JP2008192658A - Circuit board, its production process and process for producing conduction board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a circuit board which can enhance efficiency in conduction work of lands as compared with prior art. <P>SOLUTION: A flexible circuit board comprises a main board 52 having a plurality of lands to be conducted mutually, and conduction boards 54 and 55 for conducting the plurality of lands of the main board 52. The conduction board 54 has a plurality of lands provided at the positions corresponding to the plurality of lands of the main board 52 to conduct mutually, and an edge 54h having a shape along the contour of the main board 52. The conduction board 55 has a plurality of lands provided at the positions corresponding to the plurality of lands of the main board 52 to conduct mutually, and an edge 55e having a shape along the contour of a chip resistor 56 arranged on the main board 52. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit board in which a plurality of lands of a conductive substrate are made conductive by a conductive substrate, a circuit board manufacturing method, and a conductive substrate manufacturing method.

  In an optical head device used for reproducing or recording an optical recording disk such as a CD (Compact Disk) or a DVD (Digital Versatile Disk), a light emitting element, a signal detecting light receiving element, and an optical path from the light emitting element to the optical recording disk And an optical system that forms an optical path from the optical recording disk to the light receiving element for signal detection is mounted on the apparatus frame (see, for example, Patent Document 1).

  In such an optical head device, power is supplied to a light emitting element, a signal detecting light receiving element, a monitor light receiving element, a driving circuit for the light emitting element, etc. by a common printed circuit board. A large number of wirings are formed. In many cases, a large number of wirings formed on a printed circuit board include wirings that are electrically connected to each other. In such a case, conventionally, a land is formed on each wiring to be short-circuited. A method is adopted in which these lands are connected to each other by a chip resistance of 0Ω.

  However, in the method of making lands conductive with a chip resistance of 0Ω, there is a problem that wiring cannot be performed if the distance between lands is too long.

Therefore, a method is adopted in which the lands are connected to each other by a lead wire or a magnet wire.
JP 2002-8250 A

  However, in the method of making lands conductive by lead wires or magnet wires, if the distance between the lands is too short, handling of short lead wires or magnet wires becomes difficult, so that there is a problem that soldering is difficult.

  The present invention has been made to solve the conventional problems, and an object of the present invention is to provide a circuit board capable of improving the efficiency of conduction work between lands.

  The circuit board according to the present invention includes a conductive substrate that is a substrate having a plurality of conductive lands that are lands that are electrically connected to each other, and a conductive substrate that is a substrate for connecting the plurality of conductive lands to each other. The conductive substrate is a land provided at a position corresponding to the plurality of conductive lands, and a plurality of conductive lands that are electrically connected to each other, and an outline of the conductive substrate or the conductive substrate And an edge part that is an edge part of the shape along the outer shape of the arranged electronic component, and the edge part is an outer shape of the conductive substrate or an outer shape of the electronic component arranged on the conductive substrate. It is characterized by being arranged at least in the vicinity thereof.

  With this configuration, the conductive substrate of the present invention has an edge portion that is an edge portion of a shape along the outer shape of the conductive substrate or the outer shape of the electronic component disposed on the conductive substrate. The edge portion is disposed at least in the vicinity of the outer shape of the conductive substrate or the outer shape of the electronic component disposed on the conductive substrate. Therefore, the position of the conductive substrate relative to the conductive substrate can be aligned with the outer shape of the conductive substrate or the outer shape of the electronic component so that the position of the conductive substrate relative to the conductive substrate can be adjusted. The work efficiency can be improved as compared with the prior art. Since the circuit board of the present invention can improve the work efficiency of positioning the conductive board with respect to the conductive board, it can improve the efficiency of the conductive work between the conductive lands.

  Moreover, it is preferable that the shape of the said edge part of the board | substrate for conduction | electrical_connection of this invention is formed including the several plane which is not mutually on the same surface.

  With this configuration, the circuit board of the present invention positions the conductive substrate with respect to the conductive substrate in two or more directions, so that the positioning accuracy and work efficiency are improved compared to the case where the positioning is performed in only one direction. Can be improved.

  The circuit board manufacturing method of the present invention is characterized in that the position of the conductive substrate is aligned with the conductive substrate by aligning the shape of the edge portion with the external shape of the conductive substrate or the external shape of the electronic component. To do.

  With this configuration, the circuit board according to the present invention can improve the positioning accuracy and working efficiency of the conductive substrate with respect to the conductive substrate as compared with the related art. Since the circuit board of the present invention can improve the work efficiency of positioning the conductive board with respect to the conductive board, it can improve the efficiency of the conductive work between the conductive lands.

