JP2008263138A - Mounting condition determination method - Google Patents

Abstract

Provided is a mounting condition determination method capable of optimizing mounting conditions for each type of mounting board.
A mounting condition determining method includes a derivation step S104 for deriving a common mounting condition for producing mounting boards of a plurality of board types, and a board in a case where a component mounter mounts a component according to the mounting condition. A tact specifying step S106 for specifying a tact for each product type, a determination step S108 for determining whether or not the specified tact is less than or equal to a target time predetermined for the substrate product type for each board product type, and a target The change steps S110 and S104 for changing the mounting conditions described above so that the tact determined not to be less than the time is shortened, and the determination step S112 for determining the changed mounting conditions as final mounting conditions.
[Selection] Figure 14

Description

  The present invention relates to a mounting condition determining method for determining conditions for mounting a component on a board.

  The component mounter is a device that produces a mounting board by mounting components such as electronic components on the board. By connecting a plurality of such component mounting machines, for example, a production line for producing a complex mounting board at high speed can be configured.

  Conventionally, a mounting condition determination method for determining a mounting condition for mounting a component on a board has been proposed for the above-described component mounter or production line (see, for example, Patent Document 1). The mounting condition is, for example, an arrangement of components (component arrangement) arranged on the component mounting machine.

In the mounting condition determination method (operation analysis method) described in Patent Document 1, a common component arrangement is mounted on a plurality of types of mounting boards so that the time required to produce a plurality of types of mounting boards (total production time) is minimized. Determine as a condition. Therefore, a manufacturer that produces a plurality of types of mounting boards, incorporates them into an electronic device, and sells the electronic device can reduce the manufacturing cost of the electronic device by this mounting condition determination method.
Japanese Patent Laid-Open No. 2002-111298 (FIGS. 31, 33 to 35)

  However, the mounting condition determination method of Patent Document 1 has a problem that the mounting conditions cannot be optimized for each type of mounting board.

  Specifically, a company that contracts the production of a mounting board from each manufacturer (hereinafter referred to as a contractor) has a component mounting machine, a production line, etc., and mounts multiple types of mounting boards requested by each manufacturer. Etc. to produce. Here, the contractor is requested by each manufacturer to produce a mounting board, and a cost target for the mounting board is also set. Accordingly, the contractor must produce a mounting board at a set cost or less for each type of mounting board.

  However, in the mounting condition determination method of Patent Document 1, the mounting conditions are determined so that the total production time is the shortest. Therefore, it is not possible to optimize the mounting conditions for each type of mounting board. It takes a lot of time to produce such a variety of mounting boards, which may cost more than the set cost. Therefore, the contractor cannot determine the mounting conditions by such a mounting condition determination method.

  Therefore, the present invention has been made in view of such problems, and an object thereof is to provide a mounting condition determination method capable of optimizing the mounting conditions for each type of mounting board.

  In order to achieve the above object, a mounting condition determination method according to the present invention is a common method for producing a plurality of types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board. A mounting condition determining method for determining a mounting condition, wherein a derivation step for deriving a common temporary mounting condition for producing a plurality of types of mounting boards and a case where the component mounter mounts a component according to the temporary mounting condition In addition, the tact specifying step for specifying the tact time required for production of one mounting board for each type of mounting board, and the tact time specified in the tact specifying step for each type of mounting board are A determination step for determining whether or not the target time is less than or equal to a predetermined target time, and a tact time determined not to be less than or equal to the target time in the determination step A changing step of changing the temporary mounting conditions, characterized in that it comprises a determining step of determining a modified the temporary mounting conditions in the changing step as the mounting conditions. For example, in the changing step, the provisional mounting condition is changed so that the tact time determined not to be less than the target time in the determining step is equal to or less than the target time.

  Thereby, for example, a common temporary mounting condition for producing a plurality of types of mounting boards is derived by a conventional optimization program, and as a result, the tact time for any of the mounting board types under the temporary mounting conditions ( Even if the tact) is longer than the target time (target time), the provisional mounting conditions are changed so that the tact time is shortened, and the changed provisional mounting conditions are determined as the mounting conditions. Mounting conditions can be optimized for each type of substrate.

  In addition, the tact specifying step, the determining step, and the changing step are repeated using the temporary mounting condition changed in the changing step as a new temporary mounting condition, and in the determining step, each of the types of all mounting boards is determined. On the other hand, when it is determined in the determination step that the tact time is equal to or less than the target time, the provisional mounting condition changed in the recent change step is determined as the mounting condition. Good.

  As a result, even if the tact time for any type of mounting board does not fall below the target time under the provisional mounting conditions changed in the changing step, until the tact time for all types of mounting boards falls below the target time, Since the temporary mounting conditions are repeatedly changed, the temporary mounting conditions can be changed by simple processing without requiring strict processing in changing the temporary mounting conditions per time. It is possible to easily determine mounting conditions such that the tact time for the product is less than the target time.

  In the deriving step, the provisional mounting conditions are derived so that the time required for producing the plurality of types of mounting boards is minimized, and the changing step is determined to be less than the target time in the determining step. A priority condition determining step for determining a priority condition in which the production of the mounting board of the type corresponding to the time has priority over the production of the mounting board of other types, and under the priority condition, Re-derivation to change the temporary mounting condition derived in the derivation step by deriving a new common temporary mounting condition for producing the plural types of mounting boards so that the time required for production is minimized. Including a step.

  For example, in the derivation step and the re-derivation step, a provisional mounting condition is derived using a conventional optimization program so that the time required for producing a plurality of types of mounting boards is as short as possible. In particular, in the re-derivation step, provisional mounting conditions are derived such that the above-mentioned time is minimized while satisfying the priority conditions. Therefore, the total time required for production of a plurality of types of mounting boards can be shortened as much as possible under the mounting conditions determined in the determining step. Also, provisional mounting conditions are not derived in the derivation step so that the time required to produce a plurality of types of mounting boards is the shortest, and only in the re-derivation step, the above time is minimized while satisfying the priority conditions. When such provisional mounting conditions are derived, the provisional mounting conditions derived in the derivation step may be significantly changed in the re-derivation step. However, in the present invention, even in the derivation step, provisional mounting conditions that lead to the shortest time required to produce a plurality of types of mounting boards are derived, so that changes in the provisional mounting conditions can be kept small.

