JP2008187089A - Lamp hood for light-emitting diode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To design a lamp hood for a light-emitting diode in which an internal transfer film is utilized for injection/extrusion molding. <P>SOLUTION: An internal transfer film 10 is directly coupled and molded to a lamp hood for a light-emitting diode by a continuous plastic injection/extrusion molding system. The in-die transfer film 10 is printed speedily completely through output facilities, such as printing machine, printer; and mainly, a demolding layer 2, a printing layer 3 with a fluorescent powder material in selected and imprinted, and a cohesive layer 4 are formed, in the order, on a base layer 1 of the in-die transfer film 10 using a printing counterpoint system. When the lamp hood and a blue-light diode chip constitutes the light-emitting diode, white light can be generated; or an ink layer in a designated color is further printed on the printing layer 3 so as to contribute to generation of light in various colors, that has the advantage of mass-production and cost reduction, prolongs the service life in use, as well as, improves the heat-radiating effects. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention provides a lamp hood design of a light emitting diode (LED element) that is injected / extruded using an in-mold transfer film, and the in-mold transfer film uses a printing counter method. A release layer, a printing layer with a selected fluorescent powder, and an adhesive layer are sequentially formed on the base layer, which can be integrally molded with the lamp hood of the light emitting diode for injection / extrusion, Therefore, the light emitting diode can emit various selected color lights (especially white), which not only has the advantage of mass production, but also can improve the situation where the light emitting diode is easily damaged by high temperature.

  Traditional in-mold transfer film places the printed film in the mold cavity and then injects plastic to complete the injection / extrusion, but in-mold transfer is usually the keypoint where the decoration element is very demanding For example, mobile phone cases, cosmetic packaging containers, keypads, automobile parts, information and electrical parts.

  In addition, in the manufacturing process of conventional light emitting diodes (LEDs) with various color lights, it uses a spotting method and packages silicon rubber containing a suitable amount of fluorescent powder material in advance on the LED chip. (Package) needs to be filled, and a general package rubber is provided on the outside, thereby changing to a light emitting diode that emits light of various colors, for example, yellow, red with a spotting method on a light emitting diode that originally emitted blue light Or, if silicon rubber containing green fluorescent powder material is packaged and filled in a light emitting diode chip, white light or monochromatic light effect can be generated. Obviously it is not suitable for mass production and has the following disadvantages.

  The traditional method of manufacturing a light emitting diode by the above spotting method completely packages and fills the light emitting diode chip, so that when it is lit and used, the chip generates heat at a high temperature for a long time and is difficult to exhaust heat. Therefore, the silicon rubber of the package cannot withstand high temperatures, easily deteriorates and becomes brittle, the luminous intensity is lowered, and if the silicon rubber of the package becomes brittle and ruptures, it leads to breakage of the conductive weld line. For this reason, general conventional LED light-emitting diodes can only be applied to the use of low power, its luminous intensity is also very finite and the service life is not long, so it breaks through to the ideal boundary of high power It is difficult to develop into lighting equipment.

  Also, conventional light emitting diodes have the lowest manufacturing cost of blue light emitting diodes, so they are usually applied to light emitting diodes that emit blue light. The rubber is packed into a blue light emitting diode chip and packaged, thereby gaining the effect of white light, but this conventional structure not only reduces heat and reduces the service life, but also artificial costs or The product failure rate is high, so the effect is not clear.

  The main object of the present invention is to provide a lamp hood design of a light emitting diode that is injected / extruded using an in-mold transfer film. The in-mold transfer film can be quickly used by using an output facility such as a printer or a printer. The printing is completed, and it uses a printing counter method to form a release layer, a printing layer with a fluorescent color substance with a selected complexion, and an adhesive layer in order on the base layer of the in-mold transfer film. The inner transfer film provides the configuration of light emitting diodes for plastic continuous injection / extrusion automation work, so that the light emitting diodes not only emit various color lights (especially white), but also mass production and cost There are various advantages such as reduction and increase in production pass rate.

  The next object of the present invention is to directly mold the light emitting diode lamp hood by using the in-mold transfer film, which is packaged on the outer periphery of the blue light diode chip, for example, with a non-filling shielding method, so that the heat dissipation characteristics It can improve the situation where the light-emitting diode is easily damaged by high temperature, and the conductive welding line does not break, and the light-emitting diode can be used for high-power lighting equipment or other complex-colored backlight module (module) The present invention provides a design of a light emitting diode lamp hood for injection / extrusion using an in-mold transfer film that breaks the current situation.