  According to the method of manufacturing a circuit board for conducting a circuit board of the present invention, a unit board, which is a board in which two conductive board patterns are arranged symmetrically, is formed, and then the unit board is cut into two sheets. It isolate | separates into the said board | substrate for conduction | electrical_connection, It is characterized by the above-mentioned.

  With this configuration, the circuit board according to the present invention has at least one conductive board, even if the cutting position of the unit board is shifted due to, for example, a setting error of a machine that cuts the unit board. A conductive substrate can be obtained.

  ADVANTAGE OF THE INVENTION According to this invention, the circuit board which can improve the efficiency of the conduction | electrical_connection operation | work between lands can be provided.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  First, the configuration of the optical head device according to the present embodiment will be described.

  As shown in FIGS. 1 to 3, the optical head device 10 according to the present embodiment is a CD-based disk (not shown) using a laser beam having a wavelength of 650 nm and a laser beam having a wavelength of 780 nm. And a two-wavelength optical head device capable of recording and reproducing information with respect to an optical recording disk such as a DVD-based disk.

  The optical head device 10 includes a metal device frame 11 made of a die-cast product such as magnesium or zinc, metal covers 12 and 13 covering various components mounted on the device frame 11, and laser light having a wavelength of 650 nm. A laser light source device 21 that includes an emitting AlGaInP semiconductor laser, a laser light source device 22 that includes an AlGaAs semiconductor laser that emits laser light having a wavelength of 780 nm, and the laser light source device 21 and the laser light source device 22. Monitor light receiving element 23 for receiving the emitted laser light, signal detection light receiving element 24 for receiving the laser light reflected by the recording surface of the optical recording disk, laser light source device 21 and laser light source device Driving IC (Integrated Circuit) 25 for driving 22 (see FIG. 4). And an optical system 30 having an objective lens 31 for converging the laser light emitted by the laser light source device 21 and the laser light source device 22 on the recording surface of the optical recording disk, and tracking of the objective lens 31 mounted on the device frame 11. Objective lens driving mechanism 40 for servo-controlling the position in the direction and the focusing direction, laser light source device 21, laser light source device 22, light receiving element 23 for monitoring, light receiving element 24 for signal detection, driving IC 25, and objective lens driving mechanism 40 and a flexible circuit board 50 as a circuit board electrically connected to the circuit board 40.

  The apparatus frame 11 includes a bearing 11a and a bearing 11b that engage with a guide shaft and a feed screw shaft (not shown) for driving an optical recording disk, a positioning projection 11c for the metal cover 12, and a metal cover 12. And a claw 11d for fastening the head.

  The metal cover 12 includes a hole 12 a that fits into the protrusion 11 c of the device frame 11 and a groove 12 b that engages with the claw 11 d of the device frame 11.

  The metal cover 13 has a hole 13 a through which the laser light emitted from the objective lens 31 passes and covers the objective lens driving mechanism 40.

  The laser light source device 21, the laser light source device 22, and the monitor light receiving element 23 are mounted on the device frame 11 and covered with a metal cover 12.

  The driving IC 25 is mounted on the flexible circuit board 50.

  The optical system 30 transmits the laser light emitted from the laser light source device 21 and reflects the laser light emitted from the laser light source device 22, and an optical path combining polarizing prism 32, and between the laser light source device 21 and the polarizing prism 32. Diffractive element 33 in which a half-wave plate is integrally formed, diffractive element 34 and relay lens 35 disposed between laser light source device 22 and polarizing prism 32, monitor light receiving element 23 and polarized light A half mirror 36 that is disposed between the prisms 32 and partially reflects the laser light emitted from the polarizing prism 32, and is disposed between the signal detection light receiving element 24 and the half mirror 36 and is incident on the signal detection light receiving element 24. A sensor lens (not shown) for giving astigmatism to the laser beam to be emitted, and a half mirror 36 emitted from the polarizing prism 32. A quarter-wave plate 37 that causes a quarter-wave phase difference in the reflected laser light, a collimator lens 38 that converts the laser light transmitted through the quarter-wave plate 37 into parallel light, and a collimator lens 38. A rising mirror 39 is provided for raising the parallel laser light toward the optical recording disk.