  In the priority condition determining step, the weights for the types of the respective mounting boards are set so that the weight of the type corresponding to the tact time determined not to be equal to or less than the target time in the determining step is larger than the weights of the other types. Is determined as the priority condition, and in the re-derivation step, the new weight is set so that the larger the weight, the shorter the tact time of the product corresponding to the weight according to the weight for the product type of each mounting board determined as the priority condition. The provisional mounting condition may be derived.

  For example, the weight determined for each type of mounting board is the weight of each type of mounting board set for the conventional optimization program. When the optimization program is executed, a large weight is obtained. The provisional mounting conditions are derived so that the set type has a shorter takt time for the type. Therefore, in the present invention, in the priority condition determining step, the weights for the types of the respective mounting boards are determined so that the weights of the types corresponding to the tact time longer than the target time are larger than the weights of the other types. In the derivation step, for example, the determined weight is set for the above-described optimization program, and the optimization program is executed. As a result, the tact time longer than the target time can be easily shortened by using the conventional optimization program, that is, by adjusting the parameters of the optimization program.

  Further, in the priority condition determining step, a component that is used more frequently in the production of a mounting board of a type corresponding to the tact time determined not to be less than or equal to the target time in the determining step is a component closer to the substrate in the component mounting machine. It may be characterized in that it is determined as the priority condition that it is arranged in the supply unit or arranged continuously so as to be simultaneously adsorbed.

  As a result, when a new provisional mounting condition is derived in the re-derivation step, the new provisional mounting condition is often used to produce a variety of mounting boards corresponding to the tact time longer than the target time in the previous provisional mounting condition. The components to be used are always arranged near the board in the component mounter. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  In addition, among a plurality of types of suction members that are attached to the component mounting machine and suck components, it is often used for the production of mounting boards of types that correspond to the tact time determined not to be less than the target time in the determination step. It may be characterized in that it is determined as the priority condition that more types of suction members are attached to the component mounter.

  As a result, when a new provisional mounting condition is derived in the re-derivation step, the new provisional mounting condition is often used to produce a variety of mounting boards corresponding to the tact time longer than the target time in the previous provisional mounting condition. Many nozzles of the type used are always attached to the component mounting machine. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  Also, the components used in the production of the mounting board of the type corresponding to the tact time determined not to be less than the target time in the determination step are arranged in the component mounting machine so that more parts can be supplied to the board simultaneously. This may be determined as the priority condition.

  As a result, when a new provisional mounting condition is derived in the re-derivation step, the new provisional mounting condition is often used to produce a variety of mounting boards corresponding to the tact time longer than the target time in the previous provisional mounting condition. The parts to be used are arranged so that many parts can be supplied to the substrate at the same time, that is, the parts are divided. As a result, the tact time that was longer than the target time in the previous provisional mounting condition can be reliably shortened in the new provisional mounting condition.

  The present invention can be realized not only as such a mounting condition determination method, but also as a device or program for determining mounting conditions according to the method, and a storage medium for storing the program.

  The mounting condition determining method of the present invention has an effect that the mounting conditions can be optimized for each type of mounting board.

  Hereinafter, a component mounting system according to an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is an external view of a component mounting system according to an embodiment of the present invention.
The component mounting system 1000 according to the present embodiment includes a plurality of component mounters 100 (six component mounters 100 in the example shown in FIG. 1) and a mounting condition determination device 200.

  The plurality of component mounting machines 100 are configured as a production line for mounting components such as electronic components while sending a circuit board (hereinafter simply referred to as a board) 20 from upstream to downstream. That is, each component mounting machine 100 receives the substrate 20 from the upstream side, mounts the component on the substrate 20, and sends the substrate 20 on which the component is mounted to the downstream side. In addition, the board | substrate 20 with which components were mounted by the production line which consists of such a some component mounting machine 100 is hereafter called a mounting board | substrate.

  The mounting condition determining apparatus 200 can determine mounting conditions for mounting components on a production line that is a plurality of component mounting machines 100, and can optimize the mounting conditions for each type of mounting board. Here, when determining the mounting condition, the mounting condition determining apparatus 200 determines a mounting condition common to the production of a plurality of types of mounting boards. As a result, all types of mounting boards are produced under the determined mounting conditions. For example, the mounting condition determination device 200 determines a component arrangement, a nozzle arrangement, and a component mounting order, which will be described later, as the mounting conditions.

  Then, the mounting condition determination apparatus 200 instructs the component mounting system 1000 to use, manage, or operate the component mounting system 1000 and each component mounting machine 100 so that the components are mounted on the board 20 according to the mounting conditions. .

FIG. 2 is an external view of the component mounter 100.
The component mounting machine 100 includes two sub facilities (a front sub facility 110 and a rear sub facility 120) that perform component mounting simultaneously and independently. Each of the sub-equipment 110 and 120 is an orthogonal robot type mounting stage, and includes a component supply unit 115, a multi mounting head 112, an XY robot 113, a component recognition camera 116, and the like. The rear sub-equipment 120 includes a tray supply unit 117. The component supply unit 115 includes an array of a plurality of component cassettes (feeders) 114 that store component tapes.

  The multi mounting head 112 (hereinafter simply referred to as a head) can include a maximum of 10 suction nozzles (hereinafter simply referred to as nozzles). For example, a maximum of 10 components can be suctioned from the component cassette 114 and the substrate 20 can be sucked. Can be attached to. The XY robot 113 moves the head 112. The component recognition camera 116 is used for two-dimensionally or three-dimensionally inspecting the suction state of the component sucked by the head 112. The tray supply unit 117 supplies tray parts. Each such sub-equipment executes component mounting on the board 20 in charge of each sub-equipment independently (in parallel) with other sub-equipment.

  The component tape is, for example, a plurality of components of the same component type arranged on a tape (carrier tape) and supplied in a state of being wound on a reel or the like.

  Specifically, the component mounting machine 100 is a mounting machine having both functions of a component mounting machine called a high-speed mounting machine and a component mounting machine called a multi-function mounting machine. A high-speed mounting machine is a facility characterized by high productivity that mainly mounts electronic parts of □ 10 mm or less at a speed of about 0.1 seconds per point. A multi-function mounting machine is a large model of □ 10 mm or more. It is equipment for mounting electronic parts, odd-shaped parts such as switches and connectors, and IC parts such as QFP (Quad Flat Package) and BGA (Ball Grid Array).

  In other words, the component mounting machine 100 is designed so that almost all types of electronic components (from 0.4 mm × 0.2 mm chip resistance to 200 mm connector as components to be mounted) can be mounted.