Another object of the present invention is that the in-mold transfer film can be selected as a printing layer of a yellow fluorescent powder material (or a fluorescent powder material in which green is mixed with red), and using it, a blue light diode chip and In addition, the present invention provides a light emitting diode lamp hood design that forms a light emitting diode and performs injection / extrusion molding using an in-mold transfer film that generates white light.
Another object of the present invention is that the in-mold transfer film is advanced to further print ink layers of various designated colors on the printed layer of yellow (or red mixed green) fluorescent powder material, thereby making the light emitting diode easy. The present invention provides a lamp hood design for a light emitting diode that is injection / extruded using an in-mold transfer film capable of obtaining various designated color lights.

  It is a kind of light emitting diode lamp hood that uses the in-mold transfer film for injection / extrusion molding. The main part of the lamp hood is a continuous plastic injection / extrusion molding method. The in-mold transfer film is quickly printed through an output facility such as a printing machine or printer. The main part of the in-mold transfer film is the release layer in the order of the base layer of the in-mold transfer film using the printing counter method, and the selected facial color. When a printing layer and a sticking layer with a fluorescent powder material are formed, and the lamp hood and the blue light diode chip constitute a light emitting diode, white light can be generated, or ink of a specified color is further added to the printing layer. The layer is printed and thereby subjected to the generation of various colored light, which has the advantages of mass production and cost reduction, and the service life Long, heat effect is good.

  As shown in FIG. 1, the main part of the “light emitting diode lamp hood for injection / extrusion using an in-mold transfer film” according to an embodiment of the present invention is quickly transferred into the mold through an output facility such as a printer or a printer. The film 10 has been printed, and the in-mold transfer film 10 is adapted to be integrally formed and joined with a lamp hood of a light emitting diode by a continuous plastic injection / extrusion method. The printing machine equipment may be a coating machine, a thread net printing machine, an intaglio printing machine, or a letterpress printing machine, and a laser color printer, an ink jet printer, or the like can be selectively used as the printer equipment. The main part of this embodiment is that a release layer 2, a printing layer 3, and an adhesive layer 4 are formed in order on the base layer 1 by a printing coating method, thereby forming an in-mold transfer film 10, of which a transparent base layer 1 is selected from either PET, PMMA, PC, ABS, or PS, light-transmitting plastic or light-transmitting paper, and the release layer 2 is hydrophilic inorganic chemical powder particles or organic chemical transparent or It is a colored substance, and the printing layer 3 is composed of fluorescent powder substance layers of various selected colors, which are transparent or colored resin layers of inorganic or organic chemical fluorescent powder particles (which may be colored or colorless transparent substances) In practice, it is suitable to be selected as a yellow fluorescent powder material (or a fluorescent powder material in which red is mixed with green), and is formed on the surface of the transparent base layer 1, and the transparent base layer 1 and the printing layer 3 When A release layer 2 is provided between them, and the printing layer 3 is also formed by using a printing counter, and the adhesive layer 4 is also used in various forms of adhesives required by printing using a printing machine or a printer. Layer 4 is formed and applied directly to the printing layer 2.

  A release layer 2, a printing layer 3, and an adhesive layer 4 that are required to have a printing position are formed on the transparent base layer 1 to form an in-mold transfer film 10. The in-mold transfer film 10 is a lamp hood for a light emitting diode. It is formed into an integral molding at the time of injection / extrusion, and directly connected to the designated joint location of the lamp hood (may be the inner surface or the outer surface of the lamp hood), simplifying production, mass production, cost reduction, acceptance rate Many objectives, such as improvement, can be achieved.

  A light emitting diode lamp hood that is injection / extruded using the in-mold transfer film is directly molded and bonded to the light emitting diode lamp hood by using the in-mold transfer film 10, which has, for example, blue light with a non-filling shielding method. Since it is packaged on the outer periphery of the diode chip, it has the property of exhausting heat, improving the light emitting diode easily damaged by high temperature, increasing the service life, and cutting the conductive welding wire Can effectively be avoided, so that the light emitting diode can be developed into a high-power lighting equipment or a wavelength light source of a backlight module of various facial colors.