  The polarizing prism 32, the diffractive element 33, the diffractive element 34, the relay lens 35, the half mirror 36, the sensor lens, the ¼ wavelength plate 37, the collimating lens 38 and the rising mirror 39 are mounted on the apparatus frame 11. The polarizing prism 32, the diffraction element 33, the diffraction element 34, the relay lens 35, the half mirror 36, and the quarter wavelength plate 37 are covered with the metal cover 12. The collimating lens 38 and the raising mirror 39 are covered with an objective lens driving mechanism 40.

  The objective lens drive mechanism 40 includes a yoke 41 fixed to the apparatus frame 11, a drive magnet 42 attached to the yoke 41, a lens holder 43 that holds the objective lens 31, and a drive magnet 42 attached to the lens holder 43. And a drive coil (not shown) constituting the magnetic drive circuit, a plurality of wires 44 connected to the lens holder 43, and the lens holder 43 fixed to the yoke 41 via the wires 44 in the tracking direction and the focusing direction. And a holder support 45 that is movably supported. Note that the objective lens driving mechanism 40 can also perform tilt control for adjusting the tilt of the objective lens 31 in the jitter direction.

  4 to 6, the flexible circuit board 50 is electrically connected to the laser light source device 21 (see FIG. 2), the end 50a, and the laser light source device 22 (see FIG. 2). End 50b connected electrically, end 50c electrically connected to monitor light receiving element 23 (see FIG. 2), and electrically connected to signal detecting light receiving element 24 (see FIG. 2). And an end 50f (see FIG. 2) electrically connected to the objective lens driving mechanism 40 (see FIG. 2). It is partially bent and mounted three-dimensionally on the apparatus frame 11 (see FIG. 2) and covered with a metal cover 12 (see FIG. 2). The flexible circuit board 50 includes a sub-board 51 that is a flexible circuit board having end portions 50a and 50b, an end portion 50c, an end portion 50d, and a mounting portion 50e, and is electrically connected to the sub-board 51. A main board 52 as a flexible circuit board, a sub board 53 (see FIG. 2) as a flexible circuit board having an end portion 50f and electrically connected to the main board 52, and a flexible circuit for conduction. Various electronic components including a conductive substrate 54 and a conductive substrate 55 that are substrates, and a 0Ω chip resistor 56 that is a conductive electronic component, and the conductive substrate 54 and the conductive substrate 55 are electrically connected to the main substrate 52. And solder 57 connected to the.

  As shown in FIG. 7, the sub-board 51 has a base film 51a made of polyimide, a conductive layer 51b formed of copper foil on one surface side of the base film 51a, and a conductive layer 51b attached to the base film 51a. An adhesive 51c, an insulating resin layer 51d made of polyimide disposed on the opposite side of the base film 51a with respect to the conductive layer 51b, an adhesive 51e having the insulating resin layer 51d attached to the conductive layer 51b, and a base A reinforcing plate 51f disposed on the opposite side of the conductive layer 51b to the film 51a to reinforce the end portion 50a and the end portion 50b, an adhesive 51g in which the reinforcing plate 51f is attached to the base film 51a, and a base film 51a In contrast, the adhesive tape 51 is disposed on the opposite side of the conductive layer 51b and is attached to the main substrate 52 (see FIG. 4). And release paper 51i that protects the adhesive tape 51h until the adhesive tape 51h is affixed to the main substrate 52, and has flexibility and exhibits a shape restoring force when folded. ing. The conductive layer 51b forms a wiring pattern at a portion covered with the insulating resin layer 51d, and forms a land at a portion not covered with the insulating resin layer 51d. The main board 52 and the sub board 53, the conduction board 54 and the conduction board 55 have the same configuration as the sub board 51.

  For example, as shown in FIG. 8, the main substrate 52 is electrically connected to each other by two lands 52 a as conductive lands to be electrically connected to each other by the conductive substrate 54 (see FIG. 6) and the conductive substrate 54. Three lands 52b as conductive lands for conduction, five lands 52c as conductive lands for conduction to each other by the conduction substrate 54, a land 52d for conduction with the conduction substrate 54, and a conduction Two lands 52e as conductive lands to be electrically connected to each other by the conductive substrate 55 (see FIG. 6), two lands 52f as conductive lands to be electrically connected to each other by the conductive substrate 55, and a chip And two lands 52g to be electrically connected to each other by a resistor 56 (see FIG. 6). The main substrate 52 has a conductive land and constitutes the conductive substrate of the present invention.

