the holding base 18. And a plurality of receiving kinematic pins 19 projecting from each other. The receiving kinematic pin 19 constitutes a container positioning means (also referred to as a positioning portion). The receiving kinematic pin 19 corresponds to a primary pin (PRIMARY PIN) defined in SEMI E57-0600. With the receiving kinematic pin 19 fitted in the positioning hole 5 of the pod 2, the holding base 18 supports the pod 2 from below. The raising / lowering driving device 16 moves the holding table 18 up and down by the shaft 17.
The holding base 18 constitutes a holding portion that holds the lower surface of the pod 2 and also constitutes a storage container placement portion.

The sealed casing 21 is installed at a height corresponding to the load port 14 below the pod carry-in port 12 inside the front wall 11a that is a partition wall that partitions the inside and outside of the main casing 11. The sealed casing 21 forms a load lock chamber 20. The load lock chamber 20 constitutes a storage container lid opening / closing chamber that can be filled and maintained with an inert gas such as nitrogen gas. The load lock chamber 20 is also referred to as an open / close chamber.
As shown in FIG. 2, an inert gas (nitrogen gas) supply device 132 and an exhaust device 133 are connected to the sealed casing 21. The inside of the load lock chamber 20 is supplied with an inert gas (nitrogen gas) by an inert gas (nitrogen gas) supply device 132 and is exhausted by an exhaust device 133.

The door access opening 22 is opened at a portion of the front wall 11a of the main housing 11 that faces the upper portion of the load lock chamber 20. The door loading / unloading port 22 is formed in a size corresponding to the wafer loading / unloading port 3 of the pod 2 placed on the load port 14 (larger than the wafer loading / unloading port 3).
A pod opener 23 as a storage container lid opening / closing part (also referred to as a detachable device) is installed in the load lock chamber 20. The pod opener 23 opens or closes the wafer loading / unloading port 3 and the door loading / unloading port 22 by removing the door 4 from the pod 2 placed on the load port 14 or attaching the door 4 to the pod 2.
The pod opener 23 includes a moving table 25 and a closure 26 held on the moving table 25. The moving table 25 moves back and forth (vertical direction) and up and down (parallel direction) with respect to the door slot 22. The closure 26 constitutes a lid holding part that holds the door 4. The pod opener 23 holds the door 4 by the closure 26 and moves back and forth to open and close the wafer loading / unloading port 3 and the door loading / unloading port 22 of the pod 2.

The mapping device 27 is installed at a portion of the sealed casing 21 that faces the door entrance 22. The mapping device 27 constitutes a substrate state detection unit.
The mapping device 27 includes a linear actuator 28 serving as a driving source, a holder 29, and a plurality of detectors 30. The linear actuator 28 moves the holder 29 back and forth with respect to the wafer loading / unloading port 3 of the pod 2. The holder 29 holds the detector 30. The mapping device 27 detects whether or not the wafer 1 is held in each of the slots in the pod 2 by detecting the wafer 1 in the pod 2 with the detector 30.

A pod storage chamber 11 b is formed in the front region in the main housing 11. A storage room is provided adjacent to the load port. The rotary pod shelf 31 as a storage shelf for storing the storage container in the housing is installed at the upper part of the central portion in the front-rear direction of the pod storage chamber 11b. The rotary pod shelf 31 stores a plurality of pods 2.
The rotary pod shelf 31 includes a support column 32 and a plurality of shelf boards 33. The support column 32 is erected vertically and rotates intermittently in a horizontal plane. The plurality of shelf boards 33 are radially supported by the support column 32 at the upper, middle, and lower positions. The plurality of shelf boards 33 hold the pod 2 in a state where a plurality of the pods 2 are placed.
A plurality of shelf plate kinematic pins 34 project from the top surface of the shelf plate 33, and the shelf plate kinematic pins 34 fit into the positioning holes 5 of the pod 2. That is, the shelf board kinematic pin 34 constitutes positioning means (also referred to as a positioning portion). The shelf board kinematic pin 34 corresponds to a primary pin (PRIMARY PIN) defined in SEMI E57-0600.

In the pod storage chamber 11b of the main housing 11, a pod transfer device 35 as a storage container transfer unit is installed. The pod transfer device 35 transfers the pod 2 between the load port 14 and the rotary pod shelf 31 via the pod transfer port 12. In other words, the pod transfer device 35 transfers the pod between the storage chamber and the load port.
The pod transfer device 35 includes a pod transfer elevator 35a as a storage container lifting mechanism and a pod transfer mechanism 35b as a storage container transfer mechanism.
The pod transfer device 35 moves the pod 2 between the holding table 18, the rotary pod rack 31, and the mounting table 43 of the pod opener 42 described in detail later by continuous operation of the pod transfer elevator 35 a and the pod transfer mechanism 35 b. Transport.

As shown in FIG. 2, a sub-housing 40 is constructed up to the rear end at a substantially central lower portion in the front-rear direction in the main housing 11.
A pair of wafer loading / unloading ports 41 are arranged on the front wall 40a of the sub-casing 40 so as to be arranged in two vertical stages. A wafer loading / unloading port (hereinafter referred to as a wafer loading / unloading port) 41 is an opening through which the wafer 1 is loaded from the pod 2 into the sub casing 40 or unloaded from the sub casing 40 to the pod 2. A pair of pod openers 42 serving as storage container lid opening / closing portions are installed at the upper and lower wafer carry-in ports 41, 41, respectively.
The pod opener 42 includes a mounting table 43 on which the pod 2 is mounted, and an attaching / detaching mechanism 44 that attaches / detaches the door 4 of the pod 2. The pod opener 42 opens and closes the wafer loading / unloading port 3 of the pod 2 by attaching / detaching the door 4 of the pod 2 mounted on the mounting table 43 by the attaching / detaching mechanism 44.

The sub housing 40 constitutes a spare chamber 45. The spare chamber 45 is fluidly isolated from the storage chamber 11b in which the pod transfer device 35 and the rotary pod shelf 31 are installed.
A wafer transfer mechanism 46 is installed in the front area of the preliminary chamber 45. The wafer transfer mechanism 46 includes a wafer transfer device 46a, a wafer transfer device elevator 46b, and a tweezer 46c. The wafer transfer device elevator 46 b is installed at the right end of the front region in the preliminary chamber 45. The wafer transfer device elevator 46b moves the wafer transfer device 46a up and down. The wafer transfer device 46a rotates or linearly moves the tweezer 46c in a horizontal plane. The tweezer 46 c holds the wafer 1.
The wafer transfer mechanism 46 conveys the wafer 1 held by the tweezer 46c from the pod 2 to the boat (substrate holder) 47 by continuous operation of the wafer transfer device elevator 46b and the wafer transfer device 46a, and loads (charging) the wafer 1 ) Further, the wafer transfer mechanism 46 holds the wafer 1 of the boat 47 with the tweezer 46c, and removes (discharges) the boat 47 from the boat 47 by the continuous operation of the wafer transfer device elevator 46b and the wafer transfer device 46a. To the pod 2 for storage.
The controller 77 includes all the load-type CVD devices such as the load port 14, the pod elevator 15, the pod opener 23, the mapping device 27, the rotary pod shelf 31, the pod transfer device 35, the pod opener 42, and the wafer transfer mechanism 46. Control the behavior.

A boat elevator 48 for raising and lowering the boat 47 is installed in the rear area of the preliminary chamber 45.
An arm 49 serving as a connecting tool is connected to a lifting platform of the boat elevator 48. A seal cap 50 is horizontally installed on the arm 49. The seal cap 50 supports the boat 47 vertically and closes the lower end portion of the processing furnace 51 described later.
The boat 47 as a substrate holder includes a plurality of holding members, and the plurality of holding members hold a plurality of (for example, about 50 to 125) wafers 1 horizontally. That is, the plurality of wafers 1 held by the boat 47 are aligned in the vertical direction with their centers substantially coincident.

For convenience, although not shown, a clean gas supply unit (hereinafter referred to as a clean unit) is installed at the left end of the auxiliary chamber 45 opposite to the wafer transfer device elevator 46b side and the boat elevator 48 side. Yes. The clean unit consists of a supply fan and a dust filter. The clean unit supplies clean air (also referred to as clean gas) which is a cleaned atmosphere or inert gas.
In addition, a notch alignment device is installed between the wafer transfer device 46a and the clean unit. The notch aligner constitutes a substrate aligner that aligns the circumferential position of the wafer.
The clean air blown out from the clean unit is circulated through the notch aligning device, the wafer transfer device 46a and the boat 47 and then sucked in by a duct (not shown). The sucked clean air is exhausted to the outside of the main housing 11 or is circulated to the primary side (supply side) that is the suction side of the clean unit and blown again into the spare chamber 45 by the clean unit. Do or do.

A processing furnace 51 shown in FIG. 4 is installed on the sub casing 40.
As shown in FIG. 4, the processing furnace 51 includes a heater 52 as a heating mechanism.
The heater 52 has a cylindrical shape and is vertically installed by being supported by a heater base 53 as a holding plate.