The in-mold transfer film 10 of this embodiment is very suitable for selecting a yellow fluorescent powder material (or a fluorescent powder material in which green is mixed in red) as the printing layer 3, and is combined with a blue light diode chip. If a light emitting diode is constituted, white light can be generated.
As shown in FIG. 2, this embodiment further proceeds to print ink layers 31 of various designated colors on a printing layer 3 of yellow (or red mixed green) fluorescent powder material, whereby the light emitting diodes are printed on the printing layer. 3 and various colored inks can be easily generated through the ink layer 31 having a face color.

  As shown in FIG. 3, the in-mold transfer film 10 of this example can be implemented in the form of a continuously stretched roll, which makes it convenient to adapt to plastic injection / extrusion operations. The inner transfer film can be directly bonded to the lamp hood of the light emitting diode. As shown in FIG. 4, it matches the continuous plastic injection molding machine 30, and roll-type in-mold transfer film 10 from one end take-up device 301 to the other end take-up device 302 is a male mold of a lamp hood of a plastic injection molding machine. When the integral transfer of the in-mold transfer film 10 and the lamp hood of the light emitting diode is completed by injection through 303 and the female mold 304, and the roll-shaped in-mold transfer film 10 advances to the other end take-up device 302, the remaining base Layer 1 is wound up and collected.

FIG. 5 is a schematic diagram of an embodiment in which the in-mold transfer film 10 of this embodiment is subjected to rapid injection molding in accordance with the male mold 303 and the female mold 304 of the lamp hood of the light emitting diode of the plastic injection molding machine 30. FIG. 6 is a schematic view of the product of the example in which the in-mold transfer film 10 of the present example is already formed on the lamp hood 5 of the integrally formed light emitting diode.
FIG. 7 is a schematic diagram of an embodiment in which the in-mold transfer film 10 of this embodiment is subjected to rapid injection molding according to the male mold 401 and the female mold 402 of the lamp hood of the light emitting diode of the plastic injection molding machine. .
The lamp hood male mold 303 and female mold 304 or male mold 401 and female mold 402 of the lamp hood manufactured by the above injection / extrusion molding has different product forms, and its raw material inlet is arbitrarily from the male or female mold position. Can be selected for injection.

  FIG. 8 is a schematic diagram in which the in-mold transfer film 10 of this embodiment is applied to the light emitting diode 20, and the in-mold transfer film 10 has a shielding method (a traditional spot filling method is not adopted). Since the outer periphery of the chip 201 of the light emitting diode 20 (when blue light is used is better and the cost is the lowest and matches the economic effect) is packaged, the vicinity of the chip 201 appears hollow. Therefore, it does not occur that the conductive welding wire 202 is decomposed by heat, or the adhesive layer is solidified and the wire is not cut, and the service life of the light emitting diode 20 becomes longer. Is highly compatible with the development of high-power lighting equipment, and therefore various high-power lighting installations that are light, thin, versatile and free from pollution and have high environmental conservation effects. Of the product is obtained.

The combination of the application of the above-described in-mold transfer film 10 of the present embodiment to the lamp hood 5 of the light emitting diode is not particularly limited in the shape of the lamp hood 5 (FIG. 8 is a representative embodiment) As shown in FIG. 9, the lamp hood 5 a is formed into a long base shape to be used in combination in accordance with a plurality of sets of light emitting diode chips 601 attached to the circuit board 60. Alternatively, as shown in FIG. 10, the lamp hood 5 appears in a combination in accordance with an LED car light base 70. Further, as shown in FIG. 11, the lamp hood 5b is formed with a curved surface on the bottom surface, and the in-mold transfer film 10 of this embodiment is integrally formed on the curved surface. Similarly, the in-mold transfer film 10 is a light emitting diode. When injection / extruded to the lamp hood, it can be integrally molded at any designated joint location, for example, the in-mold transfer film 10 may be integrally bonded to the inner or outer surface of the lamp hood, Everything is feasible.
The various embodiments described above are all descriptions taking up examples of the main technology of the present invention, which do not limit the technical scope of the present invention, and are performed based on the application of equivalent effects or the technical means in the previous section. All simple changes or replacements are considered to be within the technical scope of this proposal.