  Further, as shown in FIG. 9, the conductive substrate 54 includes a wiring pattern 54b having two lands 54a as conductive lands, a wiring pattern 54d having three lands 54c as conductive lands, and a conductive pattern 54b. A wiring pattern 54 f having five lands 54 e as common lands, one land 54 g, and a side edge 54 h that is a substantially U-shaped edge along the outer shape of the main board 52 are provided.

  As shown in FIG. 10, the conductive substrate 55 includes a wiring pattern 55b having two lands 55a as conductive lands, a wiring pattern 55d having two lands 55c as conductive lands, and a chip. And an edge portion 55e which is an L-shaped edge portion along the outer shape of the resistor 56.

  Next, a method for manufacturing the conductive substrate 55 will be described.

  First, as shown in FIG. 11A, a unit substrate 55A is formed, which is a substrate in which the wiring patterns 55b and 55d of the two conductive substrates 55 and 55 are arranged point-symmetrically.

  Then, as shown in FIG. 11B, the unit substrate 55A is cut by a cutting device (not shown) and separated into two conductive substrates 55 and 55.

  Next, a method for manufacturing the flexible circuit board 50 will be described.

  First, as shown in FIG. 12, the two lands 52 g (see FIG. 8) of the main board 52 are electrically connected to each other by attaching a chip resistor 56. In this way, the chip resistor 56 is mounted on the main board 52 in advance.

  Next, positioning is performed so that the shape of the edge portion 54 h of the conductive substrate 54 follows the outer shape of the main substrate 52, and the conductive substrate 54 is placed on the main substrate 52. That is, the three adjacent surfaces of the main substrate 52, that is, the first plane 52i and the second plane 52j which becomes the opposite wall portions rising in the same direction from both sides when the first plane 52i is the bottom. The first plane 54i constituting the edge portion 54h of the conductive substrate 54 and the first plane 52i in the U-shaped portion composed of the third plane 52k and the same direction from both sides when the first plane 52i is the bottom. The conductive substrate 54 is placed on the main substrate 52 by positioning so that the U-shaped portion composed of the second flat surface 54j and the third flat surface 54k that are opposed to each other rise up. In this embodiment, it is possible to visually confirm that the U-shaped portion of the edge portion 54 h of the conductive substrate 54 is along the U-shaped portion of the main substrate 52, so that the edge portion 54 h of the conductive substrate 54 can be visually confirmed. The entire region is disposed slightly inside the vicinity of the U-shaped portion of the main substrate 52. Therefore, the operator simply places the conductive substrate 54 on the main substrate 52 so that the U-shaped portion of the edge portion 54h of the conductive substrate 54 follows the U-shaped portion of the main substrate 52. The two lands 52a (see FIG. 8) 52 and the two lands 54a (see FIG. 9) of the conductive substrate 54 can be positioned at positions where they can be connected by the solder 57. In this embodiment, the entire area of the edge portion 54h of the conductive substrate 54 is disposed slightly inside the U-shaped portion of the main substrate 52. However, the present invention is not necessarily limited to this configuration. The entire region 54 h of the edge portion 54 h of the substrate 54 may coincide with the U-shaped portion of the main substrate 52. The two lands 52a (see FIG. 8) of the main board 52 are electrically connected to each other by being connected to the two lands 54a (see FIG. 9) of the conductive board 54 by the solder 57. Of the three lands 52b of the main substrate 52 (see FIG. 8), the two lands on the opposite side of the mounting portion 50e with respect to the fold line 52h of the main substrate 52 are the three lands 54c of the conductive substrate 54. (Refer to FIG. 9.) The two lands on the opposite side of the mounting portion 50e with respect to the fold line 52h of the main substrate 52 are connected to each other by the solder 57, thereby making them electrically connected to each other. Of the five lands 52c (see FIG. 8) of the main board 52, the two lands on the side opposite to the mounting portion 50e with respect to the folding line 52h are the five lands 54e (see FIG. 9) of the conductive board 54. .)), The two lands on the opposite side of the mounting portion 50e with respect to the folding line 52h of the main substrate 52 are connected to each other by the solder 57, so that they are made conductive.