A process tube 54 as a reaction tube is disposed concentrically with the heater 52 inside the heater 52. The process tube 54 includes an outer tube 55 as an external reaction tube and an inner tube 56 as an internal reaction tube provided on the inner side.
The outer tube 55 is made of a heat resistant material such as quartz (SiO ₂ ) or silicon carbide (SiC). The outer tube 55 has an inner diameter larger than the outer diameter of the inner tube 56, and is formed in a cylindrical shape with the upper end closed and the lower end opened. The outer tube 55 is provided concentrically with the inner tube 56.
The inner tube 56 is made of a heat resistant material such as quartz or silicon carbide. The inner tube 56 is formed in a cylindrical shape with an upper end and a lower end opened. A cylindrical hollow portion of the inner tube 56 forms a processing chamber 57. The processing chamber 57 can accommodate a boat 47 that holds the wafers 1 in a horizontal posture and arranged in multiple stages in the vertical direction.
A gap between the outer tube 55 and the inner tube 56 forms a cylindrical space 58.

The manifold 59 is disposed below the outer tube 55 concentrically with the outer tube 55. The manifold 59 is made of stainless steel, for example. The manifold 59 is formed in a cylindrical shape with an upper end and a lower end opened. The manifold 59 is engaged with and supports the outer tube 55 and the inner tube 56.
Since the manifold 59 is supported by the heater base 53, the process tube 54 is vertically installed.
Process tube 54 and manifold 59 form a reaction vessel.
An O-ring 59a as a seal member is provided between the manifold 59 and the outer tube 55.

A nozzle 60 as a gas introduction part is connected to the seal cap 50, and the nozzle 60 communicates with the inside of the processing chamber 57. A gas supply pipe 61 is connected to the nozzle 60.
The MFC (mass flow controller) 62 is connected to the upstream side which is the opposite side to the connection side with the nozzle 60 of the gas supply pipe 61. The gas supply source 63 is connected to the side opposite to the connection side of the gas supply pipe 61 of the MFC 62. The MFC 62 constitutes a gas flow rate controller. The gas supply source 63 supplies a desired gas such as a processing gas or an inert gas.
A gas flow rate control unit 64 is electrically connected to the MFC 62 through an electric wiring C. The gas flow rate control unit 64 controls the MFC 62 so that the supply gas flow rate becomes a desired amount and at a desired timing. .

The manifold 59 is provided with an exhaust pipe 65 that exhausts the atmosphere in the processing chamber 57. The exhaust pipe 65 is disposed at the lower end portion of the cylindrical space 58 formed by the gap between the inner tube 56 and the outer tube 55 and communicates with the cylindrical space 58.
The pressure sensor 66 and the pressure adjusting device 67 as pressure detectors are connected to the downstream side, which is the opposite side to the connection side of the exhaust pipe 65 with the manifold 59. An exhaust device 68 such as a vacuum pump is connected to the exhaust pipe 65 on the side opposite to the connection side with the pressure adjusting device 67. The exhaust device 68 exhausts the inside of the processing chamber 57 through the exhaust pipe 65, the pressure sensor 66, and the pressure adjusting device 67 so that the pressure in the processing chamber 57 becomes a predetermined pressure (degree of vacuum).
A pressure control unit 69 is electrically connected to the pressure adjusting device 67 and the pressure sensor 66 by an electric wiring B. The pressure control unit 69 controls the pressure adjusting device 67 based on the pressure detected by the pressure sensor 66 so that the pressure in the processing chamber 57 becomes a desired pressure and at a desired timing.

The seal cap 50 closes the lower side in the vertical direction at the lower end of the manifold 59. The seal cap 50 constitutes a furnace port lid capable of airtightly closing the lower end opening of the manifold 59.
The seal cap 50 is made of a metal such as stainless steel and is formed in a disk shape. An O-ring 50 a as a seal member is provided on the upper surface of the seal cap 50. The O-ring 50 a comes into contact with the lower end of the manifold 59.
A rotation mechanism 70 for rotating the boat is installed on the side of the seal cap 50 opposite to the processing chamber 57. A rotation shaft 71 of the rotation mechanism 70 passes through the seal cap 50 and is connected to the boat 47. The rotating shaft 71 rotates the wafer 47 by rotating the boat 47.
A drive control unit 72 is electrically connected to the rotation mechanism 70 and the boat elevator 48 by an electrical wiring A. The drive control unit 72 controls the rotation mechanism 70 and the boat elevator 48 so as to perform a desired operation and at a desired timing.

The boat 47 is made of a heat-resistant material such as quartz or silicon carbide. The boat 47 holds a plurality of wafers 1 in a multi-stage by aligning a plurality of wafers 1 in a horizontal posture with their centers aligned.
Note that a plurality of heat insulating plates 73 are arranged in a multi-stage in a horizontal posture at the lower portion of the boat 47. The heat insulating plate 73 is formed in a disk shape using a heat resistant material such as quartz or silicon carbide. The heat insulating plate 73 constitutes a heat insulating member. The plurality of heat insulating plates 73 make it difficult for the heat from the heater 52 to be transferred to the manifold 59 side.

A temperature sensor 74 is installed in the process tube 54. The temperature sensor 74 constitutes a temperature detector. A temperature controller 75 is electrically connected to the heater 52 and the temperature sensor 74 by an electric wiring D.
The temperature control unit 75 adjusts the power supply to the heater 52 based on the temperature information detected by the temperature sensor 74 so that the temperature in the processing chamber 57 has a desired temperature distribution and at a desired timing. Control.

The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, and the temperature control unit 75 also constitute an operation unit and an input / output unit, and are electrically connected to the main control unit 76 that controls the entire batch type CVD apparatus. It is connected to the.
The gas flow rate control unit 64, the pressure control unit 69, the drive control unit 72, the temperature control unit 75, and the main control unit 76 constitute a controller 77.

Next, the film forming process in the IC manufacturing method according to an embodiment of the present invention will be described by taking as an example the case where the batch type CVD apparatus having the above configuration is used.
In the following description, the operation of each part constituting the batch type CVD apparatus is controlled by the controller 77.

As shown in FIGS. 1 to 3, the pod 2 is placed on the holding table 18 when being loaded into the load port 14.
That is, when the in-process transport apparatus is the AGV 9 shown in FIG. 1, the AGV 9 places the pod 2 on the holding table 18 via the front opening 14C. When the in-process transfer apparatus is an overhead traveling type on-site transfer apparatus, the overhead traveling type on-site transfer apparatus places the pod 2 on the holding table 18 via the ceiling opening 14B.
At this time, the receiving kinematic pin 19 of the holding table 18 is fitted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned on the holding table 18.

Next, as shown in FIG. 5A, at the load port 14, the pod 2 is moved in the direction of the pod opener 23, and the door 4 is held by the closure 26 of the pod opener 23.
At this time, the inside of the load lock chamber 20 is in an inert gas atmosphere by the inert gas supplied from the inert gas supply device 132.
When the closure 26 holds the door 4, the door 4 is removed (detached) from the wafer loading / unloading port 3 by retreating the movable table 25.
Thereafter, as shown in FIG. 5B, the movable table 25 is lowered, and the closure 26 is removed from the position of the wafer loading / unloading port 3 in the load lock chamber 20.
When the wafer loading / unloading port 3 is opened, the linear actuator 28 inserts the holder 29 of the mapping device 27 into the wafer loading / unloading port 3 as shown in FIG. The mapping device 27 maps the wafer 1 in the pod 2 with the detector 30.
At this time, the inert gas supply device 132 supplies the inert gas to the load lock chamber 20, and the exhaust device 133 exhausts the load lock chamber 20, thereby replacing the atmosphere in the pod 2 with the inert gas.

When the predetermined mapping is completed, the linear actuator 28 returns the holder 29 of the mapping device 27 from the wafer loading / unloading port 3 to the original standby position.
When the holder 29 returns to the standby position, the movable table 25 is raised, and the closure 26 is moved to the position of the wafer loading / unloading port 3.
After that, as shown in FIG. 5A, the movable table 25 moves forward toward the wafer loading / unloading port 3, and the closure 26 attaches (attaches) the door 4 to the wafer loading / unloading port 3.

If the mapping information read by the mapping device 27 and the mapping information provided in advance for the pod 2 are different, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process or the immediately preceding process. It is immediately transported by an in-process transport device, for example, the AGV 9 shown in FIG.
As described above, the pod 2 in which a difference between the mapping information read by the mapping device 27 and the mapping information provided in advance is found is immediately sent back from the load port 14, so that the inside of the main casing 11, in particular, the mounting table 43 and the rotation Compared with the case where the pod 2 is carried to the type pod shelf 31 and then returned to the load port 14 and then sent back, the number of steps can be greatly reduced. As a result, an increase in the wafer placement time on the boat 47 and an increase in the wafer processing start standby time can be suppressed.