FIG. 3 is a plan view showing the main configuration of the component mounter 100.
When the tray supply unit 117 is attached to the sub-equipment, the shuttle conveyor 118 carries the parts taken out from the tray supply unit 117 and transports them to a position where the parts can be adsorbed by the head 112. It is a table. The nozzle station 119 is a table on which replacement nozzles corresponding to various types of component types are placed.

  The component recognition camera 116 is disposed near the center of the component supply unit 115 along the arrangement direction of the component cassettes 114. The head 112 that has picked up the component from the component supply unit 115 moves to the mounting point of the substrate 20 after passing through the component recognition camera 116, and repeats the operation of sequentially mounting all of the sucked components. Note that the mounting point is a position on the board on which a component is to be mounted.

FIG. 4 is a schematic diagram showing the positional relationship between the head 112 and the component cassette 114.
For example, a maximum of ten nozzles 112a can be attached to the head 112. The head 112 to which the ten nozzles 112a are attached can simultaneously pick up components from each of up to ten component cassettes 114 (by one up and down movement).

  The position of the component cassette 114 (component tape) in the component supply unit 115 is referred to as “position on the Z axis (Z number)”. The “Z axis” is a coordinate axis for specifying the position of the component cassette 114 set for each component mounter (sub-equipment). The arrangement of the component cassette 114 or the component tape along the Z-axis direction is called a component arrangement, and the arrangement of the nozzles 112a attached to the head 112 is called a nozzle arrangement.

  FIG. 5 is an external view showing an external appearance of an electronic component to be mounted. FIG. 6 is a diagram illustrating an example of a component tape and a reel containing electronic components.

  Various chip-type electronic components 423a to 423d as shown in FIGS. 5 (a) to 5 (d) are stored in a storage recess 424a continuously formed at a predetermined interval on the carrier tape 424 shown in FIG. A cover tape 425 is attached to the upper surface for packaging. The carrier tape 424 to which the cover tape 425 is thus attached is supplied to the user in a taping form wound around the reel 426 by a predetermined quantity. The carrier tape 424 and the cover tape 425 constitute a component tape. The configuration of the component tape may be other than the configuration shown in FIG.

  Such a component mounting machine 100 moves the head 112 to the component supply unit 115 and sucks the component onto the head 112. Then, the component mounter 100 moves the head 112 onto the component recognition camera 116 at a constant speed, causes the component recognition camera 116 to capture images of all the components attracted by the head 112, and accurately determines the component suction position. Let it be detected. Further, the component mounting machine 100 moves the head 112 to the substrate 20 and sequentially mounts all the sucked components on the mounting points. The component mounter 100 mounts all the predetermined components on the substrate 20 by repeatedly executing such operations of suction, movement, and mounting by the head 112.

  FIG. 7 is a block diagram showing a functional configuration of the mounting condition determining apparatus 200 in the present embodiment.

  The mounting condition determining apparatus 200 in the present embodiment includes an input unit 201, a display unit 202, an optimization unit 203, an evaluation unit 204, a priority processing unit 205, a communication unit 206, a first storage unit 207, a second storage unit 208, And a third storage unit 209.

  The input unit 201 includes, for example, a keyboard and a mouse, receives an operation from an operator, and notifies the optimization unit 203 of the operation result.

  The display unit 202 is configured by a liquid crystal display, for example, and displays an operation state of the optimization unit 203 or the like, or is stored in the first storage unit 207, the second storage unit 208, the third storage unit 209, or the like. Or display the data that is being displayed.

  The optimization unit 203 optimizes the mounting conditions for mounting the components on the plurality of component mounting machines 100 as the production line by executing an optimization program provided conventionally. Further, when a priority condition described later is determined by the priority processing unit 205, the optimization unit 203 optimizes the above-described mounting condition under the priority condition. Then, the optimization unit 203 generates mounting condition data 209 a indicating the finally optimized mounting conditions and stores the mounting condition data 209 a in the third storage unit 209.

  In this embodiment, the optimization unit 203 is configured as a derivation unit. That is, the optimization unit 203 derives common provisional mounting conditions for producing a plurality of types of mounting boards. Here, the optimization unit 203 repeatedly executes the optimization program and sequentially derives the temporary mounting conditions, thereby changing the temporary mounting conditions, and finally changing the temporary mounting conditions to the mounting condition data 209a. Is generated as That is, in the present embodiment, the optimization unit 203 is configured as a determination unit that determines the changed provisional mounting condition as the mounting condition.

  Based on the mounting conditions optimized by the optimization unit 203, the evaluation unit 204 evaluates the tact of the board type for each type of mounting board to be produced on the production line (hereinafter referred to as board type). As a result, the evaluation unit 204 specifies a board type (hereinafter referred to as a priority type) whose tact should be shortened with priority. The tact is the time required to produce one mounting board on the production line.

  Here, in the present embodiment, the evaluation unit 204 is configured as a tact identification unit. That is, the evaluation unit 204 identifies the tact for each type of mounting board when the production line mounts components in accordance with the provisional mounting conditions described above. Furthermore, in this embodiment, the evaluation unit 204 is configured as a discrimination unit. That is, the evaluation unit 204 determines, for each type of mounting board, whether or not the specified tact is equal to or less than a target time described later for the type.

  The priority processing unit 205 determines a condition that shortens the tact of the priority product as the above-described priority condition, and notifies the optimization unit 203 of the priority condition.

  In the present embodiment, the priority processing unit 205 and the optimization unit 203 described above are configured as changing means. In other words, the provisional implementation described above, in which the priority processing unit 205 determines the priority condition and the optimization unit 203 repeats the optimization under the priority condition, thereby shortening the tact determined that it is not less than the target time. Condition changes are made.

  The first storage unit 207 stores NC data 207a indicating information regarding each mounting point, and a component library 207b indicating information regarding each component. The second storage unit 208 stores target time data 208a indicating the target time determined for each board type. The third storage unit 209 stores the mounting condition data 209a generated by the optimization unit 203.

  The communication unit 206 communicates with each component mounter 100. For example, the communication unit 206 transmits the mounting condition data 209a stored in the third storage unit 209 to each component mounting machine 100, thereby mounting each component according to the mounting condition indicated by the mounting condition data 209a. The component mounter 100 is executed.