It is a schematic diagram which shows the structure of the mold transfer film of the lamp hood of the light emitting diode by one Example of this invention. It is a schematic diagram which shows the structure of the in-mold transfer film of the lamp hood of the light emitting diode according to another embodiment of the present invention. 1 is a perspective view showing a state in which a transfer film in a mold of a lamp hood of a light emitting diode according to an embodiment of the present invention is continuously stretched. It is the model which shows the state which match | combined the in-mold transfer film of the lamp hood of the light emitting diode by one Example of this invention with the continuous plastic injection molding machine. FIG. 3 is a schematic view showing a state in which an in-mold transfer film of a lamp hood of a light emitting diode according to an embodiment of the present invention is injection-molded according to a male mold and a female mold. FIG. 3 is a cross-sectional view illustrating a state in which an in-mold transfer film is integrally formed and coupled to a lamp hood of a light emitting diode in a light emitting diode lamp hood according to an embodiment of the present invention. It is a schematic diagram showing a state in which an in-mold transfer film of a lamp hood of a light emitting diode according to an embodiment of the present invention is extruded to match a male mold and a female mold. FIG. 3 is a schematic view of an in-mold transfer film applied to a light emitting diode in a light emitting diode lamp hood according to an embodiment of the present invention. FIG. 6 is an exploded perspective view showing a lamp hood and a light emitting diode in a lamp hood of a light emitting diode according to still another embodiment of the present invention. FIG. 6 is an exploded perspective view showing a lamp hood and an LED car light in a lamp hood of a light emitting diode according to still another embodiment of the present invention. FIG. 6 is a cross-sectional view illustrating a state in which an in-mold transfer film in a lamp hood of a light emitting diode according to still another embodiment of the present invention is integrally formed and coupled to the lamp hood of the light emitting diode.

Explanation of symbols

  10: In-mold transfer film, 1: base layer, 2: release layer, 3: printing layer, 31: colored ink layer, 4: adhesive layer, 5, 5a, 5b: lamp hood, 20: light emitting diode, 201: Chip, 202: Conductive welding line, 30: Plastic injection molding machine, 301, 302: Winding device, 303, 304: Male, female, 401, 402: Male, female, 60: Circuit board, 601: Light emitting diode Chip, 70: LED car light stand

Claims (8)

The in-mold transfer film that is printed quickly through the output equipment is formed with a release layer, a printing layer, and an adhesive layer in the base layer in order by the printing coating method. A transparent or colored resin layer composed of a powder material layer and of inorganic or organic chemical fluorescent powder particles;
The base layer forms a release layer, a printing layer, and an adhesive layer that are necessary for printing, and forms an in-mold transfer film. The inside of the mold is injected / extruded using the lamp hood body of the light emitting diode. A lamp hood for a light emitting diode, which is formed by injection / extrusion using an in-mold transfer film, in which a transfer film is integrally formed and directly bonded to a designated joint portion of a lamp hood main body. The in-mold transfer film has a base layer, a release layer, a printing layer, and an adhesive layer in order,
The transparent base layer is selected from PET, PMMA, PC, ABS, or PS light transmissive plastic or light transmissive paper;
The release layer is a hydrophilic inorganic chemical powder particle or an organic chemical transparent or colored substance,
The printing layer is composed of a fluorescent powder material layer and a colored ink layer having a selected complexion color, and is formed using a printing counterpoint,
The in-mold transfer film according to claim 1, wherein the adhesive layer is also formed by using an output facility to form various types of adhesive layers required for printing, and is directly applied to the printed layer. Light emitting diode lamp hood for injection / extrusion.   2. The light emission for injection / extrusion using the in-mold transfer film according to claim 1, wherein the output facility is any one of a coating machine, a thread net printing machine, an intaglio printing machine, and a relief printing machine. Diode lamp hood.   2. The lamp hood for a light emitting diode that is injected / extruded using an in-mold transfer film according to claim 1, wherein the output facility is a laser beam coloring printer or a coloring ink jet printer.   The light emitting diode lamp hood for injection / extrusion using the in-mold transfer film according to claim 1, wherein the printed layer is a yellow fluorescent powder material.   The light emitting diode lamp hood for injection / extrusion using the in-mold transfer film according to claim 1, wherein the printed layer is made of a fluorescent powder material in which green is mixed with red.   2. A light emitting diode lamp hood for injection / extrusion using an in-mold transfer film according to claim 1, wherein the lamp hood is configured to match a blue light diode chip.   The light emitting diode lamp hood for injection / extrusion using the in-mold transfer film according to claim 1, wherein an ink layer of a specified face color is printed on the printed layer.

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