When the mapping information read by the mapping device 27 described above matches the mapping information provided in advance for the pod 2, the pod elevator 15 is supported by the holding stand 18 as shown in FIG. 6. The pod 2 is raised from the load port 14 to the height of the pod carry-in port 12.
Specifically, the holding base 18 is raised to a height above the sealed casing 21 and allowing the pod transport mechanism 35b to scoop up the pod 2 from below.
When the pod 2 is raised to the height of the pod carry-in port 12, the front shutter 13 opens the pod carry-in port 12.
Subsequently, the pod transport mechanism 35b goes under the pod carry-in port 12, and the pod transport mechanism 35b of the pod transport device 35 scoops the pod 2 supported by the holding base 18 from below as shown in FIG. take.
That is, as shown in FIG. 7, when the arm 35c of the pod transport mechanism 35b extends, the plate 35d supported at the tip of the arm 35c passes through the pod carry-in port 12 and directly below the holding table 18. Enter. The plate 35d is configured as a holding portion.
Subsequently, when the pod transport elevator 35a is raised, the plate 35d scoops up the pod 2 from the holding table 18.
At this time, as referred to by imaginary lines in FIG. 7, the three plate kinematic pins 35 e of the plate 35 d are fitted into the inner positions of the three positioning holes 5, respectively. The plate kinematic pin 35e corresponds to a secondary pin (SECONDARYPIN) defined in SEMI E57-0600.
The pod 2 scooped up by the pod transport mechanism 35b as described above is carried into the main casing 11 from the pod carry-in port 12 by shortening the arm 35c of the pod transport mechanism 35b.
As shown in FIGS. 1 and 2, the pod transport device 35 automatically transports the delivered pod 2 to the designated shelf plate 33 of the rotary pod shelf 31 and delivers it.
At this time, the shelf kinematic pin 34 of the shelf 33 is inserted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned and held on the shelf 33.

The pod 2 is temporarily stored on the shelf board 33. Thereafter, the pod transfer device 35 transfers the pod 2 from the shelf plate 33 to the pod opener 42 installed at one wafer transfer port 41 and transfers it to the mounting table 43.
At this time, the attaching / detaching mechanism 44 closes the wafer carry-in port 41 of the pod opener 42. The clean air unit circulates and fills the spare air 45 with clean air.
For example, when the reserve chamber 45 is filled with nitrogen gas as clean air, the oxygen concentration is set to 20 ppm or less, and the reserve chamber 45 is set much lower than the oxygen concentration in the main casing 11 (atmosphere). Yes.
Note that the pod 2 carried into the main housing 11 from the pod carry-in port 12 by the carrying mechanism 35 b may be directly carried to the pod opener 42 installed at the wafer carry-in port 41.

The pod opener 42 presses the opening side end surface of the pod 2 placed on the placing table 43 against the opening edge of the wafer carry-in port 41 on the front wall 40a. Subsequently, the attachment / detachment mechanism 44 removes the door 4 and opens the wafer loading / unloading port 3.
At this time, since mapping has already been performed at the load port 14, mapping for the group of wafers 1 in the pod 2 can be omitted.
Further, since the pod 2 is filled with an inert gas in advance, the phenomenon that the oxygen concentration in the preliminary chamber 45 increases can be suppressed.
When the pod 2 is opened by the pod opener 42, the wafer transfer mechanism 46 picks up the wafer 1 from the pod 2 by means of a tweezer 46c of the wafer transfer device 46a through the wafer loading / unloading port 3 and sends it to a notch alignment device (not shown). Transport. The notch aligner aligns the wafer 1. After the alignment, the wafer transfer mechanism 46 picks up the wafer 1 from the notch alignment device by the tweezer 46 c and conveys it to the boat 47. The wafer transfer mechanism 46 loads (charges) the transferred wafer 1 into the boat 47.
The wafer transfer mechanism 46 returns the wafer transfer device 46 a that has transferred the wafer 1 to the boat 47 to the pod 2 and starts the step of loading the next wafer 1 into the boat 47.

  During the loading operation of the wafer 1 to the boat 47 by the wafer transfer mechanism 46 in the one (upper or lower) pod opener 42, in the other (lower or upper) pod opener 42, the pod transfer device 35 is connected to another pod. 2 is transferred from the rotary pod shelf 31 and transferred. Further, the opening operation of the pod 2 moved to the other pod opener 42 is simultaneously performed.

When a predetermined number of wafers 1 are loaded into the boat 47, a furnace port shutter (not shown) opens the lower end of the closed processing furnace 51.
Subsequently, the boat elevator 48 raises the seal cap 50 to load the boat 47 holding the group of wafers into the processing furnace 51 (boat loading).

Here, a method for forming a thin film on the wafer 1 by the CVD method using the processing furnace 51 will be described.
In the following description, the operation of each part constituting the processing furnace 51 is controlled by the controller 77.

When a plurality of wafers 1 are loaded into the boat 47 (wafer charge), the boat elevator 48 lifts the boat 47 holding the plurality of wafers 1 into the processing chamber 57 as shown in FIG. Carry in (boat loading).
In this state, the seal cap 50 is in a state where the lower end of the manifold 59 is sealed via the O-ring 50a.

The vacuum exhaust device 68 exhausts the interior of the processing chamber 57 to a predetermined pressure (degree of vacuum). At this time, the pressure sensor 66 measures the pressure in the processing chamber 57. The pressure adjusting device 67 is feedback controlled based on the measured pressure.
Further, the heater 52 heats the inside of the processing chamber 57 to a predetermined temperature. At this time, the temperature sensor 74 detects the temperature in the processing chamber 57. The power supply to the heater 52 is feedback-controlled based on the detected temperature information so that the processing chamber 57 has a predetermined temperature distribution.
Subsequently, the rotation mechanism 70 rotates the wafer 47 by rotating the boat 47.

Next, a gas supplied from the gas supply source 63 and controlled to have a predetermined flow rate by the MFC 62 is introduced into the processing chamber 57 from the nozzle 60 through the gas supply pipe 61.
The introduced gas rises in the processing chamber 57, flows out from the upper end opening of the inner tube 56 into the cylindrical space 58, and is exhausted from the exhaust pipe 65.
The gas contacts the surface of the wafer 1 as it passes through the processing chamber 57. At this time, a thin film is deposited (deposited) on the surface of the wafer 1 by a thermal CVD reaction.

  When a preset processing time elapses, the gas supply source 63 supplies an inert gas into the processing chamber 57 through the gas supply pipe 61 to replace the inside of the processing chamber 57 with the inert gas, and in the processing chamber 57. Return the pressure to normal pressure.

  Thereafter, the boat elevator 48 lowers the seal cap 50 to open the lower end of the manifold 59 and unloads the boat 47 holding the processed wafer 1 from the lower end of the manifold 59 to the outside of the process tube 54 (boat unloading).

The wafer transfer device 46 a takes out the processed wafer 1 unloaded from the boat from the boat 47 (wafer discharge), and returns it to the empty pod 2 that has been previously transferred to the pod opener 42.
When a predetermined number of processed wafers 1 are stored, the pod opener 42 attaches the door 4 to the wafer loading / unloading port 3 of the pod 2.

The pod transfer device 35 automatically transfers and delivers the pod 2 with the wafer insertion / removal port 3 blocked to the designated shelf plate 33 of the rotary pod shelf 31.
The pod 2 is temporarily stored on the shelf board 33.
Thereafter, the front shutter 13 opens the pod carry-in port 12. The pod conveyance device 35 conveys the pod 2 from the shelf plate 33 to the pod carry-in port 12, and passes the pod carry-in port 12 on the holding table 18 of the pod elevator 15.
The pod 2 storing the processed wafer 1 may be directly transferred from the pod opener 42 to the pod carry-in port 12 by the pod transfer device 35.

When the pod 2 is transferred onto the holding table 18, the front shutter 13 closes the pod carry-in port 12. Further, the elevating drive device 16 lowers the shaft 17 of the pod elevator 15 onto the load port 14.
The pod 2 lowered onto the load port 14 is transferred to a predetermined process by an in-process transfer device, for example, the AGV 9 shown in FIG.

  According to the embodiment, one or more of the following effects can be obtained.

1) By installing a mapping device at the load port where the pod is carried by the in-process transfer device, load the pod where the difference between the actual mapping information read by the mapping device and the mapping information provided in advance is found Can be sent back immediately from the port. As a result, compared to the conventional case where the mapping device is installed in the pod opener in the housing, the amount of time required for returning the wafer to the load port after loading the pod into the housing and then sending it back can be saved. It is possible to reduce the start time being delayed from the time when a difference is found.

2) A pod carry-in entrance is provided above the load port, and a pod elevator that raises and lowers a holding base that holds the pod from the bottom between the load port and the pod carry-in grips and handles the top of the pod. Compared to the case, the handling structure can be configured easily and compactly. As a result, reduction in size and weight, simplification, speeding up, safety, and space utilization can be achieved.

3) By providing the receiving kinematic pins on the holding table that is raised and lowered by the pod elevator, the holding table can be used as a transport reference for the pod mounting portions in various places. As a result, the transport standard can be unified.

4) The pod may be left for a long time even when the wafer is stored, and the oxygen concentration in the pod may be high. In that case, when the cover body is opened on the mounting table 43, the large volume of the reserve chamber is in an inert gas atmosphere (low oxygen concentration state). Therefore, it took time to return the preliminary chamber to the inert gas atmosphere. However, the throughput can be improved by replacing the inside of the pod with an inert gas atmosphere in the sealed casing 21 having a smaller volume than the preliminary chamber before opening the lid of the pod in the preliminary chamber.