FIG. 8 is a diagram illustrating an example of the NC data 207a.
The NC data 207a indicates information on the mounting points of all components to be mounted in the board type for each board type. As shown in FIG. 8, one mounting point pi includes a component type ci, an X coordinate xi, a Y coordinate yi, control data φi, and a mounting angle θi. Here, the component type corresponds to the component name in the component library 207b (see FIG. 9), the X coordinate and the Y coordinate are the coordinates of the mounting point (coordinates indicating a specific position on the board), and the control data is The restriction information related to the mounting of the component, for example, the type of nozzle 112a that can be used, the maximum movement acceleration of the head 112, and the like are shown. Further, the mounting angle θi indicates an angle at which the nozzle 112a that sucks the component of the component type ci should rotate.

FIG. 9 is a diagram illustrating an example of the component library 207b.
The component library 207b is a library that collects unique information about each of all component types that can be handled by the component mounter 100. As shown in FIG. 9, the component library 207b includes a component size for each component type, a tact for the component type, and constraint information.

  The tact shown in the component library 207b is a time specific to the component type required to mount the component on the board 20 under a certain condition, and the constraint information includes, for example, the types of usable nozzles 112a (SX and , SA, etc.), recognition method by the component recognition camera 116 (reflection, etc.), maximum acceleration ratio of the head 112, and the like. FIG. 9 also shows the appearances of the components of each component type for reference. In addition, the component library 207b may include information such as the color of the component and the shape of the component.

FIG. 10 is a diagram illustrating an example of the target time data 208a.
The target time data 208a indicates, for each board type, the board type, the number of components mounted on the board type (hereinafter referred to as the number of parts), and the target time determined for the board type.

  For example, the target time data 208a indicates the board type “A”, the number of parts “550” of the board type, and the target time “23 seconds” of the board type. The target time data 208a indicates the board type “B”, the number of parts “647” of the board type, and the target time “21 seconds” of the board type.

  Such a target time is, for example, a time set based on a cost target required by a manufacturer when the contractor subcontracts production of a mounting board from the manufacturer. That is, if the tact of the mounting board exceeds the target time corresponding to the board type of the mounting board, the contractor cannot make a predetermined profit for the production of the mounting board. Therefore, it is necessary for the contractor to keep the tact of the mounting substrate (substrate type) below this target time.

  In the target time data 208a in the present embodiment, the number of parts of the board type is shown, but the number of parts may not be shown. Further, the target time is not necessarily proportional to the number of parts.

FIG. 11 is an explanatory diagram for explaining optimization of mounting conditions.
First, based on the operation result notified from the input unit 201, the optimization unit 203 determines, for example, that the board types of the mounting boards to be produced on the production line are “A to E”. As a result, the optimization unit 203 first sets the board types A to E so that the total time required to produce all the mounted boards of the board types A to E (hereinafter referred to as total line tact) is the shortest. A common mounting condition (provisional mounting condition) is derived.

  When the mounting conditions are derived in this way, the evaluation unit 204 specifies a tact for each of the board types A to E under the mounting conditions, for example, by executing a tact simulation program. Further, the evaluation unit 204 reads the target time data 208a stored in the second storage unit 208, and knows the target times of the above-described substrate types A to E.

  Then, the evaluation unit 204 determines, for each board type A to E, whether or not the tact of the board type is within the target time of the board type, and selects the board type with the tact not within the target time. Identified as the above-mentioned priority variety Here, when the evaluation unit 204 determines that the tact of the plurality of substrate types is longer than each target time, for example, the substrate corresponding to the tact having the largest difference from the target time among the plurality of substrate types. The variety is identified as the preferred variety.

  For example, when the evaluation unit 204 specifies the board type E as the priority type, the priority processing unit 205 shortens the tact of the board type E, that is, the production of the mounting board of the board type E is different from the other board types. Priority conditions are determined so as to be advantageous compared to the production of the mounting board.

  When the priority condition for the board type E is determined in this way, the optimization unit 203 performs optimization again under the priority condition, and the mounting condition (temporary condition) that minimizes the total line tact under the priority condition. Derive mounting conditions).

  The optimization unit 203, the evaluation unit 204, and the priority processing unit 205 repeatedly execute the processing described above. As a result, when the tacts of all board types A to E fall below their respective target times, the optimization unit 203 uses the latest mounting conditions (temporary mounting conditions) derived at that time as final mounting. Determine as a condition.

  FIG. 12 is a diagram illustrating an example of a tact for each board type that is changed by repeated optimization.

  For example, as shown in FIG. 12A, the evaluation unit 204 identifies the tacts of the board types A to E based on the mounting conditions derived by the optimization unit 203 in a situation where the priority conditions are not determined. . Then, the evaluation unit 204 determines that the tact of the board types C to E is longer than each target time, and calculates the difference between the tact of the board types C to E and the target time of the board types C to E, respectively. .

  That is, the evaluation unit 204 calculates the difference “1 second” between the tact “19 seconds” of the board type C and the target time “18 seconds”, and the tact “23 seconds” and the target time “21 seconds” of the board type D. The difference “2 seconds” is calculated, and the difference “3 seconds” between the tact “18 seconds” of the board type E and the target time “15 seconds” is calculated.

  As a result, the evaluation unit 204 specifies the board type E having the largest difference between the tact and the target time as the priority type from among the board types C to E.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the board type E, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tact “13 seconds” of the board type E falls within the target time “15 seconds” of the board type E, and the tacts of the board types C and D are longer than the respective target times. To do.

  Then, the evaluation unit 204 calculates the difference between the tact of the board types C and D and the target time of the board types C and D. That is, the evaluation unit 204 calculates the difference “1 second” between the tact “19 seconds” of the board type C and the target time “18 seconds”, and the tact “24 seconds” and the target time “21 seconds” of the board type D. The difference “3 seconds” is calculated.

  Then, the evaluation unit 204 identifies the board type D having the largest difference between the tact and the target time as the priority type among the board types C and D.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the board type D, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tact “20 seconds” of the board type D is within the target time “21 seconds” of the board type D, and that only the tact of the board type C is longer than the target time. The type C is specified as the priority type.

  As a result, the priority processing unit 205 determines a priority condition that shortens the tact of the substrate type C, which is the priority type, and the optimization unit 203 performs optimization again under the priority condition, and the priority condition Below, we derive the mounting conditions that minimize the total line tact.

  Based on the mounting conditions derived by the optimization unit 203 as described above, the evaluation unit 204 identifies the tacts of the board types A to E again, for example, as shown in FIG. For each E, it is determined whether the takt of the board type is within the target time of the board type. As a result, the evaluation unit 204 determines that the tacts of all the board types A to E are within the respective target times, and instructs the optimization unit 203 to end the optimization.

