JP2008235627A - Bga semiconductor component and printed circuit board for mounting the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a printed circuit board for mounting a BGA semiconductor component thereon on which the BGA semiconductor component having pins arranged in 5 rows from its outside can be mounted and which can has a low manufacturing cost. <P>SOLUTION: In the printed circuit board for mounting thereon the BGA semiconductor component having BGA connection pads 1a formed at respective lattice points, an inner layer conductor pattern 2, single-layer through via holes 13, BGA connection pads, and a surface layer conductor pattern 1 are sequentially laminated, full-layer through via holes 18 are formed in the laminate, the BGA connection pads arranged in first and second rows are connected with the outside of a region via the surface layer conductor pattern, the BGA connection pads arranged in third and fourth rows are connected with the outside of the region through the surface layer conductor pattern, the single-layer through via holes and the inner layer conductor pattern, and the BGA connection pads arranged in a fifth row are connected with the outside of the region through the surface layer conductor pattern and the full-layer through via holes and through the inner layer conductor pattern or a back-layer conductor pattern as their lower layers. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a printed circuit board for mounting a BGA semiconductor component, and more particularly to a printed circuit board for mounting a BGA semiconductor component on which BGA semiconductor components having terminals formed in five rows can be mounted and whose manufacturing cost is low.

  BGA (Ball Grid Array) semiconductor components are provided with ball solder (BGA) arranged in a grid on the back of the package for circuit connection. Cream solder is applied to the BGA connection pads on the printed circuit board, and the ball-shaped solder of the BGA semiconductor component is put on it and passed through a reflow furnace, whereby the BGA connection pads are electrically connected to the terminals of the BGA semiconductor component. .

  FIG. 3 shows an example of a BGA connection pad of a printed circuit board for mounting a BGA semiconductor component. On this printed circuit board, BGA connection pads 1a are formed at the respective lattice points formed in five rows from the outside to the inside on the surface of the square-shaped region surrounded by the inner square and the outer square. The pitch of the BGA connection pads 1a, 1a... Is 500 μm.

  Incidentally, it is difficult to make the interval (pitch) between the wiring patterns of the printed circuit board smaller than 250 μm. Therefore, the BGA semiconductor component IC has a pin pitch as narrow as 500 μm as shown in FIG. 3 and a printed circuit board on which a large number of pins arranged in five rows from the outside to the inside are mounted as shown in FIG. A staged build-up board was used.

  A method for manufacturing the two-stage buildup substrate shown in FIG. 4 will be described. The insulating layer 7 shown in FIG. 4 constitutes a core layer. Conductive films are applied to the front surface (upper surface) and back surface (lower surface) of the insulating layer 7, and the wiring patterns 3 and 4 are formed by photosensitizing and etching. Further, a photosensitive resin is laminated on both surfaces, and holes are formed by photosensitizing and etching at positions where build via holes (VIA) 15 and 16 (single layer through via holes) are formed.

  This photosensitive resin becomes insulating layers 8 and 10 by curing. A conductor film is applied on the insulating layers 8 and 10, and the wiring pattern 2, the build via hole 15, the wiring pattern 5, and the build via hole 16 are formed by photosensitive and etching.

  Further, a photosensitive resin is laminated on the insulating layers 8 and 10 to form holes at the positions where the build via holes 13 and 14 are formed by photosensitizing and etching. This photosensitive resin becomes insulating layers 9 and 11 by curing. A conductor film is applied on the insulating layers 9 and 11, and the wiring pattern 1, the BGA connection pad 1a, the build via hole 13, the wiring pattern 6, and the build via hole 14 are formed by photosensitizing and etching.

  Holes are drilled in the thus-laminated substrates by drills, and all layer through holes (through holes) 18 are formed. The above-described printed circuit board is called a two-stage build-up board because build via holes (single layer through via holes) are formed in two stages on each side.

  When the BGA semiconductor component having the pins arranged in five rows from the outside described above is mounted on the two-stage buildup board, the BGA connection pads 1a in the two outside rows are connected to the outside by the wiring pattern 1 on the surface. The pitch of this wiring pattern is 250 μm.

  The BGA connection pads 1a in the third and fourth rows from the outside are connected to the wiring pattern 2 via the wiring pattern 1 and the build via hole 13, and are connected to the outside by the second wiring pattern 2 from the surface. The pitch of this wiring pattern is 250 μm.

  The BGA connection pads 1a in the fifth row from the outside are connected to the outside by the third wiring pattern 3 from the surface through the wiring pattern 1, the build via hole 13, the wiring pattern 2, and the build via hole 15. The pitch of this wiring pattern is 500 μm.

  Thus, the conventional BGA semiconductor component having terminals formed in five rows from the outside is mounted by a two-stage buildup board, but the two-stage buildup board forms a build via hole in two stages. For this reason, there has been a problem in that the manufacturing cost is increased because holes must be formed twice in the insulating layer.