FIG. 9 is a side sectional view showing a batch type CVD apparatus according to the second embodiment of the present invention.
The main difference of this embodiment from the above embodiment is that the pod opener is installed only in the load port.
That is, as shown in FIG. 9, the load port 14 is installed on the front wall (partition wall) 40 a of the sub-casing 40 that forms the spare chamber 45, and a wafer loading / unloading port (hereinafter referred to as a wafer loading / unloading port). 91) is established on the back wall 81a of the sealed casing 81 forming the load lock chamber 80 of the pod opener 83 installed on the front wall 40a. Further, a door mechanism 92 that opens and closes the wafer carry-in port 91 is installed in the load port.
The wafer transfer mechanism 46 as a substrate transfer device installed in the preliminary chamber 45 transfers the wafer 1 between the pod 2 and the boat 47 when the door mechanism 92 opens the wafer carry-in port 91. It is configured.
The boat elevator 48 carries the boat 47 into and out of the processing chamber 57 of the processing furnace 51 adjacent to the preliminary chamber 45.
A storage shelf 31A and a pod transfer device 35 are installed in the storage chamber 11b adjacent to the ceiling surface of the preliminary chamber 45.
The pod carry-in port 12 is opened at a portion of the main housing 11 facing the storage chamber 11b on the front wall 11a. The front shutter 13 opens and closes the pod carry-in port 12.
Similar to the pod opener 23 of the first embodiment, a mapping device 84 is installed in the load lock chamber 80. The mapping device 84 can move back and forth (vertical direction) and up and down (parallel direction) with respect to the door slot 82.
An inert gas (nitrogen gas) supply device 132 and an exhaust device 133 are connected to the sealed casing 81. The inside of the load lock chamber 80 is supplied with an inert gas (nitrogen gas) by an inert gas (nitrogen gas) supply device 132 and is exhausted by an exhaust device 133.

  Next, the operation of the pod opener of the batch type CVD apparatus according to the above configuration will be described.

As shown in FIG. 9, the pod 2 is placed on the holding base 18 of the pod elevator 15 when being carried into the load port 14.
At this time, the receiving kinematic pin 19 protruding from the holding table 18 is inserted into the positioning hole 5 on the lower surface of the pod 2, so that the pod 2 is positioned on the holding table 18.

Next, at the load port 14, the pod 2 is moved in the direction of the pod opener 83. The pod opener 83 causes the closure 86 to hold the door 4.
At this time, the inside of the load lock chamber 80 is in an inert gas atmosphere by the inert gas supplied from the inert gas supply device 132.
When the closure 86 holds the door 4, the moving base 85 moves backward, and the closure 86 removes the door 4 from the wafer loading / unloading port 3 and the door loading / unloading port 82. Thereafter, the movable table 85 descends in the load lock chamber 80, and the closure 86 is detached from the positions of the wafer loading / unloading port 3 and the door loading / unloading port 82.
When the pod opener 83 opens the wafer loading / unloading port 3, the mapping device 84 inserts the detector into the wafer loading / unloading port 3, and the wafer 1 is mapped by detecting the wafer 1 in the pod 2 with the detector.
At this time, the inert gas supply device 132 supplies the inert gas into the load lock chamber 80, and the exhaust device 133 exhausts the load lock chamber 80, whereby the atmosphere in the pod 2 is replaced with the inert gas. .

When the predetermined mapping is completed, the mapping apparatus is returned from the wafer loading / unloading port 3 to the original standby position.
Thereafter, the moving table 85 is raised, and the closure 86 is moved to the position of the wafer loading / unloading port 3. Thereafter, the movable table 85 moves forward toward the wafer loading / unloading port 3, and the closure 86 attaches the door 4 to the wafer loading / unloading port 3 and the door loading / unloading port 82.

  When the actual mapping information read by the mapping device is different from the mapping information provided in advance with respect to the pod 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process, the immediately preceding process, etc. Then, it is immediately conveyed by AGV9.

If the actual mapping information read by the mapping device described above matches the mapping information provided in advance for the pod 2, the pod elevator 15 moves the pod 2 supported by the holding base 18 from the load port 14. Raise to the height of the pod carry-in port 12.
When the pod 2 rises to the height of the pod carry-in port 12, the front shutter 13 opens the pod carry-in port 12.
Subsequently, the pod transfer device 35 causes the pod transfer mechanism 35b to scoop up the pod 2 supported by the holding table 18.
The pod carrying device 35 carries the pod 2 picked up by the pod carrying mechanism 35 b into the main housing 11 from the pod carrying port 12.
The pod transport device 35 automatically transports the delivered pod 2 to the designated shelf plate 33A of the storage shelf 31A.

The pod 2 is temporarily stored on the shelf board 33A.
Thereafter, the pod transfer device 35 and the pod elevator 15 are transferred from the storage shelf 31 </ b> A to the load port 14 in the reverse order to the above.
At this time, clean air is circulated and filled in the preliminary chamber 45.

Next, at the load port 14, the pod 2 is moved in the direction of the pod opener 83, and the door 4 is held by the closure 86 of the pod opener 83.
When the closure 86 holds the door 4, the door 4 is removed from the wafer loading / unloading port 3 by the retraction of the movable table 85. Thereafter, the closure 86 moves away from the position of the wafer loading / unloading port 3 and the door loading / unloading port 82 by the lowering of the movable table 85 in the load lock chamber 80.
When the wafer loading / unloading port 3 is opened, the door mechanism 92 opens the wafer carry-in port 91.
At this time, since the mapping of the wafer in the pod has already been completed, it can be omitted.
Further, since the pod 2 is filled with an inert gas in advance, it is possible to suppress an increase in the oxygen concentration in the preliminary chamber 45.

When the wafer loading / unloading port 3, the door loading / unloading port 82, and the wafer loading / unloading port 91 are opened, the wafer transfer device 46a uses the tweezer 46c to move the wafer 1 from the pod 2 to the wafer loading / unloading port 3, the door loading / unloading port 82, and the wafer loading / unloading port 91. Pick up through. The wafer transfer device 46a conveys the wafer 1 to the notch alignment device. The notch aligner aligns the wafer 1. After the notch alignment, the wafer transfer device 46a picks up the wafer 1 from the notch alignment device by the tweezer 46c. The wafer transfer device 46 a transports the picked-up wafer 1 to the boat 47 and charges (charges) the boat 47.
The wafer transfer device 46 a that has transferred the wafer 1 to the boat 47 returns to the pod 2 and loads the next wafer 1 into the boat 47.
Note that the wafer transfer device 46a may directly transfer the wafer 1 from the pod 2 by the tweezer 46c without performing the step of temporarily storing the pod 2 in the storage shelf 31A. That is, after the mapping is completed and the mapping device returns the detector from the wafer loading / unloading port 3 to the original standby position, or during mapping, the wafer carry-in port 91 is opened. Subsequently, the wafer transfer device 46 a inserts the tweezer 46 c into the wafer carry-in port 91 and picks up the wafer 1 from the pod 2.

  Subsequent steps are the same as those in the above embodiment, and a description thereof will be omitted.

  According to this embodiment, in addition to the one or more effects of the first embodiment, the following effects can be obtained. Since the pod opener only needs to be installed in the load port, it can contribute to space efficiency improvement (footprint reduction) and throughput improvement (possible to reduce the movement range of the pod).

  FIG. 10 is a perspective view showing a load port of a batch type CVD apparatus according to the third embodiment of the present invention.

This embodiment is different from the first embodiment in a pod elevator 15B that moves the holding table back and forth and up and down.
The shape of the holding stand is the same as in the first embodiment, but will be described in detail.
That is, the main body 96 of the linear actuator 95 is provided at the upper end of the shaft 17B of the elevating drive device 16B, and the main body 96 extends horizontally and in the front-rear direction. The holding base 18 is horizontally attached to the linear actuator 95 via a guide 97, a drive rod 98, and a bracket 99. The guide 97 and the drive rod 98 extend and contract with respect to the main body 96 to move the holding base 18 horizontally and in the front-rear direction. The linear actuator 95, the main body 96, the guide 97, the drive rod 98, and the bracket constitute a far-near movement apparatus. The far-near movement apparatus is not limited to this embodiment, and may be a belt drive type, for example.
In short, the holding base 18 only needs to operate in a direction opposite to the pod opener.
The holding base 18 has a notch (also referred to as an escape portion) on the pod opener 23 side (also referred to as the door outlet / inlet 22 side).
Specifically, the notch is disposed between two receiving kinematic pins 19F on the pod opener 23 side among the three receiving kinematic pins 19 holding the pod 2. The receiving kinematic pin 19 corresponds to a primary pin (PRIMARY PIN) defined in SEMI E57-0600 and is configured as a positioning unit. The notch is formed so that a space is formed in a part of the bottom surface of the pod 2 when the pod 2 is placed, and the pod opener 23 side is cut away from the remaining one receiving kinematic pin 19G.
The cutout shape may be a quadrangle, a rectangle, a circle, or an oval. Preferably, it is good to cut into a triangular shape. As a best mode, as shown in FIG. 10, it is preferable to cut out into a substantially equilateral triangular shape.
Due to the cutout of the holding table 18, when the pod is placed on the holding table 18, a space is formed on a part of the bottom surface of the pod and on the pod opener 23 side.
Thereby, the pod carrying device 35 can deliver the pod 2 while preventing the interference between the plate 35d and the holding table 18 when the pod 2 is transferred between the plate 35d and the holding table 18.