  Upon receiving the optimization end instruction, the optimization unit 203 determines the mounting condition derived by the last optimization as the final mounting condition, and generates mounting condition data 209a indicating the mounting condition. Store in the third storage unit 209. Further, the optimization unit 203 displays the mounting condition data 209 a on the display unit 202 or transmits the mounting condition data 209 a to each component mounting machine 100 via the communication unit 206.

  Note that when the mounting conditions are optimized again under the priority conditions as described above, the takt of the board type that is less than or equal to the target time may increase as shown in FIG. For example, as shown in FIG. 12A, as a result of the optimization of the initial mounting conditions, the tact of the board type A was 19 seconds. Increases from 21 seconds → 22 seconds → 23 seconds as shown in FIGS. 12 (b), 12 (c), and (d).

  Further, if the mounting conditions are optimized again under the priority conditions as described above, the total line tact may also increase. For example, as shown in FIG. 12 (a), the total line tact is 94 seconds as a result of the optimization of the mounting conditions first, but the total line tact is obtained by repeatedly performing the optimization. Increases from 95 seconds → 96 seconds → 97 seconds as shown in FIGS. 12B, 12C and 12D.

  However, even if the board type tact and total line tact increase in this way, if the tact of each board type under the finally determined mounting conditions is less than or equal to the target time, the contractor will have a predetermined profit. Can give. In other words, the contractor can produce a plurality of board types of mounting boards at a cost lower than their respective target costs and sell them to the manufacturer, and can make a predetermined profit.

Here, the above-described priority condition determined by the priority processing unit 205 will be described.
The priority processing unit 205 determines a priority condition in which the production of the mounting board of the type corresponding to the tact determined to be longer than the target time is given priority over the production of the mounting board of other types. That is, the priority processing unit 205 determines, for example, a weight, a component arrangement, a nozzle arrangement, and a component division number for the priority product as priority conditions for shortening the priority product tact.

  Specifically, when the priority processing unit 205 determines the weight for the priority product as the priority condition, the priority processing unit 205 has a weight larger than the weight of the priority product set in the optimization program executed previously by the optimization unit 203 described above. Are determined as new weights for the priority varieties. In other words, the priority processing unit 205 determines the weight for the type of each mounting board as a priority condition so that the weight of the type corresponding to the tact determined not to be less than the target time is larger than the weight of the other type. .

  Here, the weight is a value set for each board type in the optimization by the optimization unit 203, and is, for example, the number of mounted boards to be produced (production quantity), strictly speaking, the production quantity. It is proportional to the total number of parts. In other words, the optimization unit 203 sets the weight for each board type in the optimization program and executes the program, so that the weight set for the board type (production number or total number of parts) increases. Optimization is performed so that the tact of the board type is shortened.

  For example, in a situation where the priority condition is not determined, the optimization unit 203 first sets the same weight “1” for each of the board types A to E and performs optimization. That is, the optimization unit 203 performs the optimization under the condition that the number of produced boards of the board types A to E is equal.

  Here, the priority processing unit 205 determines the weight “10” as the priority condition for the substrate type E, which is the priority type. As a result, the optimization unit 203 sets the same weight “1” for each of the board types A to D, and sets the weight “10” only for the board type E to perform optimization. In other words, the optimizing unit 203 has the condition that the number of produced boards of the board types A to D is equal, and the number of produced boards of the board type E is 10 times higher than the number of produced boards (priority). Optimization). The tact of the board type E determined by such optimization tends to be shorter than the tact of the board type E determined by the previous optimization.

  FIG. 13 is an explanatory diagram for explaining a component arrangement, a nozzle arrangement, and a component division number determined as priority conditions.

  First, when the priority processing unit 205 determines the component arrangement as a priority condition, for example, among the plurality of component cassettes 114, the component cassette 114 that supplies a large number of components to the substrate 20 of the priority product type is used as the multi-supply component cassette. As specified. Then, the priority processing unit 205 determines the Z number of the multi-supply component cassette as a priority condition so that the multi-supply component cassette is located near the board 20 arranged in the component mounter 100. It should be noted that an arrangement in which a plurality of multi-supply component cassettes are continuous may be determined as a priority condition so that components supplied from a plurality of multi-supply component cassettes can be simultaneously picked up by a single suction operation.

  In other words, the priority processing unit 205 indicates that the components used more frequently in the production of the mounting board of the type corresponding to the tact determined not to be less than the target time are arranged closer to the board 20 in the component mounting machine 100. Determine as a priority condition.

  For example, as shown in FIG. 13, the positions of ten component cassettes 114 arranged in the component mounter 100 are identified by Z numbers “Z1, Z2, Z3,..., Z10”, respectively. In this case, the priority processing unit 205 determines “Z6, Z7, Z5” or the like as the Z number of the multi-supply component cassette. That is, the priority processing unit 205 preferentially determines the Z number close to the approximate center of the substrate 20 in the component arrangement direction (Z-axis direction) as the Z number of the multi-supply component cassette.

  Specifically, as shown in FIG. 13, the optimization unit 203 has a component cassette 114 for supplying a component of the component type c1 in the Z number Z1 by the first optimization in a situation where the priority condition is not determined. The component arrangement in which the component cassette 114 for supplying the component type c2 is in the Z number Z2 and the component cassette 114 for supplying the component type c3 is in the Z number Z3 is derived as a mounting condition.

  Here, as described above, the priority processing unit 205 supplies the component cassette 114 that supplies components of the component type c2 to the substrate 20 of the priority type E, and the multiple supply that supplies the most components to the substrate 20. It is specified as a component cassette, and it is determined as a priority condition that the multi-supply component cassette should be in Z number Z6.

  When such a priority condition is determined, the optimization unit 203 performs the second optimization so that the multi-supply component cassette that supplies the component type c2 is always arranged at the Z number Z6. That is, the optimization unit 203 performs the second optimization by fixing the multi-supply component cassette that supplies the component type c2 to the Z number Z6.

  As a result of the second optimization, for example, when the tact of the board type E does not fall below the target time and the board type E is still the priority type, the priority processing unit 205 supplies a component cassette for supplying the component type c2. Among the plurality of component cassettes 114 other than 114, the component cassette 114 that supplies the most components to the substrate 20 of the priority type E is specified as the second multi-supply component cassette. For example, the priority processing unit 205 specifies the component cassette 114 that supplies components of the component type c9 for the substrate 20 of the priority product type E as the second multi-supply component cassette, and the multi-supply component cassette is Z number Z7. It is decided as a priority condition what should be.