  Next, positioning is performed so that the shape of the edge portion 55 e of the conductive substrate 55 is aligned with the outer shape of the chip resistor 56 attached to the main substrate 52, and the conductive substrate 55 is placed on the main substrate 52. That is, the two adjacent surfaces of the chip resistor 56, that is, the first plane 56a and the second plane 56b, the first plane 55f and the second plane 55g constituting the edge portion 55e of the conductive substrate 55. And the conductive substrate 55 is placed on the main substrate 52. In this embodiment, it is visually confirmed that the first plane 55f and the second plane 55g of the conductive substrate 55 are along the first plane 56a and the second plane 56b of the chip resistor 56, respectively. The first flat surface 55f and the second flat surface 55g of the conductive substrate 55 are disposed in the vicinity of the first flat surface 56a and the second flat surface 56b of the chip resistor 56 slightly apart from each other. Therefore, the operator sets the conductive substrate 55 so that the first plane 55f and the second plane 55g of the conductive substrate 55 are along the first plane 56a and the second plane 56b of the chip resistor 56, respectively. A position where the two lands 52e (see FIG. 8) of the main board 52 and the two lands 55a (see FIG. 10) of the conductive board 55 can be connected by the solder 57 simply by placing them on the main board 52. Can be positioned. In the present embodiment, the first flat surface 55f and the second flat surface 55g of the conductive substrate 55 are slightly separated from the first flat surface 56a and the second flat surface 56b of the chip resistor 56 due to restrictions on the position of the land. However, the present invention is not necessarily limited to this configuration. When there is no restriction on the position of the land, the first plane 55f and the second plane 55g of the common substrate 55 are connected to the chip resistor 56. You may contact | abut to the 1st plane 56a and the 2nd plane 56b. The two lands 52e (see FIG. 8) of the main board 52 are electrically connected to each other by being connected to the two lands 55a (see FIG. 10) of the conduction board 55 by the solder 57. Further, the two lands 52f (see FIG. 8) of the main board 52 are electrically connected to each other by being connected to the two lands 55c (see FIG. 10) of the conduction board 55 by the solder 57. The contents described in the paragraphs “0039” and “0040” may be reversed in order.

  Next, the main board 52 is folded 180 degrees toward the drawing along the folding line 52h shown in FIG.

  One of the three lands 52b (see FIG. 8) of the main board 52 that has not been soldered yet is soldered out of the three lands 54c (see FIG. 9) of the conductive board 54. By being connected to one land which is not connected by the solder 57, the other two lands 52b are made conductive. Of the five lands 52c (see FIG. 8) of the main board 52, the three lands that are not yet soldered are still soldered out of the five lands 54e (see FIG. 9) of the conductive board 54. By connecting the three lands which are not connected with the solder 57, the other two lands 52c are electrically connected. The land 52d (see FIG. 8) of the main board 52 is connected to the land 54g (see FIG. 9) of the conductive board 54 by solder 57.

  Finally, the main board 52 is bent into the shape shown in FIG. 2 after the sub board 51 and the sub board 53 are electrically connected.

  As described above, the flexible circuit board 50 can align the position of the conductive board 54 with respect to the main board 52 by aligning the shape of the edge portion 54 h of the conductive board 54 with the outer shape of the main board 52. Thus, the positioning accuracy and working efficiency of the conductive substrate 54 with respect to the main substrate 52 can be improved as compared with the conventional technique. Similarly, the flexible circuit board 50 aligns the shape of the edge portion 55e of the conductive substrate 55 with the outer shape of the chip resistor 56 attached to the main substrate 52 and aligns the position of the conductive substrate 55 with respect to the main substrate 52. Therefore, the positioning accuracy and working efficiency of the conductive substrate 55 with respect to the main substrate 52 can be improved as compared with the prior art.

  Since the flexible circuit board 50 can improve the working efficiency of positioning the conductive boards 54 and 55 with respect to the main board 52, the lands 52a of the main board 52, the lands 52b, the lands 52c, and the lands 52e. In addition, the efficiency of the conduction work between the lands 52f can be improved as compared with the prior art.

  Further, the flexible circuit board 50 has a substantially U shape in which the shape of the edge portion 54h of the conductive board 54 includes three planes 54i, 54j, and 54k that are not coplanar with each other. The positioning of the conductive substrate 54 with respect to 52 is performed in three directions. Similarly, the flexible circuit board 50 is L-shaped so that the shape of the edge portion 55e of the conductive substrate 55 includes two flat surfaces 55f and 55g that are not on the same plane. The conductive substrate 55 is positioned in two directions. Therefore, the flexible circuit board 50 can improve positioning accuracy and work efficiency as compared with the case where the conductive boards 54 and 55 are positioned in only one direction with respect to the main board 52.

  The edge portion 54h of the conductive substrate 54 and the edge portion 55e of the conductive substrate 55 may be formed in one plane, or the edge portion 55e of the conductive substrate 55 may be used for conduction. Like the edge 54h of the substrate 54, it is formed in a substantially U-shape including three planes that are not coplanar with each other, and each plane can be closely opposed to three consecutive planes of the chip resistor 56 You may form in.