Next, a pod handling step by the pod elevator 15B according to the above configuration will be described with reference to FIG.
Since other steps such as a mapping step as a process of mapping the wafer in the pod are the same as those in the first embodiment described above, description of those steps is omitted.

The pod 2 that has been transported by the in-process transport device such as the AGV 9 is placed on the holding table 18 as shown in FIG.
At this time, the three receiving kinematic pins 19 of the holding base 18 are respectively inserted into the outer positions (see FIG. 7) of the three positioning holes 5 arranged on the lower surface of the pod 2, thereby holding the pod 2. It will be in the state positioned by the stand 18.

  Next, as shown in FIG. 11 (b), the linear actuator 95 is shortened to move the pod 2 together with the holding base 18 in the direction of the pod opener 23 (door entrance / exit 22). 4 is held in the closure 26 of the pod opener 23.

Thereafter, the mapping step is performed by the above-described operation.
When the mapping is completed, the closure 26 attaches (attaches) the door 4 to the wafer loading / unloading port 3.
Next, as shown in FIG. 11C, the linear actuator 95 is extended to return the pod 2 to the original position together with the holding base 18.

  If the mapping information read in the mapping step is different from the mapping information provided in advance with respect to the pod 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process, the immediately preceding process, and the like. It is immediately transported by the in-process transport device.

On the other hand, when the mapping information read in the mapping step matches the mapping information provided in advance with respect to the pod 2, as shown in FIG. By performing the extension operation, the pod 2 supported by the holding base 18 is raised from the load port 14 to the height of the pod carry-in port 12. The elevating drive device 16 </ b> B elevates and lowers the holding base 18 in parallel with the opening surface of the door access opening 22.
When the pod 2 rises to the height of the pod carry-in port 12, the front shutter 13 opens the pod carry-in port 12.

Subsequently, as shown in FIG. 7, when the pod transport mechanism 35 b extends the arm 35 c, the plate 35 d supported at the tip of the arm 35 c passes through the pod carry-in port 12 and is directly below the holding table 18. enter in.
Subsequently, when the pod transport elevator 35a is raised, the plate 35d scoops up the pod 2 from the holding table 18.
At this time, the three plate kinematic pins 35e of the plate 35d are fitted into the inner positions of the receiving kinematic pins 19 of the three positioning holes 5, respectively.
The pod 2 scooped up by the pod transport mechanism 35b as described above is carried into the main casing 11 from the pod carry-in port 12 by shortening the arm 35c of the pod transport mechanism 35b.
Subsequent steps are the same as those of the first embodiment described above.

According to this embodiment, in addition to the one or more effects of the first embodiment, there are one or more of the following effects.
1) A receiving kinematic pin (primary pin) is provided on the first mounting unit that can be moved up and down, and a notch is provided inside the first mounting unit surrounded by the receiving kinematic pin. Accordingly, when the pod is scooped up, the plate of the transport device can be easily inserted into the notch through the two portions of the receiving kinematic pins provided at the three locations of the outer plate.
2) By providing a notch on the transport device side of the first mounting unit, the plate can easily access the bottom surface of the pod when the transport device plate scoops up the pod from the first mounting unit.
3) When the transfer device is inserted into the cutout of the first mounting unit, one of the receiving kinematic pins (primary pins) and one of the kinematic pins (secondary pins) on the plate of the transfer device are transferred. It is arranged at a position aligned in the same direction as the movement direction of the apparatus. In such a case, the inner side can be cut out by using the kinematic pin in the first mounting unit as a primary pin, and the pod is transferred to and from a transfer device having a secondary pin that can be inserted into the cutout. be able to. By supporting the peripheral part of the bottom surface of the pod with the outer plate, stable elevation can be achieved.

  12 and 13 are perspective views showing a load port of a batch type CVD apparatus according to the fourth embodiment of the present invention.

By the way, in 3rd embodiment mentioned above, since it is necessary to raise / lower the linear actuator 95 together with the holding stand 18, there exists a possibility that the pod elevator 15B may become a large sized and complicated structure.
In order to eliminate this concern, the present embodiment separates the holding base 18 into an inner plate 18A and an outer plate 18B. The inner plate 18A constitutes a first placement member (first placement unit) that operates in a direction opposite to the pod opener (lid body attaching / detaching means, also simply referred to as attachment / detachment device) 23. The outer plate 18B constitutes an outer plate 18B as a second mounting member (second mounting unit) that moves up and down with respect to the pod opener 23.

As shown in FIG. 14, the inner plate 18A is formed in a substantially equilateral triangular flat plate shape in plan view. The linear actuator 95 moves the inner plate 18 </ b> A horizontally and in the front-rear direction (also referred to as a perspective direction with respect to the door insertion / removal port 22). The inner kinematic pins 19A are provided vertically at three vertex positions on the upper surface of the inner plate 18A and perpendicular to the upper surface of the inner plate 18A. The inner kinematic pin 19A is SEMI
It corresponds to a secondary pin defined in E57-0600 and is configured as a positioning portion.
The main body 96 of the linear actuator 95 is installed in front of a position below the door slot 22 of the sealed casing 21. The main body 96 extends horizontally and in the front-rear direction (also referred to as a perspective direction with respect to the door slot 22). The inner plate 18A is horizontally attached to the linear actuator 95 via a guide 97, a drive rod 98, and a bracket 99. The guide 97 and the drive rod 98 extend and contract with respect to the main body 96, thereby moving the inner plate 18A horizontally and in the front-rear direction.
In short, the inner plate 18A only needs to operate in a direction opposite to the pod opener.

As shown in FIGS. 12 and 13, the outer plate 18 </ b> B is formed in a flat plate shape that is substantially rectangular in plan view. The outer plate 18B is notched as a relief portion (also referred to as a notch) 18C at the center of the long side of the pod opener 23 side. The escape portion 18C is formed in a substantially equilateral triangle that is slightly larger than the inner plate 18A.
The receiving kinematic pins 19B are provided at three apex positions of the relief portion 18C on the upper surface of the outer plate 18B, respectively, perpendicular to the upper surface of the outer plate 18B. As shown in FIG. 12, the receiving kinematic pin 19B of the outer plate 18B is set to be located outside the inner kinematic pin 19A of the inner plate 18A.
That is, assuming that the inner plate 18A is inserted into the escape portion 18C of the outer plate 18B, the inner kinematic pin 19A and the receiving kinematic pin 19B are disposed adjacent to each other.
The inner kinematic pin 19A corresponds to a primary pin defined in SEMI E57-0600 and is configured as a positioning portion.
A pair of elevating drive devices 16C and 16C are arranged on the left and right sides of the hermetic casing 21 and are installed vertically upward. An outer plate 18B is installed horizontally on the upper ends of the shafts 17C and 17C of both the lift drive devices 16C and 16C. Both raising / lowering drive apparatuses 16C, 16C raise / lower the outer plate 18B by extending and contracting the shafts 17C, 17C in synchronization.
In addition, a raising / lowering drive apparatus is good also as one or three or more instead of a pair. Preferably, when the elevating drive device is provided as a pair on both sides of the cutout of the outer plate 18B, stable elevating operation can be achieved and the cost can be reduced.

Next, the pod handling step by the inner plate 18A and the outer plate 18B according to the above configuration will be described with reference to FIGS.
Since other steps such as a mapping step as a process of mapping the wafer in the pod are the same as those in the first embodiment described above, description of those steps is omitted.
In FIG. 12, FIG. 13, FIG. 15, and FIG. 16, the linear actuator 95 is not shown for convenience.

The pod 2 that has been transported by the in-process transport device such as the AGV 9 is placed on the inner plate 18A as shown in FIG.
At this time, the three inner kinematic pins 19A of the inner plate 18A are respectively inserted into the positions inside the three positioning holes 5 arranged on the lower surface of the pod 2, whereby the pod 2 is positioned on the inner plate 18A. It becomes a state.

Next, as shown in FIG. 14B, the linear actuator 95 is shortened to move the pod 2 in the direction of the pod opener 23 as shown in FIG. 15B. The door 4 is held by the closure 26 of the pod opener 23.
At this time, the inside of the load lock chamber 20 is in an inert gas atmosphere by the inert gas supplied from the inert gas supply device 132.

Next, as shown in FIG. 15C, the closure 26 removes the door 4 from the wafer loading / unloading port 3.
Subsequently, the closure 26 descends in the load lock chamber 20 to detach the door 4 from the position of the wafer loading / unloading port 3 as shown in FIG.

Thereafter, the mapping step and the replacement of the atmosphere in the pod 2 with an inert gas are performed by the above-described operation.
When the mapping is completed, the closure 26 attaches (attaches) the door 4 to the wafer loading / unloading port 3.