  When such priority conditions are determined, the optimization unit 203 always arranges the first multi-supply component cassette that supplies the component type c2 in the Z number Z6 and supplies the component type c9 component. The third optimization is performed so that the second multi-feed component cassette is always arranged at the Z number Z7. That is, the optimization unit 203 fixes the multi-supply component cassette that supplies the component type c2 to Z number Z6 and fixes the multi-supply component cassette that supplies the component type c9 component to Z number Z7 for the third time. Perform optimization.

  As described above, the multi-feed component cassette is arranged near the substrate 20 (near the center) such as Z numbers Z6 and Z7, so that the head 112 sucks and moves the components supplied from the multi-feed component cassette. The time required for mounting can be reduced. As a result, the tact can be shortened in the mounting board of the priority type produced by attracting and mounting many components from the multi-supply component cassette.

  Next, when the priority processing unit 205 determines the nozzle arrangement as a priority condition, for example, among the plural types of nozzles 112a that can be attached to the head 112, the priority processing unit 205 is often used for mounting components on the priority type substrate 20. The type of the nozzle 112a is specified as the multiple mounting nozzle type. The priority processing unit 205 arranges the multiple mounting nozzle type nozzles 112a so that the number of the multiple mounting nozzle type nozzles 112a attached to the head 112 is increased and the nozzles 112a are attached at predetermined positions. Is determined as a priority condition.

  That is, the priority processing unit 205 is mounted on the head 112 of the component mounting machine 100, and among the plurality of types of suction members (nozzles 112a) that suck the components, mounting the type corresponding to the tact determined not to be less than the target time. It is determined as a priority condition that a suction member of a type that is often used for production of a board is attached to the head 112 of the component mounting machine 100 more.

  For example, as shown in FIG. 13, the positions of the nozzles 112a attached to the head 112 of the component mounter 100 are identified by the attachment positions “h1, h2, h3,. In this example, eight nozzles 112 a can be attached to the head 112.

  In such a case, as shown in FIG. 13, the optimization unit 203 performs the first optimization in the situation where the priority condition is not determined, so that the type 112 nozzle 112a is located at the mounting positions h1 and h2, and the type k2 The nozzle arrangement in which the nozzle 112a is at the mounting position h3 and the type 112 nozzle 112a is at the mounting position h4 is derived as a mounting condition.

  Here, the priority processing unit 205 identifies the type k2 of the nozzle 112a that is most frequently used for mounting components on the substrate 20 of the priority type E as the multiple mounting nozzle type. Then, the priority processing unit 205 determines the arrangement of the nozzles 112a of the multiple mounting nozzle type k2 as a priority condition so that there are two nozzles 112a of the multiple mounting nozzle type k2 and these nozzles 112a are mounted adjacent to each other. To do. That is, the number of the nozzles 112a of the multiple mounting nozzle type k2 is one more than the number “1” in the nozzle arrangement derived by the first optimization, and the two nozzles 112a of the multiple mounting nozzle type k2 are increased. The arrangement is determined such that the mounting positions of “h2, h3” are determined.

  When such a priority condition is determined, the optimization unit 203 performs the second optimization so that the nozzle 112a of the multiple mounting nozzle type k2 is always attached to the attachment positions h2 and h3. That is, the optimization unit 203 performs the second optimization by fixing the nozzle 112a of the multiple mounting nozzle type k2 at the attachment positions h2 and h3.

  As a result of the second optimization, for example, when the tact of the substrate type E does not fall below the target time and the substrate type E is still the priority type, the priority processing unit 205 has 3 nozzles 112a of the multi-mounted nozzle type k2. The arrangement of the nozzles 112a of the multi-mounted nozzle type k2 is determined as a priority condition so that the nozzles 112a are attached next to each other. That is, the number of nozzles 112a of the multiple mounting nozzle type k2 is one more than the number “2” in the nozzle arrangement derived by the second optimization, and the three nozzles of the multiple mounting nozzle type k2 The arrangement is determined such that the mounting position of 112a is “h2, h3, h4”.

  When such a priority condition is determined, the optimization unit 203 performs the third optimization so that the nozzle 112a of the multiple mounting nozzle type k2 is necessarily attached to the attachment positions h2, h3, and h4. That is, the optimization unit 203 performs the third optimization by fixing the nozzle 112a of the multiple mounting nozzle type k2 to the attachment positions h2, h3, and h4.

  In this way, by increasing the number of nozzles 112a of the multiple mounting nozzle type, when producing a mounting board of a priority product type, a large number of components can be mounted on the substrate 20 in one task. The tact time on the mounting board can be shortened. The above-described task is a series of operations until the head 112 picks up and moves the component and mounts the component. The component mounter 100 repeats this task to repeat all the predetermined tasks. The component is mounted on the substrate 20.

  Furthermore, by attaching a plurality of nozzles 112a of multiple mounting nozzle type next to each other, when producing a priority type of mounting board, simultaneous suction can be performed by these nozzles 112a. That is, if a plurality of component cassettes 114 that supply components to be sucked by the multiple mounting nozzle type nozzle 112a are arranged side by side, the plurality of nozzles of the multiple mounting nozzle type without the head 112 moving in the horizontal direction. 112a can simultaneously pick up components from each component cassette 114. As a result, the time required for the task can be reduced, and the tact time on the priority type mounting board can be further reduced.

  Next, when the priority processing unit 205 determines the number of component divisions as a priority condition, for example, among the plurality of component cassettes 114, the multiple supply of the component cassettes 114 that supply a large number of components to the priority type substrate 20 is provided. Identifies as a component cassette. Then, the priority processing unit 205 sets the number larger than the number of multi-supply component cassettes in the mounting condition (component arrangement) derived by the previous optimization as the new number of multi-supply component cassettes, that is, the number of component divisions. decide. That is, the priority processing unit 205 divides a multi-supply component cassette corresponding to the priority product type, and determines the number of component divisions obtained as a priority condition.

  That is, the priority processing unit 205 allows the component mounter 100 so that more components used for production of the mounting board of the type corresponding to the tact determined not to be less than the target time can be supplied to the board 20 at the same time. Is determined as a priority condition.

  Specifically, as shown in FIG. 13, the priority processing unit 205 supplies a component cassette 114 that supplies components of the component type c2 to the substrate 20 of the priority type E, and supplies the most components to the substrate 20. Specified as a multi-supply component cassette to be supplied. Then, the priority processing unit 205 increases the number of the multi-supply component cassettes from one to two in the component array obtained by the first optimization, and the number of parts division of the multi-supply component cassette is “2”. Is determined as a priority condition.