  The flexible circuit board 50 is formed by forming the unit substrate 55A in which the wiring patterns 55b and 55d of the two conductive substrates 55 are arranged in point symmetry, and then cutting the unit substrate 55A to cut the two conductive substrates 55A. Therefore, even if the cutting location of the unit board 55A is shifted due to, for example, a setting error of a machine for cutting the unit board 55A or a problem such as the unit board 55A being out of the normal installation position, one unit board At least one conductive substrate 55 can be obtained from 55A.

  The conductive substrate 55 is very small and easily lost, but when two sheets are obtained from one unit substrate 55A, one can be used as a spare.

  Note that the conduction substrate 54 is larger than the conduction substrate 55, so that it is difficult to cause a cutting error or loss. Therefore, the conductive substrate 54 may be manufactured one by one from the beginning without manufacturing the unit substrate like the conductive substrate 55.

  Also, since the conductive substrates 54 and 55 are smaller than the main substrate 52, the conductive substrates 54 and 55 are manufactured together with the main substrate 52 using the gap between the main substrates 52, and then cut out separately from the main substrate 52. Can be. Since the conductive substrates 54 and 55 are manufactured together with the main substrate 52 in this way, the manufacturing cost can be significantly reduced.

1 is a perspective view of an optical head device according to an embodiment of the present invention. 1 is an exploded perspective view of the optical head device shown in FIG. FIG. 2 is a perspective view of the optical head device shown in FIG. 1 with some components removed. FIG. 2 is a top view of the main substrate of the flexible circuit board of the optical head device shown in FIG. 1 before being three-dimensionalized. (A) A perspective view of a part of the flexible circuit board of the optical head device shown in FIG. 1, as viewed from the upper surface side. (B) A perspective view of a part of the flexible circuit board of the optical head device shown in FIG. The view from the bottom side FIG. 5 is a top view of a part of the main board shown in FIG. 4 in a partially folded state. (A) Top view of sub-board of flexible circuit board shown in FIG. 5 (b) Side view of sub-board of flexible circuit board shown in FIG. FIG. 5 is a top view of a part of the main board shown in FIG. 4 before the conductive board is mounted. Top view of the conductive circuit board of the flexible circuit board shown in FIG. FIG. 9 is a top view of the conductive substrate of the flexible circuit board shown in FIG. 5, and is a diagram of the conductive substrate different from the conductive substrate shown in FIG. 9. (A) Top view of the unit substrate on which the conductive substrate shown in FIG. 10 is divided (b) Top view of the two conductive substrates divided from the unit substrate shown in FIG. FIG. 5 is a top view of a part of the main board shown in FIG. 4 in a state before being bent.

Explanation of symbols

50 Flexible circuit boards (circuit boards)
52 Main board (conducted board)
52a, 52b, 52c, 52e, 52f Land (conducted land)
54 conductive substrate 54a, 54c, 54e land (conductive land)
54h Edges 54i, 54j, 54k Plane 55 Conduction board 55A Unit board 55a Land (conduction land)
55b Wiring pattern 55c Land (land for conduction)
55d Wiring pattern 55e Edges 55f, 55g Plane 56 Chip resistor (electronic component)

Claims (4)

A conductive substrate that is a substrate having a plurality of conductive lands that are lands for conduction to each other, and a conductive substrate that is a substrate for connecting the plurality of conductive lands to each other;
The conductive substrate is a land provided at a position corresponding to the plurality of conductive lands, and is provided on a plurality of conductive lands that are electrically connected to each other and an outline of the conductive substrate or the conductive substrate. A marginal portion that is an edge portion of the shape along the contour of the electronic component, and the marginal portion is at least the contour of the conductive substrate or the contour of the electronic component disposed on the conductive substrate. A circuit board, which is disposed in the vicinity.   The circuit board according to claim 1, wherein the shape of the edge portion includes a plurality of planes that are not coplanar with each other.   The position of the said board | substrate for conduction | electrical_connection with the said to-be-conducted board | substrate is match | combined with the external shape of the said to-be-conducted board, or the external shape of the said electronic component along the shape of the said edge part. Circuit board manufacturing method. The unit substrate is formed by separating the unit substrate into two conductive substrates after forming a unit substrate which is a substrate in which two conductive substrate patterns are arranged symmetrically with respect to a point. A method for manufacturing a circuit board for conducting a circuit board according to claim 1.

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