Next, as shown in FIG. 14 (a), the linear actuator 95 is extended to move the inner plate 18A holding the pod 2 to its original position as shown in FIG. 16 (a). Return to.
In this state, the inner plate 18A is positioned directly above the escape portion 18C (see FIG. 12) of the outer plate 18B.

  If the mapping information read in the mapping step is different from the mapping information provided in advance for the pod 2, the pod 2 in which the difference is found is transferred from the load port 14 to the wafer knitting process or the immediately preceding process. It is immediately transported by such an in-process transport device.

When the mapping information read in the mapping step matches the mapping information provided in advance with respect to the pod 2, the pair of lift drive devices 16C and 16C slightly extend the shafts 17C and 17C.
As a result, as shown in FIG. 16B, the three receiving kinematic pins 19B of the outer plate 18B are arranged on the outer side of the three inner kinematic pins 19A of the inner plate 18A. Are inserted into the positioning holes 5 respectively. That is, the outer plate 18B receives the pod 2 from the inner plate 18A.

The raising / lowering driving device 16 </ b> C extends the shaft 17 </ b> C to raise the pod 2 from the load port 14 to the height of the pod carry-in port 12.
Since the receiving kinematic pin 19B is positioned outward, the outer plate 18B can raise the pod 2 in a stable state. Moreover, it can raise in a stable state by supporting a pod bottom surface peripheral part by the outer side plate 18B.

When the pod 2 rises to the height of the pod carry-in port 12, the front shutter 13 opens the pod carry-in port 12.
Thereafter, as shown in FIG. 7, when the arm 35c of the pod transport mechanism 35b extends, the plate 35d supported at the tip of the arm 35c passes through the pod carry-in port 12, and the escape portion of the outer plate 18B. Enter just below 18C.
As the pod transport elevator 35a rises, the plate 35d passes through the escape portion 18C and scoops the pod 2 from the outer plate 18B.
At this time, the three plate kinematic pins 35e of the plate 35d are fitted into the inner positions of the receiving kinematic pins 19B of the three positioning holes 5, respectively.

The pod 2 scooped up by the pod transport mechanism 35b as described above is shortened by the arm 35c of the pod transport mechanism 35b, and as shown in FIG. It is carried into the body 11.
Subsequent steps are the same as those of the first embodiment described above.

Incidentally, when the pod 2 is supplied from the rotary pod shelf 31 to the load port 14, as shown in FIG. 16 (f), the pod 2 is placed on the raised outer plate 18B. To the pod transport mechanism 35b.
Subsequently, as shown in FIG. 16G, the outer plate 18 </ b> B descends to transfer the pod 2 to the inner plate 18 </ b> A.
Thereafter, the above-described operation is performed.

According to this embodiment, in addition to one or more of the effects exhibited by the first to third embodiments, one or more of the following effects are achieved.
1) The structure of the pod elevator is simplified because the inner plate 18A that operates in a perspective manner with respect to the pod opener and the outer plate 18B that moves up and down in parallel to the opening surface of the door access opening 22 in the pod opener are separated. be able to.
2) When the first mounting unit moves up and down, the second mounting unit and the far-near movement mechanism need not be lifted and lowered together. On the other hand, when the first mounting unit performs a perspective operation, the first mounting unit and the lifting / lowering mechanism need not be operated together. Thereby, a structure can be simplified without enlarging a raising / lowering moving mechanism, and a structure can be simplified without enlarging a perspective moving mechanism.
3) A receiving kinematic pin (primary pin) is provided on the first mounting unit that can be moved up and down, and a notch is provided inside the first mounting unit surrounded by the receiving kinematic pin. Further, a second mounting unit formed at least partially in the notch so as to be insertable is provided. The second mounting unit is provided so as to be able to operate near and far with respect to the pod opener.
Accordingly, the pod can be smoothly transferred between the first mounting unit and the second mounting unit.
In this case, for example, when the pod is delivered between the second mounting unit having the secondary pin instead of the first mounting unit and the plate having the primary pin of the transport device, the second mounting unit and the second mounting unit The plate of the transport device must be lifted up by the pod while avoiding the members that support the device, which requires a lot of ingenuity, leading to a complicated device configuration and high manufacturing costs.

  17 to 19 show a fifth embodiment of the present invention in which a load port having an inner plate and an outer plate is provided in a single wafer CVD apparatus.

On the front surface of the main casing 111 of the single-wafer CVD apparatus 110, three load ports 114 are set side by side in the left-right direction. A pod opener 123 is built on the front wall facing each load port 114, and each pod elevator 115 is installed in front of each pod opener 123.
Each pod elevator 115 includes a pair of elevating drive devices 16C, 16C, and the pair of elevating drive devices 16C, 16C are arranged side by side at each load port 114 and are installed vertically upward. Both the lift drive devices 16C and 16C have an outer plate 18B installed horizontally on the upper ends of the shafts 17C and 17C. The outer plate 18B is formed in a substantially rectangular shape having a relief portion 18C. Both raising / lowering drive devices 16C and 16C raise and lower the outer plate 18B by extending and contracting the shafts 17C and 17C in synchronization.
The receiving kinematic pins 19B are provided at three vertex positions in the relief portion 18C on the upper surface of the outer plate 18B, respectively, perpendicular to the upper surface of the outer plate 18B.

Although not shown in FIGS. 17 to 19, each pod elevator 115 includes a linear actuator 95. The linear actuator 95 has a main body 96 installed at a position just below the door opening / closing port 122 of the pod opener 123. The main body 96 extends horizontally and in the front-rear direction.
The linear actuator 95 has an inner plate 18A attached horizontally to a guide 97 and a drive rod 98 via a bracket 99. The guide 97 and the drive rod 98 extend and contract with respect to the main body 96, thereby moving the inner plate 18A horizontally and in the front-rear direction.
The inner plate 18A is formed in a flat plate shape having a substantially regular triangle in plan view. The linear actuator 95 moves the inner plate 18A horizontally and in the front-rear direction. On the upper surface of the inner plate 18A, inner kinematic pins 19A are vertically provided at three vertex positions.

  Three slide type pod shelves 131 are provided side by side in the left-right direction on the upper surface of the main casing 111. Each sliding pod shelf 131 is configured by a linear actuator 95 that moves the inner plate 18A horizontally and in the front-rear direction.

  Next, the step of storing the pod 2 in the sliding pod shelf 131, which is a characteristic step of the present embodiment, will be described with reference to FIGS.

  Assuming that the pod 2 shown in FIG. 17 is a pod to be stored in the sliding pod shelf 131, the three receiving kinematic pins 19B of the outer plate 18B have three positionings arranged on the lower surface of the pod 2. The holes 5 are inserted into positions outside the holes 5.

  As shown in FIG. 18, the elevating drive device 16 </ b> C raises the pod 2 held by the outer plate 18 </ b> B to the height of the sliding pod shelf 131 by extending the shaft 17 </ b> C.

Next, as shown in FIG. 18, the linear actuator 95 of the sliding pod shelf 131 is extended to cause the inner plate 18A to enter just below the escape portion 18C of the outer plate 18B.
Subsequently, the elevation drive device 16C lowers the shaft 17C slightly. As a result, the three inner kinematic pins 19A of the inner plate 18A are respectively fitted into the three positioning holes 5 of the pod 2 inside the three receiving kinematic pins 19B of the outer plate 18B. That is, the outer plate 18B is in a state where the pod 2 is transferred to the inner plate 18A.

  Next, the linear actuator 95 of the sliding pod shelf 131 is shortened so that the inner plate 18A is pulled back from just above the escape portion 18C of the outer plate 18B, and as shown in FIG. 19, the pod 2 is moved to the sliding pod. It is stored on the shelf 131.

  When the pod 2 is supplied from the sliding pod shelf 131 to the load port 114, the pod 2 is returned from the sliding pod shelf 131 to the load port 114 in the reverse procedure.

  According to this embodiment, a storage shelf for automatically storing pods can be attached to the single wafer CVD apparatus.

  In addition, this invention is not limited to the said embodiment, It cannot be overemphasized that it can change variously in the range which does not deviate from the summary.

For example, in a pod elevator, not only a pair of lift drive devices but also a single lift drive device may be provided. When only one lifting drive is used, it is desirable to use a guide. Further, since the support of the pod is more stable when it is supported at three points, two guides may be used.
The drive device is not limited to an air cylinder device, but may be a combination of a motor, a ball screw, a guide, and the like.

As described above, the best mode has been described so as to form a substantially equilateral triangular inner plate and a substantially equilateral triangular relief portion slightly larger than the inner plate.
In this way, by forming a substantially equilateral triangular shape, the pod can be stably held on the inner plate and the outer plate, respectively.
However, it is also possible to appropriately form it as shown in FIG.
In short, it is only necessary that the pod can be delivered without interference between the inner plate and the outer plate.
FIG. 20A shows an example in which the inner plate is formed in a square shape, and the notches in the outer plate are formed in a square shape.
FIG. 20B shows an example in which the inner plate is formed in a horseshoe shape and the cutouts of the outer plate are formed in a horseshoe shape.
FIG. 20C shows an example in which the inner plate is formed in a triangular shape, and the cutouts in the outer plate are formed in a rectangular shape.
At this time, if the plate 35d of the pod transfer device is also matched to the shape of the inner plate, the pod can be easily transferred.