In the ball grid array package type semiconductor component mounting structure proposed in Japanese Patent Laid-Open No. 10-284846, a one-stage build-up substrate is used. However, this ball grid array package type semiconductor component mounting structure is for mounting BGA semiconductor components having pins arranged in four rows from the outside, and mounting BGA semiconductor components having pins arranged in five rows from the outside. Can not do it.
JP-A-10-284846, paragraphs 0018 to 0023, FIGS. 1 to 3

  The present invention has been made in view of the above points. The object of the present invention is to mount BGA semiconductor components having pins arranged in five rows from the outside, and at a low manufacturing cost. It is to provide a printed circuit board for mounting a BGA semiconductor component.

  The BGA (Ball Grid Array) semiconductor component according to the present invention is directed from the first row adjacent to each side of the outer square toward the inside on the surface of the square-shaped region surrounded by the inner square and the outer square on the bottom surface. In a BGA semiconductor component in which a BGA connection terminal is formed at each of the lattice points formed in five rows up to the fifth row, each of the lattice points in the fifth row from the outer side close to the respective sides of the outer square toward the inner side Any of a GND terminal, a power supply terminal, and an NC terminal is disposed on the BGA connection terminal.

  Also, the printed circuit board for mounting a BGA semiconductor component according to the present invention has a first surface inward from the first row adjacent to each side of the outer square on the surface of the square-shaped region surrounded by the inner square and the outer square. In a printed circuit board for mounting BGA semiconductor components, in which BGA connection pads are formed at each lattice point formed in 5 rows up to 5 rows, an inner layer conductor pattern, a surface side insulating layer, a single layer through via hole on the surface side of the base substrate , BGA connection pads, and surface layer conductor patterns are sequentially laminated, and all layer through via holes are formed in the inner square, and the BGA connection pads in the first and second rows are formed on the surface layer. The BGA connection pads in the third row and the fourth row are connected to the outside of the square-shaped region through the conductor pattern, and the surface layer conductor pattern, the single layer through via hole, and the inner layer conductor pattern The BGA connection pads in the fifth row are connected to the outside of the square-shaped region through the surface layer conductor pattern, all-layer through via holes, and the inner layer conductor pattern or the back layer conductor pattern below the inner layer conductor pattern. It is connected outside the square-shaped region.

  In the printed circuit board for mounting a BGA semiconductor component, any of the GND terminal, the power supply terminal, or the NC terminal of the BGA semiconductor component is connected to the BGA connection pad in the fifth row.

  According to the BGA semiconductor component and the printed circuit board for mounting a BGA semiconductor component according to the present invention, BGA semiconductor components having pins arranged in five rows from the outside can be mounted. Moreover, since it is a one-stage build-up board, the manufacturing cost of the printed board is low.

  The best mode for carrying out the present invention will be described below with reference to examples.

  FIG. 1 is a partial plan view showing a printed circuit board for mounting a BGA semiconductor component according to an embodiment of the present invention, and FIG. 2 is a partial sectional view showing the printed circuit board for mounting the BGA semiconductor component. The cross section of the cross-sectional view of FIG. 2 is stepped, and FIG. 2 only shows the height direction position of each member, and does not show the planar direction position.

  The BGA connection pads 1a, 1a,... Shown in FIG. 1 are provided at grid points formed in five rows from the outside to the inside in a square-shaped region surrounded by the inner square and the outer square. That is, the diameter of the BGA connection pad 1a of the printed circuit board shown in FIG.

  The manufacturing method and structure of this printed circuit board will be described with reference to FIG. A conductor film is applied to the front surface (upper surface) and back surface (lower surface) of the insulating layer 7 shown in FIG. 2, and the wiring pattern 3 and the wiring pattern 4 are formed by photosensitizing and etching. Furthermore, the insulating layer 8 and the insulating layer 10 are obtained by laminating and curing a photosensitive resin on both surfaces thereof.

  The insulating layers 7, 8 and 10 and the wiring patterns 3 and 4 form a core layer 12. The wiring pattern 2 and the wiring pattern 5, the insulating layer 9 and the insulating layer 11, and the BGA connection pad 1a are formed on the front and back surfaces thereof. Then, the build via hole 13, the wiring pattern 1, the build via hole 14 and the wiring pattern 6 are sequentially laminated to obtain two layers of wiring patterns connected to each other by the one-step build via hole on the front side and the back side. It is done.

  That is, a conductor film is applied on the insulating layers 8 and 10, and the wiring pattern 2 and the wiring pattern 5 are formed by exposure and etching. Further, a photosensitive resin is laminated on the insulating layers 8 and 10 to form holes at the positions where the build via holes 13 and 14 are formed by photosensitizing and etching.

  This photosensitive resin becomes insulating layers 9 and 11 by curing. A conductor film is applied on the insulating layers 9 and 11, and the wiring pattern 1, the BGA connection pad 1a, the build via hole 13, the wiring pattern 6, and the build via hole 14 are formed by photosensitizing and etching.