  When such priority conditions are determined, the optimization unit 203 performs the second optimization so that the number of multi-supply component cassettes that supply components of the component type c2 is always “two”.

  In this way, by dividing the parts of the multi-feed parts cassette, when producing a priority type of mounting board, it is possible to simultaneously pick up as many parts as the number of parts divided. As a result, the time required for the task can be shortened, and the tact time of the priority type mounting board can be shortened.

  FIG. 14 is a flowchart showing the operation of the mounting condition determining apparatus in the present embodiment.

  First, the optimization unit 203 of the mounting condition determining apparatus 200 reads the NC data 207a and the component library 207b necessary for optimizing the mounting conditions (Step S100), and the evaluation unit 204 reads the target time data 208a (Step S102). ). At this time, if the priority processing unit 205 holds a previously determined priority condition, the priority processing unit 205 deletes the priority condition and performs initialization, and sets the number of optimization iterations N to “0”.

  Next, the optimization unit 203 optimizes the mounting conditions using the NC data 207a and the component library 207b read in step S100 (step S104). The evaluation unit 204 identifies the tact of each board type in the mounting condition derived by the optimization in step S104 (step S106), and the tact of each board type indicated by the target time data 208a read in step S102. It is determined whether or not each time is within the time (step S108).

  If the evaluation unit 204 determines that the tact of any one of the plurality of board types exceeds the target time of the board type (N in step S108), the evaluation unit 204 determines that the tact exceeds the target time. A priority type is identified from the corresponding board types, and the priority type is notified to the priority processing unit 205.

  As a result, the priority processing unit 205 determines the priority condition for the priority product notified from the evaluation unit 204, that is, the priority condition for the substrate product corresponding to the tact exceeding the target time (step S110). Then, the priority processing unit 205 notifies the optimization unit 203 of the determined priority condition, and causes the optimization unit 203 to perform optimization again under the priority condition (step S104).

  Here, when the priority processing unit 205 determines the priority condition and notifies it to the optimization unit 203, the priority processing unit 205 increments the number of optimization iterations N described above. Then, the priority processing unit 205 determines a priority condition according to the value of the repetition count N, for example.

  On the other hand, when the evaluation unit 204 determines in step S108 that the tacts of all board types are equal to or less than the respective target times (Y in step S108), the evaluation unit 204 instructs the optimization unit 203 to determine the mounting conditions. To do. As a result, the optimization unit 203 determines the finally derived mounting condition as the final mounting condition, and generates mounting condition data 209a indicating the mounting condition (step S112).

FIG. 15 is a flowchart illustrating an example of detailed operation of the priority processing unit 205.
First, when the priority processing unit 205 receives a notification of a priority product type from the evaluation unit 204 (step S200), the priority processing unit 205 determines whether or not the number of optimization iterations N is greater than or equal to f times (f is an integer equal to or greater than 0). (Step S202).

  If the priority processing unit 205 determines that the number of repetitions N is less than f (N in step S202), the priority processing unit 205 determines the weight for the priority product as a priority condition and notifies the optimization unit 203 (step S204). . On the other hand, if the priority processing unit 205 determines that the number of repetitions N is equal to or greater than f (Y in step S202), is the optimization number of repetitions N equal to or less than g (g is an integer greater than f)? It is determined whether or not (step S206).

  As a result, when the priority processing unit 205 determines that the number of repetitions N is equal to or less than g times (Y in step S206), the priority processing unit 205 determines the component arrangement for the priority product as a priority condition and notifies the optimization unit 203 (step S208). ). On the other hand, if the priority processing unit 205 determines that the number of iterations N is greater than g (N in step S206), is the optimization number of iterations N less than h (h is an integer greater than g)? It is determined whether or not (step S210).

  If the priority processing unit 205 determines that the number of repetitions N is less than or equal to h (Y in step S210), the priority processing unit 205 determines the number of parts divided for the priority product as a priority condition and notifies the optimization unit 203 (step S210). S212). On the other hand, if the priority processing unit 205 determines that the number of iterations N is greater than h (N in step S210), is the optimization iteration number N equal to or less than i (i is an integer greater than h)? It is determined whether or not (step S214).

  As a result, when the priority processing unit 205 determines that the number of repetitions N is equal to or less than i (Y in step S214), the priority processing unit 205 determines the nozzle arrangement for the priority product as a priority condition and notifies the optimization unit 203 (step S216). ). On the other hand, if the priority processing unit 205 determines that the number of repetitions N is greater than i (N in step S214), the priority processing unit 205 determines that it is impossible to determine further priority conditions for the priority product, for example, the production line The optimization unit 203 is instructed to execute the optimization by increasing the number of the component mounting machines 100 (step S218).

  Then, the priority processing unit 205 increments the optimization repetition count N after determining and notifying the priority condition in steps S204, S208, S212, and S216 (step S220).

  As described above, in the mounting condition determining apparatus 200 according to the present embodiment, common mounting conditions for producing a plurality of types of mounting boards are derived by the conventional optimization program. Even if the tact for the type of mounting board becomes longer than the target time, the mounting conditions are changed so that the tact is shortened, and the changed mounting conditions are determined as the final mounting conditions. Mounting conditions can be optimized for each type of substrate.

  As mentioned above, although the mounting condition determination method and the mounting condition determination apparatus according to the present invention have been described using the above embodiment, the present invention is not limited to this.

  For example, in the above embodiment, the mounting conditions in the production line are determined, but the mounting conditions for only one component mounting machine 100 may be determined.

  Moreover, in the said embodiment, although the component mounting machine 100 shown in FIG. 2 and FIG. 3 was used as a component mounting machine, you may use component mounting machines other than such a component mounting machine 100. FIG. For example, the component mounting machine may be a so-called alternating mounting component mounting machine in which components are alternately mounted on a single board with a plurality of heads, and the board is moved by an XY table to each mounting position. It may be a rotary mounting machine that positions and mounts components with a rotary head.

  In the above embodiment, the mounting conditions are optimized so that the total line tact is minimized or the total line tact is minimized under the priority conditions. Other optimizations may be performed. That is, in the present invention, any conventional optimization program can be used.

  In the present embodiment, the type of priority condition such as weight, component arrangement, nozzle arrangement, etc. for the priority type is changed according to the number of optimization iterations N, but the type of priority condition is changed according to other situations. It may be changed. For example, even if priority conditions such as weights are repeatedly determined and optimized, the priority type tact does not fall below the target time, or the reduction rate of the tact is smaller than a predetermined threshold, the type of the priority condition (Weight) may be changed to a type of priority condition such as another component arrangement, and the priority condition of that type may be determined. Furthermore, the determination of priority conditions may be greedy or empirical.