  In the above-described embodiment, the case where the present invention is applied to the CVD apparatus has been described. However, the present invention is not limited to this, and can be applied to all substrate processing apparatuses such as a diffusion apparatus, an annealing apparatus, and an oxidation apparatus.

  The substrate is not limited to a wafer, but may be a photomask, a printed wiring board, a liquid crystal panel, a compact disk, a magnetic disk, or the like.

FIG. 21 is a perspective view showing a preferred embodiment of the pod elevator.
FIG. 22 is a perspective view showing the operating state.
As shown in FIG. 21, a cover 300 is installed on the pod elevator 15. The cover 300 includes a top plate 301 arranged horizontally, and a front plate 302 arranged vertically and having an upper end side fixed to a front end side of the top plate 301. The top plate 301 is fixed to the shaft 17 of the elevating drive device 16. The front plate 302 is formed with a lateral width that can cover the load port 14 and a height that is larger than the stroke of the shaft 17 (see FIG. 30).
Although the number of the lift drive device 16 and the shaft 17 may be one, it is preferable to install two or more at predetermined intervals. By doing so, the top plate 301 can be raised and lowered stably with the pod placed.
A triangular relief hole 303 is formed in the top plate 301 at a portion facing the holding table 18 on the load port 14. A kinematic pin 19 projects from each of the triangular vertices of the escape hole 303. Therefore, the top plate 301 constitutes a holding portion that holds the lower surface of the pod 2 and also constitutes a pod placement portion.
The top plate 301 may be expressed as a holding unit, and the cover 300 may be expressed as being fixed to the holding unit.
Further, the cover 300 is not necessarily fixed to the holding portion. For example, a drive device may be provided in the cover 300, and the cover 300 may be raised and lowered according to the operation of the holding unit and the lifting mechanism.

Next, the operation and effect of the pod elevator according to the above configuration will be described.
For convenience, illustration of the pod 2 is omitted, but when the state transitions from the state of FIG. 21 to the state of FIG. At this time, the kinematic pins 19 on the top plate 301 are fitted into the positioning holes 5 on the lower surface of the pod 2 on the outside of the kinematic pins 19 on the holding base 18.
During normal standby, the top plate 301 is positioned below the holding base 18 to avoid interference when the holding base 18 moves back and forth with respect to the door access slot 22.
When shifting from the state of FIG. 22 to the state of FIG. 21, the top plate 301 delivers the pod 2 onto the holding table 18.
The cover 300 covering the pod elevator 15 suppresses scattering of particles from the pod elevator 15. In particular, in a state where the pod 2 is raised to the vicinity of the pod loading / unloading port 12 by the top plate 301, the elevating drive device 16 and the shaft 17 are exposed from the front opening 14C from the front of the device. Particles are scattered. However, the cover 300 can suppress such particle scattering.
The cover 300 covering the pod elevator 15 can suppress the danger of the operator due to the lifting drive device 16 and the shaft 17 being exposed to the work space.
For example, when the operator manually places the pod 2 on the load port 14 from the front opening 14C (see FIG. 1) of the box 14A, the cover 300 prevents contact with the elevating drive device 16 and the shaft 17. Can do.

FIG. 23 is a perspective view showing a further preferred embodiment of the pod elevator.
FIG. 24 is a perspective view showing the operation state.
The present embodiment is different from the above embodiment in that the cover 300 includes a pair of side plates 304 and 304. The pair of side plates 304 and 304 are fixed at right angles to the left and right ends of the front plate 302, respectively. That is, it is provided on three side surfaces excluding the side where the pod opener 23 is present.
According to the present embodiment, since the cover 300 covers not only the front of the pod elevator 15 but also the left and right sides, the effect of preventing particle scattering and the effect of ensuring safety can be further improved.

  In addition, the Example which installs the pod elevator shown to FIGS. 21-24 is applicable also to 1st embodiment-5th embodiment. When applied, the effects described above can be obtained.

  Needless to say, the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the invention.

For example, in consideration of hermeticity of the pod storage chamber and prevention of particle scattering to the outside of the apparatus, it is preferable to provide the front shutter 13 or to form the pod loading / unloading port 12 with a small opening size. However, the front shutter 13 may not be provided.
Further, the pod loading / unloading port 12 may be maximized so that substantially all of the partition walls above the pod opener 23 and the sealed casing 21 are opened.
For example, the holding base 18 (top plate 301) is raised in advance by the pod elevator 15 to a height that can be accessed by the pod transfer device 35, and the pod is received from the OHT at that position, and the holding base 18 is lowered to open the door. The pod may be received from the holding table 18 by the pod transfer device 35 without performing the opening / closing operation 4.
When operated in this way, the OHT descending range can be reduced as much as the holding base 18 is raised. Further, since the holding table 18 does not need to be raised to a height position accessible by the pod transfer device 35 after receiving the pod from the OHT, the transfer time can be shortened accordingly.
For example, the pod elevator 15 is configured to raise at least a part of the pod placed on the outer plate from the upper end of the load lock chamber, and the pod transport device 35 is not a scooping type but a gripping type. Good. However, in this case, there are disadvantages such as an increase in conveyance space and instability of conveyance compared with the scooping type.
For example, the first mounting unit and the second mounting unit may not be plate-shaped, and only the upper surface may be a flat surface, and the lower surface may be a curved surface.
The mapping apparatus may apply the first embodiment to the second embodiment, the third embodiment, and the fourth embodiment, and the second embodiment, the third embodiment, and the fourth embodiment to the first embodiment. You may apply.

A preferred embodiment will be additionally described.
(1) a storage container in which a plurality of substrates are stored and a substrate outlet is closed with a lid;
A load port for placing the storage container;
An attachment / detachment device for attaching / detaching the lid to / from the substrate loading / unloading port at the load port;
A first placement unit that places the storage container at the load port and performs a perspective operation in a direction opposite to the attachment / detachment device;
A second mounting unit that is provided separately from the first mounting unit, mounts the storage container at the load port, and moves up and down relative to the detachable device;
A substrate processing apparatus comprising:
(2) transporting a storage container that stores a plurality of substrates and closes a substrate loading / unloading port to a load port;
A step of operating the first placement unit at the load port, and bringing the storage container placed on the first placement unit closer to an attachment / detachment device;
Removing the lid from the substrate loading / unloading port of the storage container placed on the first placement unit;
Attaching the lid to the substrate loading / unloading port of the storage container placed on the first placement unit;
The step of operating the first mounting unit and moving the storage container mounted on the first mounting unit away from the attachment / detachment device;
Raising the second mounting unit and delivering the storage container from the first mounting unit to the second mounting unit;
Transporting the substrate stored in the storage container to a processing chamber;
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:
(3) The substrate processing apparatus according to (1), wherein the second placement unit supports a bottom peripheral edge side of the storage container with respect to the first placement unit.
(4) The substrate processing apparatus according to (3), wherein the first placement unit supports the center of the bottom surface of the storage container relative to the second placement unit.
(5) The second mounting unit has a notch formed in a central portion on the side of the detachable device, and the first mounting unit can be positioned in the notch. 3) The substrate processing apparatus.
(6) The substrate processing apparatus according to (3) or (4), wherein the second mounting unit and the first mounting unit are configured to be able to simultaneously support one storage container by the load port.
(7) A storage shelf that can store a plurality of the storage containers, and a transport device that can transport the storage containers between the storage shelves and the second placement unit,
(1) The substrate processing apparatus according to (1), wherein the transfer device includes a holding unit that supports the center of the bottom surface of the storage container relative to the second placement unit.
(8) a storage room provided adjacent to the load port and storing the storage container;
(1) The substrate processing apparatus according to (1), further comprising: a transfer device provided in the storage chamber and capable of transferring the storage container between the storage chamber and the second placement unit.
(9) The substrate processing apparatus according to (8), wherein the transfer device includes a holding unit that supports the center of the bottom surface of the storage container relative to the second placement unit.
(10) The substrate processing apparatus according to (1), comprising: a lifting device that lifts and lowers the second mounting unit; and a moving device that moves the first mounting unit in a direction opposite to the attaching / detaching device.
(11) Each of the first placement unit and the second placement unit is provided with a positioning portion capable of positioning the plurality of storage containers, and the positioning portion of the first placement unit and the second placement unit The substrate processing apparatus according to (1), wherein the positioning unit of the mounting unit is disposed adjacently.
(12) The substrate processing apparatus according to (1), further including an open / close chamber surrounding the detachable device, wherein the open / close chamber can be filled with an inert gas.
(13) The second placement unit is provided with an elevating device that raises at least a part of the storage container placed on the second placement unit to a position higher than an upper end of the open / close chamber. (12) The substrate processing apparatus.
(14) A processing chamber for processing a substrate is provided, and the load port, the storage chamber, and the processing chamber are arranged in order, provided in the storage chamber, and provided in the second mounting unit of the load port. (7) The substrate processing apparatus according to (7), further including a transfer device accessible to the bottom surface of the storage container.
(15) From a height position at which the storage container is transferred to the second placement unit between the storage chamber and the outside, to a height position at which the detachable device opens and closes the substrate inlet / outlet of the storage container. The substrate processing apparatus according to (7), wherein a movable lifting mechanism is provided.
(16) The substrate processing apparatus according to (10), wherein a detector capable of detecting the state of the substrate in the storage container is provided in the open / close chamber.
(17) The substrate processing apparatus according to (13), further including a cover that covers a lower portion of the second placement unit, wherein the cover moves up and down according to an operation of the lifting mechanism.
(18) A step of transporting a storage container in which a plurality of substrates are stored and a substrate inlet / outlet is closed by a lid to a load port including an attachment / detachment device for attaching / detaching the lid;
The second mounting unit is raised at the load port, and the storage container mounted on the first mounting unit away from the attachment / detachment device is transferred from the first mounting unit to the second mounting unit. A passing step,
A method for transporting the storage container.
(19) A storage container in which a substrate is stored and a substrate outlet is closed by a lid;
A load port for carrying in and out of the storage container between the inside and outside of the housing; and
An attachment / detachment device for attaching / detaching the lid to / from the substrate outlet;
A mounting unit that mounts the storage container at the load port and moves up and down with respect to the attachment / detachment device;
The mounting unit is a substrate processing apparatus that is a part of the bottom surface of the storage container when the storage container is placed, and is cut out so that a space is formed on the side of the attachment / detachment apparatus.