  Holes are drilled in the thus-laminated substrates by drills, and all layer through holes (through holes) 18 are formed. The above-mentioned printed circuit board is called a one-stage build-up board because a build via hole (single layer through-hole) is formed in one stage on each side.

  When the BGA semiconductor component having the pins arranged in five rows from the outside is mounted on the one-stage buildup substrate, the terminals of the BGA semiconductor component are soldered to the BGA connection pads 1a, 1a,. A state where the BGA connection pads 1a, 1a,... Are connected to the outside will be described with reference to FIG.

  The A and B rows are shown as the outer two rows of BGA connection pads 1a. The B and B rows of BGA connection pads 1a are connected to the outside by a wiring pattern 1 indicated by a black line on the surface. The width of the wiring pattern 1 is 75 μm, the diameter of the BGA connection pad 1a is 275 μm, and the minimum gap between the wiring pattern 1 and the BGA connection pad 1a is 75 μm.

  The C row and the D row are shown as the BGA connection pads 1a in the third row and the fourth row from the outside, and the BGA connection pads 1a in the C row and the D row are connected via the wiring pattern 1 and the build via hole 13. Are connected to the wiring pattern 2 (inner layer conductor pattern). The wiring pattern 2 has a width of 75 μm and a pitch of 250 μm.

  The BGA connection pads 1a (E column) in the fifth column from the outside are connected to the outside by the wiring pattern 6 on the back surface through the wiring pattern 1 and the all-layer through hole 18. Terminals in the fifth column from the outside are GND and NC, and can be connected by a common wiring pattern. In this way, since a one-stage build-up substrate is used, the manufacturing cost is reduced.

  The BGA semiconductor component of the present invention is mounted on the printed circuit board for mounting the BGA semiconductor component of the above embodiment. That is, BGA semiconductor components in which pins are arranged in five rows from the outside and pins in the fifth row from the outside are only the GND terminal and the NC terminal are mounted.

  The embodiment is configured as described above, but the invention is not limited to this. For example, pins are arranged in five rows from the outside, and the pins in the fifth row from the outside are the GND terminal, the + power supply terminal and the NC terminal. The BGA connection pads in the fifth row from the outside are the BGA connection pads only for the GND terminal, + power supply terminal and NC terminal, and the NC terminal, GND terminal and power supply + You may mount in the printed circuit board for BGA semiconductor component mounting connected to the outer side by two wiring patterns as a terminal.

It is a fragmentary top view which shows the printed circuit board for BGA semiconductor component mounting which is an Example of this invention. It is a fragmentary sectional view which shows the printed circuit board for same BGA semiconductor component mounting in a step-like cross section. It is a top view which shows the example of the BGA connection pad for BGA semiconductor components. It is a fragmentary sectional view which shows the conventional printed circuit board for BGA semiconductor component mounting in a step-like cross section.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Wiring pattern, 1a BGA connection pad 2, 3, 4, 5, 6 Wiring pattern 7, 8, 9, 10, 11 Insulating layer 12 Core layer 13, 14, 15, 16 Build via hole (VIA)
18 All-layer through-holes (through-holes)

Claims (3)

Lattice points formed in five rows from the first row to the inside in the fifth row in the vicinity of each side of the outer square on the surface of the square-shaped region surrounded by the inner square and the outer square on the bottom surface In the BGA semiconductor component in which the BGA connection terminals are respectively formed, the BGA connection terminals at the respective lattice points in the fifth column from the outer side close to the respective sides of the outer square to the inner side include a GND terminal, a power supply terminal, One of NC terminals is arranged, BGA semiconductor component characterized by the above-mentioned. Each lattice point formed in five rows from the first row in the vicinity of each side of the outer square to the fifth row on the surface of the square-shaped region surrounded by the inner square and the outer square. In a printed circuit board for mounting BGA semiconductor components, on which a BGA connection pad is formed, an inner layer conductor pattern, a surface side insulating layer, a single layer through via hole, a BGA connection pad, and a surface layer conductor pattern are sequentially laminated on the surface side of the base substrate. Furthermore, through-holes are formed in all layers inside the inner square, and the BGA connection pads in the first row and the second row are connected to the outside of the square-shaped region through a surface layer conductor pattern. The BGA connection pads in the third row and the fourth row are connected to the outside of the square-shaped region via the surface layer conductor pattern, the single layer through via hole, and the inner layer conductor pattern, and the BGA contact in the fifth row. The BGA semiconductor component is characterized in that the pad is connected to the outside of the square-shaped region via a surface layer conductor pattern, an all-layer through via hole, and an inner layer conductor pattern or a back layer conductor pattern below the inner layer conductor pattern. Printed circuit board for mounting. The printed circuit board for mounting a BGA semiconductor component according to claim 2, wherein a GND terminal, a power supply terminal, or an NC terminal of the BGA semiconductor component is connected to the BGA connection pad in the fifth row.

Images