  In this embodiment, the weight, which is a kind of parameter of the optimization program, is determined as the priority condition, but other parameters may be determined as the priority condition.

  The mounting condition determination method of the present invention has an effect that the mounting conditions can be optimized for each type of mounting board, and can be applied to, for example, a computer that determines mounting conditions for a component mounting machine.

1 is an external view of a component mounting system in an embodiment of the present invention. It is an external view of a component mounting machine same as the above. It is a top view which shows the main structures of a component mounting machine same as the above. It is a schematic diagram which shows the positional relationship of a head same as the above and a component cassette. It is an external view which shows the external appearance of an electronic component same as the above. It is a figure which shows the example of the component tape and the reel which accommodated the electronic component same as the above. It is a block diagram which shows the function structure of the mounting condition determination apparatus same as the above. It is a figure which shows an example of NC data same as the above. It is a figure which shows an example of a component library same as the above. It is a figure which shows an example of target time data same as the above. It is explanatory drawing for demonstrating the optimization of the mounting conditions same as the above. It is a figure which shows an example of the tact for every board | substrate kind which changes by optimization same as the above. It is explanatory drawing for demonstrating the component arrangement | sequence, nozzle arrangement | sequence, and component division number which are determined as a priority condition same as the above. It is a flowchart which shows operation | movement of the mounting condition determination apparatus same as the above. It is a flowchart which shows an example of detailed operation | movement of a priority processing part same as the above.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Component mounting machine 200 Mounting condition determination apparatus 201 Input part 202 Display part 203 Optimization part 204 Evaluation part 205 Priority processing part 206 Communication part 207 1st storage part 207a NC data 207b Parts library 208 Second storage part 208a Target time data 209 Third storage unit 209a Mounting condition data

Claims (10)

A mounting condition determination method for determining a common mounting condition for producing a plurality of types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board,
A derivation step for deriving common provisional mounting conditions for producing multiple types of mounting boards;
When the component mounter mounts a component according to the temporary mounting conditions, a tact specifying step for specifying a tact time required for production of one mounting substrate for each type of mounting substrate;
A determination step for determining whether or not the tact time specified in the tact specification step is equal to or less than a target time predetermined for the product type for each product type of the mounting board;
A change step of changing the provisional mounting condition so that the tact time determined not to be equal to or less than the target time in the determination step is shortened;
And a determining step of determining the provisional mounting condition changed in the changing step as the mounting condition. In the changing step,
The mounting condition determination method according to claim 1, wherein the provisional mounting condition is changed so that a tact time determined not to be less than or equal to the target time in the determination step is equal to or less than the target time. The tact specifying step, the determining step, and the changing step are repeated with the temporary mounting condition changed in the changing step as a new temporary mounting condition,
In the determination step,
For each of all types of mounting boards, when it is determined in the determining step that the tact time is equal to or less than the target time, the temporary mounting condition changed in the recent changing step is the mounting condition. The mounting condition determining method according to claim 1, wherein the mounting condition is determined as follows. In the derivation step,
Deriving the provisional mounting conditions so that the time required for production of the plurality of types of mounting boards is minimized,
The changing step includes
A priority condition determining step for determining a priority condition in which the production of the mounting board corresponding to the tact time determined not to be equal to or less than the target time in the determination step is prioritized over the production of the mounting boards of other types;
By deriving a common new temporary mounting condition for producing the plurality of types of mounting boards so as to minimize the time required to produce the plurality of types of mounting boards under the priority conditions, The method according to claim 1, further comprising: a re-derivation step that changes the provisional mounting condition derived in the deriving step. In the priority condition determining step,
The weight for each type of mounting board is determined as the priority condition so that the weight of the type corresponding to the tact time determined not to be equal to or less than the target time in the determination step is larger than the weight of other types.
In the re-derivation step,
5. The new provisional mounting condition is derived so that the larger the weight, the shorter the tact time of the type corresponding to the weight is determined in accordance with the weight for each type of mounting board determined as the priority condition. The mounting condition determination method described. In the priority condition determining step,
The components that are used more frequently in the production of the mounting board of the type corresponding to the tact time determined not to be equal to or less than the target time in the determination step are arranged in the component supply unit near the substrate in the component mounting machine, or The mounting condition determination method according to claim 4, wherein the priority condition is to determine that the elements are continuously arranged so that they can be adsorbed simultaneously. Of a plurality of types of adsorbing members attached to the component mounting machine that adsorb components, this type is often used for the production of mounting boards of the type corresponding to the tact time determined not to be less than the target time in the determining step. The mounting condition determination method according to claim 4, wherein the priority condition is that a suction member is attached to the component mounting machine in a larger amount. Components that are used more frequently in the production of a mounting board of the type corresponding to the tact time determined not to be less than the target time in the determination step are arranged on the component mounting machine so that more parts can be supplied to the board simultaneously. This is determined as the priority condition. The mounting condition determination method according to claim 4. A mounting condition determination device that determines common mounting conditions for producing a plurality of types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board,
Deriving means for deriving common provisional mounting conditions for producing multiple types of mounting boards,
When the component mounter mounts a component according to the provisional mounting condition, a tact specifying unit that specifies a tact time required for production of one mounting substrate for each type of mounting substrate;
A discriminating means for discriminating whether or not the tact time specified by the tact specifying means is equal to or less than a target time predetermined for the product for each product type of the mounting board;
Changing means for changing the provisional mounting condition so that the tact time determined not to be less than or equal to the target time by the determining means is reduced;
A mounting condition determining apparatus comprising: a determining unit that determines the provisional mounting condition changed by the changing unit as the mounting condition. A program for determining common mounting conditions for producing multiple types of mounting boards for a component mounting machine that produces mounting boards by mounting components on a board,
A derivation step for deriving common provisional mounting conditions for producing multiple types of mounting boards;
When the component mounter mounts a component according to the temporary mounting conditions, a tact specifying step for specifying a tact time required for production of one mounting substrate for each type of mounting substrate;
A determination step for determining whether or not the tact time specified in the tact specification step is equal to or less than a target time predetermined for the product type for each product type of the mounting board;
A change step of changing the provisional mounting condition so that the tact time determined not to be equal to or less than the target time in the determination step is shortened;
A program causing a computer to execute a determination step of determining the provisional mounting condition changed in the changing step as the mounting condition.

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