1 is a partially omitted perspective view showing a batch type CVD apparatus according to an embodiment of the present invention. It is side surface sectional drawing. It is side surface sectional drawing which shows the principal part. It is a longitudinal cross-sectional view which shows a processing furnace. It is each partially abbreviated side sectional view for explaining operation of a pod opener, (a) shows before the door is removed, and (b) shows during mapping. It is a partially omitted side cross-sectional view showing when the pod is carried in. It is a partially omitted plan view of the main part. The pod is shown, (a) is a perspective view, (b) is a bottom view. It is a perspective view which shows the principal part of the batch type CVD apparatus which is 2nd embodiment of this invention. It is a perspective view which shows the load port of the batch type CVD apparatus which is 3rd embodiment of this invention. It is each typical side view for demonstrating an effect | action. It is a perspective view which shows the load port of the batch type CVD apparatus which is 4th embodiment of this invention. It is a perspective view which shows the time of the raise of the outer side plate. It is each perspective view of a linear actuator, (a) shows the time of expansion | extension, (b) has shown the time of shortening. It is each typical side view for demonstrating an effect | action of an inner side plate. It is each typical side view for demonstrating the effect | action of an outer side plate. It is a perspective view which shows the load port of the single wafer type CVD apparatus which is 5th embodiment of this invention. It is a perspective view which shows the time of a raise of a storage step. It is a perspective view which shows the time of storage of a storage step. It is each perspective view which shows the modification of an inner side plate and an outer side plate. It is a perspective view which shows the preferable Example of a pod elevator. It is a perspective view which shows the action state. It is a perspective view which shows the preferable Example of a pod elevator. It is a perspective view which shows the action state.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Wafer (substrate), 2 ... Pod (storage container), 3 ... Wafer loading / unloading port, 4 ... Door (lid body), 5 ... Positioning hole, 6 ... Gutter part, 9 ... AGV (in-process conveyance apparatus),
DESCRIPTION OF SYMBOLS 10 ... Batch type CVD apparatus (substrate processing apparatus), 11 ... Housing | casing, 11a ... Front wall (partition wall), 11b ... Pod storage room, 12 ... Pod carrying in / out opening (opening part), 13 ... Front shutter (opening-closing body) ), 14 ... Load port (storage container loading / unloading part), 15 ... Pod elevator (storage container mounting part lifting mechanism part), 16 ... Lifting drive device, 17 ... Shaft, 18 ... Holding stand (storage container mounting part) , 19 ... Receiving kinematic pin (positioning part),
DESCRIPTION OF SYMBOLS 20 ... Load lock chamber, 21 ... Sealed housing | casing (partition wall), 22 ... Door entrance / exit (opening part), 23 ... Pod opener (storage container lid opening / closing part), 25 ... Moving stand, 26 ... Closure, 27 ... Mapping device (substrate state detection unit), 28 ... linear actuator, 29 ... holder, 30 ... detector,
31 ... Rotary pod shelf (storage shelf), 32 ... support, 33 ... shelf, 34 ... shelf kinematic pin (positioning part),
35 ... Pod transfer device (storage container transfer unit), 35a ... Pod transfer elevator (storage container lifting mechanism), 35b ... Pod transfer mechanism (storage container transfer mechanism), 35c ... Arm, 35d ... Plate, 35e ... Plate kinematic pin (Positioning part),
DESCRIPTION OF SYMBOLS 40 ... Sub housing | casing, 40a ... Front wall (compartment wall), 41 ... Wafer loading / unloading port (wafer loading / unloading port), 42 ... Pod opener (storage container lid opening / closing part), 43 ... Mounting table, 44 ... Detachment mechanism.
45 ... Preliminary chamber, 46 ... Wafer transfer mechanism, 46a ... Wafer transfer device, 46b ... Wafer transfer device elevator, 46c ... Tweezer,
47 ... boat (substrate holder), 48 ... boat elevator, 49 ... arm, 50 ... seal cap,
DESCRIPTION OF SYMBOLS 51 ... Processing furnace, 52 ... Heater, 53 ... Heater base, 54 ... Process tube, 55 ... Outer tube, 56 ... Inner tube, 57 ... Processing chamber, 58 ... Cylindrical space, 59 ... Manifold,
60 ... Nozzle, 61 ... Gas supply pipe, 62 ... MFC, 63 ... Gas supply source, 64 ... Gas flow rate control unit, 65 ... Exhaust pipe, 66 ... Pressure sensor, 67 ... Pressure adjustment device, 68 ... Vacuum exhaust device, 69 DESCRIPTION OF SYMBOLS ... Pressure control part, 70 ... Rotation mechanism, 71 ... Rotating shaft, 72 ... Drive control part, 73 ... Thermal insulation board, 74 ... Temperature sensor, 75 ... Temperature control part, 76 ... Main control part, 77 ... Controller.
31A ... Storage shelf, 33A ... Shelves, 80 ... Load lock chamber, 81 ... Sealed housing, 81a ... Back wall, 82 ... Door door, 83 ... Pod opener, 84 ... Mapping device, 85 ... Moving platform, 86 ... Closure, 91 ... wafer loading / unloading port, 92 ... door mechanism.
15B ... Pod elevator, 95 ... Linear actuator, 96 ... Main body, 97 ... Guide, 98 ... Drive rod, 99 ... Bracket.
16C ... Lifting drive device, 17C ... Shaft,
18A ... inner plate (first mounting member, first mounting unit), 19A ... inner kinematic pin,
18B: outer plate (second mounting member, second mounting unit), 19B: receiving kinematic pin, 18C: escape portion.
DESCRIPTION OF SYMBOLS 110 ... Single wafer type CVD apparatus, 111 ... Housing | casing, 114 ... Load port (storage container mounting part), 115 ... Pod elevator, 122 ... Door entrance / exit, 123 ... Pod opener, 131 ... Sliding pod shelf (storage shelf) ).
132: Inert gas (nitrogen gas) supply device, 133: Exhaust device.

Claims (5)

A storage container in which a plurality of substrates are stored and a substrate outlet is closed by a lid;
A load port for placing the storage container;
An attachment / detachment device for attaching / detaching the lid to / from the substrate loading / unloading port at the load port;
A first placement unit that places the storage container at the load port and performs a perspective operation in a direction opposite to the attachment / detachment device;
A second mounting unit that is provided separately from the first mounting unit, mounts the storage container at the load port, and moves up and down relative to the detachable device;
A substrate processing apparatus comprising: Transporting a storage container in which a plurality of substrates are stored and a substrate outlet is closed by a lid to the load port;
A step of operating the first placement unit at the load port, and bringing the storage container placed on the first placement unit closer to an attachment / detachment device;
Removing the lid from the substrate loading / unloading port of the storage container placed on the first placement unit;
Attaching the lid to the substrate loading / unloading port of the storage container placed on the first placement unit;
The step of operating the first mounting unit and moving the storage container mounted on the first mounting unit away from the attachment / detachment device;
Raising the second mounting unit and delivering the storage container from the first mounting unit to the second mounting unit;
Transporting the substrate stored in the storage container to a processing chamber;
Processing the substrate in a processing chamber;
A method for manufacturing a semiconductor device comprising:   The substrate processing apparatus according to claim 1, wherein the second placement unit supports a bottom peripheral side of the storage container with respect to the first placement unit.   The substrate processing apparatus according to claim 3, wherein the first placement unit supports the center of the bottom surface of the storage container relative to the second placement unit.   The substrate according to claim 3, wherein the second mounting unit has a notch formed in a central portion on the detachable device side, and the first mounting unit can be positioned in the notch. Processing equipment